Wafer feeding device and operation method

Abstract

The invention discloses a wafer feeding device and an operation method, and particularly relates to the technical field of wafer feeding, the wafer feeding device comprises an equipment main body, a mechanical arm, a manipulator and an adjusting device, the end face of the manipulator is provided with a plurality of suction cup groups, each suction cup group comprises a plurality of suction cups, and the adjusting device comprises an adjusting part arranged in the manipulator; a plurality of adjusting units are arranged in the adjusting part, each adjusting unit comprises at least two first through holes, every two adjacent first through holes jointly communicate with a first pipeline, an adjusting plate is arranged in each first pipeline, the adjusting units jointly communicate with a second pipeline, and an adjusting plate is arranged in the second pipeline. By adjusting the vacuum degree between each first through hole and the third pipeline, the suction force of each suction cup group and the suction cup to the wafer is the same, and the phenomenon that the wafer is warped or damaged due to the fact that the suction force of the suction cup to the wafer is not uniform is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer loading, and more specifically, to a wafer loading device and an operation method thereof. Background Art

[0002] As the base material for integrated circuits, silicon wafers have the characteristics of controllable resistivity, oxygen and carbon content. After the single crystal ingot undergoes processes such as wire cutting, grinding, polishing, and cleaning, silicon wafers with specific thickness, geometric parameters, and a clean surface are obtained. In this highly information-based era, mobile phones, computers, TVs, solar cells, etc. are everywhere, and the operation of these electrical appliances is inseparable from integrated circuits. Therefore, as the base material for integrated circuits, the importance of silicon wafers for the development of the information industry is obvious. When processing wafers, a manipulator is usually used to grip the wafers during the loading process. However, wafers are extremely fragile, and if the gripping force is too large, it will cause the edges of the wafers to crack or microcracks to appear on the surface.

[0003] Chinese Patent with Application No. 202110844195.8 discloses a wafer loading and unloading manipulator, including a lifting mechanism, a rotating mechanism, and a gripping mechanism. The lifting mechanism is installed on one side of the rotating mechanism to drive the rotating mechanism to lift in the vertical direction. At least one of the gripping mechanisms is installed on the side of the rotating mechanism away from the lifting mechanism, and all or part of the gripping mechanisms adsorb the wafers. The wafers are transferred by driving the wafers to rotate through the rotating mechanism. Through the setting of the control component, it is realized that the wafers always remain in the horizontal direction during the transfer process, so that the wafers are transferred smoothly; the suction heads on the gripping mechanism can be adjusted, so that the gripping mechanism can adapt to the transfer of wafers of different specifications and sizes. However, when the invention uses vacuum adsorption to grip the wafers, if the adsorption forces of multiple suction heads on the wafers are uneven, it is easy to cause the wafers to warp. At the same time, during the rotation of the wafers, an additional picking and placing process is added, reducing the efficiency of wafer loading and unloading.

[0004] However, in the prior art, during the process of the suction cup on the manipulator adsorbing the wafers, due to the influence of the air flow velocity, the adsorption forces of the suction cup on different positions of the wafers may be different. When the manipulator adsorbs the wafers, stress concentration is likely to occur, resulting in wafer warping. At the same time, during the rotation of the manipulator, the wafers also rotate accordingly. Affected by the reverse air flow during the rotation of the wafers, the clamping forces at different positions will also change accordingly. This will cause the forces received by the clamped parts of the wafers to be uneven, which may lead to wafer slip, eccentricity, or even dropping. Therefore, the present invention proposes a wafer loading device and an operation method to solve the above problems. Summary of the Invention

[0005] In order to overcome the above-mentioned defects of the prior art, embodiments of the present invention provide a wafer loading device and an operation method to solve the problems raised in the above background art.

[0006] To achieve the above object, the present invention provides the following technical solutions: a wafer loading device and an operation method, including: a device main body, a robotic arm, a manipulator, and an adjusting device. A plurality of suction cup groups are arranged on the end face of the manipulator. Each suction cup group includes a plurality of suction cups, and each suction cup is internally provided with an air hole; the adjusting device includes an adjusting member arranged inside the manipulator. A plurality of adjusting units are arranged inside the adjusting member. Each adjusting unit includes at least two first through holes. Each adjacent two first through holes are commonly communicated with a first pipeline. An adjusting plate is arranged inside each first pipeline. The plurality of adjusting units are commonly communicated with a second pipeline, and an adjusting plate is arranged inside the second pipeline.

