Electrical cabinet temperature measurement system, method and device, electronic equipment and readable storage medium

Abstract

The invention discloses an electrical cabinet temperature measurement system, and relates to the technical field of electrical control. The electrical loop is mounted in the electrical cabinet; the plurality of visual units are mounted in the electrical cabinet, and each visual unit has a compound eye visual angle range for receiving the information of the electrical loop; and the thermal imaging infrared thermometer is connected with the plurality of visual units, and is used for collecting the plurality of relative positions and the infrared light sent by the plurality of visual units, and calculating the actual position and the surface temperature of the heating element in the electrical loop based on the infrared light and the relative positions, so that the efficiency and the timeliness of temperature measurement are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electrical control, and particularly relates to an electrical cabinet temperature measurement system, an electrical cabinet temperature measurement method and device, an electronic device, and a computer-readable storage medium. Background Art

[0002] High and low voltage electrical cabinets play a crucial role in the power supply system. Once the temperature of the electrical components in the electrical cabinet is abnormal, it may cause significant economic losses or personal injuries. For the temperature detection of electrical cabinets, generally, temperature measurements are carried out manually or by robots one by one, and the temperature measurement efficiency and timeliness are relatively low.

[0003] The information disclosed in this background art section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as an admission or any form of suggestion that this information constitutes the prior art already known to those of ordinary skill in the art. Summary of the Invention

[0004] The purpose of the present disclosure is to solve the technical problem of low efficiency of existing electrical cabinet temperature measurement, and provides an electrical cabinet temperature measurement system, an electrical cabinet temperature measurement method and device, an electronic device, and a computer-readable storage medium.

[0005] In the first aspect of the present disclosure, an electrical cabinet temperature measurement system is provided. The system includes: an electrical cabinet; an electrical circuit installed in the electrical cabinet; a plurality of vision units installed in the electrical cabinet, each vision unit having a compound eye viewing range for receiving information of the electrical circuit; a thermal imaging infrared thermometer connected to the plurality of vision units, configured to collect a plurality of relative positions and infrared light sent by the plurality of vision units, and calculate the actual position and surface temperature of the heating element in the electrical circuit based on the infrared light and the relative positions.

[0006] In the second aspect of the present disclosure, an electrical cabinet temperature measurement method is provided. The method includes: collecting a plurality of relative positions and infrared light sent by a plurality of vision units in the electrical cabinet; calculating the actual position and surface temperature of the heating element in the electrical circuit based on the infrared light and the relative positions.

[0007] In the third aspect of the present disclosure, an electrical cabinet temperature measurement device is provided. The device includes: a collection unit configured to collect a plurality of relative positions of the electrical circuit and infrared light sent by a plurality of vision units in the electrical cabinet; a calculation unit configured to calculate the actual position and surface temperature of the heating element in the electrical circuit based on the infrared light and the relative positions.

[0008] A fourth aspect of the present disclosure provides an electronic device, which includes: at least one processor; and a memory communicatively connected to the at least one processor, wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the method described in any implementation manner of the second aspect.

[0009] A fifth aspect of the present disclosure provides a non-transitory computer-readable storage medium storing computer instructions for causing a computer to execute the method described in any implementation manner of the second aspect.

[0010] Compared with the prior art, the technical effects achieved by the present disclosure are as follows: The bionic compound eye and infrared sensing technology are used to collect multiple infrared lights and relative positions of the electrical circuits in the electrical cabinet, and the infrared thermal imaging technology is used to calculate the actual positions and surface temperatures of the heating elements in the electrical cabinet, which can effectively measure the surface temperatures of the components at different actual positions and improve the accuracy of temperature measurement; This temperature measurement method belongs to non-contact temperature measurement, without manual participation and without robot patrol, improving the efficiency and timeliness of temperature measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic structural diagram according to an embodiment of the electrical cabinet temperature measurement system of the present disclosure;

[0012] Figure 2 is a flowchart according to an embodiment of the electrical cabinet temperature measurement method of the present disclosure;

[0013] Figure 3 is a schematic diagram for calculating the actual position of the heating element in the present disclosure;

[0014] Figure 4 is a schematic structural diagram according to an embodiment of the electrical cabinet temperature measurement device of the present disclosure;

[0015] Figure 5 is a block diagram of an electronic device for implementing the electrical cabinet temperature measurement method of the embodiment of the present disclosure. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] Unless otherwise explicitly stated, in the entire specification and claims, the term "comprising" or its variations such as "comprises" or "including" will be understood to include the stated elements or components, without excluding other elements or other components.

