Solder strip pre-bending method and string laying device

Abstract

The invention provides a welding strip pre-bending method and a string laying device. According to the welding strip pre-bending method, a welding strip pre-bending assembly provided with a plurality of welding strip clamps is included, and the welding strip clamps clamp a welding strip and keep the clamping state in the welding strip pre-bending process; on the welding strip laying plane, a plurality of welding strip clamps are controlled to clamp different positions of the welding strip at intervals at the same time; the welding strip clamps are controlled to ascend by a first preset distance, and meanwhile the welding strip sections between the adjacent welding strip clamps are fixed; or controlling the welding strip clamp to ascend for a second preset distance, and controlling the welding strip section between the adjacent welding strip clamps to press downwards for a third preset distance, or controlling the welding strip clamp to be fixed and controlling the welding strip section between the adjacent welding strip clamps to press downwards for a fourth preset distance; wherein the welding strip is pre-bent to form a welding strip body with a target length; and the welding strip body is laid on the welding strip laying plane by the welding strip clamp. The positioning precision in the welding strip pre-bending and laying process is improved, and then the quality of string laying and string manufacturing is improved.

Description

Technical Field

[0001] This application relates to the technical field of battery string processing, and particularly relates to a method for pre-bending a solder ribbon and a string laying device. Background Art

[0002] In the field of photovoltaic technology, when using a solder ribbon to fixedly connect solar cells, whether it is a flat solder ribbon or a round solder ribbon, after being heated and welded on the surface of the solar cell, due to thermal expansion and contraction, the battery string will bend. The bent battery string may cause hidden cracks or damage to the solar cells in the battery string during subsequent lamination. Therefore, the solder ribbon between the pad points (i.e., the points welded to the solder ribbon) of the solar cell needs to be set in a bent state, so that the solder ribbon has extra parts to compensate for the shrinkage after welding, thereby solving the problem of warping of the battery string; especially for a single-sided welded battery string, the whole welded battery string will bend towards the welding surface.

[0003] Currently, by bending the solder ribbon to be welded, the length of the solder ribbon between two pad points is made greater than the distance between the pad points. The common bending structure is an upper die and a lower die. The solder ribbon is pressed into a preset bending degree by the die, and then the bent solder ribbon is transported to the surface of the solar cell for welding. However, on the one hand, the bent solder ribbon is not convenient to transport. On the other hand, during the transportation of the bent solder ribbon, the bent shape of the solder ribbon may change, making it impossible to accurately position the solder ribbon on the solar cell, and it is easy to cause misalignment of the welding position between the solder ribbon and the solar cell, thus affecting the welding quality of the battery string. That is, the method of bending the solder ribbon separately and then laying it in the prior art has low positioning accuracy of the solder ribbon and is difficult to transport. Summary of the Invention

[0004] The embodiments of the present invention provide a method for pre-bending a solder ribbon and a string laying device, which can solve the problems in the aforementioned prior art.

[0005] In a first aspect, the present invention provides a method for pre-bending a solder ribbon. The method for pre-bending a solder ribbon uses a solder ribbon pre-bending assembly. The solder ribbon pre-bending assembly includes a plurality of solder ribbon clips for clamping the solder ribbon. The plurality of solder ribbon clips clamp the solder ribbon and maintain the clamping state during the process of pre-bending the solder ribbon.

[0006] Above the solder ribbon laying plane, control the plurality of solder ribbon clips to clamp different positions of the solder ribbon at the same time and at intervals.

[0007] Control the solder ribbon clips to rise by a first preset distance, and at the same time fix the solder ribbon section between adjacent solder ribbon clips; or, control the solder ribbon clips to rise by a second preset distance, and at the same time control the solder ribbon section between adjacent solder ribbon clips to press down by a third preset distance, or, control the solder ribbon clips not to move and at the same time control the solder ribbon section between adjacent solder ribbon clips to press down by a fourth preset distance; wherein, the solder ribbon is pre-bent to form a solder ribbon body with a target length.

[0008] The solder tape clip lays the solder tape body on the solder tape laying plane.

[0009] Optionally, the solder tape pre-bending assembly further includes an external pressing tool, and a plurality of the solder tape clips are arranged to grab the solder tape located directly below the pressing tool after passing through the pressing tool.

