Sensor module and electronic device

Abstract

The invention relates to a sensor module and an electronic apparatus. A sensor module is provided with: a first substrate; a second substrate disposed along a first side of the first substrate and having a first sensor device that detects a physical quantity of a first axis; and a third substrate that is disposed on the first side of the first substrate so as to overlap the second substrate, and that has a second sensor device that detects a physical quantity of the first axis.

Description

Technical Field

[0001] The present invention relates to a sensor module and an electronic device. Background Art

[0002] Patent Document 1 describes the following sensor module: By mounting two X-axis angular velocity sensor devices that detect the angular velocity around the X-axis and output digital X-axis angular velocity data on the same side of a substrate, high-precision X-axis angular velocity data is achieved.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2019-163955

[0006] In a sensor module having multiple sensor devices on one detection axis, further improvement is required for the effectiveness and reliability of its high-precision performance. Summary of the Invention

[0007] A sensor module according to one aspect of the present application includes: a first substrate; a second substrate disposed along a first side of the first substrate and having a first sensor device for detecting a physical quantity of a first axis; and a third substrate overlapping and disposed with the second substrate on a side of the first side of the first substrate and having a second sensor device for detecting the physical quantity of the first axis.

[0008] An electronic device according to one aspect of the present application includes the sensor module described above. Brief Description of the Drawings

[0009] Figure 1 It is a perspective view showing a state where the sensor module according to Embodiment 1 is fixed to a mounting surface.

[0010] Figure 2 It is a perspective view showing a state of the sensor module observed from the mounting surface side Figure 1 of.

[0011] Figure 3 It is an exploded perspective view of the sensor module.

[0012] Figure 4 It is a top view of the sensor module.

[0013] Figure 5 It is a developed view of the substrate unit.

[0014] Figure 6A It is along Figure 5 sectional view taken along line A-A of.

[0015] Figure 6B It is alongFigure 5 Cross-sectional view taken along line A-A.

[0016] Figure 7 It is a configuration diagram of a sensor device.

[0017] Figure 8 It is a perspective view of a substrate unit related to a modified example.

[0018] Figure 9 It is a developed view of a substrate unit related to a modified example.

[0019] Figure 10 It is a perspective view showing an example of an electronic device according to Embodiment 2.

[0020] Figure 11 It is a perspective view showing another example of an electronic device according to Embodiment 2.

[0021] Explanation of reference numerals

[0022] 1: Oscillator; 2: Support substrate; 3: Sensor element; 3a: Sensor element; 3b: Sensor element; 4: Circuit element; 5: Base; 6: Cover; 7: Package; 8a: Internal terminal; 8b: Internal terminal; 8c: External terminal; 9: Bonding wire; 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h: Sensor device; 14: Operational circuit; 15: Connector; 16: Memory; 17: Power supply circuit; 18: Temperature sensor; 20: Substrate unit; 21: Substrate; 21a: First side; 21b: Second side; 21c: Third side; 21d: Fourth side; 22, 23, 24, 25, 26, 27, 28, 29, 30: Substrate; 41, 42, 43, 44, 45, 46, 47, 48, 49: Connection part; 50: Housing; 51: Box; 52: Screw hole; 53: Inside; 54: Side wall; 55: Bottom surface; 56: Upper surface; 58: Cover; 59: Opening; 60: Spacer; 62: Projection; 70: Screw; 71: Mounting surface; 81: Drive circuit; 82: Detection circuit; 91: Base part; 92a: Linking arm; 92b: Linking arm; 93: Drive electrode; 94: Drive electrode; 95: Detection electrode; 96: Detection electrode; 97: Ground electrode; 98a, 98b, 98c, 98d: Drive arm; 99a, 99b: Detection arm; 100: Sensor module; 110: Smart phone; 111: Control part; 130: Automobile; 131: Body; 132: Body posture control device; 133: Wheel; C1, C2, C3: Arrow; D1, D2: Detection data; S1, S2: Detection signal; DS: Drive signal; DG: Feedback signal. Detailed Implementation Modes

[0023] In order to make each component easy to observe, in each drawing, the components may sometimes be shown in such a way that the scale of the dimensions is different according to the components.

[0024] In each drawing, the X-axis, Y-axis, and Z-axis are orthogonal to each other.

[0025] In the following description, it is assumed that: the "X-axis direction" indicates the direction parallel to the X-axis, the "Y-axis direction" indicates the direction parallel to the Y-axis, and the "Z-axis direction" indicates the direction parallel to the Z-axis.

[0026] In the following description, it is assumed that: the "positive side" indicates the front end side in the arrow direction of each of the X, Y, and Z axes, and the "negative side" indicates the end side in the arrow direction.

[0027] In the following description, it is assumed that: "looking down" means observing the plane including the X-axis and Y-axis from the Z-axis direction.

[0028] In the following description, it is assumed that: the description of the upper surface of a certain component indicates the surface of the component on the positive side in the Z-axis direction. For example, it is considered that the "upper surface of the substrate" indicates the surface of the substrate on the positive side in the Z-axis direction.

[0029] In the following description, it is assumed that: the description of the lower surface of a certain component indicates the surface of the component on the negative side in the Z-axis direction.

[0030] 1. Embodiment 1

[0031] Figures 1 to 9 Shows the sensor module 100 according to Embodiment 1.

[0032] Figure 1 Is a perspective view showing the state in which the sensor module 100 is fixed to the mounting surface 71 of an automobile or the like. Figure 2 Is a perspective view showing the state of the sensor module 100 viewed from the side of the mounting surface 71 Figure 1 of the sensor module 100. Figure 3 Is an exploded perspective view of the sensor module 100. Figure 4 Is a top view of the sensor module 100. Figure 5 Is a developed view of the substrate unit 20. Figure 6A Is along Figure 5 the sectional view taken along line A-A and shows an example of the sensor device 12d. Figure 6B Is along Figure 5 the sectional view taken along line A-A and shows another example of the sensor device 12d. Figure 7 Is an explanatory view showing the internal structure of the sensor device 12d. Figure 8 Is a perspective view of the substrate unit 20 related to a modified example. Figure 9It is an exploded view of the substrate unit 20 related to the modified example.

[0033] In the present embodiment, the sensor module 100 is an inertial measurement unit (IMU: Inertial Measurement Unit) that detects the posture and movement of a mounted device such as an automobile or a robot. Here, the mounted device can be referred to as a moving body. The movement can be referred to as the inertial motion amount. In the present embodiment, the case where the physical quantities detected by the sensor module 100 are angular velocity and / or acceleration is taken as an example for description, but the physical quantities are not limited to angular velocity and / or acceleration, and can also be other physical quantities such as velocity, pressure, displacement, posture, angle, or gravity.

[0034] As Figure 1 shown, the sensor module 100 has a housing 50. The shape of the housing 50 is a rectangular parallelepiped. Regarding the dimensions, the length of one side of the square is, for example, about 24 mm, and the thickness is about 10 mm.

[0035] The housing 50 is an outer shell that houses and mounts the substrate unit 20 on which a plurality of sensor devices are mounted. The housing 50 is composed of a box 51 and a lid 58.

[0036] The substrate unit 20 on which a plurality of sensor devices are mounted is housed in the box 51. The substrate unit 20 will be described later.

[0037] The housing 50 has screw holes 52. By passing screws 70 through these two screw holes 52, the sensor module 100 is used in a state of being fixed to the mounting surface 71 of a mounted device such as an automobile.

[0038] As Figure 2 shown, the lid 58 has an opening 59. The connector 15 of the substrate unit 20 projects from the opening 59.

[0039] The connector 15 is a plug-in connector and has a plurality of pins. A socket-type connector (not shown) is connected from the mounted device to the connector 15. Electric power is supplied to the sensor module 100 from the power circuit of the mounted device via the connector 15, and the sensor module 100 transmits electrical signals such as detection data to the mounted device.

[0040] 1.1 Configuration of the sensor module

[0041] Figure 3 It is Figure 2 the exploded perspective view of the sensor module 100 shown.

[0042] As Figure 3 shown, the sensor module 100 is composed of a housing 50 and a substrate unit 20 housed in the housing 50.

