Reinforcing structure for computer memory bank

Abstract

The invention discloses a reinforcing structure for a computer memory bank, and relates to the field of computer accessories, the reinforcing structure comprises a reinforcing mechanism, the bottom of the reinforcing mechanism is provided with a memory bank body, the bottom of the memory bank body is fixedly provided with a golden finger, the memory bank body is installed on a memory socket, the memory socket is internally provided with a memory slot, and the golden finger is fixedly connected with the memory slot. A computer mainboard is fixedly installed at the bottom of the memory socket, and a rapid positioning installation mechanism is installed on the memory socket. According to the reinforcing structure for the computer memory bank, correct electrical connection between the memory bank body and the mainboard is ensured, the problems of poor contact, incapability of recognizing a memory by a system and the like caused by inaccurate insertion position of a golden finger are avoided, and the stability and the reliability of the system are improved; in a plugging process, the golden finger is prevented from directly rubbing with the memory socket, and a gold-plated layer on the surface of the golden finger can be effectively prevented from being worn; the service life of the memory bank body is prolonged, and the hardware fault probability caused by golden finger abrasion is reduced.

Description

Technical Field

[0001] The present invention relates to the field of computer accessories, and specifically to a reinforcement structure for a computer memory module. Background Art

[0002] A memory module is an internal memory that directly exchanges data with the CPU. It is usually used as a temporary data storage medium for the operating system or other running programs. The memory module is installed and configured with a dedicated card seat, and the memory module is installed in the card seat by plugging and unplugging; however, when a cleaning member cleans the memory module, it cleans the memory module through the same position. During the cleaning process, the dust adhered to the cleaning member is likely to adhere to the memory module again, resulting in the phenomenon of secondary pollution.

[0003] To solve the above problems, after retrieval, a Chinese patent with the publication number CN218471255U discloses a reinforcement structure for a computer memory module. The text includes a card seat. A memory slot is opened on the upper side of the card seat. Elastic frames are arranged on both sides of the memory slot on the upper side of the card seat. Cleaning members are rotatably connected to both elastic frames; different positions of the cleaning member clean different positions of the memory module, reducing the phenomenon that the cleaned part of the memory module contacts the memory module again, thereby reducing the secondary pollution phenomenon that occurs when the cleaning member cleans the memory module.

[0004] Although the above device can install and clean the memory module, in actual use, when the memory module is inserted into the memory socket, the gold fingers cannot be accurately inserted into the memory socket; problems such as poor contact and the system being unable to recognize the memory are likely to occur due to inaccurate insertion positions of the gold fingers, reducing the stability and reliability of the system; during the insertion process, the gold fingers directly rub against the memory socket, resulting in wear of the gold plating layer on the surface of the gold fingers; the gold plating layer on the surface of the gold fingers has good electrical conductivity and antioxidant properties. Once worn, it may cause an increase in contact resistance, affecting the data transmission speed and stability between the memory and the motherboard, and even may malfunction due to oxidation. Summary of the Invention

[0005] The purpose of the present invention is to provide a reinforcement structure for a computer memory module to solve the defects mentioned in the above background art.

[0006] To achieve the above object, a reinforcement structure for a computer memory module is provided, including a reinforcement mechanism. The bottom of the reinforcement mechanism is provided with a memory module body. The bottom of the memory module body is fixedly provided with a gold finger. The memory module body is installed on a memory socket. The inside of the memory socket is provided with a memory slot. The bottom of the memory socket is fixedly installed on a computer motherboard. A quick positioning and installation mechanism is installed on the memory socket. A positioning seat A and a positioning seat B are respectively installed on the quick positioning and installation mechanism. The positioning seat B is fixedly connected to one side of the memory socket. A positioning seat A is fixedly installed on the side of the memory socket away from the positioning seat B.

