Dispensing machine for semiconductor production and processing

Abstract

The invention relates to the technical field of semiconductor dispensing machines, in particular to a dispensing machine for semiconductor production and processing, which comprises a dispensing machine main body and a conveying mechanism arranged on the dispensing machine main body, the conveying mechanism comprises a supporting plate, and a conveying belt and an upper fixing plate are arranged on the supporting plate. The jacking piece is arranged on the supporting plate, and a hole shrinkage part is arranged on the jacking piece; the extrusion part is arranged outside the jacking part in a sliding mode, and a movable groove is formed in the extrusion part; the first spring is arranged between the jacking piece and the extrusion piece; the lifting part is arranged outside the extrusion part in a sliding manner, and a clamping cavity is formed in the lifting part; after the PCB is fixed, due to the descending of the lifting piece, a conveying path on the conveying belt cannot be blocked, the conveying belt can continuously convey the PCB forwards to a next dispensing part at the moment, and a plurality of dispensing machines can be arranged on one line to work at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor dispensing machines, and particularly to a dispensing machine for semiconductor production and processing. Background Art

[0002] When semiconductor devices are processed and produced, a dispensing machine is required for encapsulation, bonding, sealing, protection, or electrical connection.

[0003] A conveying mechanism is usually provided in the dispensing machine. During assembly line operation, a PCB board enters the conveying track of the conveying mechanism. After being conveyed under the dispensing head, the PCB board is blocked by a blocking cylinder, directly lifted and clamped by a clamping cylinder, and then dispensing is performed on the semiconductor device on the PCB board.

[0004] Since the track is occupied during the dispensing process, subsequent PCB boards need to wait for the current board to complete dispensing and leave before they can enter the station, resulting in an extended production line beat and low efficiency. Although segmented tracks or parallel designs can alleviate this problem, most production lines still adopt a single-track structure due to equipment cost and space layout limitations, and it is difficult to improve production capacity by deploying multiple dispensing machines.

[0005] Therefore, a dispensing machine for semiconductor production and processing is proposed. Summary of the Invention

[0006] In view of the problem in the above or existing technologies that it is impossible to meet the requirement of simultaneously using multiple dispensing machines for dispensing operations on one line, the present invention is proposed.

[0007] Therefore, the object of the present invention is to provide a dispensing machine for semiconductor production and processing.

[0008] To solve the above technical problems, the present invention provides the following technical solution: A dispensing machine for semiconductor production and processing, comprising a dispensing machine main body, and a conveying mechanism provided on the dispensing machine main body; the conveying mechanism includes a support plate, on which a conveyor belt and an upper fixing plate are provided; a lifting member provided on the support plate, with a reduced diameter portion provided on the lifting member; an extrusion member slidably provided outside the lifting member, with a movable groove provided on the extrusion member; a first spring provided between the lifting member and the extrusion member; a lifting member slidably provided outside the extrusion member, with a clamping cavity provided on the lifting member; a second spring provided between the extrusion member and the lifting member; a positioning ball movably provided in the movable groove and the clamping cavity; and a clamping member provided on the support plate.

[0009] As a preferred solution of the dispensing machine for semiconductor production and processing of the present invention, wherein: the clamping cavity includes an oblique arc groove, and a rising groove connected to the oblique arc groove; the lifting member is provided with a plurality of clamping cavities arranged in a circular array, and the oblique arc groove on the clamping cavity is aligned with the rising groove at one end away from the rising groove and the rising groove of the adjacent clamping cavity.

[0010] As a preferred solution of the dispensing machine for semiconductor production and processing of the present invention, the conveying mechanism further includes a limiting member provided on the support plate; the limiting member is used to limit the sliding of the lifting member outside the extrusion member.

[0011] As a preferred solution of the dispensing machine for semiconductor production and processing of the present invention, the lifting part includes a telescopic cylinder arranged on the support plate, and a support column arranged at the telescopic end of the telescopic cylinder, and a top sleeve is provided on the support column; the reduced diameter part is located outside the support column.

[0012] As a preferred solution of the dispensing machine for semiconductor production and processing of the present invention, the lifting member further includes a sliding rod provided on the support column, and an abutment block provided at the end of the sliding rod.

