Cleaning device for multilayer circuit board
By setting up a cleaning tape and a soft brush in the cleaning device, combined with ultrasonic cleaning and hot air drying, the problem of poor cleaning effect of traditional cleaning devices is solved, and efficient cleaning of multi-layer circuit boards is achieved.
Patent Information
- Application Number
- CN202510555258.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-29
- Publication Date
- 2025-07-29
AI Technical Summary
The traditional cleaning device does not have enough cleaning effect on multi-layer circuit boards, and cannot effectively remove flux residues and oil stains.
Set up a cleaning belt in the cleaning device, install a soft bristle brush on the cleaning belt, and combine ultrasonic cleaning and hot air drying. Use a soft bristle brush to brush and wipe the circuit board to ensure that flux residues and oil stains are completely removed.
The thorough cleaning of multi-layer circuit boards is achieved, ensuring complete removal of flux residues and oil stains, and improving cleaning efficiency.
Smart Images

Figure CN120390367A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of circuit board production, and particularly to a cleaning device for multi-layer circuit boards. Background Art
[0002] After the production of multi-layer circuit boards, since there may be residues of soldering flux, oil stains, etc. on them, cleaning is required before subsequent motor assembly work;
[0003] Traditional cleaning devices rely only on ultrasonic waves for cleaning, and the cleaning effect on circuit boards is insufficient. Summary of the Invention
[0004] To solve the deficiencies in the prior art, the present invention provides a cleaning device for multi-layer circuit boards. The cleaning device for multi-layer circuit boards ensures that the residues of soldering flux and oil stains on the circuit board are all cleaned up by arranging a cleaning belt on the cleaning tank, so that the circuit board after ultrasonic cleaning is immediately brushed by a soft brush.
[0005] To achieve the above object, the present invention adopts the following technical solutions:
[0006] The present invention provides a cleaning device for multi-layer circuit boards, including a cleaning tank. An ultrasonic generator is arranged in the cleaning tank. A lifting table is arranged in the cleaning tank, and a circuit board positioning member is arranged on the lifting table;
[0007] A cleaning belt is arranged above the cleaning tank. The cleaning belt is of a conveyor belt structure, and a soft brush is arranged on the cleaning belt;
[0008] A lifting mechanism is arranged on the cleaning belt.
[0009] Before cleaning, the multi-layer circuit board is fixed on the surface of the lifting table through the circuit board positioning member. Subsequently, the lifting table descends into the cleaning tank. A special circuit board cleaning agent is stored in the cleaning tank. At the same time, the ultrasonic generator is started to perform ultrasonic cleaning on the multi-layer circuit board. Then the lifting table rises, and the cleaning belt descends so that the cleaning belt can contact the multi-layer circuit board and maintain a preset distance. After the cleaning belt is started, it moves horizontally above the lifting table. For the multi-layer circuit board, it is a one-way wiping to wipe off the residual pollutants on it. Finally, the cleaning belt rises, and the multi-layer circuit board can be taken off the lifting table to complete the cleaning.
[0010] The cleaning device for multi-layer circuit boards of the present invention ensures that the residues of soldering flux and oil stains on the circuit board are all cleaned up by arranging a cleaning belt on the cleaning tank, so that the circuit board after ultrasonic cleaning is immediately brushed by a soft brush.
[0011] In a further technical solution, it further includes a hot air duct, and the hot air duct and the cleaning belt are jointly connected to a lifting mechanism, and the horizontal position of the hot air duct is flush with the lower side of the cleaning belt.
[0012] The setting of the hot air duct enables the hot air duct to blow hot air to the wiping area while the cleaning belt is working, and cooperate with the wiping of the soft brush to accelerate the drying of the multi-layer circuit board.
[0013] In a further technical solution, a brush drying box is arranged above the cleaning belt, and the brush drying box and the cleaning belt are jointly connected to a lifting mechanism.
[0014] The soft brush on the cleaning belt is dried by the brush drying box, which is convenient for the continuous operation of the cleaning belt.
[0015] In a further technical solution, multiple groups of circuit board positioning members are provided.
[0016] Multiple groups of circuit board positioning members can clean multiple groups of multi-layer circuit boards at a time, improving the cleaning efficiency.
