Polishing and grinding fluid supply system of wafer polishing machine

Abstract

The invention discloses a polishing and grinding fluid supply system of a wafer polishing machine, which relates to the technical field of polishing machine fluid supply, and comprises a filter assembly used for receiving and filtering a polishing and grinding fluid from a polishing bin; one end of the pulse assembly is communicated into the polishing bin, and the other end of the pulse assembly is communicated with the filtering assembly through a liquid supply pipe; the liquid supplementing tank is used for selectively supplying liquid to the filtering assembly; wherein the pulse assembly can receive the polishing and grinding fluid from the filtering assembly and send the polishing and grinding fluid into the polishing bin in a pressure stabilizing mode or in a pulse mode, and the overall working mode is flexible.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing machine liquid supply, and particularly relates to a polishing grinding fluid supply system for a wafer polishing machine. Background Art

[0002] In the technical field of wafer polishing machine liquid supply, the supply stability and filtration accuracy of polishing grinding fluid directly affect the surface quality and production yield of wafers. Most existing liquid supply devices adopt a single constant pressure supply mode. In the constant pressure supply mode, the polishing interface is in a static equilibrium state. Although the basic polishing efficiency can be guaranteed, it is difficult to stimulate the dynamic response of the interface, resulting in small defects being masked under stable process parameters, and it is difficult to guarantee the consistency of wafer quality.

[0003] In addition, the filter components of traditional liquid supply devices mostly adopt a fixed number of stages or a single-precision filtering structure. For example, multi-stage filtering is achieved by connecting multiple groups of fixed filter discs in series, but the accuracy of the filter discs and the flow path cannot be adjusted as required.

[0004] Therefore, it is necessary to provide a polishing grinding fluid supply system for a wafer polishing machine to solve the above problems. Summary of the Invention

[0005] To solve the above problems, the present invention provides the following technical solution: A polishing grinding fluid supply system for a wafer polishing machine, used for supplying polishing grinding fluid to a polishing chamber, includes:

[0006] A filter component, which is used to receive and filter the polishing grinding fluid from the polishing chamber;

[0007] A pulse component, one end of which is connected to the polishing chamber, and the other end is connected to the filter component through a liquid supply pipe;

[0008] A replenishing tank, which selectively supplies liquid to the filter component;

[0009] Wherein, the pulse component can receive the polishing grinding fluid from the filter component and send it to the polishing chamber in a constant pressure manner or in a pulse manner.

[0010] Further, preferably, a sensor component is built in the polishing chamber;

[0011] During operation, the pulse component first sends the polishing grinding fluid to the polishing chamber in a constant pressure manner, and then sends the polishing grinding fluid to the polishing chamber in a pulse manner. At the same time, the sensor component compares the differences between the previous and current workpieces, and then adjusts the filtering effect of the filter component or controls the replenishing tank to selectively supply liquid to the filter component.

[0012] Further, preferably, the pulse component includes:

[0013] A pulse cylinder, which is fixed to one side of the polishing bin;

[0014] A liquid outlet pipe, one end of which is used to receive the polishing grinding liquid from the filtering assembly, and the other end of which is hermetically and slidably inserted into the pulse cylinder, and a piston is fixed on the liquid outlet pipe located in the pulse cylinder;

[0015] The pulse cylinder includes a first cylinder body, the inner diameter of which is adapted to the piston. The first cylinder body is divided into two left and right parts, and the two parts are connected by a second cylinder body. The inner diameter of the second cylinder body is larger than that of the first cylinder body. A drain pipe is also provided at the liquid outlet end of the first cylinder body;

[0016] A pump body is also provided on the liquid outlet pipe.

[0017] Further, as a preference, the pulse assembly further includes:

[0018] A track, on which a pulse seat is slidably arranged, and the pulse seat is driven by a cylinder;

[0019] A rotating bin, one end of which is communicated with the liquid outlet pipe, and the other end of which is connected with a rotating cylinder, and the rotating cylinder is rotatably arranged on the pulse seat.

