Packaging tube

Abstract

The purpose of the present invention is to provide a packaging tube capable of suppressing a decrease in conductivity even when repeatedly used, and capable of reducing static electricity generated in a semiconductor device due to friction. A packaging tube (100) is provided with a hollow member (1) and a holding part (3). The hollow member (1) extends in the longitudinal direction and is capable of housing the semiconductor device (2) such that the short-side direction orthogonal to the longitudinal direction is parallel to the width direction of the semiconductor device (2). The holding section (3) is provided inside the hollow member (1) and holds the semiconductor device (2). The holding part (3) is made of metal.

Description

Technical Field

[0001] The present disclosure relates to a packaging tube. Background Art

[0002] For example, Patent Document 1 discloses a structure in which an IC storage tube capable of storing an IC (equivalent to a semiconductor device) inside uses a conductive plastic for a portion that becomes a contact surface with the IC. Prior Art Documents Patent Documents

[0003] Patent Document 1: Japanese Patent Laid-Open No. 4-18283 Summary of the Invention Technical Problem to be Solved by the Invention

[0004] In the technology described in Patent Document 1, since a conductive plastic is used for a portion that becomes a contact surface with the IC, there is a possibility that the conductive plastic may be worn due to repeated use of the IC storage tube, resulting in a decrease in the conductivity of the contact surface with the IC. When the conductivity of the contact surface in the IC storage tube decreases, the static electricity generated in the IC due to the friction between the IC and the contact surface cannot be reduced.

[0005] Therefore, an object of the present disclosure is to provide a packaging tube that can suppress a decrease in conductivity even when repeatedly used and can reduce static electricity generated in a semiconductor device due to friction. Technical Means for Solving the Technical Problem

[0006] The packaging tube according to the present disclosure includes: a hollow member that extends in the longitudinal direction and can store the semiconductor device in such a manner that the short side direction orthogonal to the longitudinal direction is parallel to the width direction of the semiconductor device; and a holding portion that is provided inside the hollow member and holds the semiconductor device, and the holding portion is made of metal. Advantageous Effects of the Invention

[0007] According to the present disclosure, since the metal constituting the holding portion does not reduce its conductivity due to external factors, even when the packaging tube is repeatedly used, a decrease in the conductivity of the holding portion can be suppressed. Thereby, static electricity generated in the semiconductor device due to the friction between the holding portion and the semiconductor device can be reduced. Brief Description of the Drawings

[0008] Figure 1 It is a perspective view showing the packaging tube according to Embodiment 1. Figure 2 It is a cross-sectional view showing the packaging tube according to Embodiment 1. Figure 3 It is a cross-sectional view showing the packaging tube according to Modification 1 of Embodiment 1. Figure 4 This is a cross-sectional view of the packaging tube related to Modification Example 2 of Embodiment 1. Figure 5 This is a cross-sectional view showing the state in which the packaging tube related to Embodiment 2 is disposed on the external member. Figure 6 This is a cross-sectional view showing the state in which the packaging tubes related to the modification example of Embodiment 2 are stacked and disposed on the external member. Detailed Embodiments

[0009] <Embodiment 1> Embodiment 1 will be described below with reference to the drawings. Figure 1 This is a perspective view of the packaging tube 100 related to Embodiment 1. Figure 2 This is a cross-sectional view of the packaging tube 100 related to Embodiment 1. Figure 2 This shows the state in which the semiconductor device 2 is packaged in the packaging tube 100.

[0010] In Figure 1 , the X direction, Y direction, and Z direction are orthogonal to each other. The X direction, Y direction, and Z direction shown in the following figures are also orthogonal to each other. Hereinafter, the direction including the X direction and the direction opposite to the X direction, -X direction, is referred to as the "X-axis direction". In addition, hereinafter, the direction including the Y direction and the direction opposite to the Y direction, -Y direction, is referred to as the "Y-axis direction". In addition, hereinafter, the direction including the Z direction and the direction opposite to the Z direction, -Z direction, is referred to as the "Z-axis direction".

