Wafer loading device and method of operation

Abstract

The application discloses a wafer loading device and an operating method, and particularly relates to the technical field of wafer loading, which comprises a device main body, a mechanical arm, a mechanical hand and an adjusting device. The end surface of the mechanical hand is provided with a plurality of suction disc groups. Each suction disc group comprises a plurality of suction discs. The adjusting device comprises an adjusting part arranged in the interior of the mechanical hand. The adjusting part is internally provided with a plurality of adjusting units. Each adjusting unit comprises at least two first through holes. Each adjacent two first through holes are commonly communicated with a first pipeline. Each first pipeline is internally provided with an adjusting plate. The plurality of adjusting units are commonly communicated with a second pipeline. The second pipeline is internally provided with an adjusting plate. The application adjusts the vacuum degree between each first through hole and the third pipeline, so that the suction force of each suction disc group and suction disc on the wafer is the same, and the phenomenon of wafer warping or damage caused by uneven suction force of the suction disc on the wafer is prevented.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer feeding, and more particularly to a wafer feeding device and operation method. BACKGROUND

[0002] As the base material of integrated circuits, silicon wafers have the characteristics of controllable resistivity and oxygen-carbon content. Single crystal ingots are subjected to processes such as wire cutting, grinding, polishing, and cleaning to obtain silicon wafers with specific thickness and geometric parameters and clean surfaces. In this highly information-based era, mobile phones, computers, televisions, and solar cells are ubiquitous. The operation of these electrical appliances cannot be separated from integrated circuits. Therefore, as the base material of integrated circuits, the importance of silicon wafers to the development of the information industry is self-evident. During wafer processing, a robot is usually used to hold the wafer during feeding. However, wafers are extremely fragile, and if the holding force is too large, it may cause the edge of the wafer to crack or the surface to crack.

[0003] A wafer feeding and discharging robot is disclosed in Chinese Patent No. 202110844195.8, which includes a lifting mechanism, a rotating mechanism, and a grabbing mechanism. The lifting mechanism is installed on one side of the rotating mechanism to drive the rotating mechanism to lift along the vertical direction. At least one grabbing mechanism is installed on the side of the rotating mechanism away from the lifting mechanism. All or part of the grabbing mechanisms adsorb wafers, and the wafers are rotated by the rotating mechanism to achieve transmission. By controlling the setting of the assembly, the wafer is always kept in the horizontal direction during transmission, allowing the wafer to be transmitted smoothly. The suction head on the grabbing mechanism can be adjusted to allow the grabbing mechanism to adapt to the transmission of wafers of different sizes. However, when the invention uses vacuum adsorption to grab the wafer, if the adsorption force of multiple suction heads on the wafer is uneven, it may cause the wafer to warp. Additionally, during the rotation of the wafer, an additional picking and placing process is added, reducing the efficiency of wafer feeding and discharging.

[0004] However, in the prior art, during the process of adsorbing the wafer by the suction cup on the robot, the suction force of the suction cup on different positions of the wafer may be different due to the influence of air flow speed, and stress concentration may occur when the robot adsorbs the wafer, causing the wafer to warp. Meanwhile, during the rotation of the robot, the wafer also rotates, and the clamping force at different positions of the wafer changes due to the influence of the reverse air flow during rotation. This may cause the force on the clamped part of the wafer to be uneven, possibly causing the wafer to slip off-center or even fall. Therefore, the present application proposes a wafer feeding device and operation method to solve the above problems. SUMMARY

[0005] To overcome the above-mentioned defects of the prior art, the embodiments of the present application provide a wafer feeding device and operation method to solve the problems raised in the background art.

[0006] To achieve the above object, the application provides the following technical scheme: a wafer loading device and an operating method, comprising: a device main body, a mechanical arm, a mechanical hand and an adjusting device, a plurality of suction cup groups are arranged on the end face of the mechanical hand, each of the suction cup groups comprises a plurality of suction cups, and each of the suction cups is internally provided with an air hole; the adjusting device comprises an adjusting part arranged in the mechanical hand, the adjusting part is internally provided with a plurality of adjusting units, each of the adjusting units comprises at least two first through holes, each adjacent two first through holes are commonly connected with a first pipeline, each of the first pipelines is internally provided with an adjusting plate, a plurality of the adjusting units are commonly connected with a second pipeline, and the second pipeline is internally provided with an adjusting plate.

