Demolding and forming device for chip capacitor production

Abstract

The invention relates to the field of electronic component manufacturing, and discloses a chip capacitor production demolding forming device which comprises a demolding groove and a top plate, the top center of the top plate is fixedly connected with a downward pressing air cylinder, a lower mold is installed in the demolding groove, an ejection mechanism is arranged in the lower mold, an upper mold is arranged in the bottom center of the top plate, and the upper mold is fixedly connected with the top plate. Liquid injection pipes are arranged on the two sides of the top of the upper mold, the output end of the downward pressing air cylinder is fixedly connected to the center of the top of the upper mold, a cooling mechanism is arranged on the top of the top plate, a collecting assembly is arranged in the demolding groove, and a water cooling assembly is arranged on the rear side of the demolding groove. Efficient cooling and slag removal are achieved through a linkage type air cooling and water cooling system, disintegrating slag is automatically collected in cooperation with a bottom sliding storage drawer, meanwhile, synchronous ejection demolding is achieved through a gear-connecting rod structure, and the demolding efficiency and stability are improved. Cooling is accelerated through air cooling and water cooling, and product defects are avoided.

Description

Technical Field

[0001] The present invention relates to the field of demolding and forming devices for chip capacitors, and particularly to a demolding and forming device for chip capacitor production. Background Art

[0002] As a basic component in electronic components, chip capacitors are widely used in the assembly of various high-precision circuit boards, performing functions such as filtering, bypassing, and coupling. Along with the trend of miniaturization and integration of electronic products, higher requirements are put forward for the forming accuracy and production efficiency of chip capacitors. Especially on high-speed automated production lines, if there are bottlenecks in the forming and demolding processes of chip capacitors, it will directly affect the entire production rhythm, and further restrict the improvement of production capacity and the control of product consistency. Therefore, the research and development of an automated device specifically for the efficient demolding and forming of chip capacitors has become a key direction for technological innovation in the industry.

[0003] Currently, in the production of chip capacitors, the mold forming and demolding processes still mainly rely on traditional injection molding equipment with manual assistance. Generally, the equipment structure is relatively simple, mainly using a single mechanical ejection method to achieve demolding. Cooling is mostly single air cooling, and some factories will add simple water cooling for auxiliary cooling. However, this combination method is mostly external splicing, and there is a lack of effective linkage between systems. The production rhythm completely depends on the sequential connection of operating procedures, and the degree of automation integration is low. Each system function in the equipment operation is independent of each other, and the cooling and ejection actions lack synchronous coordination, resulting in a long demolding cycle and limited production efficiency.

[0004] In existing equipment, first of all, the ejection mechanism mostly relies on a single drive, with slow action response and a lack of mechanical linkage structure. During the ejection process, it is easy to get stuck, reducing the equipment stability. Secondly, the cooling method is single, the air cooling blowing angle is not fixed, the cooling efficiency is low, and there is a problem of insufficient contact area between the cold air and the mold. Thirdly, air cooling and water cooling usually operate independently, lacking a control strategy for effective combined use, and unable to achieve rapid and uniform cooling. Moreover, the debris after mold demolding mostly relies on manual cleaning, lacking an efficient automatic collection system, which is extremely easy to cause accumulation and pollution inside the equipment. Finally, the existing cooling and ejection systems are usually controlled by independent drive units, resulting in a complex structure, increased cost, and difficult maintenance, affecting the long-term stable operation of the equipment. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a demolding and forming device for chip capacitor production, which solves the problem that the ejection mechanism of the existing demolding and forming device for chip capacitor production is single, slow in response and easy to get stuck, resulting in low demolding efficiency.

