SMT (surface mount technology) device for manufacturing PCBA (printed circuit board assembly)

Abstract

The invention relates to the technical field of chip mounters, and discloses an SMT (surface mount technology) device for PCBA (printed circuit board assembly) manufacturing, which comprises a chip mounter, the chip mounter comprises a feeding mechanism, a PCB conveying mechanism and a mounting mechanism, the PCB conveying mechanism is used for conveying a PCB, the mounting mechanism is used for mounting a to-be-mounted PCB, the feeding mechanism is used for providing a mounting material for the mounting mechanism, and the feeding mechanism is used for feeding the to-be-mounted PCB. The surface mounting device comprises a mounting platform and further comprises a surface mounting loading platform, the surface mounting loading platform at least comprises two tool platforms, the tool platforms are not connected, when one tool platform is in a surface mounting state, the other tool platform is in a feeding state, the surface mounting state and the feeding state are alternately switched, and the surface mounting loading platform is arranged on the surface mounting platform. The tool table is in a chip mounting state, the tool table in the chip mounting state is not connected with the chip mounter, the chip mounting state refers to a state in which the tool table is separated from the PCB conveying mechanism and the chip mounting mechanism carries out chip mounting on the PCB conveying mechanism, and the feeding state refers to a state in which the tool table is in butt joint with the PCB conveying mechanism and is used for bearing and transferring PCBs.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounters, and in particular to an SMT chip mount device for PCBA board production. Background Art

[0002] The SMT placement equipment used to make PCBA boards usually uses a frame with high mechanical strength and rigidity. The core components of the placement machine are supported by rigid materials (such as steel) to ensure equipment stability and reduce the impact of vibrations such as the movement of the robotic arm and the conveyor belt on placement accuracy.

[0003] In the actual patch process, even when working on a stable rack, it is still necessary to shut down other motion mechanisms, such as stopping the conveyor belt, while the patch mechanism on the robot arm is performing patch placement, to minimize the impact of corresponding vibration on patch accuracy. This prevents the conveyor belt from feeding and patch placement at the same time, reducing the patch machine's patch efficiency. In addition, the movement of the patch device itself is accompanied by vibration, which also affects the patch accuracy.

[0004] Chinese patent application with application number 2021116214481: A placement machine for preventing pad vibration and displacement, which aims to solve the problem that the pad is easily subjected to vibration, resulting in the pad being offset a small distance, thereby causing deviations in the fixation of components and causing the PCB board to be easily damaged. The technical solution provided is as follows: the upper surface of the base plate is fixedly installed with a power component, and the upper surfaces of both ends of the base plate are symmetrically fixed with brackets. The PCB board is fixed by a concave clamping plate. When the cylinder drives the pressure beam to move downward along the outside of the guide beam through the T-shaped rod, the upper clamping plate is pressed and fixed by the concave pressure block, and the second pulley is linked to make the angular push rod push the second rotating shaft upward along the second strip groove, so that the movable pulley always presses against the second conveyor belt to squeeze the lower clamping plate, so that the position of the PCB board is fixed; when installing components, the connecting plate drives the rectangular slider to slide along the rectangular box through multiple top columns, and buffering is achieved by the third spring to prevent the PCB board from small-distance displacement caused by vibration. This solution is similar to the existing technology, both of which use fastening means such as clamping to rigidly fix the PCB board to be patched. However, the clamping mechanism that provides rigid fixation itself will also transmit vibration, and it does not solve the problem that the feeding of the conveyor belt and the patch work of the robotic arm cannot be carried out simultaneously.

[0005] In some existing technologies, dual cantilevers are installed to increase patch efficiency by performing patch operations on two circuit boards at the same time. However, the dual cantilevers increase the number of motion mechanisms, and the motion mechanisms are not isolated from the structure that supports the PCBs. Instead, they increase the intensity of vibration and relatively increase the risk of affecting the patch accuracy.

