Full-automatic packaging system

Abstract

The invention discloses a full-automatic packaging system which comprises a feeding device, a packaging device and a glue removing device which are linearly arranged. The feeding equipment is provided with a material frame transferring device for carrying a material frame between the feeding equipment and the packaging equipment, a first feeding device for carrying a lead frame into the material frame, and a second feeding device for carrying a plastic packaging material into the material frame. The glue removing device is provided with a piece turning device for turning the back face of the lead frame upwards, a first discharging device for carrying the lead frame between the packaging device and the piece turning device, and a second discharging device for carrying the turned lead frame to the glue removing device. Targeted design is carried out according to the plastic packaging process of the chip, feeding equipment, packaging equipment and glue removing equipment are integrated to form an automatic control packaging system for whole-course mechanical processing, manual participation is not needed from frame sheet arranging and feeding to material receiving after glue removing, the manual error rate is reduced, the labor intensity of workers is reduced, and the production efficiency is improved. And the processing efficiency and the production quality are greatly improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more specifically, to a fully automated packaging system. Background Technology

[0002] Packaging technology is the technique of encapsulating semiconductor integrated circuit chips with insulating plastic or ceramic materials. It is crucial for chip manufacturing processes because the chips must be isolated from the outside world to prevent impurities in the air from corroding the chips and causing a decline in their electrical performance. Packaged chips are also easier to install, transport, and store.

[0003] The semiconductor chip molding process typically involves: loading molding compound and lead frames with the chip attached separately; placing the loaded molding compound and lead frames in their corresponding positions on a molding compound holder; transporting the lead frames and molding compound to the mold cavity of the molding device via the molding compound holder for molding; removing excess molding compound from the molded lead frames; and removing the processed lead frames as semi-finished products for the next processing step. While existing molding devices and other processing equipment exist, loading and unloading during the process are usually done manually, which is labor-intensive and inefficient, making it difficult to meet production demands.

[0004] Therefore, how to design and implement a fully automated packaging system that mechanizes the entire process from loading to unloading is a technical problem that the industry urgently needs to solve. Summary of the Invention

[0005] To address the shortcomings of low automation in existing processing equipment, this invention proposes a fully automated packaging system. Designed specifically for the chip encapsulation process, it integrates feeding equipment, packaging equipment, and adhesive removal equipment to form a fully mechanized, automatically controlled packaging system. From frame stacking and feeding to adhesive removal and material collection, no manual intervention is required, reducing human error rates and labor intensity, and significantly improving processing efficiency and production quality.

[0006] The technical solution adopted in this invention is to design a fully automatic packaging system, including: a feeding device, a packaging device, and a glue removal device arranged in a straight line. The feeding device has a material rack, a material rack transfer device, a first feeding device, and a second feeding device. The packaging device has a plastic sealing device. The glue removal device has a first unloading device, a flipping device, a second unloading device, and a glue removal device.

[0007] The first feeding device is used to transport the lead frame to the frame discharge port of the material rack. The second feeding device is used to output the molding compound and transport the molding compound to the feeding cylinder of the material rack. The material rack transfer device can transport the material rack containing the lead frame and molding compound from the feeding equipment to the mold cavity of the molding device along a straight line. The first unloading device can transport the molded lead frame from the mold cavity of the molding device to the flipping device along a straight line. The flipping device is used to flip the back of the lead frame to face upwards. The second unloading device can transport the flipped lead frame from the flipping device to the adhesive removal device along a straight line.

[0008] Furthermore, the material rack transfer device has a material rack translation mechanism and a material rack lifting mechanism.

[0009] The material rack translation mechanism includes two guide structures located on both sides of the material rack, and a movable frame movably disposed between the two guide structures;

[0010] The material rack lifting mechanism is connected to the movable frame and the material rack respectively. It includes a rotating shaft on the movable frame, two eccentric bearings at both ends of the rotating shaft, two support seats fixedly installed on the movable frame for supporting the two eccentric bearings, two cantilever arms spaced apart, and a rotation drive module for driving the rotating shaft to rotate. The first end of each cantilever arm is movably sleeved on the rotating shaft and close to the corresponding eccentric bearing, and the second end is fixedly connected to the material rack. The bottom of each eccentric bearing is placed on the support seat below it.

[0011] The movable frame is provided with two guide seats corresponding to the two cantilever arms. Each guide seat includes a vertical guide rail fixedly mounted on the movable frame and a movable plate movably mounted on the vertical guide rail. The movable plate is also fixedly connected to the first end of the corresponding cantilever arm.

[0012] Furthermore, the first feeding device has a feeding platform, a pushing mechanism, a feeding mechanism, and a first clamping mechanism.

[0013] The loading platform is used to place the material boxes for stacking lead frames;

[0014] A pushing mechanism is used to push the lead frame in the material box to the feeding mechanism in sequence.

[0015] A feeding mechanism for conveying the lead frame to a designated position;

[0016] The first clamping mechanism has a loading mechanical claw for conveying the lead frame to the frame unloading port when it reaches the designated position.

[0017] Furthermore, the loading platform has an upper area, a lower area, and a material box lifting mechanism.

[0018] The upper region is used to place a full material box, and the upper region is provided with a first pusher mechanism to push the full material box to the material box lifting mechanism;

[0019] The lower area is used to place empty material boxes, and the lower area is provided with a second pusher mechanism to push the empty material boxes away from the material box lifting mechanism.

[0020] The material box lifting mechanism is installed adjacent to one side of the upper and lower areas, and is located between the pushing mechanism and the feeding mechanism. The material box lifting mechanism adjusts the height of the full material box so that the opening at one end of the material box faces the pusher claw of the pushing mechanism and the opening at the other end faces the feeding mechanism.

[0021] Furthermore, the feeding mechanism includes a positioning seat, a feeding belt, and a limiting block.

[0022] The positioning seat includes two positioning side plates, the lead frame is located between the two positioning side plates, and the top of the two positioning side plates is provided with a clearance opening for gripping in conjunction with the feeding mechanical claw.

[0023] A feeding belt is installed on the inner side of the positioning seat, the lead frame is placed on the feeding belt, and the top surface of the feeding belt is higher than the bottom surface of the clearance opening.

[0024] A limiting block is installed at the end of the feed belt, which is capable of transporting the lead frame to abut against the limiting block.

[0025] Furthermore, the second feeding device includes a vibratory feeder, a guide, a material distribution component, a material distribution drive mechanism, and a second clamping mechanism.

[0026] A vibratory feeder having a feeding track and a discharge port located at the end of the feeding track;

[0027] A guide component, which is provided with a connection port corresponding to the discharge port;

[0028] The material separating component is movably disposed on one side of the guide component. The side of the material separating component near the guide component has multiple notches, which correspond one-to-one with multiple clamping units on the second clamping mechanism.

[0029] The material dispensing drive mechanism is connected to the material dispensing component. The material dispensing component moves along the extension direction of the guide component under the drive of the material dispensing drive mechanism, so that the plurality of notches correspond to the connection port in sequence to receive the molding compound from the outlet of the vibratory feeder.

[0030] The second clamping mechanism has multiple clamping units for synchronously conveying the molding compound in the notch into the feeding cylinder.

[0031] Furthermore, the flipping device includes a conveyor belt, a flipping frame, and a flipping drive mechanism.

[0032] A conveyor belt for supporting the plastic-sealed lead frame and transporting it to the flipping frame, the conveyor belt comprising two side-by-side belt bodies;

[0033] A flipping frame is located between the two belt bodies. One end of the flipping frame is provided with a slot for inserting the lead frame. When the slot is parallel to the conveyor belt, the slot opening faces the lead frame on the conveyor belt in the conveying direction. The other end of the flipping frame is provided with a flipping shaft. The flipping frame can rotate relative to the conveyor belt so that the back of the lead frame faces upward.

[0034] A flipping drive mechanism is connected to the flipping shaft, and the flipping frame rotates around the flipping shaft under the drive of the flipping drive mechanism.

