Horizontal heat transfer device

Abstract

The invention discloses a horizontal heat transfer device, which comprises a uniform temperature plate, at least one heat pipe and at least one extension part, the uniform temperature plate is provided with a bottom plate and a side plate annularly arranged on the bottom plate, the inner surface of the bottom plate is provided with an evaporation area, and the side plate is provided with at least one notch part; one end part of the heat pipe extends into the vapor chamber from the notch part; one end of the extension part is connected to the end part of the pipe body of the heat pipe extending into the vapor chamber, and the other end of part of the extension part extends into the evaporation area.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and particularly to a horizontal heat transfer device capable of shortening the return water distance. Background Art

[0002] Most heat transfer devices in the existing heat dissipation technology use heat pipes in cooperation with a heat spreader for heat transfer, and use a radiator (such as fins and a fan) for heat dissipation. The heat generated by the heating element is first transferred to the heat spreader, and then the heat spreader transfers the heat to the radiator through the heat pipe for heat dissipation.

[0003] In order to improve the heat dissipation effect, a liquid working medium for cooling is accommodated in the heat pipe. The liquid working medium flows into the evaporation area in the heat spreader through the heat pipe to better reduce the heat generated by the heating element. In the existing technology, only the capillary in the heat pipe and the capillary in the heat spreader are used to connect for return water, but this method results in a relatively long return water distance of the heat pipe, thereby reducing the heat dissipation effect. In other words, the heat dissipation effect has not been fully exerted.

[0004] Therefore, how to improve the heat dissipation effect by shortening the return water distance is a major problem that the inventors of this case are eager to solve. Summary of the Invention

[0005] The present invention aims to provide a horizontal heat transfer device to improve the heat dissipation effect of the horizontal heat transfer device by shortening the return water distance.

[0006] A horizontal heat transfer device of the present invention, wherein, includes:

[0007] A heat spreader having a bottom plate and side plates annularly arranged on the bottom plate. An evaporation area is provided on the inner surface of the bottom plate, and the side plates have at least one notch portion;

[0008] At least one heat pipe, one end of which extends into the heat spreader from the notch portion;

[0009] At least one extension portion, one end of which is connected to the end of the tube body of the heat pipe extending into the heat spreader, and the other end of a part of the extension portion extends into the evaporation area;

[0010] Wherein, the liquid cooling working medium in at least part of the heat pipes flows back to the evaporation area through the extension portion to absorb heat.

[0011] The above horizontal heat transfer device, wherein, further includes: a first capillary structure. The extension portion has a bottom surface and a top surface opposite to the bottom surface. The bottom surface fits the inner surface of the bottom plate, and the first capillary structure is arranged on the top surface.

[0012] The above-mentioned horizontal heat transfer device, further comprising: a second capillary structure disposed on the inner surface of the bottom plate, and the bottom surface is attached to the second capillary structure.

[0013] The above-mentioned horizontal heat transfer device, wherein the first capillary structure is connected to the second capillary structure.

[0014] The above-mentioned horizontal heat transfer device, further comprising: at least one extended heat conduction part disposed in the evaporation area, and the other end of the extended part extends into the evaporation area and is connected to the extended heat conduction part.

[0015] The above-mentioned horizontal heat transfer device, wherein at least one groove is formed on the other end of the extended part, and is connected to at least one of the extended heat conduction parts through the groove.

[0016] The above-mentioned horizontal heat transfer device, wherein the extended part and the heat pipe are of an integral structure.

[0017] The above-mentioned horizontal heat transfer device, wherein the end of the heat pipe extending into the heat dissipation plate cuts off part of the pipe wall to form the extended part.

[0018] The above-mentioned horizontal heat transfer device, wherein the heat dissipation plate further comprises: a top plate; the top plate is installed on the side plate so that the bottom plate, the side plate and the top plate jointly form an airtight chamber, and the evaporation area is located in the airtight chamber.

[0019] The above-mentioned horizontal heat transfer device, further comprising: a third capillary structure disposed on the inner surface of the top plate.

