Screen plate, windowing method of screen plate and preparation method of printed circuit board

Abstract

The invention provides a screen plate, a windowing method of the screen plate and a preparation method of a printed circuit board, and relates to the technical field of preparation of the printed circuit board. The mesh plate comprises mesh holes arranged in an array, and the mesh holes are used for a curing medium to pass through and form a curing medium structure on the initial printed circuit board. The curing medium structure forms a thickness compensation effect and a protection effect on the metal layer of the sunken part in the thickness direction of the initial printed circuit board, and the stress of a grinding tool is dispersed through the curing medium structure in the grinding process of the initial printed circuit board so as to prevent the metal layer from being abraded, so that the preparation yield of the printed circuit board is ensured, and the production cost is reduced. The preparation difficulty of the printed circuit board is reduced, the preparation process of the printed circuit board is simplified, and the production cost of the printed circuit board is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board preparation, and in particular to a stencil, a stencil windowing method, and a printed circuit board preparation method. Background Art

[0002] With the continuous development of electronic circuit integration technology, higher requirements are also put forward for the manufacturing technology of printed circuit boards.

[0003] In related technologies, the connection circuits in a printed circuit board are electrically connected through conductive holes. During the preparation of the printed circuit board, a resin plugging process and / or an electroplating filling process need to be performed on the initial printed circuit board, and then the initial printed circuit board is ground. During the grinding process, the metal layer of the conductive holes on the initial printed circuit board is prone to wear, resulting in a poor yield of the printed circuit board preparation. Summary of the Invention

[0004] The present application provides a stencil, a stencil windowing method, and a printed circuit board preparation method to at least solve the problem of poor yield in the preparation of printed circuit boards in related technologies.

[0005] In a first aspect, the present application provides a stencil for mating connection with an initial printed circuit board to prepare a printed circuit board, and the initial printed circuit board has a recessed portion;

[0006] The stencil has a plurality of mesh holes that penetrate through opposite sides of the stencil along the thickness direction of the stencil; the mesh holes are used for the curing medium to pass through;

[0007] At least a part of the mesh holes are arranged in a circular array and form at least one circular array structure;

[0008] When the stencil and the initial printed circuit board are mated and connected, the positive projection of the circular array structure on the plane where the initial printed circuit board is located is located on at least a part of the outer peripheral side of the recessed portion, and there is a distance between the circular edge of the positive projection of the circular array structure and the edge of the recessed portion. The curing medium passes through the mesh holes and cures at the positions corresponding to the mesh holes on the initial printed circuit board to form a curing medium structure on the initial printed circuit board.

[0009] Through the arrangement of multiple mesh holes in an array in this application, the arrangement of the mesh holes on the mesh plate is regular, which is convenient for the processing of the mesh plate. Also, when the mesh plate is matched with the initial printed circuit board, the orthographic projection of the annular array structure on the plane where the initial printed circuit board is located is on the outer peripheral side of the recess. In this way, the curing medium passes through the mesh holes to form a curing medium structure on the initial printed circuit board. Along the thickness direction of the initial printed circuit board, the curing medium structure forms a thickness compensation effect and a protection effect on the metal layer of the recess, so that during the grinding process of the initial printed circuit board, the stress of the grinding tool can be dispersed through the curing medium structure, thus avoiding the wear of the metal layer, ensuring the yield rate of the preparation of the printed circuit board, reducing the difficulty of the preparation of the printed circuit board, simplifying the preparation process of the printed circuit board, and reducing the production cost of the printed circuit board.

[0010] In a second aspect, this application provides a method for opening windows on a mesh plate for preparing the mesh plate provided in the first aspect; the window opening method includes:

[0011] Obtain a first parameter set of the recess on the initial printed circuit board;

[0012] Determine a second parameter set of the window opening positions according to the first parameter set;

[0013] Open windows on the substrate to form mesh holes according to the first parameter set and the second parameter set.

