Liquid cooling server

Abstract

The invention provides a liquid cooling server which comprises a first case, a second case and a liquid cooling device. The cooling pipeline is in contact with the mainboard; the second case is arranged opposite to the first case; a heat dissipation assembly is accommodated in the second case, the heat dissipation assembly is communicated with the cooling pipeline to form a medium loop, and a cooling medium circulates in the medium loop; wherein in the medium loop, the cooling medium in the cooling pipeline exchanges heat with a heat load generated by the mainboard, the cooling medium after heat exchange is input into the heat dissipation assembly for cooling, and the cooled cooling medium is input into the cooling pipeline again.

Description

Technical Field

[0001] The present disclosure relates to server technology, and more particularly to a liquid-cooled server. Background Art

[0002] During operation, a server generates heat loads that need to be effectively managed by a liquid-cooling system to ensure stable server performance.

[0003] Currently, liquid-cooling systems rely on peripheral cooling devices to achieve cooling. The server cannot be integrated with the peripheral cooling devices, resulting in high usage costs and large occupied space. Summary of the Invention

[0004] The present disclosure provides a liquid-cooled server, including: a first chassis, in which a main board and a cooling pipeline are disposed; the cooling pipeline is in contact with the main board; a second chassis, disposed opposite to the first chassis; a heat dissipation component is disposed in the second chassis, and the heat dissipation component is in communication with the cooling pipeline to form a medium loop, and a cooling medium circulates in the medium loop; wherein, in the medium loop, the cooling medium in the cooling pipeline exchanges heat with the heat load generated by the main board, and the cooled cooling medium after heat exchange is input into the heat dissipation pipeline for cooling, and the cooled cooling medium is input into the cooling pipeline again.

[0005] In some embodiments, the heat dissipation component includes: a water pump and a heat dissipation pipeline connected to the water pump; the water pump and the heat dissipation pipeline form the medium loop with the cooling pipeline; wherein, in the medium loop, the water pump controls the cooled cooling medium after heat exchange to be input into the heat dissipation component for cooling, and controls the cooled cooling medium after cooling to be input into the cooling pipeline again.

[0006] In some embodiments, the heat dissipation pipeline includes: at least two heat dissipation sub-pipelines, the at least two heat dissipation sub-pipelines are connected in parallel, and each of the at least two heat dissipation sub-pipelines is connected to the water pump; wherein, in the medium loop, the water pump controls the cooled cooling medium after heat exchange to be simultaneously input into the at least two heat dissipation sub-pipelines for cooling, and controls the cooled cooling medium after cooling to be input into the cooling pipeline again.

[0007] In some embodiments, the heat dissipation pipeline includes: a heat dissipation pipe body and heat dissipation fins sleeved on the outer periphery of the heat dissipation pipe body; wherein, the cooled cooling medium after heat exchange is input into the heat dissipation pipe body, and secondary heat exchange is performed with external air through the heat dissipation fins.

[0008] In some embodiments, a water outlet and a water inlet are formed on the first chassis; both ends of the cooling pipeline are communicated with the water outlet and the water inlet respectively; the liquid-cooled server further includes: a water inlet pipe and a water outlet pipe; one end of the water inlet pipe is connected to the water outlet, and the other end is connected to the first end of the heat dissipation pipeline; one end of the water outlet pipe is connected to the water inlet, and the other end is connected to the second end of the heat dissipation pipeline; the water inlet pipe, the water pump, the heat dissipation pipeline, the water outlet pipe and the cooling pipeline form a medium loop; wherein, the cooled medium after heat exchange is input into the heat dissipation pipeline through the water outlet and the water inlet pipe; the cooled medium after temperature reduction is input into the cooling pipeline again through the water outlet pipe and the water inlet.

[0009] In some embodiments, the first chassis is formed by enclosing a first top plate, a first bottom plate and a plurality of first side plates connecting the first top plate and the first bottom plate, and a water outlet and a water inlet are formed on the first back plate among the plurality of first side plates; the second chassis includes: a second bottom plate and a plurality of second side plates, wherein the plurality of second side plates are connected end to end to form an annular structure, the first ends of the plurality of second side plates are connected to the second bottom plate, and the second ends of the plurality of second side plates are connected to the first bottom plate; a first through hole and a second through hole are formed on the second back plate among the plurality of second side plates; wherein, the water inlet pipe passes through the first through hole and is connected to the water outlet, and the water outlet pipe passes through the second through hole and is connected to the water inlet.

[0010] In some embodiments, the second chassis further includes: a heat-sinking top plate, wherein the heat-sinking top plate is attached to the first bottom plate, and the second ends of the plurality of second side plates are connected to the first bottom plate by connecting the heat-sinking top plate.

[0011] In some embodiments, assembly holes are formed on the second chassis; at least one fan is assembled in the assembly holes, and the air outlet of each fan among the at least one fan faces the heat dissipation component; wherein, the air in the second chassis exchanges heat with the cooled medium after heat exchange in the heat dissipation component and then heats up, and the fan cools down the heated air in the second chassis.

[0012] In some embodiments, a control device and a power supply module are further accommodated in the first chassis, and the power supply module is connected to the water pump and the fan; the control device is used to control the power supply module to supply power to the water pump and / or the fan.

[0013] In some embodiments, the liquid-cooled server further includes: a temperature detection module, and the temperature detection module is arranged in the first chassis or the second chassis; the control device is further used to control the power of the fan according to the temperature detected by the temperature detection module.

[0014] The embodiments of the present disclosure have the following beneficial effects:

[0015] In an embodiment of the present disclosure, a medium loop is formed between a relatively arranged first chassis and a second chassis. By circulating a cooling medium in the medium loop, the cooling medium can absorb the heat load generated by the motherboard in the first chassis and transfer the heat load to the second chassis for elimination through a heat dissipation component, thereby ensuring that the operating temperature of the motherboard remains stable continuously, and realizing the direct integration of the liquid cooling system into the liquid cooling server. In this way, on the one hand, the layout and structure of the liquid cooling server are optimized, making the overall volume of the liquid cooling server smaller and the space utilization rate higher when in use. On the other hand, the complexity of the liquid cooling system is reduced, making the maintenance difficulty and cost of the liquid cooling system lower.