[0010] Control the solder tape clip to rise by a first preset distance, and at the same time, the pressing tool fixes the solder tape section between adjacent solder tape clips; or, control the solder tape clip to rise by a second preset distance, and at the same time, the pressing tool presses down the solder tape section between adjacent solder tape clips by a third preset distance; or, control the solder tape clip to remain stationary and control the pressing tool to press down the solder tape section between adjacent solder tape clips by a fourth preset distance.

[0011] Optionally, the solder tape pre-bending assembly further includes a convex block connected to the solder tape clip, and the convex block is arranged between two adjacent solder tape clips.

[0012] Control the solder tape clip to rise by a first preset distance, and at the same time, the convex block fixes the solder tape section between adjacent solder tape clips; or, control the solder tape clip to rise by a second preset distance, and at the same time, the convex block presses down the solder tape section between adjacent solder tape clips by a third preset distance; or, control the solder tape clip to remain stationary and control the convex block to press down the solder tape section between adjacent solder tape clips by a fourth preset distance.

[0013] Optionally, the method further includes

[0014] When releasing the solder tape body, control the lowest surface of the pressing tool or the convex block and the bottommost end surface of the solder tape clip to satisfy a preset height difference, and control the solder tape pre-bending assembly to move downward to place the solder tape body on the solder tape laying plane.

[0015] Optionally, the method further includes

[0016] When the original length of the solder tape to be pre-bent is greater than the target length of the solder tape body after pre-bending, a plurality of the solder tape clips are arranged to move closer to the middle of the solder tape to pre-bend the solder tape between the solder tape clips; or, a plurality of the solder tape clips are arranged to elastically clamp the solder tape, and control the solder tape section between adjacent solder tape clips to move downward so that the solder tape between the solder tape clips twitches and bends downward within the solder tape clips.

[0017] When the original length of the solder tape to be pre-bent is equal to the target length of the solder tape body after pre-bending, control a plurality of the solder tape clips to maintain a preset clamping distance to fixedly clamp the solder tape and rise so that the solder tape is stretched; or, control the solder tape clips to maintain a preset clamping distance to fixedly clamp the solder tape, and control the solder tape section between adjacent solder tape clips to move downward so that the solder tape between the solder tape clips is stretched and bends downward.

[0018] Optionally, the method further includes:

[0019] It includes a welding ribbon pre-bending support platform, and controls the welding ribbon pre-bending assembly to cooperate with the welding ribbon pre-bending support platform to pre-bend the welding ribbon;

[0020] The ribbon clamps are controlled to clamp the ribbon and move them close to the ribbon pre-bending support platform, and the ribbon segments between adjacent ribbon clamps are fixed to press the ribbon toward the ribbon pre-bending support platform, so that the ribbon segments between adjacent ribbon clamps are pre-bent.

[0021] Optionally, after the solder ribbon pre-bending assembly independently pre-bends the solder ribbon on the battery cell, the solder ribbon body is released on the surface of the battery cell; or, after the solder ribbon clamp cooperates with the pre-bending support platform to pre-bend the solder ribbon, the solder ribbon pre-bending assembly is controlled to move from the solder ribbon pre-bending support platform to the battery cell, and the solder ribbon body is placed on the surface of the battery cell.

[0022] Optionally, the surface of the press or the bump in contact with the welding strip is an arc surface or a plane surface.

[0023] In the second aspect, the present invention provides a string laying device, which is used to perform any of the aforementioned solder strip pre-bending methods. The string laying device also includes: a string laying table and a battery cell gripper. The string laying table is used to carry the battery cell gripped by the battery cell gripper, and the solder strip pre-bending assembly is used to grab the solder strip and lay the obtained solder strip body on the surface of the battery cell after pre-bending.

[0024] Optionally, a heating unit is further included, which is arranged under the string-laying table or above the string-laying table and is used to weld the welding strip to the surface of the battery cell.

