Compact intelligent power modules and electronic products

Abstract

The present invention provides a compact intelligent power module and electronic product, comprising a package housing, a lead frame, three driver chips, and three groups of half-bridge structures; the driver chips are arranged in sequence along a first side; the half-bridge structures are arranged in one-to-one correspondence with the driver chips, and the high-side and low-side power devices are spaced in sequence; the low-voltage pins and the high-voltage pins are respectively arranged on the first side and the second side, and meet creepage distance requirements; the first driver chip is led out through a first floating power pedestal arranged between the high-side and low-side power devices of the first group of half-bridge structures; the second driver chip is led out through a second floating power pedestal arranged between the first and second groups of half-bridge structures; and the third driver chip is led out through a third floating power pedestal arranged between the high-side and low-side power devices of the third group of half-bridge structures. The present invention meets the requirements for external pin arrangement, reduces chip design and tape-out complexity, and makes peripheral PCB wiring design more flexible and simple.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a compact intelligent power module and an electronic product. Background Art

[0002] The compact intelligent power module (CI-IPM) is an upgraded form factor of the traditional intelligent power module. Through highly integrated design, advanced packaging technology, and intelligent control, it significantly reduces size and weight while maintaining or even improving power handling capabilities. It is suitable for space-constrained applications with high efficiency and reliability requirements. For example, the size of a compact intelligent power module is 30 mm x 15 mm or less. Due to its small package size, compact intelligent power modules have difficulty meeting creepage distance requirements between high-voltage and low-voltage pins.

[0003] To meet the requirements of pin configuration, the power device arrangement sequence often needs to be specially designed. Accordingly, the three gate driver chips need to be designed into two structures with different functions and areas to meet the requirements of internal wiring and external pin arrangement. This design increases the variety of components in the product. The differences between different chips will also reduce the consistency of product parameters, increase the complexity of tape-out and packaging, and increase the number of materials in the packaging BOM (Bill of Materials), which brings difficulties to supply and production and increases management costs.

[0004] Therefore, how to realize a compact intelligent functional module with reasonable pin arrangement and meeting creepage distance requirements and heat dissipation requirements has become one of the problems that need to be solved urgently by those skilled in the art.

[0005] It should be noted that the above technical background is merely provided to provide a clear and complete description of the technical solutions of the present invention and to facilitate understanding by those skilled in the art. Simply because these solutions are described in the technical background section of the present invention, it should not be assumed that the above technical solutions are well known to those skilled in the art. Summary of the Invention

[0006] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a compact intelligent power module and electronic product to solve the problems in the prior art that the pin arrangement of the compact intelligent function module is unreasonable and does not meet the heat dissipation requirements.

[0007] To achieve the above-mentioned and other related objectives, the present invention provides a compact intelligent power module, which comprises at least:

[0008] A packaging shell, a first driver chip, a second driver chip, a third driver chip, a first group of half-bridge structures, a second group of half-bridge structures, and a third group of half-bridge structures arranged on a lead frame inside the packaging shell, each group of half-bridge structures including a high-side power device and a low-side power device;

[0009] Each driver chip is disposed on a side close to the first side of the package shell and is arranged in sequence along the first side; each half-bridge structure is disposed on a side close to the second side of the package shell and is arranged one-to-one with each driver chip, and the high-side power devices and low-side power devices in the three groups of half-bridge structures are spaced in sequence; the low-voltage pin and the high-voltage pin of the compact intelligent power module are respectively disposed on the first side and the second side and meet the creepage distance requirements; the first side and the second side are disposed opposite each other;

[0010] The floating power positive terminal of the first driver chip is led to the corresponding pin through a first floating power base island, which is arranged between the high-side power device and the low-side power device of the first group of half-bridge structures; the floating power positive terminal of the second driver chip is led to the corresponding pin through a second floating power base island, which is arranged between the high-side power device of the first group of half-bridge structures and the low-side power device of the second group of half-bridge structures; the floating power positive terminal of the third driver chip is led to the corresponding pin through a third floating power base island, which is arranged between the high-side power device and the low-side power device of the third group of half-bridge structures.

[0011] Optionally, the second floating power base island includes a coupled first part and a second part, the first part is arranged between the high-side power devices of the first group of half-bridge structures and the low-side power devices of the second group of half-bridge structures, and the second part is arranged between the second driver chip and the low-side power devices of the second group of half-bridge structures.

[0012] More optionally, the second part passes through the leads between the low-side power devices of the second group of half-bridge structures and the low-side drive signal output terminal and the reference ground of the second driver chip, and is electrically connected to the floating power supply positive terminal of the second driver chip through the end of the second part.

[0013] Optionally, the low-voltage pins of each driver chip and the DC negative pins of the first group of half-bridge structures are arranged on the first side of the package shell; the DC bus positive ends of each half-bridge structure are connected to the same DC positive pin, and the DC positive pin, the floating power supply positive pin of each driver chip, the output pins of each half-bridge structure, and the DC negative pins of the second group of half-bridge structures and the third group of half-bridge structures are arranged on the second side of the package shell;

[0014] The DC positive terminal pins are grouped as a group, the output pins of each half-bridge structure and the floating power supply positive terminal pin of the corresponding driver chip are grouped as a group, and the DC negative terminal pins of the second group of half-bridge structures and the third group of half-bridge structures are grouped as a group; the spacing between each group meets the high-voltage creepage distance requirements, and the spacing between the pins in the same group meets the low-voltage creepage distance requirements.