[0016] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. Brief Description of the Drawings

[0017] The drawings herein are incorporated into the specification and form a part of this specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure.

[0018] Figure 1 It is a schematic diagram of the first liquid cooling server provided by an embodiment of the present disclosure;

[0019] Figure 2 It is a schematic diagram of the second liquid cooling server provided by an embodiment of the present disclosure;

[0020] Figure 3 It is a schematic diagram of the first second chassis provided by an embodiment of the present disclosure;

[0021] Figure 4 It is a schematic diagram of the second second chassis provided by an embodiment of the present disclosure;

[0022] Figure 5 It is a schematic diagram of the third second chassis provided by an embodiment of the present disclosure.

[0023] Description of the Reference Numerals:

[0024] 10. Liquid cooling server; 11. First chassis; 111. Water outlet; 112. Water inlet; 113. First backplane; 12. Second chassis; 121. Heat dissipation pipeline; 1211. First heat dissipation sub-pipeline; 1212. Second heat dissipation sub-pipeline; 122. Water pump; 123. Second backplane; 124. Fan; 125. Second panel; 126. Ventilation opening; 127. Heat equalizing top plate; 13. Water inlet pipe; 14. Water outlet pipe. Detailed Embodiments

[0025] Exemplary embodiments will be described in detail herein, and examples thereof are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. On the contrary, they are merely examples of devices consistent with some aspects of the present disclosure as detailed in the appended claims.

[0026] The liquid cooling system relies on peripheral cooling devices to achieve cooling. The peripheral cooling devices are, for example, dry cooling towers, wet cooling towers, etc. Thus, when a user uses a liquid-cooled server, additional peripheral cooling devices need to be configured to build a liquid cooling system to maintain the stable operation of the liquid-cooled server. This cooling solution in which the server cannot be integrated with the peripheral cooling device has problems of excessively high cost and large occupied space.

[0027] To solve the above technical problems, an embodiment of the present disclosure provides a liquid-cooled server to directly integrate the liquid cooling system into the server interior, so as to optimize the layout and structure of the liquid-cooled server on the one hand, make the overall volume of the liquid-cooled server smaller and the space utilization rate higher when in use, and on the other hand, reduce the complexity of the liquid cooling system, and the maintenance difficulty and cost are lower.

[0028] Figure 1 is a schematic diagram of the first liquid-cooled server provided by an embodiment of the present disclosure, Figure 2 is a schematic diagram of the second liquid-cooled server provided by an embodiment of the present disclosure, Figure 3 is a schematic diagram of the first second chassis provided by an embodiment of the present disclosure. As Figures 1 to 3 shown, the liquid-cooled server 10 may include a first chassis 11 and a second chassis 12, and the first chassis 11 and the second chassis 12 are disposed opposite to each other. In one embodiment, the first chassis 11 may be disposed opposite to the top, bottom, left side, right side, etc. of the second chassis 12, and the embodiments of the present disclosure do not make specific limitations thereto.

[0029] In some embodiments, the first chassis 11 is used to provide safety protection for the normal operation of components such as the motherboard and the cooling pipeline. The first chassis 11 may be a box formed by enclosing structures such as a housing or a flat plate. In one embodiment, the first chassis 11 has a rectangular parallelepiped shape. The first chassis 11 has good stiffness and strength, as well as good electromagnetic isolation, ventilation and heat dissipation performance.

[0030] In one embodiment, the first chassis 11 may have a preset height. Here, the height of the chassis can be expressed using the letter U (unit). For example, 1U is equal to 4.45 centimeters, and the height of the first chassis 11 can be 2U, that is, 8.9 centimeters. Similarly, the first chassis 11 may have a preset width and length. For example, the width of the first chassis 11 can be 48.26 cm (equal to 19 inches).

[0031] It should be noted that in the embodiments of the present disclosure, orientations such as top, bottom, left, and right refer to the relative positions of various components or structures of the liquid-cooled server in the actual use state. Among them, the height corresponds to the direction traveling from the top to the bottom, the width corresponds to the direction traveling from the left to the right, and the length corresponds to the direction perpendicular to the directions corresponding to the height and width.

[0032] In some embodiments, a main board and cooling pipes are disposed inside the first chassis 11, and the cooling pipes are in contact with the main board. The main board may include: a computing power board, a control board, a power supply board, etc. In one embodiment, the computing power board is the core component for high-performance computing in the liquid-cooled server 10, and is usually equipped with a high-performance graphics processing unit (GPU), a field programmable gate array (FPGA), or other dedicated computing chips. The computing power board generates a large amount of heat, and the computing power board needs to be cooled with emphasis in the liquid-cooled server 10. In one embodiment, the control board is responsible for the overall management and control functions of the server, including system startup, power management, hardware monitoring, etc. In one embodiment, the power supply board provides stable power supply for the entire server, and usually includes an alternating current / direct current (AC / DC) converter, a power distribution unit (PDU), a voltage regulation module (VRM), etc.

[0033] In some embodiments, the cooling pipes refer to the pipes of the cooling medium in the liquid-cooled server 10. There is a medium flow path in the cooling pipes, and this medium flow path is the flow path of the cooling medium. The cooling pipes are used to conduct the heat load generated by the main board into the cooling medium, so as to achieve the cooling of the main board. Here, according to the heat dissipation requirements of the main board, the cooling pipes can be correspondingly arranged with the main board, and there are various specific arrangement positions, and the embodiments of the present disclosure do not make specific limitations on this. In one embodiment, the cooling pipes can be arranged at the position in contact with the main board; in one embodiment, the cooling pipes can be arranged at a position close to the main board.

