Liquid cooling flow adjusting method and device and storage medium
By introducing a distributed flow regulation device into the liquid cooling system, the signal of the air-cooled heat dissipation interface and the brushless motor booster pump are used to achieve independent adjustment of each heat dissipation branch, solving the problem of insufficient flexibility and accuracy caused by unified regulation in the liquid cooling system, and improving the heat dissipation efficiency and response speed.
Patent Information
- Application Number
- CN202510895970.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-30
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2045-06-30
AI Technical Summary
The flow control of the existing liquid cooling system depends on the unified regulation of the coolant distribution unit, resulting in insufficient flexibility and accuracy, and the inability to respond to the heat dissipation needs under different power consumption and heating conditions in a timely manner.
By connecting the liquid-cooled flow adjustment device to the air-cooled heat dissipation interface of the electronic device, the signal of the air-cooled heat dissipation interface is used for distributed adjustment, and combining the brushless motor and the booster pump, the cooling medium flow is dynamically controlled to achieve independent adjustment of each heat dissipation branch.
It improves the flexibility and accuracy of cooling medium flow regulation, reduces resource consumption, simplifies system integration and maintenance, and enhances heat dissipation efficiency and response speed.
Smart Images

Figure CN120406698A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of heat dissipation of electronic devices, and particularly to a liquid cooling flow rate adjustment method, device, and storage medium. Background Art
[0002] In recent years, with the increasing demand for computing power in data centers and the gradually increasing power density of electronic devices such as servers, traditional air cooling technology has encountered a heat dissipation bottleneck, and liquid cooling technology has gradually become the mainstream with its higher heat dissipation capacity and lower noise. However, the flow control of the liquid cooling system in related technologies relies on the unified overall regulation of the coolant distribution unit and cannot timely and accurately adjust according to the heat dissipation requirements under different power consumption and heating conditions.
[0003] It can be seen that the liquid cooling flow rate adjustment method in related technologies has problems of insufficient flexibility and accuracy caused by relying on unified regulation. Summary of the Invention
[0004] This application provides a liquid cooling flow rate adjustment method, device, and storage medium to at least solve the problem of insufficient flexibility and accuracy in the liquid cooling flow rate adjustment method in related technologies caused by relying on unified regulation.
[0005] This application provides a liquid cooling flow rate adjustment method, including: receiving a first adjustment signal through a control component of the liquid cooling flow rate adjustment device via an air cooling heat dissipation interface, where the air cooling heat dissipation interface is an interface on the electronic device for connecting an air cooling heat dissipation device; in the case where the first adjustment signal is an adjustment signal obtained by adjusting the adjustment signal of the air cooling heat dissipation device and is used to adjust the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device, sending the first adjustment signal to an actuator of the liquid cooling flow rate adjustment device through the control component to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device.
[0006] This application also provides a liquid cooling flow rate adjustment device, including: a control component and an actuator; where the control component is used to receive a first adjustment signal via an air cooling heat dissipation interface, where the air cooling heat dissipation interface is an interface on the electronic device for connecting an air cooling heat dissipation device; in the case where the first adjustment signal is an adjustment signal obtained by adjusting the adjustment signal of the air cooling heat dissipation device and is used to adjust the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device, sending the first adjustment signal to the actuator; the actuator is used to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device in response to the first adjustment signal.
[0007] The present application also provides an electronic device, including: a memory for storing a computer program; a processor for implementing the steps of any of the above liquid cooling flow rate adjustment methods when executing the computer program.
[0008] The present application also provides a computer-readable storage medium storing a computer program, wherein the computer program implements the steps of any of the above liquid cooling flow rate adjustment methods when executed by a processor.
[0009] The present application also provides a computer program product including a computer program, which implements the steps of any of the above liquid cooling flow rate adjustment methods when executed by a processor.
[0010] Through the present application, since the control component of the liquid cooling flow rate adjustment device receives the first adjustment signal via the air cooling heat dissipation interface, where the air cooling heat dissipation interface is an interface on the electronic device for connecting an air cooling heat dissipation device, the liquid cooling flow rate adjustment device can be directly connected to the original air cooling heat dissipation device interface to achieve distributed liquid cooling adjustment, reducing the transformation cost and resource consumption; when the first adjustment signal is an adjustment signal obtained by adjusting the adjustment signal of the air cooling heat dissipation device and is used to adjust the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device, the control component sends the first adjustment signal to the actuator of the liquid cooling flow rate adjustment device to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device. Therefore, different signals can be used to adjust the flow rate of the cooling medium for different heat dissipation branches for targeted dynamic adjustment, without relying on the unified control of the coolant distribution unit, solving the problem in the related art that the liquid cooling flow rate adjustment method has insufficient flexibility and accuracy due to relying on unified control, improving the flexibility and accuracy of the cooling medium flow rate adjustment, and reducing resource consumption. Description of the Drawings
[0011] To more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0012] Figure 1 It is a schematic flowchart of a liquid cooling flow rate adjustment method provided by an embodiment of the present application.
[0013] Figure 2 It is a schematic diagram of a liquid cooling flow rate adjustment method provided by an embodiment of the present application.
[0014] Figure 3 It is a schematic diagram of another liquid cooling flow rate adjustment method provided by an embodiment of the present application.
[0015] Figure 4 Schematic diagram of another liquid cooling flow rate adjustment method provided by an embodiment of the present application.
[0016] Figure 5 Schematic diagram of another liquid cooling flow rate adjustment method provided by an embodiment of the present application.
[0017] Figure 6 Schematic diagram of another liquid cooling flow rate adjustment method provided by an embodiment of the present application.
[0018] Figure 7 Flow chart of another liquid cooling flow rate adjustment method provided by an embodiment of the present application.
[0019] Figure 8 Schematic diagram of another liquid cooling flow rate adjustment method provided by an embodiment of the present application.
[0020] Figure 9 Schematic diagram of another liquid cooling flow rate adjustment method provided by an embodiment of the present application.
[0021] Figure 10 Schematic diagram of the structure of a liquid cooling flow rate adjustment device provided by an embodiment of the present application. Detailed implementation manners
[0022] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0023] It should be noted that in the description of the present application, the terms "including", "comprising" or any other variation thereof are intended to cover a non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects, rather than to describe a specific order or sequence.
[0024] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.
