Test method, equipment and test system of radiator

Abstract

The invention provides a radiator test method, equipment and a test system, which can be applied to the technical field of computers. The method comprises the following steps: in response to a test request for a to-be-tested radiator, sending a sensor simulation value corresponding to the test request to the to-be-tested radiator, so that the to-be-tested radiator outputs a heat dissipation control value for the sensor simulation value under the condition that the to-be-tested radiator determines that the sensor simulation value meets a heat dissipation condition; and comparing the heat dissipation control value obtained from the to-be-tested radiator with a preset control value to obtain a test result of the to-be-tested radiator.

Description

Technical Field

[0001] This application relates to the field of computer technology, and particularly to a test method, device, medium, program product and test system for a radiator. Background Art

[0002] With the continuous improvement of server performance, the heat dissipation demand continues to increase. Traditional fan cooling has been difficult to meet the demand due to the bottleneck of heat dissipation efficiency. In contrast, liquid-cooled radiators have significantly improved the heat dissipation efficiency with higher heat conduction efficiency and more precise temperature control ability, and have gradually become the mainstream choice for high-performance server cooling.

[0003] However, the performance test of liquid-cooled radiators still faces challenges. Related technologies trigger the heat dissipation function by changing the local temperature of the server, which is likely to cause irreversible damage to the server due to the particularity of the liquid-cooled system. At the same time, the whole test process relies on manual on-site monitoring, which is not only inefficient but also leads to a waste of human resources. Summary of the Invention

[0004] In view of the above problems, this application provides a test method, device, medium, program product and test system for a radiator.

[0005] According to one aspect of this application, a test method for a radiator is provided, including: in response to a test request for a radiator to be tested, sending a sensor simulation value corresponding to the test request to the radiator to be tested, so that the radiator to be tested outputs a heat dissipation control value for the sensor simulation value when it is determined that the sensor simulation value meets the heat dissipation condition; comparing the heat dissipation control value obtained from the radiator to be tested with a preset control value to obtain a test result of the radiator to be tested.

[0006] Another aspect of this application provides a test system, including: a radiator to be tested and a management controller; the radiator to be tested is used to receive the sensor simulation value sent by the management controller, and is used to output a heat dissipation control value for the sensor simulation value when it is determined that the sensor simulation value meets the heat dissipation condition; the management controller is used to, in response to the received test request for the radiator to be tested, send the sensor simulation value corresponding to the test request to the radiator to be tested, and is used to, when obtaining the heat dissipation control value from the control value receiving module, compare the heat dissipation control value with a preset control value to obtain a test result of the radiator to be tested.

[0007] Another aspect of this application provides an electronic device, including: one or more processors; a memory for storing one or more computer programs, wherein the above one or more processors execute the above one or more computer programs to implement the steps of the above method.

[0008] Another aspect of the present application also provides a computer-readable storage medium, on which a computer program or instruction is stored. When the computer program or instruction is executed by a processor, the steps of the above method are implemented.

[0009] Another aspect of the present application also provides a computer program product, including a computer program or instruction. When the computer program or instruction is executed by a processor, the steps of the above method are implemented.

[0010] According to the test method of the radiator of the present application, by responding to a test request for the radiator to be tested, corresponding sensor simulation values are sent to the radiator to be tested, so that when it is determined that the simulation values meet the heat dissipation conditions, a heat dissipation control value is output, and this value is compared with a preset control value. Since simulation values are used to trigger the heat dissipation function of the radiator to be tested during the test process, direct operation on the server is avoided, and at the same time, the manual monitoring is replaced by an automated comparison process. At least partly, the problems in the related art that the test method is easy to damage the server, has low test efficiency and wastes manpower are solved. The effects of safely and efficiently testing the performance of the liquid-cooled radiator, reducing the test cost and improving the test efficiency are achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Through the following description of the embodiments of the present application with reference to the drawings, the above content and other objects, features and advantages of the present application will be more clearly understood. In the drawings:

[0012] Figure 1 Schematically shows an application scenario diagram of the test method of the radiator according to an embodiment of the present application;

[0013] Figure 2 Schematically shows a flowchart of the test method of the radiator according to an embodiment of the present application;

[0014] Figure 3 Schematically shows a data flow diagram of the test method of the radiator according to the present application;

[0015] Figure 4 Schematically shows a structural diagram of the test system according to an embodiment of the present application; and

[0016] Figure 5 Schematically shows a structural diagram of each module in the test system according to an embodiment of the present application;

[0017] Figure 6 Schematically shows an operation flowchart of each module in the test system according to an embodiment of the present application;

[0018] Figure 7 Schematically shows a block diagram of an electronic device suitable for implementing the test method of the radiator according to an embodiment of the present application. Detailed implementation manners

[0019] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present application. In the following detailed description, for the sake of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present application. However, obviously, one or more embodiments can also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present application.

[0020] The terms used herein are merely for describing specific embodiments and are not intended to limit the present application. The terms "including", "comprising", etc. used herein indicate the presence of the described features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0021] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those of ordinary skill in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0022] In the case of using expressions such as "at least one of A, B, and C, etc.", generally, it should be interpreted according to the meaning commonly understood by those of ordinary skill in the art (for example, "a system having at least one of A, B, and C" should include, but not be limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0023] In the research process, it is found that liquid-cooled radiators use liquid cooling technology to reduce the server temperature. Traditional fan cooling usually uses air cooling for heat dissipation, while in a liquid-cooled radiator, the working liquid does not directly contact the electronic devices. Instead, through highly efficient heat conduction components such as liquid-cooled plates, the heat of the object to be cooled is transferred to the refrigerant. Using the working fluid as an intermediate medium for heat transfer, the heat is transferred from the inside of the cold plate liquid-cooled server to the outside of the cold plate liquid-cooled server, and then cooling treatment is carried out. Liquid-cooled radiators are divided into two types: direct cooling and indirect cooling. Currently, the more commonly used type in the market is the indirect cooling radiator mainly based on cold plate liquid cooling.