[0007] Further, the quick positioning and installation mechanism includes a positioning seat A, a positioning slot A, a positioning seat B, a positioning slot B, a docking strip A, a docking strip B, a connecting plate, a fixing seat, and a fixing groove. Both the positioning seat A and the positioning seat B are provided in four groups. The four groups of positioning seat A and the four groups of positioning seat B are respectively fixedly connected to both sides of the four groups of memory sockets. Memory slots are provided inside the four groups of memory sockets. Memory module bodies are synchronously inserted into the four groups of memory slots.

[0008] Further, the fixing seats are evenly provided in four groups. Fixing grooves are provided inside the four groups of fixing seats. The sizes of the fixing grooves are adapted to the sizes of the memory module bodies. The tops of the four groups of memory module bodies are respectively inserted into the four groups of fixing seats.

[0009] Further, a docking strip A is fixedly provided on one side of the four groups of fixing seats, and a docking strip B is fixedly provided on the other side of the four groups of fixing seats. The four groups of docking strip B and the docking strip A are arranged in parallel; a positioning slot A is provided inside the positioning seat A, and a positioning slot B is provided inside the positioning seat B.

[0010] Further, the cross-section of the docking strip A is arranged as an isosceles trapezoid, the cross-section of the docking strip B is arranged as a right trapezoid, the cross-section of the positioning slot A is arranged as an isosceles trapezoid, and the cross-section of the positioning slot B is arranged as a right trapezoid; the sizes of the docking strip A and the positioning slot A are adapted to each other, and the sizes of the docking strip B and the positioning slot B are adapted to each other.

[0011] Further, the four groups of docking strip A are respectively inserted into the four groups of positioning slot A, and the four groups of docking strip B are respectively inserted into the four groups of positioning slot B. At the same time, the height of the docking strip A is greater than the height of the memory module body, and the bottom of the docking strip A passes over the gold finger.

[0012] Further, the adjacent two groups of docking strip A are fixedly connected by a connecting plate. Both ends of the connecting plate are arranged in an arc shape. One end of the connecting plate is screwed to one group of docking strip A, and the other end of the connecting plate is screwed to another group of docking strip A; the four groups of memory module bodies are synchronously inserted into the four groups of memory sockets through the quick positioning and installation mechanism.

[0013] Further, the reinforcement mechanism includes a top pressure seat, a first stabilizing piece, a second stabilizing piece, a second clamping strip, a second clamping seat, a first clamping strip, a first clamping seat and a clamping groove. The top pressure seat is composed of four chucks with a "C"-shaped cross-section, and the four chucks are respectively inserted into the tops of the four fixing seats, and the cross-section of the top of the fixing seat is "C"-shaped; two sets of openings are provided on both the first stabilizing piece and the second stabilizing piece.

[0014] Further, a first stabilizing piece is fixedly installed at one end of the top pressure seat, and a second stabilizing piece is fixedly installed at the other end of the top pressure seat. A second clamping strip and a first clamping strip are respectively installed at the bottoms of the second stabilizing piece and the first stabilizing piece, and both the second stabilizing piece and the first stabilizing piece are "L"-shaped.

[0015] Further, the first clamping seat is fixedly connected to one side of the surface of the computer motherboard, and a second clamping seat is fixedly connected to the other side of the surface of the computer motherboard. Clamping grooves are provided inside both the second clamping seat and the first clamping seat. The clamping grooves are adapted to the size of the clamping strips, and the cross-sections of the clamping grooves and the clamping strips are both circular. The first clamping strip and the second clamping strip are respectively horizontally inserted into the clamping grooves provided inside the first clamping seat and the second clamping seat.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. In the present invention, the docking strips A and B on both sides of the bottoms of the four fixing seats are fixedly connected by a plurality of connecting plates, so that the four memory module bodies form a whole. When being inserted into the memory sockets on the computer motherboard, there is no need to insert them one by one. The four memory module bodies can be synchronously inserted into the four memory sockets, without inserting them one by one, which greatly saves the installation time and effort. Especially for users who are not familiar with computer hardware installation, it reduces the installation difficulty and also reduces the risk of oxidation of the memory gold fingers or damage to the sockets caused by multiple pluggings and unpluggings.