[0035] Furthermore, the first unloading device has at least two parallel mechanical claws for gripping the lead frame, the conveyor belt is mounted on a support frame, the support frame is mounted on a conveyor belt linear motion module, the moving direction of the conveyor belt linear motion module is perpendicular to the conveying direction of the conveyor belt, and the mechanical claws of the first unloading device are arranged in parallel along the conveying direction of the conveyor belt.

[0036] Furthermore, the adhesive removal device includes an adhesive flushing platform, an upper adhesive removal mold, and a lower adhesive removal mold.

[0037] A glue-punching table, which is used to install the glue-removing lower mold;

[0038] The adhesive removal mold is provided with a through groove corresponding to the excess adhesive on the lead frame, and the adhesive removal mold is supported below the lead frame.

[0039] The upper mold for removing adhesive has adhesive-filling protrusions aligned vertically with the through groove.

[0040] Furthermore, the fully automated packaging system also includes a receiving device and a third unloading device. The third unloading device can transport the de-adhesive-removed lead frames from the de-adhesive removal device to the receiving device. The receiving device has a receiving platform and a lifting drive mechanism. The receiving platform is used to place the stacked lead frames on support plates. The lifting drive mechanism is connected to the receiving platform, and the receiving platform adjusts the height of the support plates under the drive of the lifting drive mechanism to match the unloading height of the third unloading device.

[0041] Furthermore, the packaging equipment also has a mold cleaning device for cleaning the upper mold and / or lower mold of the molding device, the mold cleaning device comprising: a dust hood, a brush installed in the dust hood, a power component for driving the brush to rotate, at least one air blowing pipe connected to the dust hood, an air extraction pipe communicating with the inner cavity of the dust hood, and a cleaning drive mechanism for driving the dust hood to move.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] 1. The system integrates feeding equipment, packaging equipment, and adhesive removal equipment. From feeding, sealing, flipping, adhesive removal to unloading, all processes are handled mechanically, effectively improving production efficiency.

[0044] 2. The material rack transfer device is designed with two cantilever arms that are fixedly connected to the material rack. The longitudinal horizontal movement of the cantilever arms is realized through the guide structure, and the lifting movement of the cantilever arms is realized through the eccentric bearing, so that the material rack transfer device can transfer the material rack to the processing station more smoothly.

[0045] 3. The first feeding device is divided into an upper area and a lower area. The height of the material box is adjusted by the material box lifting mechanism to realize the alignment of the material box between the pushing mechanism and the feeding mechanism, as well as the transfer of the material box between the upper area and the lower area, thereby improving the feeding efficiency of the lead frame.

[0046] 4. The second feeding device is designed with guide components and distribution components. The connection port of the guide component corresponds to the discharge port of the vibratory feeder. The multiple notches of the distribution component correspond to the connection ports of the guide component in sequence, so as to realize the transfer of the plastic sealant in the vibratory feeder to the notches of the distribution component. When the clamping mechanism comes over, it simultaneously clamps all the plastic sealant on the distribution component. The distribution process can be carried out simultaneously when the clamping mechanism moves over to feed the material, saving the entire feeding time of the plastic sealant.

[0047] 5. The flipping device is designed with a conveyor belt and a flipping frame, which automatically flips the lead frame during the process of transporting it to the glue removal device. The second unloading device directly transports the lead frame with the back facing up to the glue-punching table for glue-punching. With the simplified mechanical structure, the process from molding to glue removal is automated, which improves production efficiency while controlling the manufacturing cost of the packaging system.

[0048] 6. The packaging equipment is designed with a cleaning device. After the molding process is completed, the cleaning device is used to clean the mold of the molding process, remove molding waste from the mold surface, extend the mold life, and improve the product molding quality. Attached Figure Description

[0049] The present invention will now be described in detail with reference to the embodiments and accompanying drawings, wherein:

[0050] Figure 1 This is a three-dimensional schematic diagram of the fully automated packaging system of the present invention;

[0051] Figure 2 This is a three-dimensional schematic diagram of the feeding device of the present invention without the top cover and top structure;

[0052] Figure 3 This is a three-dimensional schematic diagram of the main structure of the feeding device of the present invention;

[0053] Figure 4 This is a top view schematic diagram of the main structure of the feeding device of the present invention;

[0054] Figure 5 This is a partially enlarged schematic diagram of the first angle of the material rack transfer device of the present invention;

[0055] Figure 6 This is a partially enlarged schematic diagram of the material rack transfer device of the present invention from a second angle;

[0056] Figure 7 This is a partially enlarged schematic diagram of the material rack transfer device of the present invention from a third angle;

[0057] Figure 8 This is a three-dimensional schematic diagram of the main structure of the first feeding device of the present invention;

[0058] Figure 9 This is a three-dimensional schematic diagram of the first clamping mechanism of the present invention;

[0059] Figure 10 This is a three-dimensional schematic diagram of the main structure of the second feeding device of the present invention;

[0060] Figure 11 This is a three-dimensional schematic diagram of the second clamping mechanism of the present invention;

[0061] Figure 12 This is a top view schematic diagram of the main structure of the second feeding device of the present invention;

[0062] Figure 13 This is a partially enlarged top view of the second feeding device of the present invention;

[0063] Figure 14 This is a three-dimensional schematic diagram of the adhesive removal device of the present invention with the top cover and top structure removed;

[0064] Figure 15 This is a three-dimensional schematic diagram of the main structure of the adhesive removal device of the present invention after removing the adhesive removal upper mold;

[0065] Figure 16 This is a top view of the main structure of the adhesive removal device of the present invention after removing the adhesive removal upper mold;

[0066] Figure 17 This is a partially enlarged schematic diagram of the flipping device of the present invention;

[0067] Figure 18 This is a schematic diagram of the lead frame after the plastic encapsulation of this invention;

[0068] Figure 19 This is a schematic diagram of the main structure of the adhesive removal lower mold of the present invention;

[0069] Figure 20 This is a schematic diagram of the main structure of the adhesive removal upper mold of the present invention;

[0070] Figure 21 This is a schematic diagram of the internal structure of the packaging device of the present invention;

[0071] Figure 22 This is a top view schematic diagram of the main structure of the cleaning device of the present invention;

[0072] Figure 23 This is a bottom view schematic diagram of the main structure of the cleaning device of the present invention; Attached image description:

[0074] 1. Feeding equipment; 2. Packaging equipment; 3. Adhesive removal equipment; 100. Material rack; 101. Frame discharge port; 102. Feeding cylinder; 103. Residual adhesive; 104. Plastic-sealed shell;

[0075] 10. Second feeding device; 11. Guide component; 110. Connection port; 112. First guide part; 113. Second guide part; 12. Material distribution component; 120. Notch; 13. Material distribution drive mechanism; 131. Fixing frame; 142. Motor; 143. Moving part; 144. Cover plate; 1440. Clearance hole; 15. Detection component; 16. Linear guide rail; 161. Protrusion; 17. Vibratory feeder; 171. Feeding track; 172. Vibratory feeder outlet; 18. Second clamping mechanism; 181. Clamping unit; 19. Molding material;

[0076] 20. Material rack transfer device; 201. Feeding base; 202. Preheating table; 21. Guide structure; 211. First guide structure; 2111. Support frame; 2112. Horizontal guide rail; 212. Second guide structure; 2121. Horizontal slide table; 2122. Limiting plate; 22. Moving frame; 221. Rotating shaft; 222. Eccentric wheel; 223. Cantilever; 224. Rotation drive module; 2241. Fixed plate; 2242. Motor; 2243. Conveying assembly; 225. Support seat; 2250. Limiting groove; 226. Guide seat; 2261. Vertical guide rail; 2262. Movable plate; 227. Horizontal connecting plate; 2270. Square hole; 228. Longitudinal connecting plate;

[0077] 30. First feeding device; 31. Feeding platform; 311. Upper area; 312. Lower area; 32. Pushing mechanism; 321. Push claw; 33. Feeding mechanism; 34. First clamping mechanism; 341. Feeding mechanical claw; 35. Material box lifting mechanism; 351. Pallet; 352. Lifting pressure plate; 36. Material box; 37. Lead wire frame; 38. First box pushing mechanism; 39. Second box pushing mechanism;