[0025] The beneficial effects of the present invention are:

[0026] When pre-bending the welding strip, first use the welding strip clamp to clamp the welding strip to be pre-bent and suspend it above the plane where the welding strip will be placed, so as to avoid the welding strip clamp from damaging the plane where the welding strip is placed during the pre-bending process; in addition, the welding strip clamp in the welding strip pre-bending assembly always keeps the welding strip in a clamped state, so that the position of the welding strip before and after pre-bending is unique. That is, the present invention uses the welding strip clamp to grab the welding strip to be pre-bent and suspend it above the plane to be laid, and then uses the clamping and lifting action of the welding strip clamp to form a plurality of bundles on a welding strip, thereby folding the welding strip into a welding strip body structure; moreover, in the process of placing the welding strip on the plane to be laid after the bending starts and ends, the welding strip remains clamped by the welding strip clamp, the welding strip clamp does not separate from the welding strip, and the position of the welding strip is completely positioned by the welding strip clamp, which reduces the transportation action of the welding strip, improves the positioning accuracy during the pre-bending and laying process of the welding strip, and further improves the quality of laying and stringing. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It shows a pre-bending schematic diagram of the first solder tape pre-bending method provided by the embodiments of the present application, which includes an external press tool;

[0028] Figure 2 It shows a solder tape body obtained by a solder tape pre-bending method provided by the embodiments of the present application;

[0029] Figure 3 It shows a pre-bending schematic diagram of the second solder tape pre-bending method provided by the embodiments of the present application, which includes a bump;

[0030] Figure 4 It shows a schematic diagram of the tape release after the solder tape is pre-bent in the embodiments of the present application;

[0031] Figure 5 It shows a schematic diagram of the pre-bending steps when the length of the solder tape to be pre-bent is greater than the length of the wooden ratio solder tape in the embodiments of the present application;

[0032] Figure 6 It shows a schematic diagram of the solder tape body being laid by the string laying device provided by the embodiments of the present application.

[0033] Reference numerals:

[0034] 1: Solder tape pre-bending assembly; 11: Solder tape clamp; 12: Press tool; 13: Bump; 21: String laying table; 100: Solder tape body. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the application. In addition, the phrase "in one embodiment" or "in an embodiment" that appears throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0036] It should also be noted that in this article, relational terms such as first and second are only used to distinguish one entity from another entity, and do not necessarily require or imply any actual relationship or order between these entities. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover a non-exclusive inclusion, so that an article or terminal device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such article or terminal device. Without further limitation, an element defined by the statement "including an..." does not exclude the existence of additional identical elements in the article or terminal device including the element.

[0037] The bottom surface of the solder tape that bends downward between the solder tape clamps is used to contact the welding points on the battery cell and heat for welding and interconnection.

[0038] Referring to Figures 1 to 6 as shown, the embodiment of the present invention provides a method for pre-bending a solder tape and a string laying device.

[0039] In a first aspect, the present invention provides a method for pre-bending a solder tape. The method for pre-bending a solder tape uses a solder tape pre-bending assembly 1. The solder tape pre-bending assembly 1 includes a plurality of solder tape clips 11 for clamping the solder tape. The plurality of solder tape clips 11 clamp the solder tape and maintain the clamping state during the process of pre-bending the solder tape.

[0040] Above the solder tape laying plane, control the plurality of solder tape clips 11 to clamp different positions of the solder tape at the same time and at intervals.

[0041] Control the solder tape clip 11 to rise by a first preset distance, and at the same time fix the solder tape section between adjacent solder tape clips 11; or, control the solder tape clip 11 to rise by a second preset distance, and at the same time control the solder tape section between adjacent solder tape clips 11 to press down by a third preset distance, or, control the solder tape clip 11 not to move and at the same time control the solder tape section between adjacent solder tape clips 11 to press down by a fourth preset distance; wherein, after the solder tape is pre-bent, a solder tape body 100 with a target length is formed.

[0042] The solder tape clip 11 lays the solder tape body 100 on the solder tape laying plane.

[0043] As described above, the present invention provides a method for pre-bending a solder tape. After the solder tape to be pre-bent is picked up by the solder tape clip 11 and suspended relative to the plane to be laid, a plurality of bulges are formed on one solder tape by the clamping and lifting actions of the solder tape clip 11, so as to fold the solder tape into the structure of the solder tape body 100; moreover, during the process of placing the solder tape towards the plane to be laid at the beginning and end of the bending, the solder tape remains clamped by the solder tape clip 11, the solder tape clip 11 does not disengage from the solder tape, and the position of the solder tape is completely positioned by the solder tape clip 11, reducing the rotational movement of the solder tape, improving the positioning accuracy during the pre-bending and laying of the solder tape, and further improving the quality of string laying and string making.

