Temperature control method and device, storage medium and electronic equipment

Abstract

The invention provides a temperature control method and device, a storage medium and electronic equipment, and relates to the field of automatic control. The electronic equipment obtains the environment temperature of the heat preservation equipment; wherein the heat preservation equipment comprises a temperature control area located in the closed cavity and a heating piece for heating the temperature control area, and the environment temperature is the temperature outside the closed cavity; the temperature control compensation amount is obtained according to the environment temperature; according to the actually measured temperature of the temperature sampling point, the initial control quantity of the heating piece is obtained; and finally, compensating the initial control quantity by using the temperature control compensation quantity to obtain the optimal control quantity of the heating element. Thus, the temperature control compensation amount is obtained through the environment temperature and used for compensating the initial control amount obtained based on the actually measured temperature so as to obtain the more accurate optimization control amount, and therefore the influence of the environment temperature on the temperature control area is reduced.

Description

Technical Field

[0001] The present application relates to the field of automatic control, and more particularly, to a temperature control method, device, storage medium, and electronic device. Background Art

[0002] In many application scenarios, there is a need for constant temperature control. For example, in the field of in vitro diagnosis, when a reagent strip is dropped into a sample, a biochemical reaction needs to be carried out on an incubation tray. The temperature control accuracy and stability in the incubation area have a significant impact on the final test results.

[0003] Currently, the PID temperature control method is commonly used in the industry. By pre-experimentally setting appropriate proportional, integral, and derivative coefficients, the heating power is adjusted in real time to ensure that the temperature of the controlled object is stabilized near the target temperature. However, in actual operation, the temperature detection point and the temperature control point may not be in the same position. The controlled object transfers heat indirectly through a controlled intermediate medium, resulting in the actual temperature of the controlled object not being transmitted to the PID temperature control algorithm as a real-time input. This means that when the ambient temperature changes, the temperature of the controlled object changes but is not captured by the PID temperature control algorithm, leading to the problem of temperature control failure. Summary of the Invention

[0004] To overcome at least one deficiency in the prior art, the present application provides a temperature control method, device, storage medium, and electronic device, specifically including:

[0005] In a first aspect, the present application provides a temperature control method, the method including:

[0006] Obtain the ambient temperature of the heat preservation device, where the heat preservation device includes a temperature control area located in a closed cavity and a heating element for heating the temperature control area, and the ambient temperature is the temperature outside the closed cavity;

[0007] Obtain a temperature control compensation amount according to the ambient temperature;

[0008] Obtain an initial control amount of the heating element according to the measured temperature at the temperature sampling point;

[0009] Compensate the initial control amount with the temperature control compensation amount to obtain an optimized control amount of the heating element.

[0010] In a second aspect, the present application further provides a temperature control device, the device including:

[0011] A temperature sampling module, configured to obtain the ambient temperature of the heat preservation device, where the heat preservation device includes a temperature control area located in a closed cavity and a heating element for heating the temperature control area, and the ambient temperature is the temperature outside the closed cavity;

[0012] A temperature control compensation module, configured to obtain a temperature control compensation amount according to the ambient temperature;

[0013] A temperature control module, configured to obtain an initial control amount of the heating element according to the measured temperature at the temperature sampling point; and compensate the initial control amount by using the temperature control compensation amount to obtain an optimized control amount of the heating element.

[0014] In a third aspect, the present application provides a storage medium storing a computer program, which, when executed by a processor, implements the temperature control method described above.

[0015] In a fourth aspect, the present application further provides an electronic device, which includes a processor and a memory. The memory stores a computer program, which, when executed by the processor, implements the temperature control method described above.

[0016] Compared with the prior art, the present application has the following beneficial effects:

[0017] The present application provides a temperature control method, device, storage medium and electronic device. Among them, the electronic device obtains the ambient temperature of the heat preservation device. Among them, the heat preservation device includes a temperature control area located in a closed cavity and a heating element for heating the temperature control area, and the ambient temperature is the temperature outside the closed cavity; according to the ambient temperature, a temperature control compensation amount is obtained; according to the measured temperature at the temperature sampling point, an initial control amount of the heating element is obtained; the initial control amount is compensated by using the temperature control compensation amount to obtain an optimized control amount of the heating element. In this way, the temperature control compensation amount is obtained through the ambient temperature and used to compensate the initial control amount obtained based on the measured temperature, so as to obtain a more accurate optimized control amount, thereby reducing the influence of the ambient temperature on the temperature control area. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 It is a schematic diagram of an incubation tray provided by an embodiment of the present application;

[0020] Figure 2 It is a schematic structural diagram of an incubation tray provided by an embodiment of the present application;

[0021] Figure 3Schematic flowchart of the temperature control method provided by the embodiment of the present application;

[0022] Figure 4 Function curve diagram of the temperature control compensation amount provided by the embodiment of the present application;

[0023] Figure 5 Temperature change curve of the controlled point in the reagent sheet incubation area of the first temperature control method provided by the embodiment of the present application;

