Efficient heat dissipation module

Abstract

The invention discloses an efficient heat dissipation module, relates to the technical field of heat exchange and heat dissipation, solves the problem that the temperature in a host is easy to rise due to an existing water-cooling radiator, and comprises a case and a circuit board fixedly mounted on the inner wall of the case, and further comprises an external mounting mechanism, a heat dissipation mechanism and a pressing mechanism, the external mechanism is used for external heat dissipation of the drain pipe, and the external mechanism is mounted at the top of the case; the heat dissipation mechanism is used for intermittently spraying alcohol to the drainage pipe for cooling, and the heat dissipation mechanism is mounted at the top of the case; the pressing mechanism is used for enabling the water cooling device to flexibly abut against a processor of the circuit board, and the pressing mechanism is installed in the water cooling device; through the external mechanism, the temperature of the processor can enter the water cooling device, cooling liquid with heat enters the water drainage pipe from the heat removal connector through the water pump and moves to the position above the top of the case, and the problem that the heat is located in the case is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchange and heat dissipation, and specifically relates to an efficient heat dissipation module. Background Art

[0002] Currently, the power used by computer motherboards is increasing, so the problem of heat generation is also getting higher and higher. Currently, the existing radiators can still solve the problem of rapid cooling at high frequencies. Currently, air cooling or water cooling is usually used for auxiliary heat dissipation in the market. A water-cooled radiator is a device that uses a liquid to be forced to circulate under the drive of a pump to take away the heat of the radiator. The existing Chinese published document (CN106648002B) records a computer heat dissipation structure. By respectively arranging a heat dissipation fan and an air extractor at the top and bottom of the chassis, and the flow directions of the airflows driven by both are the same, the hot air in the installation cavity can be effectively discharged to improve the heat dissipation efficiency. However, most of the above-mentioned water-cooled radiators are installed inside the host computer. After the water pipe dissipates heat from the circuit board, the water pipe will carry out the heat, and the temperature of the water pipe will increase. Since the water pipe is inside the chassis, the temperature inside the chassis will also increase accordingly, reducing the overall heat dissipation efficiency of the chassis. Moreover, all the water pipes being arranged inside the host computer will also reduce the usable space of the host computer. Summary of the Invention

[0003] The purpose of the present invention is to provide an efficient heat dissipation module to solve the problems raised in the above background art.

[0004] To achieve the above purpose, the present invention provides the following technical solutions: An efficient heat dissipation module includes a chassis and a circuit board. A water cooling device is arranged on the surface of the circuit board. A water pump is installed inside the water cooling device. A heat dissipation joint extending to the outside of the water cooling device is fixedly installed at the left end of the water pump. A cold water inlet joint extending to the outside of the water cooling device is fixedly installed at the right end of the water pump. A drain pipe is fixedly installed between the heat dissipation joint and the cold water inlet joint. It further includes an external installation mechanism, a heat dissipation mechanism, and a pressing mechanism. The external installation mechanism is used for externally dissipating heat from the drain pipe and is installed on the top of the chassis; the heat dissipation mechanism is used for intermittently spraying alcohol to cool down the drain pipe and is installed on the top of the chassis; the pressing mechanism is used for making the water cooling device gently press against the processor of the circuit board and is installed inside the water cooling device.

[0005] Preferably, the outer packaging mechanism includes a mounting plate fixedly installed on the top of the chassis. A mounting frame is fixedly connected to the top of the mounting plate. Heat dissipation fins are fixedly installed inside the mounting frame. The drain pipe passes through the mounting plate and is fixedly installed inside the mounting frame. The surface of the heat dissipation fins is in contact with the outer side of the drain pipe, which is used to quickly export the temperature on the surface of the drain pipe. A heat dissipation box is fixedly connected inside the mounting frame. Two symmetrically distributed heat dissipation fans are installed inside the heat dissipation box to dissipate heat from the heat dissipation fins.