[0044] The first implementable manner is:

[0045] In addition to the solder tape clip 11, the foregoing solder tape pre-bending assembly 1 further includes an external pressing tool 12. The plurality of solder tape clips 11 are arranged to pass through the pressing tool 12 and grab the solder tape located directly below the pressing tool 12. Control the solder tape clip 11 to rise by a first preset distance, and at the same time the pressing tool 12 fixes the solder tape section between adjacent solder tape clips 11; or, control the solder tape clip 11 to rise by a second preset distance, and at the same time the pressing tool 12 presses down the solder tape section between adjacent solder tape clips 11 by a third preset distance, or, control the solder tape clip 11 not to move and at the same time control the pressing tool 12 to press down the solder tape section between adjacent solder tape clips 11 by a fourth preset distance.

[0046] Specifically, as shown in Figure 1 and Figure 2As shown, during pre-bending, multiple rows of ribbon clamps 11 corresponding to the number of ribbon strips are lowered from directly above the press 12, and after passing through the through holes or vias on the press 12, the ribbon is clamped and removed from the receiving surface of the ribbon together with the press 12. After being lifted into the air, the press 12 can be controlled to press the ribbon so that it does not move, and the ribbon clamps 11 can be controlled to intermittently lift different positions of the ribbon by a first preset distance, thereby forming a plurality of raised bumps on the ribbon. Alternatively, the press 12 can be controlled to press down a third preset distance while the ribbon clamps 11 are controlled to lift a second preset distance. Alternatively, the ribbon clamps 11 can be controlled to remain stationary, and only the press 12 can be controlled to press down the ribbon segment between adjacent ribbon clamps 11 by a fourth preset distance, both of which can result in the ribbon being bent.

[0047] It should be noted that the presser 12 in the aforementioned embodiment may include a pressure pin for point contact with the solder ribbon, or may be configured as a pressure block for linear contact with the solder ribbon. This is not specifically limited in the embodiment and may be specifically designed in actual use. In addition, the bottom surface of the solder ribbon, which is bent downward between the solder ribbon clamps 11, is used to contact the solder ribbon laying surface (such as the soldering point on the surface of the solar cell) and is subsequently heated and welded to interconnect the solder ribbon and the solar cell.

[0048] The second possible implementation is:

[0049] The aforementioned solder ribbon pre-bending assembly 1 may further include a protrusion 13 connected to the solder ribbon clamp 11, and the protrusion 13 is arranged between two adjacent solder ribbon clamps 11;

[0050] The ribbon clamp 11 is controlled to rise a first preset distance, and the protrusion 13 fixes the ribbon segments between adjacent ribbon clamps 11; or, the ribbon clamp 11 is controlled to rise a second preset distance, and the protrusion 13 presses the ribbon segments between adjacent ribbon clamps 11 down a third preset distance, or, the ribbon clamp 11 is controlled to remain stationary, and the protrusion 13 is controlled to press the ribbon segments between adjacent ribbon clamps 11 down a fourth preset distance.

[0051] like Figure 2 and Figure 3 As shown, the ribbon clamp 11 and the protrusion 13 are interconnected in the same device (i.e., the ribbon pre-bending assembly 1), with the protrusion 13 located between the two ribbon clamps 11. During pre-bending, the ribbon clamp 11 lifts the ribbon and raises it. Once in the air, the protrusion 13 can be controlled to press against the ribbon and keep it stationary, while the ribbon clamp 11 is controlled to intermittently raise different positions of the ribbon by a first preset distance, thereby forming a plurality of raised bumps on the ribbon. Alternatively, the ribbon clamp 11 can be raised by a second preset distance while the protrusion 13 is controlled to press down by a third preset distance. Alternatively, the ribbon clamp 11 can be controlled to remain stationary while the protrusion 13 is controlled to press down by a fourth preset distance, thereby bending the ribbon.

[0052] In the foregoing embodiments, it should be noted that the first preset distance, the second preset distance, the third preset distance, and the fourth preset distance are all related to the actual distance between the battery cell and the solder tape clip 11, the length of the solder tape clip 11, and the falling distance of the solder tape. The present invention does not make specific limitations thereto. After the solder tape is pre-bent, when the formed solder tape body is placed on the surface of the battery cell, the bent bottom surface between the solder tape clips 11 is used to contact the welding point on the surface of the battery cell, and the solder tape and the battery cell are interconnected by subsequent heating and welding.

