Substrate coating equipment and coating method thereof

Abstract

The invention discloses substrate coating equipment and a coating method thereof.The equipment comprises a coating chamber and a transfer chamber, a deposition device used for conducting deposition coating on the surface of a substrate is arranged in the coating chamber, a mechanical arm and a supporting seat are arranged in the transfer chamber, and the mechanical arm is used for placing the coated substrate on the supporting seat; the transfer chamber is further provided with a compensation device, the compensation device comprises a driving mechanism and a compensation piece, and the driving mechanism is in transmission connection with the compensation piece so as to drive the compensation piece to move to the position, needing thickness compensation, of the substrate. According to the substrate coating equipment, through the arrangement of the compensation device, the driving piece drives the compensation piece to carry out thickness compensation on a specified position of the coated substrate, the uniformity of the coating thickness is guaranteed, and therefore the production yield of coating is guaranteed, and through the compensation of the compensation device on the coating thickness of the substrate, the production efficiency is improved. And the maintenance frequency of the deposition device can be reduced, so that the situation of shutdown maintenance of the substrate coating equipment is reduced, and the production efficiency of substrate coating is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of display device manufacturing, and in particular, to a substrate coating device and a coating method thereof. Background Art

[0002] With the development of semiconductor technology, the development and use of Plasma Enhanced Chemical Vapor Deposition (PECVD) devices are becoming increasingly widespread. In this device, two mutually parallel and opposite electrode plates are placed in a vacuum environment, where one electrode plate is connected to a Radio Frequency (RF) power supply and the other electrode plate is grounded. An RF electric field is generated between the two electrode plates. The substrate to be coated is placed between the two electrode plates. When the process gas to be coated enters between the two electrode plates, it is excited into plasma under the action of the RF electric field. The plasma adsorbs on the surface of the substrate or reacts with the surface of the substrate to form a thin film on the surface of the substrate.

[0003] Refer to Figure 1 and 2 As shown, a conventional substrate coating device includes a connected deposition chamber 1' and a transfer chamber 2'. A manipulator 3' is arranged in the transfer chamber 2'. In the deposition chamber 1', an upper electrode 4' and a lower electrode 5' are arranged at intervals in the vertical direction. The upper electrode 4' includes a RF end plate 41' and a diffusion plate 42' arranged at intervals in the vertical direction. The RF end plate 41' is connected to a RF power supply. The diffusion plate 42' is located between the RF end plate 41' and the lower electrode 5'. A diffusion cavity 43' is formed at an interval between the diffusion plate 42' and the RF end plate 41'. The diffusion cavity 43' is communicated with an external reaction gas input mechanism. A plurality of diffusion holes 421' are arranged at intervals on the diffusion plate 42'. During operation, the substrate 6' is placed on the lower electrode 5'. The reaction gas in the diffusion cavity 43' is ionized into plasma and then sputtered onto the substrate 6' through the diffusion holes 421' to form a thin film structure. The coated substrate 6' is taken out into the transfer chamber 2' by the manipulator 3'.

[0004] The prior art has the following deficiencies: During the long-term use of the diffusion plate 42' or during transportation and maintenance, local deformation or blockage of the diffusion holes 421' may occur, which easily causes uneven local diffusion of plasma and results in deviation of the coating thickness, affecting the coating production yield of the substrate 6'. Therefore, disassembly and maintenance are required after the production is stopped, seriously affecting the coating productivity of the substrate 6'. Summary of the Invention

[0005] The purpose of the present invention is to provide a substrate coating device and a coating method thereof, which have a simple structure and convenient operation. The compensation device can perform thickness compensation on the substrate after coating in the coating chamber to ensure the coating production yield of the substrate.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] In a first aspect, a substrate coating device is provided, including a coating chamber and a transfer chamber connected to each other. A deposition device is arranged in the coating chamber, and the deposition device is used for depositing a film on the surface of the substrate. A manipulator and a support seat are arranged in the transfer chamber. The manipulator is used for placing the substrate coated in the coating chamber on the support seat. A compensation device is further arranged in the transfer chamber. The compensation device is arranged above the support seat at intervals. The compensation device includes a driving mechanism and a compensation member. The driving mechanism is arranged on the top chamber wall of the transfer chamber, and the driving mechanism is in transmission connection with the compensation member to drive the compensation member to move to a position to be compensated where the substrate needs thickness compensation.