[0043] The case 51 is a base obtained by cutting aluminum into a box shape. The material is not limited to aluminum, and other metals such as zinc and stainless steel, resin, or a composite material of metal and resin can also be used.

[0044] The inner side 53 of the case 51 is a storage space surrounded by a bottom surface 55 and a side wall 54. A projection 62 is provided on the bottom surface 55. The projection 62 functions as a fixing portion for fixing the substrate unit 20 inside the case 51.

[0045] The lid 58 is joined to the upper surface 56 of the case 51 by a filler (not shown).

[0046] 1.2. Structure of the Substrate Unit

[0047] Figure 4 The substrate unit 20 stored in the case 51 is shown. Figure 5 The state of the substrate unit 20 after being unfolded is shown.

[0048] As Figure 3 and Figure 4 shown, the unfolded substrate unit 20 is assembled and stored in the case 51.

[0049] The substrate unit 20 is fixed inside the case 51 by the projection 62 and the spacer 60 while maintaining its assembled state inside the case 51. In the present embodiment, the projection 62 and the spacer 60 are an example of the fixing portion. It should be noted that the substrate unit 20 can also be fixed inside the case 51 by other components.

[0050] As Figure 5 shown, the substrate unit 20 includes: substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, 30; connection portions 41, 42, 43, 44, 45, 46, 47, 48, 49; sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h; an arithmetic circuit 14; a connector 15; a memory 16; a power supply circuit 17; and a temperature sensor 18.

[0051] The substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, 30 are rigid substrates called rigid substrates, specifically, epoxy glass substrates. The substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, 30 can also be rigid substrates such as composite substrates and ceramic substrates. The substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, 30 can be either a multi-layer or a single-layer structure.

[0052] The connecting parts 41, 42, 43, 44, 45, 46, 47, 48, 49 are substrates softer than the substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, 30. The connecting parts 41, 42, 43, 44, 45, 46, 47, 48, 49 are, for example, FPCs (Flexible printed circuits). The connecting parts 41, 42, 43, 44, 45, 46, 47, 48, 49 can also be flexible wiring cables, wiring codes such as flat cables, flat codes, or wires. The connecting parts 41, 42, 43, 44, 45, 46, 47, 48, 49 can also include connectors, solders, conductive adhesives, or crimp terminals, etc.

[0053] The substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, 30 and the connecting parts 41, 42, 43, 44, 45, 46, 47, 48, 49 can also be rigid-flexible substrates obtained by integrating them. Since there is no need for connectors, etc. for connecting between substrates, by using a rigid-flexible substrate, the generation of noise is suppressed, and thus the detection accuracy can be improved. Furthermore, a connector-free thin form and three-dimensional mounting can be achieved.

[0054] 1.2.1. Structure of substrate 21

[0055] 1.2.1.1. Structure of the upper surface of substrate 21

[0056] The arithmetic circuit 14, the connector 15, the memory 16, the power supply circuit 17, and the temperature sensor 18 are mounted on the upper surface of the substrate 21. Other electronic components can also be mounted on the upper surface of the substrate 21.

[0057] The arithmetic circuit 14 is the primary controller for the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h. The arithmetic circuit 14 is an integrated circuit device and can be implemented by a processor such as an MPU (Micro Processor Unit) or a CPU (central processing unit), for example.

[0058] The arithmetic circuit 14 includes a digital interface. The digital interface is a circuit that performs digital interface processing based on communication standards such as SPI or I2C.

[0059] The arithmetic circuit 14 receives the detection data output from each sensor device, performs various processes, and sends the processed detection data to the outside via the connector 15. In the present embodiment, the arithmetic circuit 14 is an example of a processing unit.

[0060] The various processes performed by the arithmetic circuit 14 are as follows: processes such as classifying the detection data sent from each sensor device according to the detection axis; processes of calculating the average value of the detection data for each detection axis; processes of performing temperature correction, zero point correction, alignment correction, etc. on the calculated average values or the received detection data; sensitivity adjustment processes; filtering processes; and processes of outputting the processed data from the connector 15.

[0061] The connector 15 is a plug-in connector and has two rows of connection terminals arranged at equal intervals in the Y-axis direction. In the present embodiment, the connector 15 has a total of 20 connection terminals with 10 pins in one row, but the number of terminals can be appropriately changed according to the design specifications.

[0062] In the memory 16, programs for executing various processes performed by the arithmetic circuit 14, programs for integrating the processed detection data into packet data, and data required for executing the programs such as table data for temperature correction processing are stored.

[0063] Power is supplied to the power circuit 17 from the device to be installed, and the power circuit 17 supplies the required power to each sensor device, the arithmetic circuit 14, etc.

[0064] The temperature sensor 18 outputs temperature information for temperature correction processing to the arithmetic circuit 14.

[0065] 1.2.1.2. Structure of the lower surface of the substrate 21

[0066] The sensor devices 11a and 11b are mounted on the lower surface of the substrate 21. The sensor devices 11a and 11b are angular velocity sensor devices that respectively detect the angular velocity about the Z axis. Specifically, a crystal is used as the oscillator, and the angular velocity is detected according to the Coriolis force applied to the oscillator, which is a vibrating gyroscope sensor. The oscillator is not limited to a crystal. For example, the oscillator can also be a MEMS (Micro Electro Mechanical Systems) oscillator formed using a silicon substrate. Hereinafter, the angle sensor has the same structure.

[0067] In the present embodiment, the driving frequencies of the sensor devices 11a and 11b mounted on the substrate 21 are different. Specifically, the driving frequency of the sensor device 11a is 49.6 kHz, and the driving frequency of the sensor device 11b is 51.0 kHz. Thus, since the driving frequencies of the sensor device 11a and the sensor device 11b are different, even if the sensor device 11a and the sensor device 11b are mounted on the same substrate 21, mechanical or electrical interference generated between the closely arranged sensor device 11a and sensor device 11b can be suppressed. Therefore, a decrease in the detection accuracy of the sensor devices 11a and 11b can be suppressed.

[0068] In the present embodiment, the driving frequencies of the sensor devices 11a and 11b correspond to the driving frequencies of the respective oscillators of the sensor devices 11a and 11b. Regarding the driving frequencies of other sensor devices, they also correspond to the driving frequencies of the oscillators. The driving frequencies of the sensor devices will be described in detail in item 1.2.4.6. below.

[0069] 1.2.2. Configuration of the substrate 30

[0070] As Figure 3 shown, the substrate 30 is arranged parallel to the substrate 21 on the negative Z-axis side of the substrate 21 and overlaps the substrate 21 in a top view.

[0071] As Figure 5 shown, the sensor devices 11c and 11d are mounted on the substrate 30. The sensor devices 11c and 11d are angular velocity sensor devices that respectively detect the angular velocity around the Z-axis.

[0072] In the present embodiment, the driving frequencies of the sensor devices 11c and 11d mounted on the substrate 30 are different. Specifically, the driving frequency of the sensor device 11c is 49.6 kHz, and the driving frequency of the sensor device 11d is 51.0 kHz. Thus, since the driving frequencies of the sensor device 11c and the sensor device 11d are different, even if the sensor device 11c and the sensor device 11d are mounted on the same substrate 30, mechanical or electrical interference generated between the closely arranged sensor device 11c and sensor device 11d can be suppressed. Therefore, a decrease in the detection accuracy of the sensor devices 11c and 11d can be suppressed.

[0073] Moreover, the substrate 21 and the substrate 30 are electrically connected via the connection portion 49.

[0074] As described above, since the connecting portion 49 is a substrate softer than the substrates 21 and 30, even if mechanical or electrical interference occurs in the substrate 30, its influence can be suppressed from being transmitted to the substrate 21 via the connecting portion 49. Therefore, a decrease in the detection accuracy of the sensor module 100 can be suppressed.

[0075] 1.2.3. Configuration along each side of the substrate 21

[0076] 1.2.3.1. Configuration along the first side 21a

[0077] As Figure 5 shown, the substrate 22 is arranged along the first side 21a of the substrate 21. The substrate 26 is arranged on the positive Y-axis side of the substrate 22 along the first side 21a of the substrate 21.