[0014] The mesh plate window opening method provided in this application combines the structure and preparation requirements of the printed circuit board to adapt the same type of printed circuit board through such a mesh plate, ensuring the yield rate and preparation efficiency of the preparation of the printed circuit board.

[0015] In a third aspect, this application provides a method for preparing a printed circuit board, which uses the mesh plate provided in the first aspect and an initial printed circuit board in cooperation to prepare a printed circuit board; the preparation method includes:

[0016] Use the mesh plate to form a curing medium structure on the initial printed circuit board with a recess;

[0017] Grind the initial printed circuit board formed with the curing medium structure to remove the curing medium structure;

[0018] Post-process the ground initial printed circuit board to form a printed circuit board.

[0019] The method for preparing a printed circuit board provided in this application uses the mesh plate provided in the first aspect to form a curing medium structure on the periphery of the recess of the initial printed circuit board, so as to protect the recess through the curing medium structure, prevent the metal layer of the recess from being damaged by grinding, and improve the yield rate and preparation efficiency of the preparation of the printed circuit board. Description of the Drawings

[0020] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 It is a top view of a stencil provided by an embodiment of the present application;

[0022] Figure 2 It is a schematic diagram of the cooperation between the stencil and the initial printed circuit board provided by an embodiment of the present application;

[0023] Figure 3 It is a schematic diagram of the cured medium structure on the initial printed circuit board provided by an embodiment of the present application;

[0024] Figure 4 It is a flowchart of the window opening method of the stencil provided by an embodiment of the present application;

[0025] Figure 5 It is a flowchart of the manufacturing method of the printed circuit board provided by an embodiment of the present application;

[0026] Figure 6 It is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0027] Among them, the above-mentioned drawings include the following reference numerals:

[0028] 100 - Stencil;

[0029] 101 - Mesh hole;

[0030] 1011 - First mesh hole;

[0031] 1012 - Second mesh hole;

[0032] 102 - Ring - shaped array structure;

[0033] 1021 - First ring - shaped array structure;

[0034] 1022 - Second ring - shaped array structure;

[0035] 200 - Initial printed circuit board;

[0036] 201 - Depression;

[0037] 202 - Cured medium structure. Detailed implementation manners

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0039] It should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. The terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal values is less than or equal to 5% of either of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood in specific situations.

[0040] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0041] The initial printed circuit board has a recess. The recess includes a metal groove, a metal hole, etc. The metal hole can be a through hole or a blind hole, and the embodiments of the present application do not limit this.

[0042] During the process of manufacturing a printed circuit board, it is necessary to drill holes in the initial printed circuit board and electroplate a metal layer to form recesses. The initial printed circuit board with recesses needs to undergo resin plugging of holes and / or electroplating to fill the holes, and then the surface of the initial printed circuit board is ground. However, during the grinding process, the grinding equipment is likely to damage the metal layer of the recesses, resulting in a poor yield of the printed circuit board manufacturing.

[0043] In the related art, to solve such problems, the initial printed circuit board after grinding is drilled and electroplated again. However, this will cause the manufacturing process of the printed circuit board to be complex, the manufacturing efficiency to decrease, and the manufacturing cost to increase. Moreover, the thickness of the metal layer of the recesses increases after multiple electroplating, which will also cause difficulties in processing the connection circuits on the surface layer of the initial printed circuit board. In some manufacturing operations, it is also necessary to thin the metal layer of the recesses, which will also lead to an increase in the manufacturing difficulty of the printed circuit board and a decrease in the manufacturing yield.

[0044] To solve the above problems, in combination with Figure 1 、 Figure 2 and Figure 3 ,an embodiment of the present application provides a stencil 100 for mating and connecting with an initial printed circuit board 200 to manufacture a printed circuit board. The stencil 100 has a plurality of mesh holes 101, and the mesh holes 101 penetrate through the opposite sides of the stencil 100 along the thickness direction of the stencil 100; the mesh holes 101 are used for the cured medium to pass through; at least some of the mesh holes 101 are arranged in a circular array and form at least one circular array structure 102.