[0006] To achieve the above object, the present invention is realized by the following technical solutions: A demolding and forming device for the production of chip capacitors, including a demolding groove and a top plate. Four guide columns are arranged between the demolding groove and the top plate. A pressing cylinder is fixedly connected to the center of the top of the top plate. A lower mold is installed inside the demolding groove. A top-out mechanism is arranged inside the lower mold. An upper mold is arranged at the center of the bottom of the top plate. Liquid injection pipes are arranged on both sides of the top of the upper mold. The output end of the pressing cylinder is fixedly connected to the center of the top of the upper mold. A cooling mechanism is arranged on the top of the top plate. A collection assembly is arranged inside the demolding groove. A water cooling assembly is arranged at the rear of the demolding groove; The cooling mechanism includes an air cooling assembly and a fixing plate. The air cooling assembly includes a cooling gas tank. The bottom of the cooling gas tank is fixedly connected to the front side of the top of the top plate. Two piston outer cylinders are symmetrically arranged on both sides of the top of the top plate, and the input ends of both are connected to the inside of the cooling gas tank through an air outlet pipe. The output ends of both piston outer cylinders are equipped with air supply pipes.

[0007] Preferably, a piston rod is slidably connected inside the piston outer cylinder, and the bottom of the piston rod is fixedly connected to the top of the upper mold.

[0008] Preferably, the two air supply pipes penetrate through the inside of the top plate, and nozzles are installed at the bottoms of both, and the nozzles are installed on the top of the fixing plate.

[0009] Preferably, the lower mold is located at the center of the inside of the demolding groove, and a plurality of support rods are arranged between the outside of the lower mold and the inner wall of the demolding groove. The bottom of the fixing plate is fixedly connected to the top of the support rod.

[0010] Preferably, active racks are fixedly connected to both sides of the bottom of the upper mold. The inside of the lower mold is hollow and through grooves are opened on both sides. The active racks penetrate through the through grooves and are slidably connected inside the lower mold.

[0011] Preferably, the top-out mechanism includes a driving component, a driven top-out component and two limit columns. The driving component is located inside the lower mold. The driving component includes two driven gears, and a connecting rod is fixedly connected between them. Support plates are arranged on both outer sides of the connecting rod. The two active racks are meshed with the two driven gears. The bottom of the support plate is fixedly connected to the inner bottom wall of the lower mold. An intermediate gear is arranged on the outer side of the middle of the connecting rod.

[0012] Preferably, the driven ejection assembly includes a bottom plate located directly below the lower mold. A plurality of ejector rods are fixedly connected to the top of the bottom plate. A plurality of lower mold cavities are provided on the top of the lower mold. The ejector rods are slidably connected inside the lower mold cavities. A driven rack is provided at the center of the top of the bottom plate. The driven rack penetrates the bottom wall of the lower mold and meshes with the intermediate gear.

[0013] Preferably, the bottoms of the two limit posts are fixedly connected to both sides of the top of the bottom plate, and the limit posts are slidably connected inside the lower mold.

[0014] Preferably, the collection assembly includes a storage drawer slidably connected inside the demolding groove. The storage drawer is located directly below the bottom plate, and a handle is provided at the end of the storage drawer.

[0015] Preferably, the water cooling assembly includes a cooling water tank. The output end at the top of the cooling water tank is equipped with a liquid outlet pipe, and the other end of the liquid outlet pipe is fixedly connected inside the upper mold. The input end of the cooling water tank is equipped with a liquid return pipe, and the other end of the liquid return pipe is fixedly connected inside the upper mold.

[0016] The present invention provides a demolding and forming device for the production of chip capacitors, having the following beneficial effects: 1. In the present invention, a cooling mechanism is integrated on the mold top plate and is linked with the upper mold. When the upper mold moves downward under the drive of the downward pressing cylinder, it will drive the piston rods in the two piston outer cylinders arranged on both sides of the top plate to move downward synchronously, and a negative pressure is formed inside the piston outer cylinders. Since the piston outer cylinders are connected to the cooling gas tank through the air outlet pipes, the negative pressure will cause the cold gas in the cooling gas tank to be sucked into the piston outer cylinders. After the injection molding is completed, the upper mold rises under the drive of the cylinder, the piston rods move upward, and then compress the cooling gas in the piston outer cylinders and eject it through the connected air supply pipes. The bottom of the air supply pipe is provided with a nozzle facing the product inside the lower mold cavity, which can not only quickly cool the product at a fixed point, but also effectively blow away the slag or dust attached due to molding, improving the surface quality and demolding efficiency of the product.