[0015] Optionally, the positive terminals of the power supplies of the first driver chip and the second driver chip are led to the same pin; or the positive terminals of the power supplies of the second driver chip and the third driver chip are led to the same pin.

[0016] Optionally, the lead frame further includes a common base island, a DC positive terminal base island, a DC negative terminal base island and three output base islands;

[0017] Each driver chip is arranged on the common foundation island, and the ground end of each driver chip is connected to the common foundation island through a lead wire and is led out to a corresponding pin;

[0018] Each high-side power device in the three groups of half-bridge structures is arranged on the DC positive end base island, and each low-side power device is arranged on the corresponding output base island. The DC positive end base island and each output base island are led to the corresponding pin;

[0019] The DC negative terminal base island is arranged between the common foundation island and the DC positive terminal base island. The DC negative end of the first group of half-bridge structures is connected to the DC negative terminal base island through a lead and is led out to the corresponding pin.

[0020] More optionally, the compact intelligent power module further includes a bootstrap diode disposed between the positive terminal of the power supply and the positive terminal of the floating power supply of each driver chip, and each bootstrap diode is integrated into the corresponding driver chip.

[0021] Optionally, each driver chip uses the same chip.

[0022] More optionally, each driver chip includes a driving unit, a fault output shutdown function unit, a temperature detection unit and an overcurrent detection unit.

[0023] More optionally, the output end of the fault output shutdown functional unit of each driver chip is connected to the same fault reporting / enable shutdown pin; the output end of the temperature detection unit of one driver chip is led to the corresponding pin; the input end of the overcurrent detection unit of one driver chip is led to the corresponding pin, and the input ends of the overcurrent detection units of the other two driver chips are grounded.

[0024] More optionally, each driver chip includes an overcurrent detection terminal, a temperature sensing output terminal, a first power supply positive terminal, a low-side drive signal input terminal, a high-side drive signal input terminal, a ground terminal, a second power supply positive terminal, a first fault signal output / enable shutdown control terminal, a low-side drive signal output terminal, a reference ground terminal, a floating power supply positive terminal, a high-side drive signal output terminal, a floating ground terminal and a second fault signal output / enable shutdown control terminal, which are arranged in clockwise order;

[0025] Among them, the overcurrent detection end, the temperature sensing output end, the first power supply positive end and the low-side drive signal input end are located at the first end of the driver chip; the high-side drive signal input end, the ground end, the second power supply positive end and the first fault signal output / enable shutdown control end are located at the second end of the driver chip; the low-side drive signal output end, the reference ground end, the floating power supply positive end, the high-side drive signal output end and the floating ground end are located at the third end of the driver chip; the second fault signal output / enable shutdown control end is located at the fourth end of the driver chip.

[0026] More optionally, the first side of the packaging shell includes a first U-phase DC negative terminal pin, a first common ground pin, a U-phase high-side drive signal input pin, a U-phase low-side drive signal input pin, a first power supply positive terminal pin, a V-phase high-side drive signal input pin, a V-phase low-side drive signal input pin, a temperature sensing output pin, an overcurrent detection pin, a fault reporting / enable shutdown pin, a W-phase high-side drive signal input pin, a W-phase low-side drive signal input pin, a second power supply positive terminal pin, a second common ground pin and a second U-phase DC negative terminal pin, which are arranged in sequence along the direction from the first driver chip to the third driver chip;

[0027] The second side of the packaging shell includes a DC positive terminal pin, a W-phase floating power supply positive terminal pin, a W-phase output pin, a W-phase DC negative terminal pin, a V-phase DC negative terminal pin, a V-phase output pin, a V-phase floating power supply positive terminal pin, a U-phase floating power supply positive terminal pin, and a U-phase output pin, which are arranged in sequence along the direction from the third group of half-bridge structures to the first group of half-bridge structures;

[0028] Among them, each pin is respectively arranged to correspond to a corresponding driver chip and a port of the half-bridge structure.

[0029] Optionally, a pair of screw mounting holes is further provided on the third side and / or the fourth side of the compact intelligent power module, and the third side is arranged opposite to the fourth side.

[0030] To achieve the above-mentioned object and other related objects, the present invention provides an electronic product, which at least includes the above-mentioned compact intelligent power module.

[0031] As described above, the compact intelligent power module and electronic product of the present invention have the following beneficial effects:

[0032] 1. The compact intelligent power module and electronic product of the present invention arrange six power devices in three half-bridge structures in a "high-low" interval order on a lead frame, and lead the floating power supply positive terminal (VB) of the driver chip to the high-voltage side pin through the base island. In this way, while meeting electrical connection requirements, the low-voltage and high-voltage working pins are arranged on both sides of the package shell, achieving high-low voltage isolation and improving the space utilization of the high-voltage side pin.

[0033] 2. The arrangement of the pins in the compact intelligent power module and electronic products of the present invention meets creepage distance requirements and complies with safety regulations.

[0034] 3. The compact intelligent power module and electronic products of the present invention rationally utilize pins, add functions such as overcurrent protection, fault report output, shutdown enable control, and overtemperature protection, and greatly improve the overall performance and reliability; further, the same driver chip is used, the product parameters are highly consistent, the complexity of wafer production and packaging is reduced, and there is no trouble in supply and production.