[0045] When the stencil 100 and the initial printed circuit board 200 are mated and connected, the positive projection of the circular array structure 102 on the plane where the initial printed circuit board 200 is located is located on at least a part of the outer peripheral side of the recess 201, and there is a distance between the circular edge of the positive projection of the circular array structure 102 and the edge of the recess 201. The cured medium passes through the mesh holes 101 and is cured at the positions corresponding to the mesh holes 101 on the initial printed circuit board 200 to form a cured medium structure 202 on the initial printed circuit board 200.

[0046] It should be noted that the number of the mesh holes 101 in the embodiment of the present application can be two, three, four, etc. The embodiment of the present application does not limit the specific number of the mesh holes 101. Along the thickness direction of the stencil 100, the mesh holes 101 can be straight holes or inclined holes and penetrate through the opposite sides of the stencil 100, so that the cured medium can be connected to the initial printed circuit board 200 through the mesh holes 101 when the stencil 100 and the initial printed circuit board 200 are mated.

[0047] Among them, at least some of the meshes 101 are arranged in an array to form at least one annular array structure 102. Exemplarily, three meshes 101 can be arrayed to form an annular array structure 102, or six meshes 101 can be arrayed to form an annular array structure 102, etc., and there is no limitation thereto. The number of the annular array structures 102 can be one, two, three, four, etc., and there is no limitation to the number of the annular array structures 102.

[0048] It should be noted that the contour shape of the annular array structure 102 can be a polygonal annular contour, a circular contour, etc., and there is no limitation thereto.

[0049] In this way, through the arrangement of multiple meshes 101 arranged in an array, the arrangement of the meshes 101 on the mesh plate 100 is regular, which is convenient for the processing of the mesh plate 100. When the mesh plate 100 is matched with the initial printed circuit board 200, the orthographic projection of the annular array structure 102 on the plane where the initial printed circuit board 200 is located is located on the outer peripheral side of the recess 201. In this way, the curing medium passes through the meshes 101 to form a curing medium structure 202 on the initial printed circuit board 200. Along the thickness direction of the initial printed circuit board 200, the curing medium structure 202 has a thickness compensation effect and a protection effect on the metal layer of the recess 201, so that during the grinding process of the initial printed circuit board 200, the stress of the grinding tool can be dispersed through the curing medium structure 202, and the wear of the metal layer can be avoided, thereby ensuring the preparation yield of the printed circuit board, reducing the preparation difficulty of the printed circuit board, simplifying the preparation process of the printed circuit board, and reducing the production cost of the printed circuit board.

[0050] In the embodiment of the present application, when there is one recess 201, when the mesh plate 100 and the initial printed circuit board 200 are cooperatively connected, the annular array structure 102 surrounds the outer periphery of the recess 201, and there is a spacing between the inner ring edge of the annular array structure 102 and the edge of the recess 201. When there are multiple recesses 201, for the convenience of those skilled in the art to understand the solution in the embodiment of the present application, two adjacent recesses 201 among the multiple recesses 201 are respectively defined as a first recess and a second recess. The annular array structure 102 is located between the first recess and the second recess. At this time, there is a spacing between the inner ring edge of the annular array structure 102 and the edge of the first recess, and there is a spacing between the outer ring edge of the annular array structure 102 and the second recess.

[0051] See Figure 1 , in some embodiments, the number of the annular array structures 102 is multiple, and the multiple annular array structures 102 extend along the extending direction of the plate surface of the mesh plate 100 and are sleeved and arranged with a first span.