[0013] As a preferred solution of the dispensing machine for semiconductor production and processing of the present invention, the extrusion part includes a sliding sleeve slidably arranged on the outer wall of the top sleeve, and a lower cavity and an upper cavity arranged in the sliding sleeve, and also includes a resistance boss arranged at the end of the sliding sleeve; the first spring is located in the lower cavity; the resistance block is slidably arranged in the upper cavity.

[0014] As a preferred solution of the dispensing machine for semiconductor production and processing of the present invention, the lifting member includes a slip ring slidably arranged on the outer wall of the extrusion member, and an extrusion plate arranged on the slip ring.

[0015] As a preferred solution of the dispensing machine for semiconductor production and processing of the present invention, the lifting member also includes a limiting bar provided on the slip ring; the limiting member includes a fixed sleeve provided on the support plate, and a limiting groove provided on the fixed sleeve; the inner wall of the limiting groove and the outer wall of the limiting bar are slidably connected.

[0016] As a preferred solution of the glue dispensing machine for semiconductor production and processing of the present invention, a positioning block is provided on the extrusion plate.

[0017] As a preferred solution of the dispensing machine for semiconductor production and processing of the present invention, the clamping member includes a support shaft arranged on the support plate, and a deflection plate rotatably arranged on the support shaft, and a notch is provided on the deflection plate.

[0018] Advantages of the dispensing machine for semiconductor production and processing of the present invention: After the PCB board is fixed, since the lifting member descends, it will not block the conveying path on the conveyor belt. At this time, the conveyor belt can continue to convey the PCB board forward to the next dispensing position. It is possible to set up multiple dispensing machines on a single line to operate simultaneously. On the existing basis, the present invention can add more dispensing machines, thereby improving production capacity and significantly reducing the transformation cost. Brief Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a schematic diagram of the overall structure of the dispensing machine for semiconductor production and processing.

[0021] Figure 2 It is a schematic diagram of the internal structure of the dispensing machine for semiconductor production and processing.

[0022] Figure 3 It is a schematic diagram of the structure of the conveying mechanism of the dispensing machine for semiconductor production and processing.

[0023] Figure 4 It is a schematic diagram of the connection structure of the extrusion plate and the positioning block of the dispensing machine for semiconductor production and processing.

[0024] Figure 5 It is a schematic cross-sectional structure of the conveying mechanism of the dispensing machine for semiconductor production and processing.

[0025] Figure 6 It is a schematic diagram of the structure of the clamping cavity of the dispensing machine for semiconductor production and processing.

[0026] Figure 7 It is a schematic diagram of the structure during the lifting process of the PCB board.

[0027] Figure 8 It is a schematic diagram of the structure when the support column rises to align with the positioning ball.

[0028] Figure 9 It is a schematic diagram of the structure when the slip ring slides and abuts against the end of the fixed sleeve.

[0029] In the figure: 1. Glue dispenser main body; 2. Conveyor mechanism; 21. Support plate; 211. Conveyor belt; 212. Upper fixing plate; 22. Lifting member; 221. Reduced diameter portion; 222. Telescopic cylinder; 223. Support column; 224. Top sleeve; 225. Slide bar; 226. Contact block; 23. Extrusion member; 231. Activity groove; 232. Slide sleeve; 233. Lower cavity; 234. Upper cavity; 235. Contact boss; 24. First spring; 25. Lifting member; 251. Clamping cavity; 2511. Oblique arc groove; 2512. Rising groove; 252. Slide ring; 253. Extrusion plate; 254. Limit strip; 255. Positioning block; 26. Second spring; 27. Positioning ball; 28. Clamping member; 281. Support shaft; 282. Deflection plate; 283. Notch; 29. Limiting member; 291. Fixed sleeve; 292. Limiting groove; 3. PCB board; 4. Spacing adjustment mechanism. Specific embodiments

[0030] In order to make the above objects, features, and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings of the specification.

[0031] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar generalizations without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0032] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation manner of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that excludes other embodiments.