[0035] 4. In the compact intelligent power module and electronic product of the present invention, the positive terminals of the power supply of the two-phase driver chips are combined into one pin, which reduces the number of power supply pins and makes PCB wiring more flexible and simple.

[0036] 5. The compact intelligent power module and electronic product of the present invention integrates the bootstrap diode into the driver chip, which reduces packaging wire bonding, saves internal space, and further improves reliability.

[0037] 6. The compact intelligent power module and electronic product of the present invention have a compact structure and a small size, and are provided with screw mounting holes for fixing the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 Shown is a pin diagram of the compact intelligent power module of the present invention.

[0039] Figure 2 Shown is a schematic diagram of the circuit structure of the compact intelligent power module of the present invention.

[0040] Figure 3 Shown is a schematic diagram of the internal frame and wiring of the compact intelligent power module of the present invention.

[0041] Figure 4 Shown is a schematic diagram of the port definition and distribution of the driver chip of the present invention.

[0042] Component number description

[0043] 100-compact intelligent power module; 110-package shell; 11a-first floating power base island; 11b-second floating power base island; 11c-third floating power base island; 120-common ground base island; 130-DC positive terminal base island; 14a-first output base island; 14b-second output base island; 14c-third output base island; 150-DC negative terminal base island; 160-screw mounting hole. DETAILED DESCRIPTION

[0044] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0045] See also Figures 1 to 4 It should be noted that the diagrams provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Therefore, the diagrams only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0046] like Figures 1 to 4 As shown, the present invention provides a compact intelligent power module 100, which includes:

[0047] A packaging shell 110 , a lead frame (a plurality of base islands) disposed in the packaging shell 110 , and three driver chips and three half-bridge structures disposed on the lead frame.

[0048] like Figure 2 As shown, the driver chips are a first driver chip IC1 corresponding to U, a second driver chip IC2 corresponding to V, and a third driver chip IC3 corresponding to W, each driving a set of half-bridge structures. Each half-bridge structure includes a high-side power device and a low-side power device; the high-side power device corresponding to U is denoted as H1 and the low-side power device is denoted as L1; the high-side power device corresponding to V is denoted as H2 and the low-side power device is denoted as L2; ​​and the high-side power device corresponding to W is denoted as H3 and the low-side power device is denoted as L3. Each power device can be implemented using devices including but not limited to IGBTs, MOSFETs, etc., and will not be detailed here.

[0049] like Figures 1 to 3As shown, each driver chip is disposed near a first side of the package housing 110 and arranged sequentially along the first side. Each half-bridge structure is disposed near a second side of the package housing 110 and arranged one-to-one with each driver chip. The high-side power devices and low-side power devices in the three half-bridge structures are sequentially spaced. A floating power island is provided to lead the floating power positive terminal of the driver chip to the second side of the package housing 110, so that the low-voltage pin and high-voltage pin of the compact intelligent power module 100 are disposed on the first and second sides of the package housing 110, respectively, and creepage distance requirements are met. The first side and the second side are disposed opposite each other, and the first and second sides are the long sides of the package housing 110.

[0050] For example, Figure 3 As shown, in this embodiment, the first side of the package shell 110 is the left long side; in actual use, the direction of the first side is different depending on the placement direction, and is not limited to this embodiment. The first driver chip IC1, the second driver chip IC2, and the third driver chip IC3 are arranged on the left side of the package shell 110 and are arranged in sequence along the extension direction of the long side. The first group of half-bridge structures, the second group of half-bridge structures, and the third group of half-bridge structures are arranged on the right side of the package shell 110 and are arranged in sequence along the extension direction of the long side; that is, the high-side power device H1 and the low-side power device L1 are the first group of half-bridge structures, corresponding to the first driver chip IC1, and are located at the upper end of the right side of the package shell 110; the high-side power device H2 and the low-side power device L2 are the second group of half-bridge structures, corresponding to the second driver chip IC2, and are located below the first group of half-bridge structures; the high-side power device H3 and the low-side power device L3 are the third group of half-bridge structures, corresponding to the third driver chip IC3, and are located below the second group of half-bridge structures. Furthermore, the six power devices are arranged in a high-power-low-power order; that is, from top to bottom, they are arranged as low-side power device L1, high-side power device H1, low-side power device L2, high-side power device H2, low-side power device L3 and high-side power device H3, so as to facilitate wiring from the power devices to the driver chip.

