Multifunctional liquid cooling heat dissipation plate of liquid cooling system

Abstract

The invention relates to the technical field of server liquid cooling systems, in particular to a multifunctional liquid cooling heat dissipation plate of a liquid cooling system. Comprising a mounting plate, the mounting plate is fixedly connected with a sealing bottom plate, two flow cavities are symmetrically distributed between the mounting plate and the sealing bottom plate, only one sides of the two flow cavities are communicated with each other, and the mounting plate is fixedly connected with separation liquid bags located in the flow cavities and shielding parts distributed at intervals. The separation liquid bag and the shielding part are jointly used for dividing the interior of the flowing cavity into a plurality of flow channels, and the mounting plate is fixedly connected with first blocking liquid bags which are symmetrically distributed and second blocking liquid bags which are symmetrically distributed. The flow path of cooling liquid in the flow cavity is changed through the separation liquid bag, the first blocking liquid bag and the second blocking liquid bag, so that the device can be switched between the working state of high heat dissipation of the parallel flow channel and the working state of low energy consumption of the series flow channel according to the load condition of a server, and one heat dissipation plate can achieve two different heat dissipation functions.

Description

Technical Field

[0001] The present invention relates to the technical field of server liquid cooling systems, and in particular, to a multi-functional liquid cooling heat dissipation plate for a liquid cooling system. Background Art

[0002] Liquid cooling systems are commonly used heat dissipation technologies in the existing server field. The liquid cooling system transports the coolant to the heat dissipation plate where the data chips are installed through a flow distributor. The coolant cools the heat dissipation plate to achieve cooling of the data chips in the server. There are two types of existing single heat dissipation plates: series flow channels and parallel flow channels. The flow channels in both types of heat dissipation plates are of a fixed form. The series flow channel heat dissipation plate guides the coolant to flow through a single path to gradually dissipate heat from the data chips thereon. Since the cross-sectional area of the coolant flow path in the series flow channel heat dissipation plate is small, the flow rate of the coolant required to drive the coolant flow is small, and the energy consumption required is low. However, the cost is that the heat dissipation uniformity of the series flow channel heat dissipation plate is low (the temperature of the data chips generates a gradual temperature difference along the flow path), and the heat dissipation efficiency is relatively low. Therefore, it is suitable for use in servers with low heat dissipation requirements. The parallel flow channels are branched into multiple paths to simultaneously dissipate heat from a large area of the heat dissipation plate. Since the equivalent flow area of the coolant in the parallel flow channel heat dissipation plate is large, more and larger amounts of heat can be quickly carried away during the flow of the coolant. Therefore, the heat dissipation efficiency and heat dissipation uniformity are high. However, when the parallel flow channel heat dissipation plate is working, a large flow rate of the coolant needs to be driven simultaneously (if the flow rate supplied to the heat dissipation plate is too small, the flow rate of the coolant will decrease after entering the heat dissipation plate, and the coolant will only enter a small part of the flow channels, and the coolant in some flow channels will be retained, affecting the overall heat dissipation efficiency). The energy consumption required is high. Therefore, it is suitable for use in occasions with high heat dissipation requirements. In order to ensure the normal operation of the server in a high-load state, existing servers usually choose to be equipped with parallel flow channel heat dissipation plates. However, the server is not always in a high-load state. As a result, during the daily operation of the server, it is necessary to spend more energy for heat dissipation compared to the series flow heat dissipation plate, which is not conducive to the long-term development plan of energy conservation and emission reduction. Summary of the Invention

[0003] In order to overcome the shortcomings that the existing heat dissipation plates only have two fixed forms, namely series flow channels and parallel flow channels, and cannot balance the heat dissipation requirements in the high-load state of the server and the normal energy-saving heat dissipation requirements of the server, the present invention provides a multi-functional liquid cooling heat dissipation plate for a liquid cooling system.

