Power supply system and server system

Abstract

The invention discloses a power supply system and a server system, and relates to the technical field of power supply, the power supply system comprises a server mainboard, a front window backboard, a plurality of rear window backboards and a heat dissipation equipment board; a power supply connector, a front window backboard connector and a heat dissipation equipment board connector are arranged on the server mainboard; the server mainboard is connected with the front window backboard through the front window backboard connector, the server mainboard is connected with the heat dissipation equipment board through the heat dissipation equipment board connector, and the server mainboard is directly and / or indirectly connected with the plurality of rear window backboards; and the power supply connector is used for connecting a server power supply and obtaining target voltage from the server power supply to supply power to the front window backboard, the plurality of rear window backboards and the heat dissipation equipment board. Through the server mainboard processing method and device, the technical problem that the area of the server mainboard is too large in the prior art is solved, and the technical effect of reducing the area of the server mainboard is achieved.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and particularly to a power supply system and a server system. Background Art

[0002] The server motherboard is the core component of a server. It is like the brain of the server, carrying the connection and data transmission of key components such as the CPU (Central Processing Unit), and determining the performance, stability, and expandability of the server. Its quality and design directly affect the operating efficiency and data processing ability of the server, and it is the basis for building an efficient and reliable server system. However, the increasingly complex functions of the server motherboard have led to an increasingly large area of the server motherboard. However, an overly large server motherboard may cause an increase in the motherboard wiring distance, thereby causing signal delay or attenuation, affecting the efficiency and stability of data transmission. At the same time, it is also more difficult to repair and upgrade large motherboards. Summary of the Invention

[0003] This application provides a power supply system and a server system to at least solve the problem of the overly large area of the server motherboard in the related art.

[0004] This application provides a power supply system, including: a server motherboard, a front window backplane, a plurality of rear window backplanes, and a heat dissipation device board; a power connector, a front window backplane connector, and a heat dissipation device board connector are provided on the server motherboard; the server motherboard is connected to the front window backplane through the front window backplane connector, the server motherboard is connected to the heat dissipation device board through the heat dissipation device board connector, and the server motherboard is directly and / or indirectly connected to a plurality of rear window backplanes; the power connector is used to connect to the server power supply and obtain a target voltage from the server power supply to supply power to the front window backplane, the plurality of rear window backplanes, and the heat dissipation device board.

[0005] This application also provides a server system, including: a plurality of storage devices, a heat dissipation device, a server power supply, and the aforementioned power supply system, wherein the plurality of storage devices are connected to the front window backplane and the plurality of rear window backplanes in the power supply system, the heat dissipation device is connected to the heat dissipation device board in the power supply system, and the server power supply is connected to the power connector on the server motherboard in the power supply system.

[0006] Through this application, the power supply system includes a server motherboard, a front window backplane, multiple rear window backplanes, and a heat dissipation device board. A power connector, a front window backplane connector, and a heat dissipation device board connector are provided on the server motherboard. The server motherboard is connected to the front window backplane through the front window backplane connector, and the server motherboard is connected to the heat dissipation device board through the heat dissipation device board connector. The server motherboard is directly and / or indirectly connected to multiple rear window backplanes. The power connector is used to connect to the server power supply and obtain a target voltage from the server power supply to supply power to the front window backplane, multiple rear window backplanes, and the heat dissipation device board. In the power supply system of this application, a front window backplane, a rear window backplane, and a heat dissipation device board are provided, and some components on the server motherboard are transferred to the front window backplane, the rear window backplane, and the heat dissipation device board, reducing the area of the server motherboard. Therefore, the technical problem of the too large area of the server motherboard in the related art can be solved, and the technical effect of reducing the area of the server motherboard can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0008] Figure 1 is the architecture of the power supply system according to the embodiment of the present application Figure 1 ;

[0009] Figure 2 is the architecture of the power supply system according to the embodiment of the present application Figure 2 ;

[0010] Figure 3 is the architecture of the power supply system according to the embodiment of the present application Figure 3 ;

[0011] Figure 4 is the architecture of the power supply system according to the embodiment of the present application Figure 4 ;

[0012] Figure 5 is the architecture of the power supply system according to the embodiment of the present application Figure 5 ;

[0013] Figure 6 is the architecture of the power supply system according to the embodiment of the present application Figure 6 ;

[0014] Figure 7 is the architecture of the power supply system according to the embodiment of the present application Figure 7 ;

[0015] Figure 8is the architecture of the power supply system according to an embodiment of the present application Figure 8 ;

[0016] Figure 9 is the architecture of the power supply system according to an embodiment of the present application Figure 9 ;

[0017] Figure 10 is the architecture of the power supply system according to an embodiment of the present application Figure 10 ;

[0018] Figure 11 is the architecture of the power supply system according to an embodiment of the present application Figure 10 One;

[0019] Figure 12 is a schematic diagram of a server system according to an embodiment of the present application. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0021] It should be noted that in the description of the present application, the terms "including", "comprising" or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article or device including a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0022] To enable those skilled in the art of this technology to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.

[0023] In this embodiment, a power supply system is provided, Figure 1 is the architecture of the power supply system according to an embodiment of the present application Figure 1 , such as Figure 1As shown, the power supply system includes: a server motherboard, a front window backplane, a plurality of rear window backplanes, and a heat dissipation device board; a power connector, a front window backplane connector, and a heat dissipation device board connector are provided on the server motherboard; the server motherboard is connected to the front window backplane through the front window backplane connector, the server motherboard is connected to the heat dissipation device board through the heat dissipation device board connector, and the server motherboard is directly and / or indirectly connected to the plurality of rear window backplanes; the power connector is used to connect to the server power supply and obtain a target voltage from the server power supply to supply power to the front window backplane, the plurality of rear window backplanes, and the heat dissipation device board.

[0024] Through the above power supply system, the power supply system includes a server motherboard, a front window backplane, a plurality of rear window backplanes, and a heat dissipation device board. A power connector, a front window backplane connector, and a heat dissipation device board connector are provided on the server motherboard. The server motherboard is connected to the front window backplane through the front window backplane connector, the server motherboard is connected to the heat dissipation device board through the heat dissipation device board connector, and the server motherboard is directly and / or indirectly connected to the plurality of rear window backplanes. The power connector is used to connect to the server power supply and obtain a target voltage from the server power supply to supply power to the front window backplane, the plurality of rear window backplanes, and the heat dissipation device board. In the power supply system of the present application, a front window backplane, a rear window backplane, and a heat dissipation device board are provided, and some components on the server motherboard are transferred to the front window backplane, the rear window backplane, and the heat dissipation device board, reducing the area of the server motherboard. Therefore, the technical problem of the too large area of the server motherboard in the related art can be solved, and the technical effect of reducing the area of the server motherboard can be achieved.

[0025] Optionally, in this embodiment, it is worth noting that Figure 1 The relative setting position of the shown heat dissipation device board is only an example. The heat dissipation device board in the present application can be, but is not limited to, arranged on the same side of the front window backplane, or can be, but is not limited to, arranged on the same side of the rear window backplane, or arranged in other positions. The present application does not limit this.

[0026] Optionally, in this embodiment, the power supply system can be, but is not limited to, including a server motherboard, a front window backplane, a plurality of rear window backplanes, and a heat dissipation device board, and the power supply system can be, but is not limited to, used to supply power to various expansion boards and heat dissipation devices in the server.

