Power module internal electric field modeling method, system, equipment, medium and product

Abstract

The invention relates to the technical field of electronic devices, and discloses a power module internal electric field modeling method, system and device, a medium and a product. According to the method, a target plane where electric field modeling is located is determined through an internal structure of a power module, and electric field modeling is conducted according to structural distribution of the power module in the target plane; determining a first polygonal electric field region formed by the boundaries of the insulation structure part of the target plane, and converting the first polygonal electric field region to upper half planes of different complex plane coordinate systems by adopting a conformal transformation method through two times of Cristotreme-Schwartz transformation; therefore, the complex electric field distribution in the power module is converted into a simple electric field structure, the electric field relation between the electric fields before and after the conversion of the target plane is determined through the mapping relation between the electric fields before and after the conversion, and the electric field distribution of the target plane is determined. The calculation amount and the calculation time of the modeling method for the internal electric field of the power module are greatly reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and in particular, to a method, system, device, medium and product for internal electric field modeling of a power module. Background Art

[0002] With the rise and continuous development of industries such as new energy power generation and electric vehicles, the requirements for electric energy conversion and transmission in industrial applications are getting higher and higher, and the demand for power semiconductor devices is increasing day by day. At present, the voltage level of industrial power modules is gradually increasing, and the internal electric field strength is also increasing accordingly, posing higher requirements for the insulation performance of the modules. The internal electrode distribution of the power module is complex, and the phenomenon of electric field distortion widely exists. Mathematical modeling of the internal electric field of the module is beneficial to understanding the internal electric field distribution of the module and guiding the implementation of the internal electric field optimization project.

[0003] Currently, in the design stage of the power module, the calculation amount of the modeling method for the internal electric field of the module is large, the calculation time for some complex problems is long, and it is difficult to accurately describe the distribution of the internal electric field of the module. Therefore, it is difficult for users to understand the internal electric field distribution law of the power module and identify high-field-strength regions, and it is also difficult to efficiently and specifically reduce the electric field strength in the internal electric field concentration region of the power module. Summary of the Invention

[0004] In view of this, the present invention provides a method, system, device, medium and product for internal electric field modeling of a power module, which solves the technical problems that the calculation amount of the modeling method for the internal electric field of the module is large, the calculation time for some complex problems is long, and it is difficult to accurately describe the distribution of the internal electric field of the module. Therefore, it is difficult for users to understand the internal electric field distribution law of the power module and identify high-field-strength regions, and it is also difficult to efficiently and specifically reduce the electric field strength in the internal electric field concentration region of the power module.

[0005] The first aspect of the present invention provides a method for internal electric field modeling of a power module, including:

[0006] Determine a target plane where the electric field modeling is located and a first complex plane coordinate system established on the target plane according to the internal structure of the power module;

[0007] Determine a first polygonal electric field region formed by the boundary of the insulation structure part of the target plane in the first complex plane coordinate system according to the structural distribution of the power module in the target plane;

[0008] Conformally map the first polygonal electric field region to the upper half plane of the second complex plane coordinate system through a first Christoffel-Schwarz transformation to obtain a second polygonal electric field region;

[0009] Conformally map the second polygonal electric field region to the upper half-plane of the third complex plane coordinate system through the second Christoffel-Schwarz transformation to obtain a third polygonal electric field region; wherein, the structure of the plane where the third complex plane coordinate system is located is simpler than the structure of the target plane;

[0010] Determine the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located according to the mapping relationships between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region respectively, and determine the electric field distribution of the target plane according to the electric field relationship.

[0011] Preferably, the structural distribution of the target plane is a symmetric structure;

[0012] The process of establishing the first complex plane coordinate system on the target plane includes:

[0013] Use two mutually perpendicular axes of symmetry of the target plane as the x-axis and y-axis of the first complex plane coordinate system respectively, and take the intersection point of the two axes of symmetry as the origin of the first complex plane coordinate system.

[0014] Preferably, the determining the first polygonal electric field region formed by the boundary of the insulating structure part of the target plane in the first complex plane coordinate system according to the structural distribution of the power module in the target plane includes:

[0015] Obtain the structural distribution of the power module in the target plane, and the structural distribution includes an insulating structure part and a non-insulating structure part;

[0016] Form the boundary of the region of the insulating structure part into the first polygonal electric field region in the first complex plane coordinate system; wherein, the first polygonal electric field region encloses all the insulating structure parts in the target plane.

[0017] Preferably, the conformally mapping the first polygonal electric field region to the upper half-plane of the second complex plane coordinate system through the first Christoffel-Schwarz transformation to obtain a second polygonal electric field region includes:

[0018] Determine the coordinates and vertex angles of each vertex of the first polygonal electric field region according to the first complex plane coordinate system;

[0019] Determine the pre-image points of each vertex of the first polygonal electric field region on the real axis of the second complex plane coordinate system according to the coordinates of each vertex of the first polygonal electric field region; wherein, the sorting of the pre-image points on the real axis of the second complex plane coordinate system is consistent with the connection order of each vertex of the first polygonal electric field region;

[0020] According to the preimage points and the apex angles of each vertex, through the first Christoffel–Schwarz transformation formula, the first polygonal electric field region is conformally mapped to the upper half plane of the second complex plane coordinate system to obtain the second polygonal electric field region.

[0021] Preferably, the conformally mapping the second polygonal electric field region to the upper half plane of the third complex plane coordinate system through the second Christoffel–Schwarz transformation to obtain the third polygonal electric field region includes:

[0022] According to the target plane, determine the plane where the third complex plane coordinate system is located; wherein, the structure of the plane where the third complex plane coordinate system is located is simpler than the structure of the target plane;

[0023] Conformally map the second polygonal electric field region to the upper half plane of the third complex plane coordinate system through the second Christoffel–Schwarz transformation to obtain the third polygonal electric field region.