[0078] 40. Sealing device; 41. Cleaning device; 411. Dust hood; 412. Brush; 413. Power component; 414. Air blowing pipe; 415. Air extraction pipe; 416. Cleaning drive mechanism;

[0079] 50. Flipping device; 51. First unloading device; 511. Robotic arm; 512. Material handling robotic gripper; 513. Robotic arm lifting mechanism; 514. Robotic arm linear motion module; 52. Conveyor belt; 53. Flipping frame; 531. Slot; 532. Groove; 54. Limiting stop; 55. Flipping drive mechanism; 551. Transmission belt; 56. Support frame; 57. Base; 58. Conveyor belt linear motion module;

[0080] 60. Glue removal device; 61. Glue removal base; 62. Second unloading device; 63. Glue removal upper mold; 631. Glue ejection protrusion; 64. Glue removal lower mold; 641. Through groove; 651. First photoelectric beam; 652. Second photoelectric beam; 66. Excess glue falling channel; 67. Excess glue collection bin; 68. Air jet pipe; 69. Dust collection hood;

[0081] 70. Receiving device; 71. Third unloading device; 72. Receiving platform; 73. Material support plate. Detailed Implementation

[0082] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0083] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component. The terms "mounted," "connected," and "attached" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components or an interaction between two components.

[0084] In the description of this invention, it should be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0085] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0086] It should be understood that the longitudinal and transverse directions mentioned in this article are two different directions. The length direction of the fully automated packaging system is the longitudinal direction, the width direction is the transverse direction, and the height direction is the vertical direction. In actual applications, due to limitations such as processing accuracy or installation space, the longitudinal and transverse directions do not have to be completely perpendicular; being close to perpendicular is also acceptable.

[0087] like Figure 1 , 2 As shown in Figure 14, the fully automatic packaging system proposed in this invention includes: a feeding device 1, a packaging device 2, and a glue removal device 3 arranged in a longitudinal straight line. The feeding device 1 has a material rack 100, a material rack transfer device 20, a first feeding device 30, and a second feeding device 10. The packaging device 2 has a plastic sealing device 40. The glue removal device 3 has a first unloading device 51, a flipping device 50, a second unloading device 62, and a glue removal device 60.

[0088] In some embodiments of the present invention, the feeding device 1, the packaging device 2, and the adhesive removal device 3 are arranged in a longitudinal straight line, and the first feeding device 30, the material rack transfer device 20, and the second feeding device 10 are arranged in a transverse direction, that is, the first feeding device 30 is provided on one side of the material rack transfer device 20 and the second feeding device 10 is provided on the other side. The flipping device 50 and the adhesive removal device 60 are arranged in a transverse direction, that is, the adhesive removal device 60 is located on one side of the end of the flipping device 50. This arrangement can shorten the overall length of the fully automatic packaging system and make reasonable use of the installation space.

[0089] Since the encapsulation device 40 of the packaging equipment 2 is existing technology, and the core of this invention lies in the automated transfer processing of the feeding process and the adhesive removal process, the feeding equipment and the adhesive removal equipment will be described in detail below.

[0090] like Figures 2 to 4 As shown, the feeding base 201 of the feeding device 1 is provided with a preheating platform 202, and the material rack 100 is placed on the preheating platform 202. The material rack 100 is provided with a frame feeding port 101 for placing the lead wire frame 37 and a frame support plate for supporting the lead wire frame 37 located in the frame feeding port 101. The material rack 100 is also provided with a feeding cylinder for placing the plastic sealant 19 and a baffle for supporting the plastic sealant 19 located in the feeding cylinder 102.

[0091] like Figure 5 , 6 As shown, the rack transfer device 20 is used to transfer the rack 100 containing the lead frame 37 and the molding compound 19. The first feeding device 30 is used to move the lead frame 37 into the frame discharge port 101 of the rack 100, and the second feeding device 10 is used to output the molding compound 19 and move it into the feeding cylinder 102 of the rack 100. The first feeding device 30 is located on one side of the rack 100, and the second feeding device 10 is located on the other side of the rack 100, that is, the two feeding devices are distributed on the left and right sides of the rack 100, which shortens the longitudinal length of the feeding equipment.

[0092] The material rack transfer device 20 is installed on the top surface of the feeding base 201 and can move the material rack 100 from the loading station to the processing station in the longitudinal direction. The second loading device 10 is installed next to the loading station of the material rack 100 and outputs the molding material 19 to the material rack 100 in the transverse direction.

[0093] The material rack transfer device 20 includes a material rack translation mechanism and a material rack lifting mechanism. The material rack translation mechanism includes two guide structures 21 located on both sides of the material rack 100, and a movable frame 22 movably disposed between the two guide structures 21. The material rack lifting mechanism is connected to the movable frame 22 and the material rack 100 respectively. It includes a rotating shaft 221 disposed on the movable frame 22, two eccentric bearings 222 disposed at both ends of the rotating shaft 221, and two cantilever arms 223 disposed at intervals. The first end of each cantilever arm 223 is movably sleeved on the rotating shaft 221 and close to the corresponding eccentric bearing 222, and its second end is fixedly connected to the material rack 100. In this embodiment, two cantilever arms 223 are fixedly connected to the material rack 100. The material rack translation mechanism and the material rack lifting mechanism respectively drive the two cantilever arms 223 to move horizontally and vertically to realize the transfer of the material rack 100, thereby ensuring that the transfer of the material rack 100 is more stable.

[0094] In this embodiment, the material rack translation mechanism can be configured to include two guide structures 21 with the same structure, or two guide structures 21 with different structures, as long as the two guide mechanisms allow the movable frame 22 to move horizontally.

[0095] like Figure 7As shown, taking the material rack translation mechanism as an example, it includes two guide structures 21 with different structures. The two guide structures 21 are referred to as the first guide structure 211 and the second guide structure 212, respectively. The first guide structure 211 includes a support frame 2111 and a horizontal guide rail 2112 fixedly mounted on the support frame 2111. The second guide structure 212 includes a horizontal slide 2121 and a limiting plate 2122 parallel to the horizontal slide 2121. The first side of the movable frame 22 is located on the limiting plate 2122 and is movably connected to the horizontal slide 2121, and its second side is movably connected to the horizontal guide rail 2112. In this example, the translation drive module of the material rack translation mechanism can be set only on the first guide structure 211 side. The translation drive module is connected to the first side of the moving frame 22. The translation drive module drives the first side of the moving frame 22 to move on the horizontal slide table 2121. While the first side of the moving frame 22 moves, the second side of the moving frame 22 moves on the horizontal guide rail 2112. Thus, the lifting mechanism can be driven to move together with the material rack 100 through the moving frame 22.

[0096] like Figure 5 As shown, in this embodiment, the material rack lifting mechanism further includes a rotary drive module 224 for driving the rotary shaft 221 to rotate.

[0097] The rotary drive module 224 includes a fixed plate 2241, a motor 2242, and a conveyor assembly 2243. The fixed plate 2241 primarily supports and secures the motor 2242 and the conveyor assembly 2243. Two rectangular holes are provided on the fixed plate 2241 to reduce weight. Both sides of the fixed plate 2241 are connected to two cantilever arms 223, and the motor 2242 is mounted on the fixed plate 2241. The conveyor assembly 2243 includes a drive wheel, a driven wheel, and a conveyor belt. The drive wheel is connected to the output shaft of the motor 2242, the driven wheel is mounted on the rotary shaft 221, and the conveyor belt is mounted on both the drive wheel and the driven wheel. When the rotary drive module 224 is operating, the motor 2242 rotates, driving the drive wheel to rotate. Simultaneously, the conveyor belt drives the driven wheel to rotate, which in turn drives the rotary shaft 221 to rotate.

[0098] In this embodiment, the movable frame 22 is provided with two support seats 225 corresponding to the two eccentric bearings 222 to support and limit the two eccentric bearings 222.