[0052] Thus, the arrangement of the mesh holes 101 on the stencil 100 is regular. Through the annular array structure 102 arranged in equal intervals, the mesh holes 101 can be formed on the stencil 100 by a single windowing process, which facilitates the preparation of the stencil 100 and helps improve the preparation efficiency of the stencil 100. Moreover, during the preparation of the printed circuit board, the stencil 100 and the initial printed circuit board 200 cooperate with each other. By filling the curing medium once, the curing medium structure 202 can be formed on the initial printed circuit board 200 around the circumferential side of the recess 201 and between adjacent recesses 201, so that all the recesses 201 can be protected during the grinding operation, avoiding the wear of the metal layer of the recess 201, thereby improving the preparation yield and preparation efficiency of the printed circuit board.

[0053] It should be noted that, for the convenience of those skilled in the art to understand the technical solutions provided by the embodiments of the present application, two adjacent annular array structures 102 are respectively defined as the first annular array structure 1021 and the second annular array structure 1022. Among them, the second annular array structure 1022 is sleeved outside the first annular array structure 1021 along the extending direction of the plate surface of the stencil 100. The linear distance between the outer edge of the ring of the first annular array structure 1021 and the inner edge of the ring of the second annular array structure 1022 is the first span.

[0054] See Figure 1 , optionally, in each annular array structure 102, at least a partial number of the mesh holes 101 are arranged with a second span along the circumferential direction of the corresponding annular array structure 102.

[0055] For the convenience of those skilled in the art to understand the technical solutions provided by the embodiments of the present application, two adjacent mesh holes 101 in the same annular array structure 102 are respectively defined as the first mesh hole 1011 and the second mesh hole 1012. The first mesh hole 1011 and the second mesh hole 1012 are arranged along the circumferential direction of the annular array structure 102. The linear distance between the opposite parts of the outer edges of the first mesh hole 1011 and the second mesh hole 1012 is the second span.

[0056] It can be understood that in the same annular array structure 102, all the mesh holes 101 can be arranged with the second span, or a partial number of adjacent mesh holes 101 can be arranged with the second span, and no requirements are made in this regard.

[0057] To prevent positional interference between the mesh holes 101 and the recessed portions 201, which may lead to the problem of insufficient grinding feed of the initial printed circuit board 200, and to improve the surface flatness of the initial printed circuit board 200 after grinding and the metal layer of the recessed portion 201 to meet the preparation requirements of the subsequent printed circuit board, there is a spacing between the ring edge of the orthographic projection of the annular array structure 102 on the plane where the initial printed circuit board 200 is located and the recessed portion 201.

[0058] Therefore, in the embodiments of the present application, in at least one annular array structure, at least some adjacent mesh holes 101 are arranged at a third span; the third span is greater than the second span. In this way, when the stencil 100 and the initial printed circuit board 200 are matched, the interference between the cured medium structure 202 and the recessed portion 201 on the initial printed circuit board 200 is avoided, facilitating the preparation of the printed circuit board, thereby improving the preparation efficiency and the preparation yield rate of the printed circuit board.

[0059] Optionally, the mesh hole 101 is a circular hole, and the diameter of the mesh hole 101 is 0.3 mm - 1.0 mm.

[0060] Exemplarily, the diameter of the mesh hole 101 can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, etc. Any diameter of the mesh hole 101 that meets the above numerical range is acceptable, and the embodiments of the present application do not specifically limit the diameter of the mesh hole 101.

[0061] When the diameter of the mesh hole 101 is less than 0.3 mm, the difficulty of opening the window of the stencil 100 increases, resulting in a decrease in the preparation efficiency of the stencil 100. Moreover, when the diameter of the mesh hole 101 is too small, the perforation fluidity of the cured medium becomes poor, and the time taken for the cured medium structure 202 to be formed on the initial printed circuit board 200 increases, resulting in a decrease in the preparation efficiency of the printed circuit board. In addition, the thickness of the cured medium structure 202 formed on the initial printed circuit board 200 through such a stencil 100 is uneven and of poor quality, easily causing uneven stress on the initial printed circuit board 200 during the grinding process, and there is a situation where the metal layer of the recessed portion 201 is damaged.