[0024] Preferably, the determining the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located according to the mapping relationships between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region respectively, and determining the electric field distribution of the target plane according to the electric field relationship includes:

[0025] According to the first Christoffel–Schwarz transformation process and the second Christoffel–Schwarz transformation process, determine the mapping relationships between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region respectively;

[0026] Integrate the two mapping relationships to obtain the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located;

[0027] According to the electric field line equation and equipotential line equation of the plane where the third complex plane coordinate system is located, determine the electric field distribution of the target plane through the electric field relationship; the electric field distribution of the target plane includes the electric field line equation and equipotential line equation of the target plane.

[0028] In a second aspect, the present invention provides a power module internal electric field modeling system, including:

[0029] A plane determination module, configured to determine a target plane for electric field modeling and a first complex plane coordinate system established on the target plane according to the internal structure of the power module;

[0030] A polygon determination module, configured to determine a first polygon electric field region formed by partial boundaries of an insulation structure of the target plane in the first complex plane coordinate system according to the structural distribution of the power module in the target plane;

[0031] A first mapping module, configured to conformally map the first polygon electric field region to the upper half plane of a second complex plane coordinate system through a first Christoffel–Schwarz transformation to obtain a second polygon electric field region;

[0032] A second mapping module, configured to conformally map the second polygon electric field region to the upper half plane of a third complex plane coordinate system through a second Christoffel–Schwarz transformation to obtain a third polygon electric field region; wherein, the structure of the plane where the third complex plane coordinate system is located is simpler than that of the target plane;

[0033] An electric field distribution determination module, configured to determine the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located according to the mapping relationships between the first polygon electric field region and the second polygon electric field region and the third polygon electric field region respectively, and determine the electric field distribution of the target plane according to the electric field relationship.

[0034] In a third aspect, the present invention provides an electronic device, which includes a memory and a processor. When a computer program stored in the memory is executed by the processor, the processor is caused to execute the steps of the method for modeling the internal electric field of the power module as described in the first aspect.

[0035] In a fourth aspect, the present invention provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed, the steps of the method for modeling the internal electric field of the power module as described in the first aspect are implemented.

[0036] In a fifth aspect, the present invention provides a computer program product, which includes a computer program stored on a non-transitory computer-readable storage medium. The computer program includes program instructions. When the program instructions are executed by a computer, the computer is caused to execute the steps of the method for modeling the internal electric field of the power module as described in the first aspect.

[0037] As can be seen from the above technical solution, the present invention determines the target plane where the electric field modeling is located through the internal structure of the power module, and determines the first polygonal electric field region composed of the boundary of the insulation structure of the target plane according to the structural distribution of the power module in the target plane. Through two Christoffel-Schwarz transformations, the conformal mapping method is used to transform the first polygonal electric field region to the upper half plane of different complex plane coordinate systems, so as to transform the complex electric field distribution in the power module into a simple electric field structure, and determine the electric field relationship between the target planes before and after the transformation through the mapping relationship between the electric fields before and after the transformation, and determine the electric field distribution of the target plane, greatly reducing the calculation amount and calculation time of the electric field modeling method inside the power module, improving the accuracy of describing the distribution of the electric field inside the module, and further optimizing the insulation performance of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0039] Figure 1 It is an application environment diagram of a method for modeling the internal electric field of a power module provided by an embodiment of the present invention;

[0040] Figure 2 It is a flowchart of a method for modeling the internal electric field of a power module provided by an embodiment of the present invention;

[0041] Figure 3 It is a schematic structural diagram of a longitudinal section of a power module provided by an embodiment of the present invention;

[0042] Figure 4 It is a schematic structural diagram of a two-dimensional coordinate system provided by an embodiment of the present invention;

[0043] Figure 5 It is a schematic diagram of a closed polygon provided by an embodiment of the present invention;

[0044] Figure 6 It is a schematic diagram of the electric field lines perpendicular to the field plate distribution provided by an embodiment of the present invention;

[0045] Figure 7 It is a distribution diagram of the electric field lines of the longitudinal section of the power module provided by an embodiment of the present invention; <>

[0046] Figure 8 It is a distribution diagram of the equipotential lines of the longitudinal section of the power module provided by an embodiment of the present invention;

[0047] Figure 9 This is the longitudinal cross-sectional electric field line distribution diagram of the power module obtained by finite element simulation provided by the embodiments of the present invention;

[0048] Figure 10 This is a schematic structural diagram of an internal electric field modeling system of a power module provided by the embodiments of the present invention;

[0049] Figure 11 This is a schematic structural diagram of an electronic device provided by the embodiments of the present invention. Detailed implementation manners

[0050] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0051] The internal electric field modeling method of the power module provided by the embodiments of the present application can be applied to an application environment as Figure 1 shown. Among them, the terminal 101 communicates with the server 102 through a network. The data storage system can store the data that the server 102 needs to process. The data storage system can be integrated on the server 102, or can be placed in the cloud or other network servers. The terminal 101 or the server 102 determines the target plane for electric field modeling and the first complex plane coordinate system established on the target plane according to the internal structure of the power module; determines the first polygonal electric field region formed by the boundary of the insulating structure part of the target plane in the first complex plane coordinate system according to the structural distribution of the power module in the target plane; conformally maps the first polygonal electric field region to the upper half plane of the second complex plane coordinate system through the first Christoffel-Schwarz transformation to obtain the second polygonal electric field region; conformally maps the second polygonal electric field region to the upper half plane of the third complex plane coordinate system through the second Christoffel-Schwarz transformation to obtain the third polygonal electric field region; wherein, the structure of the plane where the third complex plane coordinate system is located is simpler than the structure of the target plane; determines the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located according to the mapping relationship between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region respectively, and determines the electric field distribution of the target plane according to the electric field relationship.

[0052] The terminal 101 can be, but is not limited to, various personal computers, laptop computers, smart phones, tablet computers, etc.

[0053] The server 102 can be an independent physical server, a server cluster or a distributed system composed of multiple physical servers, or a cloud server providing cloud computing services.