[0099] like Figure 5 , 6As shown, two support seats 225 are spaced apart on the movable frame 22, and the two support seats 225 correspond one-to-one with two eccentric bearings 222. Each support seat 225 has a limiting groove 2250 at its top, and the limiting groove 2250 of each support seat 225 abuts against the circumferential surface of the corresponding eccentric bearing 222. By setting the limiting groove 2250, the eccentric bearing 222 can be limited in the axial direction to prevent the outer ring of the eccentric bearing 222 from shifting when the inner ring of the eccentric bearing 222 rotates with the rotating shaft 221.

[0100] In this embodiment, the lifting and lowering motion of the two cantilever 223 is achieved by the rotation of the two eccentric bearings 222. The moving frame 22 is also provided with two guide seats 226 corresponding to the two cantilever 223 to guide the lifting and lowering motion of the two cantilever 223.

[0101] Two guide seats 226 are spaced apart on the movable frame 22. Each guide seat 226 includes a vertical guide rail 2261 fixedly mounted on the movable frame 22, and a movable plate 2262 movably mounted on the vertical guide rail 2261. The movable plate 2262 is fixedly connected to the corresponding cantilever 223. When the two cantilever 223 moves vertically, it drives the two corresponding movable plates 2262 to move along the extension direction of the vertical guide rail 2261.

[0102] The first ends of the two cantilever arms 223 are mounted on the movable frame 22, and the second ends of the two cantilever arms 223 are mounted on the material rack 100. Since the height of the movable frame 22 is higher than the height of the material rack 100, the first ends of the two cantilever arms 223 are higher than the second ends.

[0103] The material rack lifting mechanism also includes a transverse connecting plate 227 and a longitudinal connecting plate 228. The transverse connecting plate 227 is disposed on the second end of the two cantilever 223, and four square holes 2270 are spaced apart on the transverse connecting plate 227. The longitudinal connecting plate 228 is fixedly disposed on the material rack 100, and one end of the longitudinal connecting plate 228 is disposed below the transverse connecting plate 227, and this end is fixedly connected to the transverse connecting plate 227.

[0104] like Figure 8 As shown, the first feeding device 30 has a feeding platform 31, a pushing mechanism 32, a feeding mechanism 33, and a first clamping mechanism 34. The feeding platform 31 is used to place a material box 36 on which the lead frames 37 are stacked. The material box 36 has openings at both ends. The pushing mechanism 32 is used to push the lead frames 37 in the material box 36 to the feeding mechanism 33 in sequence. The feeding mechanism 33 is used to transport the lead frames 37 to a designated position. The first clamping mechanism 34 has a feeding mechanical claw 341 for moving the lead frames 37 on the feeding platform 31 to the frame unloading port 101.

[0105] The loading platform 31 has an upper area 311, a lower area 312, and a box lifting mechanism 35. The upper area 311 is used to place full boxes and is equipped with a first box pushing mechanism 38 that pushes full boxes toward the box lifting mechanism 35. The lower area 312 is used to place empty boxes and is equipped with a second box pushing mechanism 39 that pushes empty boxes away from the box lifting mechanism 35. The box lifting mechanism 35 is used to adjust the height of the box 36. The box lifting mechanism 35 is installed adjacent to the upper area 311 and the lower area 312 on one side, and is located between the pushing mechanism 32 and the feeding mechanism 33.

[0106] The material box lifting mechanism 35 has a support plate 351 and a lifting pressure plate 352 located directly above the support plate 351. The first pushing mechanism 38 pushes a full material box in the upper area 311 onto the support plate 351. The lifting pressure plate 352 descends to press the full material box down and fix it onto the support plate 351. The support plate 351, the full material box, and the lifting pressure plate 352 are pushed and adjusted in height by the material box lifting mechanism 35 as a whole, so that the opening at one end of the material box 36 faces the pusher claw 321 of the pushing mechanism 32, and the opening at the other end faces the feeding mechanism 33. After all the lead frame 37 in the full material box has been discharged, the material box lifting mechanism 35 lowers the empty material box to be aligned with the height of the lower area 312. The lifting pressure plate 352 rises to release the empty material box, and the second pushing mechanism 39 pushes the empty material box into the lower area 312.

[0107] like Figure 8 , 9 As shown, the feeding mechanism 33 has a positioning seat, a feeding belt, and a limiting block. The positioning seat includes two positioning side plates, and the lead frame 37 is located between the two positioning side plates. The top of the two positioning side plates is provided with a clearance opening that cooperates with the feeding mechanical claw 341 to grip. The feeding belt (not shown in the figure) is installed on the inner side of the positioning seat, and the lead frame 37 is placed on the feeding belt. The top surface of the feeding belt is higher than the bottom surface of the clearance opening. The limiting block is installed at the end of the feeding belt, and the feeding belt can transport the lead frame 37 until it abuts against the limiting block. In some embodiments, in order to ensure the reliability of the feeding mechanism and the feeding efficiency, the front end of the feeding belt is provided with at least two sets of clamping rollers arranged longitudinally at intervals. Each set of clamping rollers includes a pair of upper rollers and a lower roller. The pushing mechanism 32 pushes the lead frame 37 out between the upper roller and the lower roller of the clamping roller. The clamping roller continues to rotate to transport the lead frame 37 backward onto the feeding belt, and then the feeding belt transports the lead frame 37 backward.

[0108] like Figure 10As shown, the second feeding device 10 includes a vibratory feeder 17, a guide 11, a dispensing component 12, a dispensing drive mechanism 13, and a second clamping mechanism 18. The guide 11, dispensing component 12, dispensing drive mechanism 13, and linear guide rail form a dispensing mechanism, used to receive multiple molding compounds 19 from the vibratory feeder 17 and to change the spacing between the multiple molding compounds 19. The second clamping mechanism 18 moves back and forth between the dispensing mechanism and the material rack 100. The second clamping mechanism 18 can directly clamp the multiple molding compounds 19 from the dispensing mechanism and place them into multiple feeding cylinders 102 of the material rack 100, completing the feeding of the molding compounds.

[0109] This embodiment does not limit the structure of the vibratory feeder; the vibratory feeder 17 can adopt an existing common structure.

[0110] The vibratory feeder 17 contains a cylindrical molding compound 19. Vibration causes the molding compound 19 to move along an upward-circulating feeding channel within the vibratory feeder 17. A feeding track 171, connected to the feeding channel, is also provided on the outer side of the vibratory feeder 17. Ultimately, a row of molding compounds 19 will be accommodated on the feeding track 171. In this embodiment, the end outlet of the feeding track 171 is referred to as the vibratory feeder outlet 172.

[0111] like Figure 11 As shown, the second clamping mechanism 18 includes a plurality of clamping units 181, the number of which can be four or other values. The clamping units 181 can be grippers or other structures. In some feasible embodiments of the present invention, the second clamping mechanism 18 includes four clamping units 181, each clamping unit 181 being a cylinder gripper.

[0112] like Figure 10 As shown, the guide member 11 and the material distribution member 12 are disposed above the linear guide rail 16, and the material distribution drive mechanism 13 is disposed below the linear guide rail 16. The guide member 11 and the material distribution member 12 are disposed adjacent to each other, and the side of the material distribution member 12 can fit against the side of the guide member 11. The guide member 11 is fixedly connected to the linear guide rail 16, and the material distribution member 12 is movably disposed on the linear guide rail 16. The material distribution drive mechanism 13 is connected to the material distribution member 12 to drive the material distribution member 12 to move.