[0053] It should be noted that in the foregoing two embodiments, after the solder tape is pre-bent, the preset height difference is satisfied between the lowest surface of the pressing tool 12 or the bump 13 and the outermost end surface of the solder tape clip 11, and the solder tape pre-bending assembly 1 is controlled to move downward to place the solder tape body 100 on the solder tape laying plane; the solder tape laying plane includes the surface of the battery cell or other planes.

[0054] After the solder tape is pre-bent, it needs to be placed on the battery cell or other supporting surfaces. When placing the solder tape, as Figure 1 and Figure 4 shown, because there is a certain height difference between the end surface of the lowermost end of the solder tape clip 11 and the position held by the solder tape clip 11, this can ensure that the solder tape is fixed by the solder tape clip 11. In addition, the surface of the solder tape pressed by the bump 13 or the pressing tool 12 should be lower than the outermost end surface of the solder tape clip 11, so as to ensure that the end surfaces of the bump 13 and the pressing tool 12 will not damage the battery cell laid directly below the solder tape when the solder tape clip 11 descends to release the solder tape. Therefore, when the solder tape clip 11 releases the solder tape, it is necessary to control the pressing tool 12 or the bump 13 to move up and down a certain distance; and return to the pre-bending position during the next pre-bending.

[0055] In some embodiments, when the original length of the solder tape to be pre-bent is greater than the length of the pre-bent solder tape body 100, multiple solder tape clips 11 are arranged to approach the middle of the solder tape to pre-bend the solder tape between the solder tape clips 11, or multiple solder tape clips 11 are arranged to elastically clamp the solder tape, and the solder tape segment between adjacent solder tape clips 11 is controlled to move downward so that the solder tape between the solder tape clips 11 twitches and bends downward within the solder tape clips 11.

[0056] When the original length of the solder tape to be pre-bent is equal to the length of the pre-bent solder tape body 100, control multiple solder tape clips 11 to fixedly clamp the solder tape at a preset clamping distance and rise to stretch the solder tape, or control the solder tape clips 11 to fixedly clamp the solder tape at a preset clamping distance, and control the solder tape segment between the solder tape clips 11 to move downward so that the solder tape between the solder tape clips 11 is stretched and bent downward.

[0057] The foregoing method is described below in conjunction with the foregoing pressing tool 12 or bump 13:

[0058] When pre-bending the ribbon, one option is to pre-bend a ribbon of the same length as the target length. During pre-bending, the ribbon clamps 11 are held in a fixed position and a certain tension is applied. Under the clamping action of the ribbon clamps 11, the ribbon is stretched and thinned, resulting in the desired deformed ribbon. Alternatively, the ribbon clamps 11 can be held fixed in place, and the press 12 or bumps 13 between the ribbon clamps 11 can be used to press the ribbon segment they abut against downward by a certain distance, thereby stretching the ribbon segment between the ribbon clamps 11 and bending it downward.

[0059] Another method is to select a pre-bent welding ribbon that is longer than the target length. During pre-bending, the welding ribbon to be pre-bent shrinks under the cooperation of the welding ribbon clamp 11 and the press 12 or the protrusion 13, forming a downwardly bent structure between the welding ribbon clamps 11. Specifically, the multiple welding ribbon clamps 11 can be controlled to clamp the welding ribbon and move closer to the middle of the welding ribbon, that is, to compress the spacing between adjacent welding ribbon clamps 11. Alternatively, the multiple welding ribbon clamps 11 can be controlled to be configured to elastically clamp the welding ribbon, and the welding ribbon segment between adjacent welding ribbon clamps 11 moves downward under the action of the press 12 or the protrusion 13, thereby achieving the pre-bending effect.

[0060] like Figure 5 As shown, the strip to be welded that is longer than the target length is selected for pre-bending, that is, the margin required to reach the target strip length after pre-bending is calculated according to the pre-bending degree of the strip, and the strip is cut into a strip to be pre-bent that is longer than the target length by increasing the margin; when the strip clamp 11 clamps the strip to be pre-bent for pre-bending, multiple strip clamps 11 are set so that the center line position of the strip to be pre-bent is symmetrically close to the center line of the strip, so as to obtain a pre-bent strip that is not deformed.

[0061] In this embodiment, the pre-bent welding strip is a wavy linear structure when viewed from the front, such as Figure 2 The structure of the welding strip body 100 is shown. Of course, if the distance between the two bundles is required to be larger, the distance between the two adjacent welding strip clips 11 can be adjusted, and the welding strip body 100 can be made relatively flat.