[0054] Among them, the power module is a module formed by encapsulating power electronic devices in a certain functional combination. The power electronic devices are also called power semiconductor devices, which are mainly used for high-power electronic devices in the aspects of power conversion and control circuits of power equipment. In this embodiment of the application, the internal electric field of the power module is modeled by describing the potential distribution and electric field intensity distribution in the two-dimensional plane inside the power module through modeling.

[0055] Such as Figure 2 shown, this embodiment of the application provides a method for modeling the internal electric field of a power module. Taking the application of this method to Figure 1 the terminal 101 or the server 102 as an example for illustration, it includes the following steps S1 to S5. Among them:

[0056] Step S1: According to the internal structure of the power module, determine the target plane for electric field modeling and the first complex plane coordinate system established on the target plane.

[0057] Among them, the internal structure of the power module is known, and this internal structure is the layout formed by combining power electronic devices in a certain function. When determining the target plane, usually a suitable research plane is selected according to the structure of the power module. The designer needs to study a suitable electric field plane according to the design requirements. For example, when examining the withstand voltage of the upper copper to the ground, it is necessary to analyze the electric field of the longitudinal section of the power module, or select a key section that can comprehensively reflect the internal electric field characteristics of the power module. The establishment of the first complex plane coordinate system is for the convenience of subsequent mathematical description and calculation of the electric field region.

[0058] Exemplarily, the structural distribution of the target plane is a symmetric structure;

[0059] The process of establishing the first complex plane coordinate system on the target plane includes:

[0060] Taking two mutually perpendicular symmetry axes of the target plane as the x-axis and y-axis of the first complex plane coordinate system respectively, and taking the intersection point of the two symmetry axes as the origin of the first complex plane coordinate system.

[0061] Step S2: According to the structural distribution of the power module in the target plane, determine the first polygonal electric field region formed by the boundaries of the insulating structure part of the target plane in the first complex plane coordinate system.

[0062] Among them, the structural distribution of the power module in the target plane usually includes an insulating structure part and a non-insulating structure part.

[0063] The insulating structure part has an important influence on the electric field distribution because the electric field lines are mainly distributed around the insulating structure part. By describing the boundary of the insulating structure part in the first complex plane coordinate system, a closed polygon region, namely the first polygon electric field region, can be formed. This region can accurately reflect the main distribution characteristics of the electric field in the target plane. When determining the first polygon electric field region, the specific shapes and positions of various insulating structures inside the power module need to be considered to ensure that the obtained electric field region can truly reflect the electric field distribution.

[0064] Step S3: Conformally map the first polygon electric field region to the upper half plane of the second complex plane coordinate system through the first Christoffel - Schwarz transformation to obtain the second polygon electric field region.

[0065] Among them, the Christoffel - Schwarz transformation is a conformal mapping method in complex variable functions, which can map a region with a complex shape to another relatively simple region while keeping the angular relationship between the regions unchanged. In the embodiment of the present application, the first Christoffel - Schwarz transformation is used to map the first polygon electric field region to the upper half plane of the second complex plane coordinate system to obtain the second polygon electric field region with a simpler shape, thereby simplifying the electric field analysis process and improving the calculation efficiency of the electric field modeling analysis.

[0066] Among them, the second complex plane coordinate system is a coordinate system used to receive the result of the first Christoffel - Schwarz transformation. This coordinate system has a real axis and an upper half plane, and the upper half plane is used to display the second polygon electric field region after conformal mapping. Through such a design, it is possible to more intuitively analyze and understand the distribution of the electric field inside the power module.

[0067] Step S4: Conformally map the second polygon electric field region to the upper half plane of the third complex plane coordinate system through the second Christoffel - Schwarz transformation to obtain the third polygon electric field region; among them, the structure of the plane where the third complex plane coordinate system is located is simpler than the structure of the target plane.

[0068] Among them, the third polygon electric field region is obtained after the second Christoffel - Schwarz transformation. This transformation aims to further simplify the shape of the electric field region and adjust the direction of the electric field lines. By mapping the second polygon electric field region to the upper half plane of the third complex plane coordinate system, we obtain a third polygon electric field region with a more regular and simplified shape. Such a mapping relationship not only helps us more intuitively understand the distribution of the electric field inside the power module, but also improves the calculation efficiency of the electric field modeling analysis.

[0069] Step S5: Determine the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located according to the mapping relationships between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region respectively, and determine the electric field distribution of the target plane according to the electric field relationship.

[0070] Among them, the mapping relationships between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region respectively are obtained through the Christoffel–Schwarz transformation, and these mapping relationships reflect the transformation rules of the electric field between different regions. In the process of obtaining the equipotential lines and electric field lines in the original electric field from the equipotential lines and electric field lines of the simple electric field, the mapping formulas of the two Christoffel–Schwarz transformations are obtained respectively, and combining the two can obtain the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located.

[0071] At the same time, through the mapping relationship, the electric field information of the plane where the third complex plane coordinate system is located can be inversely deduced back to the target plane, so as to obtain the electric field distribution of the target plane, realizing the conversion of electric field information from the simplified model to the actual model, and ensuring the accuracy and practicability of electric field modeling.

[0072] It should be noted that in the embodiment of the present application, the target plane where the electric field modeling is located is determined through the internal structure of the power module, and according to the structural distribution of the power module in the target plane, the first polygonal electric field region composed of the partial boundaries of the insulation structure of the target plane is determined. Through two Christoffel–Schwarz transformations, the method of conformal transformation is used to transform the first polygonal electric field region to the upper half plane of different complex plane coordinate systems, so as to transform the complex electric field distribution in the power module into a simple electric field structure, and through the mapping relationship between the electric fields before and after the transformation, determine the electric field relationship between the target plane before and after the transformation of the electric field, and determine the electric field distribution of the target plane, greatly reducing the calculation amount and calculation time of the modeling method of the internal electric field of the power module, improving the accuracy of describing the distribution of the internal electric field of the module, and further optimizing the insulation performance of the power module.