[0078] As Figure 3 or Figure 4 shown, when assembling the substrate unit 20, when observing the substrate surfaces of the substrate 22 and the substrate 26 from the Y-axis direction, the substrate 22 and the substrate 26 are arranged in an overlapping manner.

[0079] As Figure 5 shown, the sensor devices 13a and 13b are mounted on the substrate 22, and the sensor devices 13c and 13d are mounted on the substrate 26. The sensor devices 13a, 13b, 13c, and 13d are angular velocity sensor devices that respectively detect the angular velocity about the Y-axis.

[0080] In the present embodiment, the driving frequencies of the sensor devices 13a and 13b mounted on the substrate 22 are different. Specifically, the driving frequency of the sensor device 13a is 49.6 kHz, and the driving frequency of the sensor device 13b is 51.0 kHz. Thus, since the driving frequency of the sensor device 13a is different from the driving frequency of the sensor device 13b, even if the sensor devices 13a and 13b are mounted on the same substrate 22, mechanical or electrical interference generated between the closely arranged sensor devices 13a and 13b can be suppressed. Therefore, a decrease in the detection accuracy of the sensor devices 13a and 13b can be suppressed.

[0081] Similarly, the driving frequencies of the sensor devices 13c and 13d mounted on the substrate 26 are different. Specifically, the driving frequency of the sensor device 13c is 49.6 kHz, and the driving frequency of the sensor device 13d is 51.0 kHz. Therefore, mechanical or electrical interference generated between the sensor devices 13c and 13d can be suppressed. Therefore, a decrease in the detection accuracy of the sensor devices 13c and 13d can be suppressed.

[0082] Moreover, the substrate 21 and the substrate 22 are electrically connected via the connecting portion 41, and the substrate 22 and the substrate 26 are electrically connected via the connecting portion 45.

[0083] As described above, since the connecting portions 41 and 45 are substrates that are softer than the substrates 21, 22, and 26, even if mechanical or electrical interference occurs in the substrate 26, its influence can be suppressed from being transmitted to the substrate 22 through the connecting portion 45. Similarly, even if mechanical or electrical interference occurs in the substrate 22, its influence can be suppressed from being transmitted to the substrate 21 and / or the substrate 26. Therefore, a decrease in the detection accuracy of the sensor module 100 can be suppressed.

[0084] 1.2.3.2. Configuration along the second side 21b

[0085] As Figure 5 shown, the substrate 23 is arranged along the second side 21b of the substrate 21. The substrate 27 is arranged on the positive X-axis side of the substrate 23 on the second side 21b side of the substrate 21.

[0086] As Figure 3 or Figure 4 shown, when assembling the substrate unit 20, when observing the substrate surfaces of the substrate 23 and the substrate 27 from the X-axis direction, the substrate 23 and the substrate 27 are overlapped and arranged.

[0087] As Figure 5 shown, the sensor devices 12e and 12f are mounted on the substrate 23, and the sensor devices 12g and 12h are mounted on the substrate 27. The sensor devices 12e, 12f, 12g, and 12h are angular velocity sensor devices that respectively detect the angular velocity about the X-axis.

[0088] In the present embodiment, the driving frequencies of the sensor devices 12e and 12f mounted on the substrate 23 are different. Specifically, the driving frequency of the sensor device 12e is 49.6 kHz, and the driving frequency of the sensor device 12f is 51.0 kHz. Thus, since the driving frequencies of the sensor device 12e and the sensor device 12f are different, even if the sensor devices 12e and 12f are mounted on the same substrate 23, mechanical or electrical interference generated between the closely arranged sensor devices 12e and 12f can be suppressed. Therefore, a decrease in the detection accuracy of the sensor devices 12e and 12f can be suppressed.

[0089] Similarly, the driving frequencies of the sensor devices 12g and 12h mounted on the substrate 27 are different. Specifically, the driving frequency of the sensor device 12g is 49.6 kHz, and the driving frequency of the sensor device 12h is 51.0 kHz. Therefore, mechanical or electrical interference between the sensor device 12g and the sensor device 12h can be suppressed. Therefore, a decrease in the detection accuracy of the sensor devices 12g and 12h can be suppressed.

[0090] Moreover, the substrate 21 and the substrate 23 are electrically connected through the connecting portion 42, and the substrate 23 and the substrate 27 are electrically connected through the connecting portion 46.

[0091] As described above, since the connecting portions 42 and 46 are substrates that are softer than the substrates 21, 23, and 27, even if mechanical or electrical interference occurs in the substrate 27, its influence can be suppressed from being transmitted to the substrate 23 through the connecting portion 46. Similarly, even if mechanical or electrical interference occurs in the substrate 23, its influence can be suppressed from being transmitted to the substrate 21 and / or the substrate 27. Therefore, a decrease in the detection accuracy of the sensor module 100 can be suppressed.

[0092] 1.2.3.3. Configuration along the third side 21c

[0093] As Figure 5 shown, the substrate 24 is arranged along the third side 21c of the substrate 21. The substrate 28 is arranged on the negative Y-axis side of the substrate 24 in the third side 21c side of the substrate 21.

[0094] As Figure 3 or Figure 4 shown, when assembling the substrate unit 20, when observing the substrate surfaces of the substrate 24 and the substrate 28 from the Y-axis direction, the substrate 24 and the substrate 28 are overlapped and arranged.

[0095] As Figure 5 shown, the sensor devices 13e and 13f are mounted on the substrate 24, and the sensor devices 13g and 13h are mounted on the substrate 28. The sensor devices 13e, 13f, 13g, and 13h are angular velocity sensor devices that respectively detect the angular velocity around the Y-axis.

[0096] In the present embodiment, the driving frequencies of the sensor devices 13e and 13f mounted on the substrate 24 are different. Specifically, the driving frequency of the sensor device 13e is 49.6 kHz, and the driving frequency of the sensor device 13f is 51.0 kHz. Thus, since the driving frequencies of the sensor device 13e and the sensor device 13f are different, even if the sensor device 13e and the sensor device 13f are mounted on the same substrate 24, mechanical or electrical interference generated between the closely arranged sensor device 13e and the sensor device 13f can be suppressed. Therefore, a decrease in the detection accuracy of the sensor devices 13e and 13f can be suppressed.

[0097] Similarly, the driving frequencies of the sensor devices 13g and 13h mounted on the substrate 28 are different. Specifically, the driving frequency of the sensor device 13g is 49.6 kHz, and the driving frequency of the sensor device 13h is 51.0 kHz. Therefore, mechanical or electrical interference generated between the sensor devices 13g and 13h can be suppressed. Therefore, a decrease in the detection accuracy of the sensor devices 13g and 13h can be suppressed.

[0098] Moreover, the substrate 21 and the substrate 24 are electrically connected via the connecting portion 43, and the substrate 24 and the substrate 28 are electrically connected via the connecting portion 47.

[0099] As described above, since the connecting portions 43 and 47 are substrates that are softer than the substrates 21, 24, and 28, even if mechanical or electrical interference occurs in the substrate 28, its influence can be suppressed from being transmitted to the substrate 24 via the connecting portion 47. Similarly, even if mechanical or electrical interference occurs in the substrate 24, its influence can be suppressed from being transmitted to the substrate 21 and / or the substrate 28. Therefore, a decrease in the detection accuracy of the sensor module 100 can be suppressed.

[0100] 1.2.3.4. Configuration along the fourth side 21d

[0101] As Figure 5 shown, the substrate 25 is arranged along the fourth side 21d of the substrate 21. The substrate 29 is arranged on the negative X-axis side of the substrate 25 on the side of the fourth side 21d of the substrate 21.

[0102] As Figure 3 or Figure 4 shown, when assembling the substrate unit 20, when observing the substrate surfaces of the substrate 25 and the substrate 29 from the X-axis direction, the substrate 25 and the substrate 29 are overlapped and arranged.

[0103] As Figure 5As shown, the sensor devices 12a and 12b are mounted on the substrate 25, and the sensor devices 12c and 12d are mounted on the substrate 29. The sensor devices 12a, 12b, 12c, and 12d are angular velocity sensor devices that respectively detect the angular velocity about the X-axis.