[0062] In some embodiments, a ribbon pre-bending support platform may be included to pre-bend the ribbon. The ribbon pre-bending assembly 1 is controlled to cooperate with the ribbon pre-bending support platform to pre-bend the ribbon. Specifically, the ribbon clamps 11 are controlled to clamp the ribbon and then approach the ribbon pre-bending support platform. The ribbon segment between adjacent ribbon clamps 11 is fixed and pressed against the ribbon pre-bending support platform, so that the ribbon segment between adjacent ribbon clamps 11 is pre-bent.

[0063] The solder ribbon pre-bending support table can be set as a groove matching the press tool 12 or the bump 13, and an avoidance hole for avoiding the solder ribbon clamp 11 is set at the same time. After controlling the solder ribbon clamp 11 to clamp the solder ribbon and move downward close to the solder ribbon pre-bending support table, the press tool 12 or the bump 13 presses the solder ribbon section between the solder ribbon clamps 11 into the groove on the solder ribbon pre-bending support table, so as to form a downward-bent solder ribbon section. In this embodiment, the solder ribbon pre-bending assembly 1 is above the solder ribbon pre-bending support table. After the solder ribbon is pre-bent, the solder ribbon pre-bending assembly 1 is controlled to move above the battery cell and clamp the solder ribbon to fall on the battery cell.

[0064] In the present invention, after the solder ribbon pre-bending assembly 1 pre-bends the solder ribbon independently above the battery cell, the solder ribbon body 100 is released on the surface of the battery cell, or, after the solder ribbon clamp 11 cooperates with the solder ribbon pre-bending support table to pre-bend the solder ribbon, the solder ribbon pre-bending assembly 1 is controlled to move from the solder ribbon pre-bending support table above the battery cell and place the solder ribbon body 100 on the surface of the battery cell. After the pre-bent solder ribbon body is placed on the surface of the battery cell, the bent section fits with the welding point on the battery cell, waiting for subsequent heating welding to fixedly connect the solder ribbon body 100 with the surface of the battery cell.

[0065] In some embodiments, the surface of the press tool 12 or the bump 13 in contact with the solder ribbon is an arc surface, or the contact surface is a flat surface, and an arc-shaped groove can also be provided on the flat contact surface. In this embodiment, in order to increase the effect of solder ribbon pre-bending, the surface of the bump 13 or the press tool 12 pressing the solder ribbon between the two bulges lifted by the solder ribbon clamp 11 is set as an arc surface or an arc-shaped groove. During pre-bending, the solder ribbon fits with the arc surface or the arc-shaped groove, so that the solder ribbon between the two bulges is in a smooth curve shape.

[0066] In a second aspect, the present invention provides a string laying device, which is used to execute the foregoing solder ribbon pre-bending method. The string laying device further includes: a string laying table 21 and a battery cell gripper, wherein the string laying table 21 is used to carry the battery cell grabbed by the battery cell gripper, and the solder ribbon pre-bending assembly 1 is used to grab the solder ribbon and lay the obtained solder ribbon body 100 on the surface of the battery cell after pre-bending.

[0067] In this embodiment, as Figure 6As shown, the battery string to be strung can be such that the welding tape is laid and welded on one side of the battery cell, or the welding tape can be laid and welded on both sides of the battery cell. Taking the battery string with the welding tape laid on one side as an example, during the laying process, it is necessary to first place the battery cell on the stringing table 21, then grab the welding tape, pre-bend it and place it on the battery cell so that the welding tape coincides with the welding points on the battery cell. The pressing tool 12 or the bump 13 can ensure that the welding tape is stable at the preset position on the surface of the battery cell; when the pressing tool 12 is included, during the pre-bending and laying of the welding tape, the welding tape needs to be pre-bent and laid according to the welding tape pre-bending assembly 1 including the pressing tool 12 as described above. After welding is completed, the pressing tool 12 and the welding tape clamp 11 are moved away from the surface of the battery cell. When the bump 13 is included, during the pre-bending and laying of the welding tape, the welding tape needs to be pre-bent and laid according to the welding tape pre-bending assembly 1 including the bump 13 as described above. After welding is completed, the bump 13 is retracted and the welding tape clamp 11 is moved away from the surface of the battery cell.