[0051] More specifically, as an example, each driver chip uses the same chip (that is, the functions, ports, dimensions and other parameters of each driver chip are the same), and all include a driver unit, a fault output shutdown function unit, a temperature detection unit and an overcurrent detection unit; illustratively, each driver chip uses the same BOM (Bill of Materials). Each driver chip has undervoltage protection, overtemperature protection, and overcurrent protection functions to achieve shutdown protection in abnormal scenarios of the global module and prevent the power device from operating under abnormal conditions. Among them, the driver unit generates a high-side drive signal and a low-side drive signal corresponding to the half-bridge structure based on the high-side drive input signal and the low-side drive input signal provided externally; the temperature detection unit detects the working environment temperature of the preset position and generates a corresponding temperature detection signal; the overcurrent detection unit detects the current flowing through each group of half-bridge structures and generates a corresponding overcurrent detection signal; when overtemperature or overcurrent is detected, the fault output shutdown function unit triggers the protection state and reports the fault state to the outside through the corresponding port (SD / FO). The external controller can also give the port (SD / FO) a low-level signal to put the driver chip into a reset state and stop working. Figure 4As shown, in this embodiment, the port distribution and definition of the driver chip include, in clockwise order, an overcurrent detection terminal CSC, a temperature sensing output terminal VOT, a first power supply positive terminal VCC, a low-side drive signal input terminal INL, a high-side drive signal input terminal INH, a ground terminal GND, a second power supply positive terminal VCC, a first fault signal output / enable shutdown control terminal SD / FO, a low-side drive signal output terminal LO, a reference ground terminal VSesd, a floating power supply positive terminal VB, a high-side drive signal output terminal HO, a floating ground terminal VS, and a second fault signal output / enable shutdown control terminal SD / FO. Among them, the overcurrent detection terminal CSC, the temperature sensing output terminal VOT, the first power supply positive terminal VCC and the low-side drive signal input terminal INL are located at the first end of the driver chip; the high-side drive signal input terminal INH, the ground terminal GND, the second power supply positive terminal VCC and the first fault signal output / enable shutdown control terminal SD / FO are located at the second end of the driver chip; the low-side drive signal output terminal LO, the reference ground terminal VSesd, the floating power supply positive terminal VB, the high-side drive signal output terminal HO and the floating ground terminal VS are located at the third end of the driver chip; and the second fault signal output / enable shutdown control terminal SD / FO is located at the fourth end of the driver chip. Furthermore, the distance between the temperature sensing output terminal VOT and the first power supply positive terminal VCC, and the distance between the first power supply positive terminal VCC and the low-side drive signal input terminal INL are relatively large (greater than the distance between other adjacent ports on the same end), the distance between the first fault signal output / enable shutdown control terminal SD / FO and the low-side drive signal output terminal LO, and the distance between the low-side drive signal output terminal LO and the reference ground terminal VSesd are also relatively large (greater than the distance between other adjacent ports on the same end), to facilitate wiring.

[0052] Among them, the temperature detection function and the over-current detection function only need to be realized by one chip. In this case, the corresponding ports (VOT and CSC) on the driver chip that need to realize the temperature detection function and the over-current detection function are led out, and the corresponding ports on the driver chip that do not need to realize the temperature detection function and the over-current detection function can be left unleaded. Figure 2 As shown, in this embodiment, ports VOT and CSC of the second driver chip IC2 are connected to implement temperature detection and overcurrent detection functions. Port VOT of the first driver chip IC1 and the third driver chip IC3 is left floating, and port CSC is grounded. In actual use, the first driver chip IC1 or the third driver chip IC3 can also be used to implement the temperature detection and overcurrent detection functions. The temperature detection and overcurrent detection functions can also be performed by two driver chips respectively, which is not detailed here. As another example, each driver chip can also be configured as a different type of chip as needed, which is not detailed here.

[0053] More specifically, the compact intelligent power module 100 further includes a bootstrap diode disposed between the positive power supply terminal VCC and the floating power supply positive terminal VB of each driver chip. In one example, each bootstrap diode is integrated into the corresponding driver chip, thereby reducing internal package wiring, saving internal space, and improving reliability. In another example, each bootstrap diode is disposed within the package housing 110 and electrically connected to the corresponding driver chip via wires, which are not described in detail here.

[0054] like Figure 3 As shown, the floating power positive terminal VB of the first driver chip IC1 is connected to a first floating power pedestal 11a of the lead frame via a lead wire, and then leads to the U-phase floating power positive terminal pin VBU via the first floating power pedestal 11a. The first floating power pedestal 11a is located between the high-side power device H1 and the low-side power device L1 of the first half-bridge structure. The floating power positive terminal VB of the second driver chip IC2 is connected to a second floating power pedestal 11b of the lead frame via a lead wire, and then leads to the V-phase floating power positive terminal pin VBV via the second floating power pedestal 11b. The second floating power pedestal 11b is located between the first half-bridge structure and the second half-bridge structure. The floating power positive terminal VB of the third driver chip IC3 is connected to a third floating power pedestal 11c of the lead frame via a lead wire, and then leads to the W-phase floating power positive terminal pin VBW via the third floating power pedestal 11c. The third floating power pedestal 11c is located between the high-side power device H3 and the low-side power device L3 of the third half-bridge structure. By using floating power islands, the pins corresponding to the floating positive power terminals of each driver chip are positioned on the second side of the package housing 110. This improves space utilization on the second side while ensuring creepage distances. The placement of each floating power island also reduces the difficulty of internal wiring. Other ports of each driver chip and power device are connected to corresponding pins as needed.

[0055] Specifically, as an implementation method, the second floating power island 11b includes a coupled first part and a second part; wherein the first part is arranged between the high-side power device H1 of the first half-bridge structure and the low-side power device L2 of the second half-bridge structure, and the second part is arranged between the second driver chip IC2 and the low-side power device L2 of the second half-bridge structure, so as to facilitate wiring inside the package shell; it should be noted that the first part and the second part can be formed separately and then integrated together, or the two parts can be formed in one piece. Figure 3As shown, one end of the first portion extends to the V-phase floating power supply positive terminal pin VBV, and the other end is connected to the second portion. The second portion extends toward the high-side power device H2 of the second half-bridge structure, with its end proximate to the high-side power device H2 of the second half-bridge structure. In this embodiment, the second portion passes through the leads between the low-side power device L2 of the second half-bridge structure and the low-side drive signal output terminal LO and the reference ground terminal VSesd of the second driver chip IC2, extending close to the high-side power device H2 of the second half-bridge structure. The end of the second portion electrically connects the second floating power supply island 11b to the floating power supply positive terminal VB of the second driver chip. In actual use, the number and definition of the leads passed by the second portion are determined based on the port design of the driver chip and are not limited to this embodiment.

