Optimization design method for cryogenic transmission pipeline support, electronic equipment

Abstract

The present invention discloses an optimization design method and electronic equipment for a low-temperature transmission pipeline support, and relates to the field of heat transfer technology. The optimization design method for a low-temperature transmission pipeline support includes: determining a first design parameter of a support structure and a second design parameter of a heat conduction path; establishing a three-dimensional thermo-solid coupling model of the low-temperature transmission pipeline based on a cold screen, the first design parameter, and the second design parameter, and meshing the contact portion between the support structure and a plurality of inner tubes and outer tubes; performing thermo-solid coupling numerical simulation with the temperature of the plurality of inner tubes and the temperature of the outer tube as boundary conditions to obtain stress results of the support structure and heat leakage of the inner tube of the low-temperature transmission pipeline; adjusting the first design parameter and the second design parameter according to the stress results and heat leakage of the inner tube until the stress results and heat leakage of the inner tube meet the preset requirements. This method realizes the systematic design of the low-temperature transmission pipeline support, and has high design accuracy, which can reduce the loss of the low-temperature medium during the transmission process.

Description

Technical Field

[0001] The present invention relates to the field of heat transfer technology, and in particular to an optimization design method and electronic equipment for a low-temperature transmission pipeline support. Background Art

[0002] Pipe support design is a key aspect of cryogenic transmission pipeline design, as its performance determines the overall performance of the pipeline. Due to the long distances of cryogenic transmission pipelines, it is crucial not only to ensure that the pipe support meets the required strength but also to minimize losses during transmission of the cryogenic medium. Currently, research on optimal design for this purpose is limited, and systematic design approaches are lacking. Therefore, a feasible optimization design method is urgently needed. Summary of the Invention

[0003] The present invention aims to at least partially address one of the technical problems in the related art. To this end, the present invention provides an optimized design method and electronic device for cryogenic transmission pipeline supports, thereby enabling systematic design of cryogenic transmission pipeline supports, improving design accuracy, and reducing losses during cryogenic medium transmission.

[0004] In a first aspect, an embodiment of the present invention provides an optimization design method for a low-temperature transmission pipeline support, characterized in that the low-temperature transmission pipeline includes an outer tube, a cold screen, a support structure and a plurality of inner tubes, the support structure includes a support plate and a plurality of support legs, the support plate is fixedly connected to the plurality of inner tubes, the cold screen is fixed to the outer end surface of the support plate through the support legs, the outer tube is sleeved on the outside of the cold screen and contacts the outer end surface of the support legs, and a plurality of waist-shaped holes are provided on the support plate to extend the heat conduction path of the cold screen; the method comprises the following steps: determining a first design parameter of the support structure and a first design parameter of the heat conduction path a second design parameter of the heat path; establishing a three-dimensional thermo-solid coupling model of the low-temperature transmission pipeline based on the cold shield, the first design parameter, and the second design parameter, and performing mesh encryption on the contact portions between the support structure and the multiple inner tubes and the outer tube; performing thermo-solid coupling numerical simulation with the temperatures of the multiple inner tubes and the outer tube as boundary conditions to obtain stress results of the support structure and heat leakage of the inner tube of the low-temperature transmission pipeline; adjusting the first design parameter and the second design parameter according to the stress results and the heat leakage of the inner tube until the stress results and the heat leakage of the inner tube meet preset requirements.

[0005] In addition, the optimization design method for the cryogenic transmission pipeline support according to the embodiment of the present invention may also have the following additional technical features:

[0006] According to one embodiment of the present invention, the step of designing the cold shield includes: establishing a three-dimensional model of the cold shield; and completing the design of the cold shield by adjusting the structure of the coil on the cold shield based on the three-dimensional model of the cold shield.

[0007] According to one embodiment of the present invention, the support plate is provided with a plurality of openings, which are determined according to the interfaces of the terminal connectors of the cryogenic transmission pipeline and correspond one-to-one to the plurality of inner tubes.

