Electronic device

Abstract

Disclosed is an electronic device including a display layer, a sensor layer in which an active area is defined as a first area and a second area, and a sensor driving unit, the sensor layer including a plurality of first electrodes, a plurality of second electrodes, a first line, a second line, a third line, and a fourth line, each of the plurality of first electrodes includes a plurality of first sub-electrodes and a plurality of second sub-electrodes alternately arranged in the first direction, a third line connected to one of the plurality of first sub-electrodes and located in the first region, and a fourth line connected to one of the plurality of second sub-electrodes and located in the second region, and the sensor driving unit is configured to compensate the coordinate based on a difference between a first sensing signal sensed in the third line and a second sensing signal sensed in the fourth line.

Description

[0001] This application claims the priority and benefit of Korean Patent Application No. 10-2024-0013894, filed with the Korean Intellectual Property Office on January 30, 2024, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] Aspects of some embodiments of the present disclosure described herein relate to an electronic device. Background Art

[0003] Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation systems, game consoles, and vehicle displays can display images and provide a touch-based input method that allows a user to input information or commands relatively easily, intuitively, and conveniently in addition to general input methods such as buttons, keyboards, and mice.

[0004] The above information disclosed in this background art section is only for enhancing the understanding of the background art, and thus, the information discussed in this background art section does not necessarily constitute the prior art. Summary of the Invention

[0005] Aspects of some embodiments of the present disclosure described herein relate to an electronic device with relatively improved sensing reliability.

[0006] According to some embodiments, an electronic device includes: a display layer; a sensor layer on the display layer, and an active area is defined in the sensor layer; and a sensor driving unit that drives the sensor layer, wherein a part of the active area is defined as a first area, and another part of the active area is defined as a second area adjacent to the first area in a first direction, the sensor layer includes: a plurality of first electrodes, each of the plurality of first electrodes including a plurality of first sub-electrodes and a plurality of second sub-electrodes alternately arranged in the first direction; a plurality of second electrodes, each of the plurality of second electrodes extending in a second direction intersecting the first direction; a first line electrically connected to the plurality of first sub-electrodes; a second line electrically connected to the plurality of second sub-electrodes; a third line extending in the second direction, connected to one of the plurality of first sub-electrodes, and located in the first area; and a fourth line extending in the second direction, connected to one of the plurality of second sub-electrodes, and located in the second area, and the sensor driving unit compensates coordinates based on a difference between a first sensing signal sensed in the third line and a second sensing signal sensed in the fourth line.

[0007] According to some embodiments, the third line and the fourth line may be spaced apart from each other in the first direction, and at least one of the plurality of first sub-electrodes and / or at least one of the plurality of second sub-electrodes may be disposed between the third line and the fourth line.

[0008] According to some embodiments, the sensor layer may further include a plurality of fifth lines respectively connected to the plurality of second electrodes.

[0009] According to some embodiments, at least a portion of each of the first line and the second line may extend in a first direction and may be located in the active region.

[0010] According to some embodiments, the plurality of first sub - electrodes and the plurality of second sub - electrodes may be electrically insulated from each other.

[0011] According to some embodiments, the first line, the second line, the third line, and the fourth line may be connected to a sensor driving unit.

[0012] According to some embodiments, the sensor driving unit may include a differential amplifier, the first line may be electrically connected to a first terminal of the differential amplifier, and the second line may be electrically connected to a second terminal of the differential amplifier.

[0013] According to some embodiments, in a plan view, the third line and the fourth line may overlap with the plurality of second electrodes.

[0014] According to some embodiments, the sensor driving unit may include a sensor control circuit, a signal generation circuit, and an input detection circuit, and the signal generation circuit may sequentially provide driving signals to the plurality of second electrodes.

[0015] According to some embodiments, the input detection circuit may include a plurality of signal receiving units, each of the signal receiving units includes an amplifier, and the third line and the fourth line may be electrically connected to the plurality of signal receiving units.

[0016] According to some embodiments, the first line and the second line may be disposed in the active region.

[0017] According to some embodiments, the plurality of first electrodes may extend in a first direction, the plurality of first electrodes may be arranged in a second direction, the plurality of second electrodes may be arranged in the first direction, and the plurality of first electrodes and the plurality of second electrodes may be insulated from each other and intersect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other aspects and features of the present disclosure will become apparent by describing some aspects of embodiments of the present disclosure in more detail with reference to the accompanying drawings.

[0019] Figure 1 is a perspective view of an electronic device according to some embodiments of the present disclosure.

[0020] Figure 2 is a cross - sectional view of an electronic device according to some embodiments of the present disclosure.

[0021] Figure 3 is a cross - sectional view of a display module according to some embodiments of the present disclosure.

[0022] Figure 4 is a view for describing the operation of an electronic device according to some embodiments of the present disclosure.

[0023] Figure 5 is a cross-sectional view of a display module along line I-I' according to some embodiments of the present disclosure. Figure 1 of

[0024] Figure 6 is a block diagram of a sensor layer and a sensor driving unit according to some embodiments of the present disclosure.

[0025] Figure 7 is a plan view of a sensor layer and a sensor driving unit according to some embodiments of the present disclosure.

[0026] Figure 8 is a block diagram of a sensor layer and an input detection circuit according to some embodiments of the present disclosure.

[0027] Figure 9 is a plan view showing an enlarged area A according to some embodiments of the present disclosure. Figure 7 of

[0028] Figure 10 is a cross-sectional view along line II-II' according to some embodiments of the present disclosure. Figure 9 of

[0029] Figure 11 is a cross-sectional view along line III-III' according to some embodiments of the present disclosure. Figure 9 of

[0030] Figure 12 is a plan view showing a part of an electronic device according to some embodiments of the present disclosure.

[0031] Figure 13 is a view for describing the operation of an electronic device according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0032] In this specification, the expression that a first component (or region, layer, part, portion, etc.) "is located on", "is connected to", or "is coupled to" a second component means that the first component is directly located on / connected to / coupled to the second component, or means that a third component is disposed between the first component and the second component.

[0033] The same reference numerals denote the same components. In addition, in the drawings, for an effective description of the technical content, the thickness, ratio, and dimensions of the components are exaggerated. The expression "and / or" includes one or more combinations that the related components can define.

[0034] Although terms such as "first", "second", etc. may be used to describe various components, the components should not be limited by the terms. These terms are only used to distinguish one component from another. For example, without departing from the proper scope of the present disclosure, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. Unless clearly indicated otherwise in the context, singular expressions also include plural expressions.