[0006] Preferably, the heat dissipation mechanism includes two positioning cylinders symmetrically installed inside the heat dissipation fins. The two positioning cylinders are respectively located directly above the two heat dissipation fans. Through holes for installing the positioning cylinders are provided inside the heat dissipation fins. Positioning frames are fixedly connected between the two ends of the positioning cylinders and the inner side of the mounting frame. A speed reduction gearbox is installed at the output end of the heat dissipation fan. The speed reduction gearbox is fixedly installed inside the positioning cylinder. An installation box is fixedly installed at the top of the positioning frame on the upper side of the positioning cylinder. The output end of the speed reduction gearbox is rotatably installed on the inner wall of the top of the installation box. The output end of the speed reduction gearbox is fixedly connected with a triangular turntable. The output end of the heat dissipation fan slowly rotates the triangular turntable through the speed reduction gearbox. Three pulleys are annularly and equidistantly distributed and rotatably installed on the top of the triangular turntable. A slide plate is arranged outside the triangular turntable and is limited to slide on the inner wall of the installation box. A push groove is provided on the surface of the slide plate. The triangular turntable is located in the push groove. The length of the push groove is greater than the outer diameter of the triangular turntable, so that the pulleys on the triangular turntable push the push groove to move the slide plate. Right-angle grooves are provided on both sides of the push groove. The two right-angle grooves are centrosymmetrically distributed. The inclined surface of the right-angle groove is of an arc structure to provide a moving space for the pulley. A first sliding rod is fixedly connected to the left side of the slide plate. A sliding cavity for the first sliding rod to be limited and slide is provided inside the installation box to provide guidance for the first sliding rod. The first sliding rod extends to the outside of the installation box. An atomizing nozzle is provided on the left side of the mounting frame. A heat dissipation cavity for installing the atomizing nozzle is provided on the left side of the mounting frame. A water storage box for storing alcohol is fixedly installed outside the atomizing nozzle. The water storage box is fixedly installed on the top of the mounting plate. An elastic button for starting the atomizing nozzle is installed on the top of the water storage box to make the atomizing nozzle discharge the alcohol in the water storage box. A pressing block is fixedly connected to the end of the first sliding rod away from the slide plate. The pressing block is in contact with the outer side of the elastic button. The contact surfaces of the pressing block and the elastic button are both of an inclined surface structure, so that the pressing block can push the elastic button downward to start the atomizing nozzle when moving.

[0007] Preferably, the pressing mechanism includes a first heat conducting plate installed inside the water cooling device. A plurality of equally spaced heat conducting fins are fixedly connected to the side of the first heat conducting plate away from the heat dissipation joint. The heat conducting fins dissipate heat from the processor of the circuit board. The heat conducting fins extend to the outside of the water cooling device. An opening for the first heat conducting plate to slide and be limited is provided on the outside of the water cooling device. A second heat conducting plate is fixedly connected to the side of the first heat conducting plate away from the heat conducting fins. An installation cavity for the second heat conducting plate to slide and be limited is provided inside the water cooling device. The outer diameter of the first heat conducting plate is smaller than that of the second heat conducting plate, so that the second heat conducting plate remains inside the water cooling device. A positioning ring is fixedly connected to the inner side of the water cooling device. The surface of the water pump close to the first heat conducting plate is in contact with the surface of the positioning ring, which is convenient for installing the water pump. A tension spring is fixedly connected between the positioning ring and the second heat conducting plate. Four equally spaced fasteners are installed on the outside of the water cooling device for installing the water cooling device on the circuit board. A positioning frame is arranged between the four fasteners. Slide holes for the fasteners to slide and be sleeved are provided on the surface of the positioning frame. Four equally spaced positioning blocks are fixedly connected between the positioning frame and the water cooling device. A plurality of springs are fixedly connected between the positioning frame and the first heat conducting plate. The coolant pumped by the water pump presses the second heat conducting plate, causing the heat conducting fins on the first heat conducting plate to flexibly press the processor of the circuit board.

[0008] Preferably, a second sliding rod is fixedly connected to the side of the sliding plate away from the first sliding rod. A guiding cavity for the second sliding rod to slide and be limited is provided inside the installation box, improving the smoothness of the movement of the sliding plate.

[0009] Preferably, a sleeve frame is fixedly connected to the left side of the installation frame. The sleeve frame is fixedly sleeved on the outside of the atomizing nozzle, facilitating the insertion of the atomizing nozzle into the heat dissipation cavity of the installation frame.

[0010] Preferably, an exhaust port located above the heat dissipation cavity is fixedly installed on the top of the installation frame, facilitating the volatilization of alcohol.

[0011] Preferably, an annular clamping frame is fixedly connected to the side of the positioning ring close to the tension spring. One end of the tension spring is located inside the annular clamping frame, preventing the tension spring from skewing when rebounding.