[0018] 2. In the present invention, the positioning groove A and the positioning seat B provide accurate positioning for the docking strips A and B, and can guide the docking strips to accurately cooperate with the memory sockets, so as to ensure that the gold fingers can be accurately inserted into the memory sockets; this helps to ensure the correct electrical connection between the memory module body and the motherboard, and avoid problems such as poor contact and the system being unable to recognize the memory caused by inaccurate insertion positions of the gold fingers, improving the stability and reliability of the system; during the insertion process, it avoids the direct friction between the gold fingers and the memory sockets, and can effectively prevent the gold plating layer on the surface of the gold fingers from being worn; it prolongs the service life of the memory module body and reduces the probability of hardware failures caused by wear of the gold fingers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front view schematic diagram of the structure of the present invention;

[0020] Figure 2 It is the rear view of the structure of the present invention;

[0021] Figure 3 is Figure 1 the schematic diagram of removing the reinforcement mechanism in;

[0022] Figure 4 It is the rear view of the structure of the present invention;

[0023] Figure 5 It is the schematic diagram of the surface mounting structure of the computer motherboard of the structure of the present invention;

[0024] Figure 6 It is the schematic diagram of the memory module body and its connection structure of the structure of the present invention;

[0025] Figure 7 It is the fixing seat and its connection structure of the structure of the present invention;

[0026] Figure 8 It is the structure of the present invention Figure 7 cross-sectional view.

[0027] [Reference Signs]

[0028] 1. Computer motherboard; 11. Memory socket; 12. Memory slot; 2. Memory module body; 21. Gold finger; 3. Quick positioning and installation mechanism; 31. Positioning seat A; 32. Positioning groove A; 33. Positioning seat B; 34. Positioning groove B; 35. Docking strip A; 351. Docking strip B; 36. Connecting plate; 37. Fixing seat; 371. Fixing groove; 4. Reinforcement mechanism; 41. Pressing seat; 42. First stabilizing piece; 421. Second stabilizing piece; 422. Second clamping strip; 423. Second clamping seat; 43. First clamping strip; 44. First clamping seat; 45. Card slot; 46. Opening. Detailed Embodiment

[0029] Detailed Embodiment 1: Please refer to Figures 1-8 , the present invention provides a technical solution: A reinforcement structure for a computer memory module, including a reinforcement mechanism 4. The bottom of the reinforcement mechanism 4 is provided with a memory module body 2. The bottom of the memory module body 2 is fixedly provided with a gold finger 21. The memory module body 2 is installed on a memory socket 11. A memory slot 12 is opened inside the memory socket 11. The bottom of the memory socket 11 is fixedly installed with a computer motherboard 1. A quick positioning and installation mechanism 3 is installed on the memory socket 11. A positioning seat A 31 and a positioning seat B 33 are respectively installed on the quick positioning and installation mechanism 3. The positioning seat B 33 is fixedly connected to one side of the memory socket 11. A positioning seat A 31 is fixedly installed on the side of the memory socket 11 away from the positioning seat B 33.