[0004] The technical solution is as follows: A multi-functional liquid cooling heat dissipation plate for a liquid cooling system, including a mounting plate. The mounting plate is fixedly connected with a sealing bottom plate. The mounting plate is used for mounting electronic components. Between the mounting plate and the sealing bottom plate, there are two flow cavities symmetrically distributed and only connected to each other on one side. The sealing bottom plate is fixedly connected with symmetrically distributed liquid inlet heads. The sealing bottom plate is fixedly connected with a liquid outlet head at the connection of the two flow cavities. Both the liquid inlet heads and the liquid outlet head are communicated with the flow cavities. The mounting plate is fixedly connected with a partition liquid bag located in the flow cavities and shielding parts distributed at intervals. The shielding parts are used to prevent the partition liquid bag from expanding. The partition liquid bag is fixedly connected and communicated with symmetrically distributed connecting heads. The connecting heads are fixedly connected with the sealing bottom plate. The partition liquid bag and the shielding parts together are used to divide the flow cavities into multiple flow channels. The mounting plate is fixedly connected with symmetrically distributed first sealing liquid bags and symmetrically distributed second sealing liquid bags. In the same flow cavity, the partition liquid bag, the first sealing liquid bag, and the second sealing liquid bag together are used to divide the flow cavity into a serpentine flow channel.

[0005] Further, the flow cavity is divided by the partition liquid bag into three flow channels, namely a first flow channel, a second flow channel, and a third flow channel that are communicated with each other. The two third flow channels are communicated with each other. The first sealing liquid bag is located on the side of the second flow channel and the third flow channel close to the adjacent liquid inlet head. The second sealing liquid bag is located on the side between the second flow channel and the third flow channel close to the liquid outlet head.

[0006] Further, the mounting plate is fixedly connected with heat conduction plates distributed at intervals. The heat conduction plates are attached to the sealing bottom plate.

[0007] Further, the sealing bottom plate is fixedly connected with extrusion strips distributed at intervals. The extrusion strips distributed at intervals are respectively aligned with the positions of the adjacent first sealing liquid bags, the adjacent second sealing liquid bags, and the partition liquid bag not blocked by the shielding parts, for increasing the sealing performance between the first sealing liquid bags, the second sealing liquid bags, and the partition liquid bag and the sealing bottom plate.

[0008] Further, the heat conduction plates distributed at intervals in the flow cavity are all in contact with the partition liquid bag. The positions of the partition liquid bag not blocked by the shielding parts are all wavy. The heat conduction plates distributed at intervals are used to limit the partition liquid bag.

[0009] Further, diversion parts for guiding the coolant are arranged on both the side of the heat conduction plate close to the adjacent liquid inlet head and the side away from the liquid inlet head.

[0010] Further, the height of the shielding part is less than one-third of the total height of the flow cavity.

[0011] Further, adjusting liquid sacs which are distributed at intervals are fixedly connected inside the first flow channel, the second flow channel and the third flow channel of the sealing bottom plate.

[0012] Further, a symmetrically distributed electromagnetic valve group is fixedly connected to the sealing bottom plate. The electromagnetic valve group is communicated with the adjacent adjusting liquid sacs. The sealing bottom plate is composed of a first layer plate and a second layer plate which are fixedly connected to each other. The first layer plate is fixedly connected to the mounting plate. Two adjacent adjusting liquid sacs are communicated through a hose. The electromagnetic valve group and the adjacent adjusting liquid sacs are communicated through a hose. The hose on the adjusting liquid sac is located between the first layer plate and the second layer plate.

[0013] Further, the shape of the horizontal cross section of the adjusting liquid sac is fusiform.

[0014] Beneficial effects of the present invention: By changing the flow path of the cooling liquid in the flow cavity through the partition liquid sac, the first blocking liquid sac and the second blocking liquid sac, the device of the present invention can switch between the working state of high heat dissipation in the parallel flow channels and the working state of low energy consumption in the series flow channels according to the server load condition, enabling a heat dissipation plate to achieve two different heat dissipation functions, which can not only meet the heat dissipation requirements of the server in the high load state, but also meet the normal energy-saving heat dissipation requirements of the server.