[0035] In addition, terms such as "under", "below", "on", "above", etc. are used to describe the relevance of the components shown in the drawings. As conceptually opposite terms, they are described based on the directions shown in the drawings.

[0036] It will be understood that terms such as "comprising", "including", "having", etc. illustrate the presence of the features, numbers, steps, operations, elements or components described in the specification, or combinations thereof, and do not preclude the presence or additional possibility of one or more other features, numbers, steps, operations, elements or components, or combinations thereof.

[0037] Unless otherwise defined, all terms (including technical and scientific terms) used in the specification have the same meaning as commonly understood by those skilled in the art to which the present disclosure pertains. In addition, terms (such as those defined in a general dictionary) should be interpreted as having a meaning consistent with the meaning in the context of the relevant art, and should not be interpreted as being overly idealized or overly formal, unless clearly defined herein.

[0038] Hereinafter, aspects of some embodiments of the present disclosure will be described with reference to the drawings.

[0039] Figure 1 is a perspective view of an electronic device according to some embodiments of the present disclosure.

[0040] Referring to Figure 1 , the electronic device ELD may be a device activated according to an electrical signal. For example, the electronic device ELD may be a mobile phone, a foldable mobile phone, a laptop computer, a television, a tablet computer, a vehicle navigation system, a game console, or a wearable device, but is not limited thereto according to embodiments of the present disclosure. As an example for the purpose of description, Figure 1 exemplarily shows that the electronic device ELD is a mobile phone.

[0041] The electronic device ELD can display an image and can sense an external input applied from an external unit. The external input can be an input from a user. The user input can include various types of external inputs such as a part US_F of the user's body, a pen PN, light, heat, or pressure. The user input can include all inputs that can change the capacitance of the sensor layer.

[0042] An active area AA and a peripheral area NAA can be defined in the electronic device ELD. The electronic device ELD can display an image at the active area AA. The active area AA can include a plane defined by a first direction DR1 and a second direction DR2. The peripheral area NAA can surround the periphery of the active area AA (or be located outside the occupied area of the active area AA). According to some embodiments of the present disclosure, the peripheral area NAA can be omitted.

[0043] The thickness direction of the electronic device ELD can be parallel to a third direction DR3 that intersects the first direction DR1 and the second direction DR2. Accordingly, a front surface (or an upper surface) and a rear surface (or a lower surface) of the components constituting the electronic device ELD can be defined based on the third direction DR3.

[0044] Figure 1 An exemplary bar-shaped electronic device ELD is shown, but the embodiments according to the present disclosure are not limited thereto. For example, the following description can be applied to various electronic devices ELD such as a foldable electronic device, a rollable electronic device, or a slidable electronic device.

[0045] Figure 2 is a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0046] Referring to Figure 2 , the electronic device ELD can include a display module DM and a window WM. The display module DM can display an image and detect an external input. The display module DM can include a display layer DP and a sensor layer ISP.

[0047] A display area and a non-display area corresponding to the active area AA (see Figure 1 ) and the peripheral area NAA (see Figure 1 ) of the electronic device ELD can be defined in the display layer DP.

[0048] The display layer DP according to some embodiments of the present disclosure may be a light-emitting display layer, but the embodiments of the present disclosure are not limited thereto. For example, the display layer DP may be an organic light-emitting display layer, a quantum dot light-emitting display layer, a micro light-emitting diode (LED) display layer, or a nano-LED display layer. The light-emitting layer of the organic light-emitting display layer may include an organic light-emitting material. The light-emitting layer of the quantum dot light-emitting display layer may include quantum dots, quantum rods, etc. The light-emitting layer of the micro-LED display layer may include micro-LEDs. The light-emitting layer of the nano-LED display layer may include nano-LEDs.

[0049] The sensor layer ISP may be directly located on the display layer DP. According to some embodiments of the present disclosure, the sensor layer ISP may be formed on the display layer DP through a continuous process. That is, when the sensor layer ISP is directly located on the display layer DP, the internal adhesive layer is not located between the sensor layer ISP and the display layer DP.

[0050] The electronic device ELD may further include an optical member located on the display module DM. The optical member may be an anti-reflection layer that can reduce the external light reflectance. The optical member may include a polarizer and a phase retarder. The polarizer and the phase retarder may be of the stretching type or the coating type. The optical axis of the coating type optical film is defined according to the stretching direction of the functional film. The coating type optical film may include liquid crystal molecules arranged on a substrate film.

[0051] According to some embodiments of the present disclosure, the optical member may be omitted. In this case, the display module DM may further include a color filter and a black matrix instead of the optical member.

[0052] The window WM provides the outer surface of the electronic device ELD. The window WM may include a substrate base, and may also include functional layers such as an anti-reflection layer and an anti-fingerprint layer.

[0053] According to some embodiments, the display module DM may further include at least one adhesive layer ADL. The adhesive layer ADL may bond the components of the display module DM. The adhesive layer ADL may be an optically transparent adhesive layer or a pressure-sensitive adhesive layer.

[0054] The window WM may include a light-shielding pattern WBM for defining a peripheral area NAA (see Figure 1 ). The light-shielding pattern WBM may be a colored organic layer, and may be formed on one surface of the window substrate layer WM-BS using, for example, a coating method.

[0055] Figure 3 is a cross-sectional view of a display module according to some embodiments of the present disclosure.

[0056] [[ID=Z7]]Referring to Figure 3 , the display module DM may include a display layer DP and a sensor layer ISP.

[0057] The display layer DP may include a substrate layer BL, a circuit layer DP-CL, a light-emitting element layer DP-ED, and a encapsulation layer TFL.

[0058] The substrate layer BL may be a member providing a substrate surface on which the circuit layer DP-CL is located. The substrate layer BL may have a multi-layer structure or a single-layer structure. The substrate layer BL may be a glass substrate, a metal substrate, a silicon substrate, a polymer substrate, etc., but is not limited thereto according to embodiments of the present disclosure.

[0059] The circuit layer DP-CL may be located on the substrate layer BL. The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, signal lines, etc. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the substrate layer BL by means such as coating and deposition, and the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned through a plurality of lithography processes.

[0060] The light-emitting element layer DP-ED may be located on the circuit layer DP-CL. The light-emitting element layer DP-ED may include light-emitting elements. For example, the light-emitting element layer DP-ED may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0061] The encapsulation layer TFL may be located on the light-emitting element layer DP-ED. The encapsulation layer TFL may protect the light-emitting element layer DP-ED from foreign substances or contaminants such as moisture, oxygen, and dust particles.

