Power supply device and electronic apparatus

Abstract

The invention provides a power supply device and electronic equipment, which can be applied to the technical field of power supply. The power supply device includes: a substrate; a plurality of power chips disposed in a first region of the surface of the substrate; the multiple output inductors are arranged in the second area of the surface of the substrate, the multiple power supply chips are electrically connected with the output inductors respectively, the output inductors comprise primary side inductors and secondary side inductors, and first magnetic cores and second magnetic cores are arranged on the peripheries of the primary side inductors and the secondary side inductors respectively; the outer surface of the first magnetic core and the outer surface of the second magnetic core are oppositely arranged at a preset gap and are both in a matched sawtooth shape.

Description

Technical Field

[0001] The present disclosure relates to the technical field of power supply, and particularly to a power supply device and an electronic device. Background Art

[0002] In an electronic device, data processing is usually performed by processors such as a Central Processing Unit (CPU) and a Graphics Processing Unit (GPU). The operation of the CPU, GPU and other processors relies on the support of a power supply device. With the continuous miniaturization and high performance of electronic devices, higher requirements are also placed on the efficiency and integration of the power supply device. However, the power supply device has problems such as high wiring difficulty and large volume. Summary of the Invention

[0003] In view of the above problems, the present disclosure provides a power supply device and an electronic device.

[0004] According to a first aspect of the present disclosure, there is provided a power supply device, comprising: a substrate; a plurality of power chips disposed in a first area on the surface of the substrate; and a plurality of output inductors disposed in a second area on the surface of the substrate, wherein each of the plurality of power chips is electrically connected to one of the output inductors. The output inductor includes a primary side inductor and a secondary side inductor. A first magnetic core and a second magnetic core are respectively disposed around the primary side inductor and the secondary side inductor. The outer surfaces of the first magnetic core and the second magnetic core are disposed opposite to each other with a predetermined gap, and both are formed into serrated shapes that are adapted to each other.

[0005] A second aspect of the present disclosure provides an electronic device, comprising: the power supply device as described above.

[0006] According to an embodiment of the present disclosure, by finely adjusting the gap between the first magnetic core and the second magnetic core in the output inductor, the leakage inductance of the output inductor is increased, so that the energy storage function of the energy storage inductor can be realized by using the output inductor, replacing the energy storage inductor, reducing the wiring difficulty of the power supply device, and improving the integration of the power supply device. In addition, since the components in the power supply device are reduced, the volume of the power supply device can also be reduced, and the cost of the power supply device can be lowered. Moreover, since the changes to the first magnetic core and the second magnetic core are small, the design of the output inductor can be reused to the greatest extent. Brief Description of the Drawings

[0007] Through the following description of the embodiments of the present disclosure with reference to the drawings, the above content and other objects, features and advantages of the present disclosure will become clearer. In the drawings: Figure 1ASchematically shows a circuit schematic diagram of a power supply device; Figure 1B Schematically shows a layout schematic diagram of a power supply device supplying power to a processor; Figure 2 Schematically shows a top view structural schematic diagram of the power supply device according to an embodiment of the present disclosure; Figure 3A Schematically shows a cross-sectional schematic diagram of an output inductor; Figure 3B Schematically shows a cross-sectional schematic diagram of the output inductor according to an embodiment of the present disclosure; Figure 4A Schematically shows an equivalent circuit diagram of the power supply device according to an embodiment of the present disclosure; Figure 4B Schematically shows an actual circuit diagram of the power supply device according to an embodiment of the present disclosure; Figure 5 Schematically shows a layout schematic diagram of the power supply device according to an embodiment of the present disclosure supplying power to a processor; Figure 6 Schematically shows a schematic diagram of the leakage magnetic phenomenon of the output inductor according to an embodiment of the present disclosure; Figure 7A Schematically shows a partial side view structural diagram of a power supply transposition; Figure 7B Schematically shows a partial side view structural diagram of the power supply transposition according to an embodiment of the present disclosure; Figure 8A Schematically shows a front view structural diagram of a power supply device; Figure 8B Schematically shows a front view structural diagram of the power supply device according to an embodiment of the present disclosure; and Figure 9 Schematically shows a block diagram of an electronic device according to an embodiment of the present disclosure. Detailed implementation manners

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present disclosure. In the following detailed description, for the sake of explanation, many specific details are set forth in order to provide a thorough understanding of the embodiments of the present disclosure. However, obviously, one or more embodiments can also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present disclosure.