[0006] In the prior art, a transfer mechanism such as a robotic arm is also provided to transfer the PCB board on the conveyor belt to the clamping station for the chip mounting operation. First, the clamping station in the prior art is also an integral structure with the chip mounter and cannot isolate the vibration caused by the various moving mechanisms on the chip mounter. Moreover, usually, after the chip mounting is completed, the clamping mechanism needs to send the PCB board after chip mounting back to the conveyor belt so that it can enter the next process. Therefore, the conveyor belt is also in a stopped state during chip mounting, and the problem of conveying efficiency is not solved. Otherwise, a robotic arm with a large span is required to transfer the PCB board, which will greatly increase the volume of the equipment, and the movement path of the corresponding mechanical structure needs to be planned in a limited area, greatly increasing the complexity of mechanical movement.

[0007] In summary, there is an urgent need for an SMT chip mounting device for manufacturing PCBA boards that can isolate the vibration generated by the moving mechanism of the chip mounter from being transmitted to the position to be chip-mounted and can improve the chip mounting efficiency. Summary of the Invention

[0008] In view of the problems of vibration and efficiency during chip mounting in the prior art, an SMT chip mounting device for manufacturing PCBA boards is proposed, which can isolate the vibration generated by the moving mechanism of the chip mounter from being transmitted to the position to be chip-mounted and can improve the chip mounting efficiency.

[0009] To solve the above problems, the technical solution of the present invention is as follows:

[0010] An SMT chip mounting device for manufacturing PCBA boards includes a chip mounter, and the chip mounter includes a feeding mechanism, a PCB conveying mechanism, and a mounting mechanism. It also includes two tooling platforms, and each of the tooling platforms is not connected to each other; the tooling platform in the chip mounting state is used to load the PCB board to be chip-mounted for the mounting mechanism, and the tooling platform in the feeding state is used to receive and transfer the PCB board to be chip-mounted transmitted on the PCB conveying mechanism. The chip mounting state and the feeding state of each tooling platform are alternately switched, and when one of the tooling platforms is in the chip mounting state, the other tooling platform is in the feeding state. Among them, the tooling platform in the chip mounting state is not connected to the chip mounter.

[0011] As a preferred technical solution, the tooling platform includes a support base, a translation driving mechanism, and a receiving and conveying mechanism; the support base is used to support the translation driving mechanism and the receiving and conveying mechanism, the translation driving mechanism is used to drive the receiving and conveying mechanism into the chip mounting state or the feeding state, and the receiving and conveying mechanism is used to receive or transfer the PCB board.

[0012] As a preferred technical solution, the translation driving mechanism is a hydraulic rod structure, and the receiving and conveying mechanism is a conveyor belt structure.

[0013] As a preferred technical solution, there are two sets of the feeding mechanisms, which are symmetrically arranged on both sides of the PCB conveying mechanism.

[0014] As a preferred technical solution, the displacement area of the placement head of the placement mechanism covers each of the receiving and conveying mechanisms.

[0015] As a preferred technical solution, it includes a baffle and a lifting mechanism. The lifting mechanism is used to control the lifting of the baffle. When the lifting mechanism rises, the baffle is used to prevent the PCB on the PCB conveying mechanism from entering the receiving and conveying mechanism.

[0016] As a preferred technical solution, the baffle includes a blocking piece and a guiding rod; the lifting mechanism includes a first guiding platform and a second guiding platform. The first guiding platform and the second guiding platform are symmetrically arranged on each of the receiving and conveying mechanisms, and there is a gap between the first guiding platform and the second guiding platform; the guiding rod can move along the first guiding platform and the second guiding platform.

[0017] As a preferred technical solution, the first guiding platform includes a settling platform, a rising platform, and a high-position platform; when the guiding rod is located on the rising platform and the high-position platform, the blocking piece prevents the PCB on the PCB conveying mechanism from entering the receiving and conveying mechanism.

[0018] As a preferred technical solution, rollers are provided at the ends of the guiding rods.