[0008] According to one embodiment of the present invention, the first design parameters include the diameter, thickness and material of the support plate, and the length, diameter and material of the support legs, wherein the diameter of the support plate and the length of the support legs are determined according to the diameter of the outer tube and the diameter of the cold shield.

[0009] According to one embodiment of the present invention, adjusting the first design parameter according to the stress result includes: if the stress result does not meet the preset stress requirement, increasing the thickness of the support plate when the stress point is greater at the support plate, and increasing the diameter of the support leg when the stress point is greater at the support leg.

[0010] According to one embodiment of the present invention, the initialization thickness of the support plate is within the range of 10 mm to 35 mm, the initialization diameter of the support legs is within the range of 20 mm to 30 mm, and the material of the support plate and the material of the support legs are both G10.

[0011] According to one embodiment of the present invention, the second design parameters include the size of each of the waist-shaped holes and the closest distance between each of the waist-shaped holes and the outer walls of the multiple inner tubes.

[0012] According to one embodiment of the present invention, adjusting the second design parameter according to the heat leakage of the inner tube includes: if the heat leakage of the inner tube does not meet the preset heat leakage requirement, increasing the size of the waist-shaped hole, and / or increasing the closest distance between the waist-shaped hole and the outer wall of the inner tube.

[0013] According to one embodiment of the present invention, the initialization closest distance between each of the waist-shaped holes and the outer walls of the multiple inner tubes is within a range of 10 mm to 20 mm.

[0014] In a second aspect, an embodiment of the present invention provides an electronic device comprising a memory, a processor, and a computer program stored on the memory. When the computer program is executed by the processor, the optimization design method for the cryogenic transmission pipeline support described in the embodiment of the first aspect is implemented.

[0015] The optimization design method and electronic device for a cryogenic transmission pipeline support according to an embodiment of the present invention first determine a first design parameter of the support structure and a second design parameter of the heat conduction path; then, based on the cold screen, the first design parameter, and the second design parameter, a three-dimensional thermo-solid coupling model of the cryogenic transmission pipeline is established, and the mesh of the contact portion between the support structure and multiple inner and outer tubes is encrypted; then, using the temperatures of the multiple inner and outer tubes as boundary conditions, a thermo-solid coupling numerical simulation is performed to obtain the stress results of the support structure and the heat leakage of the inner tubes of the cryogenic transmission pipeline; finally, the first and second design parameters are adjusted according to the stress results and the heat leakage of the inner tubes until the stress results and the heat leakage of the inner tubes meet the preset requirements. Thus, a systematic design of a cryogenic transmission pipeline support is achieved with high design accuracy, which can reduce the loss of cryogenic media during transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a flow chart of a method for optimizing design of a cryogenic transmission pipeline support according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic structural diagram of a cryogenic transmission pipeline according to an embodiment of the present invention;

[0018] Figure 3 This is a flow chart of a method for optimizing the design of a cryogenic transmission pipeline support according to a specific embodiment of the present invention;

[0019] Figure 4 It is a structural block diagram of an electronic device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0020] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0021] The following describes a method for optimizing and designing pipeline supports for cryogenic transmission lines and an electronic device according to embodiments of the present invention with reference to the accompanying drawings.

[0022] Pipe support design is a key aspect of cryogenic transmission pipeline design, as its performance determines the overall performance of the pipeline. Due to the long distances of cryogenic transmission pipelines, it is crucial not only to ensure that the pipe support meets the required strength but also to minimize losses during transmission of the cryogenic medium. Currently, research on optimal design for this purpose is limited, and systematic design approaches are lacking. Therefore, a feasible optimization design method is urgently needed.