[0017] The technical solutions of the present invention will be described below through specific embodiments. It should be understood that one or more steps mentioned in the present invention do not exclude the existence of other methods and steps before and after the combined steps, or other methods and steps can be inserted between these clearly mentioned steps. It should also be understood that these examples are only used to illustrate the present invention and not to limit the scope of the present invention. Unless otherwise specified, the numbers of the method steps are only for the purpose of identifying each method step, rather than limiting the arrangement order of each method or limiting the scope of implementation of the present invention. The change or adjustment of their relative relationship can also be regarded as the scope in which the present invention can be implemented under the condition of no substantial change in technical content.

[0018] There are no specific restrictions on the sources of the raw materials and instruments used in the embodiments, and they can be purchased on the market or prepared according to the conventional methods well-known to those skilled in the art.

[0019] Explanation of relevant terms involved in this disclosure:

[0020] Compound eye principle: It is to imitate insects. The principle is that a compound eye composed of several simple eyes receives surrounding images in a fixed place. The horizontal and vertical viewing angle ranges of a single compound eye of an insect can be close to 180 degrees, and an artificial compound eye can achieve a horizontal and vertical viewing angle close to 360 degrees.

[0021] Infrared optical fiber: A relatively special optical fiber that can conduct infrared light (the conduction wavelength is 1 - 12 μm). Generally, the conduction wavelength of single-mode optical fibers on the market is (1310 - 1550 nm), and the conduction wavelength of multi-mode optical fibers is (850 - 1310 nm).

[0022] Thermal imaging infrared temperature measurement: By measuring the infrared radiation amount of the target within its wavelength band range, and then restoring the image by calculation and calculating the surface temperature of the measured target.

[0023] High and low voltage electrical cabinets play a crucial role in the power supply system. Once a failure occurs, it may cause significant economic losses or personal injuries. The failures of electrical components, cables, and busbars in the operating electrical cabinet basically manifest as heat generation. By monitoring its temperature in real time and based on the temperature curve, the failure location of the electrical cabinet can be judged in advance, the failure can be eliminated in time, and losses can be reduced.

[0024] In the traditional technology, the temperature measurement of high and low voltage electrical cabinets mainly adopts the following methods:

[0025] 1) Regular inspection with a handheld infrared temperature detector. Regular inspection with a handheld infrared temperature detector lacks real-time temperature monitoring, and due to the non-fixed distance between the handheld infrared thermometer and the detection target, detection errors will occur.

[0026] 2) By installing wireless temperature sensors on electrical components, cables, and busbars to monitor temperature. However, its disadvantage is that it can only monitor the temperature at the fixed positions where the temperature measurement elements are installed. There are many restrictions as temperature measurement elements cannot be installed at some positions that need to be monitored. Additionally, the wireless signals can be interfered with, resulting in signal loss.

[0027] 3) Install a small glass window on the cabinet door, and install a rail robot with an infrared thermometer in the electrical room to scan the temperature of electrical components, cables, and busbars inside the electrical cabinet through the glass window from outside the cabinet, realizing unmanned regular inspections. However, its disadvantages are as follows: If operating or display elements are installed on the cabinet door of the electrical cabinet, the small glass window cannot be installed; space for the inspection robot's rail needs to be reserved in front of the electrical cabinet. The robot can only perform regular inspections and cannot achieve real-time temperature monitoring.

[0028] In view of the deficiencies in the prior art, the present disclosure provides an electrical cabinet temperature measurement system. By installing a thermal imaging infrared thermometer in the electrical cabinet, effective measurement of the temperature of the electrical circuit can be achieved, improving the efficiency and timeliness of temperature measurement. Figure 1 The structural schematic diagram of an embodiment of the electrical cabinet temperature measurement system is shown. The above electrical cabinet temperature measurement system includes: an electrical cabinet 1, an electrical circuit 2, a thermal imaging infrared thermometer 3, and multiple vision units 4. The electrical circuit 2 is installed in the electrical cabinet 1; the multiple vision units 4 are installed in the electrical cabinet 1, and each vision unit 4 has a compound eye viewing angle range for receiving information of the electrical circuit 2; the thermal imaging infrared thermometer 3 is connected to the multiple vision units, and is used to collect multiple relative positions and infrared light sent by the multiple vision units, and calculate the actual position and surface temperature of the heating elements in the electrical circuit based on the infrared light and relative positions.

[0029] In this embodiment, the electrical cabinet 1 can be a high-voltage or low-voltage electrical cabinet, and the electrical circuit 2 can be a high-voltage or low-voltage circuit composed of at least one electronic component and a transmission sub-unit (such as a busbar, cable). There may be a power supply device for power supply in the electrical circuit, or there may be no power supply device, such as Figure 1 As shown, the electrical circuit 2 includes: a busbar 21, an electronic component 22, and a cable 23. The single electronic component or transmission sub-unit in the electrical circuit may generate heat when current passes through. The electrical circuit within the compound eye viewing angle range is collected by the vision unit 4, and the surface temperature of the heating elements in the electrical circuit is calculated by the thermal imaging infrared thermometer 3.