[0024] Figure 6A Temperature change curve of the controlled point in the reagent sheet incubation area of the second temperature control method provided by the embodiment of the present application;

[0025] Figure 6B Stability of the temperature inside the plate of the second temperature control method provided by the embodiment of the present application;

[0026] Figure 6C Heating value change curve of the heating sheet of the second temperature control method provided by the embodiment of the present application;

[0027] Figure 6D Environmental temperature change curve of the second temperature control method provided by the embodiment of the present application;

[0028] Figure 7A Temperature change curve of the controlled point in the reagent sheet incubation area of the third temperature control method provided by the embodiment of the present application;

[0029] Figure 7B Stability of the temperature inside the plate of the third temperature control method provided by the embodiment of the present application;

[0030] Figure 7C Heating value change curve of the heating sheet of the third temperature control method provided by the embodiment of the present application;

[0031] Figure 7D Environmental temperature change curve of the third temperature control method provided by the embodiment of the present application;

[0032] Figure 8 Schematic structural diagram of the temperature control device provided by the embodiment of the present application;

[0033] Figure 9 Schematic structural diagram of the electronic device provided by the embodiment of the present application. Detailed implementation manners

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Apparently, the described embodiments are some, but not all, of the embodiments of this application. Components of the embodiments of this application usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts fall within the scope of protection of this application.

[0036] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0037] In the description of this application, it should be noted that the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance. In addition, the terms "include", "comprise", or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article, or device. Without further limitations, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article, or device including the said element.

[0038] Based on the above statement, as introduced in the background art, the controlled object transfers heat indirectly through a controlled intermediate medium, which means that when the ambient temperature changes, the actual temperature of the controlled object fails to be transmitted to the PID temperature control algorithm as a real-time input, resulting in the problem of temperature control failure.

[0039] Exemplarily, continue with Figure 1 the incubation tray 10 in the in vitro diagnostic field shown. Its structure is as Figure 2 shown. The incubation tray 10 includes a cover plate 101, thermal insulation cotton 102, a rotating blade 103, a heating sheet 105, and a base 104. Among them, the rotating blade 103 is provided with an incubation area 106 having the same shape as the reagent sheet 107 for placing the reagent sheet 107.

[0040] Continue to refer to Figure 2, the incubation tray 10 uses the heating sheet 105 as the heating element, which is directly attached to the bottom surface of the base 104, avoiding the existence of the air layer between the heating sheet and the base 104 in the traditional design, thus significantly improving the heat conduction efficiency and ensuring that the reagent strip 107 can be heated quickly and evenly. The heat generated by the heating sheet 105 is transferred to the reagent strip 107 through the intermediate heat transfer components (the base 104, the rotating blade 103). To reduce heat dissipation, the cover plate 101 and the base 104 enclose a highly sealed closed cavity, with only necessary openings provided at the strip unloading slot 108 and the detection slot 109, and the other parts are completely enclosed, effectively reducing heat dissipation and maintaining the uniformity and stability of the temperature inside the cavity. In addition, the heat insulation cotton 102 is fixedly arranged inside the closed cavity, between the rotating blade 103 and the cover plate 101, further blocking the heat from dissipating through the cover plate 101 and ensuring a constant temperature inside the cavity.

[0041] In the field of in vitro diagnosis, after the reagent strip 107 is dropped with a sample, it is placed in the incubation tray 10 for biochemical reactions. The accuracy and stability of the temperature control in the incubation area 106 have a great impact on the final test results. Therefore, it is necessary to precisely control the temperature of the incubation area where the reagent strip is located. However, it is found in the practical process that due to the limitations of actual conditions, the temperature sampling point and the temperature controlled point are not in the same position, and the actual temperature of the controlled object is not transmitted to the PID temperature control algorithm as a real-time input, so there will be a problem of temperature control failure. For example, when using heating methods such as metal bath and air bath, in order to avoid contaminating the reagent strip, the temperature sampling point cannot be directly set in the incubation area. Therefore, the temperature sampling point needs to be set near the incubation area, as close as possible to the actual controlled area, to improve the accuracy of temperature control.

[0042] When the temperature sampling point and the temperature controlled point are inconsistent, when the ambient temperature around the incubation tray changes, the conventional PID temperature control algorithm faces two problems:

[0043] (1) The change in the ambient temperature changes the heat dissipation power of the temperature controlled point. When the heating power remains unchanged, the temperature of the temperature controlled point will change in a difficult-to-quantitatively-determine manner following the ambient temperature, that is, the temperature drift problem. Suppressing the temperature drift can make the temperature curve change smoothly after the controlled point reaches the steady state and remain stable within a small range.

[0044] (2) To control the temperature of the temperature controlled point to reach the target temperature, that is, to control the heat balance point of heating and heat dissipation to be stable at the target temperature value, the change in the ambient temperature will change the heat dissipation power and then lower or raise the heat balance point of the controlled object at steady state. It is necessary to control the change of the heating power reference to suppress the movement of the heat balance point. And at steady state, the heating power reference is related to the set temperature of the controlled intermediate heat transfer component (the set temperature of the intermediate heat transfer component must be higher than the target temperature and there is a difference from the target temperature), so there is a problem of setting the temperature of the controlled intermediate heat transfer component, that is, the target temperature difference problem.