[0017] In the present invention, to cooperate with the function of blowing away slag by gas, a special slag collection assembly is provided at the bottom of the lower mold. This assembly includes a slidable and extractable storage drawer located at the bottom of the lower mold and directly opposite the mold cavity. When the cooling gas blows towards the product surface from the nozzle and blows away the slag, the slag will naturally fall into this storage drawer. The staff can regularly pull out the storage drawer for cleaning without interrupting the entire production process, effectively improving the cleaning efficiency and the convenience of equipment maintenance.

[0018] The present invention designs a complex gear-link ejecting structure inside the lower mold and links it with the injection mold to achieve precise and synchronous demolding and ejecting actions. Active racks are provided on both sides of the bottom of the upper mold. When the mold is closed, the active racks penetrate into the inside of the lower mold and are connected to the internal drive assembly. The drive assembly includes driven gears meshing with the active racks. The two driven gears are connected by a connecting rod, and an intermediate gear is provided in the middle of the connecting rod. The rotation of the driven gears drives the intermediate gear through the connecting rod, and then drives the driven rack meshing with the intermediate gear to move downward. Since the bottom of the driven rack is connected to a bottom plate, and multiple ejector rods are provided on the bottom plate, under the action of the entire transmission chain, the ejector rods slide out of the cavity during mold closing and injection molding, and the ejector rods will push the product in the mold cavity upward after the product is formed, realizing automatic demolding. This structure improves the stability of the ejecting force while ensuring synchronism, and is applicable to multi-cavity high-precision chip capacitor molds.

[0019] The present invention provides a water-cooling component outside the demolding groove. Cooling water is injected into the cooling cavity inside the upper mold through a liquid outlet pipe. After the mold is closed and the injection molding is completed, the cooling water conducts heat around the product for temperature reduction. This water-cooling device can effectively shorten the molding cycle, improve the uniformity of temperature control in the mold cavity, and avoid product warping or cracking problems caused by uneven cooling. At the same time, this water-cooling system can be used in conjunction with the aforementioned cold air blowing system to achieve a dual cooling mechanism, further improving production efficiency and product yield. Brief Description of the Drawings

[0020] Figure 1 is a perspective view of the present invention; Figure 2 is a schematic diagram of the piston rod of the present invention; Figure 3 is a schematic diagram of the liquid injection pipe of the present invention; Figure 4 is a schematic diagram of the cooling gas tank of the present invention; Figure 5 is a schematic diagram of the intermediate gear of the present invention; Figure 6 is a schematic diagram of the driven rack of the present invention; Figure 7 is a schematic diagram of the storage drawer of the present invention; Figure 8 is a schematic diagram of the cooling water tank of the present invention.

[0021] Among them, 1, demolding groove; 2, top plate; 3, guide pillar; 4, lower pressing cylinder; 5, upper mold; 6, lower mold; 61, lower mold cavity; 7, cooling mechanism; 71, air cooling assembly; 711, cooling air tank; 712, piston outer cylinder; 713, air outlet pipe; 714, air supply pipe; 715, piston rod; 716, nozzle; 72, fixing plate; 8, driving rack; 9, liquid injection pipe; 10, support rod; 11, ejection mechanism; 111, driving assembly; 1111, driven gear; 1112, connecting rod; 1113, support plate; 1114, intermediate gear; 112, driven ejection assembly; 1121, bottom plate; 1122, ejector rod; 1123, driven rack; 113, limit post; 12, collection assembly; 121, storage drawer; 122, handle; 13, water cooling assembly; 131, cooling water tank; 132, liquid return pipe; 133, liquid outlet pipe. Detailed implementation manner