[0030] Working principle: When in actual use, first insert the tops of the four memory module bodies 2 into the fixing grooves 371 formed inside the four fixing seats 37 respectively. At the same time, the docking strips A35 and docking strips B351 on both sides of the bottoms of the four fixing seats 37 are fixedly connected through multiple connecting plates 36, so that the four memory module bodies 2 form a whole. When inserted into the memory sockets 11 on the computer motherboard 1, there is no need to insert them one by one. The four memory module bodies 2 can be synchronously inserted into the four memory sockets 11, eliminating the need for piecemeal insertion, greatly saving installation time and effort. Especially for users who are not familiar with computer hardware installation, it reduces the installation difficulty and also reduces the risk of oxidation of the memory module pins 21 or damage to the sockets caused by multiple insertions and extractions; the four memory module bodies 2 can be inserted into the sockets simultaneously, ensuring their synchronization and compatibility during operation; because they are installed and initialized as a whole, they can work better together, avoiding memory recognition problems or asynchronous operation situations that may occur due to piecemeal installation, thereby improving the stability and performance of the system; after the memory module bodies 2 combined into a whole are inserted into the memory sockets, the overall structure is more stable; compared with the four individual memory module bodies 2, the connection between them is closer, and it is not easy for individual memory module bodies 2 to become loose due to external vibration and other factors, reducing the probability of system failures caused by poor memory contact; when the memory needs to be upgraded, replaced, or repaired, the memory module bodies 2 as a whole are easier to operate; they can be pulled out as a whole for inspection, replacement, or upgrade, instead of having to deal with each individual memory module body 2 like a single one, improving the maintenance efficiency and facilitating unified management and identification of the memory; when the four memory module bodies 2 are being inserted, specifically when actually inserting the memory module bodies 2, since the bottom of the docking strip A35 is set to cross over the memory module pins 21, before the memory module pins 21 are inserted into the memory sockets 11, the four docking strips A35 and docking strips B351 are first inserted into the positioning seats A31 and positioning seats B33 respectively, completing the accurate insertion of the memory module pins 21 into the memory sockets 11 without error; this avoids abrasion of the memory module pins 21; the positioning grooves A32 and the positioning seats B33 provide precise positioning for the docking strips A35 and docking strips B351, and can guide the docking strips to accurately cooperate with the memory sockets 11, thereby ensuring that the memory module pins 21 can be accurately inserted into the memory sockets 11 without error; this helps to ensure the correct electrical connection between the memory module bodies 2 and the motherboard, avoiding problems such as poor contact and the system being unable to recognize the memory caused by inaccurate insertion positions of the memory module pins 21, and improving the stability and reliability of the system; during the insertion process, it avoids direct friction between the memory module pins 21 and the memory sockets 11, effectively preventing the gold plating layer on the surface of the memory module pins 21 from being worn;The gold plating layer on the surface of the gold finger 21 has good electrical conductivity and oxidation resistance. Once worn, it may cause an increase in contact resistance, affecting the data transmission speed and stability between the memory and the motherboard, and may even malfunction due to oxidation. This method extends the service life of the memory module body 2 and reduces the probability of hardware failures caused by wear of the gold finger 21. The method of first inserting the docking strip A35 and the docking strip B351 into the positioning groove A32 and the positioning seat B33 provides a relatively simple and easy-to-operate plugging process for users. Users can more easily align the memory module body 2 with the memory socket 11, reducing the risk of accidental contact and damage to the gold finger 21 during the plugging process. Especially for users who are not familiar with computer hardware installation, this design reduces the installation difficulty and improves the installation success rate. Since the cooperation between the docking strip and the positioning seat can quickly and accurately guide the gold finger 21 into the memory socket 11, reducing the process of repeated adjustment and trial, it saves installation time and improves installation efficiency. Whether in large-scale production in a computer assembly factory or when users assemble a computer by themselves, the advantages of this design in improving work efficiency can be reflected. After the four groups of memory module bodies 2 are respectively plugged into the four groups of memory sockets 11, at this time, hold the pressing seat 41 and cover the pressing seat 41 on the four groups of fixing seats 37. At the same time, the second card strip 422 and the first card strip 43 are respectively installed at the bottoms of the second stabilizing piece 421 and the first stabilizing piece 42. The first card strip 43 and the second card strip 422 are respectively horizontally inserted into the card slots 45 opened inside the first card seat 44 and the second card seat 423. It can improve the stability of the four groups of memory module bodies 2 after plugging, prevent the memory module body 2 from shaking, replace the snap-fixing method, and is more labor-saving during installation and disassembly.