[0056] In this embodiment, the first side of the package shell 110 includes a first U-phase DC negative terminal pin NU, a first common ground pin COM, a U-phase high-side drive signal input pin INUH, a U-phase low-side drive signal input pin INUL, a first power supply positive terminal pin VCCU / V, a V-phase high-side drive signal input pin INVH, a V-phase low-side drive signal input pin INVL, a temperature sensing output pin VOT, an overcurrent detection pin CSC, a fault report / enable shutdown pin VFO / SD, a W-phase high-side drive signal input pin INWH, a W-phase low-side drive signal input pin CSC, a fault report / enable shutdown pin VFO / SD, a W-phase high-side drive signal input pin INWH, a W-phase low-side drive signal input pin INUL, a first power supply positive terminal pin VCCU / V, a V-phase high-side drive signal input pin INVH, a V-phase low-side drive signal input pin INVL, a temperature sensing output pin VOT, an overcurrent detection pin CSC, a fault report / enable shutdown pin VFO / SD, a W-phase high-side drive signal input pin INWH, a W-phase low-side drive signal input pin The drive signal input pin INWL, the second power supply positive terminal pin VCCW, the second common ground pin COM and the second U-phase DC negative terminal pin NU; the second side of the packaging shell 110 includes a DC positive terminal pin P, a W-phase floating power supply positive terminal pin VBW, a W-phase output pin VSW, a W-phase DC negative terminal pin NW, a V-phase DC negative terminal pin NV, a V-phase output pin VSV, a V-phase floating power supply positive terminal pin VBV, a U-phase floating power supply positive terminal pin VBU and a U-phase output pin VSU, which are arranged in sequence from the third group of half-bridge structures to the first group of half-bridge structures; wherein each pin is respectively arranged corresponding to the port of the corresponding driver chip and the half-bridge structure. The high-side drive signal input terminal INH and the low-side drive signal input terminal INL of each driver chip, the temperature sensing output terminal VOT and the overcurrent detection terminal CSC of the second driver chip IC2 are led to the pins at the corresponding positions; the ground terminal GND of each driver chip and the overcurrent detection terminal CSC of the first driver chip IC1 and the second driver chip IC2 are led to the corresponding pins through the common base island; the first power supply positive terminal VCC of the first driver chip IC1 and the second power supply positive terminal VCC of the second driver chip IC2 are led to the same pin at the corresponding position; the second fault of the first driver chip IC1 The signal output / enable shutdown control terminal SD / FO is electrically connected to the first fault signal output / enable shutdown control terminal SD / FO of the second driver chip IC2 via a lead. The first fault signal output / enable shutdown control terminal SD / FO of the second driver chip IC2 and the first fault signal output / enable shutdown control terminal SD / FO of the third driver chip IC3 are connected to the same pin at corresponding positions. The term "corresponding positions" means that the arrangement sequence of the lead-out ports and the pins is designed so that the leads between them do not cross, that is, the above-mentioned pins are respectively set to correspond to the ports of the corresponding driver chips.

[0057] Specifically, if Figure 3As shown, each driver chip is arranged on the same common foundation island 120 of the lead frame, and the ground terminal GND of each driver chip is connected to the common foundation island 120 through a lead wire and is led out to the common ground pin COM through the common foundation island 120. The second fault signal output terminal / enable shutdown control terminal SD / FO of the second driver chip IC2 and the first fault signal output terminal / enable shutdown control terminal SD / FO of the third driver chip IC3 are connected to the same fault report / enable shutdown pin VFO / SD through leads; the second fault signal output terminal / enable shutdown control terminal SD / FO of the first driver chip IC1 is connected to the first fault signal output terminal / enable shutdown control terminal SD / FO of the second driver chip IC2 through wiring, and then connected to the fault report / enable shutdown pin VFO / SD through the internal wiring of the second driver chip IC2; the temperature sensing output terminal VOT of the second driver chip IC2 is connected to the temperature sensing output pin VOT through a lead, and the overcurrent detection terminal CSC of the second driver chip IC2 is connected to the overcurrent detection pin CSC through a lead; the first power supply positive terminal VCC of the first driver chip IC1 and the second power supply positive terminal VCC of the second driver chip IC2 are connected to the first power supply positive terminal VCC through leads. On the positive terminal pin VCCU / V, the first power supply positive terminal VCC of the third driver chip IC3 is connected to the second power supply positive terminal pin VCCW through a lead (the power supply positive terminals of the second driver chip and the third driver chip can also be connected to the same pin); the high-side drive signal input terminal INH of the first driver chip IC1 is connected to the U-phase high-side drive signal input pin INUH through a lead, and the low-side drive signal input terminal INL is connected to the U-phase low-side drive signal input pin INUL through a lead; the high-side drive signal input terminal INH of the second driver chip IC2 is connected to the V-phase high-side drive signal input pin INVH through a lead, and the low-side drive signal input terminal INL is connected to the V-phase low-side drive signal input pin INVL through a lead; the high-side drive signal input terminal INH of the third driver chip IC3 is connected to the W-phase high-side drive signal input pin INWH through a lead, and the low-side drive signal input terminal INL is connected to the W-phase low-side drive signal input pin INWL through a lead.