[0019] Advantages of the present invention:

[0020] In the SMT placement device for manufacturing the PCBA board of the present invention, the tooling table used as the placement platform is arranged in the frame equipped with moving mechanisms such as the feeding mechanism, the PCB conveying mechanism, and the placement mechanism, but is not connected to the frame, so that the PCB to be placed is kept isolated from the vibrating workpieces. Therefore, during the placement process, the conveying of the PCB can still continue, effectively isolating the influence of the vibration generated by the moving mechanism of the placement machine on the PCB to be placed; the two tooling tables can be alternately switched between the placement state and the feeding state, enabling the placement mechanism to work continuously without waiting for the loading and unloading of the PCB, greatly improving the placement efficiency. The non-connected design of the two tooling tables not only ensures that the tooling table in the placement state completely isolates the vibration conduction of other moving parts of the placement machine, but also isolates the vibration of the other tooling table, thereby further ensuring the placement accuracy. Description of the Drawings

[0021] Figure 1 It is a three-dimensional schematic diagram of the working mechanism on the frame of the SMT placement device for manufacturing the PCBA board of the present invention;

[0022] Figure 2This is a schematic diagram of the installation and coordination of the SMT patch device for PCBA board production of the present invention;

[0023] Figure 3 This is a three-dimensional schematic diagram of the SMT patch device used for PCBA board production according to the present invention;

[0024] Figure 4 This is a schematic diagram of the tooling table of the SMT patch device for PCBA board production according to the present invention;

[0025] Figure 5 This is a partial schematic diagram of the SMT patch device for manufacturing the PCBA board with a baffle according to the present invention;

[0026] Figure 6 This is a schematic diagram of the baffle and lifting mechanism structure of the SMT patch device for PCBA board production according to the present invention;

[0027] Figure 7 Schematic diagram of the baffle in the raised state;

[0028] Figure 8 Schematic diagram of the coordination between the baffle in the raised state and the lifting structure.

[0029] The reference numerals and components in the drawings are as follows:

[0030] 1. Feeding mechanism; 2. PCB conveying mechanism; 21. Connecting rod; 3. Mounting mechanism;

[0031] 4. Workbench; 41. Undertaking and conveying mechanism; 42. Support seat; 43. Translation drive mechanism;

[0032] 5. Frame; 51. Chassis cover;

[0033] 6. PCB board;

[0034] 7. baffle; 71. blocking plate; 72. guide rod; 73. roller;

[0035] 8. Lifting mechanism; 81. First guide platform; 82. Second guide platform; 811. Lowering platform; 812. Rising platform; 813. High-position platform. DETAILED DESCRIPTION

[0036] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of the specific embodiments of the present invention is given in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0037] To better understand an SMT chip mounter for PCBA board manufacturing provided in this embodiment, the following first briefly introduces the existing SMT chip mounters. The existing SMT chip mounters refer to high-precision electronic devices used to accurately place various electronic components on a PCB (printed circuit board), including a frame, a conveying system, an X-Y positioning system, a chip mounting head, a feeding system, a vision system, and a control system. The frame is the basic structure of the SMT chip mounter, bearing the weight of the whole machine and maintaining its stability. The frame usually has sufficient mechanical strength and rigidity to ensure that there is no deformation or vibration during the chip mounting process. The conveying system is responsible for accurately transporting the PCB to the designated position and sending it out after chip mounting is completed. It usually consists of one or more belt conveying mechanisms, driven by a stepper motor or a servo motor to achieve accurate conveyance of the PCB. The X-Y positioning system is responsible for controlling the accurate movement of the chip mounting head on the PCB. It consists of servo motors, transmission mechanisms, linear slide rails, and positioning sensors on the X-axis and Y-axis. Through the computer control system, the position of the chip mounting head on the PCB can be accurately controlled to achieve accurate placement of components. The chip mounting head is the core component of the SMT chip mounter, responsible for picking up, moving, and placing components. It usually contains one or more suction nozzles and picks up components by means of negative pressure adsorption. The chip mounting head can also be equipped with a vision system, which is used for accurate positioning and identification of the PCB and components, usually including parts such as a camera, a light source, and image processing software. The control system usually includes parts such as a computer, a motion control card, sensors, and actuators, which are used to receive data from the vision system, the positioning system, and the user interface, and issue commands after processing to control the actions of the chip mounting head, the conveying system, the feeding system, etc., to achieve automatic chip mounting.

