Method and device for determining influence factors of chip quality, equipment and medium

Abstract

The invention provides a method, a device and equipment for determining influence factors of chip quality and a medium, which can be applied to the technical field of semiconductors. The method comprises the following steps: processing obtained first test data of wafer testing before a deterioration experiment is carried out on a wafer to obtain a first test result, and processing obtained second test data of wafer testing after the deterioration experiment is carried out on the wafer to obtain a second test result; according to the two test results, test change data of each chip is generated; and determining whether the factors corresponding to the deterioration experiment are influence factors or not by combining the reference data of each chip. According to the scheme, the test data before and after the deterioration experiment is processed to obtain the test change data, and the reference data is combined to determine whether the factor corresponding to the deterioration experiment is the influence factor, so that the accuracy of the determined influence factor is effectively improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular, to a method, apparatus, device, and medium for determining factors affecting chip quality. Background Art

[0002] In the chip manufacturing industry, the yield of chips is a concern. The yield not only affects costs but also the utilization rate of production resources. To improve the chip yield, it is necessary to determine the factors that affect chip quality.

[0003] In the prior art, to determine the influencing factors, usually, a staff member designs a degradation experiment for a certain factor to be determined, that is, applies the factor to be determined to the chips on the wafer, then detects the chips after the degradation experiment, and analyzes the detection results based on their own experience to determine whether the factor to be determined is an influencing factor.

[0004] In summary, the existing method for determining factors affecting chip quality requires manual detection of chips and analysis of detection data, resulting in a low accuracy of the determined influencing factors. Summary of the Invention

[0005] Embodiments of this application provide a method, apparatus, device, and medium for determining factors affecting chip quality, which are used to solve the problem that the existing method for determining factors affecting chip quality requires manual detection of chips and analysis of detection data, resulting in a low accuracy of the determined influencing factors.

[0006] In a first aspect, embodiments of this application provide a method for determining factors affecting chip quality, including:

[0007] Obtain first test data of wafer testing before performing a degradation experiment on the wafer, second test data of wafer testing after performing the degradation experiment on the wafer, and reference data of each chip in the wafer; wherein, the first test data includes first sub-test data of each chip under each test item in the wafer testing, the second test data includes second sub-test data of each chip under each test item, and the reference data is pre-set data used to indicate the change in test results of the chip in two wafer tests before and after the degradation experiment;

[0008] According to the first sub-test data of each chip under each test item and the pre-set test threshold range of each test item, determine the first test result of each chip, where the first test result includes a pass flag indicating that the chip test passes, or includes a fail flag indicating that the chip test fails and the item identifier of the failed test item;

[0009] Determine the second test result of each chip according to the second sub-test data of each chip under each test item and the preset test threshold range of each test item. The second test result includes a pass flag indicating that the chip passes the test, or includes a fail flag indicating that the chip fails the test and the item identifier of the failed test item;

[0010] Generate test change data for each chip according to the first test result and the second test result of each chip;

[0011] Determine whether the factor corresponding to the deterioration experiment is an influencing factor according to the test change data of each chip and the reference data of each chip.

[0012] In a specific embodiment, the generating test change data for each chip according to the first test result and the second test result of each chip includes:

[0013] For each chip, if both the first test result and the second test result of the chip include the pass flag, generate first test change data indicating that the chip passes the test to passing the test;

[0014] If the first test result of the chip includes the pass flag and the second test result of the chip includes the fail flag, generate second test change data indicating that the chip passes the test to failing the test;

[0015] If the first test result of the chip includes the fail flag and the second test result of the chip includes the fail flag, generate third test change data indicating that the chip fails the test to passing the test;

[0016] If both the first test result and the second test result of the chip include the fail flag and the item identifiers of the failed test items in the first test result and the second test result of the chip are the same, generate fourth test change data indicating that the chip fails the test to failing the test and the failed test item does not change;

[0017] If both the first test result and the second test result of the chip include the fail flag and the item identifiers of the failed test items in the first test result and the second test result of the chip are different, generate fifth test change data indicating that the chip fails the test to failing the test and the failed test item changes.

[0018] In a specific embodiment, the determining whether the factor corresponding to the deterioration experiment is an influencing factor according to the test change data of each chip and the reference data of each chip includes:

[0019] For each chip, if the test change data of the chip is the same as the reference data of the chip, then the chip is regarded as a target chip;

[0020] Determine whether the ratio of the number of target chips in the wafer to the total number of chips in the wafer is greater than a preset threshold;

[0021] If the ratio of the number of target chips in the wafer to the total number of chips in the wafer is greater than the preset threshold, then determine that the factor corresponding to the deterioration experiment is an influencing factor;

[0022] If the ratio of the number of target chips in the wafer to the total number of chips in the wafer is less than or equal to the preset threshold, then determine that the factor corresponding to the deterioration experiment is not an influencing factor.

[0023] In a specific embodiment, the determining the first test result of each chip according to the first sub-test data of each chip under each test item and the preset test threshold range of each test item includes:

[0024] For each chip, in accordance with the preset test item order, sequentially process the first sub-test data of the chip under each test item. If the first sub-test data of the chip under one of the test items exceeds the preset test threshold range of the test item, then determine the test item as a failed test item, and generate a first test result including the failed identifier and the item identifier of the test item;

[0025] If the first sub-test data of the chip under all the test items do not exceed the preset test threshold ranges of the respective test items, then generate a first test result including the passed identifier.

[0026] In a specific embodiment, the determining the second test result of each chip according to the second sub-test data of each chip under each test item and the preset test threshold range of each test item includes:

[0027] For each chip, in accordance with the preset test item order, sequentially process the second sub-test data of the chip under each test item. If the second sub-test data of the chip under one of the test items exceeds the preset test threshold range of the test item, then determine the test item as a failed test item, and generate a second test result including the failed identifier and the item identifier of the test item;

[0028] If the second sub-test data of the chip under all the test items do not exceed the preset test threshold ranges of the respective test items, then generate a second test result including the passed identifier indicating the passed identifier.

