Easily-maintained connection structure for semiconductor loading chamber

Abstract

The invention provides an easy-to-maintain connection structure for a semiconductor loading chamber, and the structure comprises a pair of supporting columns which are oppositely disposed, and a bearing region is formed between the supporting columns; the side faces, facing the bearing area, of the supporting columns are combined with the multiple bearing discs through mortise and tenon joint structures. The carrying discs are arranged in a layered mode in the height direction of the supporting columns and extend out of the corresponding supporting columns. The upper surfaces of the two carrying discs on each layer are flush so as to carry the same wafer. According to the invention, the processing workload of the damaged carrying disc is reduced, and the position of the replaced carrying disc is ensured not to change.

Description

Technical Field

[0001] The present invention belongs to the technical field of vacuum transfer equipment, and particularly relates to an easily maintainable connection structure for a semiconductor loading chamber. Background Art

[0002] In current high-temperature plasma ashing equipment, there is a loading chamber Loadlock with a vacuum environment. The support pillars Loadlock pillar and the carrier plates carrier plate inside are connected by screws and setscrews. Moreover, the two carrier plates on each layer need to ensure horizontal and vertical consistency, which is difficult to adjust. Engineers need to spend a lot of work to adjust the carrier plates, and there are human errors. In addition, during the hardware debugging stage of the equipment, there is a small probability of human error causing damage to the carrier plates made of ceramic materials. As a result, it takes at least 1 - 2 hours to replace and adjust the carrier plates after replacement. Summary of the Invention

[0003] The purpose of the present invention is to provide an easily maintainable connection structure for a semiconductor loading chamber, which reduces the workload of dealing with damaged carrier plates and ensures that the position of the carrier plates does not change after replacement. The technical solution adopted is as follows: An easily maintainable connection structure for a semiconductor loading chamber, comprising: A pair of support pillars 1, which are oppositely arranged and form a bearing area therebetween; on the side surfaces of the support pillars 1 facing the bearing area, several carrier plates 2 are combined through a mortise and tenon structure. The carrier plates 2 are arranged in layers along the height direction of the support pillars 1 and extend out of the corresponding support pillars 1; the upper surfaces of the two carrier plates 2 on each layer are flush to carry the same wafer.

[0004] Preferably, the carrier plates 2 are tenon members, and the support pillars 1 are mortise members.

[0005] Preferably, the surface of the carrier plates 2 is provided with a hard anodizing or DLC coating.

[0006] Preferably, on the side surface of the support pillar 1 facing the bearing area, several L-shaped bearing cavities 11 are opened, and the bearing cavities cooperate with the corresponding carrier plates 2 to form the mortise and tenon structure.

[0007] Preferably, the bearing cavity 11 includes a horizontal cavity 110 and a vertical cavity 111 communicating with the horizontal cavity 110; One end of the horizontal cavity 110 communicates with the bearing area, and the other end is closed; The vertical cavity 111 extends upward from the upper end surface of the horizontal cavity 110.

[0008] Preferably, the length of the horizontal cavity 110 is 20 mm, the sum of the heights of the vertical cavity 111 and the horizontal cavity 110 is 20 mm, and the length of the vertical cavity 111 is 10 mm.

[0009] Preferably, the length of the horizontal section 21 of the carrier plate 2 is 40 mm.

[0010] Preferably, the horizontal distance between a pair of support columns 1 is greater than the diameter of the wafer.

[0011] Preferably, the surface roughness Ra of the carrier plate 2 is ≤ 0.8 um.

[0012] Compared with the prior art, the advantages of the present invention are as follows: The support column and the carrier plate are connected by mortise and tenon joints, which can reduce manual errors and reduce the workload of dealing with damaged carrier plates. Description of the Drawings

[0013] Figure 1 It is a structural diagram of an easy-to-maintain connection structure for a loading chamber; Figure 2 It is a partial exploded view of an easy-to-maintain connection structure for a loading chamber; Figure 3 It is a structural diagram of a bearing chamber; Figure 4 It is a structural diagram of a carrier plate.

[0014] Among them, 1 - support column, 11 - bearing chamber, 110 - horizontal chamber, 111 - vertical chamber; 2 - carrier plate, 21 - horizontal section, 22 - vertical section. Detailed Embodiment

[0015] The easy-to-maintain connection structure for a semiconductor loading chamber of the present invention will be described in more detail below with reference to the schematic diagrams, in which the preferred embodiments of the present invention are shown. It should be understood that those skilled in the art can modify the present invention described herein while still achieving the advantageous effects of the present invention. Therefore, the following description should be understood as broad guidance for those skilled in the art and not as a limitation to the present invention.

[0016] As Figures 1 to 4 , an easy-to-maintain connection structure for a semiconductor loading chamber, comprising: A pair of support columns 1, which are oppositely arranged and form a bearing area therebetween; the support columns 1 (made of metal material), and the sides thereof facing the bearing area are each combined with a plurality of carrier plates 2 through mortise and tenon structures; The horizontal distance between a pair of support columns 1 is adjustable to accommodate wafers of 2 sizes.

[0017] Carrier plates 2, arranged in layers along the height direction of the support columns 1 and extending out of the corresponding support columns 1; for two carrier plates 2 in each layer, their upper surfaces are flush to carry the same wafer.

[0018] Taking 2 carrier plates 2 in the same layer as an example: From the prior art: Since the flatness of both the wafer and the carrier 2 is very high, it is easy to generate a vacuum adsorption phenomenon at the contact surface between the two. That is, each wafer is adsorbed on the corresponding carrier.

[0019] If the upper surfaces of the two carriers are not flush (there is a height difference), the wafer will be broken when the transfer manipulator lifts the wafer from the carrier.