[0009] The terms used herein are for describing specific embodiments only and are not intended to limit the present disclosure. The terms "including", "comprising", etc. used herein indicate the presence of the described features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0010] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0011] In cases where expressions similar to "at least one of A, B, and C, etc." are used, generally, it should be interpreted according to the meaning commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include, but not be limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0012] A Trans-Inductor Voltage Regulator (TLVR) inductor is used in a power supply device. The secondary inductor of the TLVR inductor usually needs to be used in conjunction with a storage inductor. The storage inductor can store electrical energy and release the energy at an appropriate time to ensure the stability and continuity of the output voltage of the power supply device. Therefore, the storage inductor plays a crucial role in the power supply device.

[0013] Figure 1A A circuit schematic diagram of a power supply device is schematically shown.

[0014] As Figure 1A shown, taking the power supply device 100 using a three-phase parallel TLVR inductor as an example, VIN on the left is the input voltage, and VOUT on the right is the output voltage. The input terminals of the power supply chips C11, C12, and C13 are connected to the input voltage VIN. The power supply chips C11, C12, and C13 are used in parallel and generate the output voltage VOUT through the output inductors Lm11, Lm12, and Lm13. The output inductors Lm11, Lm12, and Lm13 are TLVR inductors. The left coils of the output inductors Lm11, Lm12, and Lm13 are the primary coils, and the right coils are the secondary coils. The primary coils of the output inductors Lm11, Lm12, and Lm13 are connected in parallel and serve as the primary side inductor of the power supply device to generate the output voltage VOUT. The secondary coils of the output inductors Lm11, Lm12, and Lm13 are connected in series and serve as the secondary side inductor of the power supply device. One end of the secondary coils of the output inductors Lm11, Lm12, and Lm13 is directly grounded, and the other end is grounded after being connected in series with the storage inductor Lc.

[0015] In the above example, due to the existence of the energy storage inductor Lc, it will occupy a certain circuit layout space of the power supply device, as Figure 1B shown.

[0016] Figure 1B Schematically shows a layout diagram of a power supply device supplying power to a processor.

[0017] As Figure 1B shown, taking the power supply device supplying power to the CPU as an example, since the energy storage inductor Lc is connected in series with the secondary coil of the output inductor, the position of the energy storage inductor is basically fixed and needs to be placed side by side with the output inductor. At the same time, the high-speed traces of the CPU need to avoid vertical overlap with the output inductor to prevent the high-speed traces from being interfered by the magnetic field of the output inductor and affecting the quality of high-speed signals. In this way, it is necessary to move the power supply chip and the output inductor to the left uniformly, and the output inductor is separated from the CPU by a distance of L1. The farther the power supply chip and the output inductor are from the CPU, the worse the conversion efficiency of the power supply device, the greater the loss, the worse the dynamic response ability, and the more capacitors need to be placed. At the same time, due to the existence of the energy storage inductor, it will lead to an increase in the material cost, production cost and maintenance cost of the printed circuit board (PCB), and also lead to an increase in the defective rate of the board.

[0018] Therefore, aiming at the problems of high wiring difficulty and large volume of the above power supply device, since the leakage inductance of the output inductor can also store energy, the energy storage inductor can be removed and the function of the energy storage inductor can be realized by using the leakage inductance of the output inductor. However, the leakage inductance of the output inductor in the above example is small, so it is necessary to increase its leakage inductance.

[0019] There are various ways to increase the leakage inductance. For example, changing the material of the magnetic core, increasing the winding pitch, changing the winding method, changing the magnetic core structure, increasing the air gap (abbreviated as air gap), etc. Changing the material of the magnetic core involves in-depth research and screening of the characteristics of different magnetic materials to find the most suitable material for improving the leakage inductance without affecting other electrical properties. Increasing the winding pitch requires accurate calculation of the pitch size to ensure that the leakage inductance can be increased without causing a significant decrease in the inductance value. Changing the winding method, including complex processes such as multi-layer winding and interleaved winding, has high requirements for manufacturing equipment and process flow. Changing the magnetic core structure requires re-designing the shape, size, etc. of the magnetic core to achieve the purpose of increasing the leakage inductance. Increasing the air gap is to form an air gap by reserving a certain space in the magnetic core, thereby affecting the magnetic flux distribution and realizing an increase in the leakage inductance.