[0027] Optionally, in this embodiment, the server motherboard may, but is not limited to, refer to the server system motherboard, which is usually located at the center of the server chassis and is the core and foundation of the internal hardware of the server. The server motherboard is the connection point and communication center for all hardware components, including the processor (CPU), memory, hard disk drive, power management unit, network interface card, etc. These components are connected and communicate through various slots and interfaces on the motherboard. The design and quality of the server motherboard directly affect the stability of the system and the data processing performance. It needs to support high-speed data transmission, efficient power management, and complex thermal design to ensure the stable operation of the server under high load. The server motherboard is usually designed with redundancy and hot-swap functions, such as supporting redundant power supplies, hot-swap hard disks, and network interfaces, which are crucial for improving the availability and maintainability of the server.

[0028] Optionally, in this embodiment, the server motherboard may, but is not limited to, include the following components:

[0029] Central Processing Unit: The server motherboard may, but is not limited to, support multi-core high-end processors for performing the core computing tasks of the server;

[0030] Memory Slots: The server motherboard may, but is not limited to, be equipped with a large number of DDR (Double Data Rate) memory slots, supporting high-capacity and high-performance memory modules;

[0031] Network Interfaces: The server motherboard may, but is not limited to, integrate multi-port network controllers, supporting gigabit or 10-gigabit networks. The server motherboard may also, but is not limited to, be equipped with fiber optic interfaces;

[0032] Power Connectors: Used to receive external power, which may, but is not limited to, include main power connectors and auxiliary power connectors, supporting redundant power input;

[0033] Expansion Slots: The server motherboard may, but is not limited to, be provided with expansion slots. For example, the server motherboard may, but is not limited to, be provided with PCIe (Peripheral Component Interconnect Express) slots for installing various expansion cards;

[0034] Monitoring and Management Devices: The server motherboard may, but is not limited to, be provided with monitoring and management devices. For example, the server motherboard may, but is not limited to, be provided with a BMC (Baseboard Management Controller) for monitoring the server status and providing remote management functions.

[0035] Optionally, in this embodiment, the heat dissipation device board may, but is not limited to, refer to a board card deployed with heat dissipation devices.

[0036] Optionally, in this embodiment, the heat dissipation device board may but is not limited to include a fan board. One or more fans may but are not limited to be integrated on the fan board for heat dissipation by air convection. The fan may but is not limited to be powered by the main board and its rotation speed is controlled by a PWM (Pulse Width Modulation) signal to meet the requirements of different heat loads.

[0037] Optionally, in this embodiment, the heat dissipation device board may also but is not limited to include a water-cooling board. The water-cooling board may but is not limited to include a water pump and a series of water channels or heat exchangers. The water pump needs to be driven by electricity to push the coolant to circulate. After absorbing heat, the coolant will be transported to an external radiator (usually located outside or on the top of the server) for cooling and then recycled back to the heat dissipation board.

[0038] Optionally, in this embodiment, the heat dissipation device board may also but is not limited to include a hybrid heat dissipation device board, which combines the advantages of air cooling and water cooling. The hybrid heat dissipation device board uses both a fan and coolant in one system. The fan helps the coolant dissipate heat faster, while the coolant is responsible for transferring heat from key components such as the CPU. The entire system requires power support, including the fan and the coolant circulation system.

[0039] Optionally, in this embodiment, compared with the traditional server main board that integrates the heat dissipation device on the server main board, the heat dissipation device board in this application is separated from the server main board, simplifying the complexity of the server main board.

[0040] Optionally, in this embodiment, the front window backplane may but is not limited to be used for the expansion and connection at the front end of the server. In the server structure, the front window backplane may but is not limited to be close to the front panel of the server and is used to connect various front panel devices such as hard disk drives, optical drives, USB (Universal Serial Bus) interfaces, etc. The front window backplane may but is not limited to be connected to the server main board through the front window backplane connector on the server main board to obtain power and data signals. The front window backplane may but is not limited to be the first layer of interface for the server to interact with external devices.

[0041] Optionally, in this embodiment, the rear window backplane may but is not limited to be located at the rear of the server and is used to connect and expand the rear interfaces such as hard disk drives, network interfaces, additional power inputs, rear storage devices, etc. The number and configuration of the rear window backplane may but are not limited to be determined according to the specific requirements of the server. The design of the rear window backplane may but is not limited to focus on the expandability and maintainability at the rear end of the server.

[0042] Optionally, in this embodiment, the front window backplane and the rear window backplane can be, but are not limited to, backplanes connecting storage devices. For example, the front window backplane and the rear window backplane can be, but are not limited to, hard disk backplanes.

[0043] Optionally, in this embodiment, the types and quantities of storage devices allowed to be connected to the front window backplane and the types and quantities of storage devices allowed to be connected to the rear window backplane can be the same or different. For example, the front window backplane and the rear window backplane can be, but are not limited to, both supporting SATA (Serial Advanced Technology Attachment) hard disks and NVMe (Non-Volatile Memory Express) hard disks, or the front window backplane can be, but are not limited to, supporting SATA hard disks and NVMe hard disks, and the rear window backplane can be, but are not limited to, only supporting NVMe hard disks. For example, the front window backplane can be, but are not limited to, supporting the simultaneous connection of 24 storage devices, and the rear window backplane can be, but are not limited to, supporting the simultaneous connection of 12 storage devices.

[0044] Optionally, in this embodiment, the types and quantities of storage devices allowed to be connected to multiple rear window backplanes in this application can be the same or different. For example, there can be, but are not limited to, 3 rear window backplanes, namely rear window backplane 1, rear window backplane 2, and rear window backplane 3. Among them, rear window backplane 1 can be, but are not limited to, allowing the connection of 12 storage devices, rear window backplane 2 can be, but are not limited to, allowing the connection of 4 storage devices, and rear window backplane 3 can be, but are not limited to, allowing the connection of 2 storage devices.

[0045] Optionally, in this embodiment, compared with the traditional server motherboard that integrates storage devices on the server motherboard, this application separates the storage device backplane (including the front window backplane and the rear window backplane) from the server motherboard, simplifying the complexity of the server motherboard.

[0046] Optionally, in this embodiment, a power connector can be, but is not limited to, provided on the server motherboard. The power connector can be, but is not limited to, a key component connecting the server power supply and the server motherboard or other internal components. The power connector can be, but is not limited to, designed with specific pins and contacts for transmitting direct current of different voltage levels, and may also include the transmission of data and control signals. The power connector provided on the server motherboard, in addition to directly powering the motherboard, can also be, but is not limited to, distributing power to other components, such as the front window backplane, the rear window backplane, the heat dissipation device board, etc. In addition, the power connector can also be, but is not limited to, having a locking mechanism to prevent system instability caused by accidental disconnection, and is designed with an anti-fooling function to ensure correct polarity and voltage matching, preventing damage caused by incorrect insertion or reverse insertion.

[0047] Optionally, in this embodiment, the power connector can be used for connecting to a server power supply, but is not limited to this. The server power supply can be, but is not limited to, a PSU (Power Supply Unit) specifically designed for a server system, which is used to convert mains power into a DC voltage suitable for use by internal components of the server. The server power supply can include, but is not limited to, multiple protection mechanisms such as overvoltage, undervoltage, overcurrent, and short - circuit protection to ensure safe operation even in harsh environments. The server power supply can also support, but is not limited to, a redundant configuration, that is, multiple power modules can be installed in the same server. When one power supply fails, the other power modules can still ensure normal power supply to the server, improving the availability of the system.

[0048] Optionally, in this embodiment, the power connector can obtain a target voltage from the server power supply through connection, and supply power to the front window backplane, multiple rear window backplanes, and the heat dissipation device board with the obtained target voltage.