[0030] In Figure 1In the production process, the busbars 21, electronic components 22, and cables 23 in the electrical cabinet 1 generate heat due to the passing of current. The vision unit 4 collects information within the compound eye viewing range 41, and transmits the collected infrared light and relative position to the thermal imaging infrared thermometer 3, thereby completing the inspection of the electrical cabinet 1. Multiple vision units 4 at different positions can, through computer operation, restore the actual positions of the busbars 21, electronic components 22, and cables 23 in the electrical cabinet 1, and can also correct the monitored temperatures of the elements in the cabinet by the average value of the temperatures monitored by each compound eye, reducing errors, and promptly judging possible faults and their positions by comparing the temperature thresholds of each element.

[0031] In this embodiment, the vision unit 4 can be a unit that combines the multi-aperture sensing characteristics of an insect compound eye and infrared ranging technology. The vision unit achieves wide-angle coverage through a densely arranged infrared sensor unit (such as dozens to hundreds of ommatidia units). Each infrared sensor unit corresponds to an independent optical channel and a photoelectric conversion module. The relative position is the position of the electrical circuit provided by the vision unit. This relative position is the position of the vision unit in its visual space, which is different from the actual position of the electrical circuit in the world coordinate system. The thermal imaging infrared thermometer 3 can calculate the actual position through the relative positions provided by multiple vision units.

[0032] In this embodiment, the thermal imaging infrared thermometer 3 determines the shapes of different objects in the electrical circuit based on the infrared light collected by the vision unit. Based on the shapes, it determines the electronic components or transmission sub-units in the electrical circuit. Based on the relationship between the radiant heat of the infrared light and the surface temperature of the object, it determines the surface temperature of the electronic components or transmission sub-units in the electrical circuit, and regards the electronic components or transmission sub-units with a surface temperature greater than zero as the heating elements. Based on the shapes of the heating elements and in combination with the actual positions of the above-mentioned electrical circuits, it determines the actual positions of the heating elements.

[0033] The electrical cabinet temperature measurement system provided in this embodiment belongs to non-contact temperature measurement compared with the method of installing temperature measurement elements at the temperature monitoring positions. It is not restricted by the installation environment, has a larger temperature measurement range, and the temperature signal conduction is not interfered by electromagnetic waves. It also does not emit electromagnetic waves during the signal transmission process, which is more environmentally friendly. Compared with a handheld infrared thermometer, it belongs to real-time monitoring and non-periodic inspection. The distance between the vision unit and the electrical circuit remains fixed, which can reduce the temperature measurement error and can also perform real-time temperature monitoring. Compared with the method of robot inspection, there are no requirements for the environment where the electrical cabinet is located, no tracks and operating space for the robot are needed, the monitoring range inside the cabinet is also larger, there is no need to drill holes in the electrical cabinet body, and only need to lay the vision unit into the electrical cabinet in the same way as the incoming and outgoing cables of the electrical cabinet, and install the vision unit at a fixed position, truly achieving non-destructive installation of the electrical cabinet and real-time temperature monitoring, rather than periodic inspection.

[0034] The electrical cabinet temperature measurement system provided in this embodiment uses a visual unit based on bionic compound eyes and infrared sensing technology to collect multiple infrared lights and relative positions of electrical circuits in the electrical cabinet, and uses infrared thermal imaging technology to calculate the actual position and surface temperature of heat-generating elements in the electrical cabinet. It can effectively measure the surface temperature of components at different actual positions, thereby improving the accuracy of temperature measurement. This temperature measurement method is non-contact temperature measurement, does not require human participation, and does not require robot inspections, thereby improving the efficiency and timeliness of temperature measurement.

[0035] In some optional implementations of the present disclosure, the above-mentioned visual unit includes: a bionic compound eye unit and an infrared optical fiber; the bionic compound eye unit is installed in an electrical cabinet, and the horizontal and vertical viewing angles of the bionic compound eye unit are the compound eye viewing angles; the infrared optical fiber is connected to the bionic compound eye unit to transmit the relative position of the electrical circuit and infrared light collected by the bionic compound eye unit.

[0036] In this optional implementation, the bionic compound eye unit is highly similar to the neutron eye in the natural compound eye. The bionic compound eye unit (also called ommatidium) has core units such as cornea, crystal cone, and sensory rod bundle. The crystal cone is located below the cornea, and the cornea can be simulated by transparent polymer. The crystal cone refracts light through optical materials to form a crystal bundle, which plays a light-collecting role similar to optical fiber, and transmits the image to the sensory rod bundle. The sensory rod bundle is located in the third layer of the ommatidium, immediately below the cornea and crystal cone structure. Photoelectric sensors can be used to simulate the sensory rod bundle, thereby realizing photoelectric conduction and signal integration.