[0015] The present invention squeezes and limits the partition liquid sac into a wavy flow channel through the heat conduction plate, promoting the liquid to fold back along the flow channel during the flowing process, promoting the flow of the cooling liquid at the edge position of the flow channel, and further increasing the uniformity of the cooling liquid heat dissipation.

[0016] The present invention adjusts the flow resistance of the cooling liquid in the first flow channel, the second flow channel and the third flow channel through the adjusting liquid sac, and then distributes the flow rate of the cooling liquid in the three flow channels, and adaptively adjusts the heat dissipation efficiency according to the heat generation position of the electronic chip installed on the mounting plate, thereby increasing the range of different electronic chips that the device can adapt to. Description of the Drawings

[0017] Figure 1 is a three-dimensional structural schematic diagram of the present invention; Figure 2 is a three-dimensional structural schematic diagram of the mounting plate, the sealing bottom plate and the connector of the present invention; Figure 3 is a three-dimensional structural schematic diagram of the split mounting plate and the sealing bottom plate of the present invention; Figure 4 is of the present invention Figure 3 The enlarged view at A in; Figure 5 is a three-dimensional structural schematic diagram of the first flow channel and the third flow channel of the present invention; Figure 6 is an exploded view of the partition liquid sac and the heat conduction plate of the present invention; Figure 7 For the present invention Figure 3 An enlarged view of part B in the present invention; Figure 8 A three-dimensional structural schematic diagram of the first layer board and the second layer board of the present invention.

[0018] Reference numerals in the attached drawings: 1: mounting plate, 101: flow chamber, 2: sealing bottom plate, 21: first layer board, 22: second layer board, 3: liquid inlet head, 4: liquid outlet head, 5: partition liquid sac, 51: first flow channel, 52: second flow channel, 53: third flow channel, 6: shielding part, 7: connecting head, 8: first plugging liquid sac, 9: second plugging liquid sac, 10: heat conduction plate, 11: extrusion strip, 12: adjusting liquid sac, 13: solenoid valve group. Specific embodiments

[0019] It should be noted that the drawings provided in the following embodiments only illustrate the basic concept of the present invention in a schematic manner. Therefore, only the components related to the present invention are shown in the drawings, rather than being drawn according to the number, shape and size of the components in actual implementation. The shape, quantity and proportion of each component in actual implementation can be arbitrarily changed, and the layout form of its components may also be more complex.

[0020] Embodiment 1: A multifunctional liquid cooling heat dissipation plate for a liquid cooling system. This heat dissipation plate has the functions of high heat dissipation with parallel flow channels and low energy consumption with series flow channels, and can meet both the heat dissipation requirements of the server under high load conditions and the normal energy-saving heat dissipation requirements of the server.