[0025] According to one aspect of the embodiments of the present application, a liquid cooling flow rate adjustment method is provided. Figure 1 It is a flow chart of an optional liquid cooling flow rate adjustment method according to an embodiment of the present application, as Figure 1As shown, the process of this method includes the following steps:
[0026] Step S102, the control component of the liquid cooling flow rate regulating device receives a first adjustment signal via the air cooling heat dissipation interface, where the air cooling heat dissipation interface is an interface on the electronic device for connecting the air cooling heat dissipation device;
[0027] Step S104, when the first adjustment signal is an adjustment signal obtained by adjusting the adjustment signal of the air cooling heat dissipation device and is used to adjust the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device, the control component sends the first adjustment signal to the actuator of the liquid cooling flow rate regulating device to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device.
[0028] The liquid cooling flow rate regulating method in this embodiment can be applied to the technical field of electronic device heat dissipation and can be applied to the scenario of liquid cooling heat dissipation for electronic devices.
[0029] In recent years, with the development of cloud computing, artificial intelligence (abbreviated as AI) and big data, the data center has an increasing demand for computing power. Coupled with the gradually increasing power density of information technology (abbreviated as IT) devices such as servers, the conventional air cooling technology encounters a heat dissipation bottleneck and cannot meet the heat dissipation requirements of electronic devices. The liquid cooling technology has gradually become the mainstream with its higher heat dissipation capacity and lower noise.
[0030] Liquid cooling is divided into cold plate liquid cooling, immersion liquid cooling, and spray liquid cooling. Among them, cold plate liquid cooling is suitable for the heat dissipation of key components such as the Central Processing Unit (CPU) and Graphics Processing Unit (GPU). Here, immersion liquid cooling refers to directly immersing the entire server or key components into a special coolant (such as fluorinated liquid) for heat dissipation. It can handle very high heat densities and is suitable for the heat dissipation requirements of extreme conditions or ultra-large data centers. However, immersion liquid cooling requires specially designed servers and sealed immersion containers, which increases the equipment cost and complexity and is not suitable for general electronic devices; spray liquid cooling refers to spraying coolant onto the surface of the heat-generating components for cooling, which can quickly respond to the temperature changes of the heat-generating components and provide an immediate heat dissipation effect. However, the design and maintenance of the spray system are relatively complex, and it is necessary to ensure that the coolant does not come into contact with the electronic components. Moreover, the system requires good sealing and circulation capabilities and is also not suitable for general electronic devices; cold plate liquid cooling means that the cold plate can be directly installed on the heat-generating components without additional heat dissipation space, is easy to integrate with existing IT equipment, can be installed in most standard server chassis, and is connected to the heat-generating components on the motherboard. In addition, the cold plate is in close contact with the heat-generating components, which can directly and effectively transfer heat, reduce thermal resistance, and improve the stability and reliability of the overall heat dissipation system.
[0031] In addition, the maintenance of the cold plate liquid cooling device is relatively simple. Usually, only the cold plate and coolant need to be replaced or maintained. The noise generated during the operation of the cold plate liquid cooling device is extremely low because the main cooling process occurs inside the closed cold plate, avoiding the noise problem caused by direct heat dissipation and being more energy-efficient.
[0032] However, as Figure 2 shown, the core component of the liquid cooling system in the related technology is generally the Coolant Distribution Unit (CDU). The CDU mainly consists of a water pump, a heat exchanger, a filtration system, and control equipment for performing these functions. The water pump of the CDU drives the coolant to flow through the heat exchanger (such as a heat dissipation cold plate) along the pipeline, thereby taking away the heat transferred from the heat-generating device (such as a processor) in the water-cooled server to the cold plate and realizing the heat dissipation of the equipment. The heat exchanger transfers the heat in the coolant (i.e., cooling water) to the external environment (which can be through an outdoor cooling tower and a chiller). The cooling water is heated after passing through the heat-generating device (such as rising from 45°C to 55°C), and then the heat exchanger replaces it with cold source water to achieve heat transfer. The CDU can also include a filtration system to keep the coolant pure, and the control equipment manages the operation of the entire system. The CDU drives the coolant to circulate by applying a uniform pressure on the main coolant pipeline, and the diversion grooves inside the cold plate are designed to control the coolant flow into specific heat dissipation components.
[0033] The coolant main pipeline is not limited to the internal liquid cooling circuit of a single chassis. It can also serve as the backbone of the liquid cooling system in a data center, server cluster, or computer room. It distributes coolant from a central cooling unit (such as a cooling tower or chiller) to each IT device or chassis requiring cooling. It also recovers the hot coolant after absorbing heat from the IT equipment and transports it back to the central cooling unit for further cooling. Therefore, the coolant main pipeline can be considered a network connecting all components of the entire liquid cooling system, ensuring effective coolant circulation and efficient heat transfer. The CDU drives coolant circulation using a uniform pressure, but this approach cannot individually or precisely control the coolant flow to each cooling node. This means that if the power consumption of a cooling component in the system suddenly increases, the CDU cannot immediately respond and adjust the coolant flow near that component. Instead, it continues to circulate at the overall system design pressure. Furthermore, the flow guide grooves in the cold plate are static in design and cannot dynamically adjust their width or layout based on real-time cooling requirements. In scenarios where IT equipment loads fluctuate frequently, this may not respond quickly to changes in cooling demand, resulting in poor cooling performance. This relatively static flow control method can only uniformly adjust the flow through the CDU, and it does not respond promptly to the cooling needs of the same cooling device under different power consumption and heating conditions.
[0034] Furthermore, upgrading the heat dissipation method from air cooling to liquid cooling requires not only building a liquid cooling system consisting of a CDU, outdoor cooling equipment, and its connecting pipes, but also redesigning the equipment chassis and motherboard. This increases the overall hardware investment, makes it inconvenient to upgrade the heat dissipation of existing equipment, and hinders the reuse of resources.
[0035] It can be seen that the liquid cooling flow regulation method in the related art has the problem of insufficient flexibility and accuracy due to reliance on unified control.
[0036] To solve at least part of the above technical problems, a distributed liquid cooling flow dynamic regulation method is provided in this embodiment, including: receiving a first regulation signal by a control component of a liquid cooling flow regulation device via an air cooling heat dissipation interface, where the air cooling heat dissipation interface is an interface on an electronic device for connecting an air cooling heat dissipation device, and the liquid cooling flow regulation device can be directly connected to the original air cooling heat dissipation device interface to achieve distributed liquid cooling regulation, reducing the transformation cost and resource consumption; in the case where the first regulation signal is a regulation signal obtained by adjusting the regulation signal of the air cooling heat dissipation device and is used to regulate the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow regulation device, sending the first regulation signal to the actuator of the liquid cooling flow regulation device by the control component to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow regulation device. Thus, different signals can be used to regulate the flow rate of the cooling medium for different heat dissipation branches for targeted dynamic regulation, without relying on the unified regulation of the coolant distribution unit, solving the problem of insufficient flexibility and accuracy in the liquid cooling flow regulation method in the related art, improving the flexibility and accuracy of the cooling medium flow regulation, and reducing the resource consumption.