[0007] Preferably, each of the adjusting units further comprises a pressure regulating cavity, one end of the pressure regulating cavity is connected with the plurality of first through holes, a sliding part is slidably connected in the pressure regulating cavity, an elastic part is arranged in the pressure regulating cavity, one end of the elastic part is fixedly connected with the sliding part, the other end of the elastic part is fixedly connected with the side wall of the pressure regulating cavity, and a first adjusting part is fixedly connected to the end of the pressure regulating cavity close to the elastic part.

[0008] Preferably, one end of the pressure regulating cavity is fixedly connected with a third pipeline, a second through hole is arranged at the end of the adjusting part away from the first through hole, each of the third pipelines is commonly connected with the second through hole, each of the third pipelines is connected with the corresponding pressure regulating cavity, and each of the third pipelines is connected with the two ends of the second pipeline respectively.

[0009] Preferably, the two ends of the first pipeline are respectively provided with limit switches, one end of each of the pressure regulating cavities is fixedly connected with a plurality of sliding grooves, each of the sliding grooves is slidably connected with a sealing part, the inner bottom of each of the sliding grooves is fixedly connected with a second adjusting part, and the second adjusting part is electrically connected with the limit switch.

[0010] Preferably, a plurality of the suction cup groups are symmetrically distributed on the two sides of the mechanical hand, and the air holes in each of the suction cups are respectively connected with the corresponding first through holes through a soft air pipe.

[0011] Preferably, one end of the mechanical hand away from the suction cup group is fixedly connected with an air cylinder, the second through hole is connected with one end of the air cylinder, a third through hole is arranged in the side wall of the air cylinder, the device main body is internally provided with a vacuum pump, and the third through hole is connected with the vacuum pump through a soft air pipe.

[0012] Preferably, the mechanical arm is internally provided with a motor, and the output end of the motor is fixedly connected with the end of the air cylinder away from the second through hole.

[0013] Preferably, the mechanical arm and the mechanical hand are both two, the device main body is internally provided with a main shaft, and the two mechanical arms are commonly connected with the main shaft in rotation.

[0014] Preferably, the device body is internally provided with a control system capable of controlling the vertical movement and rotation of the main shaft, the rotation of the mechanical arm, and the rotation of the motor.

[0015] The operation method of the wafer loading device comprises the following steps:

[0016] S1. Controlling the mechanical arm and the mechanical hand to move below the wafer through the control system of the device body;

[0017] S2. Controlling the main shaft to move upward to make the mechanical hand contact the wafer through the control system of the device body;

[0018] S3. Starting the vacuum pump to make the chuck group adsorb the wafer;

[0019] S4. When the adsorption force of the wafer by the chucks in the same chuck group is inconsistent due to the inconsistent gas flow rate, the first duct adjusting plate moves to the direction of the first through hole with a faster flow rate to balance the vacuum degree of each chuck;

[0020] S5. When the adsorption force of the wafer by the chucks in different chuck groups is inconsistent, the second duct internal adjusting plate moves to the direction of the third duct with a faster flow rate to balance the vacuum degree of each chuck group;

[0021] S6. When the adjusting plate of the first duct moves to any limit switch, the sealing element seals the corresponding first through hole;

[0022] S7. When the mechanical hand rotates, the sliding element in the pressure regulating cavity away from the device body slides to increase the vacuum degree of the corresponding chuck group.

[0023] The technical effects and advantages of the present application are as follows:

[0024] 1. The present application adjusts the vacuum degree between each first through hole and the third duct through the movement of the first duct internal adjusting plate and the second duct internal adjusting plate, so that the adsorption force of each chuck group and the chucks on the wafer is uniform, preventing the wafer from warping or being damaged due to the uneven adsorption force of the chucks.

[0025] 2. The present application seals the first through hole through the sealing element, preventing one of the chucks from having too much adsorption force when the adsorption force between the chucks is uneven, causing the wafer to warp and be damaged during the adsorption process, and further increasing the vacuum degree of the chucks with less adsorption force to balance the adsorption force of the chucks.

[0026] 3. The present application increases the adsorption force of the chuck set on the side far from the device body during rotation by moving the sliding member inside the pressure regulating cavity, thereby preventing the wafer from sliding, deviating or even falling due to insufficient adsorption force during rotation. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the present application.