[0012] Preferably, a plurality of equally spaced limiting strips are fixedly connected to the installation cavity of the water cooling device. Grooves for the limiting strips to slide and be limited are provided on the outside of the second heat conducting plate, enabling the coolant to smoothly move when pressing the second heat conducting plate.

[0013] Preferably, a temperature detection panel is fixedly installed on the side of the water cooling device away from the heat conducting fins, facilitating the detection and observation of the temperature of the circuit board.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: Through the external installation mechanism, the present invention enables the drain pipe to transport the coolant into the water cooling device to dissipate heat from the processor of the circuit board. The temperature of the processor can enter the water cooling device, and the coolant with heat enters the drain pipe from the heat dissipation joint through the water pump and moves above the top of the chassis, solving the problem of heat remaining in the chassis, thereby maintaining the rapid conduction of heat in the chassis.

[0015] Through the heat dissipation mechanism, the present invention uses the method of spraying alcohol to take away the heat on the surface of the drain pipe, improving the cooling efficiency of the coolant. And by using the reciprocating spraying method, the drain pipe is intermittently and circularly cooled, facilitating the user to continuously cool the drain pipe when starting the computer, thereby achieving the effect of efficient heat dissipation.

[0016] Through the pressing mechanism, the present invention uses the method of flexible pressing to press and position the processor of the circuit board, improving the convenience of installing the water cooling device, preventing the problem of improper installation and squeezing the processor, and solving the situation that the water cooling device becomes loose due to the vibration generated during the long-term operation of the computer, improving the durability of the water cooling device, thereby achieving the effects of easy installation and safe heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a schematic diagram of the structure of the water cooling device and the heat dissipation box in the present invention; Figure 3 is a schematic diagram of the structure of the heat dissipation fins and the mounting frame in the present invention; Figure 4 is a schematic diagram of the structure of the mounting box and the mounting bracket in the present invention; Figure 5 is a schematic diagram of the structure of the sliding plate and the triangular turntable in the present invention; Figure 6 is a schematic diagram of the structure of the heat conducting sheet and the positioning frame in the present invention; Figure 7 is a schematic diagram of the structure of the water pump and the first heat conducting plate in the present invention; Figure 8 is Figure 7 an enlarged schematic diagram of area A in Figure 9 is a schematic diagram of the structure of the limiting strip and the second heat conducting plate in the present invention.

[0018] In the figure: 1, chassis; 2, circuit board; 3, external mounting mechanism; 301, mounting plate; 302, mounting frame; 303, heat dissipation fins; 304, heat dissipation box; 305, heat dissipation fan; 4, heat dissipation mechanism; 401, positioning cylinder; 402, positioning frame; 403, reduction gearbox; 404, mounting box; 405, triangular turntable; 406, pulley; 407, slide plate; 408, push groove; 409, right-angled groove; 410, first slide bar; 411, atomizing nozzle; 412, water storage box; 413, elastic button; 414, pressing block; 5, pressing mechanism; 501, first heat conducting plate; 502, heat conducting sheet; 503, positioning ring; 504, tension spring; 505, fastener; 506, positioning frame; 507, positioning block; 508, spring; 509, second heat conducting plate; 6, water cooling device; 7, water pump; 8, heat discharge joint; 9, cold inlet joint; 10, drain pipe; 11, second slide bar; 12, sleeve frame; 13, annular clamping frame; 14, limiting strip; 15, temperature detection panel. Specific embodiments

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention.

[0020] Embodiment 1: Please refer to Figures 1-9 , in the figure, the chassis 1 and the circuit board 2 fixedly installed on the inner wall of the chassis 1 further include: a water cooling device 6 arranged on the surface of the circuit board 2, a water pump 7 installed inside the water cooling device 6, a heat discharge joint 8 fixedly installed at the left end of the water pump 7 and extending outside the water cooling device 6, a cold inlet joint 9 fixedly installed at the right end of the water pump 7 and extending outside the water cooling device 6, and a drain pipe 10 fixedly installed between the heat discharge joint 8 and the cold inlet joint 9 for loading coolant; an external mounting mechanism 3 for externally dissipating heat from the drain pipe 10, the external mounting mechanism 3 being installed on the top of the chassis 1; a heat dissipation mechanism 4 for intermittently spraying alcohol to cool the drain pipe 10, the heat dissipation mechanism 4 being installed on the top of the chassis 1; and a pressing mechanism 5 for making the water cooling device 6 gently press against the processor of the circuit board 2, the pressing mechanism 5 being installed inside the water cooling device 6.