[0011] As Figure 1 shown, the packaging tube 100 includes a hollow member 1 and a holding portion 3. The hollow member 1 is made of a transparent conductive plastic and extends in the long side direction (Y-axis direction). As Figure 2 shown, the hollow member 1 is formed in a quadrilateral frame shape in cross-section. Inside the hollow member 1, the semiconductor device 2 can be accommodated in such a manner that the short side direction (X-axis direction) of the hollow member 1 is parallel to the width direction (X-axis direction) of the semiconductor device 2. By accommodating the semiconductor device 2 in the hollow member 1, the semiconductor device 2 is packaged in the packaging tube 100. The semiconductor device 2 is, for example, an IC (Integrated Circuit). In addition, although not shown, inside the hollow member 1, a plurality of semiconductor devices 2 can be accommodated along the long side direction (Y-axis direction) of the hollow member 1. By accommodating a plurality of semiconductor devices 2 along the long side direction (Y-axis direction) of the hollow member 1, the plurality of semiconductor devices 2 are packaged in the packaging tube 100.

[0012] As Figure 1 and Figure 2As shown, a holding portion 3 made of metal is provided inside the hollow member 1. The holding portion 3 holds the semiconductor device 2. The holding portion 3 includes a pair of upper holding portions 3a that are L-shaped in a cross-sectional view and a lower holding portion 3b that is in a flat plate shape. The pair of upper holding portions 3a are respectively provided on the -X side and the X side in the short side direction (X-axis direction) of the upper surface (surface in the Z direction) inside the hollow member 1, and hold the semiconductor device 2 from above (Z direction). The lower holding portion 3b is provided on the lower surface (-Z direction surface) inside the hollow member 1 and holds the semiconductor device 2 from below (-Z direction). Since the contact area of the pair of upper holding portions 3a with the semiconductor device 2 is smaller than the contact area of the lower holding portion 3b with the semiconductor device 2, static electricity generated in the semiconductor device 2 due to friction between the pair of upper holding portions 3a and the lower holding portion 3b and the semiconductor device 2 can be reduced compared to the case where the pair of upper holding portions 3a and the lower holding portion 3b have the same structure. In addition, the pair of upper holding portions 3a and the lower holding portion 3b extend in the long side direction (Y-axis direction) of the hollow member 1.

[0013] When the semiconductor device 2 is inserted into the hollow member 1 and in the housed state housed in the hollow member 1, it only contacts the holding portion 3. Specifically, the pair of upper holding portions 3a contact the upper end (end in the Z direction) of the semiconductor device 2, and the lower holding portion 3b contacts the lower end (-Z direction end) of the semiconductor device 2. Since the pair of upper holding portions 3a and the lower holding portion 3b are made of metal, static electricity generated in the semiconductor device 2 due to friction can escape to the outside through the pair of upper holding portions 3a and the lower holding portion 3b.

[0014] As described above, the packaging tube 100 according to Embodiment 1 includes: a hollow member 1 that extends in the long side direction (Y-axis direction) and can house the semiconductor device 2 in such a manner that the short side direction (X-axis direction) orthogonal to the long side direction (Y-axis direction) is parallel to the width direction (X-axis direction) of the semiconductor device 2; and a holding portion 3 that is provided inside the hollow member 1 and holds the semiconductor device 2. The holding portion 3 is made of metal.

[0015] Therefore, since the metal constituting the holding portion 3 does not reduce its conductivity due to external factors, even if the packaging tube 100 is repeatedly used, a decrease in the conductivity of the holding portion 3 can be suppressed. As a result, static electricity generated in the semiconductor device 2 due to friction between the holding portion 3 and the semiconductor device 2 can be reduced.

[0016] In addition, since the hollow member 1 is made of a transparent material, the inside of the hollow member 1 can be visually observed. As a result, the number of packaged semiconductor devices 2 can be easily confirmed.

[0017] In addition, since the holding portion 3 includes an upper holding portion 3a that holds the semiconductor device 2 from above and a lower holding portion 3b that holds the semiconductor device 2 from below, the workability can be improved by reducing the weight of the packaging tube 100. In addition, since the contact area with the semiconductor device 2 is reduced compared to the case where the upper holding portion 3a and the lower holding portion 3b have the same structure, the static electricity generated in the semiconductor device 2 due to the friction between the pair of upper holding portion 3a and the lower holding portion 3b and the semiconductor device 2 can be reduced.