[0028] Figure 2 It is a structure sectional view of the mechanical hand of the present application.

[0029] Figure 3 It is a schematic diagram of the mechanical hand structure of the present application.

[0030] Figure 4 It is a structure sectional view of the adjusting device of the present application.

[0031] Figure 5 It is an enlarged schematic diagram of the A part of the present application. Figure 4

[0032] Figure 6 It is a structure sectional view of the adjusting member of the present application.

[0033] The reference signs are: 1, device body; 11, main shaft; 2, mechanical arm; 21, motor; 3, mechanical hand; 31, chuck set; 311, chuck; 32, air hole; 33, air cylinder; 331, third through hole; 4, adjusting device; 41, adjusting member; 42, adjusting unit; 43, first through hole; 44, first pipeline; 441, limit switch; 45, adjusting plate; 46, second pipeline; 47, pressure regulating cavity; 471, sliding member; 472, elastic member; 473, first adjusting part; 474, sliding groove; 475, sealing member; 476, second adjusting part; 48, third pipeline; 49, second through hole. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0035] Embodiment one

[0036] In actual production process, the adsorption force of the chuck 311 on different positions of the wafer may be different due to the influence of air flow speed, and the mechanical hand is prone to stress concentration when adsorbing the wafer, resulting in wafer warping. In order to solve the above problems, this embodiment is invented.

[0037] Please refer to​Figures 1 to 6 As shown in the drawings, the wafer feeding device and the operating method of one embodiment of the present application include a device main body 1, a mechanical arm 2, a mechanical hand 3, and an adjusting device 4. The end face of the mechanical hand 3 is provided with a plurality of suction cup groups 31. Each suction cup group 31 includes a plurality of suction cups 311. Each suction cup 311 is internally provided with an air hole 32. The adjusting device 4 includes an adjusting part 41 arranged in the interior of the mechanical hand 3. The adjusting part 41 is internally provided with a plurality of adjusting units 42. Each adjusting unit 42 includes at least two first through holes 43. Each adjacent two first through holes 43 are commonly connected with a first pipeline 44. Each first pipeline 44 is internally provided with an adjusting plate 45. The plurality of adjusting units 42 are commonly connected with a second pipeline 46. The second pipeline 46 is internally provided with an adjusting plate 45.

[0038] As shown in the drawings, Figure 4 and Figure 5 Each adjusting unit 42 further includes a pressure regulating cavity 47. One end of the pressure regulating cavity 47 is connected with the plurality of first through holes 43. The pressure regulating cavity 47 is internally slidably connected with a sliding part 471. The pressure regulating cavity 47 is internally provided with an elastic part 472. One end of the elastic part 472 is fixedly connected with the sliding part 471. The other end of the elastic part 472 is fixedly connected with the side wall of the pressure regulating cavity 47. The pressure regulating cavity 47 is fixedly connected with a first adjusting part 473 at the end close to the elastic part 472. Specifically, the first adjusting part 473 can be an electromagnetic part. When the first adjusting part 473 is powered, the sliding part 471 can be moved towards the first adjusting part 473.

[0039] As shown in the drawings, Figure 4 and Figure 6 One end of the pressure regulating cavity 47 is fixedly connected with a third pipeline 48. The end of the adjusting part 41 away from the first through hole 43 is provided with a second through hole 49. Each third pipeline 48 is commonly connected with the second through hole 49. Each third pipeline 48 is connected with the corresponding pressure regulating cavity 47. Each third pipeline 48 is respectively connected with both ends of the second pipeline 46.

[0040] As shown in the drawings, Figure 5 Both ends of the first pipeline 44 are respectively provided with a limit switch 441. Each pressure regulating cavity 47 is fixedly connected with a plurality of sliding grooves 474 at the end away from the first through hole 43. Each sliding groove 474 is internally slidably connected with a sealing part 475. The inner bottom of each sliding groove 474 is fixedly connected with a second adjusting part 476. The second adjusting part 476 is electrically connected with the limit switch 441. Specifically, the second adjusting part 476 can be an electromagnetic part. When the second adjusting part 476 is powered, the corresponding second adjusting part 476 is powered, so that the sealing part 475 is pushed by the repulsive force.