[0034] In one embodiment, the cooling pipe may include a cooling pipe body and heat dissipation fins, and the heat dissipation fins are connected to the surface of the cooling pipe body. In one embodiment, the cooling pipe body may include a pipe inlet, a pipe outlet, and a pipe body, and the pipe inlet and the pipe outlet are respectively located at both ends of the pipe body. In one embodiment, the cooling pipe may be made of corrosion-resistant metal materials (such as copper, aluminum alloy) or plastics.

[0035] In one embodiment, the cooling pipe may be bent to form a cooling coil in contact with the main board, thereby increasing the contact area between the cooling pipe and the main board, while increasing the flow path of the cooling medium and improving the heat exchange performance of the heat load generated by the cooling medium and the main board.

[0036] In some embodiments, the second chassis 12 is used to provide safety protection for the normal operation of the heat dissipation component. The structure of the second chassis 12 may refer to the structure of the first chassis 11 above. For the sake of brevity of the specification, it will not be described in detail here.

[0037] In some embodiments, by improving the heat dissipation efficiency of the heat dissipation component, the volume of the heat dissipation component can be increased, thereby enhancing the heat dissipation capacity of the liquid-cooled server 10. Thus, the height of the second chassis 12 may be greater than the height of the first chassis 11. In one embodiment, the height of the second chassis 12 may be 4U, that is, 17.8 cm.

[0038] In some embodiments, a heat dissipation component is disposed in the second chassis 12. The heat dissipation component and the cooling pipe are connected to form a medium loop. That is to say, there is a medium flow path in the heat dissipation component, and the medium flow path is connected to the medium flow path in the cooling pipe, thereby forming a medium loop.

[0039] It can be understood that the cooling medium can circulate in the medium loop. Specifically, the cooling medium in the cooling pipe exchanges heat with the heat load generated by the main board and will be heated up. The cooled medium (the heated-up cooling medium) flows in the medium loop and is input into the heat dissipation component to be cooled down, and the cooled-down cooling medium is input into the cooling pipe again. In this cycle, the heat load generated by the main board exchanges heat with the cooling medium, thereby realizing the cooling of the main board and maintaining the stable operation of the server.

[0040] In some embodiments, the connection between the heat dissipation component and the cooling pipe can be achieved through a pipe. In some embodiments, parameters such as the material, shape, position, and size of the pipe can be set according to actual needs, and the embodiments of the present disclosure do not make specific limitations thereto.

[0041] In some embodiments, the heat dissipation component is used to cool down the cooling medium. The heat dissipation component can cool down the cooling medium through various methods such as air-cooled heat dissipation, liquid-cooled heat dissipation, and heat pipe heat dissipation, and the embodiments of the present disclosure do not make specific limitations thereto.

[0042] In one embodiment, the working principle of the heat dissipation component can be that the cooling medium in the heat dissipation component exchanges heat with the air outside the heat dissipation component to reduce the temperature of the cooling medium.

[0043] In one embodiment, the heat dissipation component can be connected to a cooling pipe to form a heat pipe. Among them, the heat dissipation component can constitute the condensation section of the heat pipe, and the cooling pipe can constitute the evaporation section of the heat pipe. A medium circuit is formed between the condensation section and the evaporation section of the heat pipe. Specifically, the cooling medium at the evaporation section absorbs the heat load of the main board and vaporizes into steam. The steam reaches the condensation section under the action of a small pressure difference. The steam releases the latent heat of vaporization when it meets cold at the condensation section and re-condenses into a liquid. The condensed liquid flows back to the evaporation section through capillary force or gravity. In this cycle, the cooling medium in the heat pipe cools the main board.

[0044] In one embodiment, the cooling medium can be working fluids such as ultrapure water, deionized water, distilled water, or it can also be working fluids such as methanol, ethanol, and Freon (such as chlorodifluoromethane (R22), difluoromethane (R32), etc.). In one embodiment, the cooling medium can also include antifreeze. The antifreeze is, for example, ethylene glycol type antifreeze, propylene glycol type antifreeze, etc.

[0045] In the embodiments of the present disclosure, a medium circuit is formed between the relatively arranged first chassis and the second chassis. Through the circulation of the cooling medium in the medium circuit, the cooling medium can absorb the heat load generated by the main board in the first chassis and transfer the heat load to the second chassis for elimination through the heat dissipation component, thereby ensuring that the working temperature of the main board remains stable continuously and realizing the direct integration of the liquid cooling system into the liquid cooling server. In this way, on the one hand, the layout and structure of the liquid cooling server are optimized, making the overall volume of the liquid cooling server smaller and the space utilization rate higher when in use. On the other hand, the complexity of the liquid cooling system is reduced, making the maintenance difficulty and cost of the liquid cooling system lower.

[0046] In some embodiments, as Figures 1 to 3 shown, the heat dissipation component includes: a water pump 122 and a heat dissipation pipe 121 connected to the water pump 122; the water pump 122, the heat dissipation pipe 121 and the cooling pipe form a medium circuit.

[0047] It can be understood that the cooling pipe, the heat dissipation pipe 121 and the water pump 122 form a closed medium circuit. In this medium circuit, the cooling medium in the cooling pipe exchanges heat with the heat load generated by the main board and will heat up. The water pump 122 controls the input of the heat-exchanged cooling medium into the heat dissipation pipe 121 for cooling, and controls the re-input of the cooled cooling medium into the cooling pipe. In this cycle, the water pump 122 can control the cooling efficiency of the cooling medium for the main board and maintain the stable operation of the server.

[0048] In one embodiment, the heat dissipation pipe 121 can be made of a material with good thermal conductivity (such as copper, aluminum, etc.). In one embodiment, the working principle of the heat dissipation pipe 121 can be that the cooling medium in the heat dissipation component exchanges heat with the air outside the heat dissipation component to reduce the temperature of the cooling medium.