[0049] [[ID=e6]]Optionally, in this embodiment, the target voltage obtained by the power connector from the server power supply can be, but is not limited to, meeting the voltage requirements of components such as the server motherboard, the front window backplane, multiple rear window backplanes, and the heat dissipation device board. The selection and setting of the target voltage can depend on, but are not limited to, the electrical specifications and operating conditions of each component in the system.

[0050] Optionally, in this embodiment, the power connector can obtain the target voltage from the server power supply through inter - board connection. The power connector can supply the obtained target voltage to the front window backplane connector and the heat dissipation device board connector through intra - board connection. The front window backplane connector then supplies the target voltage to the front window backplane through inter - board connection, and the heat dissipation device board connector supplies the target voltage to the heat dissipation device board through inter - board connection. Optionally, the inter - board connection can be implemented by, but is not limited to, rigid or flexible cables, and the intra - board connection can be implemented by, but is not limited to, metal conductor paths on the server motherboard, such as copper foil traces on the server motherboard.

[0051] Optionally, in this embodiment, the server motherboard can be connected to the front window backplane through the front window backplane connector. Optionally, the server motherboard can be connected to the front window backplane by connecting to the third connector on the front window backplane through the front window backplane connector.

[0052] Optionally, in this embodiment, the server motherboard can be connected to the heat dissipation device board through the heat dissipation device board connector. Optionally, the server motherboard can be connected to the heat dissipation device board by connecting to the heat dissipation connector on the heat dissipation device board through the heat dissipation device board connector.

[0053] Optionally, in this embodiment, the server motherboard can be directly and / or indirectly connected to multiple rear window backplanes. Specifically, the server motherboard can be directly connected to all of the multiple rear window backplanes, or the server motherboard can be indirectly connected to all of the multiple rear window backplanes, or it can be directly connected to some of the multiple rear window backplanes and indirectly connected to the remaining rear window backplanes among the multiple rear window backplanes.

[0054] Optionally, in this embodiment, Figure 2 is the architecture of the power supply system according to the embodiment of the present application Figure 2 , as Figure 2 shown, the server motherboard is connected to the front window backplane through the front window backplane connector, the server motherboard is connected to the heat dissipation device board through the heat dissipation device board connector, the server motherboard is connected to the server power supply through the power connector, and the server motherboard is directly connected to all of the multiple rear window backplanes (i.e., rear window backplane 1 - rear window backplane N).

[0055] Optionally, in this embodiment, Figure 3 is the architecture of the power supply system according to the embodiment of the present application Figure 3 , as Figure 3 shown, the heat dissipation device board is connected to the server motherboard by connecting to the heat dissipation device board connector on the server motherboard, the server power supply is connected to the server motherboard by connecting to the power connector on the server motherboard, the front window backplane is connected to the server motherboard by connecting to the front window backplane connector on the server motherboard, rear window backplane 1 - rear window backplane N - 1 are directly connected to the server motherboard, and rear window backplane N is indirectly connected to the server motherboard through the front window backplane.

[0056] Optionally, in this embodiment, Figure 4 is the architecture of the power supply system according to the embodiment of the present application Figure 4 , as Figure 4 shown, the power connector on the server motherboard is connected to the server power supply, the heat dissipation device board connector on the server motherboard is connected to the heat dissipation device board, the front window backplane connector on the server motherboard is connected to the front window backplane, rear window backplane 1 - rear window backplane N are all connected to the front window backplane, and rear window backplane 1 - rear window backplane N are all indirectly connected to the server motherboard.

[0057] Optionally, in this embodiment, Figure 5 is the architecture of the power supply system according to the embodiment of the present application Figure 5 , as Figure 5As shown, the heat dissipation device board is connected to the heat dissipation device board connector, the server power supply is connected to the power connector, the front window backplane is connected to the front window backplane connector, the rear window backplane 1 is connected to the rear window backplane 2, the rear window backplane 2 is connected to the rear window backplane 3, and so on. The rear window backplane N - 1 is connected to the rear window backplane N, and the rear window backplane N is connected to the front window backplane. The rear window backplanes 1 - N are connected to the server motherboard through an indirect connection method.

[0058] As an alternative implementation, the multiple rear window backplanes include: a first backplane, and one or more second backplanes; a first connector is provided on the front window backplane, and one or more second connectors are also provided on the server motherboard; the first backplane is connected to the first connector, and the one or more second backplanes are connected to the one or more second connectors in a one-to-one correspondence.

[0059] Optionally, in this embodiment, the multiple rear window backplanes may but are not limited to including two types of backplanes, namely a first backplane and one or more second backplanes. Among them, one type of backplane, i.e., the first backplane, is connected to the first connector provided on the front window backplane and is indirectly connected to the server motherboard through the front window backplane. The other type of backplane, i.e., the one or more second backplanes, are connected to the one or more second connectors on the server motherboard in a one-to-one correspondence.

[0060] Optionally, in this embodiment, the number of storage devices allowed to be connected by the first backplane and the number of storage devices allowed to be connected by the second backplane may be the same or different. For example, the first backplane may but is not limited to allowing 12 storage devices to be connected, and the second backplane may but is not limited to also allowing 12 storage devices to be connected; or the second backplane may but is not limited to allowing 12 storage devices to be connected, and the second backplane may but is not limited to connecting 4 storage devices.

[0061] Optionally, in this embodiment, the number of storage devices allowed to be connected by each of the multiple second backplanes may be the same or different. For example, the second backplane 1 among the multiple second backplanes allows 12 storage devices to be connected, and the second backplane 2 among the multiple second backplanes may but is not limited to also allowing 12 storage devices to be connected; or the second backplane 1 among the multiple second backplanes allows 12 storage devices to be connected, and the second backplane 2 among the multiple second backplanes may but is not limited to allowing 4 storage devices to be connected.

[0062] Optionally, in this embodiment, Figure 6 is the architecture of the power supply system according to the embodiment of the present application Figure 6 , such as Figure 6As shown, multiple rear window backplanes include a first backplane and three second backplanes (Second Backplane 1, Second Backplane 2, and Second Backplane 3). A first connector is provided on the front window backplane. The first backplane is connected to the front window backplane by connecting to the first connector. Three second connectors (Second Connector 1, Second Connector 2, and Second Connector 3) are provided on the server motherboard. Second Backplane 1 is connected to Second Connector 1, Second Backplane 2 is connected to Second Connector 2, and Second Backplane 3 is connected to Second Connector 3.

[0063] Through the above content, the rear window backplanes are divided into different types and connected through different connectors, enabling the server to flexibly configure the quantity and type of backplanes according to the required expansion capabilities and device types, thereby enhancing the adaptability and expansion capabilities of the system.

[0064] As an alternative implementation, a first quantity of storage device connectors is provided on the first backplane, and a second quantity of storage device connectors is provided on the second backplane; the first quantity is greater than the second quantity.

[0065] Optionally, in this embodiment, it is possible but not limited to determine the rear window backplane with a larger quantity of storage device connectors as the first backplane connected to the front window backplane, and determine the rear window backplane with a smaller quantity of storage device connectors as the second backplane directly connected to the server motherboard. For example, for a power supply system including three rear window backplanes, if 12 storage device connectors are provided on Rear Window Backplane 1, 4 storage device connectors are provided on Rear Window Backplane 2, and 2 storage device connectors are provided on Rear Window Backplane 3, it is possible but not limited to determine Rear Window Backplane 1 as the first backplane, Rear Window Backplane 2 as the second backplane, and Rear Window Backplane 3 as the second backplane as well.