[0018] <Modification Example 1 of Embodiment 1> Next, a modification example of Embodiment 1 will be described. Figure 3 FIG. is a cross-sectional view showing the packaging tube 100A according to Modification Example 1 of Embodiment 1. Figure 4 FIG. is a cross-sectional view showing the packaging tube 100B according to Modification Example 2 of Embodiment 1. Figure 3 and Figure 4 shows a state in which the semiconductor device 2 is packaged in the packaging tubes 100A and 100B.

[0019] As Figure 3 shown, in Modification Example 1 of Embodiment 1, the packaging tube 100A includes a holding portion 4 made of metal instead of the holding portion 3. The holding portion 4 includes a pair of upper holding portions 4a that are L-shaped in cross-section and a pair of lower holding portions 4b that are thin plate-shaped. The pair of upper holding portions 4a have the same structure as the pair of upper holding portions 3a. The pair of lower holding portions 4b are respectively provided on the -X side and the X side in the short side direction (X-axis direction) of the lower surface (-Z direction surface) of the hollow member 1, and hold the semiconductor device 2 from below (-Z direction).

[0020] As described above, in the packaging tube 100A according to Modification Example 1 of Embodiment 1, since the holding portion 4 includes a pair of upper holding portions 4a and a pair of lower holding portions 4b, the workability can be improved by reducing the weight of the packaging tube 100. In addition, since the contact area with the semiconductor device 2 is reduced compared to the case of Embodiment 1, the static electricity generated in the semiconductor device 2 due to the friction between the pair of upper holding portions 4a and the pair of lower holding portions 4b and the semiconductor device 2 can be reduced.

[0021] In addition, by dividing the lower holding portion into two parts, in addition to the upper surface (Z-direction surface) and the side surfaces (X-axis direction surface and Y-axis direction surface) of the hollow member 1, the semiconductor device 2 can also be confirmed from the lower surface (-Z direction surface).

[0022] Next, a modification example of Embodiment 1 will be described. As Figure 4As shown, in Modification 2 of Embodiment 1, the packaging tube 100B includes a holding portion 6 made of metal instead of the holding portion 3. The holding portion 6 includes a pair of upper holding portions 6a that are T-shaped in cross-section and a pair of lower holding portions 6b that are T-shaped in cross-section. The pair of upper holding portions 6a and the pair of lower holding portions 6b have the same structure. In addition, on the upper surface (the surface in the Z direction) and the lower surface (the surface in the -Z direction) inside the hollow member 1, a plurality of pairs of grooves 5a, 5b corresponding to the widths of various semiconductor devices 2 are provided. In Figure 4 this case, three pairs of grooves 5a, 5b are provided respectively, but two pairs or four or more pairs may be provided.

[0023] A pair of upper holding portions 6a is the same as the width of the semiconductor device 2 and is alternatively fixed to one pair of the plurality of pairs of grooves 5a. In addition, a pair of lower holding portions 6b is also the same as the width of the semiconductor device 2 and is alternatively fixed to one pair of the plurality of pairs of grooves 5b. The fixing of the upper holding portion 6a and the groove 5a, and the fixing of the lower holding portion 6b and the groove 5b are performed by fitting.

[0024] As described above, in the packaging tube 100B according to Modification 2 of Embodiment 1, on the upper surface (the surface in the Z direction) and the lower surface (the surface in the -Z direction) inside the hollow member 1, a plurality of pairs of grooves 5a, 5b corresponding to the widths of various semiconductor devices 2 are provided, and a pair of upper holding portions 6a and a pair of lower holding portions 6b are alternatively fixed to one pair of the plurality of pairs of grooves 5a, 5b.

[0025] Therefore, with one type of hollow member 1 and one type of holding portion 6, various semiconductor devices 2 can be packaged.

[0026] <Embodiment 2> Next, the packaging tube 100C according to Embodiment 2 will be described. Figure 5 It is a cross-sectional view showing the state where the packaging tube 100C according to Embodiment 2 is disposed on the external member 9. Figure 5 It shows the state where the semiconductor device 2 is packaged in the packaging tube 100C. In Embodiment 2, the same reference numerals are given to the structural elements having the same structure as those described in Embodiment 1, and the description thereof is omitted.