[0045] In this regard, the present embodiment also conducts actual test verification. Regarding the actual test verification process of the incubation tray, it should be understood that Figure 1 the shown incubation tray is a part of a complete incubation machine. During actual use, it is necessary to place Figure 1 the incubation tray in the reaction chamber reserved in the incubation machine. After testing the temperature of the incubation area in the incubation tray with a high-precision third-party thermometer, it is found that:

[0046] (1) The temperature of the temperature-controlled point will show a slow increase (i.e., temperature drift) within a large-scale time range (more than 3 hours), and the difference is more than 0.8 °C before and after 4 hours.

[0047] (2) After the temperature of the temperature-controlled point reaches a steady state, there will be an error at the °C level from the target temperature.

[0048] Based on the discovery of the above technical problems, the inventor has put forward the following technical solutions through creative labor to solve or improve the above problems. It should be noted that the defects existing in the above prior art solutions are the results obtained by the inventor after practice and careful research. Therefore, the process of discovering the above problems and the solutions proposed by the embodiments of the present application below for the above problems should be the contributions made by the inventor to the present application during the invention and creation process, and should not be understood as the technical content known to those skilled in the art.

[0049] In view of this, the present embodiment provides a temperature control method. As Figure 3 shown, the method includes:

[0050] S1, obtaining the ambient temperature of the heat preservation device.

[0051] Wherein, the heat preservation device includes a temperature control area located in a closed cavity and a heating element for heating the temperature control area, and the ambient temperature is the temperature outside the closed cavity.

[0052] S2, obtaining a temperature control compensation amount according to the ambient temperature.

[0053] S3, obtaining an initial control amount of the heating element according to the measured temperature at the temperature sampling point.

[0054] S4, compensating the initial control amount with the temperature control compensation amount to obtain an optimized control amount of the heating element.

[0055] In the present embodiment, the optimized control amount can be used to act on the heating element, thereby adjusting the temperature of the temperature control area. In this way, the temperature control compensation amount is obtained through the ambient temperature and is used to compensate the initial control amount obtained based on the measured temperature to obtain a more accurate optimized control amount, thereby reducing the influence of the ambient temperature on the temperature control area.

[0056] It should be understood that for the temperature control method of this embodiment, the electronic device implementing this method can be, but is not limited to, a controller (e.g., an embedded device) custom-developed for a heat preservation device, or a host computer capable of controlling a heating element in a heat preservation device. The host computer can be, but is not limited to, a mobile terminal, a tablet computer, a laptop computer, a desktop computer, etc.

[0057] To make the solution provided in this embodiment clearer, the following uses the controller as the electronic device implementing this temperature control method to elaborate on Figure 3 each step in detail. However, it should be understood that the operations in the flowchart may not be implemented in sequence, and steps without a logical context relationship can be reversed or implemented simultaneously. In addition, those skilled in the art can add one or more other operations to the flowchart or remove one or more operations from the flowchart under the guidance of the content of this application. As Figure 3 shown, this method includes:

[0058] S1, obtain the ambient temperature of the heat preservation device.

[0059] Among them, the heat preservation device includes a temperature control area located in a closed cavity and a heating element for heating the temperature control area, and the ambient temperature is the temperature outside the closed cavity. The heating element can be, but is not limited to, an electric heating wire, an electric heating tube, an electric heating film, etc. Among them, the heating principle of the electric heating wire is to generate heat by passing an electric current through a resistance wire; the electric heating tube is to encapsulate the electric heating wire in a metal tube and dissipate heat through a heat conduction medium (e.g., water or air); the electric heating film is a flexible heating element that can be attached to the surface of the device and converts electrical energy into heat energy.

[0060] Exemplarily, continue to take the Figure 1 shown incubation tray as an example. As mentioned above, the incubation tray is a part of the entire incubation machine. In actual use, it is necessary to place the Figure 1 incubation tray in the reaction chamber reserved in the incubation machine. To ensure that the incubation tray can accurately control the temperature, it is necessary to collect its ambient temperature. Therefore, a temperature sensor can be set at a position close to the incubation tray in the reaction chamber. The advantage of this setting is that the temperature sensor can accurately capture the actual ambient temperature around the incubation tray. For the incubation tray, this ambient temperature is actually the temperature in the reaction chamber.

[0061] Based on the description of the ambient temperature in the above embodiment, continue to refer to Figure 3 , and the following continues to describe Figure 3 step S2 in:

[0062] S2, obtain a temperature control compensation amount according to the ambient temperature.

[0063] As an alternative embodiment, the controller may obtain a first difference between the ambient temperature and the target temperature, and a second difference between the ambient temperature and a preset compensation stability factor, where the target temperature represents the temperature that the desired temperature control zone is to reach, and the compensation stability factor characterizes the degree of heat exchange with the environment; the ratio between the first difference and the second difference is determined as the temperature control compensation amount.