[0021] The outer packaging mechanism 3 includes a mounting plate 301 fixedly installed on the top of the chassis 1. A mounting frame 302 is fixedly connected to the top of the mounting plate 301. Heat dissipation fins 303 are fixedly installed inside the mounting frame 302. The drain pipe 10 passes through the mounting plate 301 and is fixedly installed inside the mounting frame 302. The surface of the heat dissipation fins 303 is in contact with the outer side of the drain pipe 10, which is used to quickly export the temperature on the surface of the drain pipe 10. A heat dissipation box 304 is fixedly connected inside the mounting frame 302. Two symmetrically distributed heat dissipation fans 305 are installed inside the heat dissipation box 304 to dissipate heat from the heat dissipation fins 303. The user fixedly installs the mounting plate 301 on the chassis 1, which is convenient for fixing the water cooling device 6 on the circuit board 2. The coolant in the drain pipe 10 enters the water cooling device 6 through the cold inlet joint 9. The water cooling device 6 can then take away the heat generated by the processor on the circuit board 2. And the water pump 7 discharges the heated coolant into the drain pipe 10 through the heat discharge joint 8. The coolant with heat can be transported through the drain pipe 10 to the inside of the mounting frame 302. The heat dissipation fins 303 conduct the heat on the outer side of the drain pipe 10, and the heat dissipation fans 305 dissipate heat from the heat dissipation fins 303. Thus, the heat is conducted and discharged from inside the chassis 1. After the coolant cools down, it enters the water cooling device 6 again to achieve cyclic heat dissipation, thereby facilitating the rapid conduction of heat and reducing the overall temperature inside the chassis 1.

[0022] The heat dissipation mechanism 4 includes two positioning cylinders 401 symmetrically installed inside the heat dissipation fins 303. The two positioning cylinders 401 are respectively located directly above the two cooling fans 305. Through holes for installing the positioning cylinders 401 are provided inside the heat dissipation fins 303. Positioning frames 402 are fixedly connected between both ends of the positioning cylinders 401 and the inner side of the installation frame 302. A reduction gearbox 403 is installed at the output end of the cooling fan 305, and the reduction gearbox 403 is fixedly installed inside the positioning cylinder 401. At the top of the positioning frame 402 on the upper side of the positioning cylinder 401, an installation box 404 is fixedly installed. The output end of the reduction gearbox 403 is rotatably installed on the inner wall of the top of the installation box 404. The output end of the reduction gearbox 403 is fixedly connected with a triangular turntable 405. The output end of the cooling fan 305 slowly rotates the triangular turntable 405 through the reduction gearbox 403. Three pulleys 406 distributed at equal intervals in a ring are rotatably installed on the top of the triangular turntable 405. A sliding plate 407 is arranged on the outer side of the triangular turntable 405 and is limited to slide on the inner wall of the installation box 404. A pushing groove 408 is provided on the surface of the sliding plate 407. The triangular turntable 405 is located in the pushing groove 408. The length of the pushing groove 408 is greater than the outer diameter of the triangular turntable 405, so that the pulleys 406 on the triangular turntable 405 push the pushing groove 408 to move the sliding plate 407. Right-angle grooves 409 are provided on both sides of the pushing groove 408. The two right-angle grooves 409 are symmetrically distributed about the center. The inclined surface of the right-angle groove 409 is of an arc structure, providing a moving space for the pulleys 406. A first sliding rod 410 is fixedly connected to the left side of the sliding plate 407. A sliding cavity for limiting the sliding of the first sliding rod 410 is provided inside the installation box 404, providing guidance for the first sliding rod 410. The first sliding rod 410 extends to the outside of the installation box 404. An atomizing nozzle 411 is provided on the left side of the installation frame 302. A heat dissipation cavity for installing the atomizing nozzle 411 is provided on the left side of the installation frame 302. A water storage box 412 for storing alcohol is fixedly installed on the outer side of the atomizing nozzle 411. The water storage box 412 is fixedly installed on the top of the installation plate 301. An elastic button 413 for starting the atomizing nozzle 411 is installed on the top of the water storage box 412. When the elastic button 413 is pressed downward, the atomizing nozzle 411 can be opened through the water storage box 412 to spray the alcohol inside the water storage box 412. The end of the first sliding rod 410 away from the sliding plate 407 is fixedly connected with a pressing block 414. The pressing block 414 is in contact with the outer side of the elastic button 413. The contact surfaces of the pressing block 414 and the elastic button 413 are both of inclined surface structures, so that the pressing block 414 can push the elastic button 413 downward to start the atomizing nozzle 411 when moving; When the cooling fan 305 operates, the output end of the cooling fan 305 drives the triangular turntable 405 to rotate slowly through the reduction gear 403. The triangular turntable 405 drives the three pulleys 406 to move in a circular motion within the push groove 408 of the sliding plate 407. When one of the pulleys 406 contacts the left side of the push groove 408, it pushes the sliding plate 407 to move leftward along the inner side of the mounting box 404, and the adjacent pulley 406 enters the right-angle groove 409. The sliding plate 407 can drive the pressing block 414 on the first sliding rod 410 to move along the inclined surface of the elastic button 413, causing the elastic button 413 to move downward to open the atomizing nozzle 411. The atomizing nozzle 411 sprays the alcohol in the water storage box 412 onto the drain pipe 10 for rapid heat dissipation and temperature reduction. At this time, the pulley 406 in contact with the left side of the push groove 408 enters the right-angle groove 409 as the triangular turntable 405 rotates, and another pulley 406 contacts the right side of the push groove 408, which can push the sliding plate 407 to move rightward, and the pressing block 414 can move away from the elastic button 413, thereby realizing the reciprocating movement of the sliding plate 407, and repeatedly opening and closing the atomizing nozzle 411 to achieve the effect of continuous and efficient heat dissipation.