[0029] In a specific embodiment, the method further includes:

[0030] Generate a chip position map according to the position of each chip in the wafer;

[0031] For each chip, fill the code corresponding to the wafer test change data of the chip at the corresponding position of the chip in the chip position map.

[0032] In a specific embodiment, the method further includes:

[0033] Determine the number of chips corresponding to the item identifier of each unpassed test item according to the second test results of all chips in the wafer;

[0034] Determine the influence level corresponding to each unpassed test item according to the number of chips corresponding to the item identifier of each unpassed test item and the preset corresponding relationship between the number of chips and the influence level, where the influence level is used to represent the influence degree of the factor corresponding to the deterioration experiment on the unpassed test item.

[0035] In a second aspect, an apparatus for determining factors affecting chip quality provided by an embodiment of the present application includes:

[0036] An acquisition module, configured to acquire first test data of wafer test before performing a deterioration experiment on a wafer, second test data of wafer test after performing the deterioration experiment on the wafer, and reference data of each chip in the wafer; wherein, the first test data includes first sub-test data of each chip under each test item of the wafer test, the second test data includes second sub-test data of each chip under each test item, and the reference data is preset data for indicating the change in test results of the chip in two wafer tests before and after the deterioration experiment;

[0037] A processing module, configured to:

[0038] Determine the first test result of each chip according to the first sub-test data of each chip under each test item and the preset test threshold range of each test item, where the first test result includes a pass identifier indicating that the chip test passes, or includes a fail identifier indicating that the chip test fails and the item identifier of the unpassed test item;

[0039] Determine the second test result of each chip according to the second sub-test data of each chip under each test item and the preset test threshold range of each test item, where the second test result includes a pass identifier indicating that the chip test passes, or includes a fail identifier indicating that the chip test fails and the item identifier of the unpassed test item;

[0040] Generate test change data for each chip according to the first test result and the second test result of each chip;

[0041] Determine whether the factor corresponding to the degradation experiment is an influencing factor according to the test change data of each chip and the reference data of each chip.

[0042] In a third aspect, an embodiment of the present application provides an electronic device, including:

[0043] A processor, a memory, and a communication interface;

[0044] The memory is used to store executable instructions of the processor;

[0045] Wherein, the processor is configured to execute the method for determining influencing factors of chip quality according to any one of the first aspects by executing the executable instructions.

[0046] In a fourth aspect, an embodiment of the present application provides a readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the method for determining influencing factors of chip quality according to any one of the first aspects is implemented.

[0047] In a fifth aspect, an embodiment of the present application provides a computer program product, including a computer program, and when the computer program is executed by a processor, it is used to implement the method for determining influencing factors of chip quality according to any one of the first aspects.

[0048] The method, device, equipment and medium for determining influencing factors of chip quality provided by the embodiments of the present application, by obtaining the first test data of wafer testing before the degradation experiment on the wafer, the second test data of wafer testing after the degradation experiment on the wafer, and the reference data of each chip in the wafer, determine the first test result of the chip according to the first sub-test data of each chip in the first test data under each test item, and determine the second test result of the chip according to the second sub-test data of each chip in the second test data under each test item; furthermore, generate test change data for each chip according to the first test result and the second test result of each chip; then, in combination with the reference data of each chip, determine whether the factor corresponding to the degradation experiment is an influencing factor. This solution processes the test data before and after the degradation experiment to obtain the test change data of each chip, and combines the reference data of each chip to determine whether the factor corresponding to the degradation experiment is an influencing factor, effectively improving the accuracy of the determined influencing factors. Description of the Drawings

[0049] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0050] Figure 1 It is a schematic flowchart of the first embodiment of the method for determining influencing factors of chip quality provided by the present application;

[0051] Figure 2a It is a schematic flowchart of the second embodiment of the method for determining influencing factors of chip quality provided by the present application;

[0052] Figure 2b It is a chip position diagram provided by the present application;

[0053] Figure 2c It is a chip position diagram for placing the test change results of wafers provided by the present application;

[0054] Figure 3 It is a schematic flowchart of the third embodiment of the method for determining influencing factors of chip quality provided by the present application;

[0055] Figure 4 It is a schematic structural diagram of the embodiment of the device for determining influencing factors of chip quality provided by the present application;

[0056] Figure 5 It is a schematic structural diagram of an electronic device provided by the present application. Detailed implementation manners

[0057] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, rather than all, of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments made by those of ordinary skill in the art under the inspiration of this embodiment belong to the scope of protection of the present application.

[0058] In the description, claims and the above-mentioned drawings of this application, terms such as "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances, so that the embodiments of this application described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0059] In the chip manufacturing industry, chip yield is a concern. Yield not only relates to cost but also affects the utilization rate of production resources. To improve chip yield, it is necessary to identify the influencing factors that affect chip quality.

[0060] There are many factors that can affect chip quality. For example: Voltage: For instance, a voltage of 0.5V can generate high-voltage arcs on the chip, leading to the failure of the Electro-Static Discharge (ESD) module in the chip.

[0061] Temperature: During the wafer manufacturing process, the influence of temperature is crucial for the performance of thin films, etc. In addition, temperature directly affects the performance of the chip. An increase in temperature will cause an increase in the internal current of the chip, thereby increasing chip power consumption. At the same time, high temperature will also cause thermal expansion of metal devices such as resistors and capacitors, leading to mechanical deformation and structural damage, etc., further accelerating the aging of the chip.

[0062] Humidity: If the humidity in a certain machine and a certain cavity is too high, it is likely to cause electrostatic accumulation and the phenomenon of electrostatic discharge, which will in turn affect the working stability and lifespan of the chip.