[0037] Optionally, a liquid cooling flow regulation device can be installed at each heat dissipation node (i.e., corresponding to each heat dissipation branch) to achieve local and dynamic regulation of the cooling medium flow rate. A heat dissipation branch can correspond to an electronic device or an electronic component (such as a CPU, GPU, etc.). An electronic device can include one heat dissipation branch or multiple heat dissipation branches, and this embodiment does not limit this.
[0038] Optionally, each liquid cooling flow regulation device can be relatively independent, facilitating the maintenance and upgrade of a single node and not affecting the operation of the entire liquid cooling system.
[0039] By installing a dynamic regulation device in each heat dissipation branch, the heat dissipation requirements of each electronic component or device can be immediately responded to, improving the heat dissipation efficiency and response speed.
[0040] In this embodiment, the liquid cooling flow regulation device can be directly connected to the air cooling heat dissipation interface in the electronic device. Here, the air cooling heat dissipation interface can be an interface on the electronic device for connecting an air cooling heat dissipation device. For example, it can be an interface on the electronic device for connecting a fan. Thus, the existing interfaces and installation spaces on the electronic device can be utilized, reducing the transformation cost and simplifying the integration process of the liquid cooling system. For example, the cooling fan can be removed and the liquid cooling flow regulation device can be installed in the original fan position, and the corresponding heat dissipation device (such as a cold plate) can be connected to the liquid cooling system through the liquid cooling flow regulation device. This distributed architecture can get rid of the dependence on the CDU control and pressurization functions and utilize the existing heat dissipation control interfaces of IT devices to simplify the entire liquid cooling system.
[0041] Optionally, the above-mentioned distributed liquid cooling flow dynamic regulation device can obtain the working power supply and the regulation signal of the electronic device from the air-cooled heat dissipation interface.
[0042] Optionally, the first regulation signal can be a regulation signal obtained by adjusting the regulation signal of the air-cooled heat dissipation device and used to regulate the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow regulation device. That is, for the case where the air-cooled heat dissipation device is replaced by the liquid cooling flow regulation device, since the signals required for the liquid cooling flow regulation device to control the cooling medium flow rate are different from those of the air-cooled heat dissipation device, the electronic device can be adjusted so that its output can be directly used as a regulation signal for regulating the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow regulation device.
[0043] Here, through the air-cooled heat dissipation interface, the electronic device can output a Pulse Width Modulation (PWM) signal to control the rotation speed of the air-cooled heat dissipation device. The PWM signal is a signal form widely used in multiple fields such as communication, control, and power electronics. It can encode information by changing the pulse duration (i.e., the duty cycle) at a fixed frequency, thus enabling effective signal transmission and control between digital circuits and analog circuits. In a complete cycle, the PWM signal can experience a period of high level and low level. By adjusting the ratio of the high-level duration to the total cycle time, i.e., the duty cycle, the PWM signal can represent different levels of voltage information. For example, if the high-level duration is half of the cycle time in a cycle, then the duty cycle of the signal is 50%, indicating that the average level of the signal is half of the power supply voltage.
[0044] The PWM signal can be used to control the rotation speed of the air-cooled heat dissipation device. For example, through this interface, the device can output a PWM signal to control the fan rotation speed to meet different heat dissipation requirements. It can also be used to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow regulation device. However, there are significant differences in the working mechanisms between the liquid cooling flow regulation device and the air-cooled heat dissipation device. For example, the rotation speed of the fan has a large change range, the duty cycle change range from stop to full speed is wide, and the response speed is fast, while the rotation speed change range of the liquid cooling pump is smaller, and sufficient flow needs to be maintained at low speeds, which requires more precise control of the duty cycle of the PWM signal.
[0045] Optionally, through the air-cooling heat dissipation interface, the electronic device can also obtain the requirements of the liquid-cooling flow rate regulating device for the regulating signal. Furthermore, the regulating requirements of the liquid-cooling flow rate regulating device can be mapped to the driving logic of the original air-cooling heat dissipation device in the electronic device and the first regulating signal can be adjusted. For example, a conversion table or a mapping function can be created to convert the original fan PWM signal into a signal suitable for the liquid-cooling flow rate regulating device. Based on the characteristic curve of the liquid-cooling flow rate regulating device, the duty cycle of the PWM signal is adjusted to obtain a PWM signal for indicating the required flow rate and pressure of the liquid-cooling flow rate regulating device.
[0046] Optionally, after the adjustment is completed, corresponding experiments and tests can be carried out to verify whether the adjusted first regulating signal can effectively drive the liquid-cooling flow rate regulating device and meet the heat dissipation requirements of the corresponding heat dissipation branch.
[0047] In this embodiment, after receiving the adjusted first regulating signal, the control component can directly send the first regulating signal to the actuator of the liquid-cooling flow rate regulating device to control the flow rate of the cooling medium in the corresponding heat dissipation branch. Here, the actuator can be used to adjust the flow rate of the cooling medium.
[0048] Optionally, according to the working characteristics of the liquid-cooling flow rate regulating device, the firmware of the original electronic device can be appropriately modified, and the parameters for adjusting the fan speed in its heat dissipation strategy can be finely adjusted to make it suitable for the working characteristics of the liquid-cooling flow rate regulating device and the heat dissipation requirements of the branch where it is located. In this way, the control unit of the liquid-cooling flow rate regulating device only needs to realize the drive speed regulation of the motor, thereby simplifying the design of the control unit.
[0049] Through the embodiments of the present application, the control component of the liquid-cooling flow rate regulating device receives the first regulating signal via the air-cooling heat dissipation interface, where the air-cooling heat dissipation interface is an interface on the electronic device for connecting the air-cooling heat dissipation device; when the first regulating signal is an adjusted regulating signal for the air-cooling heat dissipation device and is used to adjust the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid-cooling flow rate regulating device, the control component sends the first regulating signal to the actuator of the liquid-cooling flow rate regulating device to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid-cooling flow rate regulating device, which can solve the problem in the related art that the liquid-cooling flow rate regulating method has insufficient flexibility and accuracy due to relying on unified regulation, improve the flexibility and accuracy of the cooling medium flow rate regulation, and reduce resource consumption.
[0050] In an exemplary embodiment, the actuator includes a brushless motor and a booster pump;
[0051] After the control component sends the first regulating signal to the actuator of the liquid-cooling flow rate regulating device, the above method further includes:
[0052] Under the control of the first adjustment signal, the brushless motor rotates at a speed corresponding to the first adjustment signal to drive the booster pump to adjust the flow rate of the cooling medium in the corresponding heat dissipation branch of the liquid cooling flow rate adjustment device.