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0023] Please refer to the attached Figure 1 , the attached Figure 7 and the attached Figure 8, an embodiment of the present invention provides an efficient demolding and molding device applicable to the production process of chip capacitors. Its overall structure includes a demolding groove 1 and a top plate 2, which are vertically connected by four evenly distributed guide columns 3 to achieve stable guiding and precise alignment of the upper mold 5 and the lower mold 6. A downward pressure cylinder 4 is fixedly installed at the center of the top of the top plate 2 to drive the upper mold 5 connected below it to achieve precise up and down movement. The upper mold 5 is installed at the center of the bottom of the top plate 2 and can move downward under the action of the downward pressure cylinder 4 to close with the lower mold 6 in the demolding groove 1 below to complete mold closing and subsequent injection molding. Liquid injection pipes 9 are respectively arranged on both sides of the top of the upper mold 5 to facilitate injecting molten capacitor raw materials into the mold cavity to achieve rapid filling and molding. The lower mold 6 is located in the central area inside the demolding groove 1, and its outer side is fixed and spaced from the inner wall of the demolding groove 1 through a plurality of support rods 10 to ensure uniform force and stable structure of the mold during the molding and demolding processes. A top ejection mechanism 11 is integrated inside the lower mold 6 to push the molded capacitor parts upward after cooling and solidification to achieve automatic demolding. To improve production efficiency and optimize the cooling effect, a cooling mechanism ⑦ is also provided on the top of the top plate 2 to provide gas cooling function in the later stage of injection molding. By cooperating with the lower mold 6, it can quickly reduce the mold temperature and at the same time has the ability to blow away the debris generated during the molding process. A collection assembly 12 is arranged inside the demolding groove 1 to receive the debris residues blown off by the cooling gas, improving the cleaning efficiency and reducing manual intervention. In addition, a water cooling assembly 13 is installed at the rear side of the demolding groove 1 to further reduce the temperature of the mold and the product by using cooling water, forming a complement to the gas cooling system, significantly improving the molding efficiency and product quality, and meeting the requirements of batch automatic production of chip capacitors.

[0024] Please refer to the appendix Figure 1 - appendix Figure 4, the cooling mechanism 7 mainly includes an air-cooling component 71 and a fixing plate 72. The air-cooling component 71 is used to achieve efficient cooling and slag blowing functions during the demolding and forming process. A cooling gas tank 711 is provided in the air-cooling component 71, which is fixedly installed on the front side of the top plate 2 through a bracket. The cooling gas tank 711 stores compressed cooling gas, which can be precisely controlled and released through the gas pipeline system as needed. Two piston outer cylinders 712 are symmetrically arranged on the left and right sides of the top of the top plate 2, which are used to achieve the functions of cold air inhalation and pressure delivery, and their input ends are respectively connected to the cooling gas tank 711 through the air outlet pipes 713. The output end of each piston outer cylinder 712 is connected to an air supply pipe 714. The air supply pipe 714 penetrates from the inside of the top plate 2 to the lower part, and its end is connected to a nozzle 716, which is used to precisely spray the cooling gas onto the surface of the formed product. The nozzle 716 is installed at the top of the fixing plate 72, ensuring the distance stability and angle consistency between the nozzle 716 and the mold, thereby improving the spraying effect and cooling uniformity. The bottom of the fixing plate 72 is firmly connected to the top of the support rod 10, which not only plays a role in supporting the nozzle 716 but also further enhances the overall structural stability of the system. A slidable piston rod 715 is provided inside each piston outer cylinder 712. The bottom of the piston rod 715 is fixedly connected to the top of the upper mold 5. When the upper mold 5 moves up and down under the action of the lower pressing cylinder 4, it will drive the piston rod 715 to slide inside the outer cylinder, thus forming a negative pressure inhalation or positive pressure ejection process, enabling cold air to be inhaled into the piston outer cylinder 712 or quickly ejected, realizing the linkage control of the cooling function. By automatically driving the cooling system through the movement of the upper mold 5, synchronous cooling and slag removal can be achieved without an additional power device, greatly improving the automation level and operating efficiency, especially suitable for the forming scenario of chip capacitors with high-frequency continuous operation.