[0020] In view of this, an embodiment of the present disclosure provides a power supply device, including a substrate; a plurality of power chips disposed in a first area on the surface of the substrate; and a plurality of output inductors disposed in a second area on the surface of the substrate, wherein each of the plurality of power chips is electrically connected to an output inductor, the output inductor includes a primary side inductor and a secondary side inductor, a first magnetic core and a second magnetic core are respectively disposed around the primary side inductor and the secondary side inductor, the outer surfaces of the first magnetic core and the second magnetic core are disposed opposite to each other with a predetermined gap, and both are formed into adaptively shaped serrations.

[0021] Figure 2 Schematically shows a top view structural diagram of the power supply device according to an embodiment of the present disclosure.

[0022] As Figure 2 shown, the power supply device 200 includes a substrate 210, a plurality of power chips 220, and a plurality of output inductors 230.

[0023] A plurality of power chips 220 are disposed in a first area on the surface of the substrate 210; a plurality of output inductors 230 are disposed in a second area on the surface of the substrate 210, wherein each of the plurality of power chips 220 is electrically connected to an output inductor 230, the output inductor 230 includes a primary side inductor and a secondary side inductor, a first magnetic core and a second magnetic core are respectively disposed around the primary side inductor and the secondary side inductor, the outer surfaces of the first magnetic core and the second magnetic core are disposed opposite to each other with a predetermined gap, and both are formed into adaptively shaped serrations.

[0024] According to an embodiment of the present disclosure, the substrate 210 may be a printed circuit board (PCB), and the plurality of power chips 220 and the plurality of output inductors 230 may be integrated on the substrate 210.

[0025] According to an embodiment of the present disclosure, the predetermined gap between the outer surface of the first magnetic core and the outer surface of the second magnetic core may be set as needed, for example, it may be 1 mm, 2 mm, etc. The predetermined gap between the outer surface of the first magnetic core and the outer surface of the second magnetic core causes a gap to exist between the first magnetic core and the second magnetic core, for example, it may be an air gap.

[0026] Figure 3A Schematically shows a cross-sectional view of an output inductor.

[0027] Figure 3B Schematically shows a cross-sectional view of the output inductor according to an embodiment of the present disclosure.

[0028] As Figure 3A shown, the shape of the gap between the two magnetic cores of the output inductor in an example is rectangular, while Figure 3B shown, the gap between the first magnetic core and the second magnetic core of the output inductor according to the embodiment of the present disclosure is serrated.

[0029] According to an embodiment of the present disclosure, in the output inductor 230, there is a gap between the first magnetic core and the second magnetic core, which can reduce the magnetic permeability of the output inductor 230, making the inductance value of the output inductor 230 more stable.

[0030] According to an embodiment of the present disclosure, the gap between the first magnetic core and the second magnetic core is set to be serrated. Compared with the rectangular gap, the length of the gap of the output inductor in the embodiment of the present disclosure is significantly extended, and the gap area also increases accordingly, which can increase the inductance value of the output inductor, and further increase the leakage inductance of the output inductor.

[0031] It should be noted that Figure 2 the number of power supply chips and output inductors in [description] is only for illustration, and other numbers of power supply chips and output inductors can also be set according to needs, and the present disclosure does not make any limitations here.

[0032] According to an embodiment of the present disclosure, by finely adjusting the gap between the first magnetic core and the second magnetic core in the output inductor, the leakage inductance of the output inductor is increased, so that the energy storage function of the energy storage inductor can be realized by using the output inductor, replacing the energy storage inductor, reducing the wiring difficulty of the power supply device, and improving the integration degree of the power supply device. In addition, since the components in the power supply device are reduced, the volume of the power supply device can also be reduced, and the cost of the power supply device can be reduced. Moreover, since the changes to the first magnetic core and the second magnetic core are small, the design of the output inductor can be reused to the greatest extent.

[0033] Figure 4A Schematically shows an equivalent circuit diagram of a power supply device according to an embodiment of the present disclosure.

[0034] Figure 4B Schematically shows an actual circuit diagram of a power supply device according to an embodiment of the present disclosure.