[0049] In one embodiment, the water pump 122 can be connected to the cooling pipe and the heat dissipation pipe 121 through a pipe interface. In one embodiment, the water pump 122 can be located between the pipe outlet of the cooling pipe and the pipe inlet of the heat dissipation pipe 121, and the cooling medium flows through the cooling pipe, the water pump 122, and the heat dissipation pipe 121 in sequence. In one embodiment, the water pump 122 can be located between the pipe outlet of the heat dissipation pipe 121 and the pipe inlet of the cooling pipe, and the cooling medium flows through the cooling pipe, the heat dissipation pipe 121, and the water pump 122 in sequence.

[0050] It can be understood that the water pump 122 can provide power for the circulating flow of the cooling medium, thereby realizing the effective transfer and dissipation of heat. The water pump 122 can also adjust the flow rate of the cooling medium, thereby affecting the cooling efficiency.

[0051] In the embodiments of the present disclosure, the coordinated work of the heat dissipation pipe, the cooling pipe, and the water pump constitutes a liquid cooling heat dissipation cycle system, thereby realizing the cooling of the motherboard in the liquid cooling server and meeting the user's usage requirements.

[0052] In some embodiments, as Figures 1 to 3 shown, the heat dissipation pipe 121 includes: at least two heat dissipation sub-pipes, the at least two heat dissipation sub-pipes are connected in parallel, and each heat dissipation sub-pipe in the at least two heat dissipation sub-pipes is connected to the water pump.

[0053] It can be understood that the heat dissipation pipe 12! can include at least two heat dissipation sub-pipes. The structure of each heat dissipation sub-pipe in the at least two heat dissipation sub-pipes can be the same or different, and the embodiments of the present disclosure do not make specific limitations thereto. Among them, each heat dissipation sub-pipe in the at least two heat dissipation sub-pipes is connected in parallel, so that the at least two heat dissipation sub-pipes jointly form a medium flow path, and the water pump 122, the at least two heat dissipation sub-pipes, and the cooling pipe form a medium loop. In the medium loop, the water pump 122 controls the heat-exchanged cooling medium to be simultaneously input into the at least two heat dissipation sub-pipes for cooling, and the cooled cooling medium can merge, and the water pump 122 also controls the cooled cooling medium to be input into the cooling pipe again. Here, each heat dissipation sub-pipe constituting the medium loop can cool the heat-exchanged cooling medium.

[0054] In one embodiment, the water pump 122 can be connected to the water inlet of each heat dissipation sub-pipe.

[0055] In some embodiments, each of at least two heat dissipation sub-pipes can be arranged at different positions within the second chassis 12, thereby avoiding the problem that a single heat dissipation pipe 121 placed in the second chassis 12 may waste the internal area of the second chassis 12.

[0056] In one embodiment, at least two heat dissipation sub-pipes include: a first heat dissipation sub-pipe 1211 and a second heat dissipation sub-pipe 1212. The arrangement positions of the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 can be set according to requirements. In one embodiment, the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 can be arranged in the width direction. In one embodiment, the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 can be arranged in the height direction. In one example, the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 can be arranged in the width direction and form a certain angle.

[0057] In some embodiments, each of at least two heat dissipation sub-pipes is connected in sequence, and the water pump 122 is arranged between any two of the at least two heat dissipation sub-pipes. The water pump 122 and the heat dissipation sub-pipes are arranged in series.

[0058] It can be understood that a medium flow path is formed in each heat dissipation sub-pipe. After each heat dissipation sub-pipe is connected in sequence, it can be connected to the water pump 122 and the cooling pipe, so that each heat dissipation sub-pipe, the water pump 122 and the cooling pipe form a medium loop. Here, the water pump 122 can be connected between any two heat dissipation sub-pipes to ensure that the cooling medium is evenly distributed to each heat dissipation sub-pipe, avoiding insufficient heat dissipation caused by local overheating.

[0059] It can be understood that in the medium loop, the cooling medium in the cooling pipe exchanges heat with the heat load generated by the main board and will heat up. The water pump 122 pumps the heat-exchanged cooling medium from the cooling pipe to the first heat dissipation sub-pipe among at least two heat dissipation sub-pipes, cools down in the first heat dissipation sub-pipe to the last heat dissipation sub-pipe among the at least two heat dissipation sub-pipes, and the cooled-down cooling medium is input into the cooling pipe from the last heat dissipation sub-pipe. In this cycle, the efficiency of the water pump 122 in controlling the cooling medium to cool the main board is realized, and the stable operation of the server is maintained.

[0060] In one embodiment, the water pump 122 can be connected to two adjacent heat dissipation sub-pipes through a pipe interface.

[0061] In one embodiment, at least two heat dissipation sub-pipes include: a first heat dissipation sub-pipe 1211 and a second heat dissipation sub-pipe 1212. A water pump 122 is connected between the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212, and the water pump 122 can ensure that the cooling medium is evenly distributed into the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212.

[0062] In the embodiments of the present application, multiple heat dissipation sub-pipes are arranged in the second chassis, so as to make full use of the space in the second chassis and improve the cooling efficiency of the liquid-cooled server.

[0063] In some embodiments, as Figures 1 to 3 shown, the heat dissipation pipe 121 includes: a heat dissipation pipe body and heat dissipation fins sleeved on the outer periphery of the heat dissipation pipe body. The heat dissipation fins are closely arranged on the surface of the heat dissipation pipe body, greatly increasing the heat dissipation area and significantly improving the heat dissipation efficiency.

[0064] It can be understood that the cooled cooling medium in the heat dissipation pipe body exchanges heat with the external air through the heat dissipation fins for secondary heat exchange to achieve temperature reduction. Specifically, the cooled cooling medium is input into the heat dissipation pipe body, and the heat is transferred from the heat dissipation pipe body to the heat dissipation fins. The heat dissipation fins absorbing the heat exchange heat with the external air and dissipate the heat into the surrounding environment.

[0065] It can be understood that the cooling medium is heated after the first heat exchange with the heat load of the main board in the cooling pipe, and the heated cooling medium is cooled after the second heat exchange with the air in the heat dissipation pipe 121. In this way, the cooling medium can be recycled in the cooling loop.