[0073] In some embodiments, determining the first polygonal electric field region formed by the partial boundaries of the insulation structure of the target plane in the first complex plane coordinate system according to the structural distribution of the power module in the target plane includes:

[0074] Step S201: Obtain the structural distribution of the power module in the target plane, and the structural distribution includes an insulation structure part and a non-insulation structure part.

[0075] Among them, the shape and layout of the insulation structure part directly affect the distribution of electric field lines and the shape of equipotential surfaces, such as ceramic substrates and potting adhesives, etc. The non-insulation structure part is such as a copper layer, etc.

[0076] Step S202: Compose the regional boundaries of the insulation structure part into a first polygonal electric field region within the first complex plane coordinate system; wherein, the first polygonal electric field region encloses all the insulation structure parts within the target plane.

[0077] Among them, the vertices of the boundary part of the target plane are taken as infinity, and the vertices within the plane are the vertices of the conductor region; generally, this polygon does not enclose the conductor. The conductors in the power module are generally cuboids, which are rectangles in the plane and have symmetry. The symmetry axis of the conductor can be selected as the plane boundary, so that the insulation part does not enclose the conductor, and the electric field distribution in the region outside the plane can be obtained through symmetry.

[0078] In some embodiments, the first polygonal electric field region is conformally mapped to the upper half plane of the second complex plane coordinate system through the first Christoffel - Schwarz transformation, obtaining a second polygonal electric field region, including:

[0079] Step S301: Determine the coordinates and vertex angles of each vertex of the first polygonal electric field region according to the first complex plane coordinate system.

[0080] Step S302: Determine the pre - image points of each vertex of the first polygonal electric field region on the real axis of the second complex plane coordinate system according to the coordinates of each vertex of the first polygonal electric field region; wherein, the order of the pre - image points on the real axis of the second complex plane coordinate system is consistent with the connection order of each vertex of the first polygonal electric field region.

[0081] Among them, the pre - image point is the mapping point of the vertex of the first polygonal electric field region on the real axis of the second complex plane coordinate system, thus realizing conformal mapping. At the same time, the relative position and order of the pre - image points will determine the shape of the second polygonal electric field region. The selection of the pre - image point is not unique, and different selections may lead to different specific forms of the mapping, but all can realize the conformal mapping from the polygon to the upper half plane.

[0082] Step S303: Conformally map the first polygonal electric field region to the upper half plane of the second complex plane coordinate system through the first Christoffel - Schwarz transformation formula according to the pre - image points and the vertex angles of each vertex, obtaining a second polygonal electric field region.

[0083] Among them, the first Christoffel - Schwarz transformation formula can form a conformal mapping between the polygonal region and the upper half plane of the coordinate system. Assume that the target plane where the first polygonal electric field region is located is the z - plane, and the upper half plane of the mapped second complex plane coordinate system is the w - plane. The transformation formula between the two is z = f(w), and the first Christoffel - Schwarz formula is expressed as:

[0084] (1)

[0085] where z and w are both complex numbers, representing a point on a plane, and w k is the preimage point on the real axis in the w-plane, C1 and C2 are constants, is the starting point of the integral, which can generally be chosen as negative infinity without affecting the integral result; is the ending point of the integral; is the vertex index, is the number of vertices, is the integral variable symbol, is the ratio of interior angles. Among them,

[0086] (2)

[0087] where α k is the apex angle of the polygon.

[0088] Substituting the parameters of the power module into Equation (1) and integrating, the transformation formula can be obtained as:

[0089] (3)

[0090] where h is the thickness of the insulating layer.

[0091] In some embodiments, conformally mapping the second polygon electric field region to the upper half plane of the third complex plane coordinate system through the second Christoffel–Schwarz transformation to obtain the third polygon electric field region includes:

[0092] Step S401: Determine the plane where the third complex plane coordinate system is located according to the target plane; wherein, the structure of the plane where the third complex plane coordinate system is located is simpler than that of the target plane.

[0093] Among them, converting the complex polygon electric field region to the electric field region in the upper half plane of the coordinate system, but the electric field distribution is still difficult to solve. Another conformal mapping can be performed to map the upper half plane electric field region to another plane with a simple electric field structure, so that the electric field distribution is more intuitive and convenient for analysis. When determining the third complex plane coordinate system, it is necessary to ensure that the plane structure of this coordinate system is simpler than that of the target plane, and at the same time, the direction of the electric field lines is perpendicular to the target plane to meet the requirements of electric field analysis. Through such a design, we can simplify the original complex electric field distribution into a third polygon electric field region with a regular shape and a clear direction of electric field lines, thereby greatly improving the efficiency and accuracy of electric field analysis.

[0094] After determining the third polygon electric field region, we can use this region for further electric field analysis. For example, the electric field distribution characteristics of the target plane can be deduced based on the electric field distribution of the third polygon electric field region,

[0095] Step S402 : Conformally map the second polygonal electric field region to the upper half plane of the third complex plane coordinate system through a second Christoffel-Schwarz transformation to obtain a third polygonal electric field region.

[0096] The process of the second Christoffel-Schwarz transformation is:

[0097] (4)

[0098] Where t is a point on the upper half plane of the third complex plane coordinate system, e is a constant, is the Christoffel-Schwarz transformation function.

[0099] Among them, through the second Christoffel-Schwarz transformation, the parallel plate capacitor can be mapped to the upper half plane of the coordinate system.

[0100] In some embodiments, determining an electric field relationship between a target plane and a plane where a third complex plane coordinate system is located based on mapping relationships between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region, and determining an electric field distribution on the target plane based on the electric field relationship includes:

[0101] Step S501 : Determine mapping relationships between a first polygonal electric field region and a second polygonal electric field region and a third polygonal electric field region respectively according to a first Christoffel-Schwarz transform process and a second Christoffel-Schwarz transform process.

[0102] The first Christoffel-Schwarz transform process and the second Christoffel-Schwarz transform process are both described as mapping relationships between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region respectively.

[0103] Step S502: Integrate the two mapping relationships to obtain the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located.

