An automatic assembling and welding device for an electronic mainboard of a law enforcement instrument

Abstract

The application belongs to the technical field of mainboard welding equipment, and particularly relates to a law enforcement instrument electronic mainboard automatic assembling and welding device. The device comprises a bottom plate, a frame fixedly connected to the top of the bottom plate, a conveying mechanism arranged in a sink groove on the inner wall of the bottom of the frame, a pair of guide plates fixed to the inner wall of the top of the frame, a clamp mounted at the free end of a first mechanical hand, an electric iron mounted at the free end of a second mechanical hand, a disc fixedly sleeved on the electric iron, a wire feeding mechanism mounted on the disc, a guide pipe fixedly connected to a support two, a pair of feed wheels rotatably connected to the support one, a motor two fixedly connected to the side of the support one, and an output shaft of the motor two connected with the end of one of the feed wheels. The assembling and welding are simultaneously performed, and the electronic mainboard does not need to be turned over, thus saving half of the time compared with the traditional mode and greatly improving the production efficiency. The conveying mechanism can stably and efficiently convey the electronic mainboard, and ensures the coherence of the production process.

Description

Technical Field

[0001] This invention relates to the field of motherboard welding equipment technology, and in particular to an automatic assembly and welding device for electronic motherboards of law enforcement recorders. Background Technology

[0002] In the field of law enforcement recorder manufacturing, the assembly and soldering of the electronic motherboard is a critical process. Traditionally, the assembly and soldering of electronic motherboards in law enforcement recorders are mostly done manually or with semi-automatic equipment, and the assembly and soldering are carried out in separate steps, requiring the electronic motherboard to be flipped over.

[0003] To address the issue of flipping and soldering electronic motherboards after assembly, Chinese Patent Publication No. CN118417746A discloses an automatic assembly and soldering device for electronic motherboards. This device includes a first horizontal frame, a second horizontal frame positioned on one side of the first horizontal frame, and the first and second horizontal frames arranged parallel to each other. Mounting slots are formed on the sides of the first and second horizontal frames that are close to each other. A material conveying assembly is mounted on the first and second horizontal frames through these mounting slots. A motherboard is mounted on the upper surface of the material conveying assembly. A horizontal position adjustment assembly is mounted on the upper surface of the first horizontal frame, and a soldering assembly is positioned on one side of the horizontal position adjustment assembly. A strip-shaped hole is formed on the upper surface of the second horizontal frame, through which a flipping mechanism is mounted. While this device solves the existing technical problem, the following issues remain:

[0004] This technical solution only provides a way to flip the electronic motherboard, but it does not actually solve the technical problem of needing to flip it before soldering the pins. Therefore, an automatic assembly and soldering device for the electronic motherboard of the law enforcement recorder that can be soldered without flipping it is proposed. Summary of the Invention

[0005] Based on the technical problems existing in the prior art, the present invention proposes an automatic assembly and welding device for the electronic motherboard of law enforcement recorders.

[0006] This invention proposes an automatic assembly and welding device for the electronic motherboard of a law enforcement recorder, comprising a base plate, a frame fixedly connected to the top of the base plate, inlets and outlets on both sides of the frame, a conveying mechanism installed in a groove on the inner wall of the bottom of the frame, a pair of guide plates fixed to the inner wall of the top of the frame, an electrical control box, a first robotic arm, and a second robotic arm fixedly connected to the top of the base plate, the first and second robotic arms being located at the front and rear of the frame respectively, the free end of the first robotic arm being equipped with a clamp, the free end of the second robotic arm being equipped with a soldering iron, a disc fixedly mounted on the soldering iron, and a wire feeding mechanism mounted on the disc, including a first bracket and a second bracket fixedly mounted below the disc, a guide tube fixedly connected to the second bracket, and a pair of guide tubes rotatably connected to the first bracket for feeding solder wire to... The feed wheel inside the guide tube is fixedly connected to the side of bracket one by motor two, and the output shaft of motor two is connected to the end of one of the feed wheels. The electronic motherboard is placed between two guide plates from the inlet and outlet on the right side, with the bottom of the electronic motherboard positioned on the conveying mechanism. The electronic motherboard is then transported to the assembly and welding position by the conveying mechanism and stops. Then, robot one assembles the pins of the electronic components onto the circuit board, and robot two on the other side welds the pins on the other side of the circuit board. This allows assembly and welding to be carried out simultaneously without flipping the electronic motherboard, saving half the time. After assembly and welding are completed, the electronic motherboard is transported away from the inlet and outlet on one side by the conveying mechanism.