[0066] In some embodiments, the heat dissipation fins can be made of metal materials such as copper, aluminum, and stainless steel.

[0067] In the embodiments of the present disclosure, heat dissipation fins are arranged on the outer periphery of the heat dissipation pipe body to meet the heat dissipation requirements of the liquid-cooled server.

[0068] In some embodiments, as Figures 1 to 3 shown, a water outlet 111 and a water inlet 112 are opened on the first chassis 11. The liquid-cooled server 10 further includes: a water inlet pipe 13 and a water outlet pipe 14; one end of the water inlet pipe 13 is connected to the water outlet 111, and the other end is connected to the first end of the heat dissipation pipe 121; one end of the water outlet pipe 14 is connected to the water inlet 112, and the other end is connected to the second end of the heat dissipation pipe 121.

[0069] It can be understood that both ends of the cooling pipe can be respectively communicated with the water outlet 111 and the water inlet 112 opened on the first chassis 11. The heat dissipation component can be communicated with the cooling pipe by connecting the water outlet 111 and the water inlet 112 to form a medium loop. Here, the water outlet 111 can be connected to one end of the water inlet pipe 13, and the other end of the water inlet pipe 13 can be connected to the first end (the water inlet end of the heat dissipation pipe 121) of the heat dissipation pipe 121. The water inlet 112 can be connected to one end of the water inlet pipe 13, and the other end of the water inlet pipe 13 can be connected to the second end (the water outlet end of the heat dissipation pipe 121) of the heat dissipation pipe 121. In this way, through the water outlet 111 and the water inlet 112, the water inlet pipe 13, the water outlet pipe 14, the heat dissipation pipe 121, the water pump 122 and the cooling pipe form a medium loop.

[0070] It can be understood that in the medium loop, the cooling medium in the cooling pipe exchanges heat with the heat load generated by the main board and will heat up. The water pump 122 controls the cooled cooling medium to be input into the heat dissipation pipe 121 through the water outlet 111 and the water inlet pipe 13, and controls the cooled cooling medium to be input into the cooling pipe again through the water outlet pipe 14 and the water inlet 112.

[0071] In some embodiments, the water outlet 111 can be connected to one end of the water inlet pipe 13, and the other end of the water inlet pipe 13 can be connected to the first end (the water inlet end of the heat dissipation pipe 121) of the heat dissipation pipe 121 after passing through the water pump 122. The water inlet 112 can be connected to one end of the water inlet pipe 13, and the other end of the water inlet pipe 13 can be directly connected to the second end (the water outlet end of the heat dissipation pipe 121) of the heat dissipation pipe 121.

[0072] Exemplarily, Figure 4 is a schematic diagram of the second second chassis provided by an embodiment of the present disclosure. Figure 5 is a schematic diagram of the third second chassis provided by an embodiment of the present disclosure. Refer to Figures 3 to 5 As shown, the water inlet pipe 13 can be connected to the inlet of the water pump 122, the outlet of the water pump 122 is connected to the inlets of the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212, and the outlets of the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 are connected to the water outlet pipe 14.

[0073] In some embodiments, the positions of the water outlet 111 and the water inlet 112 can be set according to actual needs. The water outlet 111 and the water inlet 112 can be arranged on the same surface of the first chassis 11, or can be arranged on different surfaces of the first chassis 11.

[0074] In one embodiment, the positions of the water outlet 111 and the water inlet 112 can be set according to the positional relationship between the first chassis 11 and the second chassis 12. For example, the water outlet 111 and the water inlet 112 can be set at positions on the first chassis 11 close to the second chassis 12. In one embodiment, the positions of the water outlet 111 and the water inlet 112 can be set according to the working direction of the liquid-cooled server 10. For example, the water outlet 111 and the water inlet 112 can be set on the first chassis 11 on the back of the liquid-cooled server 10.

[0075] In some embodiments, the inlet pipe 13 and the outlet pipe 14 can be prepared from materials such as metals and alloys. In one embodiment, the inlet pipe 13 and the outlet pipe 14 penetrate through the second chassis 12, with one end communicating with the cooling pipeline and the other end communicating with the heat dissipation pipeline 121. In one embodiment, the inlet pipe 13 and the outlet pipe 14 can be bent to facilitate the connection between the cooling pipeline and the heat dissipation pipeline 121.

[0076] In the embodiments of the present application, connecting the cooling pipeline and the heat dissipation pipeline through the inlet pipe and the outlet pipe has the advantages of simple structure, convenient installation, easy maintenance, low cost, and high reliability.

[0077] In some embodiments, as Figures 1 to 5 shown, the first chassis 11 is formed by enclosing a first top plate, a first bottom plate, and a plurality of first side plates connecting the first top plate and the first bottom plate. The first back plate 113 among the plurality of first side plates is provided with a water outlet 111 and a water inlet 112. The second chassis 12 includes: a second bottom plate and a plurality of second side plates, wherein the plurality of second side plates are connected end to end to form an annular structure. The first ends of the plurality of second side plates are connected to the second bottom plate, and the second ends of the plurality of second side plates are connected to the first bottom plate. The second bottom plate, the annular structure, and the first bottom plate enclose a second accommodation cavity, and the heat dissipation component is accommodated in the second accommodation cavity. The second back plate 123 among the plurality of second side plates is provided with a first through hole and a second through hole. The inlet pipe 13 passes through the first through hole and is connected to the water outlet 111 at one end and the heat dissipation component at the other end. The outlet pipe 14 passes through the second through hole and is connected to the water inlet 112 at one end and the heat dissipation component at the other end.