[0053] In this embodiment, the core component of the actuator can be a brushless motor and a booster pump connected thereto. The coil winding of the brushless motor can drive the rotation of the brushless motor magnetic pole under the control of the first adjustment signal, thereby driving the booster pump to work.
[0054] Optionally, the cooling medium input end of the booster pump can be connected to the main cooling medium pipeline, and the output end is connected to the corresponding heat dissipation device (such as a cold plate) of the device to be cooled. Under the drive of the first adjustment signal, the flow rate of the cooling medium in this heat dissipation branch is dynamically adjusted without relying on the liquid pressure in the main cooling medium pipeline. The main cooling medium pipeline can be connected to the heat exchange device outdoors to transfer the heat obtained from the device to be cooled outdoors, completing the heat dissipation of the electronic device or electronic component.
[0055] The brushless motor in this embodiment can be a brushless motor with separated magnetic poles. For example, as Figure 3 shown, the impeller and the magnetic pole wheel in the booster pump can be installed on the same shaft and fixed in the pump body, so they can rotate synchronously; the whole pump body or part of the magnetic pole wheel housing is made of non-magnetic material, that is, a material that can be penetrated by magnetic force, so that the brushless motor coil winding can penetrate the housing to drive the magnetic pole wheel. This design of separating the brushless motor coil winding from the magnetic pole wheel also ensures the water tightness of the pump body, realizing the liquid-electric separation design of this actuator.
[0056] Here, the brushless motor with separated magnetic poles is also the separated rotating magnetic pole brushless motor. Its magnetic pole wheel and coil winding are separated in structure and driven by magnetic coupling. The advantage of this design is that a part of the motor (such as the coil winding) can be placed in a dry environment, while the other part (the booster pump composed of the magnetic pole wheel and the impeller) is placed in the coolant, realizing complete isolation of electricity and hydraulics; the function of the booster pump is to increase the pressure of the cooling medium to ensure that it can effectively circulate in the pipeline and take away the heat of the IT equipment. Thus, the brushless motor can drive the impeller to rotate at a high speed to generate the necessary driving force to make the cooling medium flow and adjust the flow rate to meet the heat dissipation requirements.
[0057] Through this embodiment, by adjusting the flow rate of the cooling medium in the corresponding heat dissipation branch of the liquid cooling flow rate adjustment device by the brushless motor and the booster pump in the actuator in response to the first adjustment signal, an efficient and flexible control mechanism for the distributed liquid cooling flow rate adjustment device can be realized, improving the flexibility and accuracy of the liquid cooling flow rate adjustment method.
[0058] In an exemplary embodiment, after receiving a first adjustment signal via an air-cooling heat dissipation interface by a control component of a liquid-cooling flow rate adjustment device, the method further includes:
[0059] When the first adjustment signal is an adjustment signal for adjusting the rotation speed of the air-cooling heat dissipation device, the control component converts the first adjustment signal into a second adjustment signal, where the second adjustment signal is an adjustment signal for adjusting the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid-cooling flow rate adjustment device;
[0060] The control component sends the second adjustment signal to an actuator to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid-cooling flow rate adjustment device.
[0061] Optionally, when it is not possible or convenient to modify the device firmware, that is, when the first adjustment signal output by the electronic device through the air-cooling heat dissipation interface is a direct adjustment signal for adjusting the rotation speed of the air-cooling heat dissipation device, the control component can also parse and convert the received signal by itself, and adjust the signal to meet the flow control requirements of the liquid-cooling flow rate adjustment device. This inheritance strategy can be adjusted by software, for example, the control component can include a microcontroller and can integrate an algorithm for adjusting the signal, so that precise flow rate adjustment can be achieved without changing the original heat dissipation control logic of the device, thereby improving the adaptability and flexibility of liquid-cooling adjustment.
[0062] Optionally, after converting the signal output by the electronic device through the air-cooling heat dissipation interface into a signal suitable for controlling the flow rate of the cooling medium, the control component can send the second adjustment signal to an actuator to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid-cooling flow rate adjustment device.
[0063] For example, as Figure 4 shown, the control component can obtain the first adjustment signal (i.e., the pulse width modulation signal, also known as the PWM signal) and the power supply based on the fan interface and ground through this interface. A, B, and C are the three-phase connection points on the brushless motor coil windings, which are used to generate a rotating magnetic field by alternately controlling the on and off of the corresponding three windings of A, B, and C to drive the impeller of the motor to rotate to achieve the control of the booster pump. After receiving the first adjustment signal, the control component can convert it into a signal suitable for driving the brushless motor to control the rotation speed of the motor, and further adjust the flow rate of the cooling medium.
[0064] Through this embodiment, by adjusting the first adjustment signal by the control component to make it suitable for the liquid-cooling flow rate adjustment device, efficient and flexible control of the liquid-cooling system can be achieved.
[0065] In an exemplary embodiment, converting the first adjustment signal into a second adjustment signal by the control component includes:
[0066] The control component analyzes the first adjustment signal to obtain the duty cycle of the first adjustment signal;
[0067] The control component reduces the duty cycle of the first adjustment signal to obtain a second adjustment signal.
[0068] In this embodiment, after receiving the first adjustment signal via the air-cooling heat dissipation interface, the control component can analyze the first adjustment signal to obtain the duty cycle of the first adjustment signal. Here, the control component may include a built-in microcontroller for signal analysis and identifying the duty cycle of the signal.
[0069] Since the rotation speed of the cooling fan is relatively high, while the required rotation speed of the liquid-cooling flow rate adjustment device is lower and the required control accuracy is higher, therefore, the liquid-cooling flow rate adjustment device can provide the necessary flow rate at a lower duty cycle to meet the heat dissipation requirements.
[0070] Optionally, the control component can reduce the duty cycle of the first adjustment signal to obtain a second adjustment signal. For example, after the microcontroller in the control component analyzes the duty cycle of the first adjustment signal, according to the characteristic curve of the liquid-cooling flow rate adjustment device and the heat dissipation requirements of the corresponding heat dissipation branch, it can reduce the original duty cycle of the PWM signal to generate a second adjustment signal, so that the introduction and deployment of liquid cooling can be realized without modifying the software and hardware of the original IT equipment.
[0071] Optionally, the control component can obtain the characteristic curve of the liquid-cooling flow rate adjustment device and the heat dissipation requirements of the corresponding heat dissipation branch via the air-cooling heat dissipation interface, or can also pre-store the characteristic curve of the liquid-cooling flow rate adjustment device and obtain the heat dissipation requirements of the corresponding heat dissipation branch through a sensor. This embodiment does not make a limitation on this.