[0063] Magnetic field: The magnetic field will cause the voltage of the chip pins to be too high.

[0064] Frequency: Similar to temperature, too high a frequency will cause an increase in chip power consumption and accelerate chip aging.

[0065] Therefore, to identify the influencing factors, usually, staff design a deterioration experiment for a certain factor to be determined, that is, apply the factor to be determined to the chips on the wafer, then detect the chips after the deterioration experiment, and then analyze the detection results based on their own experience to determine whether the factor to be determined is an influencing factor. Since the manual method is used, there will be a problem of low accuracy in determining the influencing factors.

[0066] In view of the problems existing in the prior art, during the research on the method for determining the influencing factors of chip quality, the inventors found that a Chip Probing (CP) test can be performed before and after the degradation experiment. The CP test is also known as wafer testing. Wafer testing refers to the process of directly contacting the chip with the probes of the probe card by the testing equipment between the wafer manufacturing process and the packaging process to complete the testing of the performance and functions of the chip. Wafer testing can be performed for multiple test items. The test items can be testing whether the circuit is on or off, testing whether the storage module is available, connection testing, digital circuit testing, etc.

[0067] After performing two wafer tests, based on the sub-test data of each chip under each test item in the test data of the two wafer tests, and the preset test threshold range of each test item, two test results of each chip are determined; and then the test change data of each chip is generated by comparison.

[0068] Since the reference data is preset data for indicating the change in the test results of the chip under two wafer tests before and after the degradation experiment, according to the test change data and the reference data of each chip, it can be determined whether the factor corresponding to the degradation experiment is an influencing factor. Based on the above inventive concept, the solution for determining the influencing factors of chip quality in this application is designed.

[0069] The execution subject of the method for determining the influencing factors of chip quality in this application can be a computer, or a testing device for wafer testing, a server, or other devices. This application does not limit it, and the following will take a computer as an example for illustration.

[0070] The following is an example to illustrate the application scenario of the method for determining the influencing factors of chip quality provided in this application.

[0071] Exemplarily, in this application scenario, after the wafer manufacturing is completed, in order to verify whether the temperature is an influencing factor of chip quality, the staff designs a corresponding degradation experiment. Before performing the degradation experiment, the testing device is used to perform wafer testing on the chips in the wafer to generate the first test data, and then the degradation experiment is performed. After the degradation experiment is completed, the testing device is used to perform wafer testing on the chips in the wafer again to generate the second test data.

[0072] The staff inputs the first test data and the second test data into the computer. The computer can obtain the two test data, and then determine the first test result of each chip according to the first sub-test data of each chip under each test item in the first test data and the preset test threshold range of each test item; and determine the second test result of each chip according to the second sub-test data of each chip under each test item in the second test data and the preset test threshold range of each test item.

[0073] Then, according to the first test result and the second test result of each chip, the test change data of each chip is generated. Furthermore, in combination with the obtained reference data of each chip, it is determined whether the factor corresponding to the deterioration experiment is an influencing factor, that is, it is determined whether the temperature is an influencing factor affecting the chip quality.

[0074] It should be noted that the above scenario is only an example of an application scenario provided by the embodiments of the present application. The embodiments of the present application do not limit the actual forms of various devices included in this scenario. In the specific application of the solution, it can be set according to actual needs.

[0075] Next, the technical solution of the present application will be described in detail through specific embodiments. It should be noted that the following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0076] Figure 1 FIG. is a schematic flowchart of the first embodiment of the method for determining the influencing factor of chip quality provided by the present application. After the embodiments of the present application obtain two test data of wafer testing before and after the deterioration experiment by the computer, the test change data of each chip is determined according to the test data, and then in combination with the reference data of each chip, it is determined whether the factor corresponding to the deterioration experiment is an influencing factor. The method in this embodiment can be implemented by software, hardware, or a combination of software and hardware. As Figure 1 shown, the method for determining the influencing factor of chip quality specifically includes the following steps:

[0077] S101: Obtain the first test data of wafer testing before the deterioration experiment on the wafer, the second test data of wafer testing after the deterioration experiment on the wafer, and the reference data of each chip in the wafer.

[0078] In this step, in order to determine whether the factor corresponding to the deterioration experiment is an influencing factor affecting the chip quality, first, the computer needs to obtain the first test data of wafer testing before the deterioration experiment on the wafer, the second test data of wafer testing after the deterioration experiment on the wafer, and the reference data of each chip in the wafer.

[0079] Among them, the first test data includes first sub-test data of each chip under each test item in wafer testing, and the second test data includes second sub-test data of each chip under each test item. The first sub-test data and the second sub-test data are parameter values obtained by testing under the corresponding test items. The reference data is pre-set data for indicating the change in test results of the chip in two wafer tests before and after the deterioration experiment.

[0080] Exemplarily, the test item can be an electrical device open / short circuit test, and the corresponding first sub-test data and second sub-test data are the current value and voltage value of the electrical device; the test item can also be a transistor leakage test, and the corresponding first sub-test data and second sub-test data are the leakage amount of the transistor; the test item can also be a ring oscillator frequency test, and the corresponding first sub-test data and second sub-test data are the frequency of the ring oscillator. There can be one or multiple first sub-test data corresponding to one test item. There can be one or multiple second sub-test data corresponding to one test item. The embodiments of the present application do not limit the test items, the first sub-test data and the second sub-test data corresponding to the test items, and the number of the first sub-test data and the second sub-test data corresponding to one test item, which can be determined according to the actual situation.

[0081] It should be noted that the way for the computer to obtain the first test data and the second test data can be: the staff inputs the first test data and the second test data into the computer, and the computer can obtain them. It can also be: after the wafer testing equipment performs wafer testing, it sends the generated first test data and second test data to the computer. It can also be: the first test data and the second test data are stored in the database, and the computer reads the first test data and the second test data from the database. The embodiments of the present application do not limit the way for the computer to obtain the first test data and the second test data, which can be determined according to the actual situation.