[0062] The sensor layer ISP may be located on the display layer DP. The sensor layer ISP may sense an external input applied from an external unit. The sensor layer ISP may be an integrated sensor continuously formed during the process of manufacturing the display layer DP, or the sensor layer ISP may be an external sensor attached to the display layer DP.

[0063] Figure 4 is a view for describing the operation of an electronic device according to some embodiments of the present disclosure.

[0064] Referring to Figure 4 , the electronic device ELD may include a display layer DP, a sensor layer ISP, a display driving unit 100C, a sensor driving unit 200C, a main driving unit 1000C, and a power circuit 1000P.

[0065] The sensor layer ISP can sense a first input 2000 and a second input 3000 applied from an external unit. The first input 2000 and the second input 3000 can be input methods that can provide a change in capacitance of the sensor layer ISP, or can be input methods that can induce an induced current in the sensor layer ISP. For example, the first input 2000 can be a passive input mechanism such as a user's body. The second input 3000 can be an input from a pen PN or an input from a radio frequency integrated circuit (RFIC) tag. For example, the pen PN can be a passive pen or an active pen.

[0066] According to some embodiments of the present disclosure, the pen PN can be a device that generates a magnetic field having a resonant frequency (e.g., a set or predetermined resonant frequency). The pen PN can be configured to transmit an output signal based on an electromagnetic resonance method. The pen PN can be referred to as an input device, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.

[0067] The pen PN can include an RLC resonance circuit, and the RLC resonance circuit can include an inductor L and a capacitor C. According to some embodiments of the present disclosure, the RLC resonance circuit can be a variable resonance circuit having a variable resonance frequency. In this case, the inductor L can be a variable inductor and / or the capacitor C can be a variable capacitor, but is not limited thereto according to the embodiments of the present disclosure.

[0068] The inductor L generates a current through the magnetic field formed in the sensor layer ISP. However, it is not limited thereto according to the embodiments of the present disclosure. For example, when the pen PN operates as an active type, even when the pen PN does not receive a magnetic field from an external unit, the pen PN can generate a current. The generated current is transmitted to the capacitor C. The capacitor C charges the current input from the inductor L and discharges the charged current to the inductor L. Thereafter, the inductor L can emit a magnetic field having a resonant frequency. The induced current can flow in the sensor layer ISP through the magnetic field emitted by the pen PN, and the induced current as a received signal (or sensed signal) can be transmitted to the sensor driving unit 200C.

[0069] The main driving unit 1000C can control the overall operation of the electronic device ELD. For example, the main driving unit 1000C can control the operations of the display driving unit 100C and the sensor driving unit 200C. The main driving unit 1000C can include at least one microprocessor and can also include a graphics controller. The main driving unit 1000C can be referred to as an application processor, a central processing unit, or a main processor.

[0070] The display driving unit 100C can drive the display layer DP. The display driving unit 100C can receive image data and control signals from the main driving unit 1000C. The control signals can include various signals. For example, the control signals can include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock, a data enable signal, etc.

[0071] The sensor driving unit 200C can drive the sensor layer ISP. The sensor driving unit 200C can receive control signals from the main driving unit 1000C. The control signals can include the clock signal of the sensor driving unit 200C. In addition, the control signals can also include a mode determination signal for determining the driving mode of the sensor driving unit 200C and the sensor layer ISP.

[0072] The sensor driving unit 200C can be implemented as an integrated circuit (IC) and electrically connected to the sensor layer ISP. For example, the sensor driving unit 200C can be directly mounted on the area of the display layer DP (e.g., a set or predetermined area), or mounted on a separate printed circuit board using the chip-on-film (COF) method and electrically connected to the sensor layer ISP.

[0073] The sensor driving unit 200C and the sensor layer ISP can selectively operate in a first mode or a second mode. For example, the first mode can be a mode for sensing a touch input (e.g., the first input 2000). The second mode can be a mode for sensing an input from the pen PN (e.g., the second input 3000). The first mode can be referred to as a touch sensing mode, and the second mode can be referred to as a pen sensing mode.

[0074] The switching between the first mode and the second mode can be performed in various ways. For example, the sensor driving unit 200C and the sensor layer ISP can be driven in the first mode and the second mode in a time-division manner, and can sense the first input 2000 and the second input 3000. Optionally, the switching between the first mode and the second mode can be generated by the user's selection or by a specific action of the user, any one of the first mode and the second mode can be activated or deactivated by activating or deactivating a specific application, or the current mode can be switched from one of the first mode and the second mode to the other. Optionally, while the sensor driving unit 200C and the sensor layer ISP alternately operate in the first mode and the second mode, when the first input 2000 is sensed, the first mode is maintained, or when the second input 3000 is sensed, the second mode is maintained.

[0075] The sensor driving unit 200C can calculate the input coordinate information based on the signal received from the sensor layer ISP, and provide a coordinate signal with the coordinate information to the main driving unit 1000C. The main driving unit 1000C performs an operation corresponding to the user's input based on the coordinate signal. For example, the main driving unit 1000C can operate the display driving unit 100C so that a new application image is displayed on the display layer DP.

[0076] The power supply circuit 1000P can include a power management integrated circuit (PMIC). The power supply circuit 1000P can generate a plurality of driving voltages for driving the display layer DP, the sensor layer ISP, the display driving unit 100C, and the sensor driving unit 200C. For example, the plurality of driving voltages can include a first driving voltage (e.g., ELVSS voltage), a second driving voltage (e.g., ELVDD voltage), an initialization voltage, etc., but are not limited to the above examples according to the embodiments of the present disclosure.

[0077] Figure 5 is a cross-sectional view of the display module along the line I-I' according to some embodiments of the present disclosure. In the Figure 1 description, the components described by Figure 5 are denoted by the same reference numerals, and some of their repeated descriptions may be omitted. Figure 3

[0078] Figure 5 Referring to , the substrate layer BL can provide a substrate surface on which the circuit layer DP-CL is located. The circuit layer DP-CL can be located on the substrate layer BL. The circuit layer DP-CL can include an insulating layer, a semiconductor pattern, a conductive pattern, signal lines, etc. The insulating layer, the semiconductor layer, and the conductive layer can be formed on the substrate layer BL in such a manner as coating and deposition, and then the insulating layer, the semiconductor layer, and the conductive layer can be selectively patterned through a plurality of photolithography processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal lines included in the circuit layer DP-CL can be formed.