[0031] Specific Embodiment 2: This embodiment is a further limitation of Specific Embodiment 1. The quick positioning and installation mechanism 3 includes a positioning seat A31, a positioning groove A32, a positioning seat B33, a positioning groove B34, a docking strip A35, a docking strip B351, a connecting plate 36, a fixing seat 37, and a fixing groove 371. Both the positioning seat A31 and the positioning seat B33 are provided in four groups. The four groups of positioning seats A31 and positioning seats B33 are respectively fixedly connected to both sides of the four groups of memory sockets 11. Memory slots 12 are opened inside the four groups of memory sockets 11, and the memory module body 2 is synchronously inserted into the four groups of memory slots 12.

[0032] Specific Embodiment 3: This embodiment is a further limitation of Specific Embodiment 1. The fixing seats 37 are evenly provided in four groups. Fixing grooves 371 are opened inside the four groups of fixing seats 37. The fixing grooves 371 are adapted to the size of the memory module body 2, and the tops of the four groups of memory module bodies 2 are respectively inserted into the four groups of fixing seats 37.

[0033] Embodiment 4: This embodiment is a further limitation of Embodiment 2. On one side of the four groups of fixed seats 37, docking strip A35 is fixedly arranged, and on the other side of the four groups of fixed seats 37, docking strip B351 is fixedly arranged. The four groups of docking strip B351 and docking strip A35 are arranged in parallel; a positioning groove A32 is formed inside the positioning seat A31, and a positioning groove B34 is formed inside the positioning seat B33.

[0034] Embodiment 5: This embodiment is a further limitation of Embodiment 4. The cross-section of the docking strip A35 is isosceles trapezoid, the cross-section of the docking strip B351 is right trapezoid, the cross-section of the positioning groove A32 is isosceles trapezoid, and the cross-section of the positioning groove B34 is right trapezoid; the sizes of the docking strip A35 and the positioning groove A32 are adapted to each other, and the sizes of the docking strip B351 and the positioning groove B34 are adapted to each other.

[0035] Embodiment 6: This embodiment is a further limitation of Embodiment 5. The four groups of docking strip A35 are respectively inserted inside the four groups of positioning grooves A32, the four groups of docking strip B351 are respectively inserted inside the four groups of positioning grooves B34. At the same time, the height of the docking strip A35 is greater than the height of the memory module body 2, and the bottom of the docking strip A35 extends beyond the gold finger 21.

[0036] Embodiment 7: This embodiment is a further limitation of Embodiment 6. The adjacent two groups of docking strip A35 are fixedly connected through a connecting plate 36. Both ends of the connecting plate 36 are arc-shaped. One end of the connecting plate 36 is screwed to one group of docking strip A35, and the other end of the connecting plate 36 is screwed to another group of docking strip A35; the four groups of memory module bodies 2 are synchronously inserted inside the four groups of memory sockets 11 through the quick positioning and installation mechanism 3.

[0037] Embodiment 8: This embodiment is a further limitation of Embodiment 1. The reinforcement mechanism 4 includes a pressing seat 41, a first stabilizing piece 42, a second stabilizing piece 421, a second clamping strip 422, a second clamping seat 423, a first clamping strip 43, a first clamping seat 44 and a clamping groove 45. The pressing seat 41 is composed of four chucks with a "C"-shaped cross-section, and the four chucks are respectively inserted on the tops of the four groups of fixed seats 37. The top of the fixed seat 37 has a "C"-shaped cross-section; two sets of openings 46 are formed on both the first stabilizing piece 42 and the second stabilizing piece 421.

[0038] Embodiment 9: This embodiment is a further limitation of Embodiment 8. A first stabilizing piece 42 is fixedly installed at one end of the pressing seat 41, a second stabilizing piece 421 is fixedly installed at the other end of the pressing seat 41. A second clamping strip 422 and a first clamping strip 43 are respectively installed at the bottoms of the second stabilizing piece 421 and the first stabilizing piece 42. Both the second stabilizing piece 421 and the first stabilizing piece 42 are "L"-shaped.