[0020] Among them, the support column 1 is a mortise part, and the carrier 2 is a tenon part.

[0021] On the side of the support column 1 facing the bearing area, a number of L-shaped bearing cavities 11 are opened, and the bearing cavities cooperate with the corresponding carrier 2 to form a mortise and tenon structure.

[0022] The bearing cavity 11 includes a horizontal cavity 110 and a vertical cavity 111 communicating with the horizontal cavity 110; One end of the horizontal cavity 110 communicates with the bearing area, and the other end is closed; The vertical cavity 111 extends upward from the upper end surface of the horizontal cavity 110.

[0023] As Figure 1 shown, the vertical cavity 111 is located above the horizontal cavity 110, and the function is: as Figure 1 the rotating arrow in, to prevent the carrier 2 from rotating.

[0024] The length of the horizontal cavity 110 is 20 mm, the sum of the heights of the vertical cavity 111 and the horizontal cavity 110 is 20 mm, and the length of the vertical cavity 111 is 10 mm.

[0025] The length of the horizontal section 21 of the carrier 2 is 40 mm. The horizontal section 21 and the vertical section 22 are integrally formed.

[0026] The horizontal distance between a pair of support columns 1 is 204 mm, which is suitable for an 8-inch wafer (diameter 200 mm).

[0027] The surface of the carrier 2 is provided with a hard anodizing or DLC coating.

[0028] The surface roughness Ra of the carrier 2 is ≤0.8 um, so it is easy to embed the carrier 2 into the reserved hole position (bearing cavity 11), and the roughness of the grinding process is ≤0.8 um.

[0029] In view of the possible damage of the Carrier plate, in this embodiment, the mortise and tenon connection can ensure that the horizontal and vertical directions are respectively consistent before and after replacement. Without the need for engineers to debug the screws and set screws of each layer of carrier plate, only the ceramic carrier 2 needs to be embedded from the corresponding position reserved by the support column 1, and the corresponding mortise and tenon are set on both the horizontal and vertical surfaces of the L-shaped structure to form a two-way constraint to prevent rotation or deviation.

[0030] Due to the precise fit of mortise and tenon joints, the contact surfaces of mortise and tenon are processed by CNC grinding, with the tolerance controlled within ±5um and the surface roughness of the mating surface Ra≤0.8um.

[0031] The high-frequency disassembly areas (such as the root of the tenon) are treated with hard anodic oxidation (HAO) or DLC coating to improve wear resistance and anti-galling ability.

[0032] The replaced carrier plate can maintain the same position as before replacement, and once installed, it can ensure that the horizontal and vertical accuracies of the new components and the original structure are consistent.

[0033] This connection method of the structure reduces the horizontal or vertical deviation caused by installation errors, reduces the dependence on the debugging level of engineers, and also reduces the debugging time and cost.

[0034] The connection method using mortise and tenon joints can significantly simplify the maintenance and replacement processes of the Loadlock station.

[0035] The above are only the preferred embodiments of the present invention and do not impose any restrictive effects on the present invention. Any person skilled in the art, within the scope of the technical solution of the present invention, makes any form of equivalent replacement or modification and other changes to the disclosed technical solution and technical content of the present invention, all of which belong to the content within the scope of the technical solution of the present invention and still fall within the protection scope of the present invention.

Claims

1. An easily maintainable connection structure for a semiconductor loading chamber, characterized in that, Including: A pair of support columns (1), which are oppositely arranged and form a loading area therebetween; on the sides of the support columns (1) facing the loading area, each is combined with a plurality of carrier plates (2) through a mortise and tenon structure; The carrier plates (2) are arranged in layers along the height direction of the support columns (1) and extend out of the corresponding support columns (1); for the two carrier plates (2) of each layer, their upper surfaces are flush to carry the same wafer.

2. The easy-to-maintain connection structure for a semiconductor loading chamber according to claim 1, characterized in that, The carrier plates (2) are tenon members, and the support columns (1) are mortise members.

3. The easy-to-maintain connection structure for a semiconductor loading chamber according to claim 2, wherein The surface of the carrier plate (2) is provided with a hard anodization or DLC coating.

4. The easy-to-maintain connection structure for a semiconductor loading chamber according to claim 1, wherein, On the side of the support column (1) facing the loading area, a plurality of L-shaped loading cavities (11) are opened thereon, and the loading cavities cooperate with the corresponding carrier plates (2) to form the mortise and tenon structure.

5. The easy-to-maintain connection structure for a semiconductor loading chamber according to claim 4, wherein The loading cavity (11) includes a horizontal cavity (110) and a vertical cavity (111) communicating with the horizontal cavity (110); One end of the horizontal cavity (110) communicates with the loading area, and the other end is closed; The vertical cavity (111) extends upward from the upper end surface of the horizontal cavity (110).

6. The easy-to-maintain connection structure for a semiconductor loading chamber according to claim 5, wherein, The length of the horizontal cavity (110) is 20 mm, the sum of the heights of the vertical cavity (111) and the horizontal cavity (110) is 20 mm, and the length of the vertical cavity (111) is 10 mm.

7. The easy-to-maintain connection structure for a semiconductor loading chamber according to claim 6, wherein, The length of the horizontal section (21) of the carrier plate (2) is 40 mm.

8. The easy-to-maintain connection structure for a semiconductor loading chamber according to claim 7, wherein The horizontal distance between the pair of support columns (1) is greater than the diameter of the wafer.

9. The easy-to-maintain connection structure for a semiconductor loading chamber according to claim 7, wherein, The surface roughness Ra of the carrier plate (2) is ≤ 0.8 μm.

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