[0062] When the diameter of the mesh hole 101 is greater than 1.0 mm, the density of the cured medium structure 202 formed on the outer periphery of the recessed portion 201 decreases, and the size of the cured medium structure 202 increases, resulting in an increase in the grinding time of the initial printed circuit board 200, and further leading to a decrease in the preparation efficiency of the printed circuit board. Therefore, by selecting the diameter of the mesh hole 101 within the above numerical range in the embodiments of the present application, the preparation efficiency of the printed circuit board can be improved.

[0063] In some embodiments, the first span is 0.3 mm - 0.8 mm.

[0064] Exemplarily, the first span can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, etc. Any first span that meets the above numerical range is acceptable, and the embodiments of the present application do not limit this.

[0065] It is not difficult to understand that when the first span is less than 0.3 mm, the density of the mesh holes 101 increases. Correspondingly, the density of the cured medium structure 202 formed by the cured medium on the initial printed circuit board 200 increases. Although it can disperse the grinding force of the grinding tool to prevent damage to the metal layer of the recess 201, it will cause a decrease in the grinding efficiency and lead to a decrease in the production efficiency of the printed circuit board.

[0066] When the first span is greater than 0.8 mm, the density of the mesh holes 101 decreases, increasing the probability of surface contact between the grinding tool and the initial printed circuit board 200. This easily causes wear of the metal layer of the recess 201 and leads to a decrease in the yield rate of the printed circuit board preparation. Therefore, the embodiments of the present application select a reasonable first span to further improve the preparation efficiency of the printed circuit board on the basis of ensuring the yield rate of the printed circuit board.

[0067] In some embodiments, the second span is 0.3 mm - 0.8 mm.

[0068] Exemplarily, the second span can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, etc. Any second span that meets the above numerical range is acceptable, and the embodiments of the present application do not limit this.

[0069] It is not difficult to understand that when the second span is less than 0.3 mm, the density of the mesh holes 101 increases. Correspondingly, the density of the cured medium structure 202 formed by the cured medium on the initial printed circuit board 200 increases. Although it can disperse the grinding force of the grinding tool to prevent damage to the metal layer of the recess 201, it will cause a decrease in the grinding efficiency and lead to a decrease in the production efficiency of the printed circuit board.

[0070] When the second span is greater than 0.8 mm, the density of the mesh holes 101 decreases, increasing the probability of surface contact between the grinding tool and the initial printed circuit board 200. This easily causes wear of the metal layer of the recess 201 and leads to a decrease in the yield rate of the printed circuit board preparation. Therefore, the embodiments of the present application select a reasonable second span to further improve the preparation efficiency of the printed circuit board on the basis of ensuring the yield rate of the printed circuit board.

[0071] See Figure 4 , in a second aspect, the present application can also provide a window opening method for the stencil 100, which is used to prepare the stencil 100 provided in the first aspect; the window opening method includes:

[0072] S301. Obtain a first parameter set of the recessed part 201 on the initial printed circuit board 200.

[0073] S302. Determine a second parameter set of the windowing sites according to the first parameter set.

[0074] S303. Open a window on the substrate according to the first parameter set and the second parameter set to form the mesh holes 101.

[0075] In some embodiments, the first parameter set includes at least one of the following: the number of the recessed parts 201, the coordinate parameters of the recessed parts 201, and the dimension parameters of the recessed parts 201.

[0076] The second parameter set includes at least one of the following: the number of the mesh holes 101, the coordinate parameters of the mesh holes 101, the first span, the second span, and the dimension parameters of the mesh holes 101.

[0077] During implementation, the coordinate parameters of the mesh holes 101 can be obtained by calculation. Exemplarily, the coordinate of the mesh hole 101 = the coordinate of the recessed part 201 + [the radius of the recessed part 201 × (i) × cosθ, the radius of the recessed part 201 × (i) × sinθ]. Wherein, i is the number of layers of the annular array structure 102 surrounding the outside of the recessed part 201, and θ is the included angle between the windowing site and the x-axis of the two-dimensional coordinate system.