[0066] Optionally, in this embodiment, the storage device connector may be used for connecting a storage device, but is not limited thereto. The storage device connector may be, but is not limited to, a key component for implementing data transmission and power supply between a server motherboard and a storage device (such as a hard disk drive, a solid-state drive, etc.). The storage device connector may be, but is not limited to, responsible not only for connecting the storage device to the server motherboard, but also for signal transmission and power management, ensuring fast data transmission and normal operation of the storage device. There are various types of storage device connectors according to different interface standards and technologies. The storage device connector may be, but is not limited to, including: SATA connectors (SATA is one of the widely used hard disk interfaces, providing a high data transmission rate, and usually using 7-pin or 15-pin connectors to transmit data and power), SAS (Serial Attached SCSI) connectors (SAS connectors are used to connect SCSI (Small Computer System Interface) hard disks, providing a higher data transmission rate and more reliable performance than SATA), NVMe connectors (NVMe connectors are mainly used for solid-state drives, especially PCIe-based high-speed SSDs (Solid State Drives), etc.).

[0067] Optionally, in this embodiment, if the first quantity of the storage device connectors on the first backplane is greater than the second quantity of the storage device connectors on the second backplane, then the wiring resources required for the first backplane are greater than the wiring resources required for the second backplane.

[0068] Based on the above, the rear window backplane that requires more wiring resources is set as the first backplane that indirectly connects to the server motherboard by directly connecting to the front window backplane, and the rear window backplane that requires fewer wiring resources is set as the second backplane that directly connects to the server motherboard. Only connection resources with a smaller specification (smaller pins or thinner connecting wires) need to be provided on the server motherboard to meet the requirement of the second backplane directly connecting to the server motherboard, further saving space on the motherboard.

[0069] As an optional implementation manner, the first backplane includes: a rear window backplane provided with 12 storage device connectors; one or more second backplanes include: a rear window backplane provided with 4 storage device connectors and / or a rear window backplane provided with 2 storage device connectors.

[0070] Optionally, in this embodiment, the first backplane may be, but is not limited to, provided with 12 storage device connectors.

[0071] Optionally, in this embodiment, one or more second backplanes may be, but is not limited to, including a second backplane provided with 4 storage device connectors.

[0072] Optionally, in this embodiment, one or more second backplanes may, but are not limited to, include a second backplane provided with 2 storage device connectors.

[0073] Optionally, in this embodiment, one or more second backplanes may, but are not limited to, include a second backplane A provided with 4 storage device connectors and a second backplane B provided with 2 storage device connectors.

[0074] Optionally, in this embodiment, Figure 7 is the architecture of the power supply system according to the embodiments of the present application Figure 7 , such as Figure 7 shown, the first backplane may, but is not limited to, include a rear window backplane provided with 12 storage device connectors, and one or more second backplanes include: a second backplane A provided with 4 storage device connectors and a second backplane B provided with 2 storage device connectors.

[0075] As an alternative embodiment, a third connector is further provided on the front window backplane, and the third connector is connected to the front window backplane connector.

[0076] Optionally, in this embodiment, as Figure 7 shown, a third connector is further provided on the front window backplane, and the third connector is connected to the front window backplane connector on the server motherboard.

[0077] Optionally, in this embodiment, in the design of the power supply system, the front window backplane connector may, but is not limited to, be used to directly receive the signals and power provided by the server motherboard and further distribute them to various devices on the front window backplane, such as hard disk drives, solid state drives, or other storage units. The third connector, on the other hand, may, but is not limited to, be an additional interface provided on the front window backplane. The third connector may, but is not limited to, establish a connection with the front window backplane connector on the server motherboard. The third connector may, but is not limited to, serve as a secondary distribution point for signals and data, that is, the data signals received from the server motherboard through the front window backplane connector are redistributed through the third connector to multiple storage devices or other components on the front window backplane to achieve effective expansion and distribution of signals. Similarly, the third connector may, but is not limited to, be used for secondary distribution of power to ensure that all devices on the front window backplane can obtain stable power supply.

[0078] As an alternative implementation, there is a first positional difference between the setting position of the first connector on the front window backplane and the setting position of the third connector on the front window backplane. The first positional difference is used to distinguish the first connector and the third connector from the setting positions when blindly plugging the first connector and the third connector; alternatively, there is a first interface difference between the blind plug interfaces of the first connector and the third connector. The first interface difference is used to distinguish the first connector and the third connector from the blind plug interfaces when blindly plugging the first connector and the third connector.

[0079] Optionally, in this embodiment, in order to ensure the assembly efficiency during the assembly of the power supply system, a positional difference or an interface difference may be set, but not limited to these, to help the assembly workers quickly identify the first connector and the third connector and avoid wiring errors.

[0080] Optionally, in this embodiment, there may be a first positional difference, but not limited to this, between the setting position of the first connector on the front window backplane and the setting position of the third connector on the front window backplane. Specifically, the ways to achieve the first positional difference may include, but are not limited to: distinguishing by physical spacing: by setting the first connector and the third connector on the front window backplane to ensure there is sufficient physical spacing between them, and this spacing can be used as a basis for distinction during blind plugging to avoid inserting the wrong connector; or, distinguishing by structural layout: when designing the front window backplane, the first connector and the third connector can be considered to be set at different heights or angles, and the spatial difference is used for blind plugging distinction. For example, one connector may be designed as a straight plug type, while the other is a side plug type.

[0081] Optionally, in this embodiment, as Figure 7 shown, the first connector can be set on one side of the front window backplane and the third connector can be set on the other side of the front window backplane, thereby achieving the first positional difference between the setting position of the first connector and the setting position of the third connector.

[0082] Optionally, in this embodiment, the first positional difference can be used to distinguish the first connector and the third connector from the setting positions when blindly plugging the first connector and the third connector. Through the first positional difference, the assembly workers can quickly identify the first connector and the third connector.

[0083] Optionally, in this embodiment, there may be, but is not limited to, a first interface difference between the blind mating interface of the first connector and the blind mating interface of the third connector, that is, there are significant differences between the blind mating interface of the first connector and the blind mating interface of the third connector. Specifically, the ways to achieve the first interface difference may include, but are not limited to: distinguishing by interface size and shape: designing the first connector and the third connector to have different sizes and shapes, so that they can be distinguished by touch or shape recognition even during blind mating operations; or, distinguishing by color coding: the color coding of the first connector and the third connector or their blind mating interface parts can be used to assist the operator in identification in an environment with insufficient lighting.

[0084] Optionally, in this embodiment, the first interface difference may be used, but is not limited to, to distinguish the first connector and the third connector from the blind mating interface when performing blind mating on the first connector and the third connector. Through the first interface difference, the assembly worker can quickly identify the first connector and the third connector.

[0085] Optionally, in this embodiment, while there may be, but is not limited to, a first position difference between the installation position of the first connector on the front window backplane and the installation position of the third connector on the front window backplane, two blind mating interfaces with a first interface difference may be set for the first connector and the third connector. By adopting a differentiated strategy in terms of position and interface design, a safer, more efficient, and user-friendly hardware system can be created, which not only reduces the difficulty of maintenance and upgrade, but also improves the overall system stability and user experience of the server.

[0086] As an alternative implementation, the third connector is set on one side of a short side of the front window backplane, and the third connector and the front window backplane connector are on the same side in the power supply system; the first connector is set on the other side of the short side of the front window backplane.