[0041] As shown in the drawings, Figure 2 and Figure 3As shown, the plurality of suction cup groups 31 are symmetrically distributed on both sides of the manipulator 3, and the air holes 32 in each suction cup 311 are respectively connected to the corresponding first through holes 43 through flexible air pipes. The flexible air pipes are prior art and will not be described here.

[0042] As shown in Figure 2 As shown, the end of the manipulator 3 away from the suction cup group 31 is fixedly connected with an air cylinder 33, the second through hole 49 is connected to one end of the air cylinder 33, the side wall of the air cylinder 33 is provided with a third through hole 331, a vacuum pump is arranged in the equipment body 1, the third through hole 331 is connected to the vacuum pump through a flexible air pipe, a motor 21 is arranged in the mechanical arm 2, and the output end of the motor 21 is fixedly connected to the end of the air cylinder 33 away from the second through hole 49.

[0043] As shown in Figure 1 As shown, the mechanical arm 2 and the manipulator 3 are both two, a main shaft 11 is arranged in the equipment body 1, the two mechanical arms 2 are jointly connected to the main shaft 11 in transmission, a control system is arranged in the equipment body 1, the control system can control the vertical movement and rotation of the main shaft 11, the control system can control the rotation of the mechanical arm 2, and the control system can control the rotation of the motor 21. The control system includes a driving unit for driving the movement of the mechanical arm 2 and the main shaft 11 and a control unit for controlling the driving unit and the start and stop of the motor 21. The control system is prior art and will not be described here.

[0044] In use, the mechanical arm 2, the main shaft 11 and the mechanical hand 3 are quickly positioned by the control system of the device body 1, so that the mechanical hand 3 moves to the lower side of the wafer, the main shaft 11 is controlled by the control system of the device body 1 to move upward so that the suction disc group 31 on the mechanical hand 3 contacts the wafer, the vacuum pump is started to make the gas be extracted through the air holes 32, so that the negative pressure is generated between each suction disc 311 inside the suction disc group 31 and the wafer, thereby the wafer is adsorbed, when the gas flow rates of each suction disc 311 are inconsistent, the vacuum degree is inconsistent, thereby the adsorption force is uneven, the gas enters the first through hole 43 inside through the soft air pipe through the air holes 32, when the flow rates of two adjacent first through holes 43 are inconsistent, the pressure of the first through hole 43 with a fast flow rate is small, thereby the negative pressure is generated at the position of the first pipe 44 close to the first through hole 43 with a fast flow rate, thereby the adjusting plate 45 moves to the direction of the first through hole 43 with a fast flow rate, thereby the vacuum degree of the first through hole 43 with a slow flow rate is increased, the vacuum degrees between each first through hole 43 are adjusted by the movement of the adjusting plate 45 inside the first pipe 44, thereby the adsorption forces of each suction disc 311 inside the same suction disc group 31 are balanced, similarly, when the gas flows to the third pipe 48 through the first through hole 43 and the pressure regulating cavity 47, when the pressure difference is caused by the inconsistent flow rates of two third pipes 48, the adjusting plate 45 inside the second pipe 46 moves to the direction of the third pipe 48 with a faster flow rate, thereby the vacuum degree of the third pipe 48 with a slower flow rate is increased, thereby the adsorption forces of each suction disc group 31 are balanced, the vacuum degrees between each first through hole 43 and the third pipe 48 are adjusted by the movement of the adjusting plate 45 inside the first pipe 44 and the adjusting plate 45 inside the second pipe 46, thereby the adsorption forces of each suction disc group 31 and the suction disc 311 to the wafer are the same, thereby the phenomenon of wafer warping or damage caused by the uneven adsorption force of the suction disc 311 to the wafer is prevented.

[0045] Embodiment two

[0046] In actual use, it is found that when the adsorption of the wafer is in progress, if the adsorption force of one of the suction discs 311 is too large, the wafer will be warped and damaged in the adsorption process, and further improvement is made on the basis of the above embodiment.