[0007] Preferably, each adjusting unit further includes a pressure regulating cavity. One end of the pressure regulating cavity is communicated with a plurality of first through holes. A sliding member is slidably connected inside the pressure regulating cavity. An elastic member is arranged inside the pressure regulating cavity. One end of the elastic member is fixedly connected to the sliding member, and the other end of the elastic member is fixedly connected to the side wall of the pressure regulating cavity. A first adjusting portion is fixedly connected to one end of the pressure regulating cavity close to the elastic member.

[0008] Preferably, one end of the pressure regulating cavity is fixedly connected to a third pipeline. A second through hole is opened at one end of the adjusting member away from the first through hole. Each third pipeline is commonly communicated with the second through hole. Each third pipeline is communicated with the corresponding pressure regulating cavity. Each third pipeline is respectively communicated with both ends of the second pipeline.

[0009] Preferably, limit switches are respectively arranged at both ends of the first pipeline. A plurality of sliding grooves are fixedly connected to one end of each pressure regulating cavity away from the first through hole. A sealing member is slidably connected inside each sliding groove. A second adjusting portion is fixedly connected to the inner bottom of each sliding groove. The second adjusting portion is electrically connected to the limit switch.

[0010] Preferably, the plurality of suction cup groups are symmetrically distributed on both sides of the manipulator. The air holes inside each suction cup are respectively communicated with the corresponding first through holes through flexible air pipes.

[0011] Preferably, an air cylinder is fixedly connected to one end of the manipulator away from the suction cup group. The second through hole is communicated with one end of the air cylinder. A third through hole is opened on the side wall of the air cylinder. A vacuum pump is arranged inside the device main body. The third through hole is communicated with the vacuum pump through a flexible air pipe.

[0012] Preferably, a motor is arranged inside the robotic arm. The output end of the motor is fixedly connected to one end of the air cylinder away from the second through hole.

[0013] Preferably, there are two robotic arms and two manipulators. A main shaft is arranged inside the device main body. The two robotic arms are commonly rotatably connected to the main shaft.

[0014] Preferably, a control system is provided inside the device body. The control system can control the vertical movement and rotation of the main shaft, the rotation of the robotic arm, and the rotation of the motor.

[0015] An operating method of a wafer loading device includes the following steps: S1. Control the robotic arm and the manipulator to move below the wafer through the control system of the device body; S2. Control the main shaft to move upward through the control system of the device body so that the manipulator contacts the wafer; S3. Start the vacuum pump so that the suction cup group adsorbs the wafer; S4. When the suction force of the suction cups within the same suction cup group is inconsistent due to inconsistent gas flow rates, the first pipe regulating plate moves towards the first through hole with a faster flow rate to balance the vacuum degrees of the suction cups; S5. When the suction forces between multiple suction cup groups on the wafer are inconsistent, the second pipe internal regulating plate moves towards the third pipe with a faster flow rate to balance the vacuum degrees of the suction cup groups; S6. When the regulating plate of the first pipe moves to any limit switch, the seal seals the corresponding first through hole; S7. When the robotic arm rotates, the sliding member inside the pressure regulating chamber away from the device body slides to increase the vacuum degree of the corresponding suction cup group.

[0016] The technical effects and advantages of the present invention: 1. By moving the first pipe internal regulating plate and the second pipe internal regulating plate of the present invention, the vacuum degrees between the respective first through holes and the third pipe are adjusted, so that the suction forces of the respective suction cup groups and the suction cups on the wafer are the same, preventing the phenomenon of wafer warping or damage caused by uneven suction force of the suction cups on the wafer.

[0017] 2. By sealing the first through hole with the seal of the present invention, when the suction forces between the suction cups are uneven, the suction force of one of the suction cups is too large, causing the wafer to warp and be damaged during the adsorption process. At the same time, the vacuum degree of the suction cup with a smaller suction force is further increased to balance the suction force of the suction cups.

[0018] 3. By moving the sliding member inside the pressure regulating chamber of the present invention, the suction force of the suction cup group on the side away from the device body during rotation is increased, preventing the wafer from sliding, shifting, or even falling due to insufficient suction force during rotation. Description of the Drawings

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0020] Figure 2 This is a cross-sectional view of the structure at the manipulator of the present invention.