[0008] As a preferred scheme of the substrate coating device, the compensation member includes a reaction electrode, a first connecting pipe, and a first gas source. The reaction electrode is arranged at the driving end of the driving mechanism. The reaction electrode includes a cathode cylinder and an anode needle. The anode needle is connected to a radio frequency power supply. The cathode cylinder is sleeved outside the anode needle at intervals. One end of the first connecting pipe is connected to the cathode cylinder, and the other end of the first connecting pipe is connected to the first gas source. The first gas source is provided with a reaction gas. The support seat is grounded. The reaction gas can enter the cathode cylinder and be ionized into plasma. The plasma is led out from the end of the cathode cylinder away from the connecting pipe and sputtered onto the substrate.

[0009] As a preferred scheme of the substrate coating device, the compensation member further includes a protective layer. The outside of the cathode cylinder is coated with the protective layer. The protective layer is provided with a feed port communicating with the cathode cylinder, and the feed port is communicated with the first connecting pipe. A plurality of discharge holes communicating with the cathode cylinder are arranged at intervals on one side of the protective layer away from the first connecting pipe.

[0010] As a preferred scheme of the substrate coating device, the compensation member further includes an isolation cylinder, a second connecting pipe, and a second gas source. The isolation cylinder is arranged on the driving mechanism. The isolation cylinder is sleeved outside the protective layer, and an annular air channel is formed between the isolation cylinder and the protective layer at intervals. The annular air channel is communicated with the second gas source through the second connecting pipe. The second gas source is provided with an inert gas. One end of the isolation cylinder is hermetically connected to the protective layer through a connecting member. An annular air outlet is formed between one end of the isolation cylinder adjacent to the discharge hole and the protective layer at intervals.

[0011] As a preferred solution of the substrate coating equipment, the substrate coating equipment further includes a liquid cooling tube, the outer peripheral wall of the cathode cylinder is wound with the liquid cooling tube, and the liquid cooling tube is connected to an external liquid cooling circulation system.

[0012] As a preferred solution of the substrate coating device, the inner side wall of the cathode cylinder is coated with a molybdenum nitride coating; and / or,

[0013] The cathode cylinder is a molybdenum cathode cylinder; and / or,

[0014] The anode needle is a tungsten anode needle.

[0015] As a preferred solution of the substrate coating equipment, a positioning groove is provided on the support seat, the substrate is placed in the positioning groove, and the opening of the positioning groove gradually increases from the bottom of the groove to the groove mouth.

[0016] As a preferred solution for the substrate coating equipment, the driving mechanism includes a first driving member and a second driving member, the second driving member is transmission-connected to the compensation member to drive the compensation member to move along the first direction, the second driving member is arranged at the driving end of the first driving member, the first driving member is arranged on the top cavity wall of the transfer chamber, the first driving member can drive the second driving member and the compensation member on the second driving member to move along the second direction, and the first direction, the second direction and the vertical direction are arranged perpendicular to each other.

[0017] In a second aspect, a substrate coating method is provided, which uses the above-mentioned substrate coating device, comprising the following steps:

[0018] S10, setting a target coating thickness of a substrate as needed, placing the substrate in a coating chamber of the substrate coating equipment, and causing a deposition device in the coating chamber to deposit a coating on the substrate;

[0019] S20, taking out the coated substrate from the coating chamber, and dividing the thin film side of the substrate into a plurality of coating areas, obtaining the actual coating thickness of the thin film in each coating area by means of a thickness measuring instrument, and calculating the deviation value of each coating area by using the actual coating thickness and the target coating thickness;

[0020] S30, starting with the second substrate, placing the coated substrate in the coating chamber on the support seat by the robot arm of the substrate coating equipment;

[0021] S40. Start the compensation device of the substrate coating equipment so that the driving member of the compensation device can drive the compensation member to move to the designated coating area, and perform thickness compensation according to the deviation value of the designated coating area, so that the thickness of the film in the designated coating area is consistent with the target coating thickness.

[0022] As a preferred solution of the substrate coating method, the deviation value is S, -22 μm ≤ S ≤ 22 μm; and / or,

[0023] The number of the coating areas with the deviation value is N, N ≤ 2.