[0104] In the present embodiment, the driving frequencies of the sensor devices 12a and 12b mounted on the substrate 25 are different from each other. Specifically, the driving frequency of the sensor device 12a is 49.6 kHz, and the driving frequency of the sensor device 12b is 51.0 kHz. Thus, since the driving frequencies of the sensor device 12a and the sensor device 12b are different, even if the sensor device 12a and the sensor device 12b are mounted on the same substrate 25, mechanical or electrical interference generated between the closely arranged sensor device 12a and the sensor device 12b can be suppressed. Therefore, a decrease in the detection accuracy of the sensor devices 12a and 12b can be suppressed.

[0105] Similarly, the driving frequencies of the sensor devices 12c and 12d mounted on the substrate 29 are different from each other. Specifically, the driving frequency of the sensor device 12c is 49.6 kHz, and the driving frequency of the sensor device 12d is 51.0 kHz. Therefore, mechanical or electrical interference generated between the sensor device 12c and the sensor device 12d can be suppressed. Therefore, a decrease in the detection accuracy of the sensor devices 12c and 12d can be suppressed.

[0106] Moreover, the substrate 21 and the substrate 25 are electrically connected via the connection portion 44, and the substrate 25 and the substrate 29 are electrically connected via the connection portion 48.

[0107] As described above, since the connection portions 44 and 48 are substrates that are softer than the substrates 21, 25, and 29, even if mechanical or electrical interference occurs in the substrate 29, its influence can be suppressed from being transmitted to the substrate 25 via the connection portion 48. Similarly, even if mechanical or electrical interference occurs in the substrate 25, its influence can be suppressed from being transmitted to the substrate 21 and / or the substrate 29. Therefore, a decrease in the detection accuracy of the sensor module 100 can be suppressed.

[0108] 1.2.4. Sensor Devices

[0109] 1.2.4.1. Angular Velocity Sensor Devices for Detecting the Angular Velocity about the Z-Axis

[0110] As Figure 5 shown, the sensor module 100 includes four sensor devices 11a, 11b, 11c, and 11d as angular velocity sensor devices for detecting the angular velocity about the Z-axis.

[0111] The driving frequencies of the sensor devices 11a and 11c among the four sensor devices 11a, 11b, 11c, and 11d are 49.6 kHz respectively, and the driving frequencies of the sensor devices 11b and 11d are 51.0 kHz respectively.

[0112] In other words, the sensor module 100 of the present embodiment includes four sensor devices 11a, 11b, 11c, and 11d as angular velocity sensor devices for detecting the angular velocity about the Z-axis, but it is not necessary to prepare components with different driving frequencies for the four sensor devices 11a, 11b, 11c, and 11d.

[0113] Therefore, the sensor module 100 of the present embodiment can reduce the costs required for preparing components with different driving frequencies for the four sensor devices 11a, 11b, 11c, and 11d in aspects such as manufacturing, ordering, inventory, or assembly, and can improve the industrial utilization value.

[0114] The number of angular velocity sensor devices for detecting the angular velocity about the Z-axis is not limited to four. For example, the number of angular velocity sensor devices for detecting the angular velocity about the Z-axis can be two, three, six, etc.

[0115] When the number of angular velocity sensor devices is two, one is installed on each of the substrate 21 and the substrate 30.

[0116] When the number of angular velocity sensor devices is three, another substrate can be arranged in parallel with the substrate 30 on the negative Z-axis side of the substrate 30, and one is installed on each substrate.

[0117] When the number of angular velocity sensor devices is six, three can be installed on each of the substrate 21 and the substrate 30, or another substrate can be arranged in parallel with the substrate 30 on the negative Z-axis side of the substrate 30, and two can be installed on each substrate.

[0118] 1.2.4.2. Angular Velocity Sensor Device for Detecting Angular Velocity about the Y-axis

[0119] As Figure 5 shown, the sensor module 100 includes eight sensor devices 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h as angular velocity sensor devices for detecting the angular velocity about the Y-axis.

[0120] The driving frequencies of the sensor devices 13a, 13c, 13e, and 13g among the eight sensor devices 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h are 49.6 kHz respectively, and the driving frequencies of the sensor devices 13b, 13d, 13f, and 13h are 51.0 kHz respectively.

[0121] In other words, the sensor module 100 of the present embodiment has eight sensor devices 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h, but there is no need to prepare components with different driving frequencies for the eight sensor devices 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h respectively.

[0122] Therefore, the sensor module 100 of the present embodiment can reduce the costs required for preparing components with different driving frequencies for the eight sensor devices 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h in aspects such as manufacturing, ordering, inventory, or assembly, and can improve the industrial utilization value.

[0123] The number of angular velocity sensor devices for detecting the angular velocity about the Y-axis is not limited to eight. For example, the number of angular velocity sensor devices for detecting the angular velocity about the Y-axis can also be two, twelve, etc.

[0124] When the number of angular velocity sensor devices is two, one can be installed on each of the substrates 22 and 26, and the substrates 24 and 28 can be omitted.

[0125] When the number of angular velocity sensor devices is twelve, three can be installed on each of the substrates 22, 24, 26, 28, or another substrate can be arranged in parallel with the substrate 26 on the positive side in the Y-axis direction of the substrate 26, and another substrate can be arranged in parallel with the substrate 28 on the negative side in the Y-axis direction of the substrate 28, and two can be installed on each substrate.

[0126] 1.2.4.3. Angular velocity sensor device for detecting the angular velocity about the X-axis

[0127] As Figure 5 shown, the sensor module 100 includes eight sensor devices 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h as angular velocity sensor devices for detecting the angular velocity about the X-axis.

[0128] Among the eight sensor devices 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, the driving frequencies of the sensor devices 12a, 12c, 12e, 12g are 49.6 kHz respectively, and the driving frequencies of the sensor devices 12b, 12d, 12f, 12h are 51.0 kHz respectively.

[0129] In other words, the sensor module 100 of the present embodiment has eight sensor devices 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, but there is no need to prepare components with different driving frequencies for the eight sensor devices 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h.

[0130] Therefore, the sensor module 100 of the present embodiment can reduce the costs required for preparing components with different driving frequencies for the eight sensor devices 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h in aspects such as manufacturing, ordering, inventory, or assembly, and can improve the industrial utilization value.

[0131] The number of angular velocity sensor devices for detecting the angular velocity about the X axis is not limited to eight. For example, the number of angular velocity sensor devices for detecting the angular velocity about the X axis can also be two, twelve, etc.

[0132] When the number of angular velocity sensor devices is two, one can be installed on each of the substrates 25 and 29, and the substrates 23 and 27 can be omitted.

[0133] When the number of angular velocity sensor devices is twelve, three can be installed on each of the substrates 23, 25, 27, and 29, or another substrate can be arranged in parallel with the substrate 27 on the positive side in the X-axis direction of the substrate 27, and another substrate can be arranged in parallel with the substrate 29 on the negative side in the X-axis direction of the substrate 29, and two can be installed on each substrate.

[0134] 1.2.4.4. Encapsulation of Sensor Devices

[0135] Figure 6A and Figure 6B are cross-sectional views along the A-A line of Figure 5 and are cross-sectional views for explaining the encapsulation of the sensor device. Figure 6A and Figure 6B show cross-sectional views of the sensor device 12d, but the other sensor devices are also configured in the same way. In Figure 6A and Figure 6B , the orientations of the X, Y, and Z axes are the same as those in Figure 3 and Figure 4 .

[0136] In the present embodiment, Figure 6A the sensor device 12d is a physical quantity sensor for detecting the angular velocity with the X axis as the detection axis. Figure 6B the sensor device 12d is a composite physical quantity sensor for detecting the angular velocity with the X axis as the detection axis and the acceleration with the X axis as the detection axis.

[0137] As Figure 6A and Figure 6B shown, the sensor device 12d has a package 7 and a sensor element 3 and a circuit element 4 or sensor elements 3a, 3b and a circuit element 4 accommodated in the package 7.