[0072] Through this embodiment, by reducing the duty cycle of the first adjustment signal to obtain a second adjustment signal for controlling the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid-cooling flow rate adjustment device, the refined control of the flow rate of the cooling medium can be realized, the heat dissipation efficiency of the liquid-cooling flow rate adjustment device is improved, and the energy waste is reduced.
[0073] In an exemplary embodiment, the first adjustment signal is received through the input / output interface of the control component;
[0074] The control component analyzes the first adjustment signal to obtain the duty cycle of the first adjustment signal, including:
[0075] The timer of the control component triggers an interrupt event at a specified moment in the change cycle of the first adjustment signal to determine the duty cycle of the first adjustment signal; or,
[0076] Regularly query the status of the first adjustment signal through a specified program in the control component to determine the duty cycle of the first adjustment signal.
[0077] In this embodiment, the first adjustment signal is received through the input / output interface of the control component. For example, it can be received through the interface of the microcontroller of the control component.
[0078] Optionally, the control component can obtain the frequency and duty cycle of the first adjustment signal through timer interrupts or program queries.
[0079] Here, obtaining the frequency and duty cycle of the first adjustment signal through timer interrupts can be achieved by the timer of the control component triggering an interrupt event at a specified moment in the change cycle of the first adjustment signal to determine the duty cycle of the first adjustment signal. It can be based on the timer in the control component to detect the status of the first adjustment signal at a preset time point. Whenever the cycle of the first adjustment signal reaches the preset trigger point, the timer can generate an interrupt request. Then, the control component can read and record the high-level duration and cycle time of the signal through the interrupt service routine. For example, the timer can trigger an interrupt event at the rising edge or falling edge of each cycle of the first adjustment signal. The control component can read the high-level duration through a counter in the interrupt service routine and then divide it by the total signal cycle time to obtain the duty cycle.
[0080] Optionally, the control component can also regularly query the status of the first adjustment signal through a program. This method does not rely on hardware interrupts but can regularly check the signal level through loops or timed tasks, record the high-level duration of the signal, and finally calculate the duty cycle. For example, the software program of the control component can check the status of the signal at fixed intervals, such as once every half of the signal cycle. When the signal is at a high level, the program starts counting until the signal becomes low. The program can calculate the duty cycle based on the recorded high-level duration and the total signal cycle time.
[0081] For example, as Figure 5 shown, after the microcontroller obtains the input of the first adjustment signal, it can obtain the frequency and duty cycle parameters of the signal through the timer and the terminal, re-modulate through the modulation strategy, and output it as the second adjustment signal.
[0082] Optionally, the method triggered by interrupt events can provide more accurate signal reading, while the method of regular program queries is more flexible in design and easier to implement. The method for analyzing the first adjustment signal can be selected based on user requirements or the design difficulty of the control component. This is not limited in this embodiment.
[0083] Through this embodiment, by triggering an interrupt event or querying regularly by a program to analyze the duty cycle of the first adjustment signal, accurate signal analysis and reading can be achieved to respond to the heat dissipation requirements of the heat dissipation branch, realizing efficient and intelligent heat dissipation control.
[0084] In an exemplary embodiment, the liquid cooling flow rate adjustment device further includes a first temperature sensor and a second temperature sensor. Among them, the first temperature sensor is used to monitor the temperature of the cooling medium flowing into the heat dissipation device, and the second temperature sensor is used to monitor the temperature of the cooling medium flowing out of the heat dissipation device. The heat dissipation device is attached to the device to be cooled;
[0085] The above method further includes:
[0086] Obtaining the sensor data of the first temperature sensor and the sensor data of the second temperature sensor through a control component;
[0087] Based on the sensor data of the first temperature sensor and the sensor data of the second temperature sensor, the control component determines the parameter value of the flow rate adjustment parameter, where the flow rate adjustment parameter is used to indicate the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device;
[0088] The control component converts the parameter value of the flow rate adjustment parameter into a third adjustment signal and sends the third adjustment signal to the actuator of the liquid cooling flow rate adjustment device to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device.
[0089] In the foregoing embodiment, the distributed liquid cooling flow rate dynamic adjustment device can obtain the working power supply and the fan speed adjustment signal of the device from the air cooling heat dissipation interface, adjust the duty cycle of the signal according to the fan speed PWM signal in combination with the characteristics of liquid cooling to make it adapt to the working characteristics and pressurization intensity of liquid cooling, and then drive the liquid cooling flow rate adjustment actuator. In this way, it is not necessary to modify the original hardware circuit and firmware of the IT device; it is also possible to directly drive the cold liquid flow rate adjustment actuator with the fan speed adjustment signal of the device, which requires modifying the fan drive logic of the heat dissipation function in the firmware to make it adapt to the flow rate control of liquid cooling, but it can simplify the design complexity of the liquid cooling flow rate dynamic adjustment device. The above solutions not only realize the access of the liquid cooling flow rate adjustment device but also meet the current heat dissipation requirements of the device.
[0090] In this embodiment, the liquid cooling flow rate adjustment device can also use the temperature sensors installed at the inlet / outlet pipes of the cooling medium in this heat dissipation branch to obtain the temperature difference between the cold liquid flowing into and out of the heat dissipation cold plate, and calculate the flow rate of the cold liquid (i.e., the cooling medium) required for the current heat dissipation of the device to be cooled according to a preset algorithm, so as to drive the actuator to adjust the cold liquid flow rate.
[0091] Optionally, the liquid cooling flow rate regulating device further includes a first temperature sensor and a second temperature sensor. The first temperature sensor is used to monitor the temperature of the cooling medium flowing into the heat dissipation device, and the second temperature sensor is used to monitor the temperature of the cooling medium flowing out of the heat dissipation device. The heat dissipation device is attached to the device to be cooled.
[0092] For example, as Figure 6 shown, the liquid cooling flow rate regulating device can be installed in the original fan installation position and connected to the fan interface. The cold plate (i.e., the heat dissipation device) can be attached to the device to be cooled. The coolant can flow from the heat exchange device through the liquid cooling flow rate regulating device into the cold plate, and take away the heat of the device to be cooled, and then flow out of the cold plate back to the heat exchange device to complete the cycle. The two temperature sensors can be respectively installed on the coolant inlet / outlet pipes to monitor the temperature of the cooling medium flowing into the heat dissipation device and the temperature of the cooling medium flowing out of the heat dissipation device. Corresponding to multiple heat dissipation devices, there can also be multiple liquid cooling flow rate regulating devices.