[0064] In this embodiment, the relationships among the ambient temperature, the target temperature, the first difference, the second difference, and the temperature control compensation amount are as follows:

[0065]

[0066] In the formula, ΔR power represents the temperature control compensation amount, T ambient represents the ambient temperature, T target represents the target temperature, T base represents the compensation stability factor, T ambient -T target represents the first difference, T ambient -T base represents the second difference.

[0067] Among them, the magnitude of the compensation stability factor is actually inversely related to the degree of heat exchange between the closed cavity of the incubation tray and the environment. When the degree of heat exchange is greater, the compensation stability factor T base is smaller, and the value obtained by substituting into the above calculation expression of the temperature control compensation amount is larger, meaning a larger compensation amount; conversely, the larger the compensation stability factor T base , the smaller the required compensation amount.

[0068] As an alternative embodiment, to maintain the curve shape to reasonably compensate the heating power ratio, the value range of T base can be limited to [T target , T target / 0.9]. In this way, when the ambient temperature T ambient varies in the interval (-∞, T target ), the temperature control compensation amount is positive; when the ambient temperature T ambient varies in the interval (T target , T base ), the temperature control compensation amount is negative; when T ambient = 0 °C, the temperature control compensation amount is T target / T base , close to 1, thus greatly increasing the heating power compensation amount. Therefore, the curve of the temperature control compensation amount becomes flatter as the compensation stability factor T base increases within the value range, and becoming flatter means that the ambient temperature is approaching the target temperature T targetWhen the heat exchange degree between the closed cavity and the environment gradually decreases, the sensitivity of the compensation algorithm to environmental temperature changes also decreases at this time. Similarly, when the heat exchange degree between the closed cavity and the environment is large, the compensation algorithm needs to be sensitive enough. For this reason, the compensation stability factor T base has a small value within a limited range, so that the curve of the temperature control compensation amount needs to change violently enough when the environmental temperature approaches the target temperature to adapt to large heat exchange. In addition, in this embodiment, the application range limit condition of the temperature control compensation amount formula can also be set to be less than T base .

[0069] It can be understood that the greater the heat exchange degree, the more compensation is required (the compensation amount is closer to 1). Therefore, the value of the compensation stability factor is smaller. On the contrary, it means less compensation is required (the compensation amount is closer to 0). Therefore, the value of the compensation stability factor is larger. From the physical meaning represented by the compensation stability factor, for different thermal insulation devices, the value of this compensation stability factor is also different. And the research also found that the heat exchange degree of different thermal insulation devices belongs to the inherent property of the device, which means that for different thermal insulation devices, their compensation stability factors can be determined by prior calibration.

[0070] Exemplarily, continue to take the Figure 1 incubation tray shown as an example. During calibration, a high-precision temperature measurement probe is installed in the incubation area of the reagent sheet to collect the actual temperature of the incubation area and compare it with the desired target temperature of the incubation area. During the comparison process, the compensation stability factor is adjusted so that the actual temperature of the incubation area approaches the target temperature.

[0071] In this example, an incremental PID control algorithm is adopted, and its output is the ratio (0-1) of the heating power of the heating element. The main working process of the PID control algorithm is to update the difference between the currently detected temperature and the target temperature, calculate the gain amount according to the set proportional coefficient P, integral coefficient I, and differential coefficient D, and calculate the heating power ratio according to the gain amount. The heating power is adjusted according to the size of the power ratio, thereby affecting the temperature change of the reagent sheet on the incubation tray.

[0072] By superimposing the temperature control compensation amount, the heating power ratio obtained by the PID control algorithm is changed, so that the temperature of the incubation area is suppressed as much as possible by the influence of the environmental temperature. After calibration, the calculation expression of the temperature control compensation amount is:

[0073]

[0074] In the formula, 34.5 represents the target temperature that the incubation area is expected to reach, and 36.0 is the calibrated value of the compensation stability factor, and its value should be near the value of 34.5. The function curve of the above calculation expression of the temperature control compensation amount is as Figure 4 shown.

[0075] As can be seen from Figure 4 this, the function curve decreases from 1 to 0 in the temperature range (0 °C, 34.5 °C), which means that the compensation power decreases from large to small. After multiple tests, its change situation meets the actual compensation requirements.

[0076] Based on the description of the relationship between the ambient temperature and the temperature control compensation amount in the above embodiments, the following continues to describe Figure 3 step S3 in

[0077] S3. Obtain the initial control amount of the heating element according to the measured temperature of the temperature sampling point.

[0078] In this embodiment, the controller can obtain the initial control amount according to the first temperature difference between the measured temperature and the actual controlled temperature of the temperature sampling point. It can be understood that the actual controlled temperature represents the temperature that the temperature sampling point actually needs to be controlled to reach. For Figure 2 the incubation tray shown, this actual controlled temperature is actually the temperature set for the intermediate heat transfer element of the incubation tray. In addition, the initial control amount of the above heating element can be, but is not limited to, the proportional value of the rated power of the heating element, the absolute value of the heating power, the voltage of the heating element, etc.