[0087] Optionally, in this embodiment, the front window backplane may include, but is not limited to, two short sides and two long sides. The third connector may be set on one side of a short side of the front window backplane, and the first connector may be set on the other side of the short side of the front window backplane, so that the distance between the first connector and the third connector is approximately the length of a long side, forming a first position difference.

[0088] Optionally, in this embodiment, the third connector may be, but is not limited to, set on the same side as the front window backplane connector in the power supply system. As Figure 3 shown, the third connector and the front window backplane connector may be set on the same side of the power supply system, so as to avoid generating overly long connection wires and cross connection wires.

[0089] As an alternative embodiment, the distance between each second connector and the power connector falls within a target distance range, where the upper limit of the target distance range is used to control the current flowing between the second connector and the power connector to be less than or equal to a current threshold, and the lower limit of the target distance range is used to control the interference generated by the second connector on the power connector to be less than an interference threshold.

[0090] Optionally, in this embodiment, the multiple second connectors on the server motherboard can be, but are not limited to, not too far from the power connector and not too close to the power connector. If the distance between the second connector and the power connector is too far, a relatively large current flow, i.e., the in-board current, will be generated between the second connector and the power connector, and there will be too many copper foil connections on the server motherboard. If the distance between the second connector and the power connector is too close, various interferences are likely to occur between the second connector and the power connector, such as interference in position and interference in assembly operations, etc. To reduce copper foil connections and in-board current, and to reduce interference and interference, the distance between the second connector and the power connector needs to be limited within a certain range.

[0091] Optionally, in this embodiment, the distance between each second connector and the power connector can be, but is not limited to, restricted within a target distance range, where the upper limit of the target distance range is used to control the current flowing between the second connector and the power connector to be less than or equal to a current threshold, and the upper limit can be, but is not limited to, 100 mm (millimeter), and the lower limit of the target distance range is used to control the interference generated by the second connector on the power connector to be less than an interference threshold, and the lower limit can be, but is not limited to, 2 mm.

[0092] Optionally, in this embodiment, the target distance range can be, but is not limited to, 2 mm - 100 mm, or with a stricter standard, the target distance range can be, but is not limited to, 3 mm - 100 mm, and the target distance range can also be, but is not limited to, 2 mm - 50 mm, or 2 mm - 70 mm, or 3 mm - 50 mm.

[0093] As an alternative embodiment, the distance between each second connector and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm.

[0094] Optionally, in this embodiment, the target distance range can be, but is not limited to, set to 2 mm - 100 mm.

[0095] As an alternative embodiment, in Figure 7In the power supply system shown, the power supply for the front window backplane can be achieved through the following paths, but is not limited to: the server power supply is connected to the server motherboard, the power connector inputs to the front window backplane connector on the server motherboard, and the backplane connection cable is connected from the third connector to the front window backplane; for the power supply of the first backplane, it can be achieved through the following paths, but is not limited to: after the server power supply is input, it passes through the copper foil of the in-board PCB (Printed Circuit Board), passes through the E-FUSE (Electronic Fuse) to supply power to the front window backplane, and another part of the current passes through the first connector and is output to the first backplane through the cable connecting the first connector and the first backplane to supply power to the first backplane. An E-FUSE is placed on the first backplane to provide power to the first backplane; for the power supply of the second backplane A and the second backplane B, it can be achieved through the following paths, but is not limited to: after the server power supply is input, it passes through the copper foil of the in-board PCB, passes through the E-FUSE, and then passes through the power supply connectors on the second backplane A and the second backplane B respectively to supply power to the second backplane A and the second backplane B; for the power supply of the heat dissipation device board, it can be achieved through the following paths, but is not limited to: after the server power supply is input, it passes through the copper foil of the in-board PCB, passes through the E-FUSE to the heat dissipation device board connector, and then passes through the cable to the heat dissipation connector on the heat dissipation device board. The heat dissipation device board can be, but is not limited to, a fan board, and there can be, but is not limited to, vertical fan connectors on the fan board, so that the fan can be installed on the fan board from top to bottom. In this embodiment, the front window backplane connector and the heat dissipation device board connector on the server motherboard can be, but is not limited to, of the same model and have a strong current-carrying capacity; the two connectors are located on both sides of the server motherboard respectively, and the anti-fooling effect is achieved through the cable position and length. Through the above content, the heat dissipation device board is separated from the server motherboard, which can reduce the size of the server motherboard, is beneficial to reducing the size of the server motherboard, and reduces the cost of the server motherboard PCB board; the front window backplane connector is close to the power connector, reducing the current flow of the front window backplane in the in-board PCB of the server motherboard, which can alleviate the problems of high device density and high current flow pressure on the server motherboard.

[0096] As an alternative implementation, the multiple rear window backplanes include: a third backplane, and multiple fourth backplanes; a first connector is provided on the front window backplane, and a fourth connector is also provided on the server motherboard; the third backplane is connected to the first connector, and the multiple fourth backplanes are connected to the fourth connector; a first number of storage device connectors are provided on the third backplane, and a second number of storage device connectors are provided on the fourth backplane, and the sum of the second numbers of the multiple fourth backplanes is less than or equal to the first number.

[0097] Optionally, in this embodiment, Figure 8 is the architecture of the power supply system according to the embodiment of the present application Figure 8 , such as Figure 8As shown in the figure, multiple rear window backplanes of the power supply system include a third backplane and multiple fourth backplanes (such as fourth backplane A and fourth backplane B). A first connector is provided on the front window backplane, and a fourth connector is provided on the server motherboard. The third backplane is connected to the front window backplane through the first connector, and multiple fourth backplanes are connected to the fourth connector. For example, both fourth backplane A and fourth backplane B are connected to the fourth connector. By integrating multiple connectors of two or more corresponding backplanes into one connector (i.e., the fourth connector), the area of the server motherboard can be further reduced, and the time for assembly workers to find the position of the connector can be reduced.

[0098] Optionally, in this embodiment, the total number of storage device connectors provided on multiple fourth backplanes is less than the number of storage device connectors provided on the third backplane. By connecting the rear window backplane that requires more wiring resources indirectly to the server motherboard and connecting the rear window backplane that requires fewer wiring resources directly to the server motherboard, the area required by the server motherboard can be further reduced.

[0099] As an alternative implementation, the third backplane includes: a rear window backplane provided with 12 storage device connectors; multiple fourth backplanes include: a rear window backplane provided with 4 storage device connectors and a rear window backplane provided with 2 storage device connectors.

[0100] Optionally, in this embodiment, the third backplane may but is not limited to being provided with 12 storage device connectors.

[0101] Optionally, in this embodiment, multiple fourth backplanes may but are not limited to including a fourth backplane provided with 4 storage device connectors and a fourth backplane provided with 2 storage device connectors.

[0102] Optionally, in this embodiment, as Figure 8 shown, the third backplane may but is not limited to including a rear window backplane provided with 12 storage device connectors, and multiple fourth backplanes include: fourth backplane A provided with 4 storage device connectors and fourth backplane B provided with 2 storage device connectors.

[0103] As an alternative implementation, multiple fourth connectors are also provided on the server motherboard; multiple rear window backplanes are connected to the multiple fourth connectors in one-to-one correspondence.

[0104] Optionally, in this embodiment, the power supply system may but is not limited to including three rear window backplanes. Correspondingly, three fourth connectors may but are not limited to be provided on the server motherboard, and the three rear window backplanes are connected to the three fourth connectors in one-to-one correspondence.

