Aging test clamp for plastic package surface-mounted discrete semiconductor device

Abstract

The invention discloses a plastic package surface-mounted discrete semiconductor device aging test fixture, which comprises a bottom plate, a middle plate and a top plate, the bottom plate, the middle plate and the top plate are sequentially stacked, the bottom plate and the middle plate are jointly provided with a step mounting hole, a probe is mounted in the step mounting hole, and the two ends of the probe respectively penetrate out of the two ends of the step mounting hole; a positioning groove is formed in the top plate, a probe hole is formed in the bottom of the positioning groove, the upper end of the probe points to the probe hole, and a limiting mechanism is arranged on the bottom plate and used for fixing a device in the positioning groove; and flexible fixing and rapid fixing of the structure are improved, the working efficiency is improved, and convenience is provided for development of automatic aging feeding in the future.

Description

Technical Field

[0001] The invention relates to the field of semiconductor device testing, in particular to an aging test fixture for plastic-sealed surface-mounted semiconductor discrete devices. Background Art

[0002] Aging fixture is a device used for aging testing of electronic devices. Its function is to continuously perform repeated charge and discharge tests on electronic devices to achieve the purpose of inspecting the quality and performance of the devices. The aging fixtures on the market for plastic-sealed surface-mount semiconductor discrete devices use a flip-top type. After opening the test cover, the plastic-sealed surface-mount semiconductor discrete device is manually placed into the fixture, and then the test cover is closed to secure it.

[0003] Prior art, Chinese patent publication CN 212392226U discloses a surface-mount device aging fixture, belonging to the field of surface-mount device clamping technology. The fixture comprises a heat sink A, a heat sink B, and multiple clamping assemblies. Heat sink A is provided with a heat sink assembly on one side, and heat sink B is mounted on heat sink A. Multiple clamping assemblies are mounted on heat sink B. Multiple clamping assemblies are mounted on heat sink B, each used to hold surface-mount devices of different models and specifications. Compared to batch aging of surface-mount devices, this fixture improves the efficiency of surface-mount device aging tests and the practicality of the fixture.

[0004] Most existing technologies require people to manually stabilize the clamping cover and clamp the device. This design structure is highly dependent on manual labor, slow to operate, and brings great difficulties to the future development of automated aging and loading. Summary of the Invention

[0005] In order to solve the above technical problems, the present invention provides an aging test fixture for plastic-sealed surface-mounted semiconductor discrete devices.

[0006] The present invention is achieved through the following technical solutions.

[0007] The present invention provides a plastic-sealed surface-mounted semiconductor discrete device aging test fixture, which includes a bottom plate, a middle plate and a top plate. The bottom plate, the middle plate and the top plate are stacked in sequence. The bottom plate and the middle plate are jointly provided with a step mounting hole, in which a probe is installed, and two ends of the probe respectively pass through the two ends of the step mounting hole; a positioning groove is provided on the top plate, and a probe hole is provided at the bottom of the positioning groove, and the upper end of the probe points to the probe hole; a limiting mechanism is provided on the bottom plate, and the limiting mechanism is used to fix the device in the positioning groove.

[0008] Preferably, the limiting mechanism includes two relatively arranged metal bases, the metal bases are installed on the base plate, a rotating shaft is rotatably connected to the metal base, a metal claw is fixedly connected to the rotating shaft, the claw arm end of the metal claw is located in the positioning groove, and a pressing assembly is provided on the metal base, which is used to rotate the metal claw counterclockwise.

[0009] Preferably, the pressing component includes a pressing spring, a metal pressing block and a connecting block. Pressing springs are provided at both ends of the metal pressing block. One end of each pressing spring away from the metal pressing block is fixedly connected to the upper end surface of the metal base. One end of the connecting block is fixedly connected to the middle position of the metal pressing block, and the other end is rotatably connected to one end of the metal claw away from the claw arm end.

[0010] Preferably, guide grooves are provided at both ends on the upper end surface of the metal base. One end of each pressing spring away from the metal pressing block is fixedly installed in the guide groove. A guide rod is inserted through the pressing spring. One end of the guide rod is fixedly connected to the metal pressing block, and the other end extends into the guide groove.

[0011] Preferably, telescopic springs are fixedly installed at the four corners of the middle plate, and the other ends of the telescopic springs are fixedly installed on the lower end surface of the top plate.