[0079] At least one inorganic layer is formed on the upper surface of the substrate layer BL. According to some embodiments, it is shown that the display layer DP includes a buffer layer BFL. The buffer layer BFL can relatively improve the bonding force between the substrate layer BL and the semiconductor pattern. The buffer layer BFL can include a silicon oxide layer and a silicon nitride layer, and the silicon oxide layer and the silicon nitride layer can be alternately laminated.

[0080] The semiconductor pattern can be located on the buffer layer BFL. The semiconductor pattern can include polysilicon. However, according to the embodiments of the present disclosure, it is not limited thereto, and the semiconductor pattern can include amorphous silicon or metal oxide.

[0081] Figure 5 ​Only a part of the semiconductor pattern is shown, and the semiconductor pattern may also be located in another region. The semiconductor pattern may be set across pixels according to a specific rule. Depending on whether the semiconductor pattern is doped, the semiconductor pattern may have different electrical properties. The semiconductor pattern may include a first region having a higher conductivity and a second region having a lower conductivity. The first region may be doped with an N-type dopant or a P-type dopant. The P-type transistor includes a doped region doped with a P-type dopant. The second region may be an undoped region or may be doped at a concentration lower than that of the first region.

[0082] The conductivity of the first region is greater than that of the second region, and the first region basically serves as an electrode or a signal line. The second region may substantially correspond to the active region (or channel region) of the pixel transistor TR-P. In other words, a part of the semiconductor pattern may be the active region of the transistor, and another part thereof may be the source region or the drain region of the transistor.

[0083] Each of the pixels may have an equivalent circuit including seven transistors, one capacitor, and a light-emitting element, and the equivalent circuit of the pixel may be modified into various forms. Figure 5 Exemplarily shown is one pixel transistor TR-P and one light-emitting element ED included in the pixel.

[0084] The source region SR, the channel region CHR, and the drain region DR of the pixel transistor TR-P may be formed of the semiconductor pattern. The source region SR and the drain region DR may extend in opposite directions from the channel region CHR in a cross section. Figure 5 Shown is a part of the signal transmission region SCL formed in the first region of the semiconductor pattern. According to some embodiments, the signal transmission region SCL may be electrically connected to the pixel transistor TR-P in a plane.

[0085] The first insulating layer IL1 may be located on the buffer layer BFL. The first insulating layer IL1 may commonly overlap with a plurality of pixels and cover the semiconductor pattern. The first insulating layer IL1 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The first insulating layer IL1 may include at least one of alumina, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. According to some embodiments, the first insulating layer IL1 may be a single-layer silicon oxide layer. The insulating layer of the circuit layer DP-CL described below and the first insulating layer IL1 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The inorganic layer may include at least one of the above materials, but is not limited thereto according to the embodiments of the present disclosure.

[0086] The gate GE of the pixel transistor TR-P is located on the first insulating layer IL1. The gate GE can be part of a metal pattern. The gate GE overlaps with the channel region CHR. The gate GE can be used as a mask in the process of doping a semiconductor pattern.

[0087] The second insulating layer IL2 can be located on the first insulating layer IL1 and cover the gate GE. The second insulating layer IL2 can commonly overlap with the pixel. The second insulating layer IL2 can be an inorganic layer and / or an organic layer and can have a single-layer structure or a multi-layer structure. According to some embodiments, the second insulating layer IL2 can be a single-layer silicon oxide layer.

[0088] The third insulating layer IL3 can be located on the second insulating layer IL2. According to some embodiments, the third insulating layer IL3 can be a single-layer silicon oxide layer. The first connection electrode CNE1 can be located on the third insulating layer IL3. The first connection electrode CNE1 can be connected to the signal transmission region SCL through a contact hole CNT1 that passes through the first insulating layer IL1, the second insulating layer IL2, and the third insulating layer IL3.

[0089] The fourth insulating layer IL4 can be located on the third insulating layer IL3. The fourth insulating layer IL4 can be a single-layer silicon oxide layer. The fifth insulating layer IL5 can be located on the fourth insulating layer IL4. The fifth insulating layer IL5 can be an organic layer. At the same time, the fourth insulating layer IL4 can be omitted, and the fifth insulating layer IL5 can be directly located on the third insulating layer IL3.

[0090] The second connection electrode CNE2 can be located on the fifth insulating layer IL5. The second connection electrode CNE2 can be connected to the first connection electrode CNE1 through a contact hole CNT2 that passes through the fourth insulating layer IL4 and the fifth insulating layer IL5.

[0091] The sixth insulating layer IL6 can be located on the fifth insulating layer IL5 and cover the second connection electrode CNE2. The sixth insulating layer IL6 can be an organic layer. The light-emitting element layer DP-ED can be located on the circuit layer DP-CL. The light-emitting element layer DP-ED can include a light-emitting element ED. The light-emitting element ED can include a first electrode AE, a light-emitting layer EL, and a second electrode CE. For example, the light-emitting layer EL can include an organic light-emitting material, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0092] The first electrode AE can be located on the sixth insulating layer IL6. The first electrode AE can be connected to the second connection electrode CNE2 through a contact hole CNT3 that passes through the sixth insulating layer IL6.

[0093] The pixel defining film IL7 may be located on the sixth insulating layer IL6 and cover a part of the first electrode AE. An opening OP7 is defined in the pixel defining film IL7. At least a part of the first electrode AE is exposed through the opening OP7 of the pixel defining film IL7. According to some embodiments, the light emitting region PXA is defined to correspond to a partial region of the first electrode AE, and this partial region is exposed by the opening OP7. The non-light emitting region NPXA may surround the light emitting region PXA.

[0094] The light emitting layer EL may be located on the first electrode AE. The light emitting layer EL may be arranged to correspond to the opening OP7. That is, the light emitting layer EL may be separately formed for each pixel. When the light emitting layer EL is separately formed for each pixel, each of the light emitting layers EL may emit light having at least one of blue, red, and green. However, according to the embodiments of the present disclosure, it is not limited thereto, and the light emitting layer EL may be connected to the pixels and may be provided commonly. In this case, the light emitting layer EL may also provide blue light or white light.

[0095] The second electrode CE may be located on the light emitting layer EL. The second electrode CE may have an integral shape and may be commonly arranged in a plurality of pixels. A common voltage may be provided to the second electrode CE, and the second electrode CE may be referred to as a common electrode.

[0096] According to some embodiments, a hole control layer may be located between the first electrode AE and the light emitting layer EL. The hole control layer may be commonly located in the light emitting region PXA and the non-light emitting region NPXA. The hole control layer may include a hole transport layer and may also include a hole injection layer. An electron control layer may be located between the light emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may also include an electron injection layer. The hole control layer and the electron control layer may be commonly formed in the pixels using an opening mask.