[0007] Preferably, the conveying mechanism includes conveying rollers, a conveyor belt, and a motor. A pair of conveying rollers are rotatably connected in the settling tank, the conveyor belt is connected between the two conveying rollers, the motor is fixed to the front end of the frame, and the output shaft of the motor is connected to the end of one of the conveying rollers. Multiple evenly distributed support rollers located between the two conveying rollers are also rotatably connected in the settling tank. The output of the motor drives one of the conveying rollers to rotate, and then the two conveying rollers can drive the conveyor belt to operate, thereby realizing the conveying of the electronic motherboard.

[0008] Preferably, the guide plate has arc-shaped inlet portions at both ends; the two inlet portions at the same end of a set of guide plates will form an expanded entrance, which makes it convenient for the electronic motherboard to be inserted between the two guide plates from the inlet and outlet.

[0009] Preferably, a pressure plate is inserted into the slot at the top of the frame, and an electric push rod is fixedly connected to the top of the frame. The output shaft of the electric push rod is fixedly connected to the pressure plate. When the electronic motherboard reaches the assembly and welding position, the output shaft of the electric push rod drives the pressure plate to move downward, pressing the electronic motherboard downward to achieve fixation. This can prevent the electronic motherboard from shifting slightly during the welding and assembly process.

[0010] Preferably, it further includes: a solder joint shape acquisition module, installed on the side of the soldering iron, used to monitor the three-dimensional morphology of the solder joint melting state in real time, identify key features such as wetting angle and stacking height, and generate a solder joint integrity coefficient through the control module; a wire feeding resistance acquisition module, installed on the power supply circuit of the second motor, used to monitor the operating current of the second motor in real time, and generate a wire feeding resistance fluctuation coefficient through the control module; the control module performs a comprehensive analysis of the generated solder joint integrity coefficient and wire feeding resistance fluctuation coefficient, generates an evaluation coefficient, determines whether the current state of the wire feeding mechanism and the soldering iron is abnormal, compares the evaluation coefficient with a preset reference threshold, and controls the working state of the wire feeding mechanism and the soldering iron according to the comparison result.

[0011] Preferably, the output and input ends of the solder joint shape acquisition module and the output and input ends of the wire feeding resistance acquisition module are electrically connected to the input and output ends of the control module, respectively, and the output end of the control module is electrically connected to the input end of the soldering iron and the input end of the second motor.

[0012] Preferably, the control module controls the working state of the wire feeding mechanism and the soldering iron according to the comparison results in the following steps:

[0013] Real-time detection: The weld joint shape acquisition module acquires the three-dimensional morphology of the weld joint in its molten state; the wire feeding resistance acquisition module acquires the operating current of the second motor.

[0014] Coefficient Calculation: The control module calculates the solder joint integrity coefficient, wire feed resistance fluctuation coefficient, and evaluation coefficient. ;

[0015] Dynamic adjustment: If : Maintain the current parameters; if Increase the soldering iron temperature and decrease the wire feed speed; if : Pause welding, sound and light alarm, start weld repair program.