[0039] Embodiment Ten: This embodiment is a further limitation of Embodiment Eight. The first card holder 44 is fixedly connected to one side of the surface of the computer motherboard 1, and a second card holder 423 is fixedly connected to the other side of the surface of the computer motherboard 1. Card slots 45 are formed inside both the second card holder 423 and the first card holder 44. The sizes of the card slots 45 are adapted to those of the card strips. The cross-sections of the card slots 45 and the card strips are both circular. The first card strip 43 and the second card strip 422 are respectively horizontally inserted into the card slots 45 formed inside the first card holder 44 and the second card holder 423.

[0040] The reinforcement mechanism 4 can make the connection between the memory module body 2 and the memory socket 11 more stable, effectively preventing the memory module body 2 from loosening when the computer vibrates, moves, or is subjected to external force collision, ensuring a stable connection between the memory and the motherboard, and reducing system failures caused by poor contact, such as blue screens, crashes, etc.; during the operation of the computer, especially for computers that are often moved or used in an unstable environment, such as laptop computers or industrial control computers, the reinforcement mechanism 4 can enhance the seismic resistance of the memory module body 2, avoiding friction and wear between the gold fingers 21 and the memory socket 11 caused by vibration, and extending the service life of the memory module body 2 and the memory socket 11; by integrally fixing the memory module body 2 through the reinforcement mechanism 4, it can ensure a good electrical connection between the gold fingers 21 and the memory socket 11; a stable connection helps to reduce interference and loss of signal transmission, improving the stability and reliability of memory data transmission, thereby enhancing the overall performance of the computer system; the overall fixed design enables the memory module body 2 to be easily found and operated when maintaining or upgrading the computer; the reinforcement mechanism 4 can be designed to be easily disassembled and installed, facilitating users to quickly and accurately remove the memory module body 2 from the motherboard or install a new memory module body 2 when replacing or upgrading the memory, improving the maintenance efficiency; the reinforcement mechanism 4 can play a certain protective role, preventing users from inadvertently touching or shaking the memory module body 2, resulting in its loosening or detachment; this is of great significance for avoiding hardware failures caused by human misoperation during the normal use of the computer; at the same time, it also helps to keep the internal hardware of the computer clean and orderly, reducing problems such as poor contact caused by foreign objects entering the memory slot.

Claims

1. A reinforcement structure for a computer memory module, comprising a reinforcement mechanism (4), characterized in that: The bottom of the reinforcement mechanism (4) is provided with a memory module body (2). The bottom of the memory module body (2) is fixedly provided with a gold finger (21). The memory module body (2) is installed on a memory socket (11). An inner memory slot (12) is provided inside the memory socket (11). The bottom of the memory socket (11) is fixedly installed on a computer motherboard (1). A quick positioning and installation mechanism (3) is installed on the memory socket (11). A positioning seat A (31) and a positioning seat B (33) are respectively installed on the quick positioning and installation mechanism (3). The positioning seat B (33) is fixedly connected to one side of the memory socket (11). The positioning seat A (31) is fixedly installed on the side of the memory socket (11) away from the positioning seat B (33).

2. The reinforcement structure for a computer memory module according to claim 1, wherein: The quick positioning and installation mechanism (3) includes a positioning seat A (31), a positioning slot A (32), a positioning seat B (33), a positioning slot B (34), a docking strip A (35), a docking strip B (351), a connecting plate (36), a fixing seat (37), and a fixing slot (371). Both the positioning seat A (31) and the positioning seat B (33) are provided in four groups. The four groups of positioning seat A (31) and positioning seat B (33) are respectively fixedly connected to both sides of the four groups of memory sockets (11). Inner memory slots (12) are provided inside the four groups of memory sockets (11). The memory module body (2) is synchronously inserted into the four groups of inner memory slots (12).