[0097] The sensor layer ISP may be directly formed on the upper surface of the encapsulation layer TFL by a continuous process. The sensor layer ISP may include a first sensor insulating layer IIL1, a first sensor conductive layer ICL1, a second sensor insulating layer IIL2, a second sensor conductive layer ICL2, and a third sensor insulating layer IIL3. In the specification, the first sensor insulating layer IIL1 may be referred to as the "substrate insulating layer".

[0098] Each of the first sensor conductive layer ICL1 and the second sensor conductive layer ICL2 may include a plurality of patterns having a single-layer structure or a multi-layer structure in which layers are stacked in the third direction DR3. The conductive layer having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO). Additionally, the transparent conductive layer may include conductive polymers such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, or graphene.

[0099] The conductive layer having a multi-layer structure may include a metal layer. The metal layer may have, for example, a three-layer structure of titanium / aluminum / titanium. The conductive layer having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0100] The second sensor insulating layer IIL2 covers the first sensor conductive layer ICL1, and the third sensor insulating layer IIL3 covers the second sensor conductive layer ICL2. It is shown that the first sensor insulating layer IIL1 to the third sensor insulating layer IIL3 have a single-layer structure, but this is not limited according to embodiments of the present disclosure.

[0101] At least one of the first sensor insulating layer IIL1 and the second sensor insulating layer IIL2 may include an inorganic layer. The inorganic layer may include at least one of alumina, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0102] At least one of the second sensor insulating layer IIL2 and the third sensor insulating layer IIL3 may include an organic layer. The organic film may include at least one of acrylate resins, methacrylate resins, polyisoprene resins, ethylene resins, epoxy resins, urethane resins, cellulose resins, silicone resins, polyimide resins, polyamide resins, and perylene resins.

[0103] Figure 6 is a block diagram of a sensor layer and a sensor driving unit according to some embodiments of the present disclosure.

[0104] Referring to Figure 6 , an active area SA and a peripheral area NSA adjacent to the active area SA may be defined in the sensor layer ISP. The active area SA and the peripheral area NSA may correspond to the active area AA (see Figure 1 ) and the peripheral area NAA (see Figure 1 ) of the electronic device ELD (see Figure 1corresponds to. The active area SA can be an area that is activated according to an electrical signal. For example, the active area SA can be an area for sensing an input.

[0105] The sensor layer ISP can include a plurality of first electrodes RE and a plurality of second electrodes TE.

[0106] The plurality of first electrodes RE can be arranged to be spaced apart from each other in the second direction DR2. The plurality of first electrodes RE can extend in the first direction DR1.

[0107] The plurality of second electrodes TE can be arranged to be spaced apart from each other in the first direction DR1. The plurality of second electrodes TE can extend in the second direction DR2.

[0108] The sensor driving unit 200C can be electrically connected to the sensor layer ISP. The sensor driving unit 200C can control the sensor layer ISP. The sensor driving unit 200C can receive a control signal I-CS from the main driving unit 1000C (see Figure 4 ), and provide a coordinate signal I-SS to the main driving unit 1000C (see Figure 4 ).

[0109] The sensor driving unit 200C can include a sensor control circuit 200C1, a signal generation circuit 200C2, and an input detection circuit 200C3. The sensor control circuit 200C1, the signal generation circuit 200C2, and the input detection circuit 200C3 can be implemented in a single chip, or some of the sensor control circuit 200C1, the signal generation circuit 200C2, and the input detection circuit 200C3 and others can be implemented in different chips.

[0110] The sensor control circuit 200C1 can control the mode of the sensor layer ISP. The sensor control circuit 200C1 can control the operation of the signal generation circuit 200C2, and calculate the coordinates of an external input according to the signal received from the input detection circuit 200C3.

[0111] The signal generation circuit 200C2 can output an output signal corresponding to the operation mode to the sensor layer ISP. The signal generation circuit 200C2 can provide a first touch signal TS (or driving signal), which is called a TX signal, to the sensor layer ISP. The first touch signal TS can be sequentially provided to the plurality of second electrodes TE.

[0112] The input detection circuit 200C3 can convert an analog signal, which is a second touch signal RS (or detection signal) called an RX signal received from the sensor layer ISP, into a digital signal. The input detection circuit 200C3 can amplify and filter the received analog signal. Thereafter, the input detection circuit 200C3 can convert the filtered signal into a digital signal. The input detection circuit 200C3 can reduce or remove noise of the received second touch signal RS. This will be described below.

[0113] Figure 7 is a plan view of a sensor layer and a sensor driving unit according to some embodiments of the present disclosure. In Figure 7 the description of, components described by Figure 6 are denoted by the same reference numerals, and some of their repetitive descriptions may be omitted.

[0114] Referring to Figure 7 , an active area SA and a peripheral area NSA may be defined in the sensor layer ISP. A part of the active area SA may be defined as a first area AR1, and another part of the active area SA may be defined as a second area AR2. That is, when viewed on a plane (e.g., in a plan view), the first area AR1 and the second area AR2 may not overlap each other. The second area AR2 may be adjacent to the first area AR1 in a first direction DR1.

[0115] The sensor layer ISP may include a plurality of first electrodes RE, a plurality of second electrodes TE, a first line L1, a second line L2, a third line L3, a fourth line L4, and a fifth line L5.

[0116] The plurality of first electrodes RE and the plurality of second electrodes TE may be electrically insulated from each other and may intersect each other.

[0117] Each of the plurality of first electrodes RE may include a plurality of first sub - electrodes SME1 and a plurality of second sub - electrodes SME2. The plurality of first sub - electrodes SME1 and the plurality of second sub - electrodes SME2 may be alternately arranged in a first direction DR1. The plurality of first sub - electrodes SME1 and the plurality of second sub - electrodes SME2 may be electrically insulated from each other.

[0118] According to the present disclosure, a first channel including a plurality of first sub - electrodes SME1 and a second channel including a plurality of second sub - electrodes SME2 may be defined in each of the plurality of first electrodes RE. The number of channels of the plurality of first electrodes RE that receive the second touch signal RS (see Figure 6 ) can be increased, and thus, the noise can be reduced by half. Therefore, an electronic device ELD (see Figure 1 ) having relatively improved sensing reliability can be provided.