[0047] On the basis of the above-mentioned embodiments, in use, when the air flow rates of two adjacent first through holes 43 are inconsistent, the adjusting plate 45 moves in the direction of the first through hole 43 with a faster flow rate. When the adjusting plate 45 moves to contact the limit switch 441, the corresponding second adjusting part 476 is energized, so that the sealing part 475 is subjected to a repulsive force, and the sealing part 475 moves in the direction of the first through hole 43 with a faster flow rate, so that the sealing part 475 seals the first through hole 43 with a faster flow rate. At this time, the gas is no longer extracted from the first through hole 43 with a faster flow rate, thereby preventing the wafer from being warped and damaged during adsorption when the adsorption force of one of the suction cups 311 is too large, and further increasing the vacuum degree of the first through hole 43 with a slower flow rate to balance the adsorption force of the suction cup 311.

[0048] Embodiment three

[0049] In actual use, it is found that the wafer is also turned over during the turning over of the mechanical hand, and the wafer is affected by the reverse airflow during rotation, which causes the force on the wafer adsorption part to be uneven, which may cause the wafer to slip eccentrically or even fall. On the basis of the above-mentioned embodiments, further improvements are made.

[0050] On the basis of the above-mentioned embodiments, in use, when the wafer needs to be turned over, the control system of the device main body 1 starts the motor 21, and the motor 21 drives the air cylinder 33 to rotate, so that the mechanical hand 3 rotates, thereby turning over the wafer. During the rotation of the mechanical hand 3, the suction cup group 31 on one side gradually moves away from the device main body 1. The control system in the device main body 1 energizes the first adjusting part 473 in the pressure regulating cavity 47 corresponding to the suction cup group 31 on this side, so that the sliding part 471 moves in the direction of the first adjusting part 473, thereby compressing the elastic part 472 and generating negative pressure in the pressure regulating cavity 47, so that the adsorption force of the suction cup 311 in the suction cup group 31 on this side to the wafer increases. When the motor 21 stops rotating, the adsorption force of the suction cup groups 31 on both sides of the mechanical hand 3 is balanced again by de-energizing the first adjusting part 473, and the adsorption force of the suction cup group 31 on the side away from the device main body 1 during rotation is increased by moving the sliding part 471 in the pressure regulating cavity 47, thereby preventing the wafer from slipping or even falling due to insufficient adsorption force during rotation.

[0051] Embodiment four

[0052] On the basis of the above-mentioned embodiments, the present embodiment also provides an operation method of a wafer loading device, which includes the following specific steps:

[0053] S1. Control the movement of the mechanical arm 2 and the mechanical hand 3 to below the wafer by the control system of the device main body 1.

[0054] S2. The spindle 11 is controlled to move upward by the control system of the equipment body 1, so that the mechanical hand 3 contacts the wafer.

[0055] S3. The vacuum pump is started to enable the chuck set 31 to adsorb the wafer.

[0056] S4. When the adsorption force of the chuck 311 in the same chuck set 31 to the wafer is inconsistent due to the inconsistent gas flow rate, the adjusting plate 45 in the first pipeline 44 moves to the direction of the first through hole 43 with faster flow rate, so as to balance the vacuum degree of each chuck 311.

[0057] S5. When the adsorption force of the chuck set 31 to the wafer is inconsistent, the adjusting plate 45 in the second pipeline 46 moves to the direction of the third pipeline 48 with faster flow rate, so as to balance the vacuum degree of each chuck set 31.

[0058] S6. When the adjusting plate 45 in the first pipeline 44 moves to any limit switch 441, the sealing piece 475 seals the corresponding first through hole 43.

[0059] S7. When the mechanical hand 3 rotates, the sliding piece 471 in the pressure regulating cavity 47 away from the equipment body 1 slides to increase the vacuum degree of the corresponding chuck set 31.