[0138] The package 7 has: a base 5 having a recess open at the upper surface; and a lid 6 joined to the upper surface of the base 5 via a joining member so as to block the opening of the recess. An internal space S is formed by the recess inside the package 7.

[0139] The package 7 is, for example, a ceramic package. The base 5 is made of a ceramic such as alumina, and the lid 6 is made of a ceramic such as alumina or a metal material such as kovar.

[0140] Figure 6A The sensor device 12d of Figure 6A accommodates the sensor element 3 and the circuit element 4 in the internal space S. The sensor element 3 is an angular velocity sensor element that detects the angular velocity about the X axis, and includes an oscillator 1 and a support substrate 2. The oscillator 1 is a crystal oscillator. The circuit element 4 includes a detection circuit and the like described later.

[0141] The internal space S is airtight and in a reduced pressure state, preferably in a state closer to a vacuum state. Thereby, the vibration characteristics of the oscillator 1 are improved. However, the gas in the internal space S is not particularly limited.

[0142] In the internal space S, the oscillator 1, the support substrate 2 and the circuit element 4 are arranged to overlap each other in a plan view. Such a configuration can suppress the planar area of the package 7 from expanding in the direction along the X axis and / or the Y axis, which is advantageous for miniaturization.

[0143] A plurality of internal terminals 8a, 8b are provided in the recess of the base 5, and a plurality of external terminals 8c are provided on the surface of the base 5 on the negative side in the X axis direction.

[0144] These internal terminals 8a, 8b and external terminals 8c are electrically connected to wirings (not shown) formed in the base 5 and the substrate 29.

[0145] The internal terminal 8a is electrically connected to the sensor element 3 via a conductive joining member, and the internal terminal 8b is electrically connected to the circuit element 4 by a bonding wire 9.

[0146] Figure 6B The sensor device 12d of Figure 6B accommodates the sensor elements 3a, 3b and the circuit element 4 in the internal space S.

[0147] The sensor element 3a is an angular velocity sensor element that detects the angular velocity about the X axis. Similar to the sensor element 3, it has an oscillator that performs bending vibration and detects the angular velocity using the Coriolis force.

[0148] The sensor element 3b is an acceleration sensor element that detects acceleration in the X-axis direction. The sensor element 3b includes a crystal oscillator and detects acceleration by using the change in the vibration frequency of the crystal oscillator. The sensor element 3b may also be configured to include a silicon MEMS having a comb-shaped fixed electrode and a movable electrode, and detects acceleration by using the change in the capacitance formed therebetween.

[0149] The circuit element 4 includes a detection circuit and the like described later.

[0150] In Figure 6A In the manner shown, the sensor device 12d includes the sensor element 3 that detects the angular velocity about the X-axis. However, the sensor device 12d is not limited to this configuration.

[0151] For example, in addition to the sensor element 3, the sensor device 12d may further include a sensor element that detects the angular velocity about the Y-axis and / or a sensor element that detects the angular velocity about the Z-axis.

[0152] For example, in the sensor device 12d, the sensor element 3 may also be a sensor element that detects acceleration in the Y-axis direction. Moreover, in addition to the sensor element that detects acceleration in the Y-axis direction, the sensor element 3 may further include a sensor element that detects acceleration in the Z-axis direction and / or a sensor element that detects the angular velocity about the Z-axis.

[0153] In Figure 6B In the manner shown, the sensor device 12d includes the sensor element 3a that detects the angular velocity about the X-axis and the sensor element 3b that detects acceleration in the X-axis direction. However, the sensor device 12d is not limited to this configuration.

[0154] For example, in addition to the sensor elements 3a and 3b, the sensor device 12d may further include a sensor element that detects the angular velocity about the Y-axis and / or a sensor element that detects acceleration in the Y-axis direction.

[0155] For example, in addition to the sensor elements 3a and 3b, the sensor device 12d may further include a sensor element that detects the angular velocity about the Z-axis and / or a sensor element that detects acceleration in the Z-axis direction.

[0156] For example, the sensor element 3a may also be a three-axis sensor element that detects the angular velocity about each of the X, Y, and Z axes.

[0157] For example, the sensor element 3b may also be a three-axis sensor element that detects acceleration in each of the X, Y, and Z axis directions.

[0158] For example, the sensor element 3a may also be a two-axis sensor element that detects the angular velocity about the Y-axis or the Z-axis in addition to the angular velocity about the X-axis, or may also be a three-axis sensor element that detects the angular velocity about each of the X, Y, and Z axes.

[0159] For example, the sensor element 3b may also be a two-axis sensor element that detects the acceleration in the Y-axis direction or the Z-axis direction in addition to the acceleration in the X-axis direction, or may also be a three-axis sensor element that detects the acceleration in each of the X, Y, and Z axis directions.

[0160] For example, the sensor element 3a may also be a three-axis sensor element that detects the angular velocity about each of the X, Y, and Z axes, and the sensor element 3b may also be a three-axis sensor element that detects the acceleration in each of the X, Y, and Z axis directions. In other words, the sensor device 12d may also be a three-axis angular velocity sensor device and a three-axis acceleration sensor device, or may also be a 6DoF (Six degrees of freedom) sensor device.

[0161] When a ceramic package is used in the package 7, the package 7 can be renamed as a rigid substrate. In this case, the sensor elements 3, 3a, and 3b can be renamed as the sensor device 12d.

[0162] When a ceramic package is used in the package 7, the package 7 can be configured to be directly mounted on the connection portion 48 without passing through the substrate 29.

[0163] 1.2.4.5. Configuration of Sensor Element and Circuit Element

[0164] Figure 7 Show Figure 6A A detailed configuration example of the sensor element 3 and the circuit element 4 of the shown sensor device 12d. The configuration can also be adopted in other sensor devices. Figure 7 Configuration.

[0165] The sensor device 12d includes a sensor element 3 and a circuit element 4.

[0166] The sensor element 3 includes an oscillator 1, and the circuit element 4 includes a drive circuit 81 and a detection circuit 82.

[0167] The drive circuit 81 includes an amplifier circuit that is input with a feedback signal DG from the oscillator 1 to amplify the signal, an AGC (Automatic Gain Control) circuit that performs automatic gain control, an output circuit that outputs a drive signal DS to the oscillator 1, etc. The AGC circuit variably and automatically adjusts the gain so that the amplitude of the feedback signal DG from the oscillator 1 is constant. The output circuit outputs a drive signal DS in the form of a rectangular wave to the oscillator 1, for example.

[0168] The detection circuit 82 may include an amplifier circuit, a synchronous detection circuit, an A / D conversion circuit, etc. The amplifier circuit is input with the detection signals S1 and S2 from the oscillator 1 to perform charge-voltage conversion and signal amplification of the detection signals S1 and S2, which are differential signals. The synchronous detection circuit uses the synchronous signal from the drive circuit 81 to perform synchronous detection for extracting the desired wave. The A / D conversion circuit converts the analog detection signals S1 and S2 after synchronous detection into digital detection data D1 and outputs it to the arithmetic circuit 14. In the present embodiment, the detection data D1 is an example of the detection signal.

[0169] The arithmetic circuit 14 performs various processes such as temperature correction, zero-point correction, sensitivity adjustment, and filtering process on the detection data D1, and outputs the processed detection data D2 to the outside via the connector 15. In the present embodiment, the detection data D2 is an example of the output signal.

[0170] In the present embodiment, the oscillator 1 is an oscillator with a double-T structure. An oscillator such as a tuning fork type or an H type can also be used as the oscillator 1.

[0171] The oscillator 1 includes: drive arms 98a, 98b, 98c, 98d; detection arms 99a, 99b; a base 91; and connection arms 92a, 92b.

[0172] The base 91 has a rectangular shape, and the detection arm 99a, the detection arm 99b, the connection arm 92a, and the connection arm 92b are provided on the respective sides of the base 91.

[0173] At the front end of the connection arm 92a, the drive arms 98a and 98b are provided.

[0174] At the front end of the connection arm 92b, the drive arms 98c and 98d are provided.

[0175] At the front ends of the drive arms 98a, 98b, 98c, 98d and the detection arms 99a, 99b, weight portions for frequency adjustment are provided.