[0119] The plurality of first electrodes RE may include a first row of first electrodes RE1, a second row of first electrodes RE2, a (k-1)-th row of first electrodes REk-1, and a k-th row of first electrodes REk. In this case, k may be a natural number greater than 3. The first row of first electrodes RE1, the second row of first electrodes RE2, the (k-1)-th row of first electrodes REk-1, and the k-th row of first electrodes REk may be arranged in a second direction DR2.

[0120] The plurality of second electrodes TE may include a first column of second electrodes TE1, a second column of second electrodes TE2, a (n-1)-th column of second electrodes TEn-1, and an n-th column of second electrodes TEn. In this case, n may be a natural number greater than 3. The first column of second electrodes TE1, the second column of second electrodes TE2, the (n-1)-th column of second electrodes TEn-1, and the n-th column of second electrodes TEn may be arranged in a first direction DR1.

[0121] The first line L1 may be electrically connected to the plurality of first sub-electrodes SME1. The first line L1 located in the active region SA may extend in the first direction DR1, and the first line L1 located in the peripheral region NSA may extend in the second direction DR2.

[0122] The plurality of first sub-electrodes SME1 may be electrically connected to the sensor driving unit 200C through the first line L1.

[0123] The second line L2 may be electrically connected to the plurality of second sub-electrodes SME2. The second line L2 located in the active region SA may extend in the first direction DR1, and the second line L2 located in the peripheral region NSA may extend in the second direction DR2. Within the active region SA, the second line L2 may be spaced apart from the first line L1 in the second direction DR2.

[0124] The third line L3 may be connected to one of the plurality of first sub-electrodes SME1. The third line L3 may extend in the second direction DR2. The third line L3 may be located in the first region AR1. When viewed in a plane (e.g., in a plan view), the third line L3 may not overlap with the second region AR2. The third line L3 may be provided as a plurality of third lines L3, and the plurality of third lines L3 may be electrically connected to the plurality of first electrodes RE respectively. In the plan view, the third line L3 may overlap with one of the plurality of second electrodes TE.

[0125] The fourth line L4 can be connected to one of a plurality of second sub - electrodes SME2. The fourth line L4 can extend in a second direction DR2. The fourth line L4 can be located in a second region AR2. When viewed in a plane (e.g., in a plan view), the fourth line L4 may not overlap with the first region AR1. The fourth line L4 can be provided as a plurality of fourth lines L4, and the plurality of fourth lines L4 can be electrically connected to a plurality of first electrodes RE respectively. In the plan view, the fourth line L4 may overlap with one of a plurality of second electrodes TE.

[0126] According to the present disclosure, the third line L3 and the fourth line L4 can extend to overlap with the active region SA. For example, the third line L3 and the fourth line L4 may not be arranged in a peripheral region NSA adjacent to the active region SA in a first direction DR1. The area of the peripheral region NSA can be reduced. Thus, the area of the peripheral region NAA (see Figure 1 ) can be reduced, and an electronic device ELD with a narrow border can be provided (see Figure 1 ).

[0127] The first line L1 to the fourth line L4 can be electrically connected to the sensor driving unit 200C. The first line L1 to the fourth line L4 can transmit a second touch signal RS (see Figure 6 ) to the sensor driving unit 200C.

[0128] According to the present disclosure, four wirings including the first line L1 to the fourth line L4 can be connected to one first electrode RE. The resistance of the wiring for transmitting the second touch signal RS (see Figure 6 ) can be reduced. Thus, the bandwidth of the wiring can be increased. The range of selectable frequencies is increased, so it is easier to avoid noise, and the touch performance can be relatively improved. Therefore, an electronic device ELD with relatively improved sensing reliability can be provided (see Figure 1 ).

[0129] The fifth line L5 can be provided as a plurality of fifth lines L5. The plurality of fifth lines L5 can be connected to a plurality of second electrodes TE respectively. The plurality of fifth lines L5 can be arranged in the peripheral region NSA.

[0130] The plurality of fifth lines L5 can be electrically connected to the sensor driving unit 200C. The plurality of fifth lines L5 can sequentially supply a first touch signal TS (see Figure 6 ) to the plurality of second electrodes TE.

[0131] The sensor driving unit 200C can obtain information about a user's input based on changes in the mutual capacitance between the plurality of first electrodes RE and the plurality of second electrodes TE.

[0132] The change in the mutual capacitance between the plurality of second electrodes TE and the plurality of first electrodes RE can occur at the position where the user's input is provided. The sensor driving unit 200C can generate coordinate values for the position where the user's input is provided based on the received signals received from the first line L1 to the fourth line L4.

[0133] Figure 8 is a block diagram of a sensor layer and an input detection circuit according to some embodiments of the present disclosure.

[0134] Referring to Figure 7 and Figure 8 , the input detection circuit 200C3 may include a differential amplifier DAMP. The first line L1 may be electrically connected to a first terminal (e.g., a negative terminal) of the differential amplifier DAMP, and the second line L2 may be electrically connected to a second terminal (e.g., a positive terminal) of the differential amplifier DAMP.

[0135] The second touch signal RS input to the first terminal is referred to as a first received signal, and the second touch signal RS input to the second terminal is referred to as a second received signal. The differential amplifier DAMP may generate a difference between the first received signal and the second received signal as an output signal. That is, the sensor driving unit 200C may use the difference between the first received signal and the second received signal to obtain touch information in the effective area SA.

[0136] Figure 9 is a magnified plan view of region A showing according to some embodiments of the present disclosure Figure 7 of Figure 10 is a cross-sectional view taken along line II-II' according to some embodiments of the present disclosure Figure 9 of Figure 11 is a cross-sectional view taken along line III-III' according to some embodiments of the present disclosure Figure 9 of Figure 9 In the description of Figure 7 the components described by

[0137] Referring to Figures 9 to 11 , opening portions T_OP1 and T_OP2 extending in the second direction DR2 may be defined in the plurality of second electrodes TE. Figure 9 Exemplarily, a first opening portion T_OP1 defined in the first column of second electrodes TE1 and a second opening portion T_OP2 defined in the second column of second electrodes TE2 are shown.

[0138] A boundary opening portion T_BOP may be defined between two adjacent second electrodes TE among the plurality of second electrodes TE.

[0139] A corresponding first sub-electrode SME1 among the plurality of first sub-electrodes SME1 may be arranged to correspond to the first opening portion T_OP1 and the boundary opening portion T_BOP. The plurality of first sub-electrodes SME1 may include a plurality of first segmented electrodes S_SME1 and a plurality of first bridging electrodes SBE1.