[0016] Preferably, the logic for generating the solder joint integrity coefficient is as follows:

[0017] S1. The actual three-dimensional shape of the weld joint at different moments during the welding process is obtained through the weld joint shape acquisition module. The actual weld joint wetting angle and weld joint stacking height are calibrated as follows: and ;

[0018] S2. Calculate the solder joint integrity coefficient. The expression for the calculation is:

[0019]

[0020] In the formula, Standard wetting angle; The standard stacking height is represented by , and a and b are the tolerance weighting coefficients for angle / height.

[0021] Preferably, the generation logic of the wire feeding resistance fluctuation coefficient is as follows:

[0022] S1. The actual operating current of motor 2 at different times within time T during the welding process is obtained through the wire feeding resistance acquisition module. The actual operating current obtained at time i within time T is calibrated as... , , It is a positive integer;

[0023] S2. Calculate the wire feeding resistance fluctuation coefficient. The expression for the calculation is:

[0024]

[0025] In the formula, is the no-load wire feeding reference current, and i is the number of samplings within time T.

[0026] Preferably, the control module performs formulaic analysis based on the following formula:

[0027]

[0028] In the formula, , These are preset weighting coefficients.

[0029] Compared with the prior art, the present invention provides an automatic assembly and welding device for the electronic motherboard of a law enforcement recorder, which has the following beneficial effects:

[0030] 1. An automatic assembly and welding device for the electronic motherboard of a law enforcement recorder. This invention proposes an automatic assembly and welding device for the electronic motherboard of a law enforcement recorder, which performs assembly and welding simultaneously without requiring the motherboard to be flipped, saving half the time compared to traditional methods and significantly improving production efficiency. The conveying mechanism can stably and efficiently transport the electronic motherboard, ensuring the continuity of the production process.

[0031] 2. An automatic assembly and welding device for the electronic motherboard of a law enforcement recorder, wherein the arc-shaped guide portions at both ends of the guide plate facilitate the insertion of the electronic motherboard, and the pressure plate at the top of the frame and the electric push rod cooperate to press the electronic motherboard downward and fix it during welding assembly, avoiding slight displacement, ensuring the accuracy of assembly and welding, and improving product quality.

[0032] 3. An automatic assembly and welding device for the electronic motherboard of a law enforcement recorder, equipped with a solder joint shape acquisition module and a wire feeding resistance acquisition module, can monitor the three-dimensional morphology of the solder joint melting state and the working status of the wire feeding mechanism in real time. The control module generates correlation coefficients and performs comprehensive analysis to determine whether the working status of the wire feeding mechanism and the soldering iron is abnormal. Based on preset rules, the control module can dynamically adjust working parameters according to the comparison results, such as increasing the soldering iron temperature, adjusting the wire feeding speed, or pausing welding, issuing audible and visual alarms, and initiating a solder joint repair program when the abnormality is severe. This effectively reduces the defect rate, lowers production costs, and improves the intelligence and reliability of the production process. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the overall structure of an automatic assembly and welding device for the electronic motherboard of a law enforcement recorder proposed in this invention.

[0034] Figure 2 This is a cross-sectional view of the frame structure of an automatic assembly and welding device for the electronic motherboard of a law enforcement recorder proposed in this invention.

[0035] Figure 3 This is a schematic diagram of the guide plate mounting structure of an automatic assembly and welding device for the electronic motherboard of a law enforcement recorder proposed in this invention;

[0036] Figure 4 This is a schematic diagram of the wire feeding mechanism of an automatic assembly and welding device for the electronic motherboard of a law enforcement recorder proposed in this invention;

[0037] Figure 5 For the present invention Figure 4 A magnified structural diagram at point A;

[0038] Figure 6 This is a system block diagram of an automatic assembly and welding device for the electronic motherboard of a law enforcement recorder proposed in this invention.