[0023] To this end, this paper proposes an optimized design method for cryogenic transmission pipeline supports. This method explains the design process for cryogenic transmission pipeline supports, from optimizing the overall heat leakage and structural strength of the cryogenic transmission pipeline to selecting the pipe support thickness, leg diameter, and heat conduction path layout. The designed pipe support can reduce the loss of cryogenic media during transmission. Furthermore, this method is universally applicable and can be used for support design involving cryogenic transmission pipelines in applications such as magnetic confinement nuclear fusion and vacuum cryogenics. It offers high design efficiency and provides technical support for the detailed design of cryogenic transmission pipelines.

[0024] Figure 1 It is a flow chart of a method for optimizing design of a cryogenic transmission pipeline support according to an embodiment of the present invention.

[0025] In an embodiment of the present invention, Figure 2 As shown, the low-temperature transmission pipeline includes an outer tube 1, a support structure 2, a cold shield 3 and multiple inner tubes 4. The support structure 2 includes a support plate 20 and multiple support legs 21. The support plate 20 is fixedly connected to the multiple inner tubes 4. The cold shield 3 is fixed to the outer end surface of the support plate 20 through the support legs 21. The outer tube 1 is sleeved on the outside of the cold shield 3 and contacts the outer end surface of the support legs 21. A plurality of waist-shaped holes 22 are opened on the support plate 20 to extend the heat conduction path of the cold shield 3.

[0026] For example, the support plate 20 is provided with a plurality of openings, which are determined according to the interface of the terminal connector of the cryogenic transmission pipeline and correspond one-to-one with the plurality of inner tubes 4. Each opening is adapted to fit a corresponding inner tube 4. For example, the opening can be a circular hole, which is adapted to allow the corresponding inner tube 4 to pass through, and the sidewall of the circular hole contacts the outer wall of the corresponding inner tube 4; or, for another example, the opening can be a slot, which is adapted to allow the corresponding inner tube 4 to be placed, and the sidewall of the slot contacts at least a portion of the outer wall of the corresponding inner tube 4.

[0027] like Figure 1 As shown in FIG, the optimization design method for cryogenic transmission pipeline supports includes the following steps:

[0028] S11 , determining first design parameters of the support structure and second design parameters of the heat conduction path.

[0029] In some embodiments of the present invention, the first design parameter includes the diameter, thickness and material of the support plate, and the length, diameter and material of the support leg, wherein the diameter of the support plate and the length of the support leg are determined according to the diameter of the outer tube and the diameter of the cold screen, including: the sum of the diameter of the support plate and the length of the support leg is less than the diameter of the outer tube, and the diameter of the support plate is less than the diameter of the cold screen.

[0030] For example, the initialization thickness of the support plate is within the range of 10 mm to 35 mm, the initialization diameter of the support legs is within the range of 20 mm to 30 mm, and the material of the support plate and the material of the support legs are both G10.

[0031] As an implementation, when optimizing the support structure, G10 is selected as the material due to its high strength, stability, corrosion resistance, wear resistance, non-conductivity, and water absorption properties. The diameter of the support plate is determined based on the diameter of the cold shield, and the length of the support legs is determined based on the diameter of the outer tube and the diameter of the support plate. In the first loop, the thickness of the support plate (e.g., 20 mm) and the diameter of the support legs (e.g., 25 mm) are initialized.

[0032] In some embodiments of the present invention, the second design parameter includes the size of each waist-shaped hole and the closest distance between each waist-shaped hole and the outer walls of the plurality of inner tubes.

[0033] For example, the initial closest distance between each waist-shaped hole and the outer walls of the multiple inner tubes is within a range of 10 mm to 20 mm. Specifically, for each waist-shaped hole, the distance between the waist-shaped hole and the outer walls of the multiple inner tubes is determined, and a closest distance is selected from these distances for use in establishing the three-dimensional thermo-solid coupling model in step S12 below.

[0034] S12, establishing a three-dimensional thermo-solid coupling model of the low-temperature transmission pipeline based on the cold shield, the first design parameter, and the second design parameter, and performing mesh encryption on the contact portion between the support structure and the multiple inner tubes and outer tubes.