[0113] like Figures 11 to 13As shown, the guide member 11 has a connection port 110, which corresponds to the vibratory feeder outlet 172. This connection port 110 allows the molding compound 19 at the vibratory feeder outlet 172 to move into the notch of the distribution member 12. The guide member 11 also prevents the molding compound 19 from falling out during movement after entering the notch of the distribution member 12. The guide member 11 can consist of two parts, including a first guide portion 112 and a second guide portion 113 spaced apart, with the connection port 110 formed by the gap between the first guide portion 112 and the second guide portion 113. Both the first guide portion 112 and the second guide portion 113 are mounted on the upper edge of the linear guide rail 16 using fasteners. The length of the first guide portion 112 is the same as the length of the second guide portion 113, and the height of the first guide portion 112 is the same as the height of the second guide portion 113. The side of the first guide portion 112 closest to the second guide portion 113 is a first side surface, which includes a first plane and a first inclined surface connected to each other. Similarly, the side of the second guide portion 113 closest to the first guide portion 112 is a second side surface, which includes a second plane and a second inclined surface connected to each other. By providing a first inclined surface to the first guide portion 112 and a second inclined surface to the second guide portion 113, the size of the connection port 110 near the vibratory feeder outlet 172 is made larger, allowing the molding compound 19 to enter the connection port 110 more smoothly.

[0114] The material distribution component 12 is movably disposed on one side of the guide component 11. The side of the material distribution component 12 closest to the guide component 11 has multiple notches 120. The number of notches 120 is the same as the number of clamping units 181 of the second clamping mechanism 18, and the spacing between the multiple notches 120 is the same as the spacing between the clamping units 181. Whenever one of the notches 120 of the material distribution component 12 aligns with the connection port 110 of the guide component 11, the molding compound 19 at the vibratory feeder outlet 172 can enter the notch 120 of the material distribution component 12 through the connection port 110. After the molding compound 19 enters the previous notch 120, the material distribution component 12 is moved so that the next notch 120 of the material distribution component 12 aligns with the connection port 110 of the guide component 11, allowing the molding compound 19 to enter the next notch 120. This process continues until all the notches 120 of the material distribution component 12 contain the molding compound 19. The material distribution component 12 is provided to change the spacing between the molding compound 19, and to make the spacing between the molding compound 19 the same as the spacing between the clamping units 181, so as to facilitate the second clamping mechanism 18 to clamp the molding compound 19. The material distribution component 12 is also provided with a groove (not shown in the figure) that is connected to the protrusion 161 of the linear guide rail 16, so as to achieve upper limit of the material distribution component 12 in the width direction, ensuring that the material distribution component 12 will not deviate in the width direction when the molding compound 19 enters the notch 120 and during the movement, thereby ensuring that the molding compound 19 is stably and accurately placed in the notch 120 of the material distribution component 12.

[0115] like Figure 12 , 13 As shown, the material distribution drive mechanism 13 is connected to the material distribution component 12. The material distribution drive mechanism 13 drives the material distribution component 12 to move along the extension direction of the guide component 11, so that the multiple notches 120 of the material distribution port correspond sequentially to the connection ports 110 of the guide component 11 to receive the molding compound 19 from the vibratory feeder outlet 172. The material distribution drive mechanism 13 is located below the linear guide rail 16. The material distribution drive mechanism 13 includes a fixed frame 131, a motor 142, a conveying assembly, a movable component 143, and a cover plate 144. The fixed frame 131 is connected to the linear guide rail 16 and is mainly used to fix and support the other components of the material distribution drive mechanism 13. The motor 142 is installed on one side of the fixed frame 131, and the conveying assembly is installed on the other side of the fixed frame 131. The conveying assembly includes a drive wheel connected to the output shaft of the motor 142, a driven wheel installed on the fixed frame 131, and a conveyor belt sleeved on the drive wheel and the driven wheel. One end of the movable component 143 is mounted on the conveyor belt, and the other end is connected to the side of the material distribution component 12 facing away from the guide component 11. A cover plate 144 is mounted on the other side of the fixed frame 131 and covers the conveyor assembly. The cover plate 144 has a clearance hole 1440 to allow a portion of the movable component 143 to be exposed, ensuring that the movable component 143 can move normally under the drive of the conveyor belt. When the material distribution drive mechanism 13 is working, the motor 142 rotates normally and drives the conveyor belt to move. The movable component 143 moves with the conveyor belt, thereby driving the material distribution component 12 to move.

[0116] The guide member 11 includes a first guide portion 112 and a second guide portion 113. The gap between the first guide portion 112 and the second guide portion 113 forms a connection port 110. The length of the first guide portion 112 is equal to the length of the second guide portion 113. The first guide portion 112 and the second guide portion 113 are installed at the upper edge of the linear guide rail 16. The material distribution member 12 is disposed above the linear guide rail 16. The material distribution member 12 has a groove (not shown in the figure), and the linear guide rail 16 has a protrusion 161. The groove (not shown in the figure) of the material distribution member 12 is engaged with the protrusion 161 of the linear guide rail 16. The material distribution member 12 has four notches 120 on the side near the guide member 11. The length of the material distribution member 12 is greater than the length of the first guide portion 112 or the length of the second guide portion 113. The material dispensing drive mechanism 13 includes a fixed frame 131, a motor 142, a conveyor belt, a movable component 143, and a cover plate 144. The fixed frame 131 is located below and connected to the linear guide rail 16. The motor 142 is mounted on one side of the fixed frame 131, and the conveyor belt is located on the other side of the fixed frame 131 and is driven to move by the motor 142. The movable component 143 is mounted on the conveyor belt and connected to the side of the material dispensing component 12 facing away from the guide component 11. The material dispensing drive mechanism 13 drives the material dispensing component 12 to move along the extension direction of the linear guide rail 16 (that is, the extension direction of the guide component 11), so that the multiple notches 120 of the material dispensing component 12 correspond sequentially to the connection ports 110 of the guide component 11 to receive the molding compound 19 from the vibratory feeder outlet 172, thereby changing the spacing between the four molding compounds 19.

[0117] In this embodiment, the second feeding device 10 may further include a detection element 15 to determine whether the molding compound 19 has entered the notch 120. When the detection element 15 determines that the molding compound 19 has entered the current notch 120, it can control the dispensing element 12 to move to transfer the next molding compound 19. The detection element 15 may be a CCD camera or other image sensor. The detection element 15 is disposed above the dispensing element 12 and is mounted on a fixed seat located below the feeding track 171 of the vibratory feeder 17 via a support plate. The detection element 15 determines whether the molding compound 19 has entered the notch 120.

[0118] like Figures 14 to 16As shown, the adhesive removal base of the adhesive removal equipment is used to support the flipping device 50 and the adhesive removal device 60. The flipping device 50 has a conveyor belt 52, a flipping frame 53 and a flipping drive mechanism 55. The conveyor belt 52 is used to support the plastic-sealed lead frame 37 and transport it to the flipping frame 53. The conveyor belt 52 includes two parallel belt bodies. The flipping frame 53 is located between the two adjacent belt bodies, which makes the equipment structure compact. It is located inside the conveyor belt 52 and does not occupy the extra space of the conveyor belt 52. It also helps to balance the position of the lead frame 37 in the slot 531, so that the slot 531 is located in the middle position of the lead frame 37, which is conducive to the stable flipping of the lead frame 37.

[0119] like Figure 17 As shown, specifically, one end of the flipping frame 53 is provided with a slot 531 for inserting the lead frame 37, and the other end of the flipping frame 53 is provided with a flipping shaft. The flipping drive mechanism 55 is connected to the flipping shaft. The flipping frame 53 rotates around the flipping shaft under the drive of the flipping drive mechanism 55, that is, the flipping frame 53 can rotate in the vertical direction relative to the conveyor belt 52. When slot 531 is parallel to conveyor belt 52, slot opening 532 of slot 531 faces lead frame 37 on conveyor belt 52 in the conveying direction. That is, slot opening 532 faces the opposite direction of conveyor belt 52. Lead frame 37 is transported forward by conveyor belt 52 into slot opening 532. Then flipping frame 53 rotates and stands up, causing lead frame 37 to leave conveyor belt 52 and rotate with slot 531. After flipping frame 53 rotates about 180° in the vertical direction, slot opening 532 rotates to face the conveying direction of conveyor belt 52 and slot 531 is parallel to conveyor belt 52. At this time, lead frame 37 is placed on conveyor belt 52 again and moves away from slot 531 with conveyor belt 52. Then flipping frame 53 rotates in the opposite direction to return to its original position so as to receive the next lead frame 37 for flipping.