[0025] Please refer to the appendix Figure 5 - appendix Figure 6, on the left and right sides of the bottom of the upper mold 5, a set of driving racks 8 are respectively fixedly connected. These racks serve as the input unit of the ejection mechanism 11 and can convert the longitudinal linear movement into rotational transmission during the movement of the upper mold 5. The internal structure of the lower mold 6 is designed as a cavity type, and through slots are symmetrically opened on both sides, enabling the driving racks 8 to pass through the through slots and penetrate into the interior of the lower mold 6 to achieve meshing and cooperation with the internal structure, while maintaining a sliding connection state to ensure the stability and precision of the transmission process during the mold closing or separating process of the upper mold 5 and the lower mold 6. The ejection mechanism 11 includes a driving component 111, a driven ejection component 112, and two limit posts 113, and the three together constitute an efficient mechanical linkage demolding system. The driving component 111 is arranged in the core area inside the lower mold 6, and two driven gears 1111 corresponding to each other are equipped inside it. Synchronous rotation control is achieved between the two driven gears 1111 through a connecting rod 1112. Support plates 1113 are respectively connected to both ends of the connecting rod 1112, and the bottom of the support plate 1113 is fixedly installed at the inner bottom wall position of the lower mold 6 to form a stable support framework. The two driving racks 8 are precisely meshed with the two driven gears 1111. When the upper mold 5 drives the driving rack 8 to move, it will drive the driven gears 1111 to rotate synchronously. An intermediate gear 1114 is arranged on the outer side of the middle of the connecting rod 1112, serving as a relay transmission element for the driving structure and the lower ejection system, and playing a role in transmitting the rotational movement of the gear downward. The driven ejection component 112 includes a bottom plate 1121. The bottom plate 1121 is located directly below the lower mold 6, and a plurality of ejector rods 1122 are uniformly fixedly connected to the top of the bottom plate 1121. The ejector rods 1122 penetrate and slide upwardly and downwardly through a plurality of lower mold cavities 61 arranged on the top of the lower mold 6, and are used to eject the molded product under the driving action. To achieve structural limitation and movement guidance, the two limit posts 113 are respectively installed on both sides of the top of the bottom plate 1121, and chutes are provided inside the lower mold 6, enabling the limit posts 113 to slide along a preset path to prevent deviation or jamming during the ejection process. In addition, a driven rack 1123 is arranged at the center position of the top of the bottom plate 1121. This rack penetrates upwardly through the bottom wall of the lower mold 6 and is directly meshed with the aforementioned intermediate gear 1114 to achieve the conversion of rotational-linear transmission. The above structures work together. While the upper mold 5 drives the driving rack 8 to move, the gear system is sequentially transmitted to the driven rack 1123, thereby driving the entire bottom plate 1121 to move downward or upward, driving a plurality of ejector rods 1122 to slide out of the cavity before injection molding, or pushing the product out of the cavity after injection molding, completing the automatic and high-precision ejection and demolding actions, and improving the production efficiency and equipment reliability.

[0026] Please refer to the appendix Figure 7, the collecting component 12 is used to efficiently collect the scraps or impurities blown off during the demolding process by the cooling air flow, so as to keep the inside of the mold and the equipment clean, and improve the quality of the finished product and the production efficiency. This component includes a pull-out storage drawer 121, which is in a box-like structure as a whole. It is slidably connected to the internal guide rail at the bottom of the demolding groove 1, facilitating the staff to easily pull it out for cleaning during the equipment operation gap or regular maintenance. The vertical position of the storage drawer 121 is directly below the bottom plate 1121, ensuring that after the cooling air flow impacts the product from the nozzle 716 and blows off the scraps, they can directly enter the inside of the storage drawer 121 without scattering and affecting the operation of other parts of the equipment. A handle 122 convenient for manual operation is provided at the front end of the storage drawer 121. The storage drawer 121 can be slid outwards or pushed back in again through the handle 122. The structural design is simple and practical, facilitating maintenance and the management of the cleaning frequency, thereby effectively reducing the mold cavity pollution or molding defects caused by the accumulation of debris.

