Automatic labeling machine for semiconductor packaging box and use method of automatic labeling machine

Abstract

The invention provides an automatic labeling machine for a semiconductor packaging box and a using method of the automatic labeling machine. The automatic labeling machine for the semiconductor packaging box comprises a base, a label carrying mechanism and a packaging box fixing mechanism are arranged on the base, the packaging box fixing mechanism is composed of an air cylinder fixing part, a clamping air cylinder, a clamping push plate and the like, the packaging box can be accurately positioned and clamped, and the packaging box can be conveniently and rapidly labeled. The label carrying mechanism comprises a first installation frame, a carrying robot, a label taking suction cup, a visual positioning camera and the like, label suction and positioning are achieved, and the label fixing mechanism completes label compaction through a label fixing air cylinder and a label roller. By means of the structure, the clamping air cylinder is used for fixing, the carrying robot drives the suction cup to take labels, the visual positioning camera corrects the positions and then labels are pasted, finally, the labels are compacted through the label roller, the full-automatic process from positioning to labeling is achieved, and compared with manual operation, the labeling efficiency and precision are remarkably improved, the labor cost is reduced, and the problems that labels are inclined, not firm in pasting and the like are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor component packaging, and specifically to an automatic label pasting machine for semiconductor packaging boxes and its usage method. Background Art

[0002] Generally, after the plastic encapsulation of semiconductor components is formed, they have to go through multiple production processes such as tin plating - lead frame cutting - testing - external inspection and packaging before they can be officially shipped; and in the packaging process, different product packaging boxes need to be pasted with different labels to bind each box of products with the corresponding labels, so as to query the products of the corresponding batches later or trace the products with problems.

[0003] At present, the common practice in the industry for pasting labels on packaging boxes is to manually paste the labels at the designated positions on the packaging boxes, which has a great impact on the implementation of automation in the future, and there are also uneven paste positions in manual pasting, resulting in a relatively poor experience for end - users. Summary of the Invention

[0004] Aiming at the deficiencies of the prior art, the present invention provides an automatic label pasting machine for semiconductor packaging boxes and its usage method, which solves the problems of low efficiency, poor accuracy, high labor intensity, and unstable label pasting quality.

[0005] To achieve the above - mentioned purposes, the present invention is realized through the following technical solutions: an automatic label pasting machine for semiconductor packaging boxes and its usage method, including: a base, on the upper end of the base, there are arranged a label handling mechanism and a packaging box fixing mechanism;

[0006] The label handling mechanism includes a first mounting frame, a handling robot, a label - picking suction cup, a mechanism fixing block, a mechanism fixing plate, a suction cup fixing plate, a fastening connecting piece, a vision positioning camera, and a label fixing mechanism;

[0007] The packaging box fixing mechanism includes a cylinder fixing piece, a clamping cylinder, a clamping push plate, a paper box placing plate, a paper box baffle, and a second bracket.

[0008] Preferably: The label fixing mechanism includes a label fixing cylinder, a label roller, a roller connecting block, and a roller mounting block, and the rear end of the label fixing cylinder is fixedly connected to the mechanism fixing plate.

[0009] Preferably: The telescopic end of the label fixing cylinder is fixedly connected to the roller connecting block, both sides of the roller connecting block are fixedly connected to the roller mounting block, and the inner wall of the roller mounting block is in rolling connection with the label roller through a bearing.

[0010] Preferably: The lower end of the first mounting frame is fixedly connected to the base through a first bolt, and the upper end of the first mounting frame is fixedly connected to the handling robot.

[0011] Preferably, the lower side of the front end of the handling robot is rotatably connected to the mechanism fixing block. The lower end surface of the mechanism fixing block is fixedly connected to the upper end surface of the mechanism fixing plate. The lower end of the mechanism fixing plate is fixedly connected to the fastening connecting piece. The inner side of the fastening connecting piece is rotatably connected to the suction cup fixing plate. The inner wall of the suction cup fixing plate is fixedly connected to the label-taking suction cup. The lower end of the mechanism fixing plate is fixedly connected to the vision positioning camera.

[0012] Preferably, the lower end of the second bracket is fixedly connected to the base through the second bolt. The upper end of the second bracket is fixedly connected to the carton placing plate. The front end of the carton placing plate is fixedly connected to the carton baffle.

[0013] Preferably, the lower end of the cylinder fixing piece is fixedly connected to the base through the third bolt. The upper end of the cylinder fixing piece is fixedly connected to the clamping cylinder. The telescopic end of the clamping cylinder is fixedly connected to the clamping push plate.