[0037] In this optional implementation, bionic compound eye units independently receive light and transmit signals, and multiple bionic compound eye units contribute to the overall visual capability of the compound eye. To generate these multiple visual units, the compound eye base can be fabricated using surface projection microstereolithography 3D printing technology. Microfluidics manipulation technology is then used to create a high density of ommatidia and light guides on the compound eye's surface and within its interior.

[0038] In this optional implementation, the biomimetic compound eye unit is connected to an infrared optical fiber. The crystal cone of the biomimetic compound eye unit focuses incident light onto the rod bundle region through refraction, forming the initial path for the optical signal output. The infrared optical fiber aligns with the structure of the crystal cone or rod bundle to directly capture and couple the focused light signal. In a biomimetic design, the cone's tapered structure may be optimized to interface with the end face of the optical fiber, reducing optical signal loss at the transmission interface.

[0039] Microstructured optical fibers (such as multi-core optical fibers or photonic crystal fibers) are used to match the bionic compound eye unit array. Each small eye corresponds to an independent optical fiber channel, ensuring independent signal transmission. Infrared optical fibers use the principle of total internal reflection to confine light signals within the fiber core for long-distance transmission through a structure with a high refractive index core and a low refractive index cladding.

[0040] The vision unit provided by this alternative implementation mode, where the bionic compound eye unit is connected to the infrared optical fiber, can effectively transmit the relative position of the electrical circuit and infrared light, providing a reliable implementation mode for the realization of the vision unit.

[0041] In some alternative implementation modes of the present disclosure, the above-mentioned vision unit includes: a convex lens and an infrared single-core optical fiber; the convex lens is installed in the electrical cabinet, and the focal length of each convex lens in the convex lens is twice the distance from the convex lens to the electrical circuit; the infrared single-core optical fiber is connected to the convex lens and is used to transmit the relative position of the electrical circuit and infrared light collected by the convex lens.

[0042] In this alternative implementation mode, the coupling of the convex lens and the infrared single-core optical fiber needs to be achieved through precise optical alignment and mechanical adaptation to realize efficient infrared light collection. The specific operation steps of the coupling include: 1) Optical path collimation and parallel adjustment. Fix the convex lens with an adjustable bracket to make the incident infrared light parallel to the optical axis of the lens, and use a white screen concentric circle to assist in aligning the center of the lens. For infrared light, it is necessary to use an infrared observation card or camera to monitor the position of the light spot in real time. 2) Focus position calibration. Adjust the focal length of the lens to make the light beam focus to form the smallest light spot. Place the end face of the optical fiber precisely near the focal plane, and adjust the three-dimensional position of the optical fiber through a micro-displacement stage (accuracy <1μm) to maximize the coupling efficiency. 3) Mechanical connection and fixation. Connect the optical fiber and the lens assembly with an adapter with an FC / PC or SMA interface to ensure that the end face of the optical fiber is coaxial with the center of the lens, and fix the connector through a threaded locking mechanism to prevent offset caused by vibration1.

[0043] In this alternative implementation mode, each convex lens corresponds to an infrared single-core optical fiber. Using the lens imaging principle, through optical fiber conduction, and the method of restoring the image with a thermal imager, the infrared light and relative position of the electrical circuit in the electrical cabinet are collected to detect the surface temperature of the heating elements in the electrical circuit. The imaging range of a single convex lens is large, and the amount of temperature and position data collected by a single lens at the same time is also large.

[0044] The vision unit provided by this alternative implementation mode includes a convex lens and an infrared single-core optical fiber; the convex lens is installed in the electrical cabinet, and the focal length of each convex lens in the convex lens is twice the distance from the convex lens to the electrical circuit; the infrared single-core optical fiber is connected to the convex lens and is used to transmit the relative position of the electrical circuit and infrared light collected by the convex lens, providing a reliable implementation mode for the realization of the vision unit.

[0045] In some alternative implementation modes of the present disclosure, the thermal imaging infrared thermometer is also used to detect whether there is a fault in the heating element through surface temperature during the operation of the electrical circuit, and when a fault occurs in the heating element, it sends a fault message; the system further includes: an alarm unit, electrically connected to the thermal imaging infrared thermometer, for receiving the fault message of the thermal imaging infrared thermometer and sending an alarm message.

[0046] In this optional implementation, the thermal imaging infrared thermometer can be connected to the current sensor of the electrical circuit. When the current detected by the current sensor is greater than zero, it is determined that the electrical circuit is operating. The thermal imaging infrared thermometer records the temperature thresholds of the heating elements (for example, the temperature threshold of the busbar is 80 °C, the temperature threshold of the electronic component is 65 °C, and the temperature threshold of the cable is 60 °C). When the surface temperature of the heating element is greater than this temperature threshold, it is determined that the sending element has a fault, and a fault message is sent. The fault message is used to indicate that the heating element has a fault.