[0082] S102: Determine the first test result of each chip according to the first sub-test data of each chip under each test item and the preset test threshold range of each test item.

[0083] In this step, after the computer obtains the first test data and the second test data, since the first test data includes the first sub-test data of each chip in the wafer under each test item, the first test result of each chip can be determined by combining the preset test threshold range of each test item.

[0084] Among them, the first test result includes a pass flag indicating that the chip test passes, or includes a fail flag indicating that the chip test fails and the item identifier of the failed test item.

[0085] It should be noted that the pass flag, fail flag, and item flag are used for coding. For example, the pass flag is A01, the fail flag is A00, and the item flag is 001. The embodiments of the present application do not limit the pass flag, fail flag, and item flag, which can be determined according to the actual situation.

[0086] Specifically, for each chip, in accordance with the preset test item sequence, the first sub-test data of the chip under each test item is processed in turn. If the first sub-test data of the chip under one of the test items exceeds the preset test threshold range of the test item, then the test item is determined as a failed test item, and a first test result including the fail flag and the item flag of the test item is generated.

[0087] If the first sub-test data of the chip under all test items do not exceed the preset test threshold ranges of the respective test items, then a first test result including the pass flag is generated.

[0088] It should be noted that if the first sub-test data of the chip under the test item do not exceed the preset test threshold range of the test item, and the test item is not the last item in the preset test item sequence, then the first sub-test data of the next test item in the preset test item sequence after the test item is processed.

[0089] Exemplarily, there are 3 test items in wafer testing, namely test item A, test item B, and test item C. The first sub-test data corresponding to test item A is data a, the first sub-test data corresponding to test item B is data b, and the first sub-test data corresponding to test item C is data c. The preset test item sequence is: test item B, test item C, test item A.

[0090] First, it is determined whether data b exceeds the preset test threshold range of test item B. If data b exceeds the preset test threshold range of test item B, then test item B is determined as a failed test item, and a first test result including the fail flag and the item flag of test item B is generated; data c and data a are no longer processed.

[0091] If data b does not exceed the preset test threshold range of test item B, since test item B is not the last test item, it is determined whether data c exceeds the preset test threshold range of test item C. If data c exceeds the preset test threshold range of test item C, then test item C is determined as a failed test item, and a first test result including the fail flag and the item flag of test item C is generated; data a is no longer processed.

[0092] If the data c does not exceed the preset test threshold range of the test item C, since the test item C is not the last test item, it is determined whether the data a exceeds the preset test threshold range of the test item A. If the data a exceeds the preset test threshold range of the test item A, the test item A is determined as a failed test item, and a first test result including a failure identifier and the item identifier of the test item A is generated; if the data a does not exceed the preset test threshold range of the test item A, since the test item A is the last test item, a first test result including a pass identifier is generated.

[0093] It should be noted that if there are multiple first sub-test data for a chip under a test item, there are also multiple preset test threshold ranges for this test item, and each first sub-test data has a corresponding preset test threshold range. Exemplarily, there are 3 first sub-test data for a chip under a test item, namely data a, data b, and data c; there are also 3 preset test threshold ranges for this test item, namely the first threshold range, the second threshold range, and the third threshold range. Data a corresponds to the first threshold range, data b corresponds to the second threshold range, and data c corresponds to the third threshold range.

[0094] In the case where there are multiple first sub-test data for a chip under this test item, if there is a first sub-test data that exceeds its corresponding preset test threshold range, the test item is determined as a failed test item, and a first test result including a failure identifier and the item identifier of this test item is generated.

[0095] Exemplarily, on the basis of the above example, if the data a exceeds the first threshold range, the data b does not exceed the second threshold range, and the data c does not exceed the third threshold range, the test item is determined as a failed test item, and a first test result including a failure identifier and the item identifier of this test item is generated.

[0096] In the case where there are multiple first sub-test data for a chip under this test item, if all the first sub-test data for the chip under this test item belong to their corresponding preset test threshold ranges, it indicates that the test item passes the test, and subsequent processing can be performed according to whether this test item is the last item in the preset test item sequence.

[0097] Exemplarily, on the basis of the above example, if the data a does not exceed the first threshold range, the data b does not exceed the second threshold range, and the data c does not exceed the third threshold range, it indicates that the test item passes the test.

[0098] S103: Determine the second test result of each chip according to the second sub-test data of each chip under each test item and the preset test threshold range of each test item.

[0099] In this step, after the computer obtains the first test data and the second test data, since the second test data includes the second sub-test data of each chip in the wafer under each test item, the second test result of each chip can be determined in combination with the preset test threshold range of each test item.

[0100] Among them, the second test result includes a pass flag indicating that the chip test passes, or includes a fail flag indicating that the chip test fails and the item identifier of the failed test item.

[0101] Specifically, for each chip, in accordance with the preset test item order, the second sub-test data of the chip under each test item is processed in sequence. If the second sub-test data of the chip under one of the test items exceeds the preset test threshold range of the test item, the test item is determined as a failed test item, and a second test result including a fail flag and the item identifier of the test item is generated.

[0102] If the second sub-test data of the chip under all test items do not exceed the preset test threshold ranges of the respective test items, a second test result including a pass flag is generated.

[0103] It should be noted that this step is similar to step S102, and will not be elaborated here.

[0104] It should be noted that the execution order of step S102 and step S103 can be: first execute step S102, and then execute step S103; it can also be: first execute step S103, and then execute step S103; it can also be: step S102 and step S103 are executed simultaneously. The embodiments of the present application do not limit the execution order of step S102 and step S103, and can be determined according to the actual situation.

[0105] S104: Generate test change data for each chip according to the first test result and the second test result of each chip.

[0106] In this step, after the computer obtains the first test result and the second test result of each chip, the test change data of each chip is generated according to the first test result and the second test result of each chip.