[0014] A method for automatically labeling a semiconductor packaging box, based on the semiconductor packaging box automatic labeling machine according to any one of the above, includes the following steps:

[0015] S1. Install the packaging box on the carton placing plate;

[0016] S2. Start the clamping cylinder to move the clamping push plate forward to clamp and fix the packaging box;

[0017] S3. Rotate the handling robot fixed on the first mounting frame, and use the label-taking suction cup to suck the label on the roll material;

[0018] S4. Move the sucked label to the position where labeling is required through the vision positioning camera, and make the label stick to the corresponding position of the carton by moving the handling robot;

[0019] S5. During the labeling process, drive the label roller at the lower end to move downward through the label fixing cylinder and contact the label on the carton, and fix the label by pressure.

[0020] The present invention provides a semiconductor packaging box automatic labeling machine and its usage method. It has the following beneficial effects: In terms of positioning and fixing, the carton placement plate cooperates with the carton baffle to complete the preliminary positioning of the packaging box, and the clamping cylinder drives the clamping push plate to achieve stable clamping, effectively avoiding the displacement of the packaging box during the labeling process and ensuring the high-precision of the labeling position; In the label handling and attachment link, the handling robot is equipped with a label picking suction cup, which uses the principle of vacuum adsorption to quickly and stably pick the label. The vision positioning camera collects images in real time and calculates the deviation, guiding the robot to accurately adjust the position, greatly improving the labeling accuracy and efficiency; In the label fixing mechanism, the label fixing cylinder pushes the label roller to roll and compact the label, which can not only effectively expel air and prevent bubbles from generating, ensure the label is firmly and smoothly pasted, but also completely solve the problems that may exist in manual label pasting, improve the work efficiency and accuracy of label pasting, and increase the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the internal structure of the present invention;

[0022] Figure 2 It is a schematic diagram of the base connection structure of the present invention;

[0023] Figure 3 is Figure 2 The enlarged schematic diagram at A in

[0024] Figure 4 is Figure 2 The enlarged schematic diagram at B in

[0025] Figure 5 It is a schematic diagram of the packaging box fixing mechanism of the present invention;

[0026] Figure 6 It is a schematic diagram of the connection of the handling components of the present invention;

[0027] Figure 7 It is a schematic diagram of the structure of the suction mechanism and the label fixing mechanism of the present invention.

[0028] Among them, 1. Base; 2. First mounting frame; 3. Label handling mechanism; 4. Packaging box fixing mechanism; 5. Handling robot; 6. Label fixing mechanism; 7. Vision positioning camera; 8. Label picking suction cup; 9. Mechanism fixing block; 10. Mechanism fixing plate; 11. Suction cup fixing plate; 12. Fastening connection piece; 13. Label fixing cylinder; 14. Label roller; 15. Roller connection block; 16. Roller mounting block; 17. Cylinder fixing piece; 18. Clamping cylinder; 19. Clamping push plate; 20. Carton placement plate; 21. Carton baffle; 22. First bolt; 23. Second bracket; 24. Second bolt; 25. Third bolt. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] Embodiment 1

[0031] As Figures 1-7 shown, an embodiment of the present invention provides an automatic labeler for semiconductor packaging boxes and its usage method, including a base 1, and a label handling mechanism 3 and a packaging box fixing mechanism 4 are arranged at the upper end of the base 1.

[0032] The label handling mechanism 3 includes a first mounting frame 2, a handling robot 5, a label picking suction cup 8, a mechanism fixing block 9, a mechanism fixing plate 10, a suction cup fixing plate 11, a fastening connecting piece 12, a vision positioning camera 7 and a label fixing mechanism 6. The label fixing mechanism 6 includes a label fixing cylinder 13, a label roller 14, a roller connecting block 15 and a roller mounting block 16. The rear end of the label fixing cylinder 13 is fixedly connected to the mechanism fixing plate 10, the telescopic end of the label fixing cylinder 13 is fixedly connected to the roller connecting block 15, both sides of the roller connecting block 15 are fixedly connected to the roller mounting block 16, the inner wall of the roller mounting block 16 is rotatably connected to the label roller 14 through a bearing. The lower end of the first mounting frame 2 is fixedly connected to the base 1 through a first bolt 22, the upper end of the first mounting frame 2 is fixedly connected to the handling robot 5, the lower side of the front end of the handling robot 5 is rotatably connected to the mechanism fixing block 9, the lower end surface of the mechanism fixing block 9 is fixedly connected to the upper end surface of the mechanism fixing plate 10, the lower end of the mechanism fixing plate 10 is fixedly connected to the fastening connecting piece 12, the inner side of the fastening connecting piece 12 is rotatably connected to the suction cup fixing plate 11, the inner wall of the suction cup fixing plate 11 is fixedly connected to the label picking suction cup 8, the lower end of the mechanism fixing plate 10 is fixedly connected to the vision positioning camera 7. The label picking suction cup 8 uses the principle of vacuum adsorption to generate negative pressure and smoothly peel the label from the roll material. During the handling process, the vision positioning camera 7 fixed to the lower end of the mechanism fixing plate 10 plays a key role, and it real-time collects the image information of the label and the packaging box.