[0027] Please refer to the appendix Figure 8 , the water-cooling component 13 is used to cooperate with the air-cooling system to further improve the cooling speed of the molded part. Its core structure includes a cooling water tank 131 arranged outside the equipment, with a closed water circulation system inside, which is used to transport constant-temperature cooling water into the upper mold 5 to maintain the stability of the working temperature. An outlet pipe 133 is provided at the top of the cooling water tank 131, which is used to draw out the cooling water from the cooling water tank 131 and transport it into the internal cooling cavity of the upper mold 5. By forming an enclosed waterway structure in the mold, the residual heat in the mold cavity can be quickly removed. The other end of the outlet pipe 133 is fixedly installed inside the upper mold 5 through a sealing connector to ensure the tightness and stability during the fluid transportation process. At the same time, a return pipe 132 is installed at the input end of the cooling water tank 131, and the other end is also fixedly connected inside the upper mold 5, which is used to re-circulate the heat-absorbed cooling water back to the water tank for cooling and circulation treatment, realizing the continuous and stable operation of the closed-loop water-cooling system.

[0028] Working principle: Before the equipment starts to run, the operating system activates the pressing cylinder 4, causing the upper mold 5 to move downward along the guide pillar 3. During this process, the driving rack 8 at the bottom of the upper mold 5 slides into the inside of the lower mold 6 along the through grooves on both sides of the lower mold 6 and meshes with the driven gear 1111 inside the lower mold 6; at the same time, it drives the fixedly connected piston rod 715 to slide downward in the piston outer cylinder 712, causing a negative pressure to be formed inside the piston outer cylinder 712, and sucking the cooling gas in the cooling gas tank 711 into the piston outer cylinder 712. The upper mold 5 continues to move downward until it is closed with the lower mold 6 to form a closed molding space. At the same time, the molten capacitor raw material is injected into the lower mold cavity 61 through the injection pipe 9 to complete the filling process.

[0029] During the mold closing process, the driving rack 8 drives the driven gear 1111 to rotate as the upper mold 5 presses down. The driven gear 1111 drives the intermediate gear 1114 in the middle to rotate via the connecting rod 1112, and meshes with the driven rack 1123, causing the driven rack 1123 to move downward. Thereby, the bottom plate 1121 and multiple ejector rods 1122 are driven to retract downward, and the ejector rods 1122 slide out of the lower mold cavity 61, creating space for material injection.

[0030] After molding is completed, the downward pressing cylinder 4 controls the upward movement of the upper mold 5, and at the same time drives the fixedly connected piston rod 715 to slide upward in the piston outer cylinder 712, creating a positive pressure inside the piston outer cylinder 712. Under the action of the positive pressure, it is discharged downward through the air supply pipe 714 and sprayed onto the surface of the molded product through the nozzle 716 for cooling and slag removal operations. During the blowing process of the cooling gas, the debris on the surface of the molded product is blown off by the airflow and directly falls into the storage drawer 121 provided below. The storage drawer 121 is slidably connected to the bottom of the demolding groove 1, and can be regularly pulled out for cleaning through the handle 122 provided thereon.

[0031] Meanwhile, the cooling water tank 131 activates the water circulation system, injects cooling water into the cooling cavity inside the upper mold 5 through the liquid outlet pipe 133, and completes the water cooling process of the mold. The cooling water after absorbing heat returns to the cooling water tank 131 through the liquid return pipe 132, forming a closed-loop flow to maintain the constant temperature of the mold.

[0032] After cooling is completed, the lower mold 6 remains stationary under the instruction of the control system, and the upper mold 5 continues to rise. The driving rack 8 moves upward accordingly, driving the engaged driven gear 1111 to rotate in the reverse direction. Through the connecting rod 1112, intermediate gear 1114 and driven rack 1123, the bottom plate 1121 is driven to rise, and then multiple ejector rods 1122 are pushed to eject upward from the lower mold cavity 61, ejecting the entire product and completing the entire process of automatic demolding and molding.