[0012] Preferably, screws are threadedly inserted through the four corners of the top plate. Installation grooves are provided at the four corners of the middle plate. One end of each telescopic spring close to the middle plate is fixedly installed at the bottom of the installation groove. The screws sequentially pass through the top plate, the telescopic springs and extend into the installation grooves.

[0013] Preferably, a positioning pin is connected to the middle plate, and a positioning hole is provided on the top plate. The positioning pin and the positioning hole are snap-fitted.

[0014] Preferably, a positioning plate is installed at the middle position of the middle plate. The positioning plate is aligned with the positioning groove in the vertical direction. The upper end of the probe passes through the positioning plate and points to the probe hole.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. By placing the device in the positioning groove, the two opposite metal claws press down the device to achieve a fixing effect, and at the same time, good contact between the device and the probe is ensured, so that the device will not be displaced or loosened during the test, and reliable electrical connection between the probe and the device is achieved to ensure the accuracy of the measurement result.

[0017] 2. By pressing the metal claw with the metal pressing block to fix and unlock the device, there is no need to manually fix the device, thereby improving the flexible fixing and quick fixing of the structure, improving work efficiency, and providing convenience for the future development of automatic aging feeding. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of the present invention;

[0019] Figure 2 is a schematic structural diagram of the present invention mainly for showing the bottom plate, the middle plate, the positioning plate and the stepped mounting holes;

[0020] Figure 3It is a schematic structural diagram mainly used to show the top plate, positioning groove and probe holes of the present invention;

[0021] Figure 4 It is a schematic structural diagram mainly used to show some structures in the limiting mechanism of the present invention;

[0022] Figure 5 It is a schematic structural diagram mainly used to show the bottom plate, middle plate, top plate, telescopic spring and screw of the present invention;

[0023] Figure 6 It is a schematic structural diagram mainly used to show some parts on the bottom plate and middle plate of the present invention;

[0024] Figure 7 It is a schematic structural diagram mainly used to show the bottom plate and probe of the present invention.

[0025] In the figure: 1-bottom plate; 2-middle plate; 3-top plate; 4-step mounting hole; 5-probe; 6-positioning groove; 7-metal base; 8-rotating shaft; 9-metal claw; 10-pressing spring; 11-metal pressing block; 12-connecting block; 13-guiding groove; 14-guiding rod; 15-telescopic spring; 16-screw; 17-mounting groove; 18-positioning pin; 19-positioning plate; 20-pin shaft; 21-probe hole; 22-aging plate mounting hole. Detailed implementation manners

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0027] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If this specific posture changes, then the directional indications will also change accordingly.

[0028] In this embodiment, refer to Figure 1 , Figure 2 , Figure 3 and Figure 6, including a bottom plate 1, a middle plate 2 and a top plate 3. The bottom plate 1, the middle plate 2 and the top plate 3 are stacked in sequence. A stepped mounting hole 4 is jointly provided on the bottom plate 1 and the middle plate 2. A probe 5 is installed in the stepped mounting hole 4, which is convenient for fixing the middle part of the probe 5 at the middle position of the stepped mounting hole 4. Both ends of the probe 5 respectively pass through both ends of the stepped mounting hole 4. A positioning groove 6 is provided on the top plate 3. A probe hole 21 is provided at the bottom of the positioning groove 6. A positioning plate 19 is installed at the middle position of the middle plate 2. The positioning plate 19 is aligned with the positioning groove 6 in the vertical direction. The upper end of the probe 5 passes through the positioning plate 19 and points to the probe hole 21, which is convenient for accurately contacting the device with the probe 5 when the device is placed in the positioning groove 6.

[0029] In this embodiment, referring to Figure 1 , Figure 3 , Figure 4 and Figure 7 , a limiting mechanism is provided on the bottom plate 1. The limiting mechanism is used to fix the device in the positioning groove 6. The limiting mechanism includes two relatively arranged metal bases 7. Mounting holes are provided on the bottom plate 1. The metal bases 7 are fixedly installed on the bottom plate 1 through bolts. An activity notch is provided at the middle position of the metal base 7. A rotating shaft 8 is provided in the activity notch. Both ends of the rotating shaft 8 are respectively rotatably connected to the two side walls of the activity notch. A metal claw 9 is fixedly connected to the rotating shaft 8. The claw arm end of the metal claw 9 is located in the positioning groove 6. When the device is placed in the positioning groove 6, the metal claw 9 abuts against the device under natural gravity and fixes the device in the positioning groove 6.