[0107] Specifically, for each chip, if both the first test result and the second test result of the chip include a pass flag, a first test change data indicating that the chip test passes to passes is generated;

[0108] If the first test result of the chip includes a pass flag and the second test result of the chip includes a fail flag, a second test change data indicating that the chip test passes to fails is generated;

[0109] If the first test result of the chip includes a fail flag and the second test result of the chip includes a pass flag, then generate third test change data indicating that the chip's test changes from fail to pass.

[0110] If both the first test result and the second test result of the chip include a fail flag and the item identifiers of the failed test items in the first test result and the second test result of the chip are the same, then generate fourth test change data indicating that the chip's test changes from fail to fail and the failed test items remain unchanged.

[0111] If both the first test result and the second test result of the chip include a fail flag and the item identifiers of the failed test items in the first test result and the second test result of the chip are different, then generate fifth test change data indicating that the chip's test changes from fail to fail and the failed test items change.

[0112] S105: According to the test change data of each chip and each chip's reference data, determine whether the factor corresponding to the degradation experiment is an influencing factor.

[0113] In this step, after the computer determines the test change data of each chip, since the reference data is pre-set data used to indicate the change in the test results of the chip under two wafer tests before and after the degradation experiment, the computer can combine the reference data of each chip to determine whether the factor corresponding to the degradation experiment is an influencing factor.

[0114] Specifically, for each chip, if the test change data of the chip is the same as the chip's reference data, then regard the chip as a target chip.

[0115] It should be noted that the reference data is used to indicate that the chip's test changes from pass to pass, or indicates that the chip's test changes from pass to fail, or indicates that the chip's test changes from fail to pass, or indicates that the chip's test changes from fail to fail and the failed test items remain unchanged, or indicates that the chip's test changes from fail to fail and the failed test items change.

[0116] Exemplarily, the test change data of the chip indicates that the chip's test changes from pass to pass, and the chip's reference data also indicates that the chip's test changes from pass to pass, which means that the test change data of the chip is the same as the chip's reference data, and the chip is a target chip.

[0117] Judge whether the ratio of the number of target chips in the wafer to the total number of chips in the wafer is greater than a preset threshold.

[0118] If the ratio of the number of target chips in the wafer to the total number of chips in the wafer is greater than a preset threshold, it is determined that the factor corresponding to the degradation experiment is an influencing factor; since the test change data of the target chips is the same as the reference data, it indicates that the target chips may be affected by the factor corresponding to the degradation experiment. The more the number of target chips, the greater the possibility that the factor corresponding to the degradation experiment is an influencing factor; when the ratio of the number of target chips in the wafer to the total number of chips in the wafer is greater than the preset threshold, the number of target chips is relatively large, indicating that the factor corresponding to the degradation experiment is an influencing factor.

[0119] If the ratio of the number of target chips in the wafer to the total number of chips in the wafer is less than or equal to the preset threshold, it is determined that the factor corresponding to the degradation experiment is not an influencing factor. Since the test change data of the target chips is the same as the reference data, it indicates that the target chips may be affected by the factor corresponding to the degradation experiment. The fewer the number of target chips, the smaller the possibility that the factor corresponding to the degradation experiment is an influencing factor; when the ratio of the number of target chips in the wafer to the total number of chips in the wafer is less than or equal to the preset threshold, the number of target chips is relatively small, indicating that the factor corresponding to the degradation experiment is not an influencing factor.

[0120] It should be noted that the preset threshold can be 60%, 70%, 90, etc. The embodiments of the present application do not limit the preset threshold, and it can be set according to the actual situation.

[0121] The method for determining the influencing factors of chip quality provided in this embodiment, after obtaining the first test data of wafer testing before the degradation experiment on the wafer, the second test data of wafer testing after the degradation experiment on the wafer, and the reference data of each chip in the wafer, determines the first test result of the chip according to the first sub-test data of each chip in each test item in the first test data, and determines the second test result of the chip according to the second sub-test data of each chip in each test item in the second test data; then generates the test change data of each chip according to the first test result and the second test result of each chip; and then combines the reference data of each chip to determine whether the factor corresponding to the degradation experiment is an influencing factor. Compared with the prior art in which manual detection and analysis of detection data are used for chips, this solution processes the test data before and after the degradation experiment to obtain the test change data of each chip, combines the reference data of each chip, and determines whether the factor corresponding to the degradation experiment is an influencing factor, effectively improving the accuracy of the determined influencing factors and also improving the efficiency of determining the influencing factors.

[0122] Figure 2a This is a schematic flowchart of the second embodiment of the method for determining the influencing factors of chip quality provided by the present application. On the basis of the above embodiments, the embodiments of the present application illustrate the situation where a computer realizes the visualization of test change data. AsFigure 2a As shown in the figure, the method for determining the influencing factors of the chip quality specifically includes the following steps:

[0123] S201: Generate a chip position map according to the position of each chip in the wafer.

[0124] In this step, after the computer obtains the test change data of each chip, in order for the staff to more intuitively view the change of the wafer test results, the visualization of the test change data can be carried out. First, generate a chip position map according to the position of each chip in the wafer obtained in advance.

[0125] Exemplarily, Figure 2b The chip position map provided by this application is shown in Figure 2b As shown in the figure, the chip position map is a circle, and the circle represents the wafer. There are grids in the circle, each grid represents a chip, and each grid is a chip position.

[0126] It should be noted that the way for the computer to obtain the position of the chip in the wafer can be: the staff inputs the position of the chip in the wafer into the computer, and the computer can obtain it. It can also be: the position of the chip in the wafer is stored in the database, and the computer reads the position of the chip in the wafer from the database. The embodiments of this application do not limit the way for the computer to obtain the position of the chip in the wafer, and can be determined according to the actual situation.

[0127] S202: For each chip, fill the code corresponding to the test change data of the chip in the corresponding position of the chip in the chip position map.