[0078] In some embodiments, the number of the recessed parts 201 is multiple, and the multiple recessed parts 201 are arranged at intervals; S302. Determining a second parameter set of the windowing sites according to the first parameter set includes:

[0079] Determine a second parameter set of the windowing sites corresponding to each recessed part 201 according to the first parameter set corresponding to each recessed part 201.

[0080] In this way, multiple mesh holes 101 at different positions can be formed on a stencil 100 at the same time, and the positions of the mesh holes 101 and the recessed parts 201 are arranged in one-to-one correspondence, so that when the stencil 100 and the initial printed circuit board 200 cooperate with each other, a cured medium structure 202 can be formed on the initial printed circuit board 200 at one time, further improving the processing beat of the printed circuit board and increasing the preparation efficiency of the printed circuit board.

[0081] In some embodiments, the number of the recessed parts 201 is multiple, and the multiple recessed parts 201 are arranged at intervals. Two adjacent recessed parts 201 are a first recessed part and a second recessed part; S302. Determining a second parameter set of the windowing sites according to the first parameter set includes:

[0082] Determine a first process parameter set of the windowing sites corresponding to the first recessed part according to the first parameter set of the first recessed part.

[0083] Determine a second set of process parameters for the windowing sites corresponding to the second recessed portion according to the first set of parameters of the second recessed portion.

[0084] It can be understood that the windowing sites corresponding to the first recessed portion and the second recessed portion may overlap, and there may be windowing sites that do not meet the requirement of the distance between the mesh 101 and the recessed portion 201.

[0085] Therefore, in the embodiments of the present application, according to the first set of parameters of the first recessed portion and the first set of process parameters, determine a first set of distance parameters.

[0086] Determine a second set of distance parameters according to the first set of parameters of the first recessed portion and the second set of process parameters.

[0087] Determine a third set of distance parameters according to the first set of parameters of the second recessed portion and the first set of process parameters;

[0088] Determine a fourth set of distance parameters according to the first set of parameters of the second recessed portion and the second set of process parameters.

[0089] Respectively determine the magnitude relationship between the distance parameters in the first set of distance parameters, the second set of distance parameters, the third set of distance parameters, and the fourth set of distance parameters and the preset distance parameter.

[0090] If the distance parameters in the first set of distance parameters, the second set of distance parameters, the third set of distance parameters, and the fourth set of distance parameters are greater than or equal to the preset distance parameter, then determine the first process parameter corresponding to the distance parameter in the first set of process parameters, and the second process parameter corresponding to the distance parameter in the second set of process parameters to form a second set of parameters.

[0091] In this way, by screening the distances of the windowing sites corresponding to the first recessed portion and the second recessed portion, the requirement of the preset distance between the mesh 101 and the first recessed portion and the second recessed portion is satisfied, so as to prevent the cured medium structure 202 formed on the initial printed circuit board 200 through the mesh 101 from interfering with the recessed portion 201, and further improve the preparation efficiency of the printed circuit board.

[0092] It should be noted that the preset distance in the embodiments of the present application is 1 mm - 1.4 mm.

[0093] Exemplarily, the preset distance can be: 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, etc. Any preset distance that meets the above numerical range is acceptable, and the embodiments of the present application do not limit this.

[0094] See Figure 5, Thirdly, the present application provides a method for preparing a printed circuit board, which uses the stencil 100 provided by the first aspect and an initial printed circuit board 200 in cooperation to prepare a printed circuit board; the preparation method includes:

[0095] S401: Use the stencil 100 to form a cured dielectric structure 202 on the initial printed circuit board 200 having a recess 201.