[0024] Beneficial effects of the present invention: Through the arrangement of the compensation device, the driving member drives the compensating member to perform thickness compensation at a specified position on the coated substrate, reducing the situation where there are deviations in the local coating thickness of the substrate, ensuring the uniformity of the coating thickness, thereby ensuring the production yield of the coating. Moreover, through the compensation of the coating thickness of the substrate by the compensation device, the maintenance frequency of the deposition device can also be reduced, thereby reducing the situation of shutdown and maintenance of the substrate coating equipment and ensuring the production efficiency of the substrate coating. Description of the Drawings

[0025] The present invention will be further described in detail below with reference to the drawings and embodiments.

[0026] Figure 1 is a schematic structural diagram of an existing substrate coating equipment;

[0027] Figure 2 is a schematic structural diagram inside an existing deposition chamber;

[0028] Figure 3 is a schematic structural diagram of the substrate coating equipment according to an embodiment of the present invention;

[0029] Figure 4 is a schematic structural diagram of a transfer chamber, a manipulator and a compensation device according to an embodiment of the present invention;

[0030] Figure 5 is a schematic structural diagram of a compensating member according to an embodiment of the present invention.

[0031] Figure 1 and Figure 2 in:

[0032] 1′, deposition chamber; 2′, transfer chamber; 3′, manipulator; 4′, upper electrode; 41′, radio frequency end plate; 42′, diffusion plate; 421′, diffusion hole; 43′, diffusion cavity; 5′, lower electrode; 6′, substrate;

[0033] Figures 3 to 5 in:

[0034] 1. Coating chamber; 2. Transfer chamber; 3. Substrate; 4. Manipulator; 5. Support seat; 6. Compensation device; 61. Driving mechanism; 611. First driving member; 612. Second driving member; 613. Third driving member; 62. Compensation member; 621. Reaction electrode; 6211. Cathode tube; 6212. Anode needle; 622. First connecting pipe; 623. First gas source; 624. Protective layer; 6241. Feed inlet; 6242. Discharge hole; 625. Isolation tube; 626. Second connecting pipe; 627. Second gas source; 628. Annular air duct; 629. Gas outlet; 7. Liquid cooling pipe; 8. Connectors. DETAILED DESCRIPTION

[0035] The advantages and features of the present invention and methods for achieving them will become apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms. This embodiment is provided only to complete the disclosure of the present invention and enable those skilled in the art to fully understand the scope of the present invention. The present invention is limited only by the scope of the claims. The same reference numerals represent the same components throughout the specification.

[0036] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0037] like Figures 3 to 5 As shown, the substrate 3 coating equipment of an embodiment of the present invention includes a coating chamber 1 and a transfer chamber 2 connected to each other. A deposition device is provided in the coating chamber 1, and the deposition device is used to deposit a coating on the surface of the substrate 3. A robot 4 and a support seat 5 are provided in the transfer chamber 2. The robot 4 is used to place the substrate 3 after coating in the coating chamber 1 on the support seat 5. The transfer chamber 2 is also provided with a compensation device 6, and the compensation device 6 is arranged at intervals above the support seat 5. The compensation device 6 includes a driving mechanism 61 and a compensation part 62. The driving mechanism 61 is arranged on the top cavity wall of the transfer chamber 2, and the driving mechanism 61 is connected to the compensation part 62 to drive the compensation part 62 to move to the position to be compensated where the thickness compensation of the substrate 3 is required.

[0038] It can be understood that, by setting up the compensation device 6, the driving member drives the compensation member 62 to compensate for the thickness of the specified position of the coated substrate 3, thereby reducing the deviation of the local coating thickness of the substrate 3, ensuring the uniformity of the coating thickness, and thus ensuring the production yield of the coating. In addition, by compensating the coating thickness of the substrate 3 through the compensation device 6, the maintenance frequency of the deposition device can also be reduced, thereby reducing the shutdown maintenance of the substrate 3 coating equipment and ensuring the production efficiency of the substrate 3 coating.