[0035] As an implementation method, the cold shield is pre-designed and can be directly used to determine the first design parameters and establish a three-dimensional thermo-solid coupling model of the low-temperature transmission pipeline.

[0036] As another implementation, a cold shield is designed during the optimization of the pipe supports. In this case, the cold shield design must be completed in the first step. The cold shield design steps include: creating a 3D cold shield model; and completing the cold shield design by adjusting the structure of the upper coils based on the 3D cold shield model.

[0037] For example, the design of the cold shield includes: determining the cooling temperature of the cold shield; the cooling fluid inlet temperature, pressure, flow rate; the layout of the cooling pipes on the cold shield; the cooling pipe fluid outlet temperature and pressure; and simulation calculation of the temperature distribution of the cold shield. The specific steps are as follows:

[0038] Step 1: Create a 3D model of the cold screen.

[0039] Assuming a cooling temperature T for the cold panel, calculate the total heat load based on the load's operating temperature, heat output, ambient temperature, and the radiation characteristics of each surface. Specifically, use commercial or custom computational fluid dynamics (CFD) software to build a steady-state 3D model of the cold panel. For the radiation heat transfer component, select an appropriate radiation model, such as S2S (Surface to Surface) or DO (Discrete Ordinates), and input the emissivity of each surface at different temperatures. For the solid heat transfer component, import the thermal conductivity of the solid material at low temperatures and the heat output of the load. Once the model is set up, select an appropriate algorithm and iterative residual to calculate the total heat load of the cold panel.

[0040] Step 2: Select a certain step size between the load's operating temperature and the ambient temperature, and calculate the cooling exergy based on the total heat load of the cold panel at different cold panel temperatures.

[0041] Step 3: Based on the calculation results of step 2, determine the target cooling screen temperature corresponding to the minimum cooling exergy value, and simulate the heat flux density distribution characteristic function of the cooling screen at the target cooling temperature;

[0042] Step 4: Based on the heat balance formula, the temperature uniformity requirements of the cold screen, the target cold screen temperature and its corresponding total heat load, calculate the cooling fluid flow rate.

[0043] Step 5: Carry out coil design and establish a three-dimensional fluid-solid coupling heat transfer model of the cold screen and coil.

[0044] The coils are arranged more densely where the heat flux density is high and more sparsely where the heat flux density is low. For the fluid domain, a structured grid is used for discretization, and the boundary layer grid of the pipe wall is encrypted.

[0045] Step 6: Using the heat flux density distribution of the cold screen and the cooling fluid inlet parameters as boundary conditions, import the thermophysical properties of the cold screen material and fluid at low temperature, and perform fluid-solid coupling heat transfer numerical simulation to obtain the maximum temperature of the cold screen, the uniformity of the temperature field, and the total pressure drop of the cooling channel.

[0046] Specifically, depending on the inlet Reynolds number, you can select a laminar flow model or a turbulence model such as SST (Shear-Stress Transport) kw (k represents turbulent kinetic energy, w represents specific dissipation rate), input the heat flux density distribution characteristic function of the cold screen, set the velocity inlet and pressure outlet as boundary conditions, and perform fluid-solid coupled heat transfer numerical simulation based on the Coupled algorithm to obtain the maximum temperature of the cold screen, the uniformity of the temperature field, and the total pressure drop in the cooling channel.

[0047] Step 7: Compare the maximum temperature of the cold screen and the pressure drop of the cooling channel to see if they meet the requirements.

[0048] If the maximum temperature is too high and the cooling fluid outlet temperature is higher than the target temperature, increase the cooling fluid flow rate at the cold plate and return to step 6. If the maximum temperature meets the requirements but the temperature field uniformity does not, reduce the distance between the coils and return to step 5 until the requirements are met. If the pressure drop is too large, increase the pipe diameter or divide the cooling channel into multiple sections for parallel cooling and return to step 5 until the requirements are met.