[0039] In the diagram: 1. Base plate; 2. Frame; 3. Settling tank; 4. Inlet / outlet; 5. Guide plate; 6. Electrical control box; 7. Conveyor roller; 8. Conveyor belt; 9. Motor 1; 10. Support roller; 11. Robotic arm 1; 12. Robotic arm 2; 13. Soldering iron; 14. Inlet section; 15. Pressure plate; 16. Electric push rod; 17. Disc; 18. Support 1; 19. Feed wheel; 20. Motor 2; 21. Support 2; 22. Guide tube; 23. Solder wire; 24. Solder joint shape acquisition module; 25. Wire feeding resistance acquisition module. Detailed Implementation

[0040] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0041] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0042] Reference Figures 1-6 An automatic assembly and welding device for the electronic motherboard of a law enforcement recorder includes a base plate 1, a frame 2 fixedly connected to the top of the base plate 1, inlets and outlets 4 on both sides of the frame 2, a conveying mechanism installed in a groove 3 on the inner wall of the bottom of the frame 2, a pair of guide plates 5 fixedly fixed to the inner wall of the top of the frame 2, an electrical control box 6, a robotic arm 11 and a robotic arm 2 12 fixedly connected to the top of the base plate 1, the robotic arm 11 and the robotic arm 2 12 being located at the front and rear of the frame 2 respectively, the free end of the robotic arm 11 being equipped with a clamp, and the robotic arm 2... A soldering iron 13 is installed at the free end of 12. A disc 17 is fixedly sleeved on the soldering iron 13. A wire feeding mechanism is installed on the disc 17, including a bracket 18 and a bracket 21 fixed below the disc 17. A guide tube 22 is fixedly connected to the bracket 21. A pair of feed wheels 19 for pushing the solder wire 23 into the guide tube 22 are rotatably connected to the bracket 18. A motor 20 is fixedly connected to the side of the bracket 18. The output shaft of the motor 20 is connected to the end of one of the feed wheels 19.

[0043] In use, the electronic motherboard is placed between the two guide plates 5 through the inlet / outlet 4 on the right side, with the bottom of the electronic motherboard positioned on the conveying mechanism. The conveying mechanism then transports the electronic motherboard to the assembly and soldering position and stops. Next, robotic arm 11 assembles the pins of the electronic components onto the circuit board, while robotic arm 2 12 on the other side solders the pins on the other side of the circuit board. This allows assembly and soldering to be performed simultaneously without needing to flip the electronic motherboard, saving half the time. After assembly and soldering are completed, the electronic motherboard is transported away from the inlet / outlet 4 on one side through the conveying mechanism. The wire feeding mechanism drives the feed wheel 19 to rotate via motor 20, and then pushes the solder wire along the guide tube 22 to the soldering iron 13, achieving continuous wire feeding during soldering.

[0044] The conveying mechanism includes conveying rollers 7, conveyor belts 8 and motor 9. A pair of conveying rollers 7 are rotatably connected in the settling trough 3. The conveyor belt 8 is connected between the two conveying rollers 7. The motor 9 is fixed at the front end of the frame 2. The output shaft of the motor 9 is connected to the end of one of the conveying rollers 7. A number of evenly distributed support rollers 10 located between the two conveying rollers 7 are also rotatably connected in the settling trough 3.

[0045] In use, the output of motor 9 drives one of the conveyor rollers 7 to rotate, and then the two conveyor rollers 7 can drive the conveyor belt 8 to operate, so as to transport the electronic motherboard.

[0046] Furthermore, the guide plate 5 has arc-shaped inlet portions 14 at both ends;

[0047] In use, the two inlet portions 14 at the same end of a set of guide plates 5 will form an expanded entrance, which makes it convenient for the electronic mainboard to be inserted between the two guide plates 5 from the inlet and outlet 4.

[0048] Furthermore, a pressure plate 15 is inserted into the slot at the top of the frame 2, and an electric push rod 16 is fixedly connected to the top of the frame 2. The output shaft of the electric push rod 16 is fixedly connected to the pressure plate 15.