[0176] If the X-axis direction is set as the thickness direction of the oscillator 1, the oscillator 1 detects the angular velocity about the X-axis.

[0177] The drive electrodes 93 are formed on the upper and lower surfaces of the drive arms 98a, 98b. The drive electrodes 94 are formed on the surfaces of the drive arms 98a, 98b on the positive side in the Y-axis direction and on the negative side in the Y-axis direction.

[0178] The drive electrodes 94 are formed on the upper and lower surfaces of the drive arms 98c, 98d. The drive electrodes 93 are formed on the surfaces of the drive arms 98c, 98d on the positive side in the Y-axis direction and on the negative side in the Y-axis direction.

[0179] The drive electrodes 93 and 94 are electrically connected to the drive circuit 81. The drive circuit 81 supplies a drive signal DS to the drive electrode 93, and a feedback signal DG is input from the drive electrode 94 to the drive circuit 81.

[0180] The detection electrodes 95 are formed on the upper and lower surfaces of the detection arm 99a. The ground electrodes 97 are formed on the surfaces of the detection arm 99a on the positive side in the Y-axis direction and on the negative side in the Y-axis direction.

[0181] The detection electrodes 96 are formed on the upper and lower surfaces of the detection arm 99b. The ground electrodes 97 are formed on the surfaces of the detection arm 99b on the positive side in the Y-axis direction and on the negative side in the Y-axis direction.

[0182] The detection electrodes 95 and 96 are electrically connected to the detection circuit 82. Detection signals S1 and S2 from the detection electrodes 95 and 96 are input to the detection circuit 82.

[0183] 1.2.4.6. Operations of the sensor element and the circuit element

[0184] The sensor element 3 and the circuit element 4 operate as described below.

[0185] If a drive signal DS is applied from the drive circuit 81 to the drive electrode 93, the drive arms 98a, 98b, 98c, and 98d undergo bending vibration as shown by the arrow C1 due to the inverse piezoelectric effect. Specifically, the tips of the drive arms 98a and 98c repeatedly approach and separate from each other, and the tips of the drive arms 98b and 98d also repeatedly approach and separate from each other.

[0186] In other words, the drive arms 98a, 98b, 98c, and 98d repeat the vibration postures shown by the solid-line arrow C1 and the vibration postures shown by the dashed-line arrow C1 at a predetermined frequency. The predetermined frequency is, for example, 49.6 kHz.

[0187] In the present embodiment, the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d is an example of the drive frequency of the sensor device 12d. The frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d can also be defined by the frequency of the drive signal DS. This is because the frequency of the drive signal DS is correlated with the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d. Similarly, the drive frequency of the sensor device 12d can also be defined by other signals that are correlated with the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d.

[0188] The bending vibrations of drive arms 98a and 98b and the bending vibrations of drive arms 98c and 98d are vibrations that are symmetric with respect to the Z axis passing through the center of gravity position of base 91. Therefore, due to the bending vibrations of drive arms 98a, 98b, 98c, and 98d, base 91, connecting arms 92a, connecting arms 92b, detection arms 99a, and detection arms 99b hardly vibrate.

[0189] In this state, when an angular velocity about the X axis is applied to oscillator 1, drive arms 98a, 98b, 98c, and 98d vibrate as shown by arrow C2 due to the Coriolis force. In other words, a Coriolis force in the direction of arrow C2, which is orthogonal to the direction of arrow C1 and the direction of the Y axis, acts on drive arms 98a, 98b, 98c, and 98d, thereby generating a vibration component in the direction of arrow C2.

[0190] The vibration in the direction of arrow C2 is transmitted to base 91 via connecting arms 92a and connecting arms 92b, whereby detection arms 99a and detection arms 99b bend and vibrate in the direction of arrow C3.

[0191] Charge signals generated by the piezoelectric effect due to the bending vibrations of these detection arms 99a and 99b are input as detection signals S1 and S2 to detection circuit 82, thereby detecting the angular velocity about the X axis.

[0192] 1.3. Modification

[0193] The foregoing embodiments can be variously modified.

[0194] Figure 8 is a perspective view of substrate unit 20 related to the modification, Figure 9 is an exploded view of substrate unit 20 related to the modification.

[0195] The sensor module 100 of the modification is the same as the above-described Embodiment 1. Substrate unit 20 includes: substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, 30; connection portions 41, 42, 43, 44, 45, 46, 47, 48, 49; sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h; arithmetic circuit 14; connector 15; memory 16; power supply circuit 17; temperature sensor 18. In Figure 9 the illustrations of substrates 25, 26, 27, 28 and connection portions 45, 46, 47 are omitted.

[0196] In the substrate unit 20 related to the modification example, the connection relationships between the substrates 21, 22, 23, 24, 25, 26, 27, 28, 29 and the connection portions 41, 42, 43, 44, 45, 46, 47, 48 are different from the above configuration.

[0197] As Figure 9 shown, the substrate 22 is electrically connected to the substrate 21 via the connection portion 41. The substrate 23 is electrically connected to the substrate 22 via the connection portion 42. The substrate 24 is electrically connected to the substrate 23 via the connection portion 43. A substrate 25 (not shown) is electrically connected to the substrate 24 via the connection portion 44. A substrate 26 (not shown) is electrically connected to a substrate 25 (not shown) via a connection portion 45 (not shown). A substrate 27 (not shown) is electrically connected to a substrate 26 (not shown) via a connection portion 46 (not shown). A substrate 28 (not shown) is electrically connected to a substrate 27 (not shown) via a connection portion 47 (not shown). The substrate 29 is electrically connected to a substrate 28 (not shown) via the connection portion 48.

[0198] In other words, the substrates 22 to 29 are connected in a row like a string of beads.

[0199] When assembling the substrate unit 20, as Figure 8 shown, starting from the first side 21a of the substrate 21, the substrates 22 to 29 are wound clockwise around the four sides of the substrate 21 for two rounds. In this way, just by winding the substrates 22 to 29 clockwise around the four sides of the substrate 21 for two rounds, the substrate unit 20 related to the modification example can be assembled. Therefore, the assemblability of the substrate unit 20 of the modification example is excellent, and the productivity of the sensor module 100 can be improved.

[0200] As Figure 8 shown, when assembling the substrate unit 20 related to the modification example, the arrangement positions of the respective substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, 30 are the same as those in the first embodiment.

[0201] Specifically, the substrates 22 and 26 are arranged along the first side 21a of the substrate 21, the substrates 23 and 27 are arranged along the second side 21b of the substrate 21, the substrates 24 and 28 are arranged along the third side 21c of the substrate 21, the substrates 25 and 29 are arranged along the fourth side 21d of the substrate 21, and the substrate 30 is arranged on the negative side of the Z-axis direction of the substrate 21.

[0202] The substrate 22 is electrically connected to the substrate 21 via the connection portion 41, and the substrate 26 is electrically connected to the substrate 22 via the connection portion 45. More specifically, the substrate 26 is electrically connected to the substrate 22 via the connection portion 45, the substrate 25, the connection portion 44, the substrate 24, the connection portion 43, the substrate 23, and the connection portion 42.

[0203] The substrate 23 is electrically connected to the substrate 21 via the connecting portion 42, and the substrate 27 is electrically connected to the substrate 23 via the connecting portion 46. More specifically, the substrate 23 is electrically connected to the substrate 21 via the connecting portion 42, the substrate 22, and the connecting portion 41, and the substrate 27 is electrically connected to the substrate 23 via the connecting portion 46, the substrate 26, the connecting portion 45, the substrate 25, the connecting portion 44, the substrate 24, and the connecting portion 43.

[0204] The substrate 24 is electrically connected to the substrate 21 via the connecting portion 43, and the substrate 28 is electrically connected to the substrate 24 via the connecting portion 47. More specifically, the substrate 24 is electrically connected to the substrate 21 via the connecting portion 43, the substrate 23, the connecting portion 42, the substrate 22, and the connecting portion 41, and the substrate 28 is electrically connected to the substrate 24 via the connecting portion 47, the substrate 27, the connecting portion 46, the substrate 26, the connecting portion 45, the substrate 25, and the connecting portion 44.