[0023] The pressing mechanism 5 includes a first heat-conducting plate 501 installed inside the water-cooling device 6. On the side of the first heat-conducting plate 501 away from the heat-dissipating joint 8, a plurality of equally spaced heat-conducting fins 502 are fixedly connected. The processor of the circuit board 2 is cooled through the heat-conducting fins 502. The heat-conducting fins 502 extend to the outside of the water-cooling device 6. An opening for the first heat-conducting plate 501 to be limited and slide is provided on the outside of the water-cooling device 6. A second heat-conducting plate 509 is fixedly connected to the side of the first heat-conducting plate 501 away from the heat-conducting fins 502. An installation cavity for the second heat-conducting plate 509 to be limited and slide is provided inside the water-cooling device 6. The outer diameter of the first heat-conducting plate 501 is smaller than the outer diameter of the second heat-conducting plate 509, so that the second heat-conducting plate 509 is kept inside the water-cooling device 6. A positioning ring 503 is fixedly connected to the inner side of the water-cooling device 6. The surface of the water pump 7 close to the first heat-conducting plate 501 contacts the surface of the positioning ring 503, which is convenient for installing the water pump 7. A tension spring 504 is fixedly connected between the positioning ring 503 and the second heat-conducting plate 509. Four equally spaced fasteners 505 are installed on the outside of the water-cooling device 6 for installing the water-cooling device 6 on the circuit board 2. A positioning frame 506 is arranged between the four fasteners 505. A sliding hole for the fasteners 505 to slide and be sleeved is provided on the surface of the positioning frame 506. Four equally spaced positioning blocks 507 are fixedly connected between the positioning frame 506 and the water-cooling device 6. A plurality of springs 508 are fixedly connected between the positioning frame 506 and the first heat-conducting plate 501. The coolant pumped by the water pump 7 presses the second heat-conducting plate 509, causing the heat-conducting fins 502 on the first heat-conducting plate 501 to flexibly press the processor of the circuit board 2; The user fixedly installs the water cooling device 6 on the circuit board 2 through four fasteners 505. By using the elasticity of the spring 508, the heat conducting sheet 502 is attached to the surface of the processor, preventing the user from pressing too hard on the processor due to improper force. When the user turns on the computer, the water pump 7 circulates and conveys the coolant. The coolant enters the water cooling device 6 and presses the second heat conducting plate 509. The second heat conducting plate 509 pulls the extension spring 504 to extend and press the spring 508. By using the elasticity of the spring 508 and the extension spring 504, the second heat conducting plate 509 drives the heat conducting sheet 502 on the first heat conducting plate 501 to perform flexible pressing on the processor, and can prevent the loosening between the heat conducting sheet 502 and the processor during the long-term operation of the computer, thus achieving the effects of convenient installation and durability of the heat conducting sheet 502.