[0038] However, the conveying system, X-Y positioning system, chip mounting head, and feeding system of the existing SMT chip mounters are all provided on the same frame, resulting in the vibration generated by each motor and transmission mechanism during operation being conducted to the PCB to be chipped, causing the PCB to vibrate. Especially in high-precision chip mounting requirements, it is easy to reduce the chip mounting yield, increase the difficulty of recognition and positioning of the vision system, and reduce the chip mounting efficiency.

[0039] Embodiment 1

[0040] Please refer to the appendix Figure 1 , this application proposes an SMT chip mounter for PCBA board manufacturing. The device includes a chip mounter, and the chip mounter includes a feeding mechanism 1 for providing chip mounting materials for the chip mounting mechanism 3, a PCB conveying mechanism 2 for transporting and transferring the PCB board 6, and a chip mounting mechanism 3 for picking up the chip mounting materials on the feeding mechanism 1 to perform chip mounting on the PCB board 6.

[0041] To solve the problem that the vibration generated by the motion mechanism of the chip mounter affects the chip mounting accuracy and improve the chip mounting efficiency at the same time, this application proposes to solve this problem by alternately switching the working modes of two tooling platforms 4, and the tooling platform 4 in the chip mounting working mode is not connected to the machine that generates vibration.

[0042] Please refer to the appendix Figure 2 The SMT chip mounting device for manufacturing the PCBA board further includes two tooling platforms 4. When one of the tooling platforms 4 is in the chip mounting state, the other tooling platform 4 is in the feeding state, and the chip mounting state and the feeding state can be alternately switched. Among them, the chip mounting state refers to the state of being disengaged from the PCB conveying mechanism 2 and the chip mounting mechanism 3 performing chip mounting on it, and the feeding state refers to the state of being docked with the PCB conveying mechanism 2 and being used to receive and transfer the PCB board 6. When the tooling platform 4 in the chip mounting state completes chip mounting, the PCB board 6 on the PCB conveying mechanism 2 is completely fed into the tooling platform 4 in the feeding state. At this time, the states of the two tooling platforms 4 start to switch. The tooling platform 4 that has completed chip mounting moves to be docked with the PCB conveying mechanism 2 and transfers the completed chip mounting to the PCB conveying mechanism 2. Synchronously, the unchipped PCB board 6 on the PCB conveying mechanism 2 is gradually fed onto the above-mentioned tooling platform 4. At the same time, the other tooling platform 4 that was previously in the feeding state carries the PCB board 6 to be chipped above it into the chip mounting station, and the chip mounting mechanism 3 sucks the chip mounting material and moves above the tooling platform 4 to perform chip mounting on the PCB board 6. Therefore, through the switching of the chip mounting stations of the two tooling platforms 4, the conveying and chip mounting of the PCB board 6 can be carried out synchronously, effectively improving the chip mounting efficiency. At the same time, the two tooling platforms 4 are not connected to each other, so that the vibration generated by the tooling platform 4 in the feeding state cannot be transmitted to the tooling platform 4 in the chip mounting state, and the tooling platform 4 in the chip mounting state is not connected to the chip mounter either. Thus, the tooling platform 4 in the chip mounting state completely isolates the vibration generated by the chip mounter and avoids the vibration affecting the chip mounting accuracy.