[0205] The substrate 25 is electrically connected to the substrate 21 via the connecting portion 44, and the substrate 29 is electrically connected to the substrate 25 via the connecting portion 48. More specifically, the substrate 25 is electrically connected to the substrate 21 via the connecting portion 44, the substrate 24, the connecting portion 43, the substrate 23, the connecting portion 42, the substrate 22, and the connecting portion 41, and the substrate 29 is electrically connected to the substrate 25 via the connecting portion 48, the substrate 28, the connecting portion 47, the substrate 27, the connecting portion 46, the substrate 26, and the connecting portion 45.

[0206] In a modified example, the arithmetic circuit 14 may also be disposed on the substrate 24 or the substrate 25 near the center of the substrate row connected in a daisy chain manner. The distances between the arithmetic circuit 14 and the substrate 29 and between the arithmetic circuit 14 and the substrate 30 are shortened, and the transfer load can be reduced. Alternatively, the arithmetic circuit 14 may be dispersedly disposed on each substrate.

[0207] In summary, as described above, the sensor module 100 of the present embodiment has the following effects.

[0208] The sensor module 100 of the present embodiment includes: a substrate 21 as a first substrate; a substrate 22 as a second substrate, disposed along the first side 21a of the substrate 21 and having a sensor device 13a as a first sensor device for detecting a physical quantity of the first axis, the sensor device 13a detecting an angular velocity about the Y axis; and a substrate 26 as a third substrate, overlapping and disposed with the substrate 22 on the first side 21a side of the substrate 21 and having a sensor device 13c as a second sensor device for detecting a physical quantity of the first axis, the sensor device 13c detecting an angular velocity about the Y axis.

[0209] As can be seen, the sensor module 100 of the present embodiment includes: a substrate 21; a substrate 22 disposed along a first side 21a of the substrate 21; a substrate 26 disposed overlapping the substrate 22 on the first side 21a side of the substrate 21; a sensor device 13a for detecting an angular velocity about the Y axis; and a sensor device 13c for detecting an angular velocity about the Y axis, wherein the substrate 22 has the sensor device 13a and the substrate 26 has the sensor device 13c.

[0210] Therefore, the sensor module 100 of the present embodiment can suppress mechanical and / or electrical interference between the sensor device 13a mounted on the substrate 22 and the sensor device 13c mounted on the substrate 26. Therefore, in the configuration of the sensor module 100 of the present embodiment having a plurality of angular velocity sensor devices about the Y axis, the effectiveness of high-precision angular velocity data can be improved.

[0211] In the sensor module 100 of the present embodiment, the detection axes of the angular velocity sensor devices mounted on the substrate 22 and the substrate 26 may also be the X axis or the Z axis. Thus, in the configuration of the sensor module 100 of the present embodiment having a plurality of angular velocity sensor devices about the X axis or about the Z axis, the effectiveness of high-precision angular velocity data can be improved.

[0212] In the sensor module 100 of the present embodiment, the angular velocity sensor devices mounted on the substrate 22 and the substrate 26 may also be acceleration sensor devices. Thus, in the configuration of the sensor module 100 of the present embodiment having a plurality of acceleration sensor devices, the effectiveness of high-precision acceleration sensor devices can be improved.

[0213] In the sensor module 100 of the present embodiment, the angular velocity sensor devices mounted on the substrate 22 and the substrate 26 may also be physical quantity sensors for detecting other physical quantities such as velocity, pressure, displacement, posture, angle, or gravity. Thus, in the configuration of the sensor module 100 of the present embodiment having a plurality of physical quantity sensors, the effectiveness of high-precision physical quantity sensors can be improved.

[0214] The sensor module 100 of the present embodiment further includes: a connection portion 41 as a first connection portion, disposed between the substrate 21 and the substrate 22, for electrically connecting the substrate 21 and the substrate 22; and a connection portion 45 as a second connection portion, disposed between the substrate 22 and the substrate 26, for electrically connecting the substrate 22 and the substrate 26.

[0215] As can be seen, in the sensor module 100 of the present embodiment, the substrate 21 and the substrate 22 are electrically connected via the connection portion 41, and the substrate 22 and the substrate 26 are electrically connected via the connection portion 45.

[0216] Therefore, the sensor module 100 of the present embodiment can suppress mechanical or electrical interference from occurring between the substrate 21 and the substrate 22 and / or between the substrate 22 and the substrate 26. Therefore, the sensor module 100 of the present embodiment can improve the effectiveness and reliability of the high-precision detection data D2.

[0217] In the sensor module 100 of the present embodiment, the first connection portion and the second connection portion are each an FPC substrate.

[0218] The connection portion 41 is a substrate that is softer than the substrates 21, 22, and 26. Therefore, the sensor module 100 of the present embodiment can suppress mechanical or electrical interference from occurring between the substrate 21 and the substrate 22 and / or between the substrate 22 and the substrate 26. Therefore, the sensor module 100 of the present embodiment can improve the effectiveness and reliability of the high-precision detection data D2.

[0219] Therefore, in the sensor module 100 of the present embodiment, the arithmetic circuit 14 processes each detection data D1 detected by each sensor device based on a configuration that ensures the effectiveness of high-precision. Therefore, the sensor module 100 of the present embodiment can obtain high-precision and highly reliable detection data D2.

[0220] In the sensor module 100 of the present embodiment, the drive frequency of the sensor device 13a is the same as the drive frequency of the sensor device 13c.

[0221] Thus, although the sensor module 100 of the present embodiment has a plurality of sensor devices 13a, 13c, there is no need to prepare components with different drive frequencies for the plurality of sensor devices 13a, 13c.

[0222] Therefore, the sensor module 100 of the present embodiment can reduce the costs required for preparing components with different drive frequencies for the plurality of sensor devices 13a, 13c in terms of manufacturing, ordering, inventory, or assembly, etc., and can improve the industrial utilization value.

[0223] Furthermore, in the sensor module 100 of the present embodiment, the substrate 21 has an arithmetic circuit 14 as a processing unit, and processes the detection data D1 as detection signals from the sensor device 13a and the sensor device 13c.

[0224] Therefore, in the sensor module 100 of the present embodiment, the arithmetic circuit 14 processes each detection data D1 detected by each sensor device based on a configuration that ensures the effectiveness of high-precision. Therefore, the sensor module 100 of the present embodiment can obtain high-precision and highly reliable detection data D2.

[0225] Furthermore, in the sensor module 100 of the present embodiment, the substrate 21 has a connector 15, and outputs the detection data D2, which is the output signal processed by the output operation circuit 14.

[0226] Therefore, based on the configuration that ensures the effectiveness of high-precision, the sensor module 100 of the present embodiment can output the high-precision and highly reliable detection data D2 processed by the operation circuit 14 to the outside via the connector 15.

[0227] The sensor module 100 of the present embodiment further includes projections 62 and spacers 60 as fixing parts for fixing the substrates 21, 22, and 26.

[0228] Therefore, it is possible to easily and accurately arrange the substrate 22 along the first side 21a of the substrate 21 and overlap and arrange the substrate 26 with the substrate 22 on the first side 21a side of the substrate 21. Therefore, the sensor module 100 of the present embodiment can improve the effectiveness and reliability of the high-precision of the detection data D2.

[0229] The sensor module 100 of the present embodiment further includes a housing 50 for housing the substrates 21, 22, and 26.

[0230] Therefore, the substrates 21, 22, and 26 on which the sensor devices are installed are housed in the housing 50 and shielded from the outside. Therefore, the sensor module 100 of the present embodiment can improve the effectiveness and reliability of the high-precision of the detection data D2.

[0231] The sensor module 100 of the present embodiment further includes: a substrate 23 as a fourth substrate, arranged along the second side 21b of the substrate 21, and having a sensor device 12e as a third sensor device for detecting a physical quantity of the second axis, the sensor device 12e detecting the angular velocity about the X axis; and a substrate 27 as a fifth substrate, arranged to overlap the substrate 23 on the second side 21b side of the substrate 21, and having a sensor device 12g as a fourth sensor device for detecting a physical quantity of the second axis, the sensor device 12g detecting the angular velocity about the X axis.