[0021] Refer to Figures 1 - 6 , including a mounting plate 1 for mounting electronic components. The mounting plate 1 is fixedly connected with a sealing bottom plate 2. Figure 1 is an assembly drawing of the mounting plate 1 and the sealing bottom plate 2. Figures 3 - 5 is a drawing showing the mounting plate 1 being disassembled and placed upside down. There are two flow chambers 101 symmetrically distributed front and back between the mounting plate 1 and the sealing bottom plate 2. The left parts of the two flow chambers 101 are interconnected. The sealing bottom plate 2 is fixedly connected with two liquid inlet heads 3 symmetrically distributed front and back (refer to Figure 3 ), the liquid inlet heads 3 are located at the right parts of the adjacent flow chambers 101. The sealing bottom plate 2 is fixedly connected with a liquid outlet head 4, and the liquid outlet head 4 is located at the connection part of the two flow chambers 101 (refer to Figure 3 ). Both the liquid inlet heads 3 and the liquid outlet head 4 are connected to the flow chambers 101, and both the liquid inlet heads 3 and the liquid outlet head 4 are connected to the coolant supply system (this system is an existing device, including several common components such as flow distributors, solenoid valves, liquid supply pumps and control terminals). The liquid inlet heads 3 deliver normal-pressure coolant into the flow chambers 101, and the liquid outlet head 4 is used to discharge the coolant in the flow chambers 101. The mounting plate 1 is fixedly connected with a partition liquid sac 5 and spaced shielding parts 6 located in the flow chambers 101. The assembled shape of the partition liquid sac 5 is as shown in Figures 3 - 6As shown, the shielding part 6 is used to prevent the separation liquid sac 5 from expanding. Both ends of the separation liquid sac 5 are fixedly connected and communicated with a connector 7. Both connectors 7 are communicated with the coolant supply system. One of the connectors 7 is used to supply continuously flowing coolant into the separation liquid sac 5, and the other is used to discharge the coolant in the separation liquid sac 5. The separation liquid sac 5 dissipates heat from the mounting plate 1 along a folded path. The liquid pressure of the coolant supplied by the coolant supply system into the connector 7 is adjustable (for example, it can be selected to supply coolant in an atmospheric pressure state or in a high-pressure state). When high-pressure state coolant flows in the separation liquid sac 5, the separation liquid sac 5 expands and separates the space in the flow cavity 101. The connector 7 is a metal hose, and the connector 7 is fixedly connected to the sealing bottom plate 2 (refer to Figure 2 and Figure 3 . During installation, first penetrate the connector 7 through the sealing bottom plate 2, then fix the mounting plate 1 and the sealing bottom plate 2, and finally use an existing sealing and fixing structure to fix the connector 7 and the sealing bottom plate 2 together). The mounting plate 1 is fixedly connected with two first plugging liquid sacs 8 symmetrically distributed front and back and two second plugging liquid sacs 9 symmetrically distributed front and back. The first plugging liquid sac 8 and the second plugging liquid sac 9 are communicated with an external hydraulic system through hoses.

[0022] Refer to Figure 3 and Figure 5 . The flow cavity 101 is separated by the separation liquid sac 5 into three flow channels, namely a first flow channel 51, a second flow channel 52, and a third flow channel 53. The two third flow channels 53 are communicated with each other. The first plugging liquid sac 8 is located on the side of the second flow channel 52 and the third flow channel 53 close to the adjacent liquid inlet head 3. When the first plugging liquid sac 8 does not expand, the first plugging liquid sac 8 is used to promote the liquid flowing into the flow cavity 101 from the liquid inlet head 3 to flow into the first flow channel 51, alleviating the situation of uneven heat dissipation caused by the small flow rate in the side flow channels in the traditional parallel flow channel heat dissipation plate. The second plugging liquid sac 9 is located on the side of the second flow channel 52 and the third flow channel 53 close to the liquid outlet head 4.

[0023] The above arrangement can be achieved that when the separation liquid capsule 5 is filled with high-pressure coolant, the liquid pressure in the separation liquid capsule 5 is greater than the liquid pressure in the flow chamber 101, the separation liquid capsule 5 expands, and the blocking portion 6 blocks the expansion of the separation liquid capsule 5 in the adjacent position by limiting. Therefore, the part of the separation liquid capsule 5 not blocked by the blocking portion 6 expands upward and contacts the sealing bottom plate 2, dividing one flow chamber 101 into three flow channels: the first flow channel 51, the second flow channel 52 and the third flow channel 53. At this time, if liquid is added to the first blocking liquid capsule 8 and the second blocking liquid capsule 9, the first blocking liquid capsule 8 and the second blocking liquid capsule 9 expand and contact the sealing bottom plate 2, the first blocking liquid capsule 8 blocks the communication path between the second flow channel 52 and the third flow channel 53 and the liquid inlet head 3, and the second blocking liquid capsule 9 blocks the communication path between the first flow channel 51 and the second flow channel 52 and the liquid outlet head 4. In the same flow chamber 101, the separation liquid capsule 5, the first blocking liquid capsule 8 and the second blocking liquid capsule 9 jointly separate the flow chamber 101 into a serpentine flow channel.