[0033] Example 1. Refer to Figures 1 to 6 , which is the first embodiment of the present invention. This embodiment provides a glue dispenser for semiconductor production and processing, including a glue dispenser main body 1 and a conveyor mechanism 2 provided on the glue dispenser main body 1. A spacing adjustment mechanism 4 is provided on the glue dispenser main body 1. There are two conveyor mechanisms 2, and one of the conveyor mechanisms 2 is connected to the spacing adjustment mechanism 4. The spacing adjustment mechanism 4 is a lead screw telescopic mechanism, and the distance between the two conveyor mechanisms 2 can be controlled through the spacing adjustment mechanism 4, so that the conveyor mechanism 2 can be applicable to PCB boards 3 of different sizes. The semiconductor devices on the PCB board 3 can be coated and encapsulated through the glue dispenser main body 1.

[0034] The conveying mechanism 2 includes a support plate 21, on which a conveyor belt 211 and an upper fixing plate 212 are provided; through the arrangement of the conveyor belt 211, it is convenient to convey and displace the PCB board 3. The upper fixing plate 212 is arranged above the conveyor belt 211. When dispensing glue on the PCB board 3, the upper fixing plate 212 is used to fit on the top of the PCB board 3 to limit the PCB board 3.

[0035] A lifting member 22 is arranged on the support plate 21, and a reduced-diameter portion 221 is provided on the lifting member 22; the lifting member 22 can be lifted and lowered.

[0036] An extrusion member 23 is slidably arranged outside the lifting member 22, and a movable groove 231 is provided on the extrusion member 23; a first spring 24 is arranged between the lifting member 22 and the extrusion member 23; the elastic force of the first spring 24 can make the extrusion member 23 have a tendency to move away from the lifting member 22.

[0037] A lifting member 25 is slidably arranged outside the extrusion member 23, and a clamping cavity 251 is provided on the lifting member 25; a second spring 26 is arranged between the extrusion member 23 and the lifting member 25; the elastic force of the second spring 26 can make the lifting member 25 have a tendency to move away from the top end of the extrusion member 23.

[0038] A positioning ball 27 is movably arranged in the movable groove 231 and the clamping cavity 251; a clamping member 28 is arranged on the support plate 21, and the clamping member 28 is used to clamp and fix the PCB board during the dispensing operation.

[0039] In the initial state, refer to Figure 5, the positioning ball 27 is located within the movable slot 231 and the clamping cavity 251. The positioning ball 27 abuts against the outer wall of the lifting member 22. Due to the abutment of the lifting member 22, the positioning ball 27 can only be located within the movable slot 231 and the clamping cavity 251. Therefore, the lifting member 25 is clamped outside the pressing member 23 by the positioning ball 27 through the clamping cavity 251. At this time, when the lifting member 25 is controlled to rise, the first spring 24 provides a supporting force to drive the pressing member 23 and the lifting member 25 to rise together. The pressing member 23 will approach the clamping member 28, and the lifting member 25 will lift the PCB board 3 located on the conveyor belt 211 until the upper surface of the PCB board 3 abuts against the upper fixing plate 212. Since the lifting member 25 is in a state of pressing the PCB board 3 against the upper fixing plate 212, the lifting member 22 will continue to rise and exert pressure on the first spring 24, causing the first spring 24 to compress. During this process, since the positioning ball 27 can only be located within the movable slot 231 and the clamping cavity 251, the pressing member 23 will not lift until the reduced diameter portion 221 of the lifting member 22 aligns with the movable slot 231. At this time, due to the existence of the reduced diameter portion 221, the positioning ball 27 can move, break away from the clamping cavity 251 and enter the movable slot 231 and the reduced diameter portion 221. Under the elastic force of the second spring 26, it will push the lifting member 25 to slide downward. When the lifting member 25 slides downward, it can push the positioning ball 27 to move in the direction of the reduced diameter portion 221. It should be noted that the elastic force of the second spring 26 is much greater than the elastic force of the first spring 24. Therefore, when the positioning ball 27 is displaced to the area where the reduced diameter portion 221 is located, the lifting member 25 has a greater downward sliding force, so it can provide a greater force to push the positioning ball 27 to be displaced into the reduced diameter portion 221. When the positioning ball 27 is displaced into the reduced diameter portion 221 and the movable slot 231, the second spring 26 pushes the lifting member 25 to slide downward, causing the lifting member 25 to descend and lose the abutment against the PCB board 3. At the same time, as long as the lifting member 25 slides downward and loses the restriction on the positioning ball 27, under the elastic force of the first spring 24, it will push the pressing member 23 to rise, the positioning ball 27 is ejected from the reduced diameter portion 221, the pressing member 23 abuts against the clamping member 28, and after the clamping member 28 is abutted, it will deflect to clamp and fix the PCB board 3, completing the fixation of the PCB board 3. At this time, the semiconductor on the PCB board 3 is dispensed through the dispensing machine main body 1. Since the lifting member 25 descends, it will not block the conveying path on the conveyor belt 211. At this time, the conveyor belt 211 can continue to convey the PCB board 3 forward to the next dispensing position. Multiple dispensing machines can be set up in a line to operate simultaneously. On the existing basis, more dispensing machines can be added to this invention, thereby improving production capacity and significantly reducing the transformation cost.