[0024] Working principle: First, the user fixedly installs the mounting plate 301 on the chassis 1. Subsequently, the water cooling device 6 is fixed on the circuit board 2 by four fasteners 505. By the elasticity of the spring 508, the heat conducting sheet 502 is attached to the surface of the processor. Then, the user turns on the computer and the water pump 7. The water pump 7 causes the coolant in the drain pipe 10 to enter the water cooling device 6 through the cold inlet joint 9. The coolant presses the second heat conducting plate 509, and the second heat conducting plate 509 pulls the extension spring 504 to extend and press the spring 508. By the elasticity of the spring 508 and the extension spring 504, the second heat conducting plate 509 drives the heat conducting sheet 502 on the first heat conducting plate 501 to flexibly press the processor. The heat conducting sheet 502, the first heat conducting plate 501 and the second heat conducting plate 509 take away the heat generated by the processor on the circuit board 2. And the water pump 7 discharges the heated coolant into the drain pipe 10 through the heat discharge joint 8. The coolant with heat enters the drain pipe 10 again through the heat discharge joint 8 and is conveyed and moved into the mounting frame 302. The heat dissipation fins 303 conduct the heat on the outer side of the drain pipe 10, and the heat dissipation fan 305 dissipates the heat of the heat dissipation fins 303. Thus, the heat is conducted and discharged from the inside of the chassis 1. At the same time, the output end of the heat dissipation fan 305 drives the triangular turntable 405 to rotate slowly through the reduction gear 403. The triangular turntable 405 drives the three pulleys 406 to move in a circular motion in the push groove 408 of the sliding plate 407. When one of the pulleys 406 contacts the left side of the push groove 408, it pushes the sliding plate 407 to move leftward along the inner side of the mounting box 404, and the adjacent pulley 406 enters the right-angle groove 409. The sliding plate 407 can drive the pressing block 414 on the first sliding rod 410 to move along the inclined surface of the elastic button 413, so that the elastic button 413 moves downward to open the atomizing nozzle 411. The atomizing nozzle 411 sprays the alcohol in the water storage box 412 on the drain pipe 10 for rapid heat dissipation and cooling. At this time, the pulley 406 in contact with the left side of the push groove 408 enters the right-angle groove 409 as the triangular turntable 405 rotates, and another pulley 406 contacts the right side of the push groove 408, which can push the sliding plate 407 to move rightward, and the pressing block 414 can move away from the elastic button 413, realizing the reciprocating movement effect of the sliding plate 407. Thus, the atomizing nozzle 411 is repeatedly opened and closed, realizing the effect of continuous and efficient heat dissipation. Finally, after the coolant cools down, it enters the water cooling device 6 again to realize cyclic heat dissipation, thus achieving the effect of efficient heat dissipation.

[0025] Embodiment 2: Please refer to Figures 1-9, this embodiment further elaborates on the first embodiment. On the side of the skateboard 407 away from the first slide bar 410 in the figure, a second slide bar 11 is fixedly connected. A guiding cavity for the second slide bar 11 to slide with limited displacement is provided inside the installation box 404, improving the smoothness of the movement of the skateboard 407. A sleeve frame 12 is fixedly connected to the left side of the installation frame 302. The sleeve frame 12 is fixedly sleeved on the outside of the atomizing nozzle 411, facilitating the insertion of the atomizing nozzle 411 into the heat dissipation cavity of the installation frame 302. An exhaust port is fixedly installed at the top of the installation frame 302 and is located above the heat dissipation cavity, facilitating the volatilization of alcohol.

[0026] In this embodiment: When the skateboard 407 drives the first slide bar 410 to move, it can pull or push the second slide bar 11 to move synchronously, improving the smoothness of the movement of the skateboard 407. And the sleeve frame 12 on the left side of the installation frame 302 can facilitate the alignment of the atomizing nozzle 411 with the heat dissipation cavity of the installation frame 302, and alcohol can volatilize from the exhaust port, improving the convenience of alcohol heat dissipation.