[0140] Each of the plurality of first segmented electrodes S_SME1 may have a quadrilateral shape including two horizontal sides parallel to the first direction DR1 and two vertical sides parallel to the second direction DR2. The plurality of first segmented electrodes S_SME1 may be spaced apart from each other in the first direction DR1 and the second direction DR2. The plurality of first bridging electrodes SBE1 may be connected to the plurality of first segmented electrodes S_SME1.

[0141] The plurality of first sub-electrodes SME1 may be electrically connected to the first line L1 through the first contact hole CCH1. The first line L1 may extend in the first direction DR1.

[0142] A corresponding second sub-electrode SME2 among the plurality of second sub-electrodes SME2 may be arranged to correspond to the second opening portion T_OP2 and the boundary opening portion T_BOP. The plurality of second sub-electrodes SME2 may include a plurality of second segmented electrodes S_SME2 and a plurality of second bridging electrodes SBE2.

[0143] Each of the plurality of second segmented electrodes S_SME2 may have a quadrilateral shape including two horizontal sides parallel to the first direction DR1 and two vertical sides parallel to the second direction DR2. The plurality of second segmented electrodes S_SME2 may be spaced apart from each other in the first direction DR1 and the second direction DR2. The plurality of second bridging electrodes SBE2 may be connected to the plurality of second segmented electrodes S_SME2.

[0144] The plurality of second sub-electrodes SME2 may be electrically connected to the second line L2 through the second contact hole CCH2. The second line L2 may extend in the first direction DR1.

[0145] The first line L1 and the second line L2 may be spaced apart from each other in the second direction DR2, and the plurality of first sub-electrodes SME1 and the plurality of second sub-electrodes SME2 are disposed between the first line L1 and the second line L2.

[0146] The third line L3 can be connected to one of the plurality of first sub-electrodes SME1. The third line L3 can extend in the second direction DR2. The third line L3 can be located on the first sensor insulating layer IIL1. The second sensor insulating layer IIL2 can cover the third line L3. The plurality of first segmented electrodes S_SME1 can be arranged on the second sensor insulating layer IIL2. The third line L3 can be electrically connected to the plurality of first segmented electrodes S_SME1 through the segmented contact hole SCH1. The third line L3 and the plurality of first segmented electrodes S_SME1 can have a mesh structure.

[0147] The third line L3 can include a first part SLP1 and a second part SLP2. The first part SLP1, the second part SLP2, the first line L1, and the second line L2 can be arranged on the first sensor insulating layer IIL1. The first part SLP1 can be provided as a plurality of first parts SLP1. The first line L1 and the second line L2 can be arranged between the plurality of first parts SLP1.

[0148] The second sensor insulating layer IIL2 can cover the plurality of first parts SLP1, the first line L1, and the second line L2. The second part SLP2 can be located on the second sensor insulating layer IIL2. The second part SLP2 can be electrically connected to the plurality of first parts SLP1 through the plurality of line contact holes BCNT1 and BCNT2.

[0149] When viewed in a plane (e.g., in a plan view), the second part SLP2 can be superimposed on the first line L1 and the second line L2.

[0150] Figure 9 Exemplarily, a plurality of first electrodes RE and a plurality of second electrodes TE having a strip shape are shown, but the shapes of the plurality of first electrodes RE and the plurality of second electrodes TE according to some embodiments of the present disclosure are not limited thereto. For example, the plurality of first electrodes RE and the plurality of second electrodes TE can have a diamond pattern shape.

[0151] Figure 12 is a plan view showing a part of an electronic device according to some embodiments of the present disclosure, Figure 13 is a view showing the operation of an electronic device according to some embodiments of the present disclosure. In Figure 12 the description of, the components described by Figure 7 are denoted by the same reference numerals, and some of their repeated descriptions can be omitted.

[0152] Refer to Figure 12 and Figure 13When the user uses the pen PN, the user can use the pen PN while the user's arm is placed on the effective area SA. In this case, the arm acts as a large-area conductor TC, extending in the same direction as the third line L3 or the fourth line L4, and generating a coupling capacitor C_TC. For example, when the third line L3 of the leftmost first sub-electrode SME1 among the multiple first sub-electrodes SME1 directly connected to the first electrode RE1 of the first row overlaps with the large-area conductor TC on the plane, the capacitance of the coupling capacitor C_TC corresponding to the first sub-electrode SME1 increases.

[0153] When viewed on a plane (e.g., in a floor plan), and when the large-area conductor TC overlaps with the third line L3 in the first region AR1, the large-area conductor TC does not overlap with the second region AR2 spaced from the first region AR1 in the first direction DR1. Therefore, the large-area conductor TC can not overlap with the fourth line L4 on the plane. That is, when one of the third line L3 and the fourth line L4 overlaps with the large-area conductor TC, the other of the third line L3 and the fourth line L4 does not overlap with the large-area conductor TC.

[0154] The third line L3 and the fourth line L4 connected to the multiple first electrodes RE can be spaced apart from each other in the first direction DR1, and at least one of the multiple first sub-electrodes SME1 or at least one of the multiple second sub-electrodes SME2 is placed between the third line L3 and the fourth line L4. That is, the third line L3 can be located in the first region AR1, and the fourth line L4 can be located in the second region AR2 spaced from the first region AR1 in the first direction DR1.

[0155] The third line L3 can be represented as a first resistor R_L3 and a first capacitor C_L3.

[0156] When the coupling capacitor C_TC is formed on the third line L3 through the large-area conductor TC, the fourth line L4 can be spaced apart from the third line L3 by a distance (e.g., a set or predetermined distance) in the first direction DR1, and thus does not overlap with the large-area conductor TC. That is, the fourth line L4 can be spatially separated from the large-area conductor TC. Therefore, no coupling capacitor is formed in the fourth line L4.

[0157] The fourth line L4 can be represented as a second resistor R_L4 and a second capacitor C_L4.

[0158] The third line L3 and the fourth line L4 can be connected to the sensor driving unit 200C through a pad (also known as a "bond pad" or "landing pad") portion PAD. The sensor driving unit 200C can include an input detection circuit 200C3.

[0159] The input detection circuit 200C3 may include a plurality of signal receiving units 201C3, a plurality of conversion circuits 202C3, and a signal processing unit 203C3.

[0160] The plurality of signal receiving units 201C3 may amplify and output the received signals. The plurality of signal receiving units 201C3 may be connected to the pad portion PAD. That is, the third line L3 may be electrically connected to one of the plurality of signal receiving units 201C3, and the fourth line L4 may be electrically connected to another one of the plurality of signal receiving units 201C3.