[0033] The packaging box fixing mechanism 4 includes a cylinder fixing piece 17, a clamping cylinder 18, a clamping push plate 19, a paper box placement plate 20, a paper box baffle 21 and a second bracket 23.

[0034] Embodiment 2

[0035] As Figures 1-7 shown, an embodiment of the present invention provides an automatic labeler for semiconductor packaging boxes and its usage method, including a base 1, and a label handling mechanism 3 and a packaging box fixing mechanism 4 are arranged at the upper end of the base 1.

[0036] The label handling mechanism 3 includes a first mounting bracket 2, a handling robot 5, a label suction cup 8, a mechanism fixing block 9, a mechanism fixing plate 10, a suction cup fixing plate 11, a fastening connecting piece 12, a vision positioning camera 7 and a label fixing mechanism 6.

[0037] The packaging box fixing mechanism 4 includes a cylinder fixing piece 17, a clamping cylinder 18, a clamping push plate 19, a paper box placing plate 20, a paper box baffle 21 and a second bracket 23. The lower end of the second bracket 23 is fixedly connected to the base 1 through a second bolt 24. The upper end of the second bracket 23 is fixedly connected to the paper box placing plate 20. The front end of the paper box placing plate 20 is fixedly connected to the paper box baffle 21. The lower end of the cylinder fixing piece 17 is fixedly connected to the base 1 through a third bolt 25. The upper end of the cylinder fixing piece 17 is fixedly connected to the clamping cylinder 18. The telescopic end of the clamping cylinder 18 is fixedly connected to the clamping push plate 19. The paper box baffle 21 at the front end of the paper box placing plate 20 plays a preliminary positioning role. Subsequently, the clamping cylinder 18 is started, and its telescopic end pushes the clamping push plate 19 forward to squeeze and fix the packaging box between the baffle and the push plate from the rear side, ensuring that the packaging box will not be displaced during the labeling process and achieving precise positioning.

[0038] A method for automatically labeling a semiconductor packaging box, based on the semiconductor packaging box automatic labeling machine described in any one of the above, includes the following steps:

[0039] S1. Install the packaging box on the paper box placing plate 20;

[0040] S2. Start the clamping cylinder 18 to move the clamping push plate 19 forward to clamp and fix the packaging box;

[0041] S3. Rotate the handling robot 5 fixed on the first mounting bracket 2, and use the label suction cup 8 to suck the label on the coil;

[0042] S4. Move the sucked label to the position where labeling is required through the vision positioning camera 7, and make the label stick to the corresponding position of the paper box through the movement of the handling robot 5;

[0043] S5. During the labeling process, drive the label roller 14 at the lower end to move downward through the label fixing cylinder 13 and contact the label on the paper box, and fix the label by pressure.

[0044] Working principle: The automatic labeler for semiconductor packaging boxes realizes automatic labeling through the coordinated operation of multiple mechanisms. First, the operator places the semiconductor packaging box on the carton placement plate 20. The carton baffle 21 at the front end of the carton placement plate 20 plays a preliminary positioning role. Subsequently, the clamping cylinder 18 is activated, and its telescopic end pushes the clamping push plate 19 forward to squeeze and fix the packaging box between the baffle and the push plate from the rear, ensuring that the packaging box does not displace during the labeling process and achieving precise positioning.

[0045] In the label handling stage, the handling robot 5 fixed on the first mounting frame 2 starts to operate. It can rotate flexibly in multiple axes, driving the label suction cup 8 at the end to move above the roll-fed label. The label suction cup 8 uses the principle of vacuum adsorption to generate negative pressure and smoothly peel the label from the roll. During the handling process, the visual positioning camera 7 fixed at the lower end of the mechanism fixing plate 10 plays a key role. It real-time collects the image information of the label and the packaging box, and through the built-in image algorithm, quickly calculates the position deviation between the two, and feeds the data back to the control system. The handling robot 5 precisely adjusts its own posture and position according to the deviation data to ensure that the sucked label is accurately moved to the specified labeling position of the packaging box. Subsequently, a certain adhesion force is applied through the movement of the robot to complete the preliminary pasting of the label.