[0024] General liquid cooling radiators include various functions such as anti-condensation function, anti-vaporization function, device switching, device set values, and various alarm functions. The heat dissipation system needs to test these functions to determine whether the performance of the heat dissipation system is good or not. Due to the particularity of the liquid cooling heat dissipation device, using a server for functional testing is likely to damage the server and other components, and requires testers to observe on-site for a long time, resulting in a waste of personnel.

[0025] In some related technologies, the test of the liquid cooling radiator is also performed by switching the on-off state of the corresponding pipeline through a solenoid valve. However, in the case of a large number of test requirements, it is necessary to ensure that the tester is always on-site, and the data cannot be recorded in a timely and accurate manner, which is likely to cause a waste of testers and loss of data.

[0026] In view of this, an embodiment of the present application provides a method for testing a radiator, including: in response to a test request for a radiator to be tested, sending a sensor simulation value corresponding to the test request to the radiator to be tested, so that when the radiator to be tested determines that the sensor simulation value meets the heat dissipation condition, outputting a heat dissipation control value for the sensor simulation value; comparing the heat dissipation control value obtained from the radiator to be tested with a preset control value to obtain a test result of the radiator to be tested.

[0027] Figure 1 A schematic diagram shows an application scenario diagram of the method for testing a radiator according to an embodiment of the present application.

[0028] As Figure 1 shown, the application scenario 100 according to this embodiment may include a first terminal device 101, a second terminal device 102, a third terminal device 103, a network 104, a management controller 105, and a radiator to be tested 106. The network 104 is used to provide a medium for communication links between the first terminal device 101, the second terminal device 102, the third terminal device 103, and the management controller 105, and between the management controller 105 and the radiator to be tested 106. The network 104 may include various connection types, such as wired, wireless communication links, or fiber optic cables, etc.

[0029] Users can use the first terminal device 101, the second terminal device 102, and the third terminal device 103 to interact with the server 105 through the network 104 to receive or send messages, etc. Various communication client applications may be installed on the first terminal device 101, the second terminal device 102, and the third terminal device 103, such as shopping applications, web browser applications, search applications, instant messaging tools, email clients, social platform software, etc. (only for example).

[0030] The first terminal device 101, the second terminal device 102, and the third terminal device 103 can be various electronic devices with a display screen and supporting web browsing, including but not limited to smart phones, tablet computers, laptop computers, desktop computers, and the like.

[0031] The management controller 105 can be a Baseboard Management Controller (BMC) or other processors.

[0032] The radiator 106 to be tested can be a radiator with a total control module. The total control module can monitor sensor data in real time, and perform data processing and calculation analysis on the sensor data to obtain the heat dissipation requirement. For example, the radiator 106 to be tested can be a liquid-cooled radiator.

[0033] It should be noted that the method for testing the radiator provided in the embodiments of the present application can generally be executed by the management controller 105. The method for testing the radiator provided in the embodiments of the present application can also be executed by a server or a server cluster that is different from the management controller 105 and can communicate with the first terminal device 101, the second terminal device 102, the third terminal device 103, the radiator 106 to be tested, and / or the management controller 105.

[0034] It should be understood that Figure 1 the numbers of the terminal devices, the network, the management controller, and the radiator to be tested in

[0035] are merely illustrative. According to the implementation requirements, there can be any number of terminal devices, networks, management controllers, and radiators to be tested. Figure 1 Based on the Figures 2 to 3 scenario described below, the method for testing the radiator in the embodiments of the application will be described in detail through

[0036] Figure 2 FIG. schematically shows a flowchart of the method for testing the radiator according to the embodiments of the present application.

[0037] As Figure 2 shown, the method includes operation S210 to operation S220, and the method can be executed by the management controller.

[0038] In operation S210, in response to a test request for the radiator to be tested, a sensor simulation value corresponding to the test request is sent to the radiator to be tested, so that the radiator to be tested outputs a heat dissipation control value for the sensor simulation value when it is determined that the sensor simulation value meets the heat dissipation condition.

[0039] In operation S220, the heat dissipation control value obtained from the radiator to be tested is compared with a preset control value to obtain a test result of the radiator to be tested.

[0040] The test request may include functional test requirements for the radiator to be tested, such as: temperature regulation test, anti-condensation function test, anti-vaporization function test, etc.

[0041] In some embodiments, the test request may further include data related to the functional test requirements, such as: sensor simulation values, etc.

[0042] The sensor simulation values can be obtained by simulating the values of sensors at the coolant inlet and coolant outlet of the radiator to be tested. The types of sensors can include temperature sensors, pressure sensors, etc.

[0043] For example: the sensor simulation values may include inlet temperature simulation value, outlet temperature simulation value, inlet pressure simulation value, and outlet pressure simulation value.

[0044] When the radiator to be tested receives the sensor simulation values, it can calculate whether the sensor simulation values meet the heat dissipation conditions based on the preset operation rules carried by itself. If it meets, it outputs a targeted heat dissipation control value. If it does not meet, it outputs a preset target value.

[0045] The preset control value can be the correct control value corresponding to the sensor simulation values.

[0046] By comparing the heat dissipation control value with the preset control value, it can be determined whether the radiator to be tested can calculate the correct heat dissipation control value according to the comparison result, thereby realizing the test of the radiator to be tested.