[0105] Optionally, in this embodiment, Figure 9 is the architecture of the power supply system according to the embodiment of the present application Figure 9, such as Figure 9 As shown, three fourth connectors are provided on the server motherboard: fourth connector A, fourth connector B, and fourth connector C. Rear window backplane A is correspondingly connected to fourth connector A, rear window backplane B is correspondingly connected to fourth connector B, and rear window backplane C is correspondingly connected to fourth connector C.

[0106] By setting all rear window backplanes to be directly connected to the server motherboard, it is possible to avoid mutual influence between the backplanes and prevent a situation where a failure of one backplane affects the normal operation of other backplanes, reducing the scope of the failure explosion.

[0107] As an optional implementation manner, Figure 10 is the architecture of the power supply system according to the embodiment of the present application Figure 10 , in the power supply system as shown in Figure 10 , the power supply for the heat dissipation device board, front window backplane, rear window backplane, etc. can but is not limited to be directly input from the PSU and then reach the heat dissipation device board, front window backplane, and rear window backplane via connectors and cables. Specifically, after the power connector is input, multiple groups of connectors (including the front window backplane connector, heat dissipation device board connector, and multiple fourth connectors) are directly placed near the power connector. Or it can but is not limited to adding connector interfaces on the power connector body, that is, directly dividing the part for powering the front window backplane, rear window backplane, and heat dissipation device board on the power connector, and the front window backplane, rear window backplane, and heat dissipation device board are directly connected to the corresponding parts on the power connector, further reducing the current flow of the power supply in the motherboard. Through the above settings, the current flow of the daughter board power supply in the motherboard can be reduced, avoiding the current flow requirement of the power supply under the CPU part of the motherboard, which is beneficial to the copper foil planning of the motherboard and the reduction of the motherboard size.

[0108] As an optional implementation manner, a fifth connector is also provided on the server motherboard; multiple rear window backplanes are all connected to the fifth connector.

[0109] Optionally, in this embodiment, it can but is not limited to deploy only one fifth connector on the server motherboard, and multiple rear window backplanes are all connected to this one fifth connector.

[0110] By integrating multiple connectors corresponding to two or more backplanes into one connector (i.e., the fifth connector), it is possible to further reduce the area of the server motherboard and the time for assembly workers to find the position of the connector.

[0111] As an alternative embodiment, the multiple rear window backplanes include: a fifth backplane, and one or more sixth backplanes; a first connector is provided on the front window backplane, a sixth connector and one or more seventh connectors are provided on the fifth backplane; the sixth connector is connected to the first connector, and one or more sixth backplanes are connected to one or more seventh connectors in a one-to-one correspondence.

[0112] Optionally, in this embodiment, it is possible but not limited to set up multiple layers of series connections. It is possible but not limited to connect the front window backplane in series after the fifth backplane, and then use the seventh connector to connect the sixth backplanes in series. The multiple sixth backplanes can be but are not limited to being connected in parallel.

[0113] Optionally, in this embodiment, the power supply system can but is not limited to include two sixth backplanes. Correspondingly, two seventh connectors can but are not limited to be provided correspondingly on the fifth backplane.

[0114] Optionally, in this embodiment, Figure 11 is the architecture of the power supply system according to the embodiment of the present application Figure 10 One, as Figure 11 shown, the rear window backplane includes a fifth backplane and two sixth backplanes (Sixth Backplane A and Sixth Backplane B). The front window backplane is connected to the fifth backplane through the first connector and the sixth connector. Sixth Backplane A is correspondingly connected to the seventh connector A on the fifth backplane, and Sixth Backplane B is correspondingly connected to the seventh connector B on the fifth backplane.

[0115] As an alternative embodiment, the fifth backplane includes: a rear window backplane provided with 12 storage device connectors; the multiple sixth backplanes include: a rear window backplane provided with 4 storage device connectors and a rear window backplane provided with 2 storage device connectors.

[0116] Optionally, in this embodiment, the fifth backplane can but is not limited to be provided with 12 storage device connectors.

[0117] Optionally, in this embodiment, the multiple sixth backplanes can but are not limited to include a sixth backplane provided with 4 storage device connectors and a sixth backplane provided with 2 storage device connectors.

[0118] Optionally, in this embodiment, as Figure 11 shown, the fifth backplane can but is not limited to include a rear window backplane provided with 12 storage device connectors. The multiple sixth backplanes include: Sixth Backplane A provided with 4 storage device connectors and Sixth Backplane B provided with 2 storage device connectors.

[0119] As an alternative embodiment, there is a second positional difference between the setting position of the front window backplane connector on the server motherboard and the setting position of the heat dissipation device board connector on the server motherboard. The second positional difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the setting positions when blindly plugging the front window backplane connector and the heat dissipation device board connector; or, there is a second interface difference between the blind plug interfaces of the front window backplane connector and the heat dissipation device board connector. The second interface difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the blind plug interfaces when blindly plugging the front window backplane connector and the heat dissipation device board connector.

[0120] Optionally, in this embodiment, in order to ensure the assembly efficiency during the assembly of the power supply system, a positional difference or an interface difference can be set, but not limited to, to help the assembly worker quickly identify the front window backplane connector and the heat dissipation device board connector and avoid connection errors.

[0121] Optionally, in this embodiment, there can be, but not limited to, a second positional difference between the setting position of the front window backplane connector on the server motherboard and the setting position of the heat dissipation device board connector on the server motherboard. Specifically, the ways to achieve the second positional difference can include, but not limited to: distinguishing by physical spacing: by setting the front window backplane connector and the heat dissipation device board connector on the server motherboard to ensure there is sufficient physical spacing between them, and this spacing can be used as a basis for distinction during blind plugging to avoid inserting the wrong connector; or, distinguishing by structural layout: when designing the server motherboard, the front window backplane connector and the heat dissipation device board connector can be considered to be set at different heights or angles, and the spatial difference is used for blind plugging distinction. For example, one connector may be designed as a straight plug type, while the other is a side plug type.

[0122] Optionally, in this embodiment, as Figure 7 shown, the front window backplane connector can be set on one side of the server motherboard, and the heat dissipation device board connector can be set on the other side of the server motherboard, thereby achieving the second positional difference between the setting position of the front window backplane connector and the setting position of the heat dissipation device board connector.

[0123] Optionally, in this embodiment, the second positional difference can be used, but not limited to, to distinguish the front window backplane connector and the heat dissipation device board connector from the setting positions when blindly plugging the front window backplane connector and the heat dissipation device board connector. Through the second positional difference, the assembly worker can quickly identify the front window backplane connector and the heat dissipation device board connector.

[0124] Optionally, in this embodiment, the first position difference and the second position difference of the same type may be set, but are not limited to, for example, the first position difference distinguished by physical spacing and the second position difference distinguished by physical spacing may be set. The first position difference and the second position difference of different types may be set, but are not limited to, for example, the first position difference distinguished by physical spacing and the second position difference distinguished by structural layout may be set.

[0125] Optionally, in this embodiment, there may be, but is not limited to, a second interface difference between the blind plug interface of the front window backplane connector and the blind plug interface of the heat dissipation device board connector, that is, there is a significant difference between the blind plug interface of the front window backplane connector and the blind plug interface of the heat dissipation device board connector. Specifically, the ways to achieve the second interface difference may include, but are not limited to: being distinguished by interface size and shape, or being distinguished by color coding.

[0126] Optionally, in this embodiment, the second interface difference may be used to distinguish the front window backplane connector and the heat dissipation device board connector from the blind plug interface when blindly plugging the front window backplane connector and the heat dissipation device board connector. Through the second interface difference, the assembly worker can quickly identify the front window backplane connector and the heat dissipation device board connector.