[0128] In this step, after the computer generates the chip position map, for each chip, fill the code corresponding to the test change data of the chip in the corresponding position of the chip in the chip position map.

[0129] That is, for each chip position in the chip position map, fill the code corresponding to the test change data of the chip corresponding to the chip position in the chip position.

[0130] Exemplarily, on the basis of Figure 2b the chip position map provided for placing the wafer test change results by this application is shown in Figure 2c As shown in Figure 2c the figure, there are numbers in the grid, and the numbers are test change data.

[0131] The number 1 is the code of the first test change data; the number 2 is the code of the second test change data; the number 3 is the code of the third test change data; the number 4 is the code of the fourth test change data; the number 5 is the code of the fifth test change data.

[0132] It should be noted that each grid can also display a background color, and different test change data correspond to different background colors, so that the staff can more intuitively view the test change data.

[0133] The method for determining the influencing factors of chip quality provided in this embodiment realizes the visualization of test change data by filling the test change data of the chip in the corresponding position of the chip in the chip position map, enabling the staff to intuitively view the test change data.

[0134] Figure 3 It is a schematic flowchart of the third embodiment of the method for determining the influencing factors of chip quality provided in this application. On the basis of the above embodiment, this application embodiment describes the situation where the computer determines the influence level corresponding to the unqualified test item according to the second test result. As Figure 3 shown, the method for determining the influencing factors of chip quality specifically includes the following steps:

[0135] S301: According to the second test results of all chips in the wafer, determine the number of chips corresponding to the item identifier of each unqualified test item.

[0136] In this step, after the computer obtains the second test result, it can also determine the influence degree of the factors corresponding to the deterioration experiment on the unqualified test item. First, according to the second test results of all chips in the wafer, determine the number of chips corresponding to the item identifier of each unqualified test item.

[0137] Since the second test result is the result obtained according to the second test data, and the second test data is the data obtained by testing the wafer after the deterioration experiment, the second test result is the data affected by the factors corresponding to the deterioration experiment. The influence degree of the factors corresponding to the deterioration experiment on the unqualified test item can be determined according to the second test result.

[0138] Since the second test result includes a pass identifier, or includes a fail identifier and the item identifier of the unqualified test item, the number of chips corresponding to the item identifier of each unqualified test item can be determined.

[0139] S302: According to the number of chips corresponding to the item identifier of each unqualified test item and the preset corresponding relationship between the number of chips and the influence level, determine the influence level corresponding to each unqualified test item.

[0140] In this step, after the computer determines the number of chips corresponding to the item identifier of each unqualified test item, it can combine the preset corresponding relationship between the number of chips and the influence level to determine the influence level corresponding to each unqualified test item.

[0141] For each unqualified test item, based on the number of chips corresponding to the item identifier of the unqualified test item and the preset correspondence between the number of chips and the impact level, determine the impact level corresponding to the number of chips, and this impact level is the impact level of the unqualified test item.

[0142] The impact level is used to represent the degree of influence of the factors corresponding to the deterioration experiment on the unqualified test item. The more chips corresponding to the item identifier of the unqualified test item, the greater the degree of influence of the factors corresponding to the deterioration experiment on the unqualified test item.

[0143] Exemplarily, Table 1 is a correspondence table of the number of chips and the impact level provided by this application.

[0144] Table 1

[0145] Number of chips Impact level 0-200 1 201-300 2 301-500 3 501-800 4 801-1000 5

[0146] As shown in Table 1, the more chips, the greater the corresponding impact level, indicating a greater degree of influence.

[0147] It should be noted that Table 1 is only an example of the correspondence between the number of chips and the impact level. The embodiments of this application do not limit the number of chips, the impact level, and the correspondence between the number of chips and the impact level, which can be determined according to the actual situation.

[0148] Subsequently, the staff can improve the chips or the production process according to the impact level corresponding to each unqualified test item to improve the chip yield.

[0149] The method for determining the influencing factors of chip quality provided in this embodiment, by determining the impact level corresponding to each unqualified test item according to the second test results of all chips in the wafer, enables the staff to know the degree of influence of the factors corresponding to the deterioration experiment on the unqualified test items, so as to improve the chips or the production process subsequently.

[0150] The following is an embodiment of the device of this application, which can be used to execute the method embodiment of this application. For the details not disclosed in the device embodiment of this application, please refer to the method embodiment of this application.

[0151] Figure 4 It is a schematic structural diagram of an embodiment of the device for determining the influencing factors of chip quality provided by this application. As Figure 4 shown, the device 40 for determining the influencing factors of chip quality includes:

[0152] An acquisition module 41, configured to acquire first test data of wafer testing before a deterioration experiment on a wafer, second test data of wafer testing after the deterioration experiment on the wafer, and reference data of each chip in the wafer; wherein, the first test data includes first sub-test data of each chip under each test item of the wafer testing, the second test data includes second sub-test data of each chip under each test item, and the reference data is preset data for indicating the change in test results of the chip under two wafer tests before and after the deterioration experiment;

[0153] A processing module 42, configured to:

[0154] Determine a first test result of each chip according to the first sub-test data of each chip under each test item and a preset test threshold range of each test item, where the first test result includes a pass flag indicating that the chip test passes, or includes a fail flag indicating that the chip test fails and an item identifier of the failed test item;

[0155] Determine a second test result of each chip according to the second sub-test data of each chip under each test item and a preset test threshold range of each test item, where the second test result includes a pass flag indicating that the chip test passes, or includes a fail flag indicating that the chip test fails and an item identifier of the failed test item;

[0156] Generate test change data of each chip according to the first test result and the second test result of each chip;

[0157] Determine whether the factor corresponding to the deterioration experiment is an influencing factor according to the test change data of each chip and the reference data of each chip.