[0078] It can be understood that the first top plate, the first bottom plate and the plurality of first side plates enclose to form a first accommodating cavity, the main board and the cooling pipe are accommodated in the first accommodating cavity, and both ends of the cooling pipe are respectively communicated with the water outlet 111 and the water inlet 112. The first end of the annular structure formed by the plurality of second side plates in the second chassis 12 is connected to the second bottom plate in the second chassis 12, and the second end is connected to the first bottom plate in the first chassis 11. Thus, the second bottom plate, the annular structure and the first bottom plate enclose to form a second accommodating cavity, and a heat dissipation component is accommodated in the second accommodating cavity. It can be seen that the first chassis 11 and the second chassis 12 can share the first bottom plate to partition and form the first accommodating cavity and the second accommodating cavity. On the one hand, the preparation of the top plate in the second chassis 12 can be reduced, saving costs; on the other hand, the second chassis 12 can be stacked with the first chassis 11, thereby improving the integration density of the liquid-cooled server 10 and reducing the occupied area of the liquid-cooled server 10.

[0079] In one embodiment, the first back plate 113 and the second back plate 123 are the surfaces away from the user during the use of the liquid-cooled server, so that the surface close to the user during the use of the liquid-cooled server is more beautiful.

[0080] In the embodiment of the present application, the water outlet and the water inlet are arranged on the first back plate of the first chassis, so as to facilitate the heat dissipation component and the cooling pipe to form a medium loop through the water inlet pipe and the water outlet pipe.

[0081] In some embodiments, as Figures 1 to 5 shown, the second chassis 12 further includes a heat spreader top plate 127, the heat spreader top plate 127 is attached to the first bottom plate, and the second ends of the plurality of side plates are connected to the first bottom plate by connecting the heat spreader top plate 127.

[0082] It can be understood that the heat spreader top plate 127 can be a hollow flat structure, and the heat spreader top plate 127 can conduct the heat in the first chassis 11 to make the heat in the first chassis 11 evenly distributed. Specifically, the working principle of the heat spreader top plate 127 is based on the phase change heat transfer mechanism. When the heat in the first chassis 11 is conducted to the evaporation area of the heat spreader top plate 127, the working fluid (such as ultrapure water) in the heat spreader top plate 127 will quickly absorb heat and vaporize into steam. Under the action of the pressure difference, the steam diffuses from the high-temperature area to the low-temperature area, and condenses into liquid when contacting the inner wall with a lower temperature, releasing the heat absorbed before. The condensed liquid flows back to the evaporation area through capillary action to complete a heat conduction cycle. In this way, the heat spreader top plate 127 can quickly conduct the heat in the first chassis 11 to the second chassis 12 and evenly distribute the heat on the entire heat spreader top plate 127, thereby effectively reducing the temperature in the first chassis 11 and preventing local overheating.

[0083] In some embodiments, the front projection of the first chassis 11 coincides with the front projection of the second chassis 12, so that the lengths and widths of the first chassis 11 and the second chassis 12 are the same. This ensures a more reasonable spatial layout of the liquid-cooled server 10. Especially when the liquid-cooled server 10 is used in a server room or a data center, multiple liquid-cooled servers 10 can be neatly stacked together, which is convenient for management and heat dissipation.

[0084] In some embodiments, as Figures 1 to 5 shown, the second chassis 12 is provided with assembly holes; at least one blower 124 is assembled in the assembly holes, and the air outlet of each blower 124 among the at least one blower 124 faces the heat dissipation component.

[0085] It can be understood that assembly holes can be provided on any surface of the second chassis 12. At least one blower 124 can be assembled at the position where the assembly holes are located. Here, the air outlet of each blower 124 faces the heat dissipation component, and each blower 124 is used to blow air to the heat dissipation component through the air outlet.

[0086] It can be understood that the heat dissipation component is located inside the second chassis 12. The air inside the second chassis 12 exchanges heat with the cooled medium after heat exchange in the heat dissipation component and then warms up. The blower 124 blows air on the warmed-up air inside the second chassis 12 to cool the warmed-up air. By blowing air with the blower 124, on the one hand, the temperature of the air inside the second chassis 12 can be reduced, which is convenient for the heat exchange between the cooled medium after heat exchange in the heat dissipation component and the air, and improves the cooling efficiency of the liquid-cooled server 10; on the other hand, the air flow rate inside the second chassis 12 can be increased, and the air cooling can be accelerated.

[0087] In some embodiments, the second backplane 123 is provided with assembly holes, and the blower 124 is assembled on the second backplane 123. A ventilation opening 126 is provided on the second panel 125 of the second chassis 12, and the second backplane 123 and the second panel 125 are oppositely arranged. In some embodiments, the shape, number, and size of the ventilation opening 126 can be set according to actual needs, and the embodiments of the present disclosure do not limit this. In one example, the blower 124 can be a fan, a cold blower, etc.

[0088] In the embodiments of the present disclosure, a blower is provided on the second chassis, so that the heat exchange rate inside the second chassis can be improved, and the overall cooling efficiency of the liquid-cooled server can be improved.

[0089] In some embodiments, a control device and a power supply module are further accommodated in the first chassis 11, and the power supply module is connected to the water pump 122 and the blower 124.

[0090] It can be understood that the liquid-cooled server 10 may further include a control device and a power supply module. The control device may be connected to components such as the power supply module, the water pump 122, and the fan 124, and the power supply module may be connected to components such as the water pump 122 and the fan 124. The control device and the power supply module may be disposed in the first chassis 11 to meet the cooling requirements of the control device and the power supply module.

[0091] In some embodiments, the cooling pipeline is close to or in contact with the control device and the power supply module, and the cooling medium in the cooling pipeline can exchange heat with the heat load generated by the control device and the heat load generated by the power supply module, so as to cool down the control device and the power supply module.

[0092] In one embodiment, the control device may be a combination of software and / or hardware that implements a predetermined function. In some embodiments, the control device may be a processor in the form of a hardware decoding processor, which is programmed to execute the control of the first medium loop and the second medium loop. For example, the processor in the form of a hardware decoding processor may employ one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), complex programmable logic devices (CPLDs), field-programmable gate arrays (FPGAs), or other electronic components, and the embodiments of the present disclosure do not make specific limitations thereto. In one embodiment, the control device may be integrally disposed on the main board. In one embodiment, the power supply module may be integrally disposed on the main board.