[0020] Further, as a preference, the rotating cylinder is also connected with a liquid inlet pipe by a rotatable joint, and the liquid inlet pipe is connected with the filtering assembly through the telescopic liquid supply pipe;

[0021] The rotating cylinder is also driven by a motor to rotate around its own axis.

[0022] Further, as a preference, the sensor assembly includes a vision sensor, a temperature sensor, and a sound sensor.

[0023] Further, as a preference, the filtering assembly includes:

[0024] A filtering bin, the side part of which has a window;

[0025] A positioning column, which is vertically fixed in the filtering bin;

[0026] Three filtering discs which are vertically arranged in an array and fixed on the positioning column;

[0027] A current-limiting ring is slidably sleeved outside each filtering disc, and there is an interference fit between the inner diameter of the current-limiting ring and the outer diameter of the filtering disc.

[0028] Further, as a preference, a driving sleeve corresponding to the current-limiting ring is arranged in the filtering bin, the driving sleeve is respectively connected with the corresponding current-limiting ring, the driving sleeve is driven by a telescopic cylinder, and the three driving sleeves are distributed in a gathering manner towards the side away from the window.

[0029] Further, as a preference, a diversion ring is fixed on the upper surface of the current-limiting ring, and the inner diameter of the diversion ring is larger than the outer diameter of the filter disc.

[0030] Further, as a preference, the current-limiting ring has a cavity inside, spray holes communicating with the cavity are formed on the inner wall of the current-limiting ring, and the cavity is communicated with a clean water pipe.

[0031] Compared with the prior art, the present invention provides a polishing and grinding fluid supply system for a wafer polishing machine, having the following beneficial effects:

[0032] In the present invention, after establishing a reference state by means of stable pressure liquid supply, pulsed liquid supply stimulates the dynamic response of the polishing interface, maps the conventional detection blind area through data differences, and realizes the closed-loop feedback of the liquid supply strategy and defect identification. For example, when a vision sensor captures surface abnormalities, the system can automatically adjust the filtration accuracy or the liquid supply of the liquid replenishing tank, optimize the composition of the grinding fluid, and significantly improve the yield rate of wafers.

[0033] In the present invention, the filtering assembly adopts a three-stage gradual filtering method, and cooperates with an independently driven current-limiting ring to realize the on-demand combination of filtering accuracy. In addition, the current-limiting ring receives the upper-layer filtrate through the diversion ring, and at the same time, the built-in cavity spray holes can flush the filter disc to extend the service life of the filter material. Description of the Drawings

[0034] Figure 1 It is a front view structural schematic diagram of a polishing and grinding fluid supply system for a wafer polishing machine;

[0035] Figure 2 It is a three-dimensional structural schematic diagram of a polishing and grinding fluid supply system for a wafer polishing machine;

[0036] Figure 3 It is a three-dimensional structural schematic diagram of a pulse assembly;

[0037] Figure 4 It is a sectional structural schematic diagram of a pulse cylinder;

[0038] Figure 5 It is a three-dimensional structural schematic diagram of a filtering assembly;

[0039] In the figure: 1, polishing chamber; 2, three-way valve; 3, recovery pipe; 4, filtering assembly; 5, liquid supply pipe; 6, pulse assembly; 7, liquid replenishing tank; 61, track; 62, pulse seat; 63, rotating chamber; 64, rotating cylinder; 65, motor; 66, rotatable joint; 67, liquid inlet pipe; 68, liquid outlet pipe; 69, pulse cylinder; 610, piston; 691, first cylinder body; 692, second cylinder body; 693, liquid discharge pipe; 41, filtering chamber; 42, window; 43, positioning column; 44, filter disc; 45, current-limiting ring; 46, diversion ring; 47, driving sleeve; 48, telescopic cylinder. Detailed Embodiments

[0040] In the description, claims, and the above accompanying drawing descriptions of this application, terms such as "first" and "second" are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that such terms can be interchanged under appropriate circumstances, which is merely a way of distinguishing objects with the same attributes when describing embodiments of this application. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion, so that a process, method, system, product, or device including a series of units does not have to be limited to those units, but may include other units not clearly listed or inherent to these processes, methods, products, or devices.