[0047] The present disclosure uses a bionic compound eye and an infrared conduction optical fiber to collect the temperatures of electrical components, busbars, and electrical wires and cables in high- and low-voltage electrical cabinets, determine the fault points of the electrical cabinets, and combine the bionic compound eye and the infrared conduction optical fiber to conduct the position information and temperature information of the heating objects.

[0048] Optionally, the electrical circuit further has a circuit breaker. The thermal imaging infrared thermometer is used to detect in real time whether the circuit breaker is closed. When it is detected that the circuit breaker is closed, it is determined that the electrical circuit is operating.

[0049] In the electrical cabinet temperature measurement system provided by this optional implementation, the thermal imaging infrared thermometer detects whether the heating element is faulty through the surface temperature when the electrical circuit is operating, and when the heating element is faulty, a fault message is sent; and an alarm message is sent through the alarm unit, which can effectively determine the fault and its location of the heating element.

[0050] Optionally, the above-mentioned electrical circuit includes: a busbar, an electrical component, and a cable connected in sequence. The thermal imaging infrared thermometer is also used to collect and analyze the infrared light and relative positions of the busbar, electrical component, and cable through the visual unit when the electrical circuit is operating, calculate the surface temperatures of the busbar, electrical component, and cable based on the infrared light and relative positions of the busbar, electrical component, and cable, and record the changes in the surface temperatures of the busbar, electrical component, and cable in chronological order, so as to determine the temperature change trend of each heating element in the electrical circuit.

[0051] Aiming at the defects in the prior art, the present disclosure provides an electrical cabinet temperature measurement method. Through this method, the temperature of the electrical cabinet can be measured in a non-contact and real-time manner, improving the accuracy and timeliness of the temperature measurement of the electrical cabinet. Figure 2 The flowchart 200 of an embodiment of the electrical cabinet temperature measurement method is shown. The above-mentioned electrical cabinet temperature measurement method includes the following steps:

[0052] Step 201, collect a plurality of relative positions and infrared light sent by a plurality of visual units in the electrical cabinet.

[0053] In this embodiment, the vision unit can be a unit that combines the multi-aperture sensing characteristics of an insect compound eye and infrared ranging technology. The vision unit can achieve wide-angle coverage through a densely arranged infrared sensor unit (such as dozens to hundreds of ommatidium units), and each infrared sensor unit corresponds to an independent optical channel and a photoelectric conversion module.

[0054] In this embodiment, the relative position is the position of the electrical circuit provided by the vision unit. This relative position is the position of the vision unit in its visual space, which is different from the actual position of the electrical circuit in the world coordinate system. The actual position can be calculated through the relative positions provided by multiple vision units.

[0055] In this embodiment, each vision unit is used to collect the relative position and infrared light of the electrical units in the electrical cabinet, that is, a vision unit sends a relative position and infrared light of an electrical circuit in the electrical cabinet. The actual position of the electrical circuit can be determined through the relative positions of multiple vision units.

[0056] Step 202: Calculate the actual position and surface temperature of the heating element in the electrical circuit based on the infrared light and the relative position.

[0057] In this embodiment, the surface temperature of each element in the electrical circuit can be determined through the infrared light of multiple vision units (the shape of the object on the infrared light surface can be used to determine each element). When the surface temperature is greater than zero, the current element is determined as the heating element, and the surface temperature of the heating element is determined. The actual position of the electrical circuit is determined through the relative positions of multiple vision units. The heating element is determined through the shape of the element in the infrared light, and the actual position of the heating element is extracted from the electrical circuit. Specifically, the above-mentioned determination of the actual position of the electrical circuit based on the relative positions of multiple vision units includes: establishing a global coordinate system based on the spatial positions and observation directions of each vision unit, mapping the local data to a unified reference system (such as the world coordinate system of the electrical circuit), and combining the geometric triangulation principle to intersect the observation direction lines of multiple vision units in three-dimensional space to determine the actual coordinates of the electrical circuit. Optionally, the relative pose relationship (such as the rotation matrix and translation vector) between each vision unit can also be calibrated, and the measurement values of all vision units can be unified into the global world coordinate system to obtain the actual position of the electrical circuit.

[0058] The electrical cabinet temperature measurement method provided by the present disclosure collects multiple relative positions and infrared light sent by multiple vision units in the electrical cabinet; calculates the actual position and surface temperature of the heating element in the electrical circuit based on the infrared light and the relative position, and uses the compound eye principle and infrared optical fiber to collect the electrical circuit in the electrical cabinet, which can calculate the actual position and surface temperature of the electrical circuit in real time and without contact, improving the accuracy and timeliness of the temperature measurement of the electrical cabinet.