[0021] Figure 3 This is a schematic diagram of the structure of the manipulator of the present invention.

[0022] Figure 4 This is a cross-sectional view of the structure of the adjusting device of the present invention.

[0023] Figure 5 This is the Figure 4 schematic enlarged view of the structure of part A of the present invention.

[0024] Figure 6 This is a cross-sectional view of the structure of the adjusting member of the present invention.

[0025] The reference numerals are: 1, equipment main body; 11, main shaft; 2, robotic arm; 21, motor; 3, manipulator; 31, suction cup group; 311, suction cup; 32, air hole; 33, air cylinder; 331, third through hole; 4, adjusting device; 41, adjusting member; 42, adjusting unit; 43, first through hole; 44, first pipeline; 441, limit switch; 45, adjusting plate; 46, second pipeline; 47, pressure regulating chamber; 471, sliding member; 472, elastic member; 473, first adjusting portion; 474, chute; 475, sealing member; 476, second adjusting portion; 48, third pipeline; 49, second through hole. Detailed implementation manners

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] Embodiment 1 During the actual production process, due to the influence of the air flow velocity, the adsorption force of the suction cup 311 on different positions of the wafer may be different, and the manipulator is prone to stress concentration when adsorbing the wafer, resulting in the phenomenon of wafer warping. To solve the above problems, this embodiment is specifically invented.

[0028] Please refer to Figures 1 to 6As shown in the figure, a wafer loading device and an operation method according to an embodiment of the present invention include a device main body 1, a robotic arm 2, a manipulator 3, and an adjusting device 4. A plurality of suction cup groups 31 are arranged on the end face of the manipulator 3. Each suction cup group 31 includes a plurality of suction cups 311, and an air hole 32 is arranged inside each suction cup 311; The adjusting device 4 includes an adjusting member 41 arranged inside the manipulator 3. A plurality of adjusting units 42 are arranged inside the adjusting member 41. Each adjusting unit 42 includes at least two first through holes 43. Each adjacent two first through holes 43 are jointly communicated with a first pipeline 44. An adjusting plate 45 is arranged inside each first pipeline 44. The plurality of adjusting units 42 are jointly communicated with a second pipeline 46, and an adjusting plate 45 is arranged inside the second pipeline 46.

[0029] Please refer to Figure 4 and Figure 5 As shown in the figure, each adjusting unit 42 further includes a pressure regulating cavity 47. One end of the pressure regulating cavity 47 is communicated with a plurality of first through holes 43. A sliding member 471 is slidably connected inside the pressure regulating cavity 47. An elastic member 472 is arranged inside the pressure regulating cavity 47. One end of the elastic member 472 is fixedly connected to the sliding member 471, and the other end of the elastic member 472 is fixedly connected to the side wall of the pressure regulating cavity 47. A first adjusting portion 473 is fixedly connected to one end of the pressure regulating cavity 47 close to the elastic member 472; Specifically, the first adjusting portion 473 can adopt an electromagnetic member. After the first adjusting portion 473 is energized, the sliding member 471 can be made to move in the direction of the first adjusting portion 473.

[0030] Please refer to Figure 4 and Figure 6 As shown in the figure, one end of the pressure regulating cavity 47 is fixedly connected to a third pipeline 48. A second through hole 49 is opened at one end of the adjusting member 41 away from the first through hole 43. Each third pipeline 48 is jointly communicated with the second through hole 49. Each third pipeline 48 is communicated with the corresponding pressure regulating cavity 47. Each third pipeline 48 is respectively communicated with both ends of the second pipeline 46.

[0031] Please refer to Figure 5 As shown in the figure, limit switches 441 are respectively arranged at both ends of the first pipeline 44. A plurality of sliding grooves 474 are fixedly connected to one end of each pressure regulating cavity 47 away from the first through hole 43. A sealing member 475 is slidably connected inside each sliding groove 474. A second adjusting portion 476 is fixedly connected to the inner bottom of each sliding groove 474. The second adjusting portion 476 is electrically connected to the limit switch 441. Specifically, the second adjusting portion 476 can adopt an electromagnetic member. After the second adjusting portion 476 is energized, the corresponding second adjusting portion 476 can be energized, so that the sealing member 475 is pushed after being repelled.