[0017] The beneficial effects are as follows:
[0018] 1. The cleaning device for multi-layer circuit boards of the present invention sets a cleaning belt on the cleaning tank, so that the circuit board after ultrasonic cleaning is immediately brushed by a soft brush, ensuring that all the flux residues and oil stains on the circuit board are cleaned up. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 is a schematic structural diagram of the cleaning device for multi-layer circuit boards according to an embodiment of the present invention;
[0020] Figure 2 is a schematic structural diagram of the wiping process of the cleaning device for multi-layer circuit boards according to an embodiment of the present invention.
[0021] 10. Cleaning tank; 11. Ultrasonic generator; 12. Lifting table; 20. Cleaning belt; 30. Brush drying box; 40. Hot air duct. DETAILED DESCRIPTION OF THE INVENTION
[0022] The present invention will be further described below with reference to the drawings:
[0023] Embodiment:
[0024] A cleaning device for multi-layer circuit boards, as Figure 1 shown, includes a cleaning tank 10, an ultrasonic generator 11 is arranged in the cleaning tank 10, a lifting table 12 is arranged in the cleaning tank 10, and a circuit board positioning member is arranged on the lifting table 12;
[0025] Above the cleaning tank 10, a cleaning belt 20 is provided. The cleaning belt 20 is of a conveyor belt structure, and soft brushes are provided on the cleaning belt 20.
[0026] A lifting mechanism is provided on the cleaning belt 20.
[0027] Before cleaning, the multi-layer circuit boards are fixed on the surface of the lifting platform 12 through circuit board positioning members. Subsequently, the lifting platform 12 descends into the cleaning tank 10. There is a special circuit board cleaning agent in the cleaning tank 10. At the same time, the ultrasonic generator 11 is started to perform ultrasonic cleaning on the multi-layer circuit boards. Then the lifting platform 12 rises, and the cleaning belt 20 descends. As Figure 2 shown, the cleaning belt 20 is brought into contact with the multi-layer circuit boards and maintained at a preset distance. After the cleaning belt 20 is started, it moves horizontally above the lifting platform 12. For the multi-layer circuit boards, it is a one-way wiping to wipe off the residual pollutants on them. Finally, the cleaning belt 20 rises, and the multi-layer circuit boards can be removed from the lifting platform 12 to complete the cleaning.
[0028] The cleaning device for multi-layer circuit boards of the present invention sets a cleaning belt 20 on the cleaning tank 10, so that the circuit boards after ultrasonic cleaning are immediately scrubbed by soft brushes to ensure that all the residual soldering flux and oil stains on the circuit boards are cleaned up.
[0029] In another embodiment, a hot air pipe 40 is further included. The hot air pipe 40 and the cleaning belt 20 are jointly connected to the lifting mechanism, and the horizontal position of the hot air pipe 40 is flush with the lower side of the cleaning belt 20.
[0030] The setting of the hot air pipe 40 enables the hot air pipe 40 to blow hot air to the wiping area while the cleaning belt 20 is working, and cooperate with the wiping of the soft brushes to accelerate the drying of the multi-layer circuit boards.
[0031] In another embodiment, a brush drying box 30 is provided above the cleaning belt 20. The brush drying box 30 and the cleaning belt 20 are jointly connected to the lifting mechanism.
[0032] The soft brushes on the cleaning belt 20 are dried by the brush drying box 30 to facilitate the continuous operation of the cleaning belt 20.
[0033] In another embodiment, multiple groups of circuit board positioning members are provided.
[0034] Multiple groups of circuit board positioning members can clean multiple groups of multi-layer circuit boards at a time, improving the cleaning efficiency.
[0035] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only to illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed.
Claims
1. A cleaning device for a multi-layer circuit board, characterized in that, It includes a cleaning tank, an ultrasonic generator is arranged in the cleaning tank, a lifting table is arranged in the cleaning tank, and a circuit board positioning member is arranged on the lifting table; A cleaning belt is arranged above the cleaning tank, the cleaning belt is of a conveyor belt structure, and a soft brush is arranged on the cleaning belt; A lifting mechanism is arranged on the cleaning belt.
2. The cleaning device for a multilayer circuit board according to claim 1, wherein: It further includes a hot air pipe, the hot air pipe and the cleaning belt are jointly connected to the lifting mechanism, and the horizontal position of the hot air pipe is flush with the lower side of the cleaning belt.
3. The cleaning device for the multi-layer circuit board according to claim 1, characterized in that, A brush drying box is arranged above the cleaning belt, and the brush drying box and the cleaning belt are jointly connected to the lifting mechanism.
4. The cleaning device for a multi-layer circuit board according to claim 3, characterized in that: Multiple groups of the circuit board positioning members are arranged.