[0093] In some embodiments, the power supply module is used to supply power to the water pump 122 and / or the fan 124, and the control device is used to control the power supply module to supply power to the water pump 122 and / or the fan 124.

[0094] It can be understood that the control module can control the power supply module to supply power to the water pump 122 and / or the fan 124 according to the cooling requirements. After the water pump 122 and / or the fan 124 is powered on, the liquid-cooling heat dissipation system in the liquid-cooled server 10 starts to enter the working state to cool the main board.

[0095] In one embodiment, when the cooling requirement is low, the control device controls the power supply module to supply power to the water pump 122; in one embodiment, when the cooling requirement is high, the control device controls the power supply module to supply power to the water pump 122 and the fan 124. In one embodiment, the control device controls the power supply module to supply power only to the fan 124. At this time, since the water pump 122 is not working, the flow rate of the cooling medium in the medium circuit is slow, and the heat exchange efficiency between the cooled cooling medium in the heat dissipation assembly and the air is lower than that when the power supply module supplies power to the water pump 122 and the fan 124. In one embodiment, the control device controls the power supply module to supply power only to the fan 124. The heat dissipation top plate 127 and the fan 124 in the second chassis 12 can both accelerate the heat exchange efficiency between the cooled cooling medium in the first chassis 11 and the air.

[0096] In the embodiments of the present disclosure, the control device can control the power supply module to supply power to different components, so as to meet the cooling requirements in different usage scenarios.

[0097] In some embodiments, the liquid-cooled server 10 further includes a temperature detection module, and the temperature detection module is arranged in the first chassis 11 or the second chassis 12.

[0098] It can be understood that the liquid-cooled server 10 can also be provided with a temperature detection module, and the temperature detection module is used to detect the temperature inside the chassis of the liquid-cooled server 10. The temperature detection module can be arbitrarily arranged inside the first chassis 11 or the second chassis 12.

[0099] It can be understood that the control device can obtain the temperature detected by the temperature detection module. The control device is also used to control the working power of the fan 124 according to the temperature detected by the temperature detection module. When the cooling requirement is low, the control device controls the fan 124 to work at a low power. At this time, the rotation speed of the fan 124 is slow, and the cooling efficiency of the liquid-cooled server 10 is low; when the cooling requirement is high, the control device controls the fan 124 to work at a high power. At this time, the rotation speed of the fan 124 is fast, and the cooling efficiency of the liquid-cooled server 10 is high.

[0100] In some embodiments, the temperature detection module is arranged in the first chassis 11, and the temperature detection module is close to the motherboard, so as to more accurately judge the cooling requirement of the motherboard. In one embodiment, the temperature detection module can be integrally arranged on the motherboard.

[0101] In the embodiments of the present disclosure, the control device can control the power of the fan, so as to meet the cooling requirements in different usage scenarios.

[0102] Next, a specific example is used to introduce the liquid-cooled server in the embodiments of the present disclosure.

[0103] See Figures 1 to 5As shown in the figure, the liquid-cooled server 10 includes a first chassis 11, a second chassis 12, a water inlet pipe 13, and a water outlet pipe 14. The first chassis 11 includes a first top plate, a first bottom plate, and a plurality of first side plates connecting the first top plate and the first bottom plate. The first top plate, the first bottom plate, and the plurality of first side plates enclose a first accommodating cavity, and a main board, a control device, a power supply module, a temperature detection device, and a cooling pipe are accommodated in the first accommodating cavity. Among them, among the plurality of first side plates, there is a first back plate 113, and a water outlet 111 and a water inlet 112 are formed on the first back plate 113. The water outlet 111 is communicated with one end of the cooling pipe, and the water inlet 112 is communicated with the other end of the cooling pipe. A power interface, a power external switch, a control device interface, etc. are also provided on the first back plate 113.

[0104] The second chassis 12 includes a heat dissipation top plate 127, a second bottom plate, and a plurality of second side plates. The first ends of the plurality of second side plates are connected to the second bottom plate, and the second ends of the plurality of second side plates are connected to the heat dissipation top plate 127. The heat dissipation top plate 127 is attached to the first bottom plate. The second bottom plate, the plurality of second side plates, and the heat dissipation top plate 127 enclose a second accommodating cavity, and a heat dissipation component is accommodated in the second accommodating cavity. The heat dissipation component includes a water pump 122 and a first heat dissipation sub-pipe 1211 and a second heat dissipation sub-pipe 1212 connected to the water pump 122; the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 are connected in parallel. Among them, among the plurality of second side plates, there is a second back plate 123, and the orientation of the second back plate 123 is the same as that of the first back plate 113. An assembly hole is formed on the second back plate 123, and a set (3) of fans are assembled in the assembly hole, and the air outlet of the fan faces the heat dissipation component (or the second panel 125). A first through hole and a second through hole are also formed on the second back plate 123. One end of the water inlet pipe 13 is communicated with the water outlet 111, and the other end passes through the first through hole and is communicated with the water pump 122, the water inlet of the first heat dissipation sub-pipe 1211, and the water inlet of the second heat dissipation sub-pipe 1212. One end of the water outlet pipe 14 is communicated with the water inlet 112, and the other end passes through the second through hole and is communicated with the water outlet of the first heat dissipation sub-pipe 1211 and the water outlet of the second heat dissipation sub-pipe 1212. A ventilation port 126 is provided on the second panel 125 opposite to the second back plate 123.

[0105] It can be understood that the cooling pipe, the water inlet pipe 13, the water pump 122, the first heat dissipation sub-pipe 1211, the second heat dissipation sub-pipe 1212 and the water outlet pipe 14 are connected to form a medium loop, and a cooling medium circulates in the medium loop. In the medium loop, the cooling medium in the cooling pipe exchanges heat with the heat load generated by the main board. The water pump 122 controls the cooled cooling medium to reach the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 through the water outlet 111 and the water inlet pipe 13. The cooled cooling medium exchanges heat with the air in the second chassis 12 in the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 and then cools down. The water pump 122 controls the cooled cooling medium to be input into the cooling pipe again through the water outlet pipe 14 and the water inlet 112, and cycles in this way.