[0024] Reference Figures 3 - 6 The mounting plate 1 is fixed with a plurality of spaced-apart thermal conductive plates 10, which are fitted with the sealing bottom plate 2 and are used to conduct the temperature on the mounting plate 1 to the sealing bottom plate 2, thereby increasing the heat dissipation efficiency of the coolant.

[0025] Reference Figure 3 and Figure 7 The sealing bottom plate 2 is fixed with spaced extrusion strips 11 , which are aligned with the positions of the adjacent first blocking liquid capsule 8 , the adjacent second blocking liquid capsule 9 and the separating liquid capsule 5 that are not blocked by the blocking portion 6 .

[0026] The above setting can be realized. The cross-section of the extrusion strip 11 is three rectangles. When the separating liquid capsule 5, the first blocking liquid capsule 8 and the second blocking liquid capsule 9 expand, the separating liquid capsule 5, the first blocking liquid capsule 8 and the second blocking liquid capsule 9 respectively contact the adjacent extrusion strips 11 and squeeze each other. The separating liquid capsule 5, the first blocking liquid capsule 8 and the second blocking liquid capsule 9 are respectively embedded in the corresponding extrusion strips 11, which increases the contact area and pressure at the contact position between the first blocking liquid capsule 8, the second blocking liquid capsule 9 and the separating liquid capsule 5 and the sealing bottom plate 2 in disguise, thereby increasing the sealing performance.

[0027] Reference Figures 3 - 5 The spaced-apart heat conducting plates 10 in the flow chamber 101 are all in contact with the separating liquid capsule 5, and the positions of the separating liquid capsule 5 not blocked by the blocking portion 6 are all wavy. The spaced-apart heat conducting plates 10 are used to limit the separating liquid capsule 5 so that the positions of the separating liquid capsule 5 not blocked by the blocking portion 6 maintain a wavy state for expansion.

[0028] Reference Figure 5 and Figure 6, on both the side of the heat conduction plate 10 close to the adjacent liquid inlet head 3 and the side far from the liquid inlet head 3, a flow dividing part is provided. The flow dividing part is used for guiding the coolant and reducing the resistance suffered by the coolant when flowing through the heat conduction plate 10.

[0029] Refer to Figure 5 , the height of the shielding part 6 is less than one-third of the total height of the flow cavity 101, so as to reduce the obstruction of the shielding part 6 to the flow of the coolant in the flow cavity 101.

[0030] The above setting can achieve that when the partition liquid sac 5 expands, the heat conduction plate 10 limits the partition liquid sac 5 into a wavy shape. The coolant in the three flow channels of the first flow channel 51, the second flow channel 52 and the third flow channel 53 all flows along the wavy path, enabling the coolant to flow back and forth and mix, reducing the probability of slow flow at the edge position of the flow channel, and thus increasing the uniformity of the coolant heat dissipation.

[0031] The working principle of the above setting is (for the purpose of early explanation, this working principle only takes a single device of this kind as an example to explain the usage principle of this device. In the actual use process, a cooling system needs to be equipped with multiple such heat dissipation plates. It can be controlled separately for each heat dissipation plate to achieve more delicate adjustment, or several heat dissipation plates in the same row can be regarded as a group according to the server classification and regulated in groups): Installation stage: Install the electronic chip on the mounting plate 1, connect the liquid inlet head 3, the liquid outlet head 4 and the connecting head 7 to the coolant supply system, connect the first plugging liquid sac 8 and the second plugging liquid sac 9 to the external hydraulic system through hoses, and then install multiple mounting plates 1 with installed electronic chips in the server mounting rack.