[0047] When it is determined that the comparison result indicates that the heat dissipation control value is consistent with the preset control value, it is determined that the test result of the radiator to be tested is passed. When it is determined that the comparison result indicates that the heat dissipation control value is inconsistent with the preset control value, it is determined that the test result of the radiator to be tested is not passed.

[0048] According to the radiator test method of the present application, by responding to the test request for the radiator to be tested, sending the corresponding sensor simulation values to the radiator to be tested, enabling it to output the heat dissipation control value when it determines that the simulation values meet the heat dissipation conditions, and comparing this value with the preset control value. Since the method of using simulation values to trigger the heat dissipation function of the radiator to be tested is adopted during the test process, direct operation on the server is avoided, and at the same time, the automated comparison process replaces manual monitoring. At least partially solves the problems in the related art that the test method is likely to damage the server, has low test efficiency and wastes manpower. It realizes the effects of safely and efficiently testing the performance of the liquid-cooled radiator, reducing the test cost and improving the test efficiency.

[0049] According to an embodiment of the present application, the sensor analog value includes: a temperature analog value; sending the sensor analog value corresponding to the test request to the radiator to be tested may include the following operations.

[0050] In the case where the test request is a temperature regulation test, determine the temperature analog value corresponding to the current moment according to a preset temperature curve, where the preset temperature curve represents the corresponding relationship between the temperature analog value and time; send the temperature analog value to the radiator to be tested, so that when it is determined that there is a target preset temperature threshold in the multiple preset temperature thresholds that matches the temperature analog value in the radiator to be tested, generate a heat dissipation control value corresponding to the target preset temperature threshold.

[0051] The temperature regulation test can be used to test the response of the radiator to be tested to different sensor temperatures.

[0052] In the preset temperature curve, the temperature analog value can continuously rise with time, and after rising to a certain threshold, the temperature analog value changes to a slow rise, so as to simulate the situation that in the actual scenario, the temperature of the server will rapidly increase as the running time increases, and the rising speed will slow down after reaching a certain temperature, so that the sensor analog value can simulate the sensor value in the real scenario.

[0053] During the temperature regulation test, tests can be performed at multiple moments. For example: obtain the temperature analog value corresponding to each moment according to the preset temperature curve and send it to the radiator to be tested in sequence, so as to observe the response of the radiator to be tested to each temperature analog value, and comprehensively analyze the output values of the radiator to be tested for multiple temperature analog values, so as to obtain the test result.

[0054] The multiple preset temperature thresholds can have different heat dissipation control levels, so that the heat dissipation control values corresponding to different preset temperature thresholds can be different.

[0055] According to an embodiment of the present application, the sensor analog values that match the multiple preset temperature thresholds can be sent to the radiator to be tested respectively, and the heat dissipation control values output by the radiator to be tested for each of the multiple sensor analog values are obtained. By performing error analysis on the multiple heat dissipation control values and the preset control values corresponding to the multiple heat dissipation control values respectively, the test result for the radiator to be tested can be obtained. Through the above process, it can be observed that the performance of the radiator to be tested under different preset temperature thresholds, and the stability analysis of the heat dissipation performance of the radiator to be tested can be realized through this test result.

[0056] Error analysis may include calculating the root mean square error, mean absolute error, etc. In the case where it is determined that the comprehensive error value obtained through error analysis is less than the preset error range, it can be determined that the test result of the radiator to be tested is a pass. In the case where it is determined that the comprehensive error value obtained through error analysis is greater than or equal to the preset error range, it can be determined that the test result of the radiator to be tested is a failure.

[0057] The preset temperature thresholds may respectively include an inlet temperature threshold for the simulated inlet temperature value and an outlet temperature threshold for the simulated outlet temperature value. Among the multiple preset temperature thresholds, there may be a low temperature threshold and a high temperature threshold corresponding to the inlet temperature threshold and the outlet temperature threshold respectively, such as: high temperature alarm value, low temperature alarm value, etc.

[0058] According to an embodiment of the present application, by identifying a test request, the functional scope of the test can be determined. And generate realistic temperature simulation values at corresponding time points according to the preset temperature curve, and observe the heat dissipation control values generated by the radiator under different temperature simulation values, so as to determine the response of the radiator to be tested to different temperature simulation values. Making the test result more reflective of the actual situation of the radiator to be tested in actual use, enhancing the effectiveness and practicality of the test.

[0059] According to an embodiment of the present application, a sample radiator to be tested is deployed in a sample server; the business scenario of the sample server is the same as the business scenario of the server where the radiator to be tested is to be deployed; the preset temperature curve is obtained in the following manner.

[0060] Obtain the temperature time series data of the temperature sensors of multiple sample radiators to be tested during a target time period, where the start time and end time of the target time period are the startup time and shutdown time of the sample server respectively; perform trend feature analysis on the multiple temperature time series data respectively to obtain the trend features of the multiple temperature time series data; fuse the trend features of the multiple temperature time series data to obtain a target trend feature; perform curve fitting of temperature changing with time based on the target trend feature to obtain the preset temperature curve.

[0061] The target time period may be the time period from the startup to the shutdown of the sample server.

[0062] The temperature time series data may include the temperature data of the temperature sensor collected at multiple time points.

[0063] The trend feature may be a feature that can reflect the trend and fluctuation of temperature change, such as: the mean, median, standard deviation, peak value, rising slope, falling slope, duration of the rising stage, rising rate, and temperature falling stage of the temperature time series data.

[0064] Different trend feature analysis methods can be adopted according to different trend features to be calculated. For example, when the determined trend features include the duration of the rising stage, the rising rate, and the temperature dropping stage, the trend feature analysis method can be the moving average method or the polynomial fitting method.