[0104] Among them, through the conformal mapping theory in complex functions, the transformation formulas in the two mapping relationships are combined to derive the electric field correspondence between the target plane and the plane where the third complex plane coordinate system is located. The electric field relationship function is described as:

[0105] (5)

[0106] The coordinates of any point in the t-plane can be expressed as (ξ,iη), where i is the imaginary unit.

[0107] Step S503: Determine the electric field distribution of the target plane based on the electric field line equation and equipotential line equation of the plane where the third complex plane coordinate system is located; the electric field distribution of the target plane includes the electric field line equation and equipotential line equation of the target plane.

[0108] Among them, the electric field line equation and equipotential line equation of the plane where the third complex plane coordinate system is located are known and fixed, and the electric field line equation and equipotential line equation of the plane where the third complex plane coordinate system is located can be respectively expressed as:

[0109] (6)

[0110] Among them, p and q are arbitrary constants, p can take any value, and q is any value from 0 to p. Substitute the electric field line equation and equipotential line equation of the plane where the third complex plane coordinate system is located into Equation (5), and the electric field line equation and equipotential line equation in the original electric field of the target plane can be obtained, which can be respectively expressed as:

[0111] (7)

[0112] In the formula, x is the abscissa value of the original electric field of the target plane, y is the ordinate value of the original electric field of the target plane, Re is the operation of taking the real part, Im is the operation of taking the imaginary part, is the electric field relationship function corresponding to the electric field line equation p, is the electric field relationship function corresponding to the equipotential line equation q.

[0113] In an exemplary embodiment, in order to more clearly illustrate a method for modeling the internal electric field of a power module provided by the embodiments of the present application, the following uses a specific example to specifically illustrate the method for modeling the internal electric field of a power module.

[0114] A method for modeling the internal electric field of a power module provided by this example includes:

[0115] S100: Determine the plane to be studied in the power module, and construct a complex plane coordinate system according to the electrode distribution in the plane.

[0116] Among them, select a suitable research plane according to the structure of the power module; establish a suitable two-dimensional coordinate system according to the selected research plane, named the z-plane, and any point z on it is expressed as z = x + iy or z(x, y), where i is the imaginary unit.

[0117] By implementing the above specific steps, it helps to determine the specific characteristics of the closed polygon formed by the insulating part on the research plane. The selection of the coordinate system in the implementation of Step S100 is related to the result of subsequent transformation. Under different coordinate system establishment methods, the final obtained electric field distribution function will also be different.

[0118] More specifically, in the process of determining the research plane in implementation step S100, the following steps are included:

[0119] S110. Select a suitable research plane according to the structure of the power module. Generally, there are multiple metal conductive layers distributed in the half-bridge power module, including the metal conductive layer connected to the DC positive electrode, the metal conductive layer connected to the DC negative electrode, the metal conductive layer connected to the output port, and the metal conductive layer connected to the bottom plate for grounding. Different conductive layers have different electric potentials. The arrangement of conductive layers with different electric potentials in the power module constitutes a complex electric field inside the power module. The designer needs to study a suitable electric field plane according to the design requirements. For example, when examining the withstand voltage of the upper copper to the ground, it is necessary to analyze the electric field of the longitudinal section of the power module.

[0120] S120. Establish a suitable two-dimensional coordinate system according to the selected research plane, named the z-plane. Any point z on it is expressed as z = x + iy, where i is the imaginary unit. In particular, if the selected research plane has symmetry, its electric field distribution also has a symmetric relationship, and the axis of symmetry can be selected as the coordinate axis.

[0121] Taking the example of examining the withstand voltage of the upper copper to the ground, according to the research plane determined in step S110, this plane is the longitudinal section of the power module, as Figure 3 shown. This plane includes the upper copper A101, the ceramic substrate A102, the lower copper A103, and the potting compound A104. Among them, the upper copper and the lower copper are metal conductors with extremely high conductivity and can be approximately regarded as equipotential bodies, that is, no electric field lines pass through their interiors; the ceramic substrate and the potting compound have small conductivity and are insulators, and there are electric field lines passing through their interiors, which are the targets to be studied. For the convenience of subsequent calculations, the upper surface of the lower copper is set to be collinear with the x-axis of the coordinate plane, and the right boundary of the upper copper is set to be collinear with the y-axis of the coordinate plane. The intersection of the two axes is the coordinate origin, and the two-dimensional coordinate system is as Figure 4 shown.

[0122] S200. Draw the polygon formed by the insulating parts in the research plane, and determine the coordinates of each vertex in the polygon and the angles of the corresponding vertices;

[0123] In the process of implementing step S200 to draw the polygon formed by the insulating parts in the research plane and determine the coordinates of each vertex in the polygon and the angles of the corresponding vertices, according to the research plane determined in step S100 and the coordinate plane determined in step S200, the specific coordinates of each point in the research plane can be determined. The boundaries of the insulating parts (ceramic substrate and potting compound) form a closed polygon. Suppose the vertices of this polygon are z1, z2,... z i 、... z n , and the corresponding vertex angles are α1, α2,... α i 、... αn , the polygon is named z1z2…z i …z n . In particular, if the polygon formed by the insulating part is not closed, it can be regarded as a degenerate polygon, and the point at infinity is defined as a vertex of the polygon, and the corresponding vertex angle is 0 or π. Still taking the example of examining the withstand voltage of the upper layer copper to the ground, as Figure 5 shown, assuming that the boundary effect between the potting compound and the ceramic substrate is ignored, the polygon formed by the two is expressed as z1z2z3, its vertices are z1, z2, z3, and the corresponding vertex angles are α1, α2, α3 respectively. Assuming the thickness of the ceramic layer is h, the coordinate of z1 can be expressed as (0, i h ), its vertex angle α1 is 3π / 2, z2 is the vertex at negative infinity, its vertex angle α2 is 0, and z3 is the vertex at positive infinity, its vertex angle α3 is π.