[0049] After the cold shield is designed, a 3D thermo-mechanical coupling model of the cryogenic transmission pipeline is built based on the designed cold shield, the first design parameters, and the second design parameters. The mesh of the contact area between the support structure and the multiple inner and outer pipes is refined. This mesh refinement improves design accuracy and efficiency.

[0050] S13, using the temperatures of multiple inner pipes and outer pipes as boundary conditions, conducts a thermo-solid coupling numerical simulation to obtain the stress results of the support structure and the heat leakage of the inner pipe of the low-temperature transmission pipeline.

[0051] For example, statics, heat transfer, etc. can be used to take the temperatures of multiple inner tubes and outer tubes as boundary conditions, and import the thermal conductivity of the material at different temperatures from room temperature to low temperature to perform thermo-solid coupling numerical simulation to obtain the stress results of the supporting structure and the heat leakage of the inner tube of the low-temperature transmission pipeline.

[0052] S14, adjusting the first design parameter and the second design parameter according to the stress result and the heat leakage of the inner pipe until the stress result and the heat leakage of the inner pipe meet the preset requirements.

[0053] The adjustment value of each design parameter can be a fixed step size or a variable step size, and the variable step size is positively correlated with the difference (i.e., the difference between the stress results and the heat leakage of the inner pipe and the preset requirements).

[0054] In some embodiments of the present invention, adjusting the first design parameter according to the stress result includes: if the stress result does not meet the preset stress requirement, increasing the thickness of the support plate when the stress point is greater at the support plate, and increasing the diameter of the support leg when the stress point is greater at the support leg.

[0055] In some embodiments of the present invention, the second design parameter is adjusted according to the heat leakage of the inner tube, including: if the heat leakage of the inner tube does not meet the preset heat leakage requirements, increasing the size of the waist-shaped hole, and / or increasing the closest distance between the waist-shaped hole and the outer wall of the inner tube.

[0056] The following combination Figure 3 , describing a method for optimizing the design of a cryogenic transmission pipeline support according to a specific embodiment of the present invention.

[0057] like Figure 3 As shown in Figure 2, the optimization design method for cryogenic transmission pipeline supports includes:

[0058] S21. Based on the load operating temperature, assume the cooling temperature T of the transmission line cold shield. Build a three-dimensional model of the cold shield and complete the cold shield design by adjusting the structure of the coils on the cold shield.

[0059] The transmission line is the above-mentioned low-temperature transmission pipeline.

[0060] Take, for example, cryogenic transmission pipelines in magnetic confinement fusion. Superconducting magnets must operate in cryogenic environments. To achieve this, long-distance cryogenic transmission pipelines are required to transport the cold energy generated by the refrigerator to the cryogenic valve box, which then transmits the cold energy to the superconducting magnets. The superconducting magnets act as the load, and their operating temperature can be set to the desired temperature.

[0061] S22, determining the opening position of the pipe support according to the interface distribution position of the end load, and determining the maximum size of the outer support of the pipe support according to the size of the outer pipe.

[0062] Among them, the outer support of the pipeline support includes the length of the support leg and the diameter of the support plate.

[0063] S23, carry out pipeline support design.

[0064] Among them, G10 can be selected as the pipe support material.

[0065] S24, carry out support thickness design and support leg diameter determination.

[0066] Among them, the support thickness is the thickness of the support plate, and its initialization value can be taken in the range of 10mm-35mm; the support leg diameter is the diameter of the support leg, and its initialization value can be taken in the range of 20mm-30mm.

[0067] S25, carry out thermal path design.

[0068] The heat conduction path is generally a waist-shaped hole or a waist-shaped hole with a curved long side. The design parameters of the heat conduction path include the closest distance to the outer wall of the inner tube, and the initial value can be within the range of 10mm-20mm.