[0049] When in use, after the electronic motherboard reaches the assembly and soldering position, the output shaft of the electric push rod 16 drives the pressure plate 15 to move downward, pressing the electronic motherboard downward to fix it. This can prevent the electronic motherboard from shifting slightly during the soldering and assembly process.

[0050] In another embodiment, an automatic assembly and welding device for the electronic motherboard of a law enforcement recorder further includes:

[0051] The solder joint shape acquisition module 24 is installed on the side of the soldering iron 13. It is used to monitor the three-dimensional morphology of the solder joint melting state in real time, identify key features such as wetting angle and stacking height, and generate the solder joint integrity coefficient through the control module.

[0052] The wire feeding resistance acquisition module 25 is installed on the power supply circuit of motor 20 to monitor the operating current of motor 20 in real time and generate the wire feeding resistance fluctuation coefficient through the control module.

[0053] It should be noted that the solder joint shape acquisition module 24 can be a CMOS image sensor or other device capable of real-time monitoring of the three-dimensional shape of the solder joint melting state, and the wire feeding resistance acquisition module 25 can be a Hall current sensor or other device capable of real-time monitoring of the operating current of the motor 20. The control module is an embedded controller (such as the STM32 series) that integrates data fusion algorithms. Therefore, the solder joint shape acquisition module 24, the wire feeding resistance acquisition module 25, and the control module are not specifically limited here and can be selected according to actual needs.

[0054] In use, the control module performs a comprehensive analysis of the generated solder joint integrity coefficient and wire feeding resistance fluctuation coefficient to generate an evaluation coefficient, determine whether the current state of the wire feeding mechanism and soldering iron 13 is abnormal, compares the evaluation coefficient with the preset reference threshold, and controls the working state of the wire feeding mechanism and soldering iron 13 based on the comparison result.

[0055] Among them, the output end and input end of the solder joint shape acquisition module 24, and the output end and input end of the wire feeding resistance acquisition module 25 are respectively electrically connected to the input end and output end of the control module, and the output end of the control module is respectively electrically connected to the input end of the soldering iron 13 and the input end of the second motor 20.

[0056] In another embodiment, the control module comprehensively analyzes the generated solder joint integrity coefficient and wire feeding resistance fluctuation coefficient to generate an evaluation coefficient, determines whether the current states of the wire feeding mechanism and the soldering iron 13 are abnormal, compares the evaluation coefficient with a pre-set reference threshold, and controls the working states of the wire feeding mechanism and the soldering iron 13 according to the comparison result. The specific implementation steps are as follows:

[0057] Real-time detection: The solder joint shape acquisition module 24 acquires the three-dimensional morphology of the molten state of the solder joint; the wire feeding resistance acquisition module 25 acquires the working current of the second motor 20.

[0058] Coefficient calculation:

[0059] Solder joint integrity coefficient : Quantify the deviation degree of the fluidity and solidification morphology of the molten solder, and directly reflect the metallurgical bonding quality. Its essence is to measure the geometric deviation between the solder joint morphology and the ideal state; wetting angle (θreal): Characterize the spreading ability of the solder on the pad; θreal < θstandard → excessive spreading (the solder has too strong fluidity and may bridge adjacent pads); θreal > θstandard → insufficient wetting (the solder shrinks, there is a risk of virtual soldering / cold soldering); stacking height (Hp): Reflect the balance between the heat capacity and surface tension of the solder; Hp > H0 → too much tin (insufficient heat causes incomplete melting); Hp < H0 → insufficient tin (insufficient mechanical strength);

[0060] Wθ is an exponential amplification function, and small deformations will significantly increase the coefficient value: Wθ = 1 → perfect solder joint (the morphology completely meets the standard); Wθ > 1 → every increase of 0.1 represents a 10% increase in the risk of morphology defects (such as when Wθ = 1.2, immediate intervention is required);

[0061] Among them, the generation logic of the solder joint integrity coefficient is:

[0062] S1. Obtain the actual three-dimensional morphology of the molten state of the solder joint at different moments during the welding process through the solder joint shape acquisition module 24, and calibrate the obtained actual solder joint wetting angle and solder joint stacking height as and ;

[0063] S2. Calculate the solder joint integrity coefficient, and the calculation expression is:

[0064]

[0065] In the formula, is the actual wetting angle; Standard wetting angle; This refers to the actual stacking height. The standard stacking height is represented by , and a and b are the tolerance weighting coefficients for angle / height.