[0093] Optionally, the control component can obtain the sensor data regularly or continuously. The acquisition of the data can be implemented through a dedicated analog signal or a bus interface, which can depend on the type of the temperature sensor and the interface design of the control component. This is not limited in this embodiment.
[0094] Optionally, the control component can calculate the temperature difference between the inlet temperature and the outlet temperature of the cooling medium according to the real-time temperature data of the first temperature sensor and the second temperature sensor. The magnitude of the temperature difference can reflect the heat dissipation effect and heat dissipation demand of the heat dissipation device. Furthermore, based on the sensor data obtained by the control component, it can determine the parameter value of the flow rate regulation parameter. The flow rate regulation parameter is used to indicate the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device. For example, if the outlet temperature of the cooling medium is too high, it means that the current coolant flow rate is not sufficient to meet the current heat dissipation demand of the device, and the flow rate regulation parameter can indicate the actuator to increase the flow rate, and its parameter value can increase; if the outlet temperature is low, it means that the current flow rate may be excessive, and the flow rate regulation parameter can indicate the actuator to reduce the flow rate to achieve the best heat dissipation effect and energy utilization efficiency, and its parameter value can decrease.
[0095] Optionally, the control component can convert the calculated flow rate regulation parameter value into a third regulation signal suitable for the actuator to understand. The third regulation signal can be a PWM signal to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device through its duty cycle.
[0096] Optionally, in response to different design requirements, different flow control strategies can be selected. For example, as Figure 7As shown, a direct drive strategy can be selected, that is, the firmware outputs a flow control signal according to the heat dissipation strategy, and this flow control signal can be directly used to drive the motor coil to control the cold liquid pump to adjust the flow rate; an inheritance strategy can also be selected, that is, after obtaining the host signal, the frequency or duty cycle of this signal can be adjusted according to the adjustment strategy, and the adjusted signal is used to drive the motor coil, and the temperature of the cooling medium flowing into the heat dissipation device, and the second temperature sensor is used to monitor the temperature of the cooling medium flowing out of the heat dissipation device to control the cold liquid pump to adjust the flow rate; an automatic control strategy can also be selected, that is, the liquid temperature data (that is, the temperature of the cooling medium flowing into the heat dissipation device and the temperature of the cooling medium flowing out of the heat dissipation device) can be obtained, the speed regulation parameters are determined based on the speed regulation strategy, and then an adjustment signal is generated to drive the motor coil to control the cold liquid pump to adjust the flow rate.
[0097] Optionally, corresponding to different flow control strategies, different signals can be used to drive the motor coil. Here, the control component can also include a motor speed controller, which is used to calculate the command value of the motor speed based on the duty cycle of the received signal, and convert the calculated command value into an electrical signal that the motor can understand to control the current direction and intensity of the motor winding, thereby changing the rotation speed of the motor poles.
[0098] For example, as Figure 8 shown, the microcontroller can have various buses and input / output interfaces with the function of an analog-to-digital converter (ADC), and can be connected to temperature sensors of various interfaces. Corresponding to the direct drive strategy, the first adjustment signal after being adapted by the firmware (i.e., modifying the electronic device) can be directly input into the motor speed controller; corresponding to the inheritance strategy, the unadjusted first adjustment signal can be input into the microcontroller, and after being adaptively adjusted by the microcontroller, it is output as a drive signal to the motor speed controller; corresponding to the automatic control strategy, the microcontroller can calculate the flow rate adjustment parameter value based on the received temperature sensor data and convert it into a third adjustment signal suitable for the actuator to understand, and output it as a drive signal to the motor speed controller.
[0099] Through this embodiment, by determining the temperature difference of the cooling medium flowing into the heat dissipation device through the temperature sensor and generating a corresponding adjustment signal, an independent liquid cooling adjustment strategy can be realized, improving the flexibility and reliability of liquid cooling adjustment.
[0100] In an exemplary embodiment, the parameter value of the flow rate adjustment parameter is positively correlated with the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device;
[0101] By the control component determining the parameter value of the flow rate adjustment parameter based on the sensor data of the first temperature sensor and the sensor data of the second temperature sensor, it includes:
[0102] For the sensor data of the first temperature sensor, obtain the temperature value of the cooling medium inflow temperature corresponding to the heat dissipation device;
[0103] For the sensor data of the second temperature sensor, obtain the temperature value of the cooling medium outflow temperature corresponding to the heat dissipation device;
[0104] Determine the temperature difference between the temperature value of the cooling medium inflow temperature and the temperature value of the cooling medium outflow temperature, and obtain the current temperature difference;
[0105] When the current temperature difference is greater than or equal to the specified temperature difference threshold, increase the parameter value of the flow regulation parameter to increase the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow regulation device;
[0106] When the current temperature difference is less than the specified temperature difference threshold, decrease the parameter value of the flow regulation parameter to decrease the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow regulation device.
[0107] Optionally, as shown in formula (1):
[0108] Q = CM(T H - T L ) (1)
[0109] Where, T H represents the temperature value of the cooling medium outflow temperature corresponding to the heat dissipation device, T L represents the temperature value of the cooling medium inflow temperature corresponding to the heat dissipation device, Q represents the relatively stable value of the heat that needs to be dissipated by the heat dissipation device per unit time, C represents the specific heat capacity of the cooling medium, M represents the mass of the cooling medium flowing through the cold plate per unit time. When the temperature difference is too high, the flow rate of the cooling medium may be small, resulting in poor heat dissipation effect, and it is necessary to increase the flow rate of the cooling medium to enhance the heat dissipation effect.
[0110] Optionally, the parameter value of the flow regulation parameter is positively correlated with the cooling medium flow rate of the heat dissipation branch corresponding to the liquid cooling flow regulation device. The determination and adjustment of the flow regulation parameter can be based on the temperature difference of the cooling medium. The change of the temperature difference can reflect the heat dissipation efficiency of the heat dissipation device and whether the current cooling medium flow rate is suitable for the heat dissipation requirement. For example, when ΔT ≥ threshold (i.e., the current temperature difference is greater than or equal to the specified temperature difference threshold), it indicates that the current flow rate is insufficient for effective heat dissipation, resulting in a significant increase in the temperature of the cooling medium after flowing through the heat dissipation device. In this case, the control component can increase the parameter value of the flow regulation parameter, that is, increase the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow regulation device, improve the heat dissipation efficiency, and ensure that the temperature difference of the cooling medium does not exceed the safe range; when ΔT < threshold (i.e., the current temperature difference is less than the specified temperature difference threshold), it means that the current flow rate exceeds the actual demand of the heat dissipation device, resulting in unnecessary energy consumption and possible overcooling. At this time, the control component can decrease the parameter value of the flow regulation parameter to reduce the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow regulation device, slow down the flow of the cooling medium, and make the liquid cooling regulation more economical and efficient.