[0058] Furthermore, in this example, in order to simplify the difficulty and complexity of wiring, the common ground pin COM is set as pin 2 (i.e., the first common ground pin) and pin 14 (i.e., the second common ground pin) on both sides of the other low-voltage pins of the driver chip; the U-phase high-side drive signal input pin INUH, the U-phase low-side drive signal input pin INUL, and the first power supply positive terminal pin VCCU / V are respectively set as pins 3, 4, and 5 on the left side of the first driver chip IC1 (the order of pins 2, 3, 4, and 5 is consistent with the order of the corresponding ports on the first driver chip IC1). Similarly, the V-phase high-side drive signal input pin INVH, the V-phase low-side drive signal input pin INVL, the temperature sensing output pin VOT, the overcurrent detection pin CSC, and the fault reporting / enabling shutdown pin VFO / SD are respectively arranged as pins 6, 7, 8, 9, and 10, located proximately to the left side of the second driver chip IC2 (consistent with the order of the corresponding ports on the second driver chip IC2). The W-phase high-side drive signal input pin INWH, the W-phase low-side drive signal input pin INWL, and the second power supply positive terminal pin VCCW are respectively arranged as pins 11, 12, 13, and 14, located proximately to the left side of the third driver chip IC3 (consistent with the order of the corresponding ports on the third driver chip IC3). In actual use, the pin order of the compact intelligent power module 100 can also be adjusted according to the arrangement order of the ports on the driver chip, and is not limited to this embodiment.

[0059] Specifically, if Figure 3As shown, in this embodiment, the high-side power devices in the three half-bridge structures are disposed on the same DC positive terminal island 130 of the lead frame, with their bottom drains electrically connected to the DC positive terminal island 130 via conductive adhesive, leading to the DC positive terminal pin P. Low-side power device L1 is disposed on the first output island 14a of the lead frame, with its bottom drain electrically connected to the first output island 14a via conductive adhesive, leading to the U-phase output pin VSU. Low-side power device L2 is disposed on the second output island 14b of the lead frame, with its bottom drain electrically connected to the second output island 14b via conductive adhesive, leading to the V-phase output pin VSV. Low-side power device L3 is disposed on the third output island 14c of the lead frame, with its bottom drain electrically connected to the third output island 14c via conductive adhesive, leading to the W-phase output pin VSW. The source at the top of each high-side power device is connected to the floating ground terminal VS of the corresponding driver chip and the output base island of the corresponding low-side power device via leads, and the gate at the top is connected to the high-side drive signal output terminal HO of the corresponding driver chip via leads. The source at the top of each low-side power device is connected to the reference ground terminal VSesd of the corresponding driver chip and the corresponding DC negative terminal pin via leads, and the gate at the top is connected to the low-side drive signal output terminal LO of the corresponding driver chip via leads. It should be noted that each power device can be implemented using a single chip with a parallel power tube and a freewheeling diode internally, wherein the cathode of the freewheeling diode is connected to the high-voltage terminal of the corresponding power tube, and the anode is connected to the low-voltage terminal of the corresponding power tube. It can also be implemented using a parallel power tube chip and a freewheeling diode chip (the specific connection relationship of each port is not detailed here). In this case, as an example, each freewheeling diode chip can be arranged on the same base island as the corresponding power tube chip and connected in parallel via leads.

[0060] Furthermore, in this example, the DC positive terminal pin P, the W-phase floating power supply positive terminal pin VBW, the W-phase output pin VSW, the W-phase DC negative terminal pin NW, the V-phase DC negative terminal pin NV, the V-phase output pin VSV, the V-phase floating power supply positive terminal pin VBV, the U-phase floating power supply positive terminal pin VBU and the U-phase output pin VSU are respectively arranged as pins 16, 17, 18, 19, 20, 21, 22, 23 and 24 along the lower end to the upper end of the second side; at this time, the above-mentioned pins are respectively arranged corresponding to the ports of the corresponding half-bridge structure (the leads do not cross). The lead frame also includes a DC negative terminal base island 150 arranged between the common base island 120 and the DC positive terminal base island 130. The DC negative end of the first half-bridge structure (the source of the low-side power device L1) is connected to the DC negative terminal base island 150 through a lead, and is led out to the U-phase DC negative terminal pin NU through the DC negative terminal base island 150. The U-phase DC negative terminal pin NU is arranged on the first side as pin No. 1 (i.e., the first U-phase DC negative terminal pin) and pin No. 15 (i.e., the second U-phase DC negative terminal pin), and is respectively located at the upper end of pin No. 2 and the lower end of pin No. 14.

[0061] like Figure 3 As shown, the low-voltage pins of each driver chip and the DC negative pins NU of the first half-bridge structure are arranged on the first side of the package housing 110. The pins on the first side are all low-voltage working pins, and the spacing between the pins meets the low-voltage creepage distance requirements. As an example, the center-to-center distance between two adjacent pins is set to 1.778 mm.