[0035] Such as Figure 4A and Figure 4BAs shown, taking a power supply device for a three-phase parallel Trans-Inductor Voltage Regulator (TLVR) as an example, VIN on the left is the input voltage, and VOUT on the right is the output voltage. The input terminals of power supply chips C41, C42, and C43 are connected to the input voltage VIN. The output terminal of power supply chip C41 is electrically connected to output inductor Lm41, the output terminal of power supply chip C42 is electrically connected to output inductor Lm42, and the output terminal of power supply chip C43 is electrically connected to output inductor Lm43. The outer surfaces of the first magnetic cores of output inductors Lm41, Lm42, and Lm43 are disposed opposite to the outer surfaces of the second magnetic cores with a predetermined gap, and are all formed into adaptively serrated shapes. Therefore, the leakage inductances of output inductors Lm41, Lm42, and Lm43 increase, which is equivalent to connecting a small inductor in series on the secondary side of each output inductor, thus forming unique circuit characteristics. It can be understood that Figure 4A and Figure 4B the numbers of power supply chips and output inductors in

[0036] are only for illustration. According to actual needs, other numbers of power supply chips and output inductors can also be set. Among them, equivalent inductor Lc41 is the leakage inductance equivalent inductor of output inductor Lm41, equivalent inductor Lc42 is the leakage inductance equivalent inductor of output inductor Lm42, and equivalent inductor Lc43 is the leakage inductance equivalent inductor of output inductor Lm43. Equivalent inductors Lc41, Lc42, and Lc43 undertake specific filtering and energy storage functions in the circuit. Equivalent inductors Lc41, Lc42, and Lc43 are connected in series and work together. Under the combined action of equivalent inductors Lc41, Lc42, and Lc43, they successfully replace energy storage inductor Lc. This innovative design not only optimizes the circuit performance, but also reduces the number of components, the cost of the power supply device, and the circuit complexity.

[0037] Figure 5 A layout diagram showing the power supply device of an embodiment of the present disclosure supplying power to a processor is schematically illustrated.

[0038] As Figure 5 shown, by removing energy storage inductor Lc, the occupied area of components in the power supply device on the substrate is effectively reduced, enabling the power supply chips and output inductors to move closer to the CPU side. Compared with Figure 1BThe layout of the power supply device shown. In Fig. 5, the overall power supply transposition moves further to the right, getting closer to the CPU. The dimension L2 from the CPU in Fig. 5 is reduced compared to L1. Since the power supply device is closer to the CPU, the power transmission path is shortened, reducing the energy loss during transmission, thereby improving the overall power conversion efficiency. This layout optimization enables the power supply device to respond more quickly to the load changes of the CPU, enhancing the dynamic performance of the system, and also bringing obvious advantages to the optimization of the number of output capacitors. Therefore, this change not only optimizes the circuit layout but also brings a significant performance improvement to the power supply device. It should be noted that Figure 5 The number of power chips and output inductors in [it] is only for illustration, and other numbers of power chips and output inductors can also be set according to needs. The device being powered can also be other types of processors, such as GPUs, and the present disclosure does not make any limitations here.

[0039] According to an embodiment of the present disclosure, compared with Figure 1A and Figure 1B the power supply device shown, the power supply device of the embodiment of the present disclosure reduces the energy storage inductor Lc, thereby simplifying the hardware circuit of the power supply device, making the layout of the power supply device more compact and efficient. At the same time, it also improves the reliability and stability of the power supply device, bringing better performance and higher design flexibility to the power supply device.

[0040] According to an embodiment of the present disclosure, the primary side inductor and the secondary side inductor are configured to mutually induce and generate electric energy and leakage inductance via the first magnetic core and the second magnetic core under the current control from the power chip, so as to output electric energy to the load and store the leakage inductance.

[0041] According to an embodiment of the present disclosure, multiple power chips can be respectively electrically connected to a primary side inductor. The power chip can be connected to the input voltage, obtain electric energy from the input voltage according to the input instruction, and convert it into current to be transmitted to the primary side inductor. Under the current control from the power chip, the primary side inductor and the secondary side inductor mutually induce via the first magnetic core and the second magnetic core. Since the gap between the first magnetic core and the second magnetic core is serrated, electric energy and a relatively large leakage inductance will be generated. The electric energy is output as the output voltage to the load, while the leakage inductance cannot be transmitted to the primary side inductor. Therefore, the leakage inductance can be stored in the secondary side inductor.