[0020] The above-mentioned horizontal heat transfer device, further comprising: a fourth capillary structure disposed on the third capillary structure and opposite to the evaporation area.

[0021] The above-mentioned horizontal heat transfer device, wherein at least one support structure is provided inside the heat dissipation plate.

[0022] The above-mentioned horizontal heat transfer device, wherein a fifth capillary structure is provided inside the heat pipe, and the first capillary structure connects the fifth capillary structure and the second capillary structure.

[0023] The above-mentioned horizontal heat transfer device, wherein the first capillary structure and the second capillary structure are an integrated capillary structure, or the first capillary structure and the fifth capillary structure are an integrated capillary structure.

[0024] The above-mentioned horizontal heat transfer device, wherein the first capillary structure is a metal capillary.

[0025] The above-mentioned horizontal heat transfer device, wherein the heat pipe is one of a grooved pipe, a composite pipe of a grooved pipe and powder, and a sintered pipe.

[0026] According to the horizontal heat transfer device of the above embodiment, the extension portion extends into the evaporation area, thereby shortening the water return distance between the heat pipe and the vapor chamber, thereby improving the overall heat dissipation efficiency of the horizontal heat transfer device by approximately 20%-30%.

[0027] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 2 is a perspective schematic diagram of a horizontal heat transfer device according to an embodiment of the present invention.

[0029] Figure 2 for Figure 1 Explosion diagram.

[0030] Figure 3 Schematic diagram of the structure of the second shell.

[0031] Figure 4 Schematic diagram of the structure of the extension connection.

[0032] Figure 5 for Figure 4 Enlarged view of the dotted line portion.

[0033] Figure 6 Schematic diagram of the structure of the first embodiment of the heat pipe.

[0034] Figure 7 Schematic diagram of the structure of the second embodiment of the heat pipe.

[0035] Figure 8 Schematic diagram of the structure of the third embodiment of the heat pipe.

[0036] Figure 9 FIG. 4 is a structural diagram of an extension portion connection according to another embodiment of the present invention.

[0037] Figure 10 for Figure 9 Enlarged view of the dotted line portion.

[0038] Wherein, the reference numerals:

[0039] Horizontal heat transfer device: 10;

[0040] Vapor chamber: 11;

[0041] Top plate: 111;

[0042] Base plate: 112;

[0043] Side panels: 113;

[0044] Notch portion: G;

[0045] Airtight chamber: S;

[0046] Evaporation region: S1;

[0047] Heat pipe: 12;

[0048] Pipe body: 121;

[0049] Fifth capillary structure: 122;

[0050] Sixth capillary structure: 123;

[0051] End portion: H;

[0052] Extension portion: 13;

[0053] [[ID=2,7]]One end: 131;

[0054] The other end: 132;

[0055] Groove: C1;

[0056] Bottom surface: 133;

[0057] Top surface: 134;

[0058] First capillary structure: 14;

[0059] Second capillary structure: 15;

[0060] Extended heat conduction portion: 16;

[0061] Outer surface: 161;

[0062] Gap: h;

[0063] Support structure: 17;

[0064] Third capillary structure: 18;

[0065] Fourth capillary structure: 19; Specific implementation mode

[0066] Please refer to Figures 1 to 3 . Figure 1 It is a three-dimensional schematic diagram of the horizontal heat transfer device according to the embodiment of the present invention. Figure 2 It is Figure 1 explosion schematic diagram of Figure 3 It is a structural schematic diagram of the second housing. As Figures 1 to 3As shown in the figure, a horizontal heat transfer device 10 of the present invention includes a heat pipe 12 and at least one extension 13, wherein the heat pipe 12 has a top plate 111, a bottom plate 112 and a side plate 113 provided on the bottom plate 112, and the top plate is fastened to the side plate 113 to form an airtight chamber S by the bottom plate 112, the side plate 113 and the top plate 111. An evaporation region S1 is provided on the inner surface of the bottom plate 112, and the evaporation region S1 is located in the airtight chamber S. The side plate 113 has at least one notch G; one end 121 of at least one heat pipe 12 extends into the heat pipe 11 from the notch G; one end 131 of the extension 13 is connected to the end H of the tube body 121 of the heat pipe 12 extending into the heat pipe 11, and at least part of the other end 132 of the extension 13 extends into the evaporation region S1.