[0068] In some other embodiments, the stringing device can also be provided with a structure for separately handling the pressing tool to separately complete the actions of picking up and placing the pressing tool 12, or the structure for handling the pressing tool can be integrated on the moving mechanism for fixing the welding tape clamp 11. The battery cell gripper is a handling mechanism for transporting the battery cell to the stringing table 21, and the basic vacuum suction cup can be used to realize the grasping and placing actions of the battery cell.

[0069] Based on the foregoing welding tape pre-bending method, the stringing device composed of the stringing table 21, the battery cell gripper, etc. improves the accuracy of welding tape pre-bending and laying, and thus improves the stringing quality of the stringing device.

[0070] In some embodiments, the foregoing stringing device further includes a heating unit. The heating unit is disposed below the stringing table 21 or above the stringing table 21 and is used to weld the welding tape body 100 that is pre-bent and laid on the surface of the battery cell to the surface of the battery cell. Specifically, the heating unit can use infrared welding technology to weld the welding tape, or other heating units can also be used. This embodiment does not make specific limitations on this.

[0071] In addition, the foregoing stringing device can also include a wafer transfer mechanism. The conveyor belt of the wafer transfer mechanism can move relative to the stringing table 21 to transfer the battery string without welded welding tape to the welding tape laying position, or transfer the battery string with welded welding tape to other workstations. The wafer transfer mechanism can adopt belt transmission or handling fork adsorption transmission. This embodiment does not make specific limitations on this.

[0072] Finally, the present invention provides a method for pre-bending a solder ribbon, namely a string laying device. The method for pre-bending a solder ribbon includes a solder ribbon pre-bending assembly 1 provided with a plurality of solder ribbon clips 11 for clamping the solder ribbon. The plurality of solder ribbon clips 11 clamp the solder ribbon and maintain the clamping state during the process of pre-bending the solder ribbon. Above the solder ribbon laying plane, control the plurality of solder ribbon clips 11 to clamp different positions of the solder ribbon at intervals at the same time. Control the solder ribbon clips 11 to rise to a first preset distance, and at the same time fix the solder ribbon section between adjacent solder ribbon clips 11; or, control the solder ribbon clips 11 to rise to a second preset distance, and at the same time control the solder ribbon section between adjacent solder ribbon clips 11 to descend by a second preset distance. Wherein, the solder ribbon is pre-bent to form a solder ribbon body 100 with a target length. The solder ribbon clips lay the solder ribbon body 100 on the solder ribbon laying plane. The present invention improves the positioning accuracy during the pre-bending and laying of the solder ribbon, and further improves the quality of string laying and string making.

[0073] It should be noted that the various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same and similar parts between the various embodiments, reference may be made to each other.

Claims

1. A method for pre-bending a solder tape, characterized in that, The solder strip pre-bending method uses a solder strip pre-bending assembly (1), and the solder strip pre-bending assembly (1) includes a number of solder strip clips (11) for clamping the solder strip. A plurality of the solder strip clips (11) clamp the solder strip and maintain the clamping state during the process of pre-bending the solder strip; Above the solder strip laying plane, control a plurality of the solder strip clips (11) to clamp different positions of the solder strip at intervals at the same time; Control the solder strip clips (11) to rise by a first preset distance, and at the same time fix the solder strip section between adjacent solder strip clips (11); or, control the solder strip clips (11) to rise by a second preset distance, and at the same time control the solder strip section between adjacent solder strip clips (11) to press down by a third preset distance, or, control the solder strip clips (11) not to move and at the same time control the solder strip section between adjacent solder strip clips (11) to press down by a fourth preset distance; wherein, the solder strip is pre-bent to form a solder strip body (100) with a target length; The solder strip clips (11) lay the solder strip body (100) on the solder strip laying plane.

2. The pre-bending method of the solder strip according to claim 1, wherein The solder strip pre-bending assembly (1) further includes an external pressing tool (12). A plurality of the solder strip clips (11) are arranged to grab the solder strip located directly below the pressing tool (12) after passing through the pressing tool (12), Control the solder strip clips (11) to rise by a first preset distance, and at the same time the pressing tool (12) fixes the solder strip section between adjacent solder strip clips (11); or, control the solder strip clips (11) to rise by a second preset distance, and at the same time the pressing tool (12) presses down the solder strip section between adjacent solder strip clips (11) by a third preset distance, or, control the solder strip clips (11) not to move and at the same time control the pressing tool (12) to press down the solder strip section between adjacent solder strip clips (11) by a fourth preset distance.