[0111] Optionally, the control component can adopt a Proportional-Integral-Differential (PID) control algorithm to adjust the flow regulation parameter. For example, as Figure 9 shown, the temperature difference c(t) of the cold liquid entering / leaving the cold plate obtained by the temperature sensor (i.e., temperature sensor) can be subtracted from a fixed value r(t) (such as 10 °C) to obtain the correction value e(t), which is returned to the control function e(t), and then the parameter u(t) is generated through proportional, integral, and differential operations to adjust the actuator (i.e., flow regulation pump) to control the cold liquid flow rate, so that the temperature of the cold liquid flowing out of the cold plate changes within a certain range higher than the temperature of the cold liquid flowing in, thereby realizing dynamic adjustment according to the chip heat dissipation situation.
[0112] Optionally, different flow levels can also be preset, for example, low flow, medium flow, and high flow. Each level can be set with corresponding PID parameter values. When the temperature difference calculated based on the data obtained by the temperature sensor exceeds the preset threshold, it can be automatically switched to the next higher flow level to increase the flow rate of the cooling medium and improve the heat dissipation efficiency. Similarly, when the temperature difference decreases below a certain threshold, the flow level can also be automatically lowered to reduce energy consumption.
[0113] Optionally, a flow sensor can be set on the cooling medium delivery pipeline to monitor whether the actual flow rate matches the set flow level through the integrated flow sensor. If a deviation is found, the rotation speed of the actuator is adjusted until the actual flow rate is consistent with the target flow rate.
[0114] Optionally, the historical temperature difference information and the corresponding flow rate levels can be recorded by a microcontroller, and the PID parameters can be optimized through a machine learning algorithm to automatically adjust during long-term operation to adapt to the subtle changes in the device's heat dissipation requirements.
[0115] Through this embodiment, by determining the temperature difference between the temperature value of the cooling medium inflow temperature and the temperature value of the cooling medium outflow temperature, and correspondingly increasing or decreasing the parameter value of the flow rate adjustment parameter to increase or decrease the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device, precise liquid cooling adjustment can be independently achieved, improving the flexibility and reliability of the liquid cooling adjustment.
[0116] Through the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by means of software plus a necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases, the former is a better implementation method.
[0117] The embodiment of the present application also provides a liquid cooling flow rate adjustment device, as Figure 10 shown, the device includes: a control component 1002 and an actuator 1004; wherein,
[0118] The control component 1002 is configured to receive a first adjustment signal via an air-cooled heat dissipation interface 1006, wherein the air-cooled heat dissipation interface 1006 is an interface on the electronic device 1008 for connecting an air-cooled heat dissipation device; in the case where the first adjustment signal is an adjustment signal obtained by adjusting the adjustment signal of the air-cooled heat dissipation device and is used to adjust the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device, the first adjustment signal is sent to the actuator 1004;
[0119] The actuator 1004 is configured to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device in response to the first adjustment signal.
[0120] It should be noted that the above control component 1002 can be used to implement the above step S102 and the above step S104.
[0121] Through the above module, the control component of the liquid cooling flow rate regulating device receives a first regulation signal via the air cooling heat dissipation interface, where the air cooling heat dissipation interface is an interface on the electronic device for connecting an air cooling heat dissipation device; when the first regulation signal is a regulation signal obtained by adjusting the regulation signal of the air cooling heat dissipation device and is used to regulate the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device, the control component sends the first regulation signal to the actuator of the liquid cooling flow rate regulating device to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device, which can solve the problem of insufficient flexibility and accuracy caused by relying on unified regulation in the related liquid cooling flow rate regulation method, improve the flexibility and accuracy of the cooling medium flow rate regulation, and reduce resource consumption.
[0122] For the description of the features in the embodiments corresponding to the liquid cooling flow rate regulating device, reference can be made to the relevant description in the embodiments corresponding to the liquid cooling flow rate regulation method, which will not be elaborated here one by one.
[0123] In an exemplary embodiment, the actuator includes a brushless motor and a booster pump; among them, the brushless motor is used to rotate at a speed corresponding to the first regulation signal under the control of the first regulation signal after the control component sends the first regulation signal to the actuator of the liquid cooling flow rate regulating device, so as to drive the booster pump to regulate the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device.
[0124] In an exemplary embodiment, after receiving the first regulation signal via the air cooling heat dissipation interface, the control component is further used to convert the first regulation signal into a second regulation signal when the first regulation signal is a regulation signal for regulating the rotation speed of the air cooling heat dissipation device, where the second regulation signal is a regulation signal for regulating the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device; and send the second regulation signal to the actuator to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device.
[0125] In an exemplary embodiment, the control component is further used to analyze the first regulation signal to obtain the duty cycle of the first regulation signal; and lower the duty cycle of the first regulation signal to obtain the second regulation signal.
[0126] In an exemplary embodiment, the first regulation signal is received through the input / output interface of the control component; the control component is further used to trigger an interrupt event at a specified moment in the change cycle of the first regulation signal through a timer to determine the duty cycle of the first regulation signal; or regularly query the status of the first regulation signal through a specified program to determine the duty cycle of the first regulation signal.
[0127] In an exemplary embodiment, the liquid cooling flow rate regulating device further includes a first temperature sensor and a second temperature sensor. The first temperature sensor is configured to monitor the temperature of the cooling medium flowing into the heat dissipation device, and the second temperature sensor is configured to monitor the temperature of the cooling medium flowing out of the heat dissipation device. The heat dissipation device is attached to the device to be cooled. The control component is further configured to: obtain the sensor data of the first temperature sensor and the sensor data of the second temperature sensor; determine the parameter value of the flow rate regulating parameter based on the sensor data of the first temperature sensor and the sensor data of the second temperature sensor, where the flow rate regulating parameter is used to indicate the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device; convert the parameter value of the flow rate regulating parameter into a third regulating signal and send the third regulating signal to the actuator of the liquid cooling flow rate regulating device to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device.
[0128] In an exemplary embodiment, the parameter value of the flow rate regulating parameter is positively correlated with the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device. The control component is further configured to process the sensor data of the first temperature sensor to obtain the temperature value of the cooling medium inlet temperature corresponding to the heat dissipation device; process the sensor data of the second temperature sensor to obtain the temperature value of the cooling medium outlet temperature corresponding to the heat dissipation device; determine the temperature difference between the temperature value of the cooling medium inlet temperature and the temperature value of the cooling medium outlet temperature to obtain the current temperature difference; in the case where the current temperature difference is greater than or equal to the specified temperature difference threshold, increase the parameter value of the flow rate regulating parameter to increase the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device; in the case where the current temperature difference is less than the specified temperature difference threshold, decrease the parameter value of the flow rate regulating parameter to decrease the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device.