[0039] Further, if Figure 4 and Figure 5As shown, the compensating member 62 includes a reaction electrode 621, a first connecting tube 622, and a first gas source 623. The reaction electrode 621 is disposed at the driving end of the driving mechanism 61. The reaction electrode 621 includes a cathode cylinder 6211 and an anode needle 6212. The anode needle 6212 is connected to an RF power supply. The cathode cylinder 6211 is spaced apart and sleeved around the outer periphery of the anode needle 6212. One end of the first connecting tube 622 is connected to the cathode cylinder 6211, and the other end of the first connecting tube 622 is connected to the first gas source 623. The first gas source 623 is loaded with reaction gas. The support base 5 is grounded. The reaction gas can enter the cathode cylinder 6211 and be ionized into plasma. The plasma is then guided out of the cathode cylinder 6211 away from the end of the connecting tube and sputtered onto the substrate 3. In other words, the anode needle 6212 is connected to the RF power supply, so an RF electric field is formed between the anode needle 6212 and the cathode cylinder 6211. Therefore, the reaction gas is ionized into plasma when it enters the cathode cylinder 6211. By providing a cathode cylinder 6211 with an annular structure and arranging the anode needle 6212 coaxially, a stable electric field can be formed in the anode cylinder, which has a good ionization effect and avoids the situation where discharge is concentrated in some positions.

[0040] It should be noted that the coating deviation of the substrate 3 may be too thick in addition to being too thin, that is, there may be a production deviation in the production of the diffusion plate of the upper electrode, which may cause the diffusion hole to be too large, or the diffusion hole may be too large during maintenance, which may easily cause the coating to be too thick. Therefore, the first gas source 623 should be provided with two tanks, one of which is equipped with silane, nitrous oxide, etc. for ionization to supplement the position where the coating is too thin; the other tank is equipped with nitrogen trifluoride, nitrogen, etc. for ionization to eliminate the position where the coating is too thick.

[0041] Furthermore, if Figure 5 As shown, the compensation member 62 also includes a protective layer 624, and the outer side of the cathode cylinder 6211 is covered with a protective layer 624. The protective layer 624 is provided with a feed port 6241 that is in communication with the cathode cylinder 6211. The feed port 6241 is in communication with the first connecting tube 622, and the protective layer 624 is provided with a plurality of discharge holes 6242 that are in communication with the cathode cylinder 6211 at intervals on the side away from the first connecting tube 622. By providing the protective layer 624, the protection of the cathode cylinder 6211 is improved, and at the same time, the disturbance of the plasma by external electromagnetic interference can be suppressed. In this solution, the protective layer 624 is made of yttrium-stabilized zirconia (YSZ) ceramic material, which has good high temperature resistance and corrosion resistance, and can reduce the erosion effect of high temperature or plasma. In addition, a plurality of small discharge holes 6242 are provided at intervals on the protective layer 624, which can refine the discharge effect of the plasma, thereby ensuring the uniformity of plasma sputtering and ensuring the delicate effect of the coating deposition compensation.

[0042] Optionally, the discharge process easily generates heat. Therefore, the substrate 3 coating apparatus further includes a liquid cooling tube 7, which is wound around the outer wall of the cathode cylinder 6211 and connected to an external liquid cooling circulation system. The circulation of coolant between the liquid cooling tube 7 and the external liquid cooling circulation system effectively reduces the temperature of the cathode cylinder 6211, preventing overheating, deformation, or damage to the cathode cylinder 6211.

[0043] In addition, the inner sidewall of the cathode cylinder 6211 is coated with a molybdenum nitride coating, meaning that the inner sidewall of the cathode cylinder 6211 undergoes a surface nitriding treatment to enhance sputtering resistance and ensure the service life of the cathode cylinder 6211. Of course, the cathode cylinder 6211 is made of molybdenum, and the anode needle 6212 is made of tungsten. Both molybdenum and tungsten have excellent high-temperature resistance, preventing deformation of the cathode cylinder 6211 or anode needle 6212 caused by the high temperatures generated by the plasma reaction, thereby ensuring structural stability. Furthermore, tungsten has a high electrical conductivity, which enables the anode needle 6212 to effectively conduct current and maintain a stable electric field. Molybdenum also has good electrical conductivity, ensuring smooth current transmission between the cathode cylinder 6211 and the power supply, optimizing current distribution during the coating process and helping to improve the quality of the coating. Molybdenum has high thermal conductivity, effectively conducting heat away from cathode cylinder 6211, preventing local overheating and material degradation. Due to the high-temperature stability and electrical conductivity of molybdenum and tungsten, they maintain relatively stable electric and thermal fields during the coating process, thereby contributing to more uniform film deposition. Of course, cathode cylinder 6211 could be made of molybdenum, while anode needle 6212 could be made of another metal; or cathode cylinder 6211 could be made of another metal, while anode needle 6212 could be made of tungsten. These examples are not provided here.