[0059] Optionally, the above method for measuring the temperature of the electrical cabinet further includes: collecting the surface temperatures of each heating element in the electrical circuit at different time points during the collection period, recording the surface temperatures at different time points in chronological order, plotting the temperature change trends of each heating element in the electrical circuit, and determining the operation-dominant element through the temperature change trends. Among them, the operation-dominant element is the heating element whose temperature change has the greatest impact on other heating elements in the electrical circuit.

[0060] In some alternative implementation manners of the present disclosure, the above calculation of the actual position and surface temperature of the heating element in the electrical circuit based on infrared light and relative position includes: calculating the actual position of the electrical circuit based on the relative position; determining the infrared light of the electrical circuit based on the infrared light; calculating the heating element and the surface temperature of the heating element in the electrical circuit based on the infrared light of the electrical circuit; and determining the actual position of the heating element based on the actual position of the electrical circuit.

[0061] In this alternative implementation manner, the above calculation of the actual position of the electrical circuit based on the relative position includes: establishing a global coordinate system based on the spatial positions and observation directions of each vision unit, and mapping the local data to the coordinate system where the electrical circuit C is located. As Figure 3 shown, in the coordinate system where the electrical circuit is located, through the position of vision unit A (converting the relative position of vision unit A to the position in the coordinate system where electrical circuit C is located), the position of vision unit B (converting the relative position of vision unit B to the position in the coordinate system where electrical circuit C is located), the distance h between vision units A and B, the angle α of vision unit A relative to electrical circuit C, and the angle β of vision unit B relative to electrical circuit C, the actual position of electrical circuit C can be calculated.

[0062] In this alternative implementation manner, the above infrared light refers to the infrared light collected by multiple vision units, and the infrared light of the electrical circuit is the accurate infrared light of the electrical circuit obtained after processing the infrared light of multiple vision units. The above determination of the infrared light of the electrical circuit based on the infrared light includes: combining the field-of-view coverage characteristics of the multi-aperture compound eye system, performing intersection positioning on the light source direction through multiple observation units, and excluding the stray light outside the field of view to obtain the infrared light of the electrical circuit.

[0063] In this alternative implementation manner, the above calculation of the heating element and the surface temperature of the heating element in the electrical circuit based on the infrared light of the electrical circuit includes: determining at least one element in the electrical circuit based on the infrared light of the electrical circuit, and this element can be a connection line, an electronic component, etc. in the electrical circuit; determining the surface temperature of each element based on the infrared light of each element, and extracting the heating element from at least one element based on the surface temperature of each element. Among them, the heating element is the element whose temperature is greater than zero degrees.

[0064] The method for calculating the actual position and surface temperature of the heating element provided by this alternative implementation calculates the actual position of the electrical circuit based on the relative position, determines the infrared light of the electrical circuit based on the infrared light, calculates the heating element in the electrical circuit and the surface temperature of the heating element based on the infrared light of the electrical circuit, and determines the actual position of the heating element based on the actual position of the electrical circuit. Through the actual position of the visual field provided by the visual unit, the actual position of the heating element can be effectively obtained, improving the reliability of the actual position calculation.

[0065] In some alternative implementations of the present disclosure, the above method further includes: detecting whether the electrical circuit is operating; in response to detecting that the electrical circuit is operating, determining the component name of the heating element based on the actual position; determining the temperature threshold of the heating element based on the component name; detecting whether the heating element is faulty based on the surface temperature and the temperature threshold; and sending a fault message in response to detecting that the heating element is faulty.

[0066] In this alternative implementation, when the electrical circuit is operating, all elements in the electrical circuit will generate heat, and generally the temperature will exceed zero degrees. Therefore, it is possible to detect whether the electrical circuit is operating by the temperature of the element. The above detection of whether the electrical circuit is operating includes: detecting whether the heating element in the electrical circuit is all the elements in the electrical circuit. If so, it is determined that the electrical circuit is operating.

[0067] In this alternative implementation, the component names are different and the temperature thresholds are different. For example, the temperature threshold of the busbar is 80 degrees Celsius, the temperature threshold of the electronic component is 65 degrees Celsius, and the temperature threshold of the cable is 60 degrees Celsius; the temperature thresholds of different component names are recorded in the execution subject on which the electrical cabinet temperature measurement method runs. By comparing the surface temperature with the temperature threshold, it is possible to detect whether the heating element is faulty and effectively send a fault message.

[0068] In this alternative implementation, the fault message is information characterizing the fault of the heating element. The fault message includes: the actual position, surface temperature, and temperature threshold of the heating element. When the heating element exceeds the temperature threshold, it is determined that the heating of the heating element is abnormal heating. At this time, the operation of the heating element is abnormal. Therefore, a fault message needs to be sent.

[0069] The electrical cabinet temperature measurement method provided by this alternative implementation can effectively determine the fault and its position of the heating element by detecting whether the heating element is faulty through the surface temperature when the electrical circuit is operating and sending a fault message when the heating element is faulty.