[0032] Working stage: When the server workload is low, the coolant supply system supplies high-pressure coolant into the partition liquid sac 5. The partition liquid sac 5 expands and contacts the corresponding extrusion strip 11. The external hydraulic system flushes high-pressure liquid into the first sealing liquid sac 8 and the second sealing liquid sac 9, causing the first sealing liquid sac 8 and the second sealing liquid sac 9 to expand and contact the corresponding extrusion strip 11. Subsequently, the external hydraulic system stops working, maintaining the expanded state of the first sealing liquid sac 8 and the second sealing liquid sac 9. The first sealing liquid sac 8, the second sealing liquid sac 9, and the partition liquid sac 5 divide the flow cavity 101 into a serpentine flow channel. At this time, the coolant in the flow cavity 101 flows from right to left along the first flow channel 51, then flows from left to right along the second flow channel 52 after passing through the adjacent shielding part 6, and finally flows from right to left along the third flow channel 53 after passing through the adjacent shielding part 6, and finally enters the liquid outlet head 4. In the above stage, the coolant reciprocally flows along the series flow channels in the flow cavity 101 and in the partition liquid sac 5. Therefore, the required flow rate is low, and the energy consumption is low. Moreover, because there are two flow cavities 101 flowing from the outside to the inside, the mounting plate 1 is cooled, making the heat dissipation received by the electronic chips on the mounting plate 1 more uniform.

[0033] When the server workload is high, the external hydraulic system pumps out the high-pressure liquid in the first sealing liquid sac 8 and the second sealing liquid sac 9. The first sealing liquid sac 8 and the second sealing liquid sac 9 contract and deform, no longer blocking the flow cavity 101. At this time, the coolant simultaneously enters the three flow channels of the first flow channel 51, the second flow channel 52, and the third flow channel 53. The coolant supply system activates a hydraulic pump with a greater power to deliver a greater flow rate of coolant into the liquid inlet head 3. After the coolant enters the flow cavity 101, affected by the resistance of the first sealing liquid sac 8 and the second sealing liquid sac 9, it flows into the three flow channels of the first flow channel 51, the second flow channel 52, and the third flow channel 53 in a relatively uniform state, and finally flows out from the liquid outlet head 4. At this time, the coolant flow rate increases, the heat dissipation effect is enhanced, and all the electronic chips on the mounting plate 1 are evenly cooled simultaneously.

[0034] Because when switching between the above two working states, it only needs to control the coolant supply system to inject high-pressure coolant into the partition liquid sac 5 and control the external hydraulic system to inject high-pressure liquid into the first sealing liquid sac 8 and the second sealing liquid sac 9. There are no mechanical components that need to be moved or swung. The overall structure of the mounting plate 1 and the sealing bottom plate 2 is simple, with high practicality and is easy to be transformed into a thin and light structure, meeting the modern social design trend of simplification and high energy efficiency.

[0035] When multiple of these heat dissipation plates are connected in series, and the heat dissipation requirement at the upstream position of the series connection part is relatively low, while the heat dissipation requirement of the heat dissipation plates at the downstream position of the series connection is relatively high, based on the contraction of the first plugging liquid sac 8 and the second plugging liquid sac 9 in all the heat dissipation plates, the supply of high-pressure coolant to the partition liquid sac 5 in the heat dissipation plates at the upstream position is stopped, and instead, normal-pressure coolant is supplied. At this time, the partition liquid sac 5 contracts inward, and most of the coolant in the flow cavity 101 no longer flows along the three flow channels, but directly flows from the liquid inlet head 3 towards the liquid outlet head 4. Part of the coolant is guided by the heat conduction plate 10 to flow towards the edge position of the flow cavity 101, promoting the uniform heat dissipation of the flow cavity 101 to the electronic chips thereon, further reducing the flow resistance of the coolant, enabling the coolant to pass through the heat dissipation plates at the upstream position faster, and entering the heat dissipation plates at the downstream position to complete the heat dissipation work.

[0036] Embodiment 2: Based on the multi-functional liquid cooling heat dissipation plate of a liquid cooling system in Embodiment 1, this heat dissipation plate can also adjust the flow resistance of each flow channel, and thus dynamically distribute the flow states of multiple flow channels.