[0027] Embodiment Three: Please refer to Figures 1-9 , this embodiment further elaborates on other embodiments. On the side of the positioning ring 503 close to the tension spring 504 in the figure, an annular clamping frame 13 is fixedly connected. One end of the tension spring 504 is located inside the annular clamping frame 13, preventing the tension spring 504 from skewing when rebounding. A plurality of equally spaced limiting strips 14 are fixedly connected inside the installation cavity of the water cooling device 6. A groove for the limiting strips 14 to slide with limited displacement is provided on the outside of the second heat conducting plate 509, enabling the coolant to smoothly move while squeezing the second heat conducting plate 509. A temperature detection panel 15 is fixedly installed on the side of the water cooling device 6 away from the heat conducting sheet 502, facilitating the detection and observation of the temperature of the circuit board 2.

[0028] In this embodiment: When the coolant enters the water cooling device 6, the coolant squeezes the second heat conducting plate 509 to stretch the tension spring 504. The groove on the second heat conducting plate 509 can move along the outside of the plurality of limiting strips 14, improving the smoothness of the movement of the second heat conducting plate 509 and facilitating the smooth contact of the heat conducting sheet 502 on the first heat conducting plate 501 with the processor of the circuit board 2. Thus, when the coolant stops flowing, one end of the tension spring 504 resets along the annular clamping frame 13, and the annular clamping frame 13 can prevent one end of the tension spring 504 from skewing, improving the durability of the tension spring 504. And the user can observe the temperature inside the water cooling device 6 in real time through the temperature detection panel 15, facilitating timely maintenance.

[0029] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0030] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An efficient heat dissipation module, comprising a chassis (1) and a circuit board (2), characterized in that, A water cooling device (6) is provided on the surface of the circuit board (2). A water pump (7) is installed inside the water cooling device (6). A heat dissipation joint (8) extending to the outside of the water cooling device (6) is fixedly installed at the left end of the water pump (7). A cold inlet joint (9) extending to the outside of the water cooling device (6) is fixedly installed at the right end of the water pump (7). A drain pipe (10) is fixedly installed between the heat dissipation joint (8) and the cold inlet joint (9). It further includes an outer packaging mechanism (3), a heat dissipation mechanism (4) and a pressing mechanism (5). The outer packaging mechanism (3) is used for externally dissipating heat from the drain pipe (10), and the outer packaging mechanism (3) is installed on the top of the chassis (1). The heat dissipation mechanism (4) is used for intermittently spraying alcohol to cool down the drain pipe (10), and the heat dissipation mechanism (4) is installed on the top of the chassis (1). The pressing mechanism (5) is used for making the water cooling device (6) gently press against the processor of the circuit board (2), and the pressing mechanism (5) is installed inside the water cooling device (6).

2. An efficient heat dissipation module according to claim 1, wherein: The outer packaging mechanism (3) includes a mounting plate (301) fixedly installed on the top of the chassis (1). A mounting frame (302) is fixedly connected to the top of the mounting plate (301). Heat dissipation fins (303) are fixedly installed inside the mounting frame (302). The drain pipe (10) passes through the mounting plate (301) and is fixedly installed inside the mounting frame (302). The surface of the heat dissipation fins (303) is in contact with the outer side of the drain pipe (10). A heat dissipation box (304) is fixedly connected to the inside of the mounting frame (302). Two symmetrically distributed heat dissipation fans (305) are installed inside the heat dissipation box (304).