[0127] Optionally, in this embodiment, the first interface difference and the second interface difference of the same type may be set, but are not limited to, for example, the first interface difference distinguished by interface size and shape and the second interface difference distinguished by interface size and shape may be set. The first interface difference and the second interface difference of different types may be set, but are not limited to, for example, the first interface difference distinguished by interface size and shape and the second interface difference distinguished by color coding may be set.

[0128] Optionally, in this embodiment, while there may be a second position difference between the setting position of the front window backplane connector on the server motherboard and the setting position of the heat dissipation device board connector on the server motherboard, two blind plug interfaces with a second interface difference may be set for the front window backplane connector and the heat dissipation device board connector. By adopting a differential strategy in terms of position and interface design, the difficulty of maintenance and upgrade can be reduced while improving the overall system stability and user experience of the server.

[0129] As an optional implementation manner, the front window backplane connector and the power connector are located on the same side of the server motherboard; the heat dissipation device board connector is located on the opposite side of the front window backplane connector on the server motherboard.

[0130] Optionally, in this embodiment, the front window backplane connector and the power connector can be, but are not limited to, arranged on the same side of the server motherboard to reduce the copper foil connection and the in-board current.

[0131] Optionally, in this embodiment, the heat dissipation device board connector and the front window backplane connector can be, but are not limited to, arranged on different sides of the server, that is, the heat dissipation device board connector and the front window backplane connector are arranged on opposite sides of the server to achieve the second position difference.

[0132] As an alternative embodiment, the distance between the front window backplane connector and the power connector falls within a target distance range. Wherein, the upper limit value of the target distance range is used to control the current flow generated between the front window backplane connector and the power connector to be less than or equal to the current flow threshold, and the lower limit value of the target distance range is used to control the interference generated by the front window backplane connector on the power connector to be less than the interference threshold.

[0133] Optionally, in this embodiment, the front window backplane connector on the server motherboard can be, but is not limited to, neither too far nor too close to the power connector. If the distance between the front window backplane connector and the power connector is too far, a large current flow, i.e., in-board current, will be generated between the front window backplane connector and the power connector, and there will be too many copper foil connections on the server motherboard. If the distance between the front window backplane connector and the power connector is too close, various interferences are likely to occur between the front window backplane connector and the power connector, such as positional interference and interference in assembly operations, etc. In order to reduce the copper foil connection and the in-board current, and in order to reduce interference and interference, the distance between the front window backplane connector and the power connector needs to be limited within a certain range.

[0134] Optionally, in this embodiment, the distance between the front window backplane connector and the power connector can be, but is not limited to, restricted within the target distance range. Wherein, the upper limit value of the target distance range is used to control the current flow generated between the front window backplane connector and the power connector to be less than or equal to the current flow threshold, and the upper limit value can be, but is not limited to, 100 mm. The lower limit value of the target distance range is used to control the interference generated by the front window backplane connector on the power connector to be less than the interference threshold, and the lower limit value can be, but is not limited to, 2 mm.

[0135] Optionally, in this embodiment, the target distance range can be, but is not limited to, 2 mm - 100 mm, or with a more stringent standard, the target distance range can be, but is not limited to, 3 mm - 100 mm, and the target distance range can also be, but is not limited to, 2 mm - 50 mm, or 2 mm - 70 mm, or 3 mm - 50 mm.

[0136] Optionally, in this embodiment, the target distance range for restricting the distance between the front window backplane connector and the power connector and the target distance range for restricting the distance between each second connector and the power connector can be, but are not limited to, the same, or can also be different. For example, the target distance range for restricting the distance between the front window backplane connector and the power connector can be, but is not limited to, set to 2 mm - 50 mm, and the target distance range for restricting the distance between each second connector and the power connector can be set to 2 mm - 70 mm.

[0137] As an optional implementation manner, the distance between the front window backplane connector and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm; the distance between the heat dissipation device board connector and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm; the blind plug interfaces of the front window backplane connector and the heat dissipation device board connector have a second interface difference, and the second interface difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the blind plug interfaces when blind plugging the front window backplane connector and the heat dissipation device board connector.

[0138] Optionally, in this embodiment, the target distance range for restricting the distance between the front window backplane connector and the power connector can be, but is not limited to, set to 2 mm - 100 mm.

[0139] Optionally, in this embodiment, it is also possible to, but is not limited to, restrict the distance between the heat dissipation device board connector and the power connector. The heat dissipation device board connector on the server motherboard can be, but is not limited to, not too far from the power connector and not too close to the power connector. If the distance between the heat dissipation device board connector and the power connector is too far, a relatively large current flow, i.e., the in-board current, will be generated between the heat dissipation device board connector and the power connector, and there will be too many copper foil connections on the server motherboard. If the distance between the heat dissipation device board connector and the power connector is too close, various interferences are likely to occur between the heat dissipation device board connector and the power connector, such as interference in position and interference in assembly operations, etc.

[0140] Optionally, in this embodiment, it is possible to, but is not limited to, restrict the distance between the heat dissipation device board connector and the power connector within a reference distance range. The upper limit value of the reference distance range is used to control the current flow generated between the heat dissipation device board connector and the power connector to be less than or equal to the current flow threshold, and the upper limit value can be, but is not limited to, 100 mm. The lower limit value of the reference distance range is used to control the interference generated by the heat dissipation device board connector to the power connector to be less than the interference threshold, and the lower limit value can be, but is not limited to, 2 mm.

[0141] Optionally, in this embodiment, the reference distance range may be, but is not limited to, 2 mm - 100 mm. Or with a stricter standard, the reference distance range may be, but is not limited to, 3 mm - 100 mm. The reference distance range may also be, but is not limited to, 2 mm - 50 mm, or 2 mm - 70 mm, or 3 mm - 50 mm.

[0142] An embodiment of the present application also provides a server system. Figure 12 It is a schematic diagram of a server system according to an embodiment of the present application, as Figure 12 shown. The server system includes a plurality of storage devices, a heat dissipation device, a server power supply, and the aforementioned power supply system. Among them, the plurality of storage devices are connected to the front window backplane and a plurality of rear window backplanes in the power supply system. The heat dissipation device is connected to the heat dissipation device board in the power supply system. The server power supply is connected to the power connector on the server motherboard in the power supply system.

[0143] Through the server system of the present application, the power supply system in the server system includes a server motherboard, a front window backplane, a plurality of rear window backplanes, and a heat dissipation device board. A power connector, a front window backplane connector, and a heat dissipation device board connector are provided on the server motherboard. The server motherboard is connected to the front window backplane through the front window backplane connector. The server motherboard is connected to the heat dissipation device board through the heat dissipation device board connector. The server motherboard is directly and / or indirectly connected to the plurality of rear window backplanes. The power connector is used to connect the server power supply and obtain a target voltage from the server power supply to supply power to the front window backplane, the plurality of rear window backplanes, and the heat dissipation device board. The power supply system in the present application is provided with a front window backplane, a rear window backplane, and a heat dissipation device board, and transfers some components on the server motherboard to the front window backplane, the rear window backplane, and the heat dissipation device board, reducing the area of the server motherboard. Therefore, the technical problem of the excessively large area of the server motherboard in the related art can be solved, and the technical effect of reducing the area of the server motherboard can be achieved.

[0144] Optionally, in this embodiment, the plurality of storage devices in the server system may be, but are not limited to, key components for data storage. The plurality of storage devices may include, but are not limited to, various types of storage media to provide a suitable data storage solution according to different application requirements and performance requirements. For example, the plurality of storage devices may include, but are not limited to, a plurality of SATA hard disks and a plurality of NVMe hard disks.