[0043] Please refer to the appendix Figure 3 Please refer to the appendix

[0044] Please refer to the appendix Figure 4Taking the workbench 4 on one side as an example, the workbench 4 includes a support base 42, a translation drive mechanism 43, and a receiving and conveying mechanism 41. The support base 42 is used to support the translation drive mechanism 43 and the receiving and conveying mechanism 41, and the support base 42 passes through the frame 5 and is directly fixed on the ground, and is not connected to the frame 5. A translation drive mechanism 43 is provided above the support base 42. In this embodiment, the translation drive mechanism 43 is a hydraulic rod, and the other end of the hydraulic rod is connected to the receiving and conveying mechanism 41. The receiving and conveying mechanism 41 is a conveyor belt structure, and the upper surface of the conveyor belt is flush with the upper surface of the PCB conveying mechanism 2 for conveying the PCB board 6. The receiving and conveying mechanism 41 is moved in and out between the front section and the rear section of the PCB conveying mechanism 2 by the extension and retraction of the high-precision hydraulic rod. In some embodiments, each receiving and conveying mechanism 41 is connected to two sets of hydraulic rods to improve the support strength. In some embodiments, the extension and retraction drive can also be performed by the drive of a threaded screw.

[0045] In this embodiment, two sets of feeding mechanisms 1 are provided, which are respectively arranged on the rack 5 near the tooling table 4 on both sides to facilitate feeding of the patch.

[0046] In the usage of the present invention, the PCB board 6 is located on the PCB conveying mechanism 2 and moves toward the receiving conveying mechanism 41. When the PCB board 6 is transferred to the receiving conveying mechanism 41, the conveyor belt stops operating but the conveyor belt on the PCB conveying mechanism 2 continues to work. The translation drive structures on the two workbench 4 are started at the same time, one extending and the other retracting. The receiving conveying mechanism 41 carrying the PCB board 6 is retracted to an area away from the PCB conveying mechanism 2, and enters the patch state. The other receiving conveying mechanism 41 that does not carry the PCB board 6 is sent to the area between the front section and the rear section of the PCB conveying mechanism 2 and enters the feeding state for receiving the next PCB board 6. While receiving the next PCB board 6, the placement mechanism 3 has moved to the area where it entered previously. Above the receiving and conveying mechanism 41 in the patch state, the patch head picks up parts from the adjacent feeding mechanism 1 for placement on the PCB board 6 above. It should be understood that when the placement is completed, the PCB board 6 on the other workbench 4 is also loaded, and the switching between the patch state and the feeding state begins. After the PCB board 6 with the mounted PCB board 6 is docked with the PCB conveying mechanism 2, the conveyor belt on it is started to transfer the mounted PCB board 6 to the PCB conveying mechanism 2, and at the same time, a new unmounted PCB board 6 is received from the PCB conveying mechanism 2. At the same time, the placement mechanism 3 has been transferred to the workbench 4 on the other side to start placement. This cyclic operation can achieve stable placement under the continuous operation of the PCB conveying mechanism 2.

[0047] It should be noted that, in order to enable the SMT chip mounter for PCBA board manufacturing of the present invention to work continuously and stably, it is necessary to control the spacing between adjacent two PCB boards 6 on the PCB conveying mechanism 2 and the conveying speed. Specifically, it is necessary to consider the time required for chip mounting and the time required for state switching. That is, firstly, it is necessary to ensure that the time from the completion of the docking between the receiving and conveying mechanism 41 and the PCB conveying mechanism 2 to the receipt of the PCB board 6 to be chip-mounted is the same as the time for the chip mounting mechanism 3 to complete chip mounting, or to ensure that when the chip mounting structure in the chip mounting state completes chip mounting, the PCB board 6 to be chip-mounted is on the receiving and conveying mechanism 41 in the feeding state; secondly, it is necessary to ensure that before the state switching is completed, the next PCB board 6 to be chip-mounted on the PCB conveying mechanism 2 is always on the PCB conveying mechanism 2, that is, the movement time required for the spacing between adjacent two PCB boards 6 is greater than or equal to the time required for the translation drive mechanism 43 to complete state switching. It should be understood that stable operation can be achieved only by setting and controlling the conveying speed of the corresponding conveyor belt and the interval between the PCB boards 6 entering the PCB conveying mechanism 2, so it can be achieved through the existing control system.