[0044] Furthermore, if Figure 4 and Figure 5 As shown, the compensation part 62 also includes an isolation cylinder 625, a second connecting pipe 626 and a second gas source 627. The isolation cylinder 625 is arranged on the driving mechanism 61, and the isolation cylinder 625 is sleeved on the outer periphery of the protective layer 624. The isolation cylinder 625 and the protective layer 624 are separated by an annular air channel 628. The annular air channel 628 is connected to the second gas source 627 through the second connecting pipe 626. The second gas source 627 is equipped with an inert gas. One end of the isolation cylinder 625 is closed and connected to the protective layer 624 through the connecting part 8. One end of the isolation cylinder 625 adjacent to the discharge hole 6242 is separated from the protective layer 624 to form an annular air outlet 629. On the one hand, an annular inert gas flow channel is formed by inputting inert gas and discharging it from the outlet 629. The inert gas flow channel is wrapped around the periphery of the outlet hole, so that the periphery of the plasma sputtered by the diffusion hole has an annular shielding ring, which reduces the dissipation of the plasma, that is, it can reduce the waste of plasma; on the other hand, the inert gas can be helium, which has high thermal conductivity and can take away the heat generated by the discharge process of the cathode tube 6211, thereby improving the heat dissipation effect of the compensation part 62.

[0045] Preferably, the support base 5 is provided with a positioning groove, into which the substrate 3 is placed, and the opening of the positioning groove gradually increases from the bottom of the groove to the groove opening. The provision of the positioning groove can improve the placement accuracy of the substrate 3, thereby ensuring the compensation accuracy of the compensation device 6. The gradually increasing opening of the positioning groove from the bottom of the groove to the groove opening, that is, the positioning groove has inclined groove walls, which can be used to guide the substrate 3, thereby improving the guidance of the placement of the substrate 3.

[0046] In some embodiments, as Figure 3 and Figure 4 As shown, the driving mechanism 61 includes a first driving member 611 and a second driving member 612. The second driving member 612 is in transmission connection with the compensating member 62 to drive the compensating member 62 to move in a first direction (the first direction is the X direction in the figure). The second driving member 612 is disposed at the driving end of the first driving member 611. The first driving member 611 is disposed on the top wall of the transfer chamber 2. The first driving member 611 can drive the second driving member 612 and the compensating member 62 on the second driving member 612 to move in a second direction (the second direction is the Y direction in the figure). The first direction, the second direction, and the vertical direction are perpendicular to each other (the vertical direction is the Z direction in the figure). In other words, through the combination of the first driving member 611 and the second driving member 612, the compensating member 62 can be driven to move across the entire surface of the substrate 3, thereby achieving comprehensive compensation for the entire substrate 3. In addition, a third driving member 613 can be set at the driving end of the second driving member 612, and the compensation member 62 is set at the driving end of the third driving member 613. The third driving member 613 can drive the compensation member 62 to move in the vertical direction, thereby improving the freedom of movement of the compensation member 62, and can adjust the distance between the compensation member 62 and the substrate 3 to ensure the compensation effect of the compensation member 62 on the substrate 3.

[0047] Further, if Figure 3 As shown, at least two coating chambers 1 are arranged around the periphery of the transfer chamber 2, and a deposition device is provided in each coating chamber 1. By providing multiple coating chambers 1 in conjunction with multiple deposition devices, the production of multiple substrates 3 can be achieved, thereby improving the production efficiency of the coating of the substrates 3. It should be noted that the effect of the coating deposited by each deposition device is different, so a corresponding sensor should be provided on the sealed door separating each coating chamber 1 from the transfer chamber 2, so that the compensation member 62 can respond to the corresponding substrate 3 produced by the coating chamber 1 through the sensor and make corresponding compensation. In this solution, five coating chambers 1 are arranged around the periphery of the transfer chamber 2, which means that the production of five substrates 3 can be achieved. Of course, since there is only one compensation device 6 in the transfer chamber 2, there should be a certain interval between the production of each coating chamber 1, so that the compensation device 6 can compensate one by one to achieve continuous production of the substrates 3.