[0062] like Figure 3 As shown, the DC positive terminal pin P, the floating power supply positive terminal pins of each driver chip, the output pins of each half-bridge structure, and the DC negative terminal pins of the second group of half-bridge structures and the third group of half-bridge structures are arranged on the second side of the package shell 110; the DC positive terminal pin P is a group, and the output pins of each half-bridge structure and the floating power supply positive terminal pin of the corresponding driver chip are a group (that is, the W-phase floating power supply positive terminal pin VBW and the W-phase output pin VSW are a group, the V-phase output pin VSV and the V-phase floating power supply positive terminal pin VBV are a group, and the U-phase floating power supply positive terminal pin is a group). The negative DC pin VBU and the U-phase output pin VSU are grouped together, while the negative DC pin NW and the negative DC pin NV are grouped together, for a total of five groups. The operating voltage of the pins within each group is relatively low (e.g., less than 15V), and the spacing between pins meets the low-voltage creepage distance requirements. As an example, the center-to-center distance between two adjacent pins is set to 1.778mm. The operating voltage between groups is relatively high (e.g., exceeding 300V), and the spacing between groups meets the high-voltage creepage distance requirements. As an example, the spacing between groups is designed to be 3.8mm. As an example, the long side dimensions of this compact intelligent power module 100 are set to 29±0.2mm, and the short side dimensions are set to 12±0.2mm.

[0063] For example, a pair of screw mounting holes 160 are provided on the third and fourth sides of the compact intelligent power module 100 for securing the heat sink. In actual use, the screw mounting holes 160 may be provided only on the third or fourth side, and are not limited to this embodiment. The third and fourth sides are positioned opposite each other. In this example, the package housing 110 has a rectangular structure, with the first and second sides being opposed long sides, and the third and fourth sides being opposed short sides.

[0064] The present invention leads the floating power supply positive terminal and the floating ground terminal to adjacent pins through the design of the lead frame without affecting the high and low interval arrangement order of the power devices; it also leads the DC negative terminals of the V phase and the W phase to adjacent pins to meet the creepage distance requirements.

[0065] The present invention further provides an electronic product comprising the compact intelligent power module 100 of the present invention. The electronic product may further comprise components such as a three-phase motor and a motor control module. The electronic product includes but is not limited to white appliances, which are not described in detail here.

[0066] In summary, the present invention provides a compact intelligent power module and electronic product, comprising a packaging shell, three driver chips arranged on a lead frame inside the packaging shell, and three groups of half-bridge structures; each driver chip is arranged on a side close to the first side of the packaging shell, and is arranged in sequence along the first side; each half-bridge structure is arranged on a side close to the second side of the packaging shell, and is arranged one-to-one with each driver chip, and the high-side power devices and low-side power devices in the three groups of half-bridge structures are spaced in sequence; the low-voltage pins and high-voltage pins of the compact intelligent power module are respectively arranged on the first side and the second side, and meet the creepage distance requirements; the first side The device is arranged opposite to the second side; wherein the floating power supply positive terminal of the first driver chip is led to the corresponding pin through a first floating power supply base island, and the first floating power supply base island is arranged between the high-side power device and the low-side power device of the first group of half-bridge structures; the floating power supply positive terminal of the second driver chip is led to the corresponding pin through a second floating power supply base island, and the second floating power supply base island is arranged between the first group of half-bridge structures and the second group of half-bridge structures; the floating power supply positive terminal of the third driver chip is led to the corresponding pin through a third floating power supply base island, and the third floating power supply base island is arranged between the high-side power device and the low-side power device of the third group of half-bridge structures. The present invention satisfies the high- and low-interval arrangement order of transistors and also meets the requirements of external pin arrangement; uses reusable and identical driver chips to reduce chip design and tape-out complexity; and also reduces the number of power supply positive terminal pins, making the peripheral PCB wiring design more flexible and simple. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0067] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A compact intelligent power module, characterized in that: The compact intelligent power module at least includes: A packaging shell, a first driver chip, a second driver chip, a third driver chip, a first group of half-bridge structures, a second group of half-bridge structures, and a third group of half-bridge structures arranged on a lead frame inside the packaging shell, each group of half-bridge structures including a high-side power device and a low-side power device; Each driver chip is disposed on a side close to the first side of the package shell and is arranged in sequence along the first side; each half-bridge structure is disposed on a side close to the second side of the package shell and is arranged one-to-one with each driver chip, and the high-side power devices and low-side power devices in the three groups of half-bridge structures are spaced in sequence; the low-voltage pin and the high-voltage pin of the compact intelligent power module are respectively disposed on the first side and the second side and meet the creepage distance requirements; the first side and the second side are disposed opposite each other; The floating power positive terminal of the first driver chip is led to the corresponding pin through a first floating power island, and the first floating power island is arranged between the high-side power device and the low-side power device of the first group of half-bridge structures; the floating power positive terminal of the second driver chip is led to the corresponding pin through a second floating power island, and the second floating power island is arranged between the high-side power device of the first group of half-bridge structures and the low-side power device of the second group of half-bridge structures; the floating power positive terminal of the third driver chip is led to the corresponding pin through a third floating power island, and the third floating power island is arranged between the high-side power device and the low-side power device of the third group of half-bridge structures; the DC negative terminal pin of the first group of half-bridge structures is arranged on the first side of the packaging shell, and the DC negative terminal pins of the second group of half-bridge structures and the third group of half-bridge structures are arranged on the second side of the packaging shell.

2. The compact intelligent power module according to claim 1, wherein: The second floating power base island includes a coupled first part and a second part, the first part is arranged between the high-side power devices of the first group of half-bridge structures and the low-side power devices of the second group of half-bridge structures, and the second part is arranged between the second driver chip and the low-side power devices of the second group of half-bridge structures.