[0065] The method for fusing the trend features of multiple temperature time series data is not limited. It can be methods such as calculating the average value of the trend features in the same stage and performing weighted fusion on the average values of the trend features in the same stage for fusion.

[0066] According to the embodiments of the present application, obtaining the temperature time series data of multiple sample radiators to be tested and performing trend feature analysis on the multiple temperature time series data respectively can deeply explore the characteristics of temperature change over time in each sample data. Then, fusing these trend features combines the advantageous information of multiple samples, making the obtained target trend feature more accurately reflect the true trend of temperature change and improving the generality of the preset temperature curve obtained by subsequent curve fitting.

[0067] According to the embodiments of the present application, the sensor analog value includes: a temperature analog value; the temperature analog value includes the inlet temperature analog value at the coolant inlet of the radiator to be tested; sending the sensor analog value corresponding to the test request to the radiator to be tested may include the following operations.

[0068] In the case where the test request is a dehumidification prevention function test, obtaining a preset dew point temperature and an inlet temperature analog value within the dehumidification prevention function trigger range; sending the preset dew point temperature and the inlet temperature analog value within the dehumidification prevention function trigger range to the radiator to be tested, so that the radiator to be tested determines that when the inlet temperature analog value is within the dehumidification prevention function trigger range based on the comparison result between the inlet analog value and the preset dew point temperature, a heat dissipation control value for the inlet temperature analog value is generated.

[0069] The preset dew point temperature can be a key threshold for the preset appearance of condensation.

[0070] The dehumidification prevention function can be a function of monitoring, warning, and taking corresponding measures to prevent or reduce the generation of condensation for the condensation phenomenon.

[0071] The trigger range for the dehumidification prevention function is not limited. For example, it is a temperature range less than the dew point temperature + 3.

[0072] Both the inlet temperature analog value within the dehumidification prevention function trigger range and the first inlet temperature analog value within the dehumidification prevention function off range after the dehumidification prevention function is triggered meet the heat dissipation conditions.

[0073] During the test of the anti-condensation function, the closing range of the anti-condensation function can also be set, so as to send the simulated inlet temperature values within the closing range of the anti-condensation function to the radiator under test, and obtain the heat dissipation control values of the radiator under test for the simulated inlet temperature values.

[0074] The closing range of the anti-condensation function is not limited, for example: it is a temperature range greater than the dew point temperature + 5.

[0075] According to the embodiments of the present application, obtaining the preset dew point temperature and the simulated inlet temperature values within the anti-condensation function trigger range or the simulated inlet temperature values within the anti-condensation function stop range can accurately simulate the actual environmental conditions that may cause condensation during the test. Targetedly test the performance of the radiator under test in the condensation critical state, making the test results more authentic and reliable.

[0076] According to the embodiments of the present application, the sensor simulation values include: pressure simulation values; the pressure simulation values include the simulated inlet pressure value at the coolant inlet of the radiator under test and the simulated outlet pressure value at the coolant outlet; sending the sensor simulation values corresponding to the test request to the radiator under test may include the following operations.

[0077] In the case where the test request is an anti-vaporization function test, obtain the vaporization pressure difference threshold and the simulated inlet pressure value and the simulated outlet pressure value whose pressure difference is less than the vaporization pressure difference threshold; send the vaporization pressure difference threshold, the simulated inlet pressure value and the simulated outlet pressure value to the radiator under test, so that the radiator under test generates a heat dissipation control value for the pressure difference when determining that the pressure difference is within the anti-vaporization function trigger range based on the comparison result between the vaporization pressure difference threshold and the pressure difference between the simulated inlet pressure value and the simulated outlet pressure value.

[0078] The vaporization pressure difference threshold can be a key threshold for the preset condensation phenomenon.

[0079] The simulated inlet pressure value and the simulated outlet pressure value can be obtained through the vaporization pressure difference threshold.

[0080] The simulated inlet pressure value and the simulated outlet pressure value whose pressure difference is within the anti-vaporization function trigger range, and the simulated inlet pressure value and the simulated outlet pressure value whose pressure difference is not within the anti-vaporization function trigger range for the first time after the anti-vaporization function is triggered both meet the heat dissipation conditions.

[0081] When the radiator under test determines that the pressure difference between the simulated inlet pressure value and the simulated outlet pressure value is less than the vaporization pressure difference threshold, it can be determined that the pressure difference is within the anti-vaporization function trigger range. When it is determined that the pressure difference between the simulated inlet pressure value and the simulated outlet pressure value is greater than or equal to the vaporization pressure difference threshold, it can be determined that the pressure difference is not within the anti-vaporization function trigger range.

[0082] In some embodiments, a pressure regulation test can be performed by obtaining a pressure simulation value and sending the pressure simulation value to the radiator to be tested, so that when the radiator to be tested determines that there is a target preset pressure threshold among multiple preset pressure thresholds that matches the pressure simulation value, a heat dissipation control value corresponding to the target preset pressure threshold is generated.

[0083] According to an embodiment of the present application, a vaporization pressure difference threshold and an inlet pressure simulation value and an outlet pressure simulation value with a pressure difference less than the threshold are obtained, so that a scenario where vaporization may occur can be accurately simulated. That is, by setting these specific simulation values, a situation close to the vaporization critical state can be reproduced in the test environment. It provides conditions highly similar to the actual operation for accurately evaluating the anti-vaporization function, making the test results more credible.

[0084] According to an embodiment of the present application, the above-mentioned test method for the radiator further includes: obtaining a target value from the radiator to be tested, where the target value is output by the radiator to be tested when it determines that the sensor simulation value does not meet the heat dissipation condition; comparing the target value with a preset target value to obtain the test result of the radiator to be tested.