3. The pre-bending method of the welding tape according to claim 1, wherein The solder strip pre-bending assembly (1) further includes a convex block (13) connected to the solder strip clips (11). The convex block (13) is arranged between two adjacent solder strip clips (11); Control the solder strip clips (11) to rise by a first preset distance, and at the same time the convex block (13) fixes the solder strip section between adjacent solder strip clips (11); or, control the solder strip clips (11) to rise by a second preset distance, and at the same time the convex block (13) presses down the solder strip section between adjacent solder strip clips (11) by a third preset distance; or, control the solder strip clips (11) not to move, and at the same time control the convex block (13) to press down the solder strip section between adjacent solder strip clips (11) by a fourth preset distance.

4. The solder strip pre-bending method according to claim 2 or 3, characterized in that, The method further includes, When releasing the solder strip body (100), control the lowest surface of the pressing tool (12) or the convex block (13) to satisfy a preset height difference from the bottommost end surface of the solder strip clips (11), and control the solder strip pre-bending assembly (1) to move downward to place the solder strip body (100) on the solder strip laying plane.

5. The solder strip pre-bending method according to claim 1, characterized in that The method further includes, When the original length of the welding ribbon to be pre-bent is greater than the target length of the welding ribbon body (100) after pre-bending, the plurality of welding ribbon clamps (11) are arranged to approach the middle of the welding ribbon to pre-bend the welding ribbon between the welding ribbon clamps (11); or, the plurality of welding ribbon clamps (11) are arranged to elastically clamp the welding ribbon, and control the welding ribbon segments between adjacent welding ribbon clamps (11) to move downward so that the welding ribbon between the welding ribbon clamps (11) is pulled inside the welding ribbon clamps (11) and bends downward; When the original length of the welding strip to be pre-bent is equal to the target length of the welding strip body (100) after pre-bending, the plurality of welding strip clamps (11) are controlled to maintain a preset clamping spacing to fixedly clamp the welding strip and to rise so that the welding strip is stretched; or, the welding strip clamps (11) are controlled to maintain a preset clamping spacing to fixedly clamp the welding strip, and the welding strip segments between adjacent welding strip clamps (11) are controlled to move downward so that the welding strip between the welding strip clamps (11) is stretched and bent downward.

6. The method for pre-bending a solder tape according to claim 1, wherein, The method further comprises: It comprises a welding strip pre-bending support platform, and controls the welding strip pre-bending component (1) to cooperate with the welding strip pre-bending support platform to pre-bend the welding strip; The welding ribbon clamps (11) are controlled to clamp the welding ribbon and then approach the welding ribbon pre-bending support platform, and the welding ribbon segments between adjacent welding ribbon clamps (11) are fixed to press the welding ribbon toward the welding ribbon pre-bending support platform, so that the welding ribbon segments between adjacent welding ribbon clamps (11) are pre-bent.

7. The method for pre-bending a solder tape according to claim 6, characterized in that, After the solder ribbon pre-bending assembly (1) independently pre-bends the solder ribbon on the battery cell, the solder ribbon body (100) is released on the surface of the battery cell, or after the solder ribbon clamp (11) cooperates with the pre-bending support platform to pre-bend the solder ribbon, the solder ribbon pre-bending assembly (1) is controlled to move from the solder ribbon pre-bending support platform to the battery cell, and the solder ribbon body (100) is placed on the surface of the battery cell.

8. The pre-bending method of the welding tape according to claim 1, characterized in that The surface of the pressing tool (12) or the convex block (13) in contact with the welding strip is an arc surface or a plane surface.

9. A string laying device, characterized in that, The string laying device is used to perform the solder strip pre-bending method described in any one of claims 1 to 8, and the string laying device also includes: a string laying table (21) and a battery cell gripper, the string laying table (21) is used to carry the battery cell gripped by the battery cell gripper, and the solder strip pre-bending assembly (1) is used to grab the solder strip and lay the obtained solder strip body (100) on the surface of the battery cell after pre-bending.

10. The string laying device according to claim 9, wherein, It also includes a heating unit, which is arranged below the string-laying table (21) or above the string-laying table (21) and is used to weld the welding strip (100) to the surface of the battery cell.

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