[0048] likeFigures 3 to 5 As shown in Figures 3 to 5 , an embodiment of the present invention also provides a method for coating a substrate 3. Using the above-mentioned substrate 3 coating equipment, it includes the following steps:

[0049] S10. Set the target coating thickness of the substrate 3 as required, place the substrate 3 in the coating chamber 1 of the substrate 3 coating equipment, and enable the deposition device in the coating chamber 1 to deposit and coat the substrate 3;

[0050] S20. Take out the substrate 3 coated in the first coating chamber 1, divide the film side of the substrate 3 into multiple coating areas, obtain the actual coating thickness of the film in each coating area with the help of a thickness measuring instrument, and calculate the deviation value of each coating area by using the actual coating thickness and the target coating thickness;

[0051] S30. Starting from the second substrate 3, use the manipulator 4 of the substrate 3 coating equipment to place the substrate 3 coated in the coating chamber 1 on the support seat 5;

[0052] S40. Start the compensation device 6 of the substrate 3 coating equipment, enable the driving member of the compensation device 6 to drive the compensating member 62 to move to the specified coating area, and perform thickness compensation according to the deviation value of the specified coating area, so that the thickness of the film in the specified coating area is consistent with the target coating thickness.

[0053] It can be understood that the first coated substrate 3 is taken out for testing the coating effect of each coating area to feedback the production effect of the deposition device, so as to facilitate the thickness compensation of the coated substrate 3 by the compensation device 6 starting from the second substrate 3. Through the setting of the compensation device 6, the driving member drives the compensating member 62 to be able to perform thickness compensation at a specified position on the coated substrate 3, reducing the situation where there are deviations in the local coating thickness of the substrate 3, ensuring the uniformity of the coating thickness, thereby ensuring the production yield of the coating. And through the compensation of the coating thickness of the substrate 3 by the compensation device 6, this method is simple to operate, can reduce the maintenance frequency of the deposition device, thereby reducing the situation of shutdown maintenance of the substrate 3 coating equipment and ensuring the production efficiency of the substrate 3 coating.

[0054] Specifically, the deposition device includes an upper electrode and a lower electrode arranged at intervals in the vertical direction in the coating chamber 1. The upper electrode includes a radio frequency end plate and a diffusion plate arranged at intervals in the vertical direction. The radio frequency end plate is connected to a radio frequency power supply. The diffusion plate is located between the radio frequency end plate and the lower electrode, and a diffusion cavity is formed at an interval between the diffusion plate and the radio frequency end plate. The diffusion cavity is communicated with an external reaction gas input mechanism, and a plurality of diffusion holes are arranged at intervals on the diffusion plate. During the coating operation, the substrate 3 is placed on the lower electrode, the radio frequency end plate is connected to the radio frequency power supply, reaction gas is input into the diffusion cavity, and after the reaction gas is ionized into plasma, it is sputtered onto the substrate 3 through the diffusion holes to form a thin film structure.

[0055] Furthermore, the deviation value is S, where -22 μm ≤ S ≤ 22 μm; for example, the deviation value S is -22 μm, -20 μm, -15 μm, -10 μm, -5 μm, 5 μm, 10 μm, 15 μm, 20 μm, 22 μm, etc. When the deviation value exceeds -22 μm, the thin film structure in the coating area is too thin, or when the deviation value exceeds 22 μm, the thin film structure in the coating area is too thick. In these cases, the compensation effect of the compensation device 6 is limited, and the diffusion plate should be removed for maintenance and replacement to ensure the initial coating effect of the substrate 3. Of course, when S is equal to 0, it means there is no deviation in the coating area and no compensation is required.

[0056] Preferably, the number of coating areas with a deviation value is N, where N ≤ 2. For example, when the number of coating areas with a deviation value N is 1 or 2, the deposition device does not need to be removed for maintenance. When the number of coating areas with a deviation value N is greater than 2, the compensation time is too long, affecting the production efficiency. At this time, the deposition device should be maintained. It should be noted that the area of a single coating area can be the same as the compensation area of the compensator 62 to ensure the compensation effect of coating the substrate 3.

[0057] Although the embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to the above embodiments, but can be manufactured in various forms, and those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical spirit or basic characteristics of the present invention. Therefore, it should be understood that the above embodiments are exemplary in all aspects and not restrictive.