[0027] As Figure 5 shown, in Embodiment 2, the packaging tube 100C further includes a pair of stop bolts 7 with respect to the structure of Embodiment 1. Instead of the structure of Embodiment 1, a pair of stop bolts 7 may be further included with respect to the structure of Modification 1 or Modification 2 of Embodiment 1.

[0028] A pair of stoppers 7 are respectively arranged at both ends of the hollow member 1 in the longitudinal direction (Y-axis direction). Specifically, by inserting the protruding portions 7a of the pair of stoppers 7 into the hollow member 1, the pair of stoppers 7 are fixed to the hollow member 1 in a state of contacting the holding portion 3. The pair of stoppers 7 are made of metal, for example, and thus have conductivity.

[0029] The packaging tube 100C fixed with the pair of stoppers 7 is arranged on the metal external member 9. The lower surfaces (-Z direction surfaces) of the packaging tube 100C and the pair of stoppers 7 are in contact with the bottom plate 9a of the external member 9. The external member 9 is a container and is grounded, for example.

[0030] As described above, the packaging tube 100C according to the second embodiment further includes stoppers 7 which are arranged at both ends of the hollow member 1 in the longitudinal direction (Y-axis direction) and are in contact with the holding portion 3.

[0031] Therefore, the static electricity accumulated in the semiconductor device 2 can escape to the outside through the holding portion 3 and the stoppers 7. As a result, the charging of the semiconductor device 2 and the packaging tube 100C can be suppressed.

[0032] <Modification Example of the Second Embodiment> Next, a modification example of the second embodiment will be described. Figure 6 FIG. is a cross-sectional view showing a state where the packaging tubes 100D according to the modification example of the second embodiment are stacked on the external member 9. Figure 6 FIG. shows a state where the semiconductor device 2 is packaged in the packaging tube 100D.

[0033] As Figure 6 shown, in the modification example of the second embodiment, the packaging tube 100D further includes a pair of stoppers ⑧ with respect to the structure of the first embodiment. Instead of the structure of the first embodiment, a pair of stoppers 8 may also be included with respect to the first modification example or the second modification example of the first embodiment.

[0034] A pair of stoppers 8 are respectively arranged at both ends of the hollow member 1 in the longitudinal direction (Y-axis direction). Specifically, by inserting the protruding portions 8a of the pair of stoppers 8 into the hollow member 1, the pair of stoppers 8 are fixed to the hollow member 1 in a state of contacting the holding portion 3. The pair of stoppers 8 are made of metal, for example, and thus have conductivity.

[0035] A packaging tube 100D fixed with a pair of stoppers 8 is disposed on a metal outer member 9. The lower surfaces (-Z direction surfaces) of the packaging tube 100D and the pair of stoppers 8 are in contact with the bottom plate 9a of the outer member 9. The upper end portions (Z direction end portions) 8b of the pair of stoppers 8 are formed in a convex shape, and the lower end portions (-Z direction end portions) 8c of the pair of stoppers 8 are formed in a concave shape that can be fitted with the convex shape. With this structure, a plurality of packaging tubes 100D can be stacked in the vertical direction (Z-axis direction). In Figure 6 two packaging tubes 100D are stacked, but three or more can also be stacked.

[0036] As described above, in the packaging tube 100D according to the modification of Embodiment 2, the upper end portion 8b of the stopper 8 is formed in a convex shape, and the lower end portion 8c of the stopper 8 is formed in a concave shape that can be fitted with the convex shape. Alternatively, although not shown, the upper end portion 8b of the stopper 8 may be formed in a concave shape, and the lower end portion 8c of the stopper 8 may be formed in a convex shape that can be fitted with the concave shape.

[0037] Therefore, when the packaging tubes 100D are stacked in the vertical direction (Z-axis direction), contact between the upper and lower stoppers 8 can be maintained. The upper and lower stoppers 8 are always in contact, and the lowermost stopper 8 is in contact with the outer member 9, whereby all the packaging tubes 100D are electrically connected. Thereby, static electricity generated in all the packaging tubes 100D can be escaped to the outside.