[0032] Please refer to Figure 2 and Figure 3As shown, multiple suction cup groups 31 are symmetrically distributed on both sides of the manipulator 3. The air holes 32 inside each suction cup 311 are respectively connected to the corresponding first through holes 43 through flexible hoses. The flexible hoses are prior art and will not be elaborated here.

[0033] Please refer to Figure 2 As shown, a cylinder 33 is fixedly connected to one end of the manipulator 3 away from the suction cup group 31. The second through hole 49 is connected to one end of the cylinder 33. A third through hole 331 is provided on the side wall of the cylinder 33. A vacuum pump is provided inside the equipment main body 1. The third through hole 331 is connected to the vacuum pump through a flexible hose. A motor 21 is provided inside the robotic arm 2. The output end of the motor 21 is fixedly connected to the end of the cylinder 33 away from the second through hole 49.

[0034] Please refer to Figure 1 As shown, there are two robotic arms 2 and two manipulators 3. A main shaft 11 is provided inside the equipment main body 1. The two robotic arms 2 are jointly connected to the main shaft 11 for transmission. A control system is provided inside the equipment main body 1. The control system can control the vertical movement and rotation of the main shaft 11, can control the rotation of the robotic arm 2, and can control the rotation of the motor 21. The control system includes a driving unit for driving the movement of the robotic arm 2 and the main shaft 11 and a control unit for controlling the start and stop of the driving unit and the motor 21. This control system is prior art and will not be elaborated here.

[0035] During use, the control system of the device main body 1 controls the rapid positioning of the robotic arm 2, the main shaft 11, and the manipulator 3. After the manipulator 3 moves below the wafer, the control system of the device main body 1 controls the main shaft 11 to move upward so that the suction cup group 31 on the manipulator 3 contacts the wafer. Then, the vacuum pump is started to pump out the gas through the air holes 32, so that a negative pressure is generated between each suction cup 311 inside the suction cup group 31 and the wafer, thereby adsorbing the wafer. When the gas flow rates between the suction cups 311 are inconsistent during the adsorption process of the suction cup 311, resulting in inconsistent vacuum degrees and uneven adsorption forces, the gas enters the inside of the first through hole 43 through the air hole 32 and the flexible hose. When the flow rates of two adjacent first through holes 43 are inconsistent, the pressure of the first through hole 43 with a faster flow rate is smaller, so that a negative pressure is generated at the position of the first pipe 44 close to the first through hole 43 with a faster flow rate, causing the regulating plate 45 to move towards the first through hole 43 with a faster flow rate, thereby increasing the vacuum degree of the first through hole 43 with a slower flow rate. By moving the regulating plate 45 inside the first pipe 44, the vacuum degrees between the first through holes 43 are adjusted, so as to balance the adsorption forces of each suction cup 311 inside the same suction cup group 31. Similarly, when the gas flows through the first through hole 43 and the pressure regulating cavity 47 to the third pipe 48, when the pressure difference caused by the inconsistent flow rates of the two third pipes 48 occurs, the regulating plate 45 inside the second pipe 46 moves towards the third pipe 48 with a faster flow rate, thereby increasing the vacuum degree at the position of the third pipe 48 with a slower flow rate, so as to balance the adsorption forces of each suction cup group 31. By moving the regulating plate 45 inside the first pipe 44 and the regulating plate 45 inside the second pipe 46, the vacuum degrees between the first through holes 43 and the third pipes 48 are adjusted, so that the adsorption forces of each suction cup group 31 and the suction cup 311 on the wafer are the same, preventing the phenomenon of wafer warping or damage caused by uneven adsorption forces of the suction cup 311 on the wafer.

[0036] Embodiment 2 In actual use, it is found that during the adsorption process of the wafer, when the adsorption force of one of the suction cups 311 is too large, the wafer will be warped and damaged during the adsorption process. Based on the above embodiment, further improvements are made.