[0145] In Figure 12In the server system shown, the storage device can be but is not limited to being connected to the front window backplane and multiple rear window backplanes to achieve efficient data management and scalability. The storage device in the server system can be but is not limited to adopting a high-density storage design to provide a large amount of storage capacity within a limited space. The storage device in the server system can also be but is not limited to supporting the hot-swap function, that is, it can be safely inserted or removed while the server is running without affecting the normal operation of other devices.

[0146] Optionally, in this embodiment, the heat dissipation device can be but is not limited to being responsible for handling the heat generated by hardware such as the CPU, storage device, and power module in the server system, ensuring the temperature stability of the server during high-performance operation and avoiding the degradation or damage of hardware performance caused by overheating.

[0147] Optionally, in this embodiment, the heat dissipation device can be but is not limited to including fans, heat pipes, liquid cooling systems, etc., which can be used alone or in combination to achieve the best heat dissipation effect.

[0148] Optionally, in this embodiment, the heat dissipation device can be but is not limited to a fan. The heat dissipation device board, i.e., the fan board, can be but is not limited to having a vertical fan connector provided on the fan board. The vertical fan connector on the fan board allows the fan to be installed from top to bottom, optimizing the air flow path and improving the heat dissipation efficiency.

[0149] The above has introduced in detail a power supply system and a server system provided by this application. Specific examples are used in this article to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of this application, several improvements and modifications can still be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A power supply system, characterized in that, Comprising: A server motherboard, a front window backplane, a plurality of rear window backplanes, and a heat dissipation device board; A power connector, a front window backplane connector, and a heat dissipation device board connector are provided on the server motherboard; The server motherboard is connected to the front window backplane through the front window backplane connector, the server motherboard is connected to the heat dissipation device board through the heat dissipation device board connector, and the server motherboard is directly and / or indirectly connected to the plurality of rear window backplanes; The power connector is used to connect to a server power supply and obtain a target voltage from the server power supply to supply power to the front window backplane, the plurality of rear window backplanes, and the heat dissipation device board.

2. The power supply system according to claim 1, wherein The plurality of rear window backplanes include: a first backplane, and one or more second backplanes; A first connector is provided on the front window backplane, and one or more second connectors are also provided on the server motherboard; The first backplane is connected to the first connector, and the one or more second backplanes are connected to the one or more second connectors in a one-to-one correspondence.

3. The power supply system according to claim 2, wherein A first number of storage device connectors are provided on the first backplane, and a second number of storage device connectors are provided on the second backplane; The first number is greater than the second number.

4. The power supply system according to claim 2, wherein The first backplane includes: a rear window backplane provided with 12 storage device connectors; The one or more second backplanes include: a rear window backplane provided with 4 storage device connectors and / or a rear window backplane provided with 2 storage device connectors.

5. The power supply system according to claim 2, wherein A third connector is further provided on the front window backplane, and the third connector is connected to the front window backplane connector.

6. The power supply system according to claim 5, wherein There is a first position difference between the setting position of the first connector on the front window backplane and the setting position of the third connector on the front window backplane, and the first position difference is used to distinguish the first connector and the third connector from the setting positions when blindly plugging the first connector and the third connector; or, There is a first interface difference between the blind plug interface of the first connector and the blind plug interface of the third connector, and the first interface difference is used to distinguish the first connector and the third connector from the blind plug interfaces when blindly plugging the first connector and the third connector.

7. The power supply system according to claim 5, wherein The third connector is provided on one side of a short side of the front window backplane, and the third connector and the front window backplane connector are on the same side in the power supply system; The first connector is provided on the other side of the short side of the front window backplane.

8. The power supply system according to claim 2, wherein The distance between each of the second connectors and the power connector falls within a target distance range, where the upper limit value of the target distance range is used to control the current flowing between the second connector and the power connector to be less than or equal to a current threshold value, and the lower limit value of the target distance range is used to control the interference generated by the second connector on the power connector to be less than an interference threshold value.

9. The power supply system according to claim 8, wherein the distance between each of the second connectors and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm.

10. The power supply system according to claim 1, wherein the plurality of rear window backplanes include: a third backplane, and a plurality of fourth backplanes; a first connector is provided on the front window backplane, and a fourth connector is further provided on the server motherboard; the third backplane is connected to the first connector, and the plurality of fourth backplanes are connected to the fourth connector; a first number of storage device connectors are provided on the third backplane, a second number of storage device connectors are provided on the fourth backplane, and the sum of the second numbers of the plurality of fourth backplanes is less than or equal to the first number.

11. The power supply system according to claim 10, wherein the third backplane includes: a rear window backplane provided with 12 storage device connectors; the plurality of fourth backplanes include: a rear window backplane provided with 4 storage device connectors and a rear window backplane provided with 2 storage device connectors.

12. The power supply system according to claim 1, wherein a plurality of fourth connectors are further provided on the server motherboard; the plurality of rear window backplanes are connected to the plurality of fourth connectors in a one-to-one correspondence.

13. The power supply system according to claim 1, wherein a fifth connector is further provided on the server motherboard; the plurality of rear window backplanes are all connected to the fifth connector.

14. The power supply system according to claim 1, wherein the plurality of rear window backplanes include: a fifth backplane, and one or more sixth backplanes; a first connector is provided on the front window backplane, a sixth connector and one or more seventh connectors are provided on the fifth backplane; the sixth connector is connected to the first connector, and the one or more sixth backplanes are connected to the one or more seventh connectors in a one-to-one correspondence.

15. The power supply system according to claim 14, wherein the fifth backplane includes: a rear window backplane provided with 12 storage device connectors; the plurality of sixth backplanes include: a rear window backplane provided with 4 storage device connectors and a rear window backplane provided with 2 storage device connectors.

16. The power supply system according to claim 1, wherein There is a second positional difference between the setting position of the front window backplane connector on the server motherboard and the setting position of the heat dissipation device board connector on the server motherboard. The second positional difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the setting positions when blindly plugging the front window backplane connector and the heat dissipation device board connector; or, The blind plug interfaces of the front window backplane connector and the heat dissipation device board connector have a second interface difference. The second interface difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the blind plug interfaces when blindly plugging the front window backplane connector and the heat dissipation device board connector.

17. The power supply system according to claim 1, wherein The front window backplane connector and the power connector are located on the same side of the server motherboard; The heat dissipation device board connector is located on the opposite side of the front window backplane connector on the server motherboard.

18. The power supply system according to claim 1, wherein The distance between the front window backplane connector and the power connector falls within a target distance range. Among them, the upper limit value of the target distance range is used to control the current passing between the front window backplane connector and the power connector to be less than or equal to a current passing threshold, and the lower limit value of the target distance range is used to control the interference generated by the front window backplane connector on the power connector to be less than an interference threshold.

19. The power supply system according to claim 18, wherein The distance between the front window backplane connector and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm; The distance between the heat dissipation device board connector and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm; The blind plug interfaces of the front window backplane connector and the heat dissipation device board connector have a second interface difference. The second interface difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the blind plug interfaces when blindly plugging the front window backplane connector and the heat dissipation device board connector.

20. A server system, characterized in that, Including: Multiple storage devices, a heat dissipation device, a server power supply, and the power supply system according to any one of claims 1 to 19. Among them, the multiple storage devices are connected to the front window backplane and multiple rear window backplanes in the power supply system, the heat dissipation device is connected to the heat dissipation device board in the power supply system, and the server power supply is connected to the power connector on the server motherboard in the power supply system.

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