[0040] Moreover, when clamping the PCB board 3, the elastic force provided by the first spring 24 pushes the extrusion member 23 to rise. Therefore, during the clamping process, the clamping member 28 provides a flexible clamping force, which can avoid damaging the PCB board 3 caused by excessive pressure applied instantaneously during clamping, and the magnitude of the finally provided clamping force is determined by the rising height of the lifting member 22.

[0041] During the lifting process of the lifting member 25, if the PCB board 3 is not placed stably on the conveyor belt 211, and if the PCB board 3 gets stuck between the conveyor belt 211 and the upper fixing plate 212 and cannot be lifted, and if the lifting member 25 cannot push the PCB board 3 to rise after abutting against the PCB board 3, after the pressure rises to a certain level, after the first spring 24 is compressed and the positioning ball 27 and the reduced diameter portion 221 are aligned, the lifting member 25 will still slide down and stop lifting the PCB board 3 to protect the PCB board 3.

[0042] Specifically, the clamping cavity 251 includes an inclined arc groove 2511 and a rising groove 2512 connected to the inclined arc groove 2511; several clamping cavities 251 are provided on the lifting member 25 and are arranged in a circumferential array, and the end of the inclined arc groove 2511 on the clamping cavity 251 away from the rising groove 2512 is in an aligned state with the rising groove 2512 of the adjacent clamping cavity 251.

[0043] Furthermore, the conveying mechanism 2 further includes a limiting member 29 provided on the support plate 21; the limiting member 29 is used to limit the sliding of the lifting member 25 outside the extrusion member 23, so that the lifting member 25 can only perform up and down sliding and cannot rotate outside the extrusion member 23.

[0044] Refer to Figure 9 , during use, after the semiconductor device on the PCB board 3 is dot - glued and encapsulated, by the lowering of the lifting member 22, the extrusion member 23 is lowered. After the extrusion member 23 loses the abutment against the clamping member 28, under the action of gravity, the clamping member 28 deflects and resets, and the dot - glued PCB board 3 drops onto the conveyor belt 211 for conveying. As the lifting member 22 descends, the positioning ball 27 will align with the top of the inclined arc groove 2511, and the extrusion member 23 is rotated through the guidance of the inclined arc groove 2511 until the positioning ball 27 slides from the inclined arc groove 2511 into the rising groove 2512. At this time, the reset of the device is completed to facilitate the lifting and dot - gluing of the next PCB board 3.

[0045] Embodiment 2, refer to Figures 1 to 9, which is the second embodiment of the present invention. Different from the previous embodiment, the lifting member 22 includes a telescopic cylinder 222 provided on the support plate 21, and a support column 223 provided at the telescopic end of the telescopic cylinder 222, and a top sleeve 224 is provided on the support column 223; the telescopic cylinder 222 can control the support column 223 to rise or fall, and the outer wall diameter of the top sleeve 224 matches the inner wall diameter of the extrusion member 23. The top sleeve 224 is used to limit the positioning ball 27 so that it cannot be detached from the clamping cavity 251, and the reduced diameter portion 221 is located outside the support column 223.

[0046] Specifically, the lifting member 22 further includes a sliding rod 225 provided on the support column 223 and an abutment block 226 provided at the end of the sliding rod 225 .

[0047] Furthermore, the extrusion member 23 includes a sliding sleeve 232 slidably arranged on the outer wall of the top sleeve 224, and a lower cavity 233 and an upper cavity 234 arranged in the sliding sleeve 232, and also includes a resistance boss 235 arranged at the end of the sliding sleeve 232; the first spring 24 is located in the lower cavity 233; and the resistance block 226 is slidably arranged in the upper cavity 234.