[0037] Based on the above embodiments, during use, when the air flow rates of two adjacent first through-holes 43 are inconsistent, the adjusting plate 45 moves towards the first through-hole 43 with a faster flow rate. When the adjusting plate 45 moves to contact the limit switch 441, by touching the limit switch 441 with the adjusting plate 45, the corresponding second adjusting part 476 is electrified, so that the seal 475 is subjected to a repulsive force, and thus the seal 475 moves towards the first through-hole 43 with a faster flow rate, so that the seal 475 seals the first through-hole 43 with a faster flow rate. At this time, gas is no longer extracted from the first through-hole 43 with a faster flow rate, thereby preventing the wafer from warping and being damaged during the adsorption process when the adsorption force of one of the suction cups 311 is too large. At the same time, the vacuum degree of the first through-hole 43 with a slower flow rate is further increased to balance the adsorption force of the suction cup 311.

[0038] Embodiment Three During actual use, it is found that during the flipping process of the manipulator, the wafer also flips accordingly. The wafer is affected by the reverse air flow during the rotation process, which will cause the force received by the adsorbed part of the wafer to be uneven, and may cause the wafer to slip eccentrically or even fall. Further improvements are made based on the above embodiments.

[0039] Based on the above embodiments, during use, when the wafer needs to be flipped, the motor 21 is started through the control system of the equipment main body 1. The air cylinder 33 is driven by the motor 21 to rotate, so that the manipulator 3 rotates, and thus the wafer rotates in reverse. During the rotation of the manipulator 3, one side of the suction cup group 31 gradually moves away from the equipment main body 1 as it rotates. The first adjusting part 473 inside the pressure regulating cavity 47 corresponding to the suction cup group 31 on this side is electrified through the control system inside the equipment main body 1, so that the sliding part 471 moves towards the first adjusting part 473. While the elastic part 472 is compressed, a negative pressure is generated inside the pressure regulating cavity 47, so that the adsorption force of the suction cup 311 inside the suction cup group 31 on this side on the wafer increases. When the motor 21 stops rotating, at this time the first adjusting part 473 is powered off, so that the adsorption forces of the suction cup groups 31 on both sides of the manipulator 3 are restored to balance again. By moving the sliding part 471 inside the pressure regulating cavity 47, the adsorption force of the suction cup group 31 on the side away from the equipment main body 1 during rotation on the wafer is increased, preventing the wafer from sliding and shifting or even falling due to insufficient adsorption force during rotation.

[0040] Embodiment Four Based on the above embodiments, this embodiment also provides an operation method for a wafer loading device, including the following specific steps: S1. Control the robotic arm 2 and the manipulator 3 to move below the wafer through the control system of the equipment main body 1.

[0041] S2. Control the main shaft 11 of the equipment body 1 to move upward through the control system of the equipment body 1 so that the manipulator 3 contacts the wafer.

[0042] S3. Start the vacuum pump so that the suction cup group 31 adsorbs the wafer.

[0043] S4. When the suction force of the suction cups 311 inside the same suction cup group 31 is inconsistent due to inconsistent gas flow rates, the regulating plate 45 of the first pipeline 44 moves towards the first through hole 43 with a faster flow rate to balance the vacuum degrees of the suction cups 311.

[0044] S5. When the adsorption forces of multiple suction cup groups 31 on the wafer are inconsistent, the regulating plate 45 inside the second pipeline 46 moves towards the third pipeline 48 with a faster flow rate to balance the vacuum degrees of the suction cup groups 31.

[0045] S6. When the regulating plate 45 of the first pipeline 44 moves to any limit switch 441, the seal 475 seals the corresponding first through hole 43.

[0046] S7. When the manipulator 3 rotates, the sliding member 471 inside the pressure regulating chamber 47 away from the equipment body 1 slides to increase the vacuum degree of the corresponding suction cup group 31.

[0047] As described above, it is only the preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent replacements or changes, and should be covered within the protection scope of the present invention.

Claims

1. A wafer loading device, comprising a device main body (1) and a robotic arm (2), characterized in that, It further includes: A manipulator (3), on the end face of the manipulator (3), a plurality of suction cup groups (31) are provided, each suction cup group (31) includes a plurality of suction cups (311), and an air hole (32) is arranged inside each suction cup (311); An adjusting device (4), the adjusting device (4) includes an adjusting member (41) arranged inside the manipulator (3), a plurality of adjusting units (42) are arranged inside the adjusting member (41), each adjusting unit (42) includes at least two first through holes (43), and a first pipe (44) is commonly connected between every two adjacent first through holes (43), an adjusting plate (45) is arranged inside each first pipe (44), a second pipe (46) is commonly connected by a plurality of adjusting units (42), and an adjusting plate (45) is arranged inside the second pipe (46).