[0124] Among them, the vertices of the plane boundary part are taken as the points at infinity, and the vertices in the plane are the vertices of the conductor region; generally, this polygon will not enclose the conductor. The conductor in the power device is generally a cuboid, which is a rectangle in the plane and has symmetry. The symmetry axis of the conductor can be selected as the plane boundary, so that the insulating part will not enclose the conductor, and the electric field distribution in the region outside the plane can be obtained through symmetry.

[0125] S300. Determine the preimage points on the real axis corresponding to the vertices of the polygon, and map the polygon in the original electric field to the upper half plane D in the new coordinate system through the Christoffel–Schwarz formula.

[0126] In the process of implementing step S300 to determine the preimage points on the real axis corresponding to the vertices of the polygon and applying the Christoffel–Schwarz formula to map the polygon in the original electric field to the upper half plane D in the new coordinate system w, according to step S200, the polygon formed by the research object in the research plane and its vertex coordinates and vertex angles can be determined. Each vertex corresponds to a point on the real axis of the upper half plane D of the new coordinate system after transformation, which is called the preimage point.

[0127] It should be noted that the arrangement order of the preimage points on the real axis should be consistent with the connection order of the polygon vertices. For the convenience of subsequent calculations, the preimage point of z1 is set as w1(-1, 0), the preimage point of z2 is set as w2(0, 0), and the preimage point of z3 is set as the point at infinity. Applying the Christoffel–Schwarz formula can map the original polygon to the upper half plane of the w coordinate system.

[0128] More specifically, when determining the pre-image points on the transformed real axis corresponding to the vertices of the polygon in implementation step S300 and applying the Christoffel-Schwarz formula to map the polygon in the original electric field to the upper half-plane D in the new coordinate system w, the Christoffel-Schwarz formula can form a conformal mapping between the polygon region and the upper half-plane of the coordinate system. Assuming the plane where the original polygon region is located is the z-plane and the mapped plane is the w-plane, the transformation formula between the two is z = f(w), and the Christoffel-Schwarz formula is expressed as:

[0129] (1.1)

[0130] In the formula, both z and w are complex numbers, representing a point on the plane, and w k is the pre-image point on the real axis in the w-plane, C1 and C2 are constants, is the starting point of the integral, which can generally be chosen as negative infinity without affecting the integral result; is the ending point of the integral; is the vertex index, is the number of vertices, is the integral variable symbol, is the ratio of interior angles. Among them,

[0131] (1.2)

[0132] In the formula, α k is the vertex angle of the polygon.

[0133] Substituting the parameters of the power module into formula (1.1) and integrating, the transformation formula can be obtained as:

[0134] (1.3)

[0135] In the formula, h is the thickness of the insulating layer (ceramic layer).

[0136] S400. Reflect the upper half-plane D in the new coordinate system to a relatively simple electric field structure through the Christoffel-Schwarz formula, such as a parallel-plate capacitor.

[0137] Among them, when reflecting the upper half-plane D in the new coordinate system to a relatively simple electric field structure, such as a parallel-plate capacitor, in implementation step S400, according to step S300, the complex polygon electric field region can be converted to the electric field region of the upper half-plane of the coordinate system, but its electric field distribution is still difficult to solve, and a conformal mapping can be performed again to map the upper half-plane electric field region to another shape with a simple electric field structure.

[0138] More specifically, the parallel-plate capacitor has a simple structure, and the electric field lines are all perpendicular to the field plates, as Figure 6As shown in the figure, assume that the plane where the parallel-plate capacitor is located is named the t-plane, and the plane where the upper half-plane of the coordinate system is located is still named the w-plane. By using the Christoffel-Schwarz formula, the formula for mapping the parallel-plate capacitor to the upper half-plane of the coordinate system can be obtained as follows:

[0139] (1.4)

[0140] where t is a point on the upper half-plane of the coordinate system in the third complex plane, e is a constant, is the Christoffel-Schwarz transformation function. Among them, the planes w and t are inverse operations to each other.

[0141] S500. According to the mapping relationship between the simple electric field and the original electric field obtained by two Christoffel-Schwarz formula transformations, relying on this mapping relationship, the equipotential lines and electric field lines in the original electric field are obtained from the equipotential lines and electric field lines distributions of the simple electric field.

[0142] In the process of implementing step S500 to obtain the mathematical relationship between the simple electric field and the original electric field according to the two transformations, and relying on this mathematical relationship, the equipotential lines and electric field lines in the original electric field are obtained from the equipotential lines and electric field lines distributions of the simple electric field. According to steps S300 and S400, the mapping formulas of the two Christoffel-Schwarz transformations are obtained respectively. By combining the two, the electric field relationship between the plane z where the original polygonal electric field is located and the plane t where the parallel-plate capacitor is located can be obtained, and its relationship expression is:

[0143] (1.5)

[0144] Assume that the coordinates of any point in the t-plane can be expressed as (ξ, iη). Then the electric field line equation and equipotential line equation in the parallel-plate capacitor can be expressed as:

[0145] (1.6)

[0146] where p and q are arbitrary constants. Substituting the electric field line and equipotential line equations into equation (1.5), the electric field line and equipotential line equations in the original electric field can be obtained, which can be expressed as:

[0147] (1.7)

[0148] Using mathematical calculation tools such as MATLAB, the curve clusters corresponding to these two groups of equations can be drawn. As Figure 7 shown is the electric field line distribution diagram of the longitudinal section of the power module obtained through the embodiments of the present invention, and as Figure 8 shown is the equipotential line distribution diagram of the longitudinal section of the power module obtained through the embodiments of the present invention. Figure 9The electric field line distribution of the longitudinal section of the power module obtained by finite element simulation. It can be seen from the figure that the similarity of the electric field line distributions obtained by the two methods is relatively high, indicating that the method described in the embodiments of the present invention has good accuracy in the electric field modeling.

[0149] It can be understood that in the method for modeling the internal electric field of the power module through the examples of this application, a set of processes including determining the research plane, determining the closed polygon features, applying the Christoffel - Schwarz transformation, mapping the reflection to a simple electric field, and using the simple electric field structure to inversely deduce the original electric field distribution are adopted to experiment on the modeling of the complex internal electric field of the power module. This method is more efficient and simple. Different from general finite element simulations, this method does not rely on very expensive hardware devices and high - performance software computing power, and can more intuitively reflect the internal electric field distribution of the power module, providing more effective and reliable insulation design guidance for power module designers.