3. An efficient heat dissipation module according to claim 2, characterized in that: The heat dissipation mechanism (4) includes two positioning cylinders (401) symmetrically installed inside the heat dissipation fins (303). The two positioning cylinders (401) are respectively located directly above the two cooling fans (305). Through holes for installing the positioning cylinders (401) are formed inside the heat dissipation fins (303). Positioning frames (402) are fixedly connected between both ends of the positioning cylinders (401) and the inner side of the mounting frame (302). A speed reducer (403) is installed at the output end of the cooling fan (305), and the speed reducer (403) is fixedly installed inside the positioning cylinder (401). At the top of the positioning frame (402) on the upper side of the positioning cylinder (401), a mounting box (404) is fixedly installed. The output end of the speed reducer (403) is rotatably installed on the inner wall of the top of the mounting box (404). The output end of the speed reducer (403) is fixedly connected to a triangular turntable (405). Three pulleys (406) distributed at equal intervals in a ring shape are rotatably installed on the top of the triangular turntable (405). A sliding plate (407) is arranged outside the triangular turntable (405) and is slidably limited on the inner wall of the mounting box (404). A pushing groove (408) is formed on the surface of the sliding plate (407). The triangular turntable (405) is located inside the pushing groove (408). The length of the pushing groove (408) is greater than the outer diameter of the triangular turntable (405). Right-angle grooves (409) are formed on both sides of the pushing groove (408), and the two right-angle grooves (409) are centrosymmetrically distributed. The inclined surface of the right-angle groove (409) is of an arc structure. A first sliding rod (410) is fixedly connected to the left side of the sliding plate (407). A sliding cavity for limiting and sliding the first sliding rod (410) is formed inside the mounting box (404). The first sliding rod (410) extends outside the mounting box (404). An atomizing nozzle (411) is arranged on the left side of the mounting frame (302). A heat dissipation cavity for installing the atomizing nozzle (411) is formed on the left side of the mounting frame (302). A water storage box (412) is fixedly installed outside the atomizing nozzle (411), and the water storage box (412) is fixedly installed on the top of the mounting plate (301). An elastic button (413) for starting the atomizing nozzle (411) is installed on the top of the water storage box (412). The end of the first sliding rod (410) away from the sliding plate (407) is fixedly connected to a pressing block (414). The pressing block (414) is in contact with the outside of the elastic button (413). The contact surfaces of the pressing block (414) and the elastic button (413) are both of an inclined surface structure.

4. An efficient heat dissipation module according to claim 3, characterized in that: The pressing mechanism (5) includes a first heat conducting plate (501) installed inside the water cooling device (6). A plurality of equally spaced heat conducting fins (502) are fixedly connected to the surface of the first heat conducting plate (501) away from the heat dissipation joint (8). The heat conducting fins (502) extend to the outside of the water cooling device (6). An opening for the limited sliding of the first heat conducting plate (501) is formed on the outside of the water cooling device (6). A second heat conducting plate (509) is fixedly connected to the surface of the first heat conducting plate (501) away from the heat conducting fins (502). An installation cavity for the limited sliding of the second heat conducting plate (509) is formed inside the water cooling device (6). The outer diameter of the first heat conducting plate (501) is smaller than that of the second heat conducting plate (509). A positioning ring (503) is fixedly connected to the inner side of the water cooling device (6). The surface of the water pump (7) close to the first heat conducting plate (501) is in contact with the surface of the positioning ring (503). A tension spring (504) is fixedly connected between the positioning ring (503) and the second heat conducting plate (509). Four equally spaced fasteners (505) are installed on the outside of the water cooling device (6). A positioning frame (506) is arranged between the four fasteners (505). A sliding hole for the sliding socket of the fasteners (505) is formed on the surface of the positioning frame (506). Four equally spaced positioning blocks (507) are fixedly connected between the positioning frame (506) and the water cooling device (6). A plurality of springs (508) are fixedly connected between the positioning frame (506) and the first heat conducting plate (501).

5. The highly efficient heat dissipation module according to claim 3, characterized in that: A second sliding rod (11) is fixedly connected to the side of the sliding plate (407) away from the first sliding rod (410). A guiding cavity for the limited sliding of the second sliding rod (11) is formed inside the installation box (404).

6. An efficient heat dissipation module according to claim 3, characterized in that: A sleeve frame (12) is fixedly connected to the left side of the installation frame (302). The sleeve frame (12) is fixedly sleeved on the outside of the atomizing nozzle (411).

7. The high-efficiency heat dissipation module according to claim 3, characterized in that: An exhaust port located above the heat dissipation cavity is fixedly installed at the top of the installation frame (302).

8. An efficient heat dissipation module according to claim 4, characterized in that: An annular clamping frame (13) is fixedly connected to the surface of the positioning ring (503) close to the tension spring (504). One end of the tension spring (504) is located inside the annular clamping frame (13).

9. The high-efficiency heat dissipation module according to claim 4, wherein: A plurality of equally spaced limiting strips (14) are fixedly connected to the installation cavity of the water cooling device (6). A groove for the limited sliding of the limiting strips (14) is formed on the outside of the second heat conducting plate (509).

10. The high-efficiency heat dissipation module according to claim 4, characterized in that: A temperature detection panel (15) is fixedly installed on the surface of the water cooling device (6) away from the heat conducting fins (502).

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