[0106] It can be understood that the water outlet 111 and the water inlet 112 on the first chassis are arranged on the first backplane 113, and the first through hole and the second through hole on the second chassis 12 are arranged on the second backplane 123, so that the water inlet pipe 13 and the water outlet pipe 14 will not affect the heat spreader 127 in the second chassis 12 during the process of connecting the heat dissipation component and the cooling pipe, thereby enabling the liquid-cooled server to be compatible with multiple liquid-cooled heat dissipation solutions at the same time.

[0107] In the embodiment of the present disclosure, the liquid-cooled server is equipped with a liquid-cooled heat dissipation system, which can operate stably in different application scenarios, thereby effectively reducing the equipment cost and saving space.

[0108] After considering the specification and practicing the invention disclosed herein, those skilled in the art will readily conceive of other embodiments of the present disclosure. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure, which follow the general principles of the present disclosure and include the common general knowledge or conventional technical means in the technical field not disclosed by the present disclosure. The specification and the embodiments are only regarded as exemplary, and the true scope and spirit of the present disclosure are pointed out by the following claims.

[0109] It should be understood that the present disclosure is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.

Claims

1. A liquid-cooled server, characterized in that Comprising: A first chassis, in which a main board and a cooling pipeline are disposed; The cooling pipeline is in contact with the main board; A second chassis, disposed opposite to the first chassis; a heat dissipation component is disposed in the second chassis, and the heat dissipation component is communicated with the cooling pipeline to form a medium loop, and a cooling medium circulates in the medium loop; Wherein, in the medium loop, the cooling medium in the cooling pipeline exchanges heat with the heat load generated by the main board, and the cooled cooling medium after heat exchange is input into the heat dissipation component for cooling, and the cooled cooling medium is input into the cooling pipeline again.

2. The liquid-cooled server according to claim 1, wherein The heat dissipation component includes: a water pump and a heat dissipation pipeline connected to the water pump; the water pump, the heat dissipation pipeline and the cooling pipeline form the medium loop; Wherein, in the medium loop, the water pump controls the cooled cooling medium after heat exchange to be input into the heat dissipation pipeline for cooling, and controls the cooled cooling medium to be input into the cooling pipeline again.

3. The liquid-cooled server according to claim 2, characterized in that The heat dissipation pipeline includes: at least two heat dissipation sub-pipelines, the at least two heat dissipation sub-pipelines are connected in parallel, and each heat dissipation sub-pipeline in the at least two heat dissipation sub-pipelines is connected to the water pump; Wherein, in the medium loop, the water pump controls the cooled cooling medium after heat exchange to be simultaneously input into the at least two heat dissipation sub-pipelines for cooling, and controls the cooled cooling medium to be input into the cooling pipeline again.

4. The liquid-cooled server according to claim 2 or 3, characterized in that, The heat dissipation pipeline includes: a heat dissipation pipe body and heat dissipation fins sleeved on the outer periphery of the heat dissipation pipe body; Wherein, the cooled cooling medium after heat exchange is input into the heat dissipation pipe body, and secondary heat exchange is performed with the external air through the heat dissipation fins.

5. The liquid-cooled server according to claim 2 or 3, characterized in that, An outlet and an inlet are provided on the first chassis; two ends of the cooling pipeline are respectively communicated with the outlet and the inlet; The liquid-cooled server further includes: an inlet pipe and an outlet pipe; one end of the inlet pipe is connected to the outlet, and the other end is connected to the first end of the heat dissipation pipeline; one end of the outlet pipe is connected to the inlet, and the other end is connected to the second end of the heat dissipation pipeline; the inlet pipe, the water pump, the heat dissipation pipeline, the outlet pipe and the cooling pipeline form the medium loop; Wherein, the cooled cooling medium after heat exchange is input into the heat dissipation pipeline through the outlet and the inlet pipe; the cooled cooling medium after cooling is input into the cooling pipeline again through the outlet pipe and the inlet.

6. The liquid-cooled server according to claim 5, wherein, The first chassis is formed by enclosing a first top plate, a first bottom plate and a plurality of first side plates connecting the first top plate and the first bottom plate, and the outlet and the inlet are provided on the first back plate among the plurality of first side plates; The second chassis includes: a second bottom plate and a plurality of second side plates, wherein the plurality of second side plates are connected end to end to form an annular structure, a first end of the plurality of second side plates is connected to the second bottom plate, and a second end of the plurality of second side plates is connected to the first bottom plate; a first through hole and a second through hole are provided on the second back plate among the plurality of second side plates; Wherein, the water inlet pipe passes through the first through hole and is connected to the water outlet, and the water outlet pipe passes through the second through hole and is connected to the water inlet.

7. The liquid-cooled server according to claim 6, wherein The second chassis further includes: a heat spreader top plate, wherein the heat spreader top plate is attached to the first bottom plate, and the second ends of the plurality of second side plates are connected by connecting the heat spreader top plate and the first bottom plate.

8. The liquid-cooled server according to claim 1, wherein An assembly hole is formed in the second chassis; at least one fan is assembled in the assembly hole, and the air outlet of each fan in the at least one fan faces the heat dissipation component; Wherein, the air in the second chassis exchanges heat with the cooling medium after heat exchange in the heat dissipation component and then heats up, and the fan cools the heated air in the second chassis.

9. The liquid-cooled server according to claim 1, wherein A control device and a power supply module are further accommodated in the first chassis, and the power supply module is connected to the water pump and the fan; The control device is configured to control the power supply module to supply power to the water pump and / or the fan.

10. The liquid-cooled server according to claim 9, wherein, The liquid-cooled server further includes: a temperature detection module, and the temperature detection module is disposed in the first chassis or the second chassis; The control device is further configured to control the power of the fan according to the temperature detected by the temperature detection module.

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