[0085] The target value is not limited, and the target value can be data such as a specific numerical value, a special symbol, a space, etc.

[0086] Through the target value, it can be determined that the radiator to be tested does not meet the heat dissipation condition, so that there is no need to output a heat dissipation control value.

[0087] It can be compared whether the target value is consistent with the preset target value to determine whether the radiator to be tested can also detect normal situations.

[0088] Since in the actual scenario, when the radiator to be tested does not meet the heat dissipation condition, no heat dissipation control value will be generated for the signal conversion sub-module and the input / output interface sub-module. Therefore, to ensure consistency with the actual scenario, the target value can be obtained from or sent by the master control module, thus avoiding waste of communication resources.

[0089] According to an embodiment of the present application, it is clarified that when the heat dissipation condition is not met, the radiator to be tested outputs a target value instead of a control value, and the target value is compared with the preset target value. The test for whether the radiator to be tested can judge normal scenarios is realized, improving the comprehensiveness of the test.

[0090] Figure 3 A data flow diagram of the test method for the radiator according to an embodiment of the present application is schematically shown.

[0091] As Figure 3As shown, in response to the test request 301, when the test request 301 is a temperature adjustment test, it is possible to determine a temperature simulation value corresponding to the current moment according to a preset temperature curve, and send the temperature simulation value 302 to the radiator under test, so that when the radiator under test determines that there is a target preset temperature threshold that matches the temperature simulation value 302 among multiple preset temperature thresholds, a heat dissipation control value a 303 corresponding to the target preset temperature threshold is generated.

[0092] When the test request 301 is a condensation prevention function test, obtain a preset dew point temperature 304 and an inlet temperature simulation value 305 within the range where the condensation prevention function is triggered; send the preset dew point temperature 304 and the inlet temperature simulation value 305 within the range where the condensation prevention function is triggered to the radiator under test, so that the radiator under test, based on the comparison result between the inlet simulation value 305 and the preset dew point temperature 304, generates a heat dissipation control value b 306 for the inlet temperature simulation value 305 when it determines that the inlet temperature simulation value 305 is within the range where the condensation prevention function is triggered.

[0093] When the test request 301 is a vaporization prevention function test, obtain a vaporization pressure difference threshold 307, an inlet pressure simulation value 308 and an outlet pressure simulation value 309 whose pressure difference is less than the vaporization pressure difference threshold; send the vaporization pressure difference threshold 307, the inlet pressure simulation value 308 and the outlet pressure simulation value 309 to the radiator under test, so that the radiator under test, based on the comparison result between the vaporization pressure difference threshold 307 and the pressure difference between the inlet pressure simulation value 308 and the outlet pressure simulation value 309, generates a heat dissipation control value c 310 for the pressure difference when it determines that the pressure difference is within the range where the vaporization prevention function is triggered.

[0094] Figure 4 Schematically shows a structural diagram of a test system according to an embodiment of the present application.

[0095] As Figure 4 shown, the test system 400 includes: a management controller 410 and a radiator under test 420.

[0096] The management controller 410 is configured to, in response to a test request received for the radiator under test 420, send a sensor simulation value corresponding to the test request to the radiator under test 420, and is configured to, when obtaining a heat dissipation control value from the control value receiving module, compare the heat dissipation control value with a preset control value to obtain a test result of the radiator under test 420.

[0097] The radiator under test 420 is configured to receive the sensor simulation value sent by the management controller 410, and is configured to output a heat dissipation control value for the sensor simulation value when it determines that the sensor simulation value meets the heat dissipation condition.

[0098] The management controller 410 is used to execute the above-mentioned test method for the radiator.

[0099] The sensor simulation values that need to be changed each time the management controller 410 conducts a test can be, for example, the inlet temperature simulation value, the outlet temperature simulation value, the inlet pressure simulation value, the outlet pressure simulation value, etc.

[0100] The management controller 410 can pre-transmit relevant limit values to the radiator 420 to be tested, such as: preset temperature threshold, preset pressure threshold, preset dew point temperature, vaporization pressure difference threshold, etc.

[0101] According to an embodiment of the present application, the management controller 410 tests whether the radiator 420 to be tested can output the correct heat dissipation control value by simulating the sensor values used to trigger the heat dissipation function of the radiator 420 to be tested and using the sensor simulation values. When testing, it is not necessary to control the temperature of the real server, thus avoiding damage to the server.

[0102] Figure 5 Schematically shows the structural diagram of each module in the test system according to an embodiment of the present application.

[0103] As Figure 5 shown, the radiator 420 to be tested includes: a master control module 421, a communication module 422, a DAC / ADC module 423, and a GPIO module 424. The test system 400 also includes a power supply module 430.

[0104] According to an embodiment of the present application, the radiator 420 to be tested includes: a master control module 421 and a control driving module; the master control module 421 is used to calculate the heat dissipation control value and send the heat dissipation control value to the control driving module when it is determined that the sensor simulation value meets the heat dissipation condition; the control driving module includes a signal conversion sub-module and an input / output interface sub-module. The management controller 410 is also used to: obtain the heat dissipation control value from the control driving module.

[0105] The power supply module can be used to supply power to the management controller 410 and the radiator 420 to be tested. For example: supply power to the master control module 421, the communication module 422, the DAC / ADC module 423, and the GPIO module 424.

[0106] The signal conversion sub-module can be a digital-to-analog / analog-to-digital conversion (DAC / ADC) module.

[0107] The input / output interface sub-module can be a general-purpose input / output (GPIO) module.