[0048] The SMT chip mounter for PCBA board manufacturing of the present invention keeps the PCB board 6 to be chip-mounted in an isolated state from the vibrating workpiece, so that during the chip mounting process, the conveying of the PCB board 6 can still continue, effectively isolating the influence of the vibration generated by the moving mechanism of the chip mounter on the PCB board 6 to be chip-mounted; the two tooling platforms 4 can be alternately switched between the chip mounting state and the feeding state, so that the chip mounting mechanism 3 can work continuously without waiting for the loading and unloading of the PCB board 6, greatly improving the chip mounting efficiency. The non-connected design of the two tooling platforms 4 not only ensures that the tooling platform 4 in the chip mounting state completely isolates the vibration conduction of other moving parts of the chip mounter, but also can isolate the vibration of the other tooling platform 4, thus further ensuring the chip mounting accuracy. That is, the SMT chip mounter for PCBA board manufacturing of the present invention realizes the parallel operation of the chip mounting work and the feeding work through the alternately switched isolated working mode, significantly improving the chip mounting efficiency and the yield of chip mounting. Under the same production efficiency, neither the chip mounting mechanism 3 needs to be increased nor the floor area needs to be expanded.

[0049] Embodiment 2

[0050] The switching between the feeding state and the chip mounting state is realized by the movement of the translation drive mechanism 43. Therefore, the time required for state switching depends on the speed of movement of the translation drive mechanism 43. During the switching process, the PCB conveying mechanism 2 always maintains the conveying state, and the PCB board 6 on it continues to move towards the receiving and conveying mechanism 41. In order to further prevent the PCB board 6 from coming into contact with the receiving and conveying mechanism 41 during the state switching due to errors such as the conveying speed and the interval distance between the PCB boards 6, please refer to Appendix Figure 5 Appendix Figure 6In this embodiment, the SMT placement device for PCBA board production is provided with a baffle 7 mechanism to prevent the movement of the PCB board 6. During the state switching process, the baffle 7 rises to isolate the PCB board 6 on the PCB conveying mechanism 2 and the receiving conveying mechanism 41. After the state switching is completed, the baffle 7 falls below the conveying track of the PCB board 6, and the PCB board 6 can be transferred normally.

[0051] Specifically, its isolation structure includes the baffle 7 and the lifting mechanism 8. In some embodiments, the lifting mechanism 8 can be an active driving device for controlling the lifting of the hydraulic cylinder, etc., but in order to reduce the complexity of the control system, the lifting mechanism 8 in this embodiment includes a first guide platform 81 and a second guide platform 82 respectively arranged on each receiving and conveying mechanism 41. Taking the first guide platform 81 as an example, the first guide platform 81 includes a sinking platform 811, a rising platform 812, and a high-level platform 813. The second guide platform 82 has the same structure as the first guide platform 81 and is symmetrically arranged. The first guide platform 81 and the second guide platform 82 are not connected to each other to avoid vibration. Conduction, the baffle 7 includes a blocking piece 71, and a guide rod 72 is provided below the center of the blocking piece 71. Preferably, a roller 73 is provided at the bottom of the guide rod 72. In order to fix the baffle 7 and limit the moving direction of the baffle 7, a connecting rod 21 is provided on the fixing frame on the platform for installing the PCB conveying mechanism 2. The connecting rod 21 is provided with a guide hole adapted to the guide rod 72. The guide rod 72 can be raised and lowered along the guide hole. The connecting rod 21 and the guide hole thereon are used to provide a trajectory for the baffle 7 to move up and down. In some embodiments, guide rails with limiting positions can also be provided on both sides of the blocking piece 71, which can also provide a limit for the baffle 7 to move up and down.