[0120] As a preferred embodiment, the flipping device 50 also includes a limiting stop 54 located below the flipping frame 53. When the slot 531 is parallel to the conveyor belt 52, the lower part of the flipping frame 53 is supported on the limiting stop 54 to limit the rotation position of the slot 531 and prevent excessive rotation from damaging the lead frame 37.

[0121] In some embodiments of the present invention, the flipping frame 53 includes two coaxially rotating rods located between two adjacent belts. The two rods are respectively adjacent to the two belts, and each rod is provided with a slot 531, so that the slot 531 is as close as possible to the belt, and the slot 531 can have a larger width, which is beneficial to the stable positioning of the lead frame 37 relative to the flipping frame 53. At the same time, using two rods instead of a plate helps to reduce the structural weight without affecting the positioning and flipping of the lead frame 37.

[0122] like Figure 2 ,15 As shown in Figure 18, in some embodiments of the present invention, the material rack 100 is designed with several horizontally arranged frame discharge ports 101. The hot-pressing mold of the molding device 40 is provided with mold cavities corresponding one-to-one with the frame discharge ports 101. An injection channel is provided between two adjacent mold cavities. After molding is completed, the central injection port connects the lead frames 37 together. Therefore, two lead frames 37 need to be processed simultaneously each time. The first unloading device 51 has a robotic arm 511 and several material picking robotic claws 512 provided at the end of the robotic arm 511. That is, the first unloading device 51 can grab multiple lead frames 37 in the hot-pressing mold and place them on the flipping device 50. The robotic arm 511 of the first unloading device 51 is controlled by the robotic arm lifting mechanism 513 to move up and down relative to the conveyor belt 52, thereby placing the lead frame on the picking robotic claw 512 onto the conveyor belt 52. The robotic arm lifting mechanism 513 is controlled by the robotic arm linear motion module 514 to move in the conveying direction of the conveyor belt, thereby grabbing the lead frame 37 in the sealing device 40 and placing it onto the conveyor belt 52.

[0123] like Figures 15 to 17 As shown, a conveyor belt linear movement module 58 is installed on the top surface of the adhesive base 61. The conveyor belt 52 is set on the support frame 56. The support frame 56 is slidably supported on the conveyor belt linear movement module 58 by the base 57. The movement direction of the conveyor belt linear movement module 58 is perpendicular to the conveying direction of the conveyor belt 52 (the conveying direction of the conveyor belt 52 is longitudinal, that is, the conveyor belt linear movement module 58 can drive the conveyor belt to move laterally), so that the conveyor belt 52 can move as a whole, so as to convey the lead frame 37 to different positions. The picking mechanical claws 512 of the first unloading device 51 are arranged side by side in the movement direction of the conveyor belt linear movement module 58. By moving the conveyor belt 52 laterally through the conveyor belt linear movement module 58, the conveyor belt 52 corresponds to different picking mechanical claws 512, thereby receiving the lead frame 37 on different picking mechanical claws 512.

[0124] The flipping drive mechanism 55 is a flipping motor. The rotating shaft of the flipping frame 53 is rotatably mounted on the support frame 56. The flipping motor drives the rotating shaft to rotate via the transmission belt 551. The flipping motor is fixed relative to the support frame 56, thereby causing the flipping frame 53 to move together with the conveyor belt 52. The transmission belt 551 is located between the two rods of the flipping frame 53. The flipping frame 53 is located on the unloading end side of the conveyor belt 52 to facilitate the unloading of the lead frame 37 after flipping. The flipped lead frame 37 is transported by the second unloading device 62 to the de-adhesive removal device 60 for de-adhesive removal.

[0125] like Figures 19 to 20As shown, the adhesive removal device 60 includes an adhesive flushing platform and an upper adhesive removal mold 63 that moves up and down relative to the flushing platform. The flushing platform is provided with a lower adhesive removal mold 64 for support below the lead frame. The lower adhesive removal mold 64 has a through groove 641 corresponding to the residual adhesive 103 at the injection gate of the lead frame. The upper adhesive removal mold 63 has an adhesive flushing protrusion 631 corresponding to the through groove 641. The protrusion is a thin blade-shaped protrusion that can pass through the through groove 641 to push out the residual adhesive 103 in the through groove 641, and then detach it from the lead frame 37. Although there are still some thin residual adhesives connecting the residual adhesive 103 at the injection gate to the chip's plastic encapsulation shell 104, these thin residual adhesives are very thin, so they will break when the residual adhesive is pushed away, causing the residual adhesive to fall off. In this embodiment, the upper adhesive removal mold is controlled to move up and down by a lifting cylinder.

[0126] The glue-punching platform is equipped with a first photoelectric sensor 651 for detecting whether a lead frame 37 is placed above the glue-removing lower mold 64, and a second photoelectric sensor 652 for detecting the height of the lead frame. Each first photoelectric sensor 651 is used to detect whether a lead frame 37 is placed on one glue-removing lower mold 64, and the second photoelectric sensor 652 is used to detect whether the height of the lead frames on all glue-removing lower molds 64 exceeds the set height limit. If the height exceeds the preset limit, it indicates that either the lead frame 37 is placed incorrectly or the robot arm is excessively grabbing the lead frame 37, resulting in more than one lead frame 37 being placed on the top surface of the glue-removing lower mold 64.

[0127] The channel 641 is connected to the residual glue falling channel 66 below. A residual glue collection bin 67 is provided below the lower end of the residual glue falling channel 66, so that the flushed residual glue 103 falls into the residual glue falling channel 66 and rolls into the residual glue collection bin 67 for collection. The flushing table is equipped with a sweeping air device and a dust collection device facing the glue removal mold 64. The sweeping air device includes several air jet pipes 68 located on one end of the glue removal mold 64. The dust collection device includes a dust collection hood 69 located on the other end of the glue removal mold 64 opposite to the air jet pipes 68. The dust collection hood 69 is connected to the dust collection device. The air jet pipes 68 blow air towards the glue removal mold 64 to blow away debris and other debris on the glue removal mold 64, so that the dust collection device can suck it away.

[0128] like Figure 15 , 16As shown, in some embodiments of the present invention, the fully automated packaging system further includes a receiving device 70 and a third unloading device 71. The third unloading device 71 is capable of transporting the de-adhesive-removed lead frame 37 from the de-adhesive removal device 60 to the receiving device 70. The receiving device 70 has a receiving platform 72 and a lifting drive mechanism. The receiving platform 72 is used to place the stacked support pieces 73 of the lead frame 37. The lifting drive mechanism is connected to the receiving platform 72. Under the drive of the lifting drive mechanism, the receiving platform 72 adjusts the height of the support pieces 73 to match the unloading height of the third unloading device 71. When the material support plate 73 is empty, the lifting drive mechanism controls the material support plate 73 to remain in a high position. As the lead frame 37 is gradually stacked, the lifting drive mechanism controls the material support plate 73 to gradually move down. When the third unloading device 71 releases the lead frame 37, the internal height of the material support plate 73 is adapted to the position where the third unloading device 71 places the lead frame 37. This prevents the lead frame 37 from falling from a height or interfering with the lead frames already stacked inside the material support plate 73. The lead frame 37 is placed stably in the material support plate 73, effectively protecting the lead frame.

[0129] It should be noted that both the second unloading device 62 and the third unloading device 71 employ mechanical grippers. The function of the second unloading device 62 is to transport the flipped lead frame 37 to the glue-removing table for glue removal. The function of the third unloading device 71 is to transport the lead frame 37 from the glue-removing table into the material support plate 73. The second unloading device 62 and the third unloading device 71 can be selected from existing robotic arm structures to achieve the same function. This invention does not impose any special restrictions on them.