[0108] The heat dissipation control value can include an adjustment control value and a switch control value; the adjustment control value can be used to control the rotation speed, opening degree, etc. of the heat dissipation device; the opening degree control value can be used to control the switch of the heat dissipation device.

[0109] The heat dissipation device can be a pump, valve, etc. in a liquid-cooled radiator.

[0110] The master control module 421 is used to calculate the adjustment control value and the switch control value when it is determined that the sensor analog value meets the heat dissipation condition. And send the adjustment control value to the signal conversion sub-module. Send the switch control value to the input / output interface sub-module.

[0111] The management controller 410 is also used to: obtain the adjustment control value from the signal conversion sub-module; obtain the switch control value from the input / output interface sub-module. Thus, it can be known that the heat dissipation control value is obtained from the signal conversion sub-module and the input / output interface sub-module respectively. Therefore, the comparison result between the heat dissipation control value and the preset control value tests the heat dissipation calculation of the master control module 421 while, to a certain extent, also testing the communication transmission capabilities between the master control module 421 and the signal conversion module, as well as between the master control module 421 and the input / output interface module.

[0112] The switch control value is represented in the form of high and low levels. When the target heat dissipation device needs to be turned on, the switch control value for it can be a high level.

[0113] The GPIO module 424 is connected to the GPIO port of the master control module 421, detects the high and low levels stored therein and outputs them to the BMC, that is, the management controller 410, so as to judge whether the switch control value given by the master control module 421 to the module is normal and whether the level output of each pin during operation is correct.

[0114] In some embodiments, the adjusted control value converted by the DAC / ADC module 423 can be sent to the BMC so that the BMC can compare the converted adjusted control value with the preset converted adjusted control value to determine whether the function of the DAC / ADC module 423 is correct.

[0115] The radiator under test 420 can be located outside the server where the radiator under test 420 is to be deployed, but can communicate with the BMC in the server; it can also be located inside the server, but the communication buses between the heat dissipation devices in the radiator under test 420 and the signal conversion sub-module, as well as between the heat dissipation devices and the input / output interface sub-module, are not established. Thus, when the corresponding heat dissipation control values are obtained in the signal conversion sub-module and the input / output interface sub-module, the heat dissipation control values will not be transmitted to the heat dissipation devices, resulting in heat dissipation operations by the heat dissipation devices and causing problems such as server damage.

[0116] According to an embodiment of the present application, the heat dissipation control value is calculated by the master control module 421 and undergoes communication transmission from the master control module 421 to the signal conversion sub-module and the input / output interface sub-module. The test result obtained by comparing the heat dissipation control value with the preset control value includes the test of the calculation ability of the master control module 421 in the radiator 420 to be tested, and also includes the test of the communication transmission between the master control module 421 and the signal conversion module and between the master control module 421 and the input / output interface module.

[0117] According to an embodiment of the present application, the radiator 420 to be tested further includes: a communication module 422; the communication module 422 is used to receive the sensor module value; the master control module 421 is further used to obtain the sensor analog value from the communication module 422.

[0118] The management controller 410 is further used to: receive the target sensor analog value obtained from the communication module 422 sent by the master control module 421; compare the target sensor analog value with the sensor analog value to obtain the test result for the communication transmission between the communication module 422 and the master control module 421.

[0119] The communication module 422 can be a serial communication bus (Inter-Integrated Circuit, I 2 C) module.

[0120] The master control module 421 can obtain the sensor analog value from the communication module 422 within a unit time and send it to the management controller 410. Thus, the management controller 410 can realize the test of the communication transmission between the communication module 422 and the master control module 421 by comparing the target sensor analog value sent by the master control module 421 with the original sensor analog value stored in the management controller 410.

[0121] According to an embodiment of the present application, the management controller 410 can verify whether there is a problem in the data transmission process between the communication module 422 and the master control module 421 by receiving the target sensor analog value obtained from the communication module 422 sent by the master control module 421 and comparing it with the original sensor analog value. If the comparison result is consistent, it indicates that the communication module 422 can accurately receive the sensor analog value, and the master control module 421 can also correctly read and send these values from the communication module 422, thereby realizing the communication test between the master control module 421 and the communication bus module.

[0122] Figure 6 Schematically shows the operation flow chart of each module in the test system according to an embodiment of the present application.

[0123] As Figure 6 shown, the operation process includes operation S601 to operation S611.

[0124] In operation S601, the management controller sends a power-on command to the power module to control the power module to supply power to the radiator under test.

[0125] In operation S602, it is determined whether the radiator under test is successfully powered on. If the power-on is successful, operation S603 is executed. If the power-on fails, operation S610 is executed.

[0126] In operation S603, the management controller sends a startup command to the radiator under test.

[0127] In operation S604, it is determined whether the radiator under test has started up. If it has started up, operation S605 is executed. If it has not started up, operation S610 is executed.

[0128] In operation S605, the management controller sends the sensor analog value to the I 2 C module, and the temperature analog value included in the sensor analog value continuously rises.

[0129] In operation S606, after the master control module detects that the temperature analog value exceeds the preset temperature threshold, it calculates the adjustment control value for the heat dissipation device according to the formula and sends it to the DAC / ADC module. At the same time, it outputs a switch control value of high level to the GPIO module to turn on various heat dissipation devices.

[0130] In operation S607, the management controller triggers the anti-condensation function through the preset dew point temperature and the inlet temperature analog value within the range where the anti-condensation function is triggered. After triggering, within a unit time, the master control module sends the inlet temperature analog value obtained from the I 2 C module to the management controller.

[0131] In operation S608, after the target time period when each temperature analog value is sent is completed, the management controller obtains the switch control value and the adjustment control value from the GPIO module and the DAC / ADC module.