[0070] Further reference Figure 4 As an implementation of the methods shown in the above figures, the present disclosure provides an embodiment of an electrical cabinet temperature measurement device. This device embodiment is related to Figure 2The method embodiments shown correspond to the device, which can be specifically applied to various electronic devices.

[0071] As Figure 4 shown, the electrical cabinet temperature measurement device 400 provided in this embodiment includes: an acquisition unit 401 and a calculation unit 402. Among them, the above acquisition unit 401 can be configured to acquire a plurality of relative positions and infrared light sent by a plurality of vision units in the electrical cabinet; the above calculation unit 402 can be configured to calculate the actual position and surface temperature of the heating element in the electrical circuit based on the infrared light and the relative position.

[0072] In this embodiment, in the electrical cabinet temperature measurement device 400: the specific processing of the acquisition unit 401 and the calculation unit 402 and the technical effects brought by them can respectively refer to Figure 2 the relevant descriptions of step 201 and step 202 in the corresponding embodiment, which will not be elaborated here.

[0073] In an embodiment of the present disclosure, the above calculation unit 402 is configured to: calculate the actual position of the electrical circuit based on the relative position; determine the infrared light of the electrical circuit based on the infrared light; calculate the heating element and the surface temperature of the heating element in the electrical circuit based on the infrared light of the electrical circuit; determine the actual position of the heating element based on the actual position of the electrical circuit.

[0074] In an embodiment of the present disclosure, the above device 400 further includes: a detection unit (not shown in the figure), and the above detection unit is configured to: detect whether the electrical circuit is operating; in response to detecting that the electrical circuit is operating, determine the component name of the heating element based on the actual position; determine the temperature threshold of the heating element based on the component name; detect whether the heating element is faulty based on the surface temperature and the temperature threshold; and send a fault message in response to detecting that the electrical circuit is faulty.

[0075] For the electrical cabinet temperature measurement device provided in the embodiment of the present disclosure, the acquisition unit 401 acquires a plurality of relative positions and infrared light sent by a plurality of vision units in the electrical cabinet; the calculation unit 402 calculates the actual position and surface temperature of the heating element in the electrical circuit based on the infrared light and the relative position, and uses the bionic compound eye and infrared technology to acquire the electrical circuit in the electrical cabinet, which can calculate the actual position and surface temperature of the electrical circuit in real time and without contact, improving the accuracy and timeliness of the temperature measurement of the electrical cabinet.

[0076] According to the embodiments of the present disclosure, the present disclosure also provides an electronic device, a readable storage medium, and a computer program product.

[0077] Figure 5FIG. shows a schematic block diagram of an exemplary electronic device 500 that can be used to implement embodiments of the present disclosure. The electronic device is intended to represent various forms of digital computers, such as, for example, laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as, for example, personal digital processors, cellular telephones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their modes are merely examples and are not intended to limit the implementation of the present disclosure described and / or claimed herein.

[0078] As Figure 5 shown, the device 500 includes a computing unit 501 that can perform various appropriate actions and processes in accordance with a computer program stored in a read-only memory (ROM) 502 or a computer program loaded from a storage unit 508 into a random access memory (RAM) 503. In the RAM 503, various programs and data required for the operation of the device 500 can also be stored. The computing unit 501, the ROM 502, and the RAM 503 are connected to each other via a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0079] A plurality of components in the device 500 are connected to the I / O interface 505, including: an input unit 506, such as, for example, a keyboard, a mouse, etc.; an output unit 507, such as, for example, various types of displays, speakers, etc.; a storage unit 508, such as, for example, a magnetic disk, an optical disk, etc.; and a communication unit 509, such as, for example, a network card, a modem, a wireless communication transceiver, etc. The communication unit 509 allows the device 500 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0080] The computing unit 501 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 501 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 501 executes the various methods and processes described above, such as the method for measuring the temperature of an electrical cabinet. For example, in some embodiments, the method for measuring the temperature of an electrical cabinet can be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as the storage unit 508. In some embodiments, part or all of the computer program can be loaded and / or installed onto the device 500 via the ROM 502 and / or the communication unit 509. When the computer program is loaded into the RAM 503 and executed by the computing unit 501, one or more steps of the method for measuring the temperature of an electrical cabinet described above can be executed. Alternatively, in other embodiments, the computing unit 501 can be configured to execute the method for measuring the temperature of an electrical cabinet in any other suitable manner (e.g., by means of firmware).

[0081] Various embodiments of the systems and techniques described above in this document can be implemented in digital electronic circuitry, integrated circuit systems, field-programmable gate arrays (FPGA), application-specific integrated circuits (ASIC), application-specific standard products (ASSP), system-on-a-chip systems (SOC), complex programmable logic devices (CPLD), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a dedicated or general-purpose programmable processor, and can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit the data and instructions to the storage system, the at least one input device, and the at least one output device.