[0079] This process can be implemented by a PID (Proportional-Integral-Derivative) controller. The PID controller comprehensively processes the first temperature difference through proportional, integral, and derivative operations to obtain the initial control amount required for temperature adjustment. For example, when there is a deviation between the measured temperature and the actual controlled temperature (i.e., the actual control temperature), the PID controller will dynamically adjust the control amount according to the magnitude and change trend of the deviation, so that the system quickly reaches and maintains the set temperature value.

[0080] Based on the description of the initial control amount in step S3 in the above embodiments, the following continues to describe Figure 3 step S4 in

[0081] S4. Compensate the initial control amount with the temperature control compensation amount to obtain the optimized control amount of the heating element.

[0082] Exemplarily, assume that the initial control amount of the heating element is the proportional value of the rated power. The controller calculates the proportional value of the rated power of the heating element according to the detected measured temperature through the PID algorithm; then, obtains the compensation amount required for compensation through the introduced ambient temperature information; finally, corrects the proportional value obtained by the PID algorithm with the compensation amount to obtain the optimized proportional value, so as to achieve more accurate and stable temperature control.

[0083] Thus, to address the issue of inconsistent temperature detection points and temperature controlled points, in this embodiment, by introducing the ambient temperature, the target temperature of the temperature control area and the initial control amount of the heating element are compensated based on the ambient temperature, so that the temperature in the temperature control area is stabilized near the target temperature.

[0084] In addition, it should also be understood that for the above actual controlled temperature, when the temperature sampling point is set in the temperature control area, the actual controlled temperature is the same as the target temperature expected in the temperature control area. However, as introduced in the above embodiments, when the incubation tray adopts heating methods such as metal bath and air bath, in order to avoid contaminating the reagent tablets, the temperature sampling point cannot be directly set in the incubation area. Therefore, when the temperature sampling point is set outside the temperature control area, the temperature collected by the temperature sampling point does not represent the actual temperature of the temperature control area. For example, when the heat generated by the heating element is transferred to the temperature control area only through the temperature sampling point, since the heat will gradually dissipate during the transfer process, the actual controlled temperature needs to be higher than the target temperature of the temperature control area. Moreover, the actual controlled temperature will also change with the change of the ambient temperature of the insulation device.

[0085] Exemplarily, continue to refer to Figure 2 the incubation tray, where the temperature control area is the incubation area of the incubation tray for placing the reagent tablets. And the number of incubation areas is multiple, distributed on the outer periphery of the rotating blade. Since when adopting heating methods such as metal bath and air bath, in order to avoid contaminating the reagent tablets, the temperature sampling point cannot be directly set in the incubation area. At this time, the temperature sampling point can be set in the central area of the rotating blade, and this central area can be the central area close to the heating sheet side. Since the heat generated by the heating sheet needs to be transferred to the incubation area through the base, the actual controlled temperature of the temperature sampling point needs to be higher than the target temperature of the incubation area in order to make the incubation area reach the target temperature. That is to say, when the ambient temperature of the incubation tray is too low, the actual controlled temperature needs to be appropriately increased to make the temperature of the incubation area reach the target temperature.

[0086] Therefore, before obtaining the initial control amount based on the first temperature difference between the measured temperature and the actual controlled temperature of the temperature sampling point, it is necessary to determine a reasonable actual controlled temperature for the temperature sampling point by considering multiple factors, rather than directly using the target temperature of the temperature control area as the actual controlled temperature of the temperature sampling point.

[0087] In this regard, the controller can obtain the correction amount of the actual controlled temperature corresponding to the target temperature according to the second temperature difference between the target temperature of the temperature control area and the ambient temperature, where the target temperature represents the temperature that is expected to be reached in the temperature control area; use the correction amount to correct the target temperature to obtain the actual controlled temperature.

[0088] Among them, the relationship between the actual controlled temperature, the target temperature, and the correction amount is:

[0089] T temp_set =T target +α(Ttarget -T ambient ) + β

[0090] In the formula, T temp_set represents the actual controlled temperature, T target represents the target temperature, and T ambient represents the ambient temperature. α represents a preset first adjustment coefficient, and β represents a preset second adjustment coefficient. α(T target -T ambient ) + β represents the correction amount.

[0091] For different insulation devices, the above first adjustment coefficient and second adjustment coefficient are obtained through calibration in advance. Continuing with the incubation tray as an example, the first adjustment coefficient α in the formula is actually a proportionality coefficient and is difficult to obtain through derivation. Therefore, it can be obtained by fitting according to the actual temperature data. Assuming that the value of the second adjustment coefficient β is 0, the actual data of each item in the above expression are collected as shown in the following table:

[0092]

[0093]

[0094] As can be seen from the above calculation table, the value range of the first adjustment coefficient is between 0.20 and 0.30. When specifically taking values, for an environment with stronger convection, a larger value can be selected within the range of 0.20 to 0.30. In this example, the value is 0.25.