[0037] Refer to Figure 3 、 Figure 7 and Figure 8 and Figure 3 ), four regulating liquid sacs 12 (refer to

[0038] are fixedly connected at intervals in the first flow channel 51, the second flow channel 52, and the third flow channel 53 of the sealing bottom plate 2. The number and installation positions of the regulating liquid sacs 12 can be changed according to requirements.

[0039] Refer to Figure 8, the sealed bottom plate 2 is fixedly connected with four solenoid valve groups 13 distributed symmetrically left and right (only four are set in the figure for convenient display. The communication path between the solenoid valve group 13 and the regulating liquid sac 12 can be changed through a hose, reducing or increasing the number of solenoid valve groups 13 used, and the regulating liquid sacs 12 of several heat dissipation plates can be connected to one solenoid valve group 13), the solenoid valve group 13 is communicated with the adjacent regulating liquid sac 12, the solenoid valve group 13 is communicated with an external hydraulic system, the solenoid valve group 13 is used to supply high-pressure liquid into the mutually communicated regulating liquid sac 12 to make the regulating liquid sac 12 expand, and the solenoid valve group 13 can also be used to extract the high-pressure liquid in the regulating liquid sac 12 to make the regulating liquid sac 12 contract and reset. The sealed bottom plate 2 is composed of a first layer plate 21 and a second layer plate 22 fixedly connected to each other. The first layer plate 21 and the second layer plate 22 are fixedly connected. Adjacent two regulating liquid sacs 12 are communicated through a hose (refer to Figure 8 ), and the solenoid valve group 13 and the adjacent regulating liquid sac 12 are communicated through a hose. An inner cavity is arranged on one side of the second layer plate 22 close to the first layer plate 21. The hoses on the regulating liquid sac 12 are all located in the inner cavity of the second layer plate 22, which not only maintains the cleanliness of the sealed bottom plate 2, but also can bury the hoses through the interlayer and grooves between the first layer plate 21 and the second layer plate 22, reducing the number of drilled sub-drills, thereby reducing the difficulty of producing the sealed bottom plate 2 and increasing the practicability of the device.

[0040] Refer to Figure 7 and Figure 8 , the shape of the horizontal cross-section of the regulating liquid sac 12 is spindle-shaped.

[0041] The above settings can achieve that when the regulating liquid sac 12 does not expand, the hindering effect on the coolant is reduced, and when the regulating liquid sac 12 expands, the regulating liquid sac 12 expands, thereby increasing the effect of the regulating liquid sac 12 on hindering the liquid flow.

[0042] The above embodiments are only used to illustrate the technical concept and characteristics of the present invention, and their purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it accordingly, and cannot be used to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope required by the present invention.

Claims

1. A multi-functional liquid cooling heat dissipation plate for a liquid cooling system, comprising a mounting plate (1), the mounting plate (1) is fixedly connected with a sealing bottom plate (2), the mounting plate (1) is used for mounting electronic components, two flow cavities (101) which are symmetrically distributed and only communicate with each other on one side are arranged between the mounting plate (1) and the sealing bottom plate (2), the sealing bottom plate (2) is fixedly connected with symmetrically distributed liquid inlet heads (3), the sealing bottom plate (2) is fixedly connected with a liquid outlet head (4) at the communication position of the two flow cavities (101), the liquid inlet heads (3) and the liquid outlet head (4) are both communicated with the flow cavities (101), and it is characterized in that, The mounting plate (1) is fixedly connected with a partition liquid sac (5) located in the flow cavity (101) and spaced-apart shielding parts (6). The shielding parts (6) are used to hinder the expansion of the partition liquid sac (5). The partition liquid sac (5) is fixedly connected and communicated with symmetrically distributed connecting heads (7). The connecting heads (7) are fixedly connected with the sealing bottom plate (2). The partition liquid sac (5) and the shielding parts (6) together are used to divide the flow cavity (101) into multiple flow channels. The mounting plate (1) is fixedly connected with symmetrically distributed first plugging liquid sacs (8) and symmetrically distributed second plugging liquid sacs (9). The partition liquid sac (5), the first plugging liquid sac (8) and the second plugging liquid sac (9) in the same flow cavity (101) together are used to divide the flow cavity (101) into a serpentine flow channel.