[0158] Further, the processing module 42 is specifically configured to:

[0159] For each chip, if both the first test result and the second test result of the chip include the pass flag, generate first test change data indicating that the chip test passes to the chip test passes;

[0160] If the first test result of the chip includes the pass flag and the second test result of the chip includes the fail flag, generate second test change data indicating that the chip test passes to the chip test fails;

[0161] If the first test result of the chip includes the fail flag and the second test result of the chip includes the fail flag, generate third test change data indicating that the chip test fails to the chip test passes;

[0162] If both the first test result and the second test result of the chip include the fail flag, and the item identifiers of the failed test items in the first test result and the second test result of the chip are the same, then generate fourth test change data indicating that the chip test fails to pass and the failed test items remain unchanged;

[0163] If both the first test result and the second test result of the chip include the fail flag, and the item identifiers of the failed test items in the first test result and the second test result of the chip are different, then generate fifth test change data indicating that the chip test fails to pass and the failed test items change.

[0164] Further, the processing module 42 is specifically configured to:

[0165] For each chip, if the test change data of the chip is the same as the reference data of the chip, then regard the chip as a target chip;

[0166] Judge whether the ratio of the number of target chips in the wafer to the total number of chips in the wafer is greater than a preset threshold;

[0167] If the ratio of the number of target chips in the wafer to the total number of chips in the wafer is greater than the preset threshold, then determine the factor corresponding to the degradation experiment as an influencing factor;

[0168] If the ratio of the number of target chips in the wafer to the total number of chips in the wafer is less than or equal to the preset threshold, then determine that the factor corresponding to the degradation experiment is not an influencing factor.

[0169] Further, the processing module 42 is specifically configured to:

[0170] For each chip, in accordance with the preset test item order, sequentially process the first sub-test data of the chip under each test item. If the first sub-test data of the chip under one of the test items exceeds the preset test threshold range of the test item, then determine the test item as a failed test item, and generate a first test result including the fail flag and the item identifier of the test item;

[0171] If the first sub-test data of the chip under all the test items do not exceed the preset test threshold ranges of the respective test items, then generate a first test result including the pass flag.

[0172] Further, the processing module 42 is specifically configured to:

[0173] For each chip, in accordance with the preset test item sequence, the second sub-test data of the chip under each test item is processed in turn. If the second sub-test data of the chip under one of the test items exceeds the preset test threshold range of the test item, the test item is determined as a failed test item, and a second test result including the failure identifier and the item identifier of the test item is generated;

[0174] If the second sub-test data of the chip under all the test items do not exceed the preset test threshold ranges of the respective test items, a second test result including an indication of the pass identifier is generated.

[0175] A generation module 43, configured to generate a chip position map according to the position of each chip in the wafer;

[0176] Further, the processing module 42 is further configured to, for each chip, fill the code corresponding to the wafer test change data of the chip at the corresponding position of the chip in the chip position map.

[0177] Further, the processing module 42 is further configured to:

[0178] Determine the number of chips corresponding to the item identifier of each failed test item according to the second test results of all the chips in the wafer;

[0179] Determine the impact level corresponding to each failed test item according to the number of chips corresponding to the item identifier of each failed test item and the corresponding relationship between the preset number of chips and the impact level. The impact level is used to represent the impact degree of the factor corresponding to the deterioration experiment on the failed test item.

[0180] The device for determining the influencing factors of chip quality provided in this embodiment is used to execute the technical solutions in any of the foregoing method embodiments. Its implementation principle and technical effects are similar and will not be elaborated here.

[0181] Figure 5 It is a schematic structural diagram of an electronic device provided in this application. As Figure 5 shown, the electronic device 50 includes:

[0182] A processor 51, a memory 52, and a communication interface 53;

[0183] The memory 52 is used to store the executable instructions of the processor 51;

[0184] Wherein, the processor 51 is configured to execute the technical solutions in any of the foregoing method embodiments by executing the executable instructions.

[0185] Optionally, the memory 52 can be either independent or integrated with the processor 51.

[0186] Optionally, when the memory 52 is a device independent of the processor 51, the electronic device 50 may further include:

[0187] A bus 54, through which the memory 52 and the communication interface 53 are connected to the processor 51 to complete mutual communication, and the communication interface 53 is used to communicate with other devices.

[0188] Optionally, the communication interface 53 can be specifically implemented by a transceiver. The communication interface is used to implement communication between the database access device and other devices (such as clients, read-write libraries, and read-only libraries). The memory may include a random access memory (RAM), and may also include a non-volatile memory, such as at least one disk memory.

[0189] The bus 54 can be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the sake of simplicity, only a thick line is used to represent it in the figure, but it does not mean that there is only one bus or one type of bus.

[0190] The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.

[0191] The electronic device is used to execute the technical solutions in any of the foregoing method embodiments, and its implementation principle and technical effects are similar, and will not be elaborated here.

[0192] The embodiment of the present application further provides a readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the technical solutions provided in any of the foregoing method embodiments.

[0193] The embodiment of the present application further provides a computer program product, including a computer program, and when the computer program is executed by a processor, it is used to implement the technical solutions provided in any of the foregoing method embodiments.

[0194] Those of ordinary skill in the art will understand that all or part of the steps of implementing the above method embodiments can be completed by hardware related to program instructions. The foregoing program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments; and the foregoing storage medium includes: various media such as ROM, RAM, magnetic disk, or optical disk that can store program code.