[0095] For the second adjustment coefficient, when the target temperature in the incubation area is 34.5 °C, the value range of the second adjustment coefficient is set between 0 and 1 °C and is used as the floating compensation value for the target temperature. Therefore, when it is set to 0.5, the following expression for the actual controlled temperature can be obtained:

[0096] T temp_set = 34.5 + 0.25×(34.5 - T ambient ) + 0.5

[0097] In this way, through the above expression, the reasonable actual controlled temperature can be set according to the ambient temperature of the incubation tray.

[0098] For the temperature control method provided in this embodiment, this embodiment also takes the incubation tray as the experimental object and conducts a comparative verification on its technical effects.

[0099] (1) The first control method

[0100] The first control method is the conventional PID temperature control method without any compensation and is carried out under the condition of about 24°C at room temperature. High-precision temperature probes are deployed in the six incubation zones of the incubation tray, and a temperature and humidity probe is set about 2 cm directly above the outside of the incubation tray to detect the ambient temperature. Based on the above sensor settings, each module of the incubation tray operates normally, and the incubation module board starts to run the temperature control program (without a temperature compensation algorithm). During the operation, the temperature change inside the tray (the inside of the incubation tray) is recorded. After several hours of the test cycle, the power is cut off, and the temperature record results are saved. Finally, the temperature change inside the tray is as Figure 5 shown.

[0101] Figure 5 In Figure 5 the temperature change curves of the six incubation zones are named 201 - 206 and are distinguished by different colors. Therefore, through

[0102] (2) The second control method

[0103] The second control method uses the PID temperature control method with a temperature control compensation amount. Under this method, the temperature change of the six incubation zones in the incubation tray is as Figure 6A shown; the temperature stability inside the tray is as Figure 6B shown; the heating value change curve of the heating sheet is as Figure 6C shown; the ambient temperature change curve is as Figure 6D shown.

[0104] Through Figure 6A it can be seen that after 1 hour of startup for measurement, the temperature change inside the tray is less than 0.4°C within 2 hours. In addition, Figure 6A also shows that there is still an error of more than 1.5°C between the steady-state temperature and the target temperature of 34.5°C. When the heat dissipation power of the reagent sheet always exists and is positive, with the target temperature of the heating tray set at 34.5°C, the temperature of the reagent sheet will always be lower than 34.5°C. To reach the target temperature in the incubation zone of the reagent sheet, the target temperature also needs to be compensated.

[0105] Moreover, compared with the first control method - "a temperature control algorithm with pure PID without any compensation", the temperature rises by more than 0.8 °C in 2 hours, and the situation where the temperature inside the plate drifts due to the heat accumulation in the internal environment of the instrument (as Figure 6B shown) is greatly reduced. Through Figure 6C it can be seen that the heating value (representing the heating power, and the value divided by 20,000 means the ratio of the heating power to the rated power) will slowly decrease as the ambient temperature slowly rises.

[0106] (3) The third control method

[0107] The third control method uses a PID temperature control method with a temperature control compensation amount and a target temperature compensation, and performs the aforementioned steps S1 to S4. When calibrating the parameters, in order to achieve the target temperature, different parameters are tested in different stages to determine the appropriate target temperature setting compensation curve. As Figure 7A shown, the details of the settings of α, β, and T target in the stages ①, ②, and ③ in the figure are as follows:

[0108] Stage ①: α = 0.20, β = 0, T target = 34.5

[0109] T temp_set = 34.4 + 0.20×(34.5 - T ambient )

[0110] Stage ②: α = 0.20, β = 0.5, T target = 34.5

[0111] T temp_set = 35.0 + 0.20×(34.5 - T ambient )

[0112] Stage ③: α = 0.25, β = 0.5, T target = 34.5

[0113] T temp_set = 35.0 + 0.25×(34.5 - T ambient )

[0114] It can be seen that with the adjustment of the parameters, the steady-state temperature in the incubation area gradually rises and approaches the target temperature setting value. When reaching the steady state, the temperature curve is smooth, indicating that the temperature is stable. Finally, most of the temperature inside the plate is stable at 33.7 - 34.6 °C, meeting the temperature control target. The wavy part of the curve indicated by ④ in the figure shows that the temperature drift compensation takes effect. When the ambient temperature rises and changes too much, the heating power automatically decreases according to the curvature, making the final temperature stable.

[0115] The stability of the temperature inside the plate is as Figure 7B shown; the change of the heating value of the heating sheet is asFigure 7C As shown; the change of ambient temperature is as follows Figure 7D shown.