[0132] In operation S609, it is determined whether the switch control value and the adjustment control value are successfully obtained. If the acquisition is successful, operation S611 is executed. If the acquisition fails, operation S610 is executed.

[0133] In operation S610, a fault alarm is issued and relevant personnel are notified.

[0134] In operation S611, the management controller sends a shutdown command to the radiator under test.

[0135] In operation S612, the management controller processes the received adjustment control values and switch control values, compares each adjustment control value and switch control value with the pre-stored preset adjustment control values and preset switch control values, and determines whether the heat dissipation operation of the radiator to be tested meets the expectations.

[0136] After the radiator to be tested is powered off, the management controller processes the received data, compares the data of various devices during the anti-condensation start and stop times with the data pre-stored in the management controller, determines whether the operation of the heat dissipation system meets the expectations, and thereby determines whether the anti-condensation function is normal.

[0137] According to an embodiment of the present application, the management controller remotely sets the analog data of sensors such as temperature and pressure, monitors the operating state of the liquid-cooled radiator through the management controller to complete the function test of the heat dissipation system, and records the data required by the tester, such as: heat dissipation control values, thereby determining the performance of the heat dissipation system, which can greatly improve the test efficiency.

[0138] Figure 7 Schematically shows a block diagram of an electronic device suitable for implementing the test method of the radiator according to an embodiment of the present application.

[0139] As Figure 7 shown, the electronic device 700 according to an embodiment of the present application includes a processor 701, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 702 or the program loaded from the storage section 708 into the random access memory (RAM) 703. The processor 701 may include, for example, a general microprocessor (such as a CPU), an instruction set processor, and / or a related chipset, and / or a dedicated microprocessor (such as an application specific integrated circuit (ASIC)), etc. The processor 701 may also include on-board memory for caching purposes. The processor 701 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of the present application.

[0140] In the RAM 703, various programs and data required for the operation of the electronic device 700 are stored. The processor 701, ROM 702, and RAM 703 are connected to each other through a bus 704. The processor 701 performs various operations of the method flow according to an embodiment of the present application by executing the programs in the ROM 702 and / or RAM 703. It should be noted that the program may also be stored in one or more memories other than the ROM 702 and RAM 703. The processor 701 may also perform various operations of the method flow according to an embodiment of the present application by executing the programs stored in the one or more memories.

[0141] According to an embodiment of the present application, the electronic device 700 may further include an input / output (I / O) interface 705, and the input / output (I / O) interface 705 is also connected to the bus 704. The electronic device 700 may further include one or more of the following components connected to the input / output (I / O) interface 705: an input portion 706 including a keyboard, a mouse, etc.; an output portion 707 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc. and a speaker, etc.; a storage portion 708 including a hard disk, etc.; and a communication portion 709 including a network interface card such as a LAN card, a modem, etc. The communication portion 709 performs communication processing via a network such as the Internet. The driver 710 is also connected to the input / output (I / O) interface 705 as needed. A removable medium 711, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the driver 710 as needed so that a computer program read therefrom can be installed into the storage portion 708 as needed.

[0142] The present application also provides a computer-readable storage medium, which may be included in the device / device / system described in the above embodiments; or may exist alone without being assembled into the device / device / system. The above computer-readable storage medium carries one or more programs, and when the above one or more programs are executed, the method according to the embodiments of the present application is implemented.

[0143] According to an embodiment of the present application, the computer-readable storage medium may be a non-volatile computer-readable storage medium, for example, may include but is not limited to: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, the computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. For example, according to an embodiment of the present application, the computer-readable storage medium may include the above-described ROM 702 and / or RAM 703 and / or one or more memories other than ROM 702 and RAM 703.

[0144] An embodiment of the present application also includes a computer program product, which includes a computer program, and the computer program includes program code for executing the method shown in the flowchart. When the computer program product runs on a computer system, the program code is used to cause the computer system to implement the radiator test method provided by the embodiments of the present application.

[0145] When the computer program is executed by the processor 701, the above functions defined in the system / apparatus of the embodiments of the present application are executed. According to the embodiments of the present application, the above-described systems, apparatuses, modules, units, etc. can be implemented by computer program modules.

[0146] In one embodiment, the computer program can rely on tangible storage media such as optical storage devices, magnetic storage devices, etc. In another embodiment, the computer program can also be transmitted and distributed in the form of signals on a network medium, and be downloaded and installed through the communication part 709, and / or be installed from the removable medium 711. The program code included in the computer program can be transmitted by any suitable network medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0147] In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 709, and / or be installed from the removable medium 711. When the computer program is executed by the processor 701, the above functions defined in the system of the embodiments of the present application are executed. According to the embodiments of the present application, the above-described systems, devices, apparatuses, modules, units, etc. can be implemented by computer program modules.

[0148] According to the embodiments of the present application, the program code for executing the computer program provided by the embodiments of the present application can be written in any combination of one or more programming languages. Specifically, these computing programs can be implemented using high-level procedures and / or object-oriented programming languages, and / or assembly / machine languages. Programming languages include but are not limited to, such as Java, C++, python, the "C" language, or similar programming languages. The program code can be executed entirely on the user computing device, partially on the user device, partially on a remote computing device, or entirely on a remote computing device or server. In the case of a remote computing device, the remote computing device can be connected to the user computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computing device (for example, by using an Internet service provider to connect through the Internet).

[0149] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a portion of code that contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions noted in the blocks may occur in a different order than noted in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram or flowchart, and combinations of blocks in the block diagram or flowchart, may be implemented by a dedicated hardware-based system that performs the specified functions or operations, or may be implemented by a combination of dedicated hardware and computer instructions.