[0042] According to an embodiment of the present disclosure, the primary side inductor and the secondary side inductor are also used to generate auxiliary electric energy and output it to the load by using the leakage inductance when the output power of the power supply device outputting electric energy to the load cannot meet the electric energy demand of the load.

[0043] According to an embodiment of the present disclosure, in the case where the power of the load changes rapidly, more electrical energy is required to support the power change of the load, while the output power of the power supply device for outputting electrical energy to the load is usually constant. Therefore, the leakage inductance can be utilized to generate auxiliary electrical energy and output it to the load, increasing the output electrical energy of the power supply device, thereby enhancing the output power of the power supply device.

[0044] The power supply device may further include: a heat dissipation unit disposed on the power supply chip, and the orthographic projection of the heat dissipation unit relative to the substrate covers the orthographic projections of a plurality of power supply chips relative to the substrate.

[0045] According to an embodiment of the present disclosure, the heat dissipation unit is located above the plurality of power supply chips in the vertical direction to dissipate heat from the power supply chips, preventing the power supply chips from overheating and causing performance degradation. The heat dissipation unit may include a plurality of heat dissipation fins that extend vertically upward, increasing the heat dissipation area of the heat dissipation unit, thereby enhancing the heat dissipation effect of the heat dissipation unit.

[0046] Figure 6 Schematically shows a schematic diagram of the leakage magnetic phenomenon of the output inductor according to an embodiment of the present disclosure.

[0047] As Figure 6 shown, as the leakage inductance of the output inductor increases, the interference to the surrounding components will also increase accordingly, especially the power supply chip closest to the output inductor. The leakage magnetic phenomenon generated by the gap of the output inductor will directly cover the area of the power supply chip. Specifically, the leakage magnetic field of the output inductor will generate an additional magnetic field around the power supply chip, and these magnetic fields may be coupled to the pins or internal circuits of the power supply chip, resulting in signal distortion or increased noise inside the chip. This will not only affect the performance of the power supply chip, but may also cause problems such as mis-triggering or malfunction, thereby interfering with the normal operation of the power supply chip and may also cause a series of electromagnetic compatibility problems, affecting the stability and reliability of the power supply device.

[0048] Figure 7A Schematically shows a partial side view structural diagram of a power supply transposition.

[0049] Figure 7B Schematically shows a partial side view structural diagram of the power supply transposition according to an embodiment of the present disclosure.

[0050] By comparing Figure 7A and Figure 7B it can be seen that in Figure 7A , there is no effective isolation measure between the power supply chip and the output inductor, resulting in the leakage magnetic field generated by the output inductor being easily directly affected by the power supply chip, thereby causing electromagnetic interference problems, affecting the normal operation of the power supply chip, and even possibly causing system instability. Figure 7BIn the embodiments of the present disclosure shown, a metal partition is provided between multiple power chips and multiple output inductors. The metal partition is fixedly connected to the heat dissipation unit, forming an effective magnetic field shielding area to block the leakage magnetic field generated by the output inductor and prevent it from spreading to the power chip area, thereby further reducing the interference of the leakage magnetic field on the power chip.

[0051] In addition, the metal partition increases the volume of the heat dissipation unit to a certain extent and can further improve the heat dissipation effect of the heat dissipation unit.

[0052] Therefore, by adding a metal partition between the power chip and the output inductor, the heat dissipation unit of the embodiments of the present disclosure not only effectively avoids the interference of the leakage magnetic field on the power chip, but also improves the heat dissipation performance and stability of the power supply device, providing a strong guarantee for the reliable operation of the power supply device.

[0053] According to an embodiment of the present disclosure, the heat dissipation unit can be fixedly connected to the substrate through a metal connecting member. The metal connecting member has good heat dissipation performance and can further improve the heat dissipation performance of the heat dissipation unit.

[0054] According to an embodiment of the present disclosure, the metal connecting member is disposed in a third area on the surface of the substrate. The third area is closer to the edge of the substrate than the first area and the second area, and the metal connecting member is electrically connected to the grounding end of the substrate.

[0055] According to an embodiment of the present disclosure, the third area can be the edge position of the substrate, which does not affect the arrangement of the power chip and the output inductor. Since the metal connecting member is also near the output inductor, the metal connecting member is also within the range of the leakage magnetic field of the output inductor. Electrically connecting the metal connecting member to the grounding end of the substrate can effectively conduct the magnetic field noise to the grounding end. Through grounding, a diversion channel for the magnetic field noise can be formed, so that the magnetic field noise that might otherwise interfere with the power chip is guided to the grounding end, thereby reducing the interference of the magnetic field noise on the power chip and ensuring the stable operation of the power chip.