[0116] Based on the same inventive concept as the temperature control method provided in this embodiment, this embodiment also provides a temperature control device. The device includes at least one software function module that can be stored in a memory or solidified in an electronic device in the form of software. The processor in the electronic device is used to execute the executable module stored in the memory 120. For example, the software function module and computer program included in the device. Please refer to Figure 8 Functionally, the device can include:

[0117] A temperature sampling module 21 is used to obtain the ambient temperature of the heat preservation device, wherein the heat preservation device includes a temperature control area located in a closed cavity and a heating element for heating the temperature control area, and the ambient temperature is the temperature outside the closed cavity;

[0118] The temperature control compensation module 22 is used to obtain the temperature control compensation amount according to the ambient temperature;

[0119] The temperature control module 23 is used to obtain the initial control amount of the heating element according to the measured temperature of the temperature sampling point; and compensate the initial control amount with the temperature control compensation amount to obtain the optimized control amount of the heating element.

[0120] In this embodiment, the temperature sampling module 21 is used to implement Figure 3 In step S1, the temperature control compensation module 22 is used to implement Figure 3 Step S2 in the temperature control module 23 is used to implement Figure 3 Therefore, for the detailed description of each of the above modules, please refer to the specific implementation of the corresponding steps, which will not be repeated in this embodiment.

[0121] Since the invention concept is the same as that of the temperature control method, the temperature control module 23 can also implement other steps or sub-steps of the method through the above modules.

[0122] Optionally, the temperature control compensation module 22 is further specifically configured to:

[0123] Obtaining a first difference between the ambient temperature and a target temperature, and a second difference between the ambient temperature and a preset compensation stability factor, wherein the target temperature represents the temperature desired to be reached in the temperature control zone, and the compensation stability factor represents the degree of heat exchange with the environment;

[0124] The ratio between the first difference and the second difference is determined as the temperature control compensation amount.

[0125] Optionally, the temperature control module 23 is further specifically configured to:

[0126] An initial control quantity is obtained based on a first temperature difference between the measured temperature and the actual controlled temperature of the temperature sampling point, where the actual controlled temperature represents the temperature that the temperature sampling point actually needs to be controlled to reach.

[0127] Optionally, before the temperature control module 23 obtains an initial control quantity based on the first temperature difference between the measured temperature and the actual controlled temperature of the temperature sampling point, the temperature control compensation module 22 is further configured to:

[0128] Obtain a correction quantity for the target temperature based on a second temperature difference between the target temperature of the temperature control area and the ambient temperature, where the target temperature represents the temperature that the temperature control area is expected to reach;

[0129] Use the correction quantity to correct the target temperature to obtain the actual controlled temperature.

[0130] In addition, in each embodiment of the present application, each functional module can be integrated together to form an independent part, or each module can exist separately, or two or more modules can be integrated to form an independent part.

[0131] It should also be understood that if the above embodiments are implemented in the form of software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of the present application.

[0132] Therefore, this embodiment also provides a storage medium, which is a computer-readable storage medium. The storage medium stores a computer program, and when the computer program is executed by a processor, it implements the temperature control method provided in this embodiment. Wherein, the storage medium can be various media such as a USB flash drive, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk, or an optical disc that can store program codes.

[0133] An electronic device for implementing the temperature control method provided in this embodiment. As Figure 9 shown, the electronic device may include a processor 32 and a memory 31. And, the memory 31 stores a computer program, and the processor 32 reads and executes the computer program corresponding to the above embodiment in the memory 31 to implement the temperature control method provided in this embodiment.

[0134] Continue to refer toFigure 9 The electronic device further includes a communication unit 33. Each of the memory 31, the processor 32, and the communication unit 33 is directly or indirectly electrically connected to each other through a system bus 34 to achieve data transmission or interaction.

[0135] Among them, the memory 31 can be an information recording device based on any electronic, magnetic, optical or other physical principles for recording execution instructions, data, etc. In some embodiments, the memory 31 can be, but is not limited to, a volatile memory, a non-volatile memory, a storage drive, etc.

[0136] In some embodiments, the volatile memory can be a random access memory (RAM); in some embodiments, the non-volatile memory can be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a flash memory, etc.; in some embodiments, the storage drive can be a disk drive, a solid-state drive, any type of storage disk (such as an optical disk, a DVD, etc.), or a similar storage medium, or a combination thereof, etc.

[0137] The communication unit 33 is used to transmit and receive data through a network. In some embodiments, the network may include a wired network, a wireless network, an optical fiber network, a telecommunication network, an intranet, the Internet, a Local Area Network (LAN), a Wide Area Network (WAN), a Wireless Local Area Networks (WLAN), a Metropolitan Area Network (MAN), a Wide Area Network (WAN), a Public Switched Telephone Network (PSTN), a Bluetooth network, a ZigBee network, or a Near Field Communication (NFC) network, etc., or any combination thereof. In some embodiments, the network may include one or more network access points. For example, the network may include a wired or wireless network access point, such as a base station and / or a network switching node, and one or more components of the service request processing system may be connected to the network through the access point to exchange data and / or information.