[0030] In this embodiment, referring to Figure 4 , a pressing component is provided on the metal base 7. The pressing component is used to make the metal claw 9 rotate counterclockwise to unlock the metal claw 9 from the device, so as to facilitate the taking and placing of the device.

[0031] The pressing component includes a pressing spring 10, a metal pressing block 11 and a connecting block 12. One end of the connecting block 12 is fixedly connected to the middle position of the metal pressing block 11. A pin shaft 20 is installed at the end of the metal claw 9 far from the claw arm end. The other end of the connecting block 12 is rotatably connected to the pin shaft 20. Pressing springs 10 are provided at both ends of the metal pressing block 11. One end of the pressing spring 10 is fixedly connected to the metal pressing block 11. Guide grooves 13 are provided at both ends of the upper end surface of the metal base 7. The end of the pressing spring 10 far from the metal pressing block 11 is fixedly installed in the guide groove 13. A guide rod 14 is inserted through the pressing spring 10. One end of the guide rod 14 is fixedly connected to the metal pressing block 11, and the other end extends into the guide groove 13. There is an activity space between the end of the guide rod 14 extending into the guide groove 13 and the bottom of the guide groove 13. The guide rod 14 limits and guides the pressing spring 10 to prevent the pressing spring 10 from being excessively deformed during the stretching and contracting process, and has a protective effect on the pressing spring 10.

[0032] The same metal pressure block 11 is supported by two pressing springs 10. By pressing the metal pressure block 11, the pressing spring 10 is compressed, and the connecting block 12 pushes the metal claw 9 away from the end of the claw arm to move downward. The metal claw 9 rotates counterclockwise as a whole, so that the claw arm of the metal claw 9 moves out of the positioning groove 6, making it convenient to take and place the device.

[0033] In this embodiment, referring to Figure 5 and Figure 6 3 and 4. The extension spring 15 is fixedly installed at the four corners of the middle plate 2, and the other end of the extension spring 15 is fixedly installed on the lower end surface of the top plate 3. The four corners of the top plate 3 are threaded with screws 16, and the four corners of the middle plate 2 are provided with mounting grooves 17. The end of the extension spring 15 close to the middle plate 2 is fixedly installed at the bottom of the mounting groove 17, and the screw 16 passes through the top plate 3 and the extension spring 15 in sequence and extends into the mounting groove 17. There is a movable space between the end of the screw 16 extending into the mounting groove 17 and the bottom of the mounting groove 17, so that the screw 16 has a protective and guiding effect on the extension spring 15, thereby realizing the connection between the top plate 3 and the middle plate 2, and the extension spring 15 is in a compressed state. At this time, the device contacts the upper end of the probe 5, realizing effective contact between the device and the probe 5, and under the elastic action of the extension spring 15, the contact point of the probe 5 and the device is prevented from excessive contact, thereby causing damage to the device, and has a protective effect on the device and the probe 5, and avoids poor contact during the test as much as possible.

[0034] In this embodiment, referring to Figure 6 A positioning pin 18 is connected to the middle plate 2, and a positioning hole is opened on the top plate 3. The positioning pin 18 is snap-fitted with the positioning hole to facilitate accurate positioning and installation of the top plate 3 on the middle plate 2.

[0035] In this embodiment, referring to Figure 7 An aging board mounting hole 22 is provided on the base plate 1, and the base plate 1 is installed on the aging board by passing a bolt through the aging board mounting hole 22 and threadedly connecting with the aging board.

[0036] Working principle of this embodiment: By applying pressure to press down the metal pressing block 11, the pressing spring 10 elastically contracts, causing the metal pressing block 11 to drive the connecting block 12 to move downward. The connecting block 12 pushes the end of the metal claw 9 away from the claw arm end to move downward, causing the entire metal claw 9 to move counterclockwise, so that the claw arm end of the metal claw 9 moves away from the positioning groove 6, and the two metal claws 9 are in an open state. After placing the device into the positioning groove 6, no pressure is applied to the metal pressing block 11 anymore, the end of the metal claw 9 away from the claw arm end no longer receives pressure, and the claw arm end of the metal claw 9 enters the positioning groove 6 under natural gravity and presses the device tightly, making the device contact the probe 5, achieving good line contact. Finally, the overall structure is welded to the aging board, and the aging board is placed into the aging table to perform aging tests on the device, enabling reliable electrical connection between the probe 5 and the device to ensure the accuracy of the measurement results.