[0048] The rest of the structure is the same as that of Example 1.

[0049] When in use, the extension of the telescopic cylinder 222 causes the support column 223 to rise, thereby driving the lifting member 25 and the extruding member 23 to rise together. When the lifting member 25 lifts the PCB board 3 to abut against the upper fixing plate 212, the telescopic cylinder 222 continues to extend, causing the support column 223 to compress the first spring 24, thereby causing the top sleeve 224 to slide up until the support column 223 and the positioning ball 27 are aligned. Figure 8 At this time, due to the sliding rise of the support column 223, the sliding rod 225 and the interference block 226 will rise, and the interference block 226 will extend from the upper cavity 234. The interference block 226 can first interfere with the clamping member 28, causing it to initially deflect and complete the support of the PCB board 3. After the support column 223 and the positioning ball 27 are aligned, the elastic force of the second spring 26 will cause the lifting member 25 to descend. The early deflection of the clamping member 28 by the interference block 226 can prevent the PCB board 3 from falling at the moment when the lifting member 25 loses its support. After the lifting member 25 slides down and loses the restriction on the positioning ball 27, the elastic force of the first spring 24 pushes the sliding sleeve 232 to rise, so that the contact boss 235 contacts the clamping member 28, and the pressure applied by the contact boss 235 causes the clamping member 28 to deflect and clamp. It should be noted that at this time, the pressure of the first spring 24 can be adjusted by continuing to control the extension of the telescopic cylinder 222 until the telescopic cylinder 222 moves to the maximum stroke. At this time, the contact block 226 also contacts the clamping member 28, and the clamping member 28 is in a state of maximum clamping force.

[0050] In summary, when clamping the PCB board 3 through the clamping member 28, a flexible clamping force can be provided, and when the telescopic cylinder 222 extends to the maximum stroke, the clamping member 28 can provide the maximum clamping force to clamp the PCB board 3.

[0051] Embodiment 3. Refer to Figures 1 to 9 , which is the third embodiment of the present invention. Different from the previous embodiment, the lifting member 25 includes a sliding ring 252 slidably disposed on the outer wall of the pressing member 23, and a pressing plate 253 disposed on the sliding ring 252. The pressing plate 253 is used to lift the PCB board 3.

[0052] Specifically, the lifting member 25 further includes a limiting strip 254 disposed on the sliding ring 252; the limiting member 29 includes a fixed sleeve 291 disposed on the support plate 21, and a limiting groove 292 disposed on the fixed sleeve 291; the inner wall of the limiting groove 292 is slidably connected to the outer wall of the limiting strip 254. The setting of the limiting strip 254 and the limiting groove 292 can make the sliding ring 252 unable to rotate and can only slide up and down.

[0053] Furthermore, a positioning block 255 is disposed on the pressing plate 253. The setting of the positioning block 255 facilitates the positioning of the conveyed PCB board 3.

[0054] The clamping member 28 includes a support shaft 281 disposed on the support plate 21, and a deflecting plate 282 rotatably disposed on the support shaft 281. A notch 283 is disposed on the deflecting plate 282. The deflecting plate 282 is made of rubber material. The setting of the notch 283 facilitates clamping the PCB board 3.

[0055] The remaining structures are the same as those in Embodiment 2.

[0056] Refer to Figure 5 , set Figure 5 the state of the conveying mechanism 2 in as the initial state. When the dispensing machine main body 1 performs dispensing, first control the telescopic cylinder 222 to slightly extend, so that the height of the positioning block 255 is above the upper surface of the conveyor belt 211, and the height of the pressing plate 253 is below the upper surface of the conveyor belt 211. At this time, the conveyor belt 211 conveys the PCB board 3, and the positioning block 255 blocks the conveyance of the PCB board 3 to complete the position positioning of the PCB board 3.