[0195] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for determining influencing factors of chip quality, characterized in that, Including: Obtaining first test data of wafer testing before performing a deterioration experiment on the wafer, second test data of wafer testing after performing the deterioration experiment on the wafer, and reference data of each chip in the wafer; wherein, the first test data includes first sub-test data of each chip under each test item of the wafer testing, the second test data includes second sub-test data of each chip under each test item, and the reference data is preset data for indicating the change in test results of the chip in two wafer tests before and after the deterioration experiment; Determining a first test result of each chip according to the first sub-test data of each chip under each test item and the preset test threshold range of each test item, the first test result including a pass flag indicating that the chip test passes, or including a fail flag indicating that the chip test fails and an item identifier of the failed test item; Determining a second test result of each chip according to the second sub-test data of each chip under each test item and the preset test threshold range of each test item, the second test result including a pass flag indicating that the chip test passes, or including a fail flag indicating that the chip test fails and an item identifier of the failed test item; Generating test change data of each chip according to the first test result and the second test result of each chip; Determining whether the factor corresponding to the deterioration experiment is an influencing factor according to the test change data of each chip and the reference data of each chip.

2. The method according to claim 1, characterized in that The generating test change data of each chip according to the first test result and the second test result of each chip includes: For each chip, if both the first test result and the second test result of the chip include the pass flag, generating first test change data indicating that the chip test passes to the chip test passes; If the first test result of the chip includes the pass flag and the second test result of the chip includes the fail flag, generating second test change data indicating that the chip test passes to the chip test fails; If the first test result of the chip includes the fail flag and the second test result of the chip includes the fail flag, generating third test change data indicating that the chip test fails to the chip test passes; If both the first test result and the second test result of the chip include the fail flag and the item identifiers of the failed test items in the first test result and the second test result of the chip are the same, generating fourth test change data indicating that the chip test fails to the chip test fails and the failed test item does not change; If both the first test result and the second test result of the chip include the fail flag and the item identifiers of the failed test items in the first test result and the second test result of the chip are different, generating fifth test change data indicating that the chip test fails to the chip test fails and the failed test item changes.

3. The method according to claim 1, wherein The determining whether the factor corresponding to the deterioration experiment is an influencing factor according to the test change data of each chip and the reference data of each chip includes: For each chip, if the test change data of the chip is the same as the reference data of the chip, then the chip is regarded as a target chip; Judge whether the ratio of the number of target chips in the wafer to the total number of chips in the wafer is greater than a preset threshold; If the ratio of the number of target chips in the wafer to the total number of chips in the wafer is greater than the preset threshold, then determine that the factor corresponding to the deterioration experiment is an influencing factor; If the ratio of the number of target chips in the wafer to the total number of chips in the wafer is less than or equal to the preset threshold, then determine that the factor corresponding to the deterioration experiment is not an influencing factor.

4. The method according to claim 1, wherein Determining the first test result of each chip according to the first sub-test data of each chip under each test item and the preset test threshold range of each test item, including: For each chip, process the first sub-test data of the chip under each test item in sequence according to the preset test item order. If the first sub-test data of the chip under one of the test items exceeds the preset test threshold range of the test item, then determine the test item as a failed test item, and generate a first test result including the failed identification and the item identification of the test item; If the first sub-test data of the chip under all the test items do not exceed the preset test threshold ranges of the respective test items, then generate a first test result including the passed identification.

5. The method according to claim 1, wherein Determining the second test result of each chip according to the second sub-test data of each chip under each test item and the preset test threshold range of each test item, including: For each chip, process the second sub-test data of the chip under each test item in sequence according to the preset test item order. If the second sub-test data of the chip under one of the test items exceeds the preset test threshold range of the test item, then determine the test item as a failed test item, and generate a second test result including the failed identification and the item identification of the test item; If the second sub-test data of the chip under all the test items do not exceed the preset test threshold ranges of the respective test items, then generate a second test result including an indication of the passed identification.

6. The method according to claim 1, wherein The method further includes: Generating a chip position map according to the position of each chip in the wafer; For each chip, fill the code corresponding to the wafer test change data of the chip at the corresponding position of the chip in the chip position map.

7. The method according to claim 1, wherein The method further includes: Determining the number of chips corresponding to the item identification of each failed test item according to the second test results of all the chips in the wafer; Determining the influence level corresponding to each failed test item according to the number of chips corresponding to the item identification of each failed test item and the corresponding relationship between the preset number of chips and the influence level, where the influence level is used to represent the influence degree of the factor corresponding to the deterioration experiment on the failed test item.

8. An apparatus for determining influencing factors of chip quality, characterized in that, Including: An acquisition module, configured to acquire first test data obtained by wafer testing before a degradation experiment on a wafer, second test data obtained by wafer testing after the degradation experiment on the wafer, and reference data of each chip in the wafer; wherein, the first test data includes first sub-test data of each chip under each test item of the wafer testing, the second test data includes second sub-test data of each chip under each test item, and the reference data is pre-set data for indicating the change in test results of the chip under two wafer tests before and after the degradation experiment; A processing module, configured to: Determine a first test result of each chip according to the first sub-test data of each chip under each test item and a pre-set test threshold range of each test item, where the first test result includes a pass flag indicating that the chip test passes, or includes a fail flag indicating that the chip test fails and an item identifier of the failed test item; Determine a second test result of each chip according to the second sub-test data of each chip under each test item and a pre-set test threshold range of each test item, where the second test result includes a pass flag indicating that the chip test passes, or includes a fail flag indicating that the chip test fails and an item identifier of the failed test item; Generate test change data of each chip according to the first test result and the second test result of each chip; Determine whether the factor corresponding to the degradation experiment is an influencing factor according to the test change data of each chip and the reference data of each chip.

9. An electronic device, characterized in that, Comprising: A processor, a memory, and a communication interface; The memory is used to store executable instructions of the processor; Wherein, the processor is configured to execute the method for determining influencing factors of chip quality according to any one of claims 1 to 7 by executing the executable instructions.

10. A readable storage medium, on which a computer program is stored, characterized in that, When the computer program is executed by the processor, the method for determining influencing factors of chip quality according to any one of claims 1 to 7 is implemented.

11. A computer program product, characterized in that, Comprising a computer program, which is used to implement the method for determining influencing factors of chip quality according to any one of claims 1 to 7 when executed by the processor.

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