[0056] According to an embodiment of the present disclosure, the metal connecting member includes a mating male connecting member and female connecting member. The male connecting member passes through the substrate via a via hole formed in the heat dissipation unit and is connected to the female connecting member.

[0057] According to an embodiment of the present disclosure, the male connecting member can be a metal bolt, and the female connecting member can be a metal nut. The method of fixing the heat dissipation unit by the mating male connecting member and female connecting member makes the fixing of the heat dissipation unit more convenient.

[0058] According to an embodiment of the present disclosure, the height of the female connecting member in the vertical direction is higher than the height of the power chip in the vertical direction.

[0059] According to an embodiment of the present disclosure, the female connector can be fixed to the base plate via external threads. The female connector is slightly higher than the power chip. This prevents the power chip from being crushed, regardless of the pressure from the heat sink. The female connector will preferentially bear the pressure from the heat sink and evenly release the pressure to the base plate, thereby protecting the power chip from damage.

[0060] Figure 8A The figure schematically shows a front structural diagram of a power supply device.

[0061] Figure 8B The figure schematically shows a front structural diagram of a power supply device according to an embodiment of the present disclosure.

[0062] Figure 8A The front view of a power supply device is shown, in which the heat dissipation unit is fixed on both sides with plastic screws. The plastic screws are stuck in the base plate through chamfers. This fixing method seems simple, but it is extremely inconvenient during the actual disassembly process. Due to the material properties of the plastic screws, tools need to be used to reduce the chamfers during disassembly, which not only increases the difficulty of disassembly, but may also cause damage to the plastic screws or uneven force on the base plate, thereby affecting the stability and reliability of the entire heat dissipation system of the power supply device. Therefore, Figure 8A There are obvious deficiencies in the fixing method of the heat dissipation unit of the power supply device.

[0063] In order to improve the heat dissipation stability of the power supply device, the heat dissipation unit proposed in the embodiment of the present disclosure is as follows: Figure 8B As shown, a power chip and a heat sink are mounted on a substrate. The heat sink is secured to the substrate via male and female connectors. The male connectors extend through vias formed in the heat sink and connect to the female connectors. Thermal paste can also be applied between the power chip and the heat sink.

[0064] According to an embodiment of the present disclosure, Figure 8B The heat dissipation unit in the system features an improved fixing method, now using metal connectors. The female connector can be pre-installed in the baseplate. The heat dissipation unit can be provided with vias corresponding to the female connector's fixing position. The male connector can be threaded on the outside, securely engaging the female connector. This fixing method is not only more stable but also easier to disassemble, improving the maintainability and reusability of the heat dissipation unit.

[0065] According to the embodiment of the present disclosure, compared with Figure 8A The plastic screw positioning method of the heat dissipation unit and the metal connector fixing method in the disclosed embodiment can effectively conduct electricity and transmit magnetic field noise. Furthermore, the metal connector uses separate male and female connectors for fixing, making disassembly safer and more reliable. Furthermore, the metal connector has better thermal conductivity than plastic screws, facilitating rapid heat conduction and dissipation.

[0066] Moreover, grounding treatment is carried out at the positioning position of the metal connector, which can effectively conduct the magnetic field noise to the grounding end. By grounding, a diversion channel for the magnetic field noise can be formed, so that the magnetic field noise that might otherwise interfere with the power supply chip is guided to the grounding end, thereby reducing the interference of the magnetic field noise on the power supply chip and ensuring the stable operation of the power supply chip.

[0067] Furthermore, the female connector is slightly higher than the power supply chip, so that no matter how much pressure the heat dissipation unit exerts, the risk of the power supply chip being crushed can be avoided. The female connector will bear the pressure from the heat dissipation unit first and evenly release the pressure to the substrate, thereby protecting the power supply chip from damage.

[0068] Figure 9 A block diagram of an electronic device according to an embodiment of the present disclosure is schematically shown.

[0069] As Figure 9 shown, the electronic device 900 includes a power supply device 910.

[0070] According to an embodiment of the present disclosure, the power supply device 910 may refer to the description in other embodiments of the present disclosure.