[0069] S26, establish a three-dimensional thermo-solid coupling model of low-temperature transmission lines and perform numerical simulations of statics and heat transfer coupling.

[0070] When establishing the 3D thermo-solid coupling model, a structured mesh was used to refine the mesh in the areas where the support structure contacts the inner and outer pipes. Subsequently, using the inner pipe temperatures and the outer pipe surface room temperature as boundary conditions, and importing the thermal conductivity of the material at various temperatures from ambient to cryogenic, a coupled numerical simulation of statics and heat transfer was performed to determine the inner pipe heat leakage and the structural strength (i.e., stress results) of the pipe support.

[0071] S27, compare heat leakage and structural strength.

[0072] If heat leakage does not meet preset requirements, the heat conduction path may be modified, including increasing its size and adjusting its distance from the inner tube's outer wall, and the process returns to step S25. If structural strength does not meet preset requirements, the support thickness and leg diameter may be modified, including: if the structural strength is high, analyzing the location of the point of greatest strength and, if it is at contact with the inner tube, increasing the support thickness; if it is at the support leg, increasing the leg diameter, and the process returns to step S24. If both heat leakage and structural strength meet preset requirements, the optimization design ends.

[0073] The optimized design method for cryogenic transmission pipeline supports, described in this embodiment of the present invention, is applicable to any scenario involving cryogenic transmission pipeline support design, including magnetic confinement nuclear fusion and vacuum cryogenics, demonstrating its universal applicability. This design method improves the efficiency and accuracy of pipeline support design, reduces losses during cryogenic medium transmission, and contributes to improved system operational stability, providing technical support for the overall design of cryogenic transmission pipelines.

[0074] Figure 4 It is a structural block diagram of an electronic device according to an embodiment of the present invention.

[0075] like Figure 4 As shown, electronic device 500 includes: a processor 501 and a memory 503. Processor 501 and memory 503 are connected, for example, via a bus 502. Optionally, electronic device 500 may further include a transceiver 504. It should be noted that in actual applications, the number of transceivers 504 is not limited to one, and the structure of electronic device 500 does not constitute a limitation on the embodiments of the present invention.

[0076] Processor 501 can be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or other programmable logic device, transistor logic device, hardware component, or any combination thereof. It can implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the present disclosure. Processor 501 can also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, etc.

[0077] Bus 502 may include a path for transmitting information between the above components. Bus 502 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus. Bus 502 may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 4 Only one thick line is used in the diagram, but this does not mean that there is only one bus or one type of bus.

[0078] Memory 503 is used to store a computer program corresponding to the optimization design method for cryogenic transmission pipeline supports according to the above-described embodiment of the present invention. The computer program is controlled and executed by processor 501. Processor 501 is used to execute the computer program stored in memory 503 to implement the contents of the above-described method embodiment.

[0079] The electronic device 500 includes but is not limited to mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), and fixed terminals such as digital TVs and desktop computers. Figure 4 The electronic device 500 shown is merely an example and should not limit the functions and scope of use of the embodiments of the present invention.

[0080] It should be noted that the logic and / or steps represented in the flowcharts or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing the logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (e.g., a computer-based system, a system including a processor, or other system that can fetch and execute instructions from an instruction execution system, apparatus, or device). For purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer-readable media include the following: an electrical connection with one or more wires (electronic device), a portable computer disk cartridge (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and programmable read-only memory (EPROM or flash memory), fiber optic devices, and a portable compact disc read-only memory (CDROM). Furthermore, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium and then editing, interpreting or processing it in another suitable manner if necessary, and then storing it in a computer memory.

[0081] It should be understood that various components of the present invention may be implemented using hardware, software, firmware, or a combination thereof. In the above-described embodiments, multiple steps or methods may be implemented using software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented using hardware, as in another embodiment, any one of the following technologies known in the art or a combination thereof may be used: a discrete logic circuit having logic gate circuits for implementing logic functions on data signals, an application-specific integrated circuit having suitable combinational logic gate circuits, a programmable gate array (PGA), a field-programmable gate array (FPGA), etc.