[0052] The roller 73 below the guide rod 72 can move along the surface of the first guide platform 81 and the second guide platform 82. Specifically, taking the first guide platform 81 as an example, when the receiving and conveying mechanism 41 correspondingly connected to the first guide platform 81 is in the feeding state, the roller 73 is located on the sedimentation platform 811. Figure 7 , Attachment Figure 8 When it needs to switch from the feeding state to the patch state, the translation drive mechanism 43 begins to extend and retract and drives the first guide platform 81 to move, and the roller 73 on the guide rod 72 begins to enter the rising platform 812. At this time, the blocking plate 71 begins to move upward and isolates it between the transfer tracks of the PCB board 6, which is used to prevent the PCB board 6 from entering the receiving and conveying mechanism 41 whose state has not been switched. When the roller 73 on the guide rod 72 enters the high-position platform 813, the baffle 7 rises to the highest point. It should be understood that the distance between the first guide platform 81 and the second guide platform 82 is smaller than the diameter of the roller 73, so that the roller 73 can be smoothly transferred between the first guide platform 81 and the second guide platform 82.

[0053] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and supplements can still be made, and these improvements and supplements should also be regarded as the protection scope of the present invention.

Claims

1. An SMT chip mounting device for PCBA board manufacturing, including a chip mounter, the chip mounter includes a feeding mechanism, a PCB conveying mechanism, and a mounting mechanism, characterized in that, It further includes two tooling platforms, wherein each of the tooling platforms is not connected to each other; the tooling platform in the chip mounting state is used to load the PCB board to be chip-mounted for the chip mounting mechanism, and the tooling platform in the feeding state is used to receive and transfer the PCB board with chips to be mounted on the PCB conveying mechanism. The chip mounting state and the feeding state of each tooling platform are alternately switched, and when one of the tooling platforms is in the chip mounting state, the other tooling platform is in the feeding state. Among them, the tooling platform in the chip mounting state is not connected to the chip mounter.

2. The SMT patch device for PCBA production according to claim 1, characterized in that: The tooling platform includes a support base, a translation drive mechanism, and a receiving and conveying mechanism; the support base is used to support the translation drive mechanism and the receiving and conveying mechanism, the translation drive mechanism is used to drive the receiving and conveying mechanism into the chip mounting state or the feeding state, and the receiving and conveying mechanism is used to receive or transfer the PCB board.

3. The SMT patch device for PCBA production according to claim 2, characterized in that: The translation drive mechanism is a hydraulic rod structure, and the receiving and conveying mechanism is a conveyor belt structure.

4. The SMT patching device for PCBA board manufacturing according to claim 1, wherein, There are two sets of the feeding mechanisms, and they are symmetrically arranged on both sides of the PCB conveying mechanism.

5. The SMT patch device for PCBA production according to claim 2, characterized in that: The displacement area of the chip head of the chip mounting mechanism covers each of the receiving and conveying mechanisms.

6. The SMT chip mounting device for manufacturing a PCBA board according to claim 1, wherein, It includes a baffle and a lifting mechanism. The lifting mechanism is used to control the lifting of the baffle. When the lifting mechanism rises, the baffle is used to prevent the PCB board on the PCB conveying mechanism from entering the receiving and conveying mechanism.

7. The SMT patch device for PCBA production according to claim 6, characterized in that: The baffle includes a blocking piece and a guiding rod; the lifting mechanism includes a first guiding platform and a second guiding platform. The first guiding platform and the second guiding platform are symmetrically arranged on each of the receiving and conveying mechanisms, and there is a gap between the first guiding platform and the second guiding platform; the guiding rod can move along the first guiding platform and the second guiding platform.

8. The SMT patching device for manufacturing PCBA boards according to claim 7, wherein, The first guiding platform includes a settling platform, a rising platform, and a high-position platform; when the guiding rod is located on the rising platform and the high-position platform, the blocking piece prevents the PCB board on the PCB conveying mechanism from entering the receiving and conveying mechanism.

9. The SMT chip mounting device for PCBA board manufacturing according to claim 7, wherein, The end of the guiding rod is provided with a roller.

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