[0067] In this embodiment, it is a preferred embodiment that the extension 13 and the tube body 121 of the heat pipe 12 are of an integral structure. Specifically, a part of the tube body at the end H of the tube body 121 can be formed by cutting to expose the inner surface of the tube body 121 as the extension 13. The other end 132 of the extension 13 extends into the evaporation region S1, that is, a part of the tube wall at the end H of the heat pipe 12 extending into the heat pipe 11 is cut off to form the extension 13. On the side of the open end of the heat pipe 12, a certain part of the tube wall in the airtight chamber S is cut off as the extension 13, and the extension 13 is used as a vapor channel.

[0068] In another embodiment of the present invention, the extension 13 and the tube body 121 of the heat pipe 12 can also be of a split structure, and one end 131 of the extension 13 can be connected to the end H of the tube body 121 by a welding process.

[0069] Thus, the liquid cooling working medium in the heat pipe 12 can quickly flow back to the evaporation region through the extension 13 to absorb heat, thereby shortening the water return distance between the heat pipe 12 and the heat pipe 11, and further improving the heat transfer and heat dissipation effects of the horizontal heat transfer device 10.

[0070] In this embodiment, it is a preferred embodiment that the end H of the heat pipe 12 is in the shape of a flat tube, but the present invention is not limited thereto. In other embodiments, the whole heat pipe 12 can also be in the shape of a flat tube.

[0071] Further, the horizontal heat transfer device 10 further includes a first capillary structure 14 and a second capillary structure 15. The extension portion 13 has a bottom surface 133 and a top surface 134 opposite to the bottom surface 133. The bottom surface 133 is attached to the inner surface of the bottom plate 112. The first capillary structure 14 is disposed on the top surface 134, and the second capillary structure 15 is disposed on the inner surface of the bottom plate 112. The bottom surface 133 is attached to the second capillary structure 15, and the first capillary structure 14 is connected to the second capillary structure 15.

[0072] In addition, in another embodiment of the present invention, the second capillary structure 15 may not be provided on the portion of the inner surface of the bottom plate 112 that is attached to the bottom surface 133, and the inner surface of the bottom plate 112 is directly attached to the bottom surface 133.

[0073] Wherein, in this embodiment, the connection of the first capillary structure 14 to the second capillary structure 15 includes that the first capillary structure 14 contacts the second capillary structure 15, or the first capillary structure 14 and the second capillary structure 15 are connected by a sintering process to form an integrated capillary structure in which the first capillary structure 14 is bonded to the second capillary structure 15 by a metal bond.

[0074] Wherein, the material of the first capillary structure 14 is powder of gold, silver, copper or iron, and the first capillary structure 14 is formed into a porous structure by sintering or other means.

[0075] Wherein, the second capillary structure 15 is, for example, a powder sintered body, but is not limited thereto. In other embodiments, the second capillary structure may also be selected from the group consisting of micro-grooves, metal meshes, powder sintered bodies, and ceramic sintered bodies. For example, the second capillary structure 220a may be a composite of a powder sintered body and a metal mesh.

[0076] Still further, please refer to Figure 4 and Figure 5 , Figure 4 which is a schematic structural diagram of the connection of the extension portion. Figure 5 is Figure 4 an enlarged view of the dashed part in Figure 4 and Figure 5 shown. And please refer to Figures 1 - 3, the horizontal heat transfer device 10 further includes: at least one extended heat conduction part 16 and at least one support structure 17; the extended heat conduction part 16 is arranged in the evaporation area S1, and the other end 132 of the extension part 13 extends into the evaporation area S1 and is connected to the extended heat conduction part 16. Specifically, in this embodiment, at least one groove C1 is formed on the other end 132 of the extension part 13, and is connected to at least one of the extended heat conduction parts 16 through the groove C1; the support structure 17 protrudes from the inner surface of the bottom plate 112, and between the bottom plate 112 and the top plate 111 through the support structure 17, so as to prevent the heat pipe 1 from deforming during vacuum pumping.