[0130] like Figures 21 to 23As shown, in some preferred embodiments of the present invention, the packaging device 2 further includes a cleaning device for cleaning the upper mold and / or lower mold of the sealing device 40. The cleaning device 41 includes: a dust hood 411, a brush 412, a power component 413, at least one air blowing pipe 414, an air extraction pipe 415, and a cleaning drive mechanism 416. The brush 412 is installed inside the dust hood 411. The top and bottom surfaces of the dust hood 411 are open. The bottom end of the brush 412 extends beyond the bottom surface of the dust hood 411, and the top end of the brush 412 extends beyond the top surface of the dust hood 411, to ensure the rotation process of the brush 412. The brush 412 can contact the upper and lower molds of the sealing device 40. The power component 413 drives the brush 412 to rotate. The power component 413 can be a motor or the like. The air blowing pipe 414 is connected to an air pump. Air is blown outward through the air blowing pipe 414 to remove sealing debris from the mold surface. The air blowing pipe 414 has multiple air blowing holes arranged along its axial direction. In actual use, at least two air blowing pipes 414 can be designed. One air blowing pipe 414 has its air blowing holes tilted downwards to blow out debris from the lower mold surface of the sealing device, and the other air blowing pipe 414 has its air blowing holes tilted upwards to blow out debris from the upper mold surface of the sealing device 40. The suction pipe 415 is connected to the inner cavity of the dust removal hood 411. The function of the suction pipe 415 is to draw air from the inner cavity of the dust removal hood 411 to create a negative pressure environment, causing the debris swept out by the brush 412 and the air blowing pipe 414 to be sucked into the dust removal hood 411 and then extracted outward through the suction pipe 415. The dust removal hood 411, brush 412, power component 413, air blowing pipe 414 and air extraction pipe 415 are assembled together to form a dust removal mechanism with a cleaning function. The dust removal mechanism is driven by the cleaning drive mechanism 416 to move. After the dust removal mechanism moves at least one back and forth between the upper and lower molds of the sealing device 40, it returns to the starting position, and the cleaning work is completed.

[0131] It should be noted that the encapsulation device 40 and the cleaning device 41 are arranged in a horizontal straight line, which can prevent the cleaning device 41 from interfering with the loading or unloading of the encapsulation device 40, and can make full use of the horizontal installation space of the encapsulation equipment 2. In order to ensure that the lower mold of the encapsulation device 40 can match the height of the brush 412, after the encapsulation device 40 completes the encapsulation, the upper and lower molds of the encapsulation device 40 are opened, the adhesive removal device 3 removes the lead frame 37, the lower mold of the encapsulation device 40 rises to a certain height, and the cleaning drive mechanism 416 then pushes the dust removal mechanism to move horizontally between the upper and lower molds for cleaning. Of course, in practical applications, the height of the dust removal mechanism can also be adjusted to match the upper and lower molds of the encapsulation device 40, or the height of the upper mold can be adjusted to match the dust removal mechanism, so that when the dust removal mechanism moves horizontally between the upper and lower molds of the encapsulation device 40, the top end of the brush 412 can contact the upper mold and the bottom end can contact the lower mold. This invention does not impose special restrictions on the height adjustment method.

[0132] like Figure 1 , 3As shown in Figure 15, for ease of understanding, the workflow of the fully automated packaging system will be described in detail below in conjunction with actual application scenarios.

[0133] When waiting for materials, the two cantilever 223 of the material rack transfer device 20 are in the lower position, placing the material rack 100 on the preheating table 202.

[0134] It should be noted that the material rack 100 is equipped with a frame feeding port 101 for placing the lead frame and a feeding cylinder 102 for placing the molding compound. The material rack 100 is also equipped with a heat insulation block to insulate the feeding cylinder 102 and prevent heat from being quickly transferred to the molding compound 19. This is because the molding compound 19 cannot be preheated before molding, as heating it will cause a chemical reaction, and prolonged heating will affect the packaging quality. The preheating station 202 mainly preheats the lead frame 37, causing it to expand to the same size as the molding mold.

[0135] The first clamping mechanism 34 (e.g., a loading mechanical claw) begins to clamp the lead frame 37 one by one and transfer it to the frame unloading port 101 on the material rack 100 to preheat the lead frame 37 on the preheating table 202. After all the frame unloading ports 101 on the material rack 100 have placed the lead frame 37, the second clamping mechanism 18 (e.g., a cylinder gripper) begins to clamp the molding compound 19 and feed it into the feeding cylinder 102 on the material rack 100.

[0136] After the material feeding cylinder 102 on the material rack 100 is filled with molding compound 19, the material rack lifting mechanism drives the two cantilever arms 223 to rise together with the material rack 100, lifting the preheated lead frame 37 and the filled molding compound 19 away from the preheating table 202. Next, the translation mechanism drives the two cantilever arms 223 and the material rack 100 to move horizontally together, sending the material rack 100, lead frame 37 and molding compound 19 together to the processing station (i.e., the mold cavity of the molding device). Then, the material rack lifting mechanism drives the two cantilever arms 223 and the material rack 100 to fall together, so that the material rack 100 is accurately aligned with the hot pressing mold of the molding device 40.

[0137] Four small cylinders located at the four corners of the material rack 100 are activated to pull out the frame support plate on the material rack 100 that supports the lead frame 37, causing the lead frame 37 to fall into the hot press mold (the hot press mold is equipped with positioning pins to align with the positioning holes on the lead frame 37). After all the lead frames 37 on the material rack 100 have fallen, two cylinders located on the side of the material rack 100 are activated to move the baffle that supports the molding compound 19, causing the molding compound 19 to fall into the material cavity in the hot press mold.

[0138] Once the feeding process is complete, the material rack lifting mechanism drives the two cantilever arms 223 and the material rack 100 to rise together. The material rack translation mechanism also drives the two cantilever arms 223 and the material rack 100 to translate together, so that the material rack 100 returns to the initial position of the preheating table 202 – the feeding station.

[0139] The molding device 40 initiates the mold closing action, the upper and lower molds close together, and the hydraulic cylinder drives the injection head in the hot-pressing lower mold to begin injection molding. The mold cavity of the hot-pressing lower mold is equipped with injection channels. The molten molding material flows along the injection channels to the area where the chip is located, forming protruding molding shells on the front side of the lead frame. The chip is encapsulated in the molding shells. After injection molding, residual glue will be left at the injection gate of the lead frame. The residual glue is located on the front side of the lead frame. Therefore, after injection molding, the lead frame needs to be flipped over so that the glue removal device can be inserted from the back of the lead frame to break off the residual glue from the lead frame.

[0140] The molding device 40 starts the mold opening action, the upper and lower molds open, the material picking mechanical claw 512 of the first unloading device 51 moves to the processing station (i.e. the mold cavity of the molding device), and then moves down to grab the molded lead frame 37. After grabbing, the material picking mechanical claw 512 of the first unloading device 51 retracts to directly above the conveyor belt 52, and then moves down to place the lead frame 37 on the conveyor belt 52. The conveyor belt 52 transports the lead frame 37 to the flipping frame 53. Then, the front end of the lead frame 37 is inserted into the slot 532 of the flipping frame 53. Then, the flipping motor drives the flipping frame 53 to rotate until the back of the lead frame 37 is placed on the conveyor belt 52 with its back facing up. The lead frame 37 moves away from the slot 531 with the movement of the conveyor belt 52 until the lead frame 37 moves to the unloading position.

[0141] The mechanical claw of the second unloading device 62 moves to the unloading position, then moves down to grab the flipped lead frame 37. The mechanical claw then moves up and moves the lead frame 37 directly above the glue-removing lower mold 64, then moves down to place the lead frame 37 on the glue-removing lower mold 64. The mechanical claw of the second unloading device 62 then retracts and exits the glue-punching platform. The glue-removing device 60 initiates the glue-removing action. The glue-removing upper mold 63 moves down, and the glue-punching protrusion 631 penetrates the through groove 641 of the glue-removing lower mold 64, breaking off the excess glue 103 on the lead frame 37. The excess glue 103 falls into the excess glue recycling bin 67 along the excess glue falling channel 66.