[0096] S402: Grind the initial printed circuit board 200 formed with the cured dielectric structure 202 to remove the cured dielectric structure 202.

[0097] S403: Post-process the ground initial printed circuit board 200 to form a printed circuit board.

[0098] It should be noted that during the grinding process of the initial printed circuit board 200 formed with the cured dielectric structure 202, a double-sided grinding machine is often used, and grinding tools such as abrasive belts, ceramic brushes, and non-woven brushes are used in combination to grind the initial printed circuit board 200. Among them, the current of the non-woven brush needs to be controlled within 0.5A - 1.0A to reduce the grinding amount of the grinding tool on the metal layer of the recess 201 and ensure the surface flatness of the ground initial printed circuit board 200.

[0099] In addition, post-processing the ground initial printed circuit board 200 includes verification by an optical instrument to ensure the grinding cleanliness and flatness of the cured dielectric structure 202.

[0100] As Figure 6 shown, the electronic device 500 provided by the embodiment of the present application includes: at least one processor 501 and a memory 502.

[0101] Optionally, the electronic device 500 further includes a communication component 503. Among them, the processor 501, the memory 502, and the communication component 503 are connected through a bus.

[0102] In a specific implementation process, at least one processor 501 executes the computer execution instructions stored in the memory 502, so that at least one processor 501 executes the window opening method of the above-mentioned stencil 100.

[0103] For the specific implementation process of the processor 501, reference can be made to the above method embodiment, and its implementation principle and technical effect are similar, which will not be elaborated here in this embodiment.

[0104] In the above embodiments, it should be understood that the processor may be a central processing unit (CPU), or may also be other general-purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), etc. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. The steps of the method disclosed in combination with the application can be directly implemented by the execution of the hardware processor, or can be implemented by the combination of hardware and software modules in the processor.

[0105] The memory may include a random access memory (RAM), and may also include a non-volatile memory (NVM), such as at least one disk memory.

[0106] The bus may be an industry standard architecture (ISA) bus, a peripheral component interconnect (PCI) bus, an extended industry standard architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the convenience of representation, the bus in the drawings of this application is not limited to only one bus or one type of bus.

[0107] The embodiment of the present application also provides a computer-readable storage medium, in which a computer program is stored, and the computer program is configured to execute the steps in any of the above-described windowing method embodiments of the stencil 100 when running.

[0108] In an exemplary embodiment, the above computer-readable storage medium may include, but is not limited to: USB flash drives, read-only memories (ROMs), random access memories (RAMs), mobile hard disks, magnetic disks, or optical discs and other various media that can store computer programs.

[0109] The embodiment of the present application also provides a computer program product, the above computer program product includes a computer program, and when the computer program is executed by a processor, the steps in any of the above-described windowing method embodiments of the stencil 100 are implemented.

[0110] Embodiments of the present application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the steps in any of the above-described windowing method embodiments of the stencil 100 are implemented.

[0111] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Skilled professionals can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0112] The above has introduced in detail a stencil 100, a windowing method of the stencil 100, and a method for manufacturing a printed circuit board provided by the present application. Specific examples are used herein to elaborate on the principles and implementation manners of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in the technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A stencil, characterized in that, For mating connection with an initial printed circuit board (200) to prepare a printed circuit board, the initial printed circuit board (200) having a recess (201); The stencil (100) has a plurality of apertures (101) that penetrate opposite sides of the stencil (100) in the thickness direction of the stencil (100); the apertures (101) are for allowing a curing medium to pass through; At least a partial number of the apertures (101) are arranged in a circular array and form at least one circular array structure (102); When the stencil (100) and the initial printed circuit board (200) are mated and connected, the orthographic projection of the circular array structure (102) on the plane where the initial printed circuit board (200) is located is located on at least a partial outer peripheral side of the recess (201), and there is a spacing between the circular edge of the orthographic projection of the circular array structure (102) and the edge of the recess (201). The curing medium passes through the apertures (101) and cures at positions on the initial printed circuit board (200) corresponding to the apertures (101) to form a curing medium structure (202) on the initial printed circuit board (200).