[0038] Each embodiment can be freely combined, or each embodiment can be appropriately deformed or omitted.

[0039] Hereinafter, each aspect of the present disclosure will be summarized and described as appendices.

[0040] (Appendix 1) A packaging tube, comprising: a hollow member that extends in a long side direction and can accommodate the semiconductor device in such a manner that a short side direction orthogonal to the long side direction is parallel to a width direction of the semiconductor device; and a holding portion that is provided inside the hollow member and holds the semiconductor device, and the holding portion is made of metal.

[0041] (Appendix 2) The packaging tube according to Appendix 1, wherein the hollow member is made of a transparent material.

[0042] (Appendix 3) The packaging tube according to Appendix 1 or 2, wherein the holding portion includes an upper holding portion that holds the semiconductor device from above and a lower holding portion that holds the semiconductor device from below.

[0043] (Appendix 4) The packaging tube according to Appendix 3, The holding part includes a pair of the upper holding parts and a pair of the lower holding parts.

[0044] (Supplementary Note 5) The packaging tube as described in Supplementary Note 4, On the upper surface and the lower surface within the hollow member, a plurality of pairs of grooves corresponding to the widths of the various semiconductor devices are provided. One of the pair of the upper holding parts and the pair of the lower holding parts is fixedly attached to one of the plurality of pairs of grooves.

[0045] (Supplementary Note 6) The packaging tube as described in any one of Supplementary Notes 1 to 5, Further includes a stopper, and the stopper is disposed at both end portions in the longitudinal direction of the hollow member and contacts the holding part.

[0046] (Supplementary Note 7) The packaging tube as described in Supplementary Note 6, The upper end portion of the stopper is formed in a convex shape, and the lower end portion of the stopper is formed in a concave shape capable of fitting with the convex shape.

[0047] (Supplementary Note 8) The packaging tube as described in Supplementary Note 6, The upper end portion of the stopper is formed in a concave shape, and the lower end portion of the stopper is formed in a convex shape capable of fitting with the concave shape. Reference Numeral Explanation

[0048] 1 Hollow member, 2 Semiconductor device, 3 Holding part, 3a Upper holding part, 3b Lower holding part, 4 Holding part, 4a Upper holding part, 4b Lower holding part, 5a, 5b Groove, 6 Holding part, 6a Upper holding part, 6b Lower holding part, 7, 8 Stopper, 100, 100A, 100B, 100C, 100D Packaging tube.

Claims

1. A packaging tube, characterized in that, Comprising: A hollow member that extends in the long side direction and is capable of accommodating the semiconductor device in such a manner that the short side direction orthogonal to the long side direction is parallel to the width direction of the semiconductor device; And A holding portion that is provided inside the hollow member and holds the semiconductor device, and the holding portion is made of metal.

2. The packaging tube according to claim 1, wherein The hollow member is made of a transparent material.

3. The packaging tube according to claim 1 or 2, wherein The holding portion includes: An upper holding portion that holds the semiconductor device from above; and A lower holding portion that holds the semiconductor device from below.

4. The packaging tube according to claim 3, wherein The holding portion includes a pair of the upper holding portions and a pair of the lower holding portions.

5. The packaging tube according to claim 4, wherein On the upper surface and the lower surface inside the hollow member, a plurality of pairs of grooves corresponding to the widths of various semiconductor devices are provided, One of the pair of upper holding portions and one of the pair of lower holding portions are selectively fixed to one of the plurality of pairs of grooves.

6. The packaging tube according to any one of claims 1 to 5, wherein It further includes a stop bolt that is disposed at both end portions in the long side direction of the hollow member and contacts the holding portion.

7. The packaging tube according to claim 6, wherein The upper end portion of the stop bolt is formed in a convex shape, and the lower end portion of the stop bolt is formed in a concave shape capable of fitting with the convex shape.

8. The packaging tube according to claim 6, wherein The upper end portion of the stop bolt is formed in a concave shape, and the lower end portion of the stop bolt is formed in a convex shape capable of fitting with the concave shape.

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