[0142] The upper mold 63 for degumming moves upward, and the mechanical claw of the third unloading device 71 moves to directly above the lower mold 64 for degumming. Then it moves downward to grab the degummed lead frame 37. Subsequently, the mechanical claw of the third unloading device 71 moves upward and moves the lead frame 37 directly above the support plate 73. Then it moves downward to place the lead frame 37 inside the support plate 73. Then the mechanical claw of the third unloading device 71 moves upward to prepare to grab the next lead frame 37.

[0143] This invention proposes a fully automated packaging system, specifically designed according to the chip molding process. It integrates feeding equipment, packaging equipment, and adhesive removal equipment into a fully mechanized packaging system. The feeding equipment can automatically complete the batch feeding of lead frames and molding compound, while the adhesive removal equipment can automatically complete the flipping and adhesive removal of lead frames. Both the feeding and adhesive removal equipment are perfectly integrated with the packaging equipment, realizing highly efficient and intelligent processing from feeding, packaging, flipping, adhesive removal, and unloading, significantly improving production efficiency and finished product quality.

[0144] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A fully automated packaging system comprising: The feeding device, the packaging device and the glue removing device are arranged in a straight line, the feeding device comprises a rack, a rack moving device, a first feeding device and a second feeding device, the packaging device comprises a plastic packaging device, the glue removing device comprises a first discharging device, a turning device, a second discharging device and a glue removing device; The first feeding device is used for feeding the lead frame into the frame discharging port of the rack, the second feeding device is used for outputting the plastic packaging material and feeding the plastic packaging material into the feeding cylinder of the rack, and the rack moving device can move the rack with the lead frame and the plastic packaging material along a straight line from the feeding device to the mold cavity of the plastic packaging device; The first discharging device can move the lead frame after plastic packaging along a straight line from the mold cavity of the plastic packaging device to the turning device, the turning device is used for turning the back of the lead frame upward, and the second discharging device can move the lead frame after turning along a straight line from the turning device to the glue removing device.

2. The fully automated packaging system of claim 1, wherein, The rack moving device comprises a rack translation mechanism and a rack lifting mechanism; The rack translation mechanism comprises two guide structures arranged on both sides of the rack and a moving frame movably arranged between the two guide structures; The rack lifting mechanism is connected to the moving frame and the rack respectively, and comprises a rotating shaft arranged on the moving frame, two eccentric bearings arranged at both ends of the rotating shaft, two support seats fixedly arranged on the moving frame and used for supporting the two eccentric bearings, two cantilever arms arranged at intervals, and a rotating driving module used for driving the rotating shaft to rotate, a first end of each cantilever arm is movably sleeved on the rotating shaft and close to the corresponding eccentric bearing, and a second end of each cantilever arm is fixedly connected to the rack, and the bottom of each eccentric bearing is arranged on the support seat below; The moving frame is provided with two guide seats corresponding to the two cantilever arms, each guide seat comprises a vertical guide rail fixedly arranged on the moving frame and a movable plate movably arranged on the vertical guide rail, and the movable plate is further fixedly connected to the first end of the corresponding cantilever arm.

3. The fully automated packaging system of claim 1, wherein, The first feeding device comprises a feeding table, a pushing mechanism, a feeding mechanism and a first clamping mechanism; The feeding table is used for placing the material box in which the lead frames are stacked and placed; The pushing mechanism is used for pushing the lead frames in the material box to the feeding mechanism in sequence; The feeding mechanism is used for conveying the lead frames to a specified position; The first clamping mechanism comprises a feeding mechanical gripper used for feeding the lead frame reaching the specified position to the frame discharging port.

4. The fully automated packaging system of claim 3, wherein, The feeding table comprises an upper layer region, a lower layer region and a material box lifting mechanism; The upper layer region is used for placing the full material box, and the upper layer region is provided with a first material box pushing mechanism used for pushing the full material box to the material box lifting mechanism; The lower layer region is used for placing the empty material box, and the lower layer region is provided with a second material box pushing mechanism used for pushing the empty material box away from the material box lifting mechanism; A material box lifting mechanism is installed on one side of the upper layer and the lower layer, and is located between the material pushing mechanism and the material feeding mechanism. The material box lifting mechanism adjusts the height position of the full material box, so that the opening at one end of the material box faces the pushing claw of the material pushing mechanism, and the opening at the other end faces the material feeding mechanism.

5. The fully automated packaging system of claim 3, wherein, The material feeding mechanism has a positioning seat, a material feeding belt, and a limiting block. The positioning seat includes two positioning side plates, and the lead frame is located between the two positioning side plates. The top of each positioning side plate is provided with a gap for cooperation with the feeding mechanical claw. The material feeding belt is installed on the inner side of the positioning seat, and the lead frame is placed on the material feeding belt. The top surface of the material feeding belt is higher than the bottom surface of the gap. The limiting block is installed at the end of the material feeding belt. The material feeding belt can transport the lead frame to the limiting block.

6. The fully automated packaging system of claim 1, wherein, The second feeding device has a vibrating disc, a guide, a material distributing member, a material distributing driving mechanism, and a second clamping mechanism. The vibrating disc has a feeding track and a discharging port at the end of the feeding track. The guide is provided with a connecting port corresponding to the discharging port. The material distributing member is movably arranged on one side of the guide. The side of the material distributing member close to the guide is provided with a plurality of notches corresponding to the plurality of clamping units on the second clamping mechanism. The material distributing driving mechanism is connected with the material distributing member. The material distributing member moves along the extension direction of the guide under the driving of the material distributing driving mechanism, so that the plurality of notches correspond to the connecting port in sequence to receive the plastic package material from the discharging port of the vibrating disc. The second clamping mechanism has a plurality of clamping units for synchronously conveying the plastic package material in the notches to the feeding cylinder.

7. The fully automated packaging system of claim 1, wherein, The turning device has a conveying belt, a turning frame, and a turning driving mechanism. The conveying belt is used to support the lead frame after plastic package and transport the lead frame to the turning frame. The conveying belt includes two parallel belt bodies. The turning frame is located between the two belt bodies. One end of the turning frame is provided with a slot for inserting the lead frame. When the slot is parallel to the conveying belt, the slot opening faces the lead frame on the conveying belt in the conveying direction. The other end of the turning frame is provided with a turning shaft. The turning frame can rotate relative to the conveying belt, so that the back of the lead frame faces upward. The turning driving mechanism is connected with the turning shaft. The turning frame rotates around the turning shaft under the driving of the turning driving mechanism.

8. The fully automated packaging system of claim 7, wherein, The first discharging device has at least two parallel material taking mechanical claws for grabbing the lead frame. The conveying belt is arranged on a support frame, and the support frame is arranged on a conveying belt linear movement module. The movement direction of the conveying belt linear movement module is perpendicular to the conveying direction of the conveying belt. The material taking mechanical claws of the first discharging device are arranged in parallel in the conveying direction of the conveying belt.

9. The fully automated packaging system of claim 1, wherein, The glue removing device has a glue punching table, a glue removing upper die, and a glue removing lower die. The glue punching table is used to install the glue removing lower die. The glue-removing lower mold is arranged below the lead frame and provided with through grooves corresponding to the excess glue of the lead frame; The glue-removing upper mold is provided with glue-removing protrusions vertically aligned with the through grooves.

10. The fully automated packaging system of claim 9, wherein, Further comprising: A material collecting device and a third discharging device, which can carry the lead frame after glue removal from the glue-removing device to the material collecting device; The material collecting device is provided with a material collecting table for placing a material supporting sheet on which the lead frames are stacked, and a lifting driving mechanism connected with the material collecting table, which adjusts the height of the material supporting sheet under the driving of the lifting driving mechanism to match the discharging height of the third discharging device.

11. The fully automated packaging system of claim 1, wherein, The packaging equipment is further provided with a cleaning device for cleaning the upper mold and / or lower mold of the plastic packaging device, which comprises a dust removal cover, a brush installed in the dust removal cover, a power member for driving the brush to rotate, at least one air blowing pipe connected with the dust removal cover, an air suction pipe communicated with the inner cavity of the dust removal cover, and a cleaning driving mechanism for driving the dust removal cover to move.

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