[0066] Wire feeding resistance fluctuation coefficient Indirectly characterizing resistance, it maps energy loss through electrical power conversion. A current ratio approaching 1 indicates normal wire feeding resistance (stable current and good solder flow); a current ratio > 1 indicates increased resistance (current rise, possibly due to solder wire jamming, PCB oxidation, or pad contamination); a current ratio < 1 indicates a mechanism malfunction (current drop, possibly due to motor stalling or gear wear).

[0067] The generation logic of the wire feeding resistance fluctuation coefficient is as follows:

[0068] S1. The actual operating current of motor 20 at different times within time T during the welding process is obtained through the wire feeding resistance acquisition module 25. The actual operating current obtained at time i within time T is calibrated as... , , It is a positive integer;

[0069] S2. Calculate the wire feeding resistance fluctuation coefficient. The expression for the calculation is:

[0070]

[0071] In the formula, is the no-load wire feeding reference current, and i is the number of samplings within time T.

[0072] Evaluation coefficient The comprehensive risk entropy, which integrates morphological defects and mechanical resistance, is essentially an energy criterion for establishing the stability of the welding process. This is analyzed using a formulaic approach through the control module, based on the following formula:

[0073]

[0074] In the formula, , These are preset weighting coefficients.

[0075] Dynamic adjustment: If : Maintain the current parameters; if Increase the soldering iron temperature by 5-10℃ and reduce the wire feed speed by 10%; if : Pause welding, sound and light alarm, start weld repair program.

[0076] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An automatic assembly and welding device for the electronic motherboard of a law enforcement recorder, comprising a base plate (1), characterized in that, The top of the base plate (1) is fixedly connected to a frame (2). The frame (2) has inlets and outlets (4) on both sides. A conveying mechanism is installed in the groove (3) on the inner wall of the bottom of the frame (2). A pair of guide plates (5) are fixedly installed on the inner wall of the top of the frame (2). The top of the base plate (1) is also fixedly connected to an electrical control box (6), a robot arm one (11) and a robot arm two (12). The robot arm one (11) and the robot arm two (12) are located at the front and rear of the frame (2) respectively. A clamp is installed on the free end of the robot arm one (11) and a soldering iron (13) is installed on the free end of the robot arm two (12). A disc (17) is fixedly mounted on the soldering iron (13). A wire feeding mechanism is installed on the disc (17). The wire feeding mechanism includes a bracket 1 (18) and a bracket 2 (21) fixedly below the disc (17). A guide tube (22) is fixedly connected to the bracket 2 (21). A pair of feed wheels (19) for pushing the solder wire (23) into the guide tube (22) are rotatably connected to the bracket 1 (18). A motor 2 (20) is fixedly connected to the side of the bracket 1 (18). The output shaft of the motor 2 (20) is connected to the end of one of the feed wheels (19). The mechanism also includes: The solder joint shape acquisition module (24) is installed on the side of the soldering iron (13) to monitor the three-dimensional morphology of the solder joint melting state in real time, identify key features such as wetting angle and stacking height, and generate the solder joint integrity coefficient through the control module. The wire feeding resistance acquisition module (25) is installed on the power supply circuit of motor two (20) to monitor the working current of motor two (20) in real time and generate the wire feeding resistance fluctuation coefficient through the control module; The control module in the electrical control box (6) performs a comprehensive analysis of the generated solder joint integrity coefficient and wire feeding resistance fluctuation coefficient, generates an evaluation coefficient, compares the evaluation coefficient with the preset reference threshold, and controls the working state of the wire feeding mechanism and the soldering iron (13) based on the comparison result. The control module executes control logic including: If the evaluation coefficient is less than the first threshold, maintain the current operating parameters of the soldering iron (13) and the wire feeding mechanism; If the evaluation coefficient is between the first threshold and the second threshold, increase the soldering iron temperature and decrease the wire feeding speed. If the evaluation coefficient is greater than or equal to the second threshold, welding is suspended and an audible and visual alarm and weld repair procedure are initiated. The logic for generating the solder joint integrity coefficient is as follows: The solder joint integrity coefficient is calculated by the deviation between the actual wetting angle and the standard wetting angle, and the deviation between the actual stack height and the standard stack height. The closer the solder joint integrity coefficient value is to 1, the closer the solder joint morphology is to the ideal state. When the solder joint integrity coefficient value is greater than 1, the increase in the solder joint integrity coefficient value indicates an increased risk of morphological defects. The generation logic of the wire feeding resistance fluctuation coefficient is as follows: The wire feeding resistance fluctuation coefficient is calculated by the fluctuation of the ratio of the working current of motor 2 (20) to the no-load reference current; the closer the ratio is to 1, the smaller the wire feeding resistance fluctuation, and the higher the ratio, the higher the risk of abnormal wire feeding resistance. The evaluation coefficient is generated by the control module through dynamic weighting calculation by integrating the solder joint integrity coefficient and the wire feeding resistance fluctuation coefficient and combining them with a preset weight coefficient.