3. The reinforcement structure for a computer memory module according to claim 2, wherein: The fixing seats (37) are evenly provided in four groups. Fixing slots (371) are provided inside the four groups of fixing seats (37). The fixing slots (371) are adapted to the size of the memory module body (2). The tops of the four groups of memory module bodies (2) are respectively inserted into the four groups of fixing seats (37).

4. A reinforcing structure for a computer memory module according to any one of claims 2 or 3, characterized in that: A docking strip A (35) is fixedly provided on one side of the four groups of fixing seats (37). A docking strip B (351) is fixedly provided on the other side of the four groups of fixing seats (37). The four groups of docking strip B (351) and docking strip A (35) are arranged in parallel. A positioning slot A (32) is provided inside the positioning seat A (31). A positioning slot B (34) is provided inside the positioning seat B (33).

5. The reinforcing structure for a computer memory module according to claim 4, wherein: The cross-section of the docking strip A (35) is arranged in an isosceles trapezoid shape. The cross-section of the docking strip B (351) is arranged in a right trapezoid shape. The cross-section of the positioning slot A (32) is arranged in an isosceles trapezoid shape. The cross-section of the positioning slot B (34) is arranged in a right trapezoid shape. The docking strip A (35) is adapted to the size of the positioning slot A (32). The docking strip B (351) and the positioning slot B (34) are adapted to each other in size.

6. The reinforcement structure for a computer memory module according to claim 5, characterized in that: The four groups of docking strip A (35) are respectively inserted into the four groups of positioning slots A (32). The four groups of docking strip B (351) are respectively inserted into the four groups of positioning slots B (34). At the same time, the height of the docking strip A (35) is greater than the height of the memory module body (2). The bottom of the docking strip A (35) is set to cross over the gold finger (21).

7. The reinforcement structure for a computer memory module according to claim 6, characterized in that: The adjacent two sets of docking strips A (35) are fixedly connected through a connecting plate (36). Both ends of the connecting plate (36) are arc-shaped. One end of the connecting plate (36) is screwed to one set of docking strips A (35), and the other end of the connecting plate (36) is screwed to the other set of docking strips A (35). The four memory module bodies (2) are synchronously inserted into the interiors of the four memory sockets (11) through a quick positioning and installation mechanism (3).

8. A reinforcing structure for a computer memory module according to any one of claims 1 or 2, characterized in that: The reinforcement mechanism (4) includes a pressing seat (41), a first stabilizing piece (42), a second stabilizing piece (421), a second clamping strip (422), a second clamping seat (423), a first clamping strip (43), a first clamping seat (44), and a clamping groove (45). The pressing seat (41) is composed of four chucks with a "C"-shaped cross-section, and the four chucks are respectively inserted into the tops of the four fixing seats (37). The cross-section of the top of the fixing seat (37) is "C"-shaped. Two through holes (46) are formed in both the first stabilizing piece (42) and the second stabilizing piece (421).

9. The reinforcement structure for a computer memory module according to claim 8, characterized in that: A first stabilizing piece (42) is fixedly installed at one end of the pressing seat (41), and a second stabilizing piece (421) is fixedly installed at the other end of the pressing seat (41). A second clamping strip (422) and a first clamping strip (43) are respectively installed at the bottoms of the second stabilizing piece (421) and the first stabilizing piece (42). Both the second stabilizing piece (421) and the first stabilizing piece (42) are "L"-shaped.

10. A reinforcement structure for a computer memory module according to claim 8, characterized in that: The first clamping seat (44) is fixedly connected to one side of the surface of the computer motherboard (1), and a second clamping seat (423) is fixedly connected to the other side of the surface of the computer motherboard (1). Clamping grooves (45) are formed inside both the second clamping seat (423) and the first clamping seat (44). The dimensions of the clamping grooves (45) are adapted to those of the clamping strips, and the cross-sections of the clamping grooves (45) and the clamping strips are both circular. The first clamping strip (43) and the second clamping strip (422) are respectively horizontally inserted into the clamping grooves (45) formed inside the first clamping seat (44) and the second clamping seat (423).

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