[0232] It can be seen that the sensor module 100 of the present embodiment further includes: a substrate 23 arranged along the second side 21b of the substrate 21; a substrate 27 arranged to overlap the substrate 23 on the second side 21b side of the substrate 21; a sensor device 12e for detecting the angular velocity about the X axis; and a sensor device 12g for detecting the angular velocity about the X axis, the substrate 23 having the sensor device 12e, and the substrate 27 having the sensor device 12g.

[0233] Therefore, the sensor module 100 of the present embodiment can also suppress mechanical and / or electrical interference between the sensor device 12e mounted on the substrate 23 and the sensor device 12g mounted on the substrate 27. Therefore, in the configuration of the sensor module 100 of the present embodiment that respectively includes a plurality of angular velocity sensor devices around the Y-axis and angular velocity sensor devices around the X-axis, the effectiveness of high-precision angular velocity data can be improved.

[0234] In the sensor module 100 of the present embodiment, the angular velocity sensor devices mounted on the substrates 23 and 27 can also be acceleration sensor devices. Thus, in the configuration of the sensor module 100 of the present embodiment that includes a plurality of acceleration sensor devices, the effectiveness of high-precision acceleration sensor devices can be improved.

[0235] In the sensor module 100 of the present embodiment, the angular velocity sensor devices mounted on the substrates 23 and 27 can also be physical quantity sensors for detecting other physical quantities such as speed, pressure, displacement, posture, angle, or gravity. Thus, in the configuration of the sensor module 100 of the present embodiment that includes a plurality of physical quantity sensors, the effectiveness of high-precision physical quantity sensors can be improved.

[0236] The sensor module 100 of the present embodiment further includes: a connection portion 42 as a third connection portion, disposed between the substrate 21 and the substrate 23, and electrically connecting the substrate 21 and the substrate 23; and a connection portion 46 as a fourth connection portion, disposed between the substrate 23 and the substrate 27, and electrically connecting the substrate 23 and the substrate 27.

[0237] Thus, in the sensor module 100 of the present embodiment, the substrate 21 and the substrate 23 are electrically connected via the connection portion 42, and the substrate 23 and the substrate 27 are electrically connected via the connection portion 46.

[0238] Therefore, the sensor module 100 of the present embodiment can suppress mechanical or electrical interference from occurring between the substrate 21 and the substrate 23 and / or between the substrate 23 and the substrate 27. Therefore, the sensor module 100 of the present embodiment can improve the effectiveness and reliability of high-precision detection data D2.

[0239] 2. Embodiment 2

[0240] In Embodiment 2, an electronic device including the sensor module 100 will be described.

[0241] Hereinafter, examples of portable devices such as smartphones and examples of moving bodies such as automobiles will be described as examples of electronic devices.

[0242] 2.1. Outline of Portable Devices

[0243] Figure 10 This is a perspective view of a portable device which is an electronic device according to Embodiment 2, and is a diagram showing the configuration of a smart phone 110 which is an example of a portable device.

[0244] A sensor module 100 is mounted in the smart phone 110.

[0245] The detection data D2 of the sensor module 100 is received by the control unit 111. The control unit 111 can identify the posture and movement of the smart phone 110 based on the received detection data D2, so as to change the display image shown on the display unit, or emit a warning sound or an effect sound, or drive a vibration motor to vibrate the main body.

[0246] The sensor module 100 may also be mounted in other portable devices other than the smart phone 110. For example, the sensor module 100 may be mounted in a smart watch, a portable activity meter, an HMD (Head Mounted Display), a mobile PC (Personal Computer), a tablet PC, a camera, a PDA (Personal Digital Assistants), and other portable devices. Thus, the portable device can identify the posture and movement of the portable device based on the detection data D2 of the sensor module 100, so as to change the display image, or emit a warning sound or an effect sound, or drive a vibration motor to vibrate the main body, etc.

[0247] As can be seen, in this embodiment, the sensor module 100 is mounted in a portable device such as the smart phone 110. Therefore, according to this embodiment, the reliability of the portable device equipped with the sensor module 100 can be improved.

[0248] 2.2. Outline of a moving body

[0249] Figure 11 This is a perspective view of a moving body which is an electronic device according to Embodiment 2, and is a diagram showing the configuration of an automobile 130 which is an example of a moving body.

[0250] A sensor module 100 is mounted in the automobile 130.

[0251] The sensor module 100 detects the posture of the vehicle body 131 and sends the detection data D2 to the vehicle body posture control device 132. The detection data D2 includes an angular velocity signal and an acceleration signal.

[0252] When the vehicle body posture control device 132 that controls the posture of the vehicle body 131 receives the detection data D2 of the sensor module 100, it detects the posture of the vehicle body 131 based on this signal, and controls the softness and hardness of the suspension or controls the braking of each wheel 133 according to the detection result.

[0253] In addition, the detection data D2 of the sensor module 100 can also be flexibly applied to ECU (Electronic Control Unit) such as keyless entry, engine immobilizer system, car navigation system, car air conditioner, anti-lock braking system (ABS), airbag, TPMS (Tire Pressure Monitoring System), engine control, control equipment for inertial navigation in autonomous driving, and battery monitors for hybrid vehicles and electric vehicles.

[0254] The sensor module 100 can also be mounted on other moving bodies other than the vehicle 130. Other moving bodies are, for example, bipedal walking robots, trams, radio-controlled airplanes, radio-controlled helicopters, drones, agricultural machinery, and construction machinery. The moving body equipped with the sensor module 100 can flexibly apply the detection data D2 of the sensor module 100 to posture control, position measurement, etc. of the moving body.

[0255] Thus, in the present embodiment, the sensor module 100 is mounted on a moving body such as the vehicle 130. Therefore, according to the present embodiment, the reliability of the moving body equipped with the sensor module 100 can be improved.

[0256] The preferred embodiments have been described above, but the present invention is not limited to the above embodiments. The configuration of each part of the present invention can be replaced with any configuration that exhibits the same function as the above embodiments, and any configuration can be added.

Claims

1. A sensor module, characterized in that, Comprising: A first substrate; A second substrate, disposed along a first side of the first substrate, and having a first sensor device for detecting a physical quantity of a first axis; And A third substrate, disposed overlapping the second substrate on one side of the first side of the first substrate, and having a second sensor device for detecting a physical quantity of the first axis.

2. The sensor module according to claim 1, wherein The sensor module comprises: A first connection portion, disposed between the first substrate and the second substrate, and electrically connecting the first substrate and the second substrate; And A second connection portion, disposed between the second substrate and the third substrate, and electrically connecting the second substrate and the third substrate.

3. The sensor module according to claim 2, wherein The first connection portion and the second connection portion are each an FPC substrate.

4. The sensor module according to claim 1, wherein The driving frequency of the first sensor device is the same as the driving frequency of the second sensor device.

5. The sensor module according to claim 1, wherein The first substrate has a processing portion for processing detection signals from the first sensor device and the second sensor device.

6. The sensor module according to claim 5, wherein The first substrate has a connector for outputting an output signal processed by the processing portion.

7. The sensor module according to claim 1, wherein The sensor module comprises a fixing portion for fixing the first substrate, the second substrate, and the third substrate.

8. The sensor module according to claim 1, wherein The sensor module comprises a housing for housing the first substrate, the second substrate, and the third substrate.

9. The sensor module according to claim 1, wherein The sensor module comprises: A fourth substrate, disposed along a second side of the first substrate, and having a third sensor device for detecting a physical quantity of a second axis; and A fifth substrate, disposed overlapping the fourth substrate on one side of the second side of the first substrate, and having a fourth sensor device for detecting a physical quantity of the second axis.

10. The sensor module according to claim 9, wherein The sensor module comprises: A third connection portion, disposed between the first substrate and the fourth substrate, and electrically connecting the first substrate and the fourth substrate; And A fourth connection portion, disposed between the fourth substrate and the fifth substrate, and electrically connecting the fourth substrate and the fifth substrate.

11. An electronic device, characterized in that, Comprising the sensor module according to any one of claims 1 to 10.

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