[0041] Example: Please refer to Figures 1 - 5 , in an embodiment of the present invention, a polishing and grinding fluid supply system for a wafer polishing machine is provided, which is used to supply polishing and grinding fluid to the polishing chamber 1 and includes:

[0042] A filtering component 4, which is used to receive and filter the polishing and grinding fluid from the polishing chamber 1. Specifically, a three-way valve 2 is provided at the bottom of the polishing chamber 1. One outlet of the three-way valve 2 is used to discharge waste liquid, and the other outlet is connected to a recovery pipe 3, and the recovery pipe 3 is connected to the filtering component 4. In addition, a recovery pump (not shown in the figure) is also provided on the recovery pipe 3;

[0043] A pulse component 6, one end of which communicates with the polishing chamber 1, and the other end communicates with the filtering component 4 through a supply pipe 5;

[0044] A liquid replenishment tank 7, which selectively supplies liquid to the filtering component 4;

[0045] Among them, the pulse component 6 can receive the polishing and grinding fluid from the filtering component 4 and send it to the polishing chamber 1 in a steady pressure manner or in a pulsed manner.

[0046] Furthermore, a sensor component is built into the polishing chamber 1;

[0047] During operation, the pulse component 6 first sends the polishing and grinding fluid to the polishing chamber 1 in a steady pressure manner, and then sends the polishing and grinding fluid to the polishing chamber 1 in a pulsed manner. At the same time, the sensor component is used to compare the differences between the workpieces before and after, and then adjust the filtering effect of the filtering component 4 or control the liquid replenishment tank 7 to selectively supply liquid to the filtering component 4.

[0048] It should be noted that during operation, the pulse component 6 first sends the polishing grinding fluid to the polishing chamber 1 in a constant voltage manner, and the sensor component conducts the first detection. Then, perturbations are introduced, that is, the polishing grinding fluid is sent to the polishing chamber 1 in a pulsed manner, and the sensor component conducts the second detection. By comparing the results of the two detections, potential problems are identified. Further, by exciting the dynamic response of the polishing interface through mutations in the liquid supply parameters, and using the data differences between the two liquid supply modes, tiny defects (such as tiny scratches and abnormal local material removal) are exposed, and the liquid supply strategy is optimized in reverse.

[0049] The liquid supply strategy described above includes the optimization of the filtration effect and the optimization of the composition of the polishing grinding fluid. Among them, when it comes to the optimization of the composition of the polishing grinding fluid, the replenishing tank 7 can be used to complete it.

[0050] In this embodiment, the pulse component 6 includes:

[0051] A pulse cylinder 69, which is fixed to one side of the polishing chamber 1;

[0052] A liquid outlet pipe 68, one end of which is used to receive the polishing grinding fluid from the filtration component 4, and the other end is hermetically and slidably inserted into the pulse cylinder 69, and a piston 610 is fixed on the liquid outlet pipe 68 located in the pulse cylinder 69;

[0053] The pulse cylinder 69 includes a first cylinder body 691, the inner diameter of which is adapted to the piston 610. The first cylinder body 691 is divided into two parts on the left and right, and the two parts are connected by a second cylinder body 692. The inner diameter of the second cylinder body 692 is larger than that of the first cylinder body 691. A drain pipe 693 is also provided at the liquid outlet end of the first cylinder body 691;

[0054] A pump body (not shown in the figure) is also provided on the liquid outlet pipe 68.

[0055] Among them, the meaning that the inner diameter of the first cylinder body 691 is adapted to the piston 610 is that the inner diameter of the first cylinder body 691 is slightly larger than the piston 610. Although the inner diameter of the first cylinder body 691 is slightly larger than the piston 610, when the piston 610 slides in the first cylinder body 691, it can still produce a pressurizing or suction effect on the liquid. That is to say, the purpose of the inner diameter of the first cylinder body 691 being slightly larger than the piston 610 is only to ensure the service life of the piston 610 at the expense of a certain accuracy, so that it will not rub against the first cylinder body 691. And because the piston 610 will not rub against the first cylinder body 691, no additional debris will be generated between the two, ensuring the polishing accuracy of the wafer.