[0150] Those skilled in the art can understand that the features described in the various embodiments of the present application can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in the present application. In particular, without departing from the spirit and teachings of the present application, the features described in the various embodiments of the present application can be combined and / or combined in various ways. All such combinations and / or combinations fall within the scope of the present application.

[0151] The embodiments of the present application have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present application. Although the embodiments have been described separately above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. Without departing from the scope of the present application, those skilled in the art can make various substitutions and modifications, and all such substitutions and modifications should fall within the scope of the present application.

Claims

1. A test method for a radiator, characterized in that, The method includes: In response to a test request for a radiator under test, sending a sensor simulation value corresponding to the test request to the radiator under test, so that when the radiator under test determines that the sensor simulation value meets the heat dissipation condition, outputting a heat dissipation control value for the sensor simulation value; Comparing the heat dissipation control value obtained from the radiator under test with a preset control value to obtain a test result of the radiator under test.

2. The method according to claim 1, wherein The sensor simulation value includes: a temperature simulation value; the sending the sensor simulation value corresponding to the test request to the radiator under test includes: When the test request is a temperature adjustment test, determining a temperature simulation value corresponding to the current moment according to a preset temperature curve, where the preset temperature curve represents the corresponding relationship between the temperature simulation value and time; Sending the temperature simulation value to the radiator under test, so that when the radiator under test determines that there is a target preset temperature threshold in a plurality of preset temperature thresholds that matches the temperature simulation value, generating a heat dissipation control value corresponding to the target preset temperature threshold.

3. The method according to claim 2, wherein The sample radiator under test is deployed in a sample server; the business scenario of the sample server is the same as the business scenario of the server where the radiator under test is to be deployed; the preset temperature curve is obtained by the following method: Obtaining temperature time-series data of respective temperature sensors of a plurality of sample radiators under test within a target time period, where the start time and end time of the target time period are the power-on time and power-off time of the sample server respectively; Performing trend feature analysis on the plurality of temperature time-series data respectively to obtain trend features of the plurality of temperature time-series data respectively; Fusing the trend features of the plurality of temperature time-series data respectively to obtain a target trend feature; Performing curve fitting of temperature changing with time based on the target trend feature to obtain the preset temperature curve.

4. The method according to claim 1, wherein The sensor simulation value includes: a temperature simulation value; the temperature simulation value includes an inlet temperature simulation value at the coolant inlet of the radiator under test; the sending the sensor simulation value corresponding to the test request to the radiator under test includes: When the test request is an anti-condensation function test, obtaining a preset dew point temperature and an inlet temperature simulation value within the anti-condensation function trigger range; Sending the preset dew point temperature and the inlet temperature simulation value within the anti-condensation function trigger range to the radiator under test, so that when the radiator under test determines that the inlet temperature simulation value is within the anti-condensation function trigger range based on the comparison result between the inlet simulation value and the preset dew point temperature, generating a heat dissipation control value for the inlet temperature simulation value.

5. The method according to claim 1, wherein The sensor simulation value includes: a pressure simulation value; the pressure simulation value includes an inlet pressure simulation value at the coolant inlet of the radiator under test and an outlet pressure simulation value at the coolant outlet; Wherein, the sending the sensor simulation value corresponding to the test request to the radiator under test includes: When the test request is a vaporization prevention function test, obtain a vaporization pressure difference threshold value and simulated inlet and outlet pressure values where the pressure difference is less than the vaporization pressure difference threshold value. Send the vaporization pressure difference threshold value, the simulated inlet pressure value, and the simulated outlet pressure value to the radiator under test, so that when the radiator under test determines that the pressure difference is within the range where the vaporization prevention function is triggered based on the comparison result between the vaporization pressure difference threshold value and the pressure difference between the simulated inlet pressure value and the simulated outlet pressure value, generate a heat dissipation control value for the pressure difference.

6. The method according to claim 1, characterized in that, The method further includes: Obtain a target value from the radiator under test, where the target value is output by the radiator under test when it determines that the sensor simulated value does not meet the heat dissipation condition. Compare the target value with the preset target value to obtain the test result of the radiator under test.

7. A test system, characterized in that, The system includes: a radiator under test and a management controller; The radiator under test is configured to receive sensor simulated values sent by the management controller and, when it determines that the sensor simulated values meet the heat dissipation condition, output a heat dissipation control value for the sensor simulated values. The management controller is configured to, in response to a test request for the radiator under test, send sensor simulated values corresponding to the test request to the radiator under test and, when it obtains a heat dissipation control value from the control value receiving module, compare the heat dissipation control value with a preset control value to obtain the test result of the radiator under test.

8. The system according to claim 7, wherein The radiator under test includes: a master control module and a control driving module; the master control module is configured to calculate the heat dissipation control value when it determines that the sensor simulated values meet the heat dissipation condition and send the heat dissipation control value to the control driving module; the control driving module includes a signal conversion sub-module and an input / output interface sub-module. The management controller is further configured to: Obtain the heat dissipation control value from the control driving module.

9. The system according to claim 8, wherein The radiator under test further includes: a communication module; the communication module is configured to receive the sensor module values; the master control module is further configured to obtain the sensor simulated values from the communication module. The management controller is further configured to: Receive the target sensor simulated values obtained from the communication module sent by the master control module. Compare the target sensor simulated values with the sensor simulated values to obtain the test result for the communication transmission between the communication module and the master control module.

10. An electronic device, comprising: One or more processors; A memory for storing one or more computer programs, Characterized in that the one or more processors execute the one or more computer programs to implement the steps of the method according to any one of claims 1 to 6.

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