2. The stencil according to claim 1, wherein The number of the circular array structures (102) is multiple, and the multiple circular array structures (102) extend along the plane extension direction of the stencil (100) and are sleeved and arranged with a first span.

3. The stencil according to claim 2, wherein In each of the circular array structures (102), at least a partial number of the apertures (101) are arranged with a second span along the circumferential direction of the corresponding circular array structure (102).

4. The stencil according to claim 3, wherein In at least one of the circular array structures, at least some adjacent apertures (101) are arranged with a third span; The third span is greater than the second span.

5. The stencil according to claim 3, wherein The apertures (101) are circular holes, and the diameter of the apertures (101) is 0.3 mm - 1.0 mm; And / or, the first span is 0.3 mm - 0.8 mm; And / or, the second span is 0.3 mm - 0.8 mm.

6. A method for opening windows on a stencil, characterized in that, For preparing the stencil (100) according to any one of claims 1 - 5; the windowing method includes: Obtaining a first parameter set of the recess (201) on the initial printed circuit board (200); Determining a second parameter set of windowing sites according to the first parameter set; Windowing on a substrate according to the first parameter set and the second parameter set to form apertures (101).

7. The window opening method according to claim 6, characterized in that, The number of the recesses (201) is multiple, and the multiple recesses (201) are arranged at intervals; Determining a second parameter set of windowing sites according to the first parameter set, including: Determining the second parameter set of the windowing sites corresponding to each of the recesses (201) according to the first parameter set corresponding to each of the recesses (201).

8. The window opening method according to claim 6, characterized in that, The number of the recesses (201) is multiple, and the multiple recesses (201) are arranged at intervals. Two adjacent recesses (201) are a first recess and a second recess; Determining a second parameter set of windowing sites according to the first parameter set, including: Determine a first set of process parameters for the windowing site corresponding to the first recess according to the first set of parameters of the first recess; Determine a second set of process parameters for the windowing site corresponding to the second recess according to the first set of parameters of the second recess; Determine a first set of distance parameters according to the first set of parameters of the first recess and the first set of process parameters; Determine a second set of distance parameters according to the first set of parameters of the first recess and the second set of process parameters; Determine a third set of distance parameters according to the first set of parameters of the second recess and the first set of process parameters; Determine a fourth set of distance parameters according to the first set of parameters of the second recess and the second set of process parameters; Respectively determine the magnitude relationship between the distance parameters in the first set of distance parameters, the second set of distance parameters, the third set of distance parameters, and the fourth set of distance parameters and a preset distance parameter; If the distance parameters in the first set of distance parameters, the second set of distance parameters, the third set of distance parameters, and the fourth set of distance parameters are greater than or equal to the preset distance parameter, determine the first process parameter corresponding to the distance parameter in the first set of process parameters and the second process parameter corresponding to the distance parameter in the second set of process parameters to form the second set of parameters.

9. The windowing method according to any one of claims 6-8, wherein The first set of parameters includes at least one of the following: the number of the recesses (201), the coordinate parameters of the recesses (201), and the dimension parameters of the recesses (201); The second set of parameters includes at least one of the following: the number of the mesh holes (101), the coordinate parameters of the mesh holes (101), a first span, a second span, and the dimension parameters of the mesh holes (101).

10. A method for preparing a printed circuit board, characterized in that, Use the stencil (100) according to any one of claims 1-5 in cooperation with an initial printed circuit board (200) to prepare a printed circuit board; The preparation method includes: Use the stencil (100) to form a cured dielectric structure (202) on the initial printed circuit board (200) having the recesses (201); Grind the initial printed circuit board (200) formed with the cured dielectric structure (202) to remove the cured dielectric structure (202); Post-process the ground initial printed circuit board (200) to form the printed circuit board.

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