[0056] In addition, when the piston 610 is located in the second cylinder body 692, even if the piston reciprocates, it will not cause too much perturbation to the liquid.

[0057] The pulse assembly 6 further includes:

[0058] An orbit 61, on which a pulse seat 62 is slidably arranged, and the pulse seat 62 is driven by a cylinder;

[0059] A rotary bin 63, one end of which is communicated with the liquid outlet pipe 68, and the other end is connected with a rotary drum 64, and the rotary drum 64 is rotatably arranged on the pulse seat 62.

[0060] Wherein, the rotary bin 63 can be used as a buffer bin or a mixing bin, and by driving the rotary bin 63 to rotate or move, the uniformity of the polished grinding fluid filtered by the filter assembly 4 can be improved.

[0061] Furthermore, the rotary drum 64 is also connected to the liquid inlet pipe 67 by a rotatable joint 66, and the liquid inlet pipe 67 is connected to the filter assembly 4 through the telescopic liquid supply pipe 5;

[0062] The rotary drum 64 is also driven by a motor 65 to rotate around its own axis.

[0063] Specifically, a driven wheel is coaxially fixed on the rotary drum 64, a motor 65 is fixed on the pulse seat 62, and a driving wheel is coaxially fixed at the output end of the motor 65, and a transmission belt can be arranged between the driving wheel and the driven wheel.

[0064] In this embodiment, the sensor assembly includes a vision sensor, a temperature sensor, and a sound sensor. Exemplarily, the vision sensor can directly observe the situation on the surface of the wafer, such as fine scratches. When such a situation is observed, it is prompted that the filter assembly 4 needs to improve the filtering effect, or the intervention of the liquid replenishing tank 7 is required.

[0065] In this embodiment, the filter assembly 4 includes:

[0066] A filter bin 41, the side part of which has a window 42, and an openable and closable observation window (not shown in the figure) needs to be installed at the window 42;

[0067] A positioning post 43, which is vertically fixed in the filter bin 41;

[0068] Three filter disks 44 that are vertically arranged in an array and fixed on the positioning post 43;

[0069] A current-limiting ring 45 is slidably sleeved outside each of the filter disks 44, and a transition fit is formed between the inner diameter of the current-limiting ring 45 and the outer diameter of the filter disk 44.

[0070] Wherein, a driving sleeve 47 corresponding to the current-limiting ring 45 is arranged in the filtering bin 41. The driving sleeve 47 is respectively connected to the corresponding current-limiting ring 45. The driving sleeve 47 is driven by a telescopic cylinder 48. The three driving sleeves 47 are gathered and distributed on one side away from the window 42.

[0071] By the cooperation of the telescopic cylinder 48 and the driving sleeve 47, the position of the current-limiting ring 45 can be adjusted. When the current-limiting ring 45 coincides with the adjacent filter disc 44, the polishing and grinding liquid cannot be discharged from the gap between the two. At this time, the filter disc 44 plays a filtering role.

[0072] That is to say, by independently controlling the current-limiting ring 45, the filter disc 44 can be selectively used.

[0073] Further, from top to bottom, the filtering precisions of the three filter discs 44 gradually increase.

[0074] Further, a diversion ring 46 is fixed on the upper surface of the current-limiting ring 45. The inner diameter of the diversion ring 46 is larger than the outer diameter of the filter disc 44. The diversion ring 46 can receive the liquid filtered by the filter disc 44 above it.

[0075] In order to clean the filter disc 44, a cavity is provided inside the current-limiting ring 45. Spray holes communicating with the cavity are formed on the inner wall of the current-limiting ring 45. The cavity is communicated with a clear water pipe.

[0076] The above is only the preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and all should be covered by the protection scope of the present invention.

Claims

1. A polishing and grinding fluid supply system for a wafer polishing machine, which is used to supply polishing and grinding fluid to a polishing chamber (1), and is characterized in that, Comprising: A filtering component (4) for receiving and filtering the polishing grinding fluid from the polishing chamber (1); A pulse component (6) with one end communicating with the polishing chamber (1) and the other end communicating with the filtering component (4) through a liquid supply pipe (5); A liquid replenishing tank (7) capable of supplying liquid to the filtering component (4); Wherein, the pulse component (6) can receive the polishing grinding fluid from the filtering component (4) and send it to the polishing chamber (1) in a constant pressure manner or in a pulsed manner.