[0057] Through the extension of the telescopic cylinder 222, the entire lifting member 25 is lifted, and the PCB board 3 is lifted. The process of lifting the PCB board 3 refers to Figure 7 , until the PCB board 3 abuts against the upper fixing plate 212. At this time, if the telescopic cylinder 222 continues to extend, the support column 223 will rise to be aligned with the positioning ball 27. Refer to Figure 8At this time, the abutment block 226 is in a state of extending out of the upper cavity 234. The abutment block 226 first abuts against the deflection plate 282 to cause it to initially deflect and limit the PCB board 3. Under the elastic force of the second spring 26, the slip ring 252 slides down, and then the extrusion plate 253 descends until the slip ring 252 abuts against the end of the fixed sleeve 291. Figure 9 At this time, under the elastic force of the first spring 24, the sliding sleeve 232 is pushed up to contact the deflection plate 282 to complete the clamping and fixing of the PCB board 3.

[0058] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A dispensing machine for semiconductor production and processing, characterized in that: It comprises a glue dispensing machine body (1), and a conveying mechanism (2) provided on the glue dispensing machine body (1); The conveying mechanism (2) comprises: A support plate (21) on which a conveyor belt (211) and an upper fixing plate (212) are provided; A lifting member (22) is provided on the supporting plate (21), and a reduced diameter portion (221) is provided on the lifting member (22); An extrusion member (23) is slidably arranged outside the lifting member (22), and a movable groove (231) is provided on the extrusion member (23); a first spring (24) disposed between the lifting member (22) and the extruding member (23); A lifting member (25) is slidably arranged outside the extrusion member (23), and a clamping cavity (251) is provided on the lifting member (25); a second spring (26) disposed between the extrusion member (23) and the lifting member (25); A positioning ball (27) is movably disposed in the movable groove (231) and the engaging cavity (251); The clamping member (28) is arranged on the supporting plate (21).

2. The dispensing machine for semiconductor production and processing according to claim 1, characterized in that: The clamping cavity (251) comprises an oblique arc groove (2511) and a rising groove (2512) connected to the oblique arc groove (2511); The lifting member (25) is provided with a plurality of engaging cavities (251) arranged in a circumferential array, and one end of the oblique arc groove (2511) on the engaging cavity (251) away from the rising groove (2512) is aligned with the rising groove (2512) of the adjacent engaging cavity (251).

3. The dispensing machine for semiconductor production and processing according to claim 2, wherein: The conveying mechanism (2) further includes a limiting member (29) provided on the supporting plate (21); The limiting member (29) is used to limit the sliding of the lifting member (25) outside the extrusion member (23).

4. The dispensing machine for semiconductor production and processing according to claim 3, wherein: The lifting member (22) comprises a telescopic cylinder (222) provided on the support plate (21), and a support column (223) provided at the telescopic end of the telescopic cylinder (222), wherein a top sleeve (224) is provided on the support column (223); The reduced diameter portion (221) is located outside the support column (223).

5. The dispensing machine for semiconductor production and processing according to claim 4, wherein: The lifting member (22) further includes a sliding rod (225) provided on the supporting column (223), and a resisting block (226) provided at the end of the sliding rod (225).

6. The dispensing machine for semiconductor production and processing according to claim 5, wherein: The extrusion member (23) includes a sliding sleeve (232) slidably arranged on the outer wall of the top sleeve (224), a lower cavity (233) and an upper cavity (234) arranged in the sliding sleeve (232), and also includes an abutment boss (235) arranged at the end of the sliding sleeve (232); The first spring (24) is located in the lower cavity (233); The resisting block (226) is slidably disposed in the upper cavity (234).

7. The dispensing machine for semiconductor production and processing according to any one of claims 4 to 6, characterized in that: The lifting member (25) comprises a slip ring (252) slidably arranged on the outer wall of the extrusion member (23), and an extrusion plate (253) arranged on the slip ring (252).

8. The dispensing machine for semiconductor production and processing according to claim 7, wherein: The lifting member (25) further includes a limiting strip (254) provided on the slip ring (252); The limiting member (29) includes a fixed sleeve (291) provided on the support plate (21), and a limiting groove (292) provided on the fixed sleeve (291); The inner wall of the limiting groove (292) is slidably connected to the outer wall of the limiting strip (254).

9. The dispensing machine for semiconductor production and processing according to claim 8, characterized in that: A positioning block (255) is provided on the pressing plate (253).

10. The dispensing machine for semiconductor production and processing according to any one of claims 1 to 6, characterized in that: The clamping member (28) includes a support shaft (281) provided on the support plate (21), and a deflection plate (282) rotatably provided on the support shaft (281). A notch (283) is provided on the deflection plate (282).

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