[0077] Among them, there are a plurality of through holes for the extended heat conduction part 16 and the support structure 17 to pass through. The support structure 17 passes through these through holes and supports the top plate 111, so as to prevent the heat pipe 10 from deforming during vacuum pumping.

[0078] It should be noted that the preferred embodiment of the present invention is that the extension part 13 is connected to the extended heat conduction part 16 through the groove C1, but the present invention is not limited thereto. In other embodiments, the extension part 13 can also be connected to the extended heat conduction part 16 by gluing or welding.

[0079] Furthermore, the horizontal heat transfer device 10 further includes: a third capillary structure 18 and a fourth capillary structure 19; the third capillary structure 18 is arranged on the inner surface of the top plate 111, and the fourth capillary structure 19 is arranged on the third capillary structure 18 and is located opposite to the evaporation area S1.

[0080] Among them, the third capillary structure 18 is, for example, a ceramic sintered body, but is not limited thereto. In other embodiments, the third capillary structure 18 can also be selected from the group consisting of micro-grooves, metal meshes, powder sintered bodies and ceramic sintered bodies. For example, the third capillary structure 18 can be a composite body of a ceramic powder sintered body and micro-grooves.

[0081] Furthermore, a fifth capillary structure 122 is arranged in the heat pipe 12, and the first capillary structure 14 connects the fifth capillary structure 122 and the second capillary structure 15.

[0082] Among them, in this embodiment, the connection of the first capillary structure 14 to the fifth capillary structure 122 includes that the first capillary structure 14 contacts the fifth capillary structure 122, or the first capillary structure 14 and the fifth capillary structure 122 form an integral capillary structure through a sintering process.

[0083] Please refer to Figure 6 , Figure 6 is a schematic structural diagram of the first embodiment of the heat pipe. As Figure 6As shown, the heat pipe is a grooved pipe, and a plurality of grooved fifth capillary structures 122 are formed at intervals on the inner surface of the heat pipe.

[0084] Please refer to Figure 7 , Figure 7 which is a schematic structural diagram of the second embodiment of the heat pipe. As Figure 7 shown, the heat pipe is a grooved pipe and a powder composite pipe, and the sixth capillary structure 123 of the powder sintered body is filled on the inner surface of the grooved fifth capillary structure 122.

[0085] Please refer to Figure 8 , Figure 8 which is a schematic structural diagram of the third embodiment of the heat pipe. As Figure 8 shown, the heat pipe is a sintered pipe, and a fifth capillary structure 122 is arranged in the heat pipe, and the fifth capillary structure 122 is planar.

[0086] Please refer to Figures 9 - 10 , Figure 9 which is a schematic structural diagram of the connection of the extension part according to another embodiment of the present invention. Figure 10 is Figure 9 an enlarged view of the dashed part in Figure 9 The horizontal heat transfer device shown is substantially the same as the horizontal heat transfer device shown in Figure 4 , so the same parts will not be described in detail here. Now, the different parts will be described as follows. In this embodiment, the other end 132 of the extension part 13 extends into the evaporation area S2 and there is a gap h between it and the extension heat conduction part 16. The horizontal heat transfer device further includes a seventh capillary structure. One side of the seventh capillary structure is stacked on the first capillary structure 14 located on the top surface 134. The extension heat conduction part 16 has outer surfaces 161 with different orientations. The other side of the seventh capillary structure can be selectively connected to at least one oriented outer surface 161, and the seventh capillary structure is also connected to the second capillary structure 15.