2. The polishing and grinding fluid supply system of a wafer polishing machine according to claim 1, wherein, A sensor component is built in the polishing chamber (1); During operation, the pulse component (6) first sends the polishing grinding fluid to the polishing chamber (1) in a constant pressure manner, and then sends the polishing grinding fluid to the polishing chamber (1) in a pulsed manner. Meanwhile, the sensor component compares the differences between the front and rear workpieces to adjust the filtering effect of the filtering component (4) or control the liquid replenishing tank (7) to supply liquid to the filtering component (4).

3. A polishing and grinding fluid supply system for a wafer polishing machine according to claim 1, characterized in that, The pulse component (6) includes: A pulse cylinder (69) fixed to one side of the polishing chamber (1); A liquid outlet pipe (68) with one end for receiving the polishing grinding fluid from the filtering component (4) and the other end hermetically and slidably extending into the pulse cylinder (69), and a piston (610) is fixed on the liquid outlet pipe (68) located in the pulse cylinder (69); The pulse cylinder (69) includes a first cylinder body (691) whose inner diameter is adapted to the piston (610). The first cylinder body (691) is divided into left and right two parts, and the two parts are connected by a second cylinder body (692). The inner diameter of the second cylinder body (692) is larger than the inner diameter of the first cylinder body (691). A drain pipe (693) is also provided at the liquid outlet end of the first cylinder body (691); A pump body is also provided on the liquid outlet pipe (68).

4. The polishing and grinding fluid supply system for a wafer polishing machine according to claim 3, characterized in that, The pulse component (6) further includes: A track (61) on which a pulse seat (62) is slidably arranged, and the pulse seat (62) is driven by a cylinder; A rotating chamber (63) with one end communicating with the liquid outlet pipe (68) and the other end connected with a rotating cylinder (64), and the rotating cylinder (64) is rotatably arranged on the pulse seat (62).

5. The polishing and grinding fluid supply system of a wafer polishing machine according to claim 4, characterized in that, The rotating cylinder (64) is also connected with a liquid inlet pipe (67) through a rotatable joint (66), and the liquid inlet pipe (67) is connected with the filtering component (4) through the telescopic liquid supply pipe (5); The rotating cylinder (64) is also driven by a motor (65) to rotate around its own axis.

6. The polishing and grinding fluid supply system for a wafer polishing machine according to claim 2, characterized in that, The sensor component includes a visual sensor, a temperature sensor, and a sound sensor.

7. The polishing and grinding fluid supply system of a wafer polishing machine according to claim 1, characterized in that, The filtering component (4) includes: A filtering chamber (41) with a window (42) on its side; A positioning column (43) vertically fixed in the filtering chamber (41); Three filtering discs (44) vertically arranged in an array and fixed on the positioning column (43); A current limiting ring (45) is slidably sleeved outside each filtering disc (44), and there is an interference fit between the inner diameter of the current limiting ring (45) and the outer diameter of the filtering disc (44).

8. A polishing and grinding fluid supply system for a wafer polishing machine according to claim 7, characterized in that, A drive sleeve (47) corresponding to the flow-limiting ring (45) is arranged in the filtering bin (41). The drive sleeve (47) is respectively connected to the corresponding flow-limiting ring (45). The drive sleeve (47) is driven by a telescopic cylinder (48). The three drive sleeves (47) are aggregately distributed on the side away from the window (42).

9. The polishing and grinding fluid supply system for a wafer polishing machine according to claim 7, characterized in that, A diversion ring (46) is fixed on the upper surface of the flow-limiting ring (45). The inner diameter of the diversion ring (46) is larger than the outer diameter of the filter disc (44).

10. A polishing and grinding fluid supply system for a wafer polishing machine according to claim 7, characterized in that, The interior of the flow-limiting ring (45) has a cavity. Spray holes communicating with the cavity are formed in the inner wall of the flow-limiting ring (45). The cavity is communicated with a clean water pipe.

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