[0161] The plurality of signal receiving units 201C3 may output a signal corresponding to the voltage difference between the first terminal and the second terminal through the output terminal. Each of the plurality of signal receiving units 201C3 may be implemented as an analog front end (AFE) including an amplifier AMP, a capacitor Ca, and a switch SWr. The amplifier AMP may include an operational (OP) amplifier.

[0162] The first terminal of the amplifier AMP may be electrically connected to the pad portion PAD. A reference voltage Vref may be provided to the second terminal of the amplifier AMP.

[0163] The capacitor Ca and the switch SWr may be connected in parallel between the first terminal and the output terminal of the amplifier AMP.

[0164] The plurality of conversion circuits 202C3 may convert the analog signals input from the plurality of signal receiving units 201C3 into digital signals. Each of the plurality of conversion circuits 202C3 may include an analog-to-digital converter ADC.

[0165] The signal processing unit 203C3 may process the conversion signals (digital signals) from the plurality of conversion circuits 202C3, and compensate for ghost touches based on the signal processing results.

[0166] The first sensing signal sensed by the third line L3 may include noise caused by the large-area conductor TC. In this case, the second sensing signal sensed by the fourth line L4 may be a signal that does not include noise.

[0167] The signal processing unit 203C3 may calculate the difference between the first sensing signal converted into a digital signal and the second sensing signal. The signal processing unit 203C3 may compensate for the coordinates based on this difference.

[0168] The sensor driving unit 200C may compensate for the coordinates based on the difference between the first sensing signal sensed by the third line L3 and the second sensing signal sensed by the fourth line L4. Malfunctions such as ghost touches caused by the large-area conductor TC can be prevented or reduced.

[0169] According to the present disclosure, when a large-area conductor TC is superimposed on any one of a third line L3 and a fourth line L4 and thus a coupling capacitor C_TC is formed at a specific node, the other one of the third line L3 and the fourth line L4 is not superimposed on the large-area conductor TC. A signal processing unit 203C3 may receive a first sensing signal and a second sensing signal. The first sensing signal is obtained by converting a signal that generates noise by the coupling capacitor C_TC into a digital signal, and the second sensing signal is obtained by converting a signal that does not generate noise into a digital signal. The signal processing unit 203C3 may extract only a noise signal corresponding to the noise based on a difference between the first sensing signal and the second sensing signal. The signal processing unit 203C3 may compensate coordinates based on the noise signal. Accordingly, an electronic device ELD having relatively improved sensing reliability can be provided (see Figure 1 ).

[0170] According to the above description, when a large-area conductor is superimposed on any one of a third line and a fourth line such that a coupling capacitor is formed at a specific node, the other one of the third line and the fourth line is not superimposed on the large-area conductor. A sensor driving unit may receive a first sensing signal and a second sensing signal. The first sensing signal is obtained by converting a signal that generates noise by the coupling capacitor into a digital signal, and the second sensing signal is obtained by converting a signal that does not generate noise into a digital signal. The sensor driving unit may extract only a noise signal corresponding to the noise based on a difference between the first sensing signal and the second sensing signal. The sensor driving unit may compensate coordinates based on the noise signal. Accordingly, an electronic device having relatively improved sensing reliability can be provided.

[0171] Although the above has been described with reference to aspects of some embodiments of the present disclosure, it will be understood that those skilled in the art or those of ordinary skill in the art can make various modifications and changes to the present disclosure without departing from the spirit and technical scope of the present disclosure described in the appended claims and their equivalents. Accordingly, the technical scope of the present disclosure is not limited to the detailed description of the specification, but should be defined by the appended claims and their equivalents.

Claims

1. An electronic device, the electronic device comprising: A display layer; A sensor layer on the display layer, and an effective area is defined in the sensor layer; And A sensor driving unit configured to drive the sensor layer, Wherein, a part of the effective area is defined as a first area, and another part of the effective area is defined as a second area adjacent to the first area in a first direction, Wherein, the sensor layer includes: a plurality of first electrodes, each of the plurality of first electrodes includes a plurality of first sub - electrodes and a plurality of second sub - electrodes alternately arranged in the first direction; a plurality of second electrodes, each of the plurality of second electrodes extends in a second direction intersecting the first direction; a first line electrically connected to the plurality of first sub - electrodes; a second line electrically connected to the plurality of second sub - electrodes; a third line extending in the second direction, connected to one of the plurality of first sub - electrodes, and located in the first area; and a fourth line extending in the second direction, connected to one of the plurality of second sub - electrodes, and located in the second area, and Wherein, the sensor driving unit is configured to compensate coordinates based on a difference between a first sensing signal sensed in the third line and a second sensing signal sensed in the fourth line.

2. The electronic device according to claim 1, wherein, The third line and the fourth line are spaced apart from each other in the first direction, and at least one of the plurality of first sub - electrodes and / or at least one of the plurality of second sub - electrodes is disposed between the third line and the fourth line.

3. The electronic device according to claim 1, wherein, The sensor layer further includes a plurality of fifth lines respectively connected to the plurality of second electrodes.

4. The electronic device according to claim 1, wherein, At least a part of each of the first line and the second line extends in the first direction and is located in the effective area.

5. The electronic device according to claim 1, wherein, The plurality of first sub - electrodes and the plurality of second sub - electrodes are electrically insulated from each other.

6. The electronic device according to claim 1, wherein, The first line, the second line, the third line and the fourth line are connected to the sensor driving unit.

7. The electronic device according to claim 6, wherein, The sensor driving unit includes a differential amplifier, the first line is electrically connected to a first terminal of the differential amplifier, and the second line is electrically connected to a second terminal of the differential amplifier.

8. The electronic device according to claim 1, wherein, In a plan view, the third line and the fourth line overlap with the plurality of second electrodes.

9. The electronic device according to claim 1, wherein, The sensor driving unit includes a sensor control circuit, a signal generation circuit and an input detection circuit, and Wherein, the signal generation circuit is configured to sequentially provide driving signals to the plurality of second electrodes.

10. The electronic device according to claim 9, wherein, The input detection circuit includes a plurality of signal receiving units, each of the plurality of signal receiving units includes an amplifier, and Wherein, the third line and the fourth line are electrically connected to the plurality of signal receiving units.

11. The electronic device according to claim 1, wherein, The first line and the second line are arranged in the effective area.

12. The electronic device according to claim 1, wherein, The plurality of first electrodes extend in the first direction, and the plurality of first electrodes are arranged in the second direction, Wherein, the plurality of second electrodes are arranged in the first direction, and Wherein, the plurality of first electrodes and the plurality of second electrodes are insulated from each other and intersect each other.

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