[0046] In the label fixing stage, the label fixing cylinder 13 starts to work. Its telescopic end is connected to the roller connection block 15. When the cylinder is activated, it pushes the roller connection block 15 downward, thereby driving the roller mounting blocks 16 on both sides and the label roller 14 inside to descend together, making the label roller 14 contact the label on the surface of the packaging box. The label roller 14 is installed on the inner wall of the roller mounting block 16 through bearings and can roll freely. Under the action of the cylinder pressure, the roller rolls on the label surface. On the one hand, it further compresses the label using pressure, and on the other hand, it effectively expels the air between the label and the packaging box during the rolling process to avoid generating bubbles, ensuring that the label is pasted flat and firmly on the packaging box. During the entire labeling process, the clamping cylinder 18, the handling robot 5, the visual positioning camera 7, and the label fixing cylinder 13 are closely linked and precisely coordinated through the control system, so as to efficiently and accurately complete the automatic labeling task of semiconductor packaging boxes, effectively improving production efficiency and labeling quality.

[0047] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic labeling machine for semiconductor packaging boxes, characterized in that, Comprising: A base (1), on the upper end of the base (1) there is provided a label handling mechanism (3) and a packaging box fixing mechanism (4); The label handling mechanism (3) includes a first mounting frame (2), a handling robot (5), a label picking suction cup (8), a mechanism fixing block (9), a mechanism fixing plate (10), a suction cup fixing plate (11), a fastening connecting piece (12), a vision positioning camera (7) and a label fixing mechanism (6); The packaging box fixing mechanism (4) includes a cylinder fixing piece (17), a clamping cylinder (18), a clamping push plate (19), a paper box placing plate (20), a paper box baffle (21) and a second bracket (23).

2. The automatic labeler for semiconductor packaging boxes according to claim 1, wherein: The label fixing mechanism (6) includes a label fixing cylinder (13), a label roller (14), a roller connecting block (15) and a roller mounting block (16), the rear end of the label fixing cylinder (13) is fixedly connected to the mechanism fixing plate (10).

3. The automatic labeling machine for semiconductor packaging boxes according to claim 2, wherein: The telescopic end of the label fixing cylinder (13) is fixedly connected to the roller connecting block (15), both sides of the roller connecting block (15) are fixedly connected to the roller mounting block (16), and the inner wall of the roller mounting block (16) is in rolling connection with the label roller (14) through a bearing.

4. The automatic labeler for semiconductor packaging boxes according to claim 1, wherein: The lower end of the first mounting frame (2) is fixedly connected to the base (1) through a first bolt (22), and the upper end of the first mounting frame (2) is fixedly connected to the handling robot (5).

5. The automatic labeling machine for semiconductor packaging boxes according to claim 1, wherein: The lower side of the front end of the handling robot (5) is rotatably connected to the mechanism fixing block (9), the lower end surface of the mechanism fixing block (9) is fixedly connected to the upper end surface of the mechanism fixing plate (10), the lower end of the mechanism fixing plate (10) is fixedly connected to the fastening connecting piece (12), the inner side of the fastening connecting piece (12) is rotatably connected to the suction cup fixing plate (11), the inner wall of the suction cup fixing plate (11) is fixedly connected to the label picking suction cup (8), and the lower end of the mechanism fixing plate (10) is fixedly connected to the vision positioning camera (7).

6. The automatic labeler for semiconductor packaging boxes according to claim 1, characterized in that: The lower end of the second bracket (23) is fixedly connected to the base (1) through a second bolt (24), the upper end of the second bracket (23) is fixedly connected to the paper box placing plate (20), and the front end of the paper box placing plate (20) is fixedly connected to the paper box baffle (21).

7. The automatic labeler for semiconductor packaging boxes according to claim 1, characterized in that: The lower end of the cylinder fixing piece (17) is fixedly connected to the base (1) through a third bolt (25), the upper end of the cylinder fixing piece (i7) is fixedly connected to the clamping cylinder (18), and the telescopic end of the clamping cylinder (18) is fixedly connected to the clamping push plate (19).

8. A method for automatically labeling a semiconductor packaging box, based on the semiconductor packaging box automatic labeling machine according to any one of claims 1-7, characterized in that, Including the following steps: S1. Install the packaging box on the paper box placing plate (20); S2. Start the clamping cylinder (18) to make the clamping push plate (19) move forward to clamp and fix the packaging box; S3. Rotate the handling robot (5) fixed on the first mounting frame (2) to use the label picking suction cup (8) to pick up the label on the coil; S4. Move the picked-up label to the position where labeling is required through the vision positioning camera (7), and make the label stick to the corresponding position of the paper box through the movement of the handling robot (5); S5. During the labeling process, the label fixing cylinder (13) drives the label roller (14) at the lower end to move downward and contact the label on the carton, and the label is fixed by pressure.

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