[0037] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made under the concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. An aging test fixture for plastic-encapsulated surface-mounted semiconductor discrete devices, characterized in that: It includes a bottom plate (1), a middle plate (2) and a top plate (3). The bottom plate (1), the middle plate (2) and the top plate (3) are stacked in sequence. A stepped mounting hole (4) is jointly arranged on the bottom plate (1) and the middle plate (2). A probe (5) is installed in the stepped mounting hole (4), and both ends of the probe (5) respectively pass through both ends of the stepped mounting hole (4). A positioning groove (6) is provided on the top plate (3), and a probe hole (21) is opened at the bottom of the positioning groove (6). The upper end of the probe (5) points to the probe hole (21). A limiting mechanism is arranged on the bottom plate (1), and the limiting mechanism is used to fix the device in the positioning groove (6).

2. The aging test fixture for plastic-encapsulated surface-mounted semiconductor discrete devices according to claim 1, characterized in that: The limiting mechanism includes two relatively arranged metal bases (7). The metal bases (7) are installed on the bottom plate (1). A rotating shaft (8) is rotatably connected to the metal bases (7). A metal claw (9) is fixedly connected to the rotating shaft (8). The claw arm end of the metal claw (9) is located in the positioning groove (6). A pressing component is arranged on the metal base (7), and the pressing component is used to make the metal claw (9) rotate counterclockwise.

3. The aging test fixture for plastic-encapsulated surface-mounted semiconductor discrete devices according to claim 2, characterized in that: The pressing component includes a pressing spring (10), a metal pressing block (11) and a connecting block (12). Pressing springs (10) are arranged at both ends of the metal pressing block (11). The ends of the pressing springs (10) far from the metal pressing block (11) are fixedly connected to the upper end surface of the metal base (7). One end of the connecting block (12) is fixedly connected to the middle position of the metal pressing block (11), and the other end is rotatably connected to the end of the metal claw (9) far from the claw arm end.

4. The aging test fixture for the plastic-encapsulated surface-mounted semiconductor discrete device according to claim 3, wherein: Guide grooves (13) are opened at both ends of the upper end surface of the metal base (7). The ends of the pressing springs (10) far from the metal pressing block (11) are fixedly installed in the guide grooves (13). A guide rod (14) is arranged in the pressing spring (10). One end of the guide rod (14) is fixedly connected to the metal pressing block (11), and the other end extends into the guide groove (13).

5. The aging test fixture for plastic-encapsulated surface-mounted semiconductor discrete devices according to claim 1, wherein: Expansion springs (15) are fixedly installed at the four corners of the middle plate (2), and the other ends of the expansion springs (15) are fixedly installed on the lower end surface of the top plate (3).

6. The aging test fixture for a plastic-encapsulated surface-mounted semiconductor discrete device according to claim 5, characterized in that: Screws (16) are threadedly penetrated through the four corners of the top plate (3). Installation grooves (17) are opened at the four corners of the middle plate (2). The ends of the expansion springs (15) close to the middle plate (2) are fixedly installed at the bottom of the installation grooves (17). The screws (16) sequentially pass through the top plate (3), the expansion springs (15) and extend into the installation grooves (17).

7. The aging test fixture for the plastic-encapsulated surface-mounted semiconductor discrete device according to claim 1, wherein: A positioning pin (18) is connected to the middle plate (2), and a positioning hole is opened on the top plate (3). The positioning pin (18) is in snap-fit with the positioning hole.

8. The aging test fixture for plastic-encapsulated surface-mounted semiconductor discrete devices according to claim 1, wherein: A positioning plate (19) is installed at the middle position of the middle plate (2). The positioning plate (19) is aligned with the positioning groove (6) in the vertical direction. The upper end of the probe (5) passes through the positioning plate (19) and points to the probe hole (21).

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