[0082] The program code for implementing the methods of the present disclosure can be written in any combination of one or more programming languages. These program codes can be provided to the processor or controller of a general-purpose computer, a special-purpose computer, or other programmable electrical cabinet temperature measurement devices, such that when the program codes are executed by the processor or controller, the patterns / operations specified in the flowcharts and / or block diagrams are implemented. The program codes can be executed entirely on the machine, partially on the machine, executed partially on the machine and partially on a remote machine as an independent software package, or executed entirely on a remote machine or server.

[0083] In the context of this disclosure, a machine-readable medium can be a tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0084] To provide for interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the computer. Other kinds of devices can also be used to provide for interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic, speech, or tactile input).

[0085] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer having a graphical user interface or a web browser through which the user can interact with an implementation of the systems and techniques described herein), or in a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of a communication network include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0086] It should be understood that the various forms of the processes shown above can be used, steps can be reordered, added, or removed. For example, the steps recited in this disclosure can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and no limitation is imposed herein.

[0087] The foregoing description of specific exemplary embodiments of the invention is for purposes of illustration and exemplification. These descriptions are not intended to limit the invention to the precise forms disclosed, and it is apparent that, according to the above teachings, many modifications and variations are possible. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the invention and its practical applications, so that those skilled in the art can implement and utilize the various different exemplary embodiments of the invention, as well as various different selections and modifications. The scope of the invention is intended to be defined by the claims and their equivalents.

Claims

1. An electrical cabinet temperature measurement system, characterized in that, The system includes: An electrical cabinet; An electrical circuit installed in the electrical cabinet; A plurality of vision units installed in the electrical cabinet, each vision unit having a compound eye viewing range for receiving information of the electrical circuit; A thermal imaging infrared thermometer connected to the plurality of vision units, configured to collect a plurality of relative positions and infrared light sent by the plurality of vision units, and calculate the actual position and surface temperature of the heating element in the electrical circuit based on the infrared light and the relative positions.

2. The system according to claim 1, wherein The vision unit includes: A bionic compound eye unit installed in the electrical cabinet, the horizontal and vertical viewing ranges of the bionic compound eye unit being the compound eye viewing range; An infrared optical fiber connected to the bionic compound eye unit, configured to transmit the relative position and infrared light of the electrical circuit collected by the bionic compound eye unit.

3. The system according to claim 1, wherein The vision unit includes: Convex lenses installed in the electrical cabinet, the focal length of each convex lens in the convex lenses being twice the distance from the convex lens to the electrical circuit; An infrared single-core optical fiber connected to the convex lenses, configured to transmit the relative position and infrared light of the electrical circuit collected by the convex lenses.

4. The system according to claim 1, wherein, The thermal imaging infrared thermometer is further configured to detect whether the heating element is faulty through the surface temperature when the electrical circuit is operating, and send a fault message when the heating element is faulty; The system further includes: An alarm unit electrically connected to the thermal imaging infrared thermometer, configured to receive the fault message of the thermal imaging infrared thermometer and send an alarm message.

5. A method for measuring the temperature of an electrical cabinet, characterized in that, The method includes: Collecting a plurality of relative positions and infrared light sent by a plurality of vision units in an electrical cabinet; Calculating the actual position and surface temperature of the heating element in the electrical circuit based on the infrared light and the relative positions.

6. The method according to claim 5, wherein The calculating the actual position and surface temperature of the heating element in the electrical circuit based on the infrared light and the relative positions includes: Calculating the actual position of the electrical circuit based on the relative positions; Determining the infrared light of the electrical circuit based on the infrared light; Calculating the heating element and the surface temperature of the heating element in the electrical circuit based on the infrared light of the electrical circuit; Determining the actual position of the heating element based on the actual position of the electrical circuit.

7. The method according to claim 5, characterized in that, The method further includes: Detecting whether the electrical circuit is operating; In response to detecting that the electrical circuit is operating, determining the component name of the heating element based on the actual position; Determining the temperature threshold of the heating element based on the component name; Detecting whether the heating element is faulty based on the surface temperature and the temperature threshold; In response to detecting that the heating element is faulty, sending a fault message.

8. An electrical cabinet temperature measuring device, characterized in that, The device includes: A collection unit configured to collect a plurality of relative positions and infrared light sent by a plurality of vision units in an electrical cabinet; A calculation unit configured to calculate the actual position and surface temperature of the heating element in the electrical circuit based on the infrared light and the relative positions.

9. An electronic device, characterized in that, Includes: At least one processor; And A memory communicatively connected to the at least one processor; wherein, The memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the method according to any one of claims 5-7.

10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that, The computer instructions are used to cause the computer to execute the method according to any one of claims 5-7.

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