[0060] The above is only the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacement or change according to the technical solution and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A wafer loading device comprising a device body (1) and a robot arm (2), characterized in that, Also include: Mechanical hand (3), the end face of the mechanical hand (3) is provided with a plurality of suction cup groups (31), each of the suction cup groups (31) comprises a plurality of suction cups (311), and each of the suction cups (311) is internally provided with an air hole (32); Adjusting device (4), the adjusting device (4) comprises an adjusting part (41) arranged in the interior of the mechanical hand (3), the adjusting part (41) is internally provided with a plurality of adjusting units (42), each of the adjusting units (42) comprises at least two first through holes (43), and each of the first through holes (43) is in communication with a first pipeline (44) in common with every two adjacent first through holes (43), each of the first pipelines (44) is internally provided with an adjusting plate (45), and the plurality of adjusting units (42) are in communication with a second pipeline (46) in common, and the second pipeline (46) is internally provided with an adjusting plate (45); Each of the adjusting units (42) further comprises a pressure regulating cavity (47), one end of the pressure regulating cavity (47) is in communication with the plurality of first through holes (43), the pressure regulating cavity (47) is internally and slidably connected with a sliding part (471), the pressure regulating cavity (47) is internally provided with an elastic part (472), one end of the elastic part (472) is fixedly connected with the sliding part (471), the other end of the elastic part (472) is fixedly connected with the side wall of the pressure regulating cavity (47), and the pressure regulating cavity (47) is fixedly connected with a first adjusting part (473) at one end close to the elastic part (472). The two ends of the first pipeline (44) are respectively provided with limit switches (441), one end of each of the pressure regulating cavities (47) away from the first through holes (43) is fixedly connected with a plurality of sliding grooves (474), each of the sliding grooves (474) is internally and slidably connected with a sealing part (475), and the inner bottom of each of the sliding grooves (474) is fixedly connected with a second adjusting part (476), and the second adjusting part (476) is in electrical signal connection with the limit switch (441).

2. The wafer loading device according to claim 1, wherein: One end of the pressure regulating cavity (47) is fixedly connected with a third pipeline (48), the adjusting part (41) is provided with a second through hole (49) at one end away from the first through hole (43), each of the third pipelines (48) is in communication with the second through hole (49) in common, each of the third pipelines (48) is in communication with the corresponding pressure regulating cavity (47), and each of the third pipelines (48) is in communication with the two ends of the second pipeline (46) respectively.

3. The wafer loading device of claim 2, wherein: The plurality of suction cup groups (31) are symmetrically distributed on the two sides of the mechanical hand (3), and the air holes (32) in each of the suction cups (311) are in communication with the corresponding first through holes (43) through soft air pipes respectively.

4. The wafer loading device of claim 3, wherein: One end of the second through hole (49) is in communication with the air cylinder (33), the side wall of the air cylinder (33) is provided with a third through hole (331), the interior of the equipment main body (1) is provided with a vacuum pump, and the third through hole (331) is in communication with the vacuum pump through a soft air pipe.

5. The on-wafer feeding device according to claim 4, wherein: The mechanical arm (2) is internally provided with a motor (21), and an output end of the motor (21) is fixedly connected with one end of the air cylinder (33) away from the second through hole (49).

6. The on-wafer feeding device according to claim 5, wherein: The mechanical arm (2) and the mechanical hand (3) are both two, and the equipment main body (1) is internally provided with a main shaft (11), and the two mechanical arms (2) are jointly rotationally connected with the main shaft (11).

7. The on-wafer feeding device according to claim 6, wherein: The equipment main body (1) is internally provided with a control system, the control system can control vertical movement and rotation of the main shaft (11), the control system can control rotation of the mechanical arm (2), and the control system can control rotation of the motor (21).

8. An operation method of a wafer feeding device, using the wafer feeding device according to claim 7, characterized by, The method comprises the following steps: S1. moving the mechanical arm (2) and the mechanical hand (3) to below the wafer by the control system of the equipment main body (1); S2. moving the main shaft (11) upward to make the mechanical hand (3) contact the wafer by the control system of the equipment main body (1); S3. starting the vacuum pump to make the suction disc group (31) adsorb the wafer; S4. when the suction discs (311) in the same suction disc group (31) cause inconsistent adsorption force on the wafer due to inconsistent gas flow rates, the first pipeline (44) adjusts the plate (45) to move to the direction of the first through hole (43) with a faster flow rate, and balances the vacuum degree of each suction disc (311); S5. when the adsorption force of the multiple suction disc groups (31) on the wafer is inconsistent, the adjusting plate (45) in the second pipeline (46) moves to the direction of the third pipeline (48) with a faster flow rate, and the vacuum degree of each suction disc group (31) is balanced; S6. when the adjusting plate (45) of the first pipeline (44) moves to any limit switch (441), the sealing element (475) seals the corresponding first through hole (43); S7. when the mechanical hand (3) rotates, the sliding element (471) in the pressure regulating cavity (47) away from the equipment main body (1) slides to increase the vacuum degree of the corresponding suction disc group (31).

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