[0033] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A demolding and molding device for the production of chip capacitors, comprising a demolding groove (1) and a top plate (2), characterized in that, Four guide posts (3) are arranged between the demolding groove (1) and the top plate (2). A downward pressing air cylinder (4) is fixedly connected to the center of the top of the top plate (2). A lower mold (6) is installed inside the demolding groove (1). An ejection mechanism (11) is arranged inside the lower mold (6). An upper mold (5) is arranged at the center of the bottom of the top plate (2). Liquid injection pipes (9) are arranged on both sides of the top of the upper mold (5). The output end of the downward pressing air cylinder (4) is fixedly connected to the center of the top of the upper mold (5). A cooling mechanism (7) is arranged on the top of the top plate (2). A collection assembly (12) is arranged inside the demolding groove (1). A water cooling assembly (13) is arranged at the rear of the demolding groove (1). The cooling mechanism (7) includes an air cooling assembly (71) and a fixing plate (72). The air cooling assembly (71) includes a cooling gas tank (711). The bottom of the cooling gas tank (711) is fixedly connected to the front side of the top of the top plate (2). Two piston outer cylinders (712) are symmetrically arranged on both sides of the top of the top plate (2), and the input ends of both are connected to the inside of the cooling gas tank (711) through an air outlet pipe (713). Air delivery pipes (714) are installed at the output ends of the two piston outer cylinders (712).

2. The demolding and forming device for producing chip capacitors according to claim 1, wherein A piston rod (715) is slidably connected inside the piston outer cylinder (712). The bottom of the piston rod (715) is fixedly connected to the top of the upper mold (5).

3. The demoulding and forming device for producing chip capacitors according to claim 1, characterized in that, The two air delivery pipes (714) penetrate through the inside of the top plate (2), and nozzles (716) are installed at the bottoms of both. The nozzles (716) are installed on the top of the fixing plate (72).

4. A demolding and forming device for the production of chip capacitors according to claim 1, characterized in that, The lower mold (6) is located at the center inside the demolding groove (1). A plurality of support rods (10) are arranged between the outer side of the lower mold (6) and the inner wall of the demolding groove (1). The bottom of the fixing plate (72) is fixedly connected to the top of the support rod (10).

5. The demolding and forming device for producing chip capacitors according to claim 1, wherein, Active racks (8) are fixedly connected to both sides of the bottom of the upper mold (5). The inside of the lower mold (6) is hollow and through grooves are opened on both sides. The active racks (8) penetrate through the through grooves and are slidably connected inside the lower mold (6).

6. The demolding and forming device for producing chip capacitors according to claim 5, wherein, The ejection mechanism (11) includes a driving component (111), a driven ejection component (112) and two limit posts (113). The driving component (111) is located inside the lower mold (6). The driving component (111) includes two driven gears (1111), and a connecting rod (1112) is fixedly connected between them. Support plates (1113) are arranged on both outer sides of the connecting rod (1112). The two active racks (8) are meshed with the two driven gears (1111). The bottom of the support plate (1113) is fixedly connected to the inner bottom wall of the lower mold (6). An intermediate gear (1114) is arranged on the outer side of the middle of the connecting rod (1112).

7. A demolding and forming device for the production of chip capacitors according to claim 6, characterized in that, The driven ejection assembly (112) includes a bottom plate (1121) which is located directly below the lower die (6). A plurality of ejector rods (1122) are fixedly connected to the top of the bottom plate (1121). A plurality of lower die cavities (61) are provided on the top of the lower die (6). The ejector rods (1122) are slidably connected inside the lower die cavities (61). A driven rack (1123) is provided at the center of the top of the bottom plate (1121). The driven rack (1123) penetrates through the bottom wall of the lower die (6), and the driven rack (1123) meshes with the intermediate gear (1114).

8. A demolding and forming device for the production of chip capacitors according to claim 7, characterized in that, The bottoms of two of the limit posts (113) are fixedly connected to both sides of the top of the bottom plate (1121), and the limit posts (113) are slidably connected inside the lower die (6).

9. The demolding and forming device for producing chip capacitors according to claim 7, characterized in that, The collection assembly (12) includes a storage drawer (121) which is slidably connected inside the demolding groove (1). The storage drawer (121) is located directly below the bottom plate (1121), and a handle (122) is provided at the end of the storage drawer (121).

10. The demolding and forming device for producing chip capacitors according to claim 1, characterized in that, The water cooling assembly (13) includes a cooling water tank (131). An outlet pipe (133) is installed at the output end of the top of the cooling water tank (131). The other end of the outlet pipe (133) is fixedly connected inside the upper die (5). A return pipe (132) is installed at the input end of the cooling water tank (131). The other end of the return pipe (132) is fixedly connected inside the upper die (5).

Images