Claims

1. A substrate coating device, characterized in that, The invention comprises a coating chamber and a transfer chamber connected to each other, wherein a deposition device is provided in the coating chamber, and the deposition device is used to deposit a coating on the surface of a substrate, and a manipulator and a support seat are provided in the transfer chamber, and the manipulator is used to place the substrate after coating in the coating chamber on the support seat, and the transfer chamber is also provided with a compensation device, and the compensation device is arranged at intervals above the support seat, and the compensation device comprises a driving mechanism and a compensation part, and the driving mechanism is arranged on the top cavity wall of the transfer chamber, and the driving mechanism is connected to the compensation part in transmission to drive the compensation part to move to the position to be compensated where the thickness compensation of the substrate needs to be performed.

2. The substrate coating device according to claim 1, characterized in that, The compensation component includes a reaction electrode, a first connecting tube and a first gas source. The reaction electrode is arranged at the driving end of the driving mechanism. The reaction electrode includes a cathode tube and an anode needle. The anode needle is connected to a radio frequency power supply. The cathode tube is sleeved on the outer periphery of the anode needle. One end of the first connecting tube is connected to the cathode tube, and the other end of the first connecting tube is connected to the first gas source. The first gas source is equipped with a reaction gas. The support seat is grounded. The reaction gas can enter the cathode tube and be ionized into plasma. The plasma is led out from the cathode tube away from one end of the connecting tube and sputtered onto the substrate.

3. The substrate coating device according to claim 2, wherein, The compensating part also includes a protective layer, which is provided on the outer side of the cathode cylinder. A feed port communicating with the cathode cylinder is provided on the protective layer, and the feed port is connected to the first connecting pipe. A plurality of discharge holes communicating with the cathode cylinder are provided at intervals on the side of the protective layer away from the first connecting pipe.

4. The substrate coating device according to claim 3, wherein The compensating part also includes an isolation cylinder, a second connecting pipe and a second gas source. The isolation cylinder is arranged on the driving mechanism, and the isolation cylinder is sleeved on the outer periphery of the protective layer. An annular air channel is formed between the isolation cylinder and the protective layer. The annular air channel is connected to the second gas source through the second connecting pipe. The second gas source is equipped with an inert gas. One end of the isolation cylinder is closed and connected to the protective layer through a connecting piece, and an annular air outlet is formed between the end of the isolation cylinder adjacent to the discharge hole and the protective layer.

5. The substrate coating device according to claim 2, characterized in that, It also includes a liquid cooling pipe, which is wound around the outer peripheral wall of the cathode cylinder and connected to an external liquid cooling circulation system.

6. The substrate coating equipment according to claim 2, wherein, The inner side wall of the cathode cylinder is coated with a molybdenum nitride coating; and / or, The cathode cylinder is a molybdenum cathode cylinder; and / or, The anode needle is a tungsten anode needle.

7. The substrate coating equipment according to any one of claims 1-6, characterized in that A positioning groove is provided on the support seat, the substrate is placed in the positioning groove, and the opening of the positioning groove gradually increases from the groove bottom to the groove mouth.

8. The substrate coating equipment according to any one of claims 1-6, characterized in that, The driving mechanism includes a first driving member and a second driving member. The second driving member is in transmission connection with the compensating member to drive the compensating member to move in a first direction. The second driving member is arranged at the driving end of the first driving member. The first driving member is arranged on the top chamber wall of the transfer chamber. The first driving member can drive the second driving member and the compensating member on the second driving member to move in a second direction. The first direction and the second direction are perpendicular to the vertical direction.

9. A method for coating a substrate, characterized in that, Applying the substrate coating device according to any one of claims 1-8, comprising the following steps: S10. Set the target coating thickness of the substrate as required, place the substrate in the coating chamber of the substrate coating device, and enable the deposition device in the coating chamber to deposit a film on the substrate; S20. Take out the substrate with the film in the coating chamber, divide the film side of the substrate into multiple coating areas, obtain the actual coating thickness of the film in each coating area by means of a thickness measuring instrument, and calculate the deviation value of each coating area by using the actual coating thickness and the target coating thickness; S30. Starting from the second substrate, place the substrate with the film in the coating chamber on the support seat through the manipulator of the substrate coating device; S40. Start the compensation device of the substrate coating device, enable the driving member of the compensation device to drive the compensating member to move to the designated coating area, and perform thickness compensation according to the deviation value of the designated coating area, so that the thickness of the film in the designated coating area is consistent with the target coating thickness.

10. The substrate coating method according to claim 9, characterized in that, The deviation value is S, -22μm ≤ S ≤ 22μm; and / or, The number of the coating areas with the deviation value is N, N ≤ 2.

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