[0129] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps in any of the above embodiments of the liquid cooling flow rate regulating method when running.
[0130] In an exemplary embodiment, the above computer-readable storage medium may include, but is not limited to: USB flash drives, read-only memories (ROM), random access memories (RAM), external hard drives, magnetic disks, or optical discs and other various media that can store computer programs.
[0131] An embodiment of the present application further provides a computer program product. The computer program product includes a computer program, and when the computer program is executed by a processor, it implements the steps in any of the above embodiments of the liquid cooling flow rate regulating method.
[0132] An embodiment of the present application further provides another computer program product, including a non-volatile computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the steps in any of the above embodiments of the liquid cooling flow rate adjustment method are implemented.
[0133] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.
[0134] The above has introduced in detail a liquid cooling flow rate adjustment method, device, and storage medium provided by the present application. Specific examples are used herein to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in the technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.
Claims
1. A liquid cooling flow rate adjustment method, characterized in that, Including: The control component of the liquid cooling flow rate regulating device receives a first regulation signal via the air cooling heat dissipation interface, where the air cooling heat dissipation interface is an interface on the electronic device for connecting an air cooling heat dissipation device; When the first regulation signal is a regulation signal obtained by adjusting the regulation signal of the air cooling heat dissipation device and is used to regulate the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device, the control component sends the first regulation signal to the actuator of the liquid cooling flow rate regulating device to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device.
2. The method according to claim 1, wherein The actuator includes a brushless motor and a booster pump; After the control component sends the first regulation signal to the actuator of the liquid cooling flow rate regulating device, the method further includes: The brushless motor rotates at a speed corresponding to the first regulation signal under the control of the first regulation signal to drive the booster pump to regulate the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device.
3. The method according to claim 1, characterized in that, After the control component of the liquid cooling flow rate regulating device receives the first regulation signal via the air cooling heat dissipation interface, the method further includes: When the first regulation signal is a regulation signal for regulating the rotation speed of the air cooling heat dissipation device, the control component converts the first regulation signal into a second regulation signal, where the second regulation signal is a regulation signal for regulating the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device; The control component sends the second regulation signal to the actuator to control the flow rate of the cooling medium in the heat dissipation branch corresponding to the liquid cooling flow rate regulating device.
4. The method according to claim 3, wherein The conversion of the first regulation signal into the second regulation signal by the control component includes: The control component analyzes the first regulation signal to obtain the duty cycle of the first regulation signal; The control component reduces the duty cycle of the first regulation signal to obtain the second regulation signal.
5. The method according to claim 4, characterized in that The first regulation signal is received through the input / output interface of the control component; The control component analyzes the first regulation signal to obtain the duty cycle of the first regulation signal, including: The timer of the control component triggers an interrupt event at a specified moment in the change cycle of the first regulation signal to determine the duty cycle of the first regulation signal; Or, The control component regularly queries the status of the first regulation signal through a specified program to determine the duty cycle of the first regulation signal.
6. The method according to claim 1, characterized in that The liquid cooling flow rate regulating device further includes a first temperature sensor and a second temperature sensor, where the first temperature sensor is used to monitor the temperature of the cooling medium flowing into the heat dissipation device, and the second temperature sensor is used to monitor the temperature of the cooling medium flowing out of the heat dissipation device, and the heat dissipation device is attached to the device to be cooled; The method further includes: The control component obtains the sensor data of the first temperature sensor and the sensor data of the second temperature sensor; Based on the sensor data of the first temperature sensor and the sensor data of the second temperature sensor, the control component determines the parameter value of the flow rate adjustment parameter, where the flow rate adjustment parameter is used to indicate the cooling medium flow rate of the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device; The control component converts the parameter value of the flow rate adjustment parameter into a third adjustment signal and sends the third adjustment signal to the actuator of the liquid cooling flow rate adjustment device to control the cooling medium flow rate of the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device.
7. The method according to claim 6, wherein The parameter value of the flow rate adjustment parameter is positively correlated with the cooling medium flow rate of the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device; The determining, by the control component, the parameter value of the flow rate adjustment parameter based on the sensor data of the first temperature sensor and the sensor data of the second temperature sensor includes: Processing the sensor data of the first temperature sensor to obtain the temperature value of the cooling medium inlet temperature corresponding to the heat dissipation device; Processing the sensor data of the second temperature sensor to obtain the temperature value of the cooling medium outlet temperature corresponding to the heat dissipation device; Determining the temperature difference between the temperature value of the cooling medium inlet temperature and the temperature value of the cooling medium outlet temperature to obtain the current temperature difference; When the current temperature difference is greater than or equal to the specified temperature difference threshold, increasing the parameter value of the flow rate adjustment parameter to increase the cooling medium flow rate of the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device; When the current temperature difference is less than the specified temperature difference threshold, decreasing the parameter value of the flow rate adjustment parameter to decrease the cooling medium flow rate of the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device.
8. A liquid cooling flow rate regulating device, characterized in that, including: A control component and an actuator; wherein, The control component is configured to receive a first adjustment signal via an air-cooled heat dissipation interface, where the air-cooled heat dissipation interface is an interface on the electronic device for connecting an air-cooled heat dissipation device; when the first adjustment signal is an adjustment signal obtained by adjusting the adjustment signal of the air-cooled heat dissipation device and is used to adjust the cooling medium flow rate of the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device, sending the first adjustment signal to the actuator; The actuator is configured to control the cooling medium flow rate of the heat dissipation branch corresponding to the liquid cooling flow rate adjustment device in response to the first adjustment signal.
9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, where the computer program, when executed by a processor, implements the steps of the liquid cooling flow rate adjustment method according to any one of claims 1 to 7.
10. A computer program product, comprising a computer program, characterized in that, The computer program, when executed by a processor, implements the steps of the liquid cooling flow rate adjustment method according to any one of claims 1 to 7.
Citation Information
Patent Citations
Server memory active heat dissipation method and system, equipment and medium
CN112286322A
Heat dissipation device, heat dissipation control method, electronic equipment, storage medium and product
CN115720433A
Wind-liquid mixed server heat dissipation regulation and control system and method based on active cold plate
CN116546778A
Heat dissipation mode determination method and device, storage medium and electronic equipment
CN118860090A
Method and system for optimizing operation condition of liquid cooling system of charging facility
CN119421394A