3. The compact intelligent power module according to claim 2, wherein: The second part passes through the leads between the low-side power devices of the second group of half-bridge structures and the low-side drive signal output terminal and the reference ground of the second driver chip, and is electrically connected to the floating power supply positive terminal of the second driver chip through the end of the second part.

4. The compact intelligent power module according to claim 1, wherein: The low-voltage pins of each driver chip are arranged on the first side of the package shell; the DC bus positive ends of each half-bridge structure are connected to the same DC positive end pin, and the DC positive end pin, the floating power supply positive end pins of each driver chip and the output pins of each half-bridge structure are arranged on the second side of the package shell; The DC positive terminal pins are grouped as a group, the output pins of each half-bridge structure and the floating power supply positive terminal pin of the corresponding driver chip are grouped as a group, and the DC negative terminal pins of the second group of half-bridge structures and the third group of half-bridge structures are grouped as a group; the spacing between each group meets the high-voltage creepage distance requirements, and the spacing between the pins in the same group meets the low-voltage creepage distance requirements.

5. The compact intelligent power module according to claim 1, wherein: The positive terminals of the power supply of the first driver chip and the second driver chip are led out to the same pin; or the positive terminals of the power supply of the second driver chip and the third driver chip are led out to the same pin.

6. The compact intelligent power module according to claim 1, wherein: The lead frame further comprises a common base island, a DC positive end base island, a DC negative end base island and three output base islands; Each driver chip is arranged on the common foundation island, and the ground end of each driver chip is connected to the common foundation island through a lead wire and is led out to a corresponding pin; Each high-side power device in the three groups of half-bridge structures is arranged on the DC positive end base island, and each low-side power device is arranged on the corresponding output base island. The DC positive end base island and each output base island are led to the corresponding pin; The DC negative terminal base island is arranged between the common foundation island and the DC positive terminal base island. The DC negative end of the first group of half-bridge structures is connected to the DC negative terminal base island through a lead and is led out to the corresponding pin.

7. The compact intelligent power module according to any one of claims 1 to 6, characterized in that: The compact intelligent power module further includes a bootstrap diode disposed between the positive terminal of the power supply and the positive terminal of the floating power supply of each driver chip, and each bootstrap diode is integrated into the corresponding driver chip.

8. The compact intelligent power module according to claim 1, wherein: Each driver chip uses the same chip.

9. The compact intelligent power module according to claim 8, characterized in that: Each driver chip includes a driving unit, a fault output shutdown function unit, a temperature detection unit and an overcurrent detection unit.

10. The compact intelligent power module according to claim 9, characterized in that: The output end of the fault output shutdown function unit of each driver chip is connected to the same fault report / enable shutdown pin; the output end of the temperature detection unit of one driver chip is led to the corresponding pin; the input end of the overcurrent detection unit of one driver chip is led to the corresponding pin, and the input ends of the overcurrent detection units of the other two driver chips are grounded.

11. The compact intelligent power module according to any one of claims 8 to 10, characterized in that: Each driver chip includes an overcurrent detection terminal, a temperature sensing output terminal, a first power supply positive terminal, a low-side drive signal input terminal, a high-side drive signal input terminal, a ground terminal, a second power supply positive terminal, a first fault signal output / enable shutdown control terminal, a low-side drive signal output terminal, a reference ground terminal, a floating power supply positive terminal, a high-side drive signal output terminal, a floating ground terminal and a second fault signal output / enable shutdown control terminal, which are arranged in clockwise order; Among them, the overcurrent detection end, the temperature sensing output end, the first power supply positive end and the low-side drive signal input end are located at the first end of the driver chip; the high-side drive signal input end, the ground end, the second power supply positive end and the first fault signal output / enable shutdown control end are located at the second end of the driver chip; the low-side drive signal output end, the reference ground end, the floating power supply positive end, the high-side drive signal output end and the floating ground end are located at the third end of the driver chip; the second fault signal output / enable shutdown control end is located at the fourth end of the driver chip.

12. The compact intelligent power module according to claim 11, characterized in that: The first side of the packaging shell includes a first U-phase DC negative terminal pin, a first common ground pin, a U-phase high-side drive signal input pin, a U-phase low-side drive signal input pin, a first power supply positive terminal pin, a V-phase high-side drive signal input pin, a V-phase low-side drive signal input pin, a temperature sensing output pin, an overcurrent detection pin, a fault reporting / enabling shutdown pin, a W-phase high-side drive signal input pin, a W-phase low-side drive signal input pin, a second power supply positive terminal pin, a second common ground pin and a second U-phase DC negative terminal pin, which are arranged in sequence along the direction from the first driver chip to the third driver chip; The second side of the packaging shell includes a DC positive terminal pin, a W-phase floating power supply positive terminal pin, a W-phase output pin, a W-phase DC negative terminal pin, a V-phase DC negative terminal pin, a V-phase output pin, a V-phase floating power supply positive terminal pin, a U-phase floating power supply positive terminal pin, and a U-phase output pin, which are arranged in sequence along the direction from the third group of half-bridge structures to the first group of half-bridge structures; Among them, each pin is respectively arranged to correspond to a corresponding driver chip and a port of the half-bridge structure.

13. The compact intelligent power module according to claim 1, wherein: A pair of screw mounting holes is further provided on the third side and / or the fourth side of the compact intelligent power module, and the third side is arranged opposite to the fourth side.

14. An electronic product, characterized in that: The electronic product at least includes the compact intelligent power module according to any one of claims 1 to 13.

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