[0150] Based on the same inventive concept, the embodiments of this application also provide a power module internal electric field modeling system for implementing the above - mentioned power module internal electric field modeling method.

[0151] The implementation solutions provided by this system to solve problems are similar to the implementation solutions described in the above method. Therefore, the specific limitations in one or more embodiments of the power module internal electric field modeling system provided below can refer to the limitations on the power module internal electric field modeling method in the above text, and will not be repeated here.

[0152] As Figure 10 shown, the embodiments of this application provide a power module internal electric field modeling system, including:

[0153] A plane determination module 100, configured to determine the target plane for electric field modeling and the first complex plane coordinate system established on the target plane according to the internal structure of the power module;

[0154] A polygon determination module 200, configured to determine the first polygon electric field region formed by the boundary of the insulation structure part of the target plane in the first complex plane coordinate system according to the structural distribution of the power module in the target plane;

[0155] A first mapping module 300, configured to conformally map the first polygon electric field region to the upper half - plane of the second complex plane coordinate system through the first Christoffel - Schwarz transformation to obtain a second polygon electric field region;

[0156] A second mapping module 400, configured to conformally map the second polygon electric field region to the upper half - plane of the third complex plane coordinate system through the second Christoffel - Schwarz transformation to obtain a third polygon electric field region; wherein, the structure of the plane where the third complex plane coordinate system is located is simpler than the structure of the target plane.

[0157] An electric field distribution determination module 500, configured to determine the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located according to the mapping relationships between the first polygon electric field region and the second polygon electric field region and the third polygon electric field region respectively, and determine the electric field distribution of the target plane according to the electric field relationship.

[0158] In some embodiments, the structural distribution of the target plane is a symmetric structure;

[0159] The process of establishing the first complex plane coordinate system on the target plane includes:

[0160] Using two mutually perpendicular symmetry axes of the target plane as the x-axis and y-axis of the first complex plane coordinate system respectively, and taking the intersection point of the two symmetry axes as the origin of the first complex plane coordinate system.

[0161] In some embodiments, a polygon determination module 200 is configured to:

[0162] Obtain the structural distribution of the power module in the target plane, where the structural distribution includes an insulating structure part and a non-insulating structure part;

[0163] Form the region boundary of the insulating structure part into a first polygon electric field region in the first complex plane coordinate system; wherein, the first polygon electric field region encloses all the insulating structure parts in the target plane.

[0164] In some embodiments, a first mapping module 300 is configured to:

[0165] Determine the coordinates and vertex angles of each vertex of the first polygon electric field region according to the first complex plane coordinate system;

[0166] Determine the pre-image points of each vertex of the first polygon electric field region on the real axis of the second complex plane coordinate system according to the coordinates of each vertex of the first polygon electric field region; wherein, the sorting of the pre-image points on the real axis of the second complex plane coordinate system is consistent with the connection order of each vertex of the first polygon electric field region;

[0167] Conformally map the first polygon electric field region to the upper half plane of the second complex plane coordinate system through the first Christoffel-Schwarz transformation formula according to the pre-image points and the vertex angles of each vertex, to obtain a second polygon electric field region.

[0168] In some embodiments, a second mapping module 400 is configured to:

[0169] Determine the plane where the third complex plane coordinate system is located according to the target plane; wherein, the structure of the plane where the third complex plane coordinate system is located is simpler than the structure of the target plane;

[0170] The second polygon electric field region is conformally mapped to the upper half plane of the third complex plane coordinate system through a second Christoffel - Schwarz transformation to obtain a third polygon electric field region.

[0171] In some embodiments, the electric field distribution determination module 500 is configured to:

[0172] Determine the mapping relationships between the first polygon electric field region and the second polygon electric field region and the third polygon electric field region respectively according to the first Christoffel - Schwarz transformation process and the second Christoffel - Schwarz transformation process;

[0173] Integrate the two mapping relationships to obtain the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located;

[0174] Determine the electric field distribution of the target plane according to the electric field line equation and equipotential line equation of the plane where the third complex plane coordinate system is located through the electric field relationship; the electric field distribution of the target plane includes the electric field line equation and equipotential line equation of the target plane.

[0175] As Figure 11 shown, an embodiment of the present application provides an electronic device. The electronic device 10 includes a memory 20 and a processor 30. A computer program is stored in the memory 20. When the computer program is executed by the processor 30, the processor 30 is caused to execute the steps of the internal electric field modeling method of the power module in the above - mentioned embodiment.

[0176] An embodiment of the present application provides a computer - readable storage medium, on which a computer program is stored. When the computer program is executed, the steps of the internal electric field modeling method of the power module in the above - mentioned embodiment are implemented.

[0177] An embodiment of the present application provides a computer program product. The computer program product includes a computer program stored on a non - transitory computer - readable storage medium. The computer program includes program instructions. When the program instructions are executed by a computer, the computer is caused to execute the steps of the internal electric field modeling method of the power module described in the above - mentioned embodiment.

[0178] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above - described system, electronic device, computer storage medium, and computer program product can refer to the corresponding processes in the foregoing method embodiments and will not be described herein again.

[0179] It should be noted that the terms "first", "second", etc. in the description, claims and the above-mentioned drawings of the present invention are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order different from those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0180] It should be understood that although the steps in the flowcharts involved in the above-described embodiments are shown in sequence according to the indications of the arrows, these steps do not necessarily have to be executed in the order indicated by the arrows. Unless there is a clear indication in this article, the execution of these steps has no strict order restriction, and these steps can be executed in other orders. Moreover, at least some of the steps in the flowcharts involved in the above-described embodiments may include multiple steps or multiple stages. These steps or stages do not necessarily have to be executed at the same time, but can be executed at different times. The execution order of these steps or stages does not necessarily have to be sequential, but can be executed alternately or in turn with at least some of the steps or stages in other steps or other steps.