[0071] The power supply device provided by the embodiment of the present disclosure breaks through the limitations of traditional thinking, utilizes the leakage inductance of the TLVR inductor, which was originally regarded as an adverse factor. By precisely controlling and increasing the magnitude of the leakage inductance, an output inductor with a serrated gap is designed, enabling it to store and release the leakage inductance to achieve the function of an energy storage inductor. This is an expansion of the application of the leakage inductance of the inductor, abandoning the design of matching a secondary energy storage inductor in the power supply device based on the TLVR inductor, and directly using the leakage inductance of the TLVR inductor to replace the energy storage inductor, reducing the number of components in the power supply device and making the circuit structure of the power supply device more concise. This design reduces the wiring difficulty and the probability of faults occurring in the power supply device, improves the circuit reliability and stability of the power supply device, and provides an effective solution for the optimization of the power supply device.

[0072] In addition, the embodiment of the present disclosure also proposes a heat dissipation unit, adding a metal partition connected to the heat dissipation unit between the power supply chip and the output inductor, effectively avoiding the influence of the leakage magnetic field of the output inductor on the power supply chip. This design reduces the interference of the leakage magnetic field on the power supply chip through physical isolation, improves the electromagnetic compatibility of the power supply device, and provides a strong guarantee for the stable operation of the power supply chip.

[0073] Those skilled in the art will appreciate that the features described in the various embodiments of the present disclosure can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in the present disclosure. In particular, without departing from the spirit and teachings of the present disclosure, the features described in the various embodiments of the present disclosure can be combined and / or combined in various ways. All such combinations and / or combinations fall within the scope of the present disclosure.

[0074] The embodiments of the present disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Although the embodiments have been described separately above, this does not mean that the measures in the respective embodiments cannot be used advantageously in combination. Without departing from the scope of the present disclosure, those skilled in the art can make various substitutions and modifications, and all such substitutions and modifications should fall within the scope of the present disclosure.

Claims

1. A power supply device, characterized in that, The power supply device includes: a substrate; a plurality of power chips disposed in a first area on the surface of the substrate; and a plurality of output inductors disposed in a second area on the surface of the substrate, wherein each of the plurality of power chips is electrically connected to one of the output inductors, and each output inductor includes a primary-side inductor and a secondary-side inductor. A first magnetic core and a second magnetic core are respectively disposed around the primary-side inductor and the secondary-side inductor. The outer surface of the first magnetic core and the outer surface of the second magnetic core are disposed opposite to each other with a predetermined gap and are both formed into a serrated shape that matches each other.

2. The power supply device according to claim 1, wherein The primary-side inductor and the secondary-side inductor are configured to mutually induce and generate electric energy and leakage inductance via the first magnetic core and the second magnetic core under the control of a current from the power chip, so as to output the electric energy to a load and store the leakage inductance.

3. The power supply device according to claim 2, characterized in that, The primary-side inductor and the secondary-side inductor are further configured to generate auxiliary electric energy by using the leakage inductance and output it to the load when the output power of the power supply device for outputting the electric energy to the load cannot meet the electric energy demand of the load.

4. The power supply device according to claim 1, characterized in that, The power supply device further includes: a heat dissipation unit disposed above the power chip, and a positive projection of the heat dissipation unit on the substrate covers positive projections of the plurality of power chips on the substrate.

5. The power supply device according to claim 4, wherein A metal partition is disposed between the plurality of power chips and the plurality of output inductors, and the metal partition is fixedly connected to the heat dissipation unit.

6. The power supply device according to claim 5, characterized in that The heat dissipation unit is fixedly connected to the substrate through a metal connecting member.

7. The power supply device according to claim 6, wherein The metal connecting member is disposed in a third area on the surface of the substrate. The third area is closer to the edge of the substrate than the first area and the second area, and the metal connecting member is electrically connected to the ground terminal of the substrate.

8. The power supply device according to any one of claims 5 to 7, characterized in that The metal connecting member includes a mating male connecting member and female connecting member. The male connecting member passes through the substrate via a via hole formed in the heat dissipation unit and is connected to the female connecting member.

9. The power supply device according to claim 8, characterized in that, The height of the female connecting member in the vertical direction is higher than the height of the power chip in the vertical direction.

10. An electronic device, characterized in that, including: the power supply device according to any one of claims 1 to 9.

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