[0138] The processor 32 may be an integrated circuit chip with signal processing capabilities, and the processor 32 may include one or more processing cores (e.g., a single-core processor or a multi-core processor). By way of example only, the above-mentioned processor 32 may include a Central Processing Unit (CPU), an Application-Specific Integrated Circuit (ASIC), an Application Specific Instruction-set Processor (ASIP), a Graphics Processing Unit (GPU), a Physics Processing Unit (PPU), a Digital Signal Processor (DSP), a Field Programmable Gate Array (FPGA), a Programmable Logic Device (PLD), a controller, a microcontroller unit, a Reduced Instruction Set Computing (RISC), or a microprocessor, etc., or any combination thereof.

[0139] It can be understood that Figure 9The structure shown is only illustrative. The electronic device may also have more or fewer components than Figure 9 shown, or have a configuration different from that Figure 9 shown. Figure 9 Each of the components shown may be implemented by hardware, software, or a combination thereof.

[0140] It should be understood that the devices and methods disclosed in the above embodiments may also be implemented in other ways. The device embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architectures, functions, and operations of devices, methods, and computer program products according to multiple embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, may be implemented by a dedicated hardware-based system for performing the specified functions or actions, or may be implemented by a combination of dedicated hardware and computer instructions.

[0141] As described above, these are only various embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed in the present application can easily think of changes or substitutions, which should all be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A temperature control method, characterized in that, The method includes: Obtaining the ambient temperature of the thermal insulation device, where the thermal insulation device includes a temperature control area located in a closed cavity and a heating element for heating the temperature control area, and the ambient temperature is the temperature outside the closed cavity; Obtaining a temperature control compensation amount according to the ambient temperature; Obtaining an initial control amount of the heating element according to the measured temperature at the temperature sampling point; Compensating the initial control amount by using the temperature control compensation amount to obtain an optimized control amount of the heating element.

2. The temperature control method according to claim 1, wherein Obtaining a temperature control compensation amount according to the ambient temperature includes: Obtaining a first difference between the ambient temperature and a target temperature, and a second difference between the ambient temperature and a preset compensation stability factor, where the target temperature represents the temperature that the temperature control area is expected to reach, and the compensation stability factor characterizes the degree of heat exchange with the environment; Determining the ratio between the first difference and the second difference as the temperature control compensation amount.

3. The temperature control method according to claim 2, wherein The relationship between the ambient temperature, the target temperature, the first difference, the second difference, and the temperature control compensation amount is: Where, ΔR power represents the temperature control compensation amount, T ambient represents the ambient temperature, T target represents the target temperature, T base represents the compensation stability factor, T ambient -T target represents the first difference, T ambient -T base represents the second difference.

4. The temperature control method according to claim 1, wherein Obtaining an initial control amount of the heating element according to the measured temperature at the temperature sampling point includes: Obtaining the initial control amount according to a first temperature difference between the measured temperature and the actual controlled temperature at the temperature sampling point, where the actual controlled temperature represents the temperature that the temperature sampling point actually needs to be controlled to reach.

5. The temperature control method according to claim 1, characterized in that, The temperature sampling point is arranged outside the temperature control area.

6. The temperature control method according to claim 5, characterized in that Before obtaining the initial control amount according to the first temperature difference between the measured temperature and the actual controlled temperature at the temperature sampling point, the method further includes: Obtaining a correction amount of the target temperature according to a second temperature difference between the target temperature of the temperature control area and the ambient temperature, where the target temperature represents the temperature that the temperature control area is expected to reach; Correcting the target temperature by using the correction amount to obtain the actual controlled temperature.

7. The temperature control method according to claim 6, characterized in that, The relationship between the actual controlled temperature, the target temperature, and the correction amount is: T temp_set = T target + α(T target - T ambient ) + β Wherein, T temp_set represents the actual controlled temperature, T target represents the target temperature, α represents a preset first adjustment coefficient, β represents a preset second adjustment coefficient, and α(T target - T ambient ) + β represents the correction amount.

8. The temperature control method according to any one of claims 1-7, characterized in that, The thermal insulation device is an incubation tray, and the temperature control area is an incubation area of the incubation tray for placing reagent tablets.

9. The temperature control method according to claim 8, wherein The incubation tray further includes a rotating blade, and the number of the incubation areas is multiple; The multiple incubation areas are distributed on the outer periphery of the rotating blade, and the temperature sampling point is arranged in the central area of the rotating blade.

10. A temperature control device, characterized in that, The device includes: A temperature sampling module for obtaining the ambient temperature of the thermal insulation device, where the thermal insulation device includes a temperature control area located in a closed cavity and a heating element for heating the temperature control area, and the ambient temperature is the temperature outside the closed cavity; A temperature control compensation module for obtaining a temperature control compensation amount according to the ambient temperature; A temperature control module for obtaining an initial control amount of the heating element according to the measured temperature at the temperature sampling point; compensating the initial control amount by using the temperature control compensation amount to obtain an optimized control amount of the heating element.

11. A storage medium, characterized in that, The storage medium stores a computer program, and when the computer program is executed by a processor, it implements the temperature control method according to any one of claims 1-9.

12. An electronic device, characterized in that, The electronic device includes a processor and a memory, and the memory stores a computer program. When the computer program is executed by the processor, the temperature control method according to any one of claims 1-9 is implemented.

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