2. The multi-functional liquid cooling heat dissipation plate of a liquid cooling system according to claim 1, characterized in that, The flow cavity (101) is divided by the partition liquid sac (5) into three flow channels, namely a first flow channel (51), a second flow channel (52) and a third flow channel (53) which are communicated with each other. The two third flow channels (53) are communicated with each other. The first plugging liquid sac (8) is located on the side of the second flow channel (52) and the third flow channel (53) close to the adjacent liquid inlet head (3). The second plugging liquid sac (9) is located on the side of the second flow channel (52) and the third flow channel (53) close to the liquid outlet head (4) between them.

3. The multi-functional liquid cooling heat dissipation plate of a liquid cooling system according to claim 2, characterized in that, The mounting plate (1) is fixedly connected with spaced-apart heat conduction plates (10). The heat conduction plates (10) are in contact with the sealing bottom plate (2).

4. The multifunctional liquid cooling heat dissipation plate of a liquid cooling system according to claim 3, characterized in that, The sealing bottom plate (2) is fixedly connected with spaced-apart extrusion strips (11). The spaced-apart extrusion strips (11) are respectively aligned with the positions of the adjacent first plugging liquid sacs (8), the adjacent second plugging liquid sacs (9) and the partition liquid sac (5) not blocked by the shielding parts (6), and are used to increase the sealing performance between the first plugging liquid sacs (8), the second plugging liquid sacs (9) and the partition liquid sac (5) and the sealing bottom plate (2).

5. The multifunctional liquid cooling heat dissipation plate of a liquid cooling system according to claim 4, characterized in that, The heat conduction plates (10) spaced apart in the flow cavity (101) are all in contact with the partition liquid sac (5). The positions of the partition liquid sac (5) not blocked by the shielding parts (6) are all wavy. The spaced-apart heat conduction plates (10) are used to limit the partition liquid sac (5).

6. The multi-functional liquid cooling heat dissipation plate of a liquid cooling system according to claim 5, characterized in that, On both the side of the heat conduction plate (10) close to the adjacent liquid inlet head (3) and the side away from the liquid inlet head (3), there are diversion parts for guiding the coolant.

7. The multi-functional liquid cooling heat dissipation plate of a liquid cooling system according to claim 5, characterized in that, The height of the shielding part (6) is less than one-third of the total height of the flow cavity (101).

8. The multifunctional liquid cooling heat dissipation plate of a liquid cooling system according to claim 4, characterized in that, The sealing bottom plate (2) is fixedly connected with spaced-apart adjusting liquid sacs (12) in the first flow channel (51), the second flow channel (52) and the third flow channel (53).

9. The multifunctional liquid cooling heat dissipation plate of a liquid cooling system according to claim 8, characterized in that The sealed bottom plate (2) is fixedly connected with a symmetrically distributed electromagnetic valve group (13). The electromagnetic valve group (13) is communicated with the adjacent adjusting liquid sac (12). The sealed bottom plate (2) is composed of a first layer plate (21) and a second layer plate (22) which are fixedly connected to each other. The first layer plate (21) is fixedly connected with the mounting plate (1). Two adjacent adjusting liquid sacs (12) are communicated through a hose. The electromagnetic valve group (13) and the adjacent adjusting liquid sac (12) are communicated through a hose. The hose on the adjusting liquid sac (12) is located between the first layer plate (21) and the second layer plate (22).

10. The multifunctional liquid cooling heat dissipation plate of a liquid cooling system according to claim 9, characterized in that, The shape of the horizontal cross-section of the adjusting liquid sac (12) is fusiform.

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