2. The wafer loading device according to claim 1, wherein: Each adjusting unit (42) further includes a pressure regulating cavity (47), one end of the pressure regulating cavity (47) is connected to a plurality of first through holes (43), a sliding member (471) is slidably connected inside the pressure regulating cavity (47), an elastic member (472) is arranged inside the pressure regulating cavity (47), one end of the elastic member (472) is fixedly connected to the sliding member (471), the other end of the elastic member (472) is fixedly connected to the side wall of the pressure regulating cavity (47), and a first adjusting portion (473) is fixedly connected to one end of the pressure regulating cavity (47) close to the elastic member (472).

3. The wafer loading device according to claim 2, wherein: One end of the pressure regulating cavity (47) is fixedly connected to a third pipe (48), a second through hole (49) is opened at one end of the adjusting member (41) away from the first through hole (43), each third pipe (48) is commonly connected to the second through hole (49), each third pipe (48) is connected to the corresponding pressure regulating cavity (47), and each third pipe (48) is respectively connected to both ends of the second pipe (46).

4. The wafer loading device according to claim 3, wherein: Limit switches (441) are respectively arranged at both ends of the first pipe (44), a plurality of chutes (474) are fixedly connected to one end of each pressure regulating cavity (47) away from the first through hole (43), a sealing member (475) is slidably connected inside each chute (474), and a second adjusting portion (476) is fixedly connected to the inner bottom of each chute (474), and the second adjusting portion (476) is electrically connected to the limit switch (441).

5. The wafer loading device according to claim 4, wherein: A plurality of suction cup groups (31) are symmetrically distributed on both sides of the manipulator (3), and the air holes (32) inside each suction cup (311) are respectively connected to the corresponding first through holes (43) through flexible air pipes.

6. The wafer loading device according to claim 5, wherein: One end of the manipulator (3) away from the suction cup group (31) is fixedly connected to an air cylinder (33), the second through hole (49) is connected to one end of the air cylinder (33), a third through hole (331) is opened on the side wall of the air cylinder (33), a vacuum pump is arranged inside the equipment main body (1), and the third through hole (331) is connected to the vacuum pump through a flexible air pipe.

7. The wafer loading device according to claim 6, characterized in that: Inside the robotic arm (2), there is a motor (21), and the output end of the motor (21) is fixedly connected to one end of the air cylinder (33) away from the second through hole (49).

8. The wafer loading device according to claim 7, characterized in that: There are two robotic arms (2) and two manipulators (3). Inside the equipment main body (1), there is a main shaft (11), and the two robotic arms (2) are jointly rotatably connected to the main shaft (11).

9. The wafer loading device according to claim 8, characterized in that: Inside the equipment main body (1), there is a control system. The control system can control the vertical movement and rotation of the main shaft (11), can control the rotation of the robotic arm (2), and can control the rotation of the motor (21).

10. An operating method of a wafer loading device, using the wafer loading device described in claim 9, characterized in that, It includes the following steps: S1. Control the robotic arm (2) and the manipulator (3) to move below the wafer through the control system of the equipment main body (1). S2. Control the main shaft (11) to move upward through the control system of the equipment main body (1) so that the manipulator (3) contacts the wafer. S3. Start the vacuum pump so that the suction cup group (31) adsorbs the wafer. S4. When the suction force of the suction cups (311) inside the same suction cup group (31) is inconsistent due to inconsistent gas flow rates, the regulating plate (45) of the first pipeline (44) moves towards the first through hole (43) with a faster flow rate to balance the vacuum degrees of the suction cups (311). S5. When the adsorption forces between multiple suction cup groups (31) on the wafer are inconsistent, the regulating plate (45) inside the second pipeline (46) moves towards the third pipeline (48) with a faster flow rate to balance the vacuum degrees of the suction cup groups (31). S6. When the regulating plate (45) of the first pipeline (44) moves to any limit switch (441), the seal (475) seals the corresponding first through hole (43). S7. When the manipulator (3) rotates, the slider (471) inside the pressure regulating chamber (47) away from the equipment main body (1) slides to increase the vacuum degree of the corresponding suction cup group (31).

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