2. The automatic assembly and welding device for the electronic motherboard of a law enforcement recorder according to claim 1, characterized in that, The conveying mechanism includes conveying rollers (7), conveyor belt (8) and motor (9). A pair of conveying rollers (7) are rotatably connected in the sink (3), the conveyor belt (8) is connected between the two conveying rollers (7), the motor (9) is fixed at the front end of the frame (2), and the output shaft of the motor (9) is connected to the end of one of the conveying rollers (7). A number of evenly distributed support rollers (10) located between the two conveying rollers (7) are also rotatably connected in the sink (3).

3. The automatic assembly and welding device for the electronic motherboard of a law enforcement recorder according to claim 1, characterized in that, The guide plate (5) has arc-shaped inlet portions (14) at both ends.

4. The automatic assembly and welding device for the electronic motherboard of a law enforcement recorder according to claim 1, characterized in that, A pressure plate (15) is inserted into the slot at the top of the frame (2), and an electric push rod (16) is fixedly connected to the top of the frame (2). The output shaft of the electric push rod (16) is fixedly connected to the pressure plate (15).

5. The automatic assembly and welding device for the electronic motherboard of a law enforcement recorder according to claim 1, characterized in that, The output and input ends of the solder joint shape acquisition module (24) are electrically connected to the input and output ends of the control module, respectively. The output and input ends of the wire feeding resistance acquisition module (25) are electrically connected to the input and output ends of the control module, respectively. The output end of the control module is electrically connected to the input end of the soldering iron (13) and the input end of the second motor (20), respectively.

6. The automatic assembly and welding device for the electronic motherboard of a law enforcement recorder according to claim 1, characterized in that, The formula for calculating the weld integrity coefficient is as follows: ； In the formula, This is the actual wetting angle; Standard wetting angle; This refers to the actual stacking height. The standard stacking height is given by a and b, which are the tolerance weighting coefficients for angle / height. The formula for calculating the wire feeding resistance fluctuation coefficient is as follows: ； In the formula, Let be the no-load wire feeding reference current, and i be the number of samples within time T. , It is a positive integer; The calculation expression for the evaluation coefficient is as follows: ； In the formula, , These are preset weighting coefficients.

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