[0087] It should be noted that in the present invention, the setting of the evaporation area is determined according to the size of the heat source. When the size of the heat source is small, the corresponding evaporation area can be the area where only the extension heat conduction part 16 is provided, that is, the evaporation area S1 in Figure 4 , that is, the size of the heat source is less than or equal to the evaporation area S1. When the size of the heat source is large, the corresponding evaporation area can be the area where only the inner surface of the bottom plate 112 is provided, that is, the evaporation area S2 in Figure 9 , and the size of the heat source is greater than the evaporation area S1.

[0088] According to the horizontal heat transfer device of the above embodiment, since the extension part is provided, the heat pipe can extend to the evaporation area, thereby shortening the return water distance between the heat pipe and the heat spreader, and thus improving the overall heat dissipation efficiency of the horizontal heat transfer device by about 20%-30%.

[0089] Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the relevant art, without departing from the spirit and scope of the present invention, may make some modifications and refinements. Therefore, the protection scope of the present invention shall be determined by the protection scope defined by the appended claims of this application.

Claims

1. A horizontal heat transfer device, characterized in that, Comprising: A heat pipe, having a bottom plate and side plates disposed around the bottom plate, an evaporation area is provided on the inner surface of the bottom plate, and the side plates have at least one notch portion; At least one heat pipe, one end of which extends into the heat pipe from the notch portion; At least one extension portion, one end of which is connected to the end of the pipe body of the heat pipe extending into the heat pipe, and the other end of a part of the extension portion extends into the evaporation area; Wherein, the liquid cooling working medium in at least part of the heat pipes returns to the evaporation area through the extension portion to absorb heat.

2. The horizontal heat transfer device according to claim 1, characterized in that, Further comprising: A first capillary structure, the extension portion has a bottom surface and a top surface opposite to the bottom surface, the bottom surface is attached to the inner surface of the bottom plate, and the first capillary structure is disposed on the top surface.

3. The horizontal heat transfer device according to claim 2, characterized in that, Further comprising: A second capillary structure, disposed on the inner surface of the bottom plate, and the bottom surface is attached to the second capillary structure.

4. The horizontal heat transfer device according to claim 3, characterized in that, The first capillary structure is connected to the second capillary structure.

5. The horizontal heat transfer device according to claim 1, wherein Further comprising: At least one extended heat conduction portion, disposed in the evaporation area, and the other end of the extension portion extends into the evaporation area and is connected to the extended heat conduction portion.

6. The horizontal heat transfer device according to claim 5, wherein, At least one groove is formed on the other end of the extension portion, and is connected to at least one of the extended heat conduction portions through the groove.

7. The horizontal heat transfer device according to claim 1, wherein, The extension portion and the heat pipe are of an integral structure.

8. The horizontal heat transfer device according to claim 7, characterized in that, The end of the heat pipe extending into the heat pipe cuts off a part of the pipe wall to form the extension portion.

9. The horizontal heat transfer device according to claim 1, characterized in that, The heat pipe further comprises: a top plate; the top plate is installed on the side plates, so that the bottom plate, the side plates and the top plate jointly form an airtight chamber, and the evaporation area is located in the airtight chamber.

10. The horizontal heat transfer device according to claim 9, characterized in that, Further comprising: A third capillary structure, disposed on the inner surface of the top plate.

11. The horizontal heat transfer device according to claim 10, characterized in that, Further comprising: A fourth capillary structure, disposed on the third capillary structure and opposite to the evaporation area.

12. The horizontal heat transfer device according to claim 1, wherein, At least one support structure is disposed in the heat pipe.

13. The horizontal heat transfer device according to claim 4, characterized in that, A fifth capillary structure is provided in the heat pipe, and the first capillary structure connects the fifth capillary structure and the second capillary structure.

14. The horizontal heat transfer device according to claim 13, characterized in that, The first capillary structure and the second capillary structure are an integrated capillary structure, or, the first capillary structure and the fifth capillary structure are an integrated capillary structure.

15. The horizontal heat transfer device according to claim 2, wherein, The first capillary structure is a metal capillary.

16. The horizontal heat transfer device according to claim 1, characterized in that, The heat pipe is one of a grooved pipe, a composite pipe of grooved pipe and powder, and a sintered pipe.

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