[0082] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0083] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0084] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0085] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0086] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0087] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. An optimization design method for cryogenic transmission pipeline support, characterized in that: The low-temperature transmission pipeline includes an outer tube, a cold shield, a support structure and multiple inner tubes, the support structure includes a support plate and multiple support legs, the support plate is fixedly connected to the multiple inner tubes, the cold shield is fixed to the outer end surface of the support plate through the support legs, the outer tube is sleeved on the outer side of the cold shield and contacts the outer end surfaces of the support legs, and the support plate is provided with multiple waist-shaped holes to extend the heat conduction path of the cold shield; the method includes the following steps: Determining first design parameters of the support structure and second design parameters of the heat conduction path, wherein the second design parameters include the size of each of the waist-shaped holes and the closest distance between each of the waist-shaped holes and the outer walls of the plurality of inner tubes; Establishing a three-dimensional thermo-solid coupling model of the cryogenic transmission pipeline based on the cold shield, the first design parameter, and the second design parameter, and performing mesh encryption on contact portions between the support structure and the plurality of inner tubes and the outer tube; Performing a thermo-solid coupling numerical simulation using the temperatures of the multiple inner tubes and the outer tube as boundary conditions to obtain stress results of the support structure and heat leakage of the inner tube of the cryogenic transmission pipeline; The first design parameter and the second design parameter are adjusted according to the stress result and the heat leakage of the inner pipe until the stress result and the heat leakage of the inner pipe meet preset requirements.

2. The optimization design method for cryogenic transmission pipeline support according to claim 1 is characterized in that: The design steps of the cold screen include: Establish a three-dimensional model of the cold screen; The design of the cold panel is completed by adjusting the structure of the coil on the cold panel based on the three-dimensional model of the cold panel.

3. The optimization design method for cryogenic transmission pipeline support according to claim 1 is characterized in that: The support plate is provided with a plurality of openings, which are determined according to the interfaces of the terminal connectors of the cryogenic transmission pipeline and correspond one-to-one to the plurality of inner tubes.

4. The optimization design method for cryogenic transmission pipeline support according to claim 1 is characterized in that: The first design parameters include the diameter, thickness and material of the support plate, and the length, diameter and material of the support legs, wherein the diameter of the support plate and the length of the support legs are determined according to the diameter of the outer tube and the diameter of the cold shield.

5. The optimization design method for cryogenic transmission pipeline support according to claim 4 is characterized in that: Adjusting the first design parameter according to the stress result includes: If the stress result does not meet the preset stress requirement, when the stress point is greater at the support plate, the thickness of the support plate is increased, and when the stress point is greater at the support leg, the diameter of the support leg is increased.

6. The optimization design method for cryogenic transmission pipeline support according to claim 4, characterized in that: The initialization thickness of the support plate is within the range of 10 mm to 35 mm, the initialization diameter of the support leg is within the range of 20 mm to 30 mm, and the material of the support plate and the material of the support leg are both G10.

7. The optimization design method for cryogenic transmission pipeline support according to claim 1 is characterized in that: Adjusting the second design parameter according to the heat leakage of the inner tube includes: If the heat leakage of the inner tube does not meet the preset heat leakage requirement, the size of the waist-shaped hole is increased, and / or the closest distance between the waist-shaped hole and the outer wall of the inner tube is increased.

8. The optimization design method for cryogenic transmission pipeline support according to claim 1, characterized in that: The initialization closest distance between each waist-shaped hole and the outer walls of the multiple inner tubes is within a range of 10 mm to 20 mm.

9. An electronic device, characterized in that: The invention comprises a memory, a processor, and a computer program stored in the memory, wherein when the computer program is executed by the processor, the optimization design method of the cryogenic transmission pipeline support according to any one of claims 1 to 8 is implemented.

Images