[0181] In several embodiments provided by the present invention, it should be understood that the disclosed systems, electronic devices, computer storage media, computer program products and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling, direct coupling or communication connection to each other can be through some interfaces, and the indirect coupling or communication connection of the device or unit can be in an electrical, mechanical or other form.

[0182] The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0183] In addition, in each embodiment of the present invention, each functional unit can be integrated into a processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above integrated unit can be implemented in the form of hardware or in the form of a software functional unit.

[0184] If the above integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of the present invention. The foregoing storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memories (English full name: Read-Only Memory, English abbreviation: ROM), random access memories (English full name: Random Access Memory, English abbreviation: RAM), magnetic disks, or optical discs.

[0185] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of each embodiment of the present invention.

Claims

1. A method for modeling the internal electric field of a power module, characterized in that, Including: Determine the target plane where the electric field modeling is located and the first complex plane coordinate system established on the target plane according to the internal structure of the power module; Determine the first polygonal electric field region formed by the boundary of the insulation structure part of the target plane in the first complex plane coordinate system according to the structural distribution of the power module in the target plane; Conformally map the first polygonal electric field region to the upper half plane of the second complex plane coordinate system through the first Christoffel - Schwarz transformation to obtain the second polygonal electric field region; Conformally map the second polygonal electric field region to the upper half plane of the third complex plane coordinate system through the second Christoffel - Schwarz transformation to obtain the third polygonal electric field region; wherein, the structure of the plane where the third complex plane coordinate system is located is simpler than that of the target plane; Determine the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located according to the mapping relationships between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region respectively, and determine the electric field distribution of the target plane according to the electric field relationship.

2. The method for internal electric field modeling of the power module according to claim 1, wherein The structural distribution of the target plane is a symmetric structure; The process of establishing the first complex plane coordinate system on the target plane includes: Use two mutually perpendicular symmetry axes of the target plane as the x - axis and y - axis of the first complex plane coordinate system respectively, and take the intersection point of the two symmetry axes as the origin of the first complex plane coordinate system.

3. The method for modeling the internal electric field of a power module according to claim 1, characterized in that The step of determining the first polygonal electric field region formed by the boundary of the insulation structure part of the target plane in the first complex plane coordinate system according to the structural distribution of the power module in the target plane includes: Obtain the structural distribution of the power module in the target plane, and the structural distribution includes an insulation structure part and a non - insulation structure part; Form the first polygonal electric field region in the first complex plane coordinate system with the regional boundary of the insulation structure part; wherein, the first polygonal electric field region encloses all insulation structure parts in the target plane.

4. The internal electric field modeling method of the power module according to claim 1, wherein The step of conformally mapping the first polygonal electric field region to the upper half plane of the second complex plane coordinate system through the first Christoffel - Schwarz transformation to obtain the second polygonal electric field region includes: Determine the coordinates and vertex angles of each vertex of the first polygonal electric field region according to the first complex plane coordinate system; Determine the pre - image points of each vertex of the first polygonal electric field region on the real axis of the second complex plane coordinate system according to the coordinates of each vertex of the first polygonal electric field region; wherein, the order of the pre - image points on the real axis of the second complex plane coordinate system is consistent with the connection order of each vertex of the first polygonal electric field region; Conformally map the first polygonal electric field region to the upper half plane of the second complex plane coordinate system through the first Christoffel - Schwarz transformation formula according to the pre - image points and the vertex angles of each vertex to obtain the second polygonal electric field region.

5. The method for modeling the internal electric field of a power module according to claim 1, wherein Conformally mapping the second polygonal electric field region to the upper half-plane of a third complex plane coordinate system through a second Christoffel–Schwarz transformation to obtain a third polygonal electric field region, including: Determining the plane where the third complex plane coordinate system is located according to the target plane; wherein, the structure of the plane where the third complex plane coordinate system is located is simpler than the structure of the target plane; Conformally mapping the second polygonal electric field region to the upper half-plane of a third complex plane coordinate system through a second Christoffel–Schwarz transformation to obtain the third polygonal electric field region.

6. The method for modeling the internal electric field of a power module according to any one of claims 1 to 5, characterized in that, Determining the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located according to the mapping relationships between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region respectively, and determining the electric field distribution of the target plane according to the electric field relationship, including: Determining the mapping relationships between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region respectively according to the first Christoffel–Schwarz transformation process and the second Christoffel–Schwarz transformation process; Integrating the two mapping relationships to obtain the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located; Determining the electric field distribution of the target plane according to the electric field line equation and equipotential line equation of the plane where the third complex plane coordinate system is located through the electric field relationship; the electric field distribution of the target plane includes the electric field line equation and equipotential line equation of the target plane.

7. A power module internal electric field modeling system, characterized in that, Including: A plane determination module, configured to determine the target plane where the electric field modeling is located and the first complex plane coordinate system established on the target plane according to the internal structure of the power module; A polygon determination module, configured to determine the first polygonal electric field region formed by the boundary of the insulation structure part of the target plane in the first complex plane coordinate system according to the structural distribution of the power module in the target plane; A first mapping module, configured to conformally map the first polygonal electric field region to the upper half-plane of a second complex plane coordinate system through a first Christoffel–Schwarz transformation to obtain a second polygonal electric field region; A second mapping module, configured to conformally map the second polygonal electric field region to the upper half-plane of a third complex plane coordinate system through a second Christoffel–Schwarz transformation to obtain a third polygonal electric field region; wherein, the structure of the plane where the third complex plane coordinate system is located is simpler than the structure of the target plane; An electric field distribution determination module, configured to determine the electric field relationship between the target plane and the plane where the third complex plane coordinate system is located according to the mapping relationships between the first polygonal electric field region and the second polygonal electric field region and the third polygonal electric field region respectively, and determine the electric field distribution of the target plane according to the electric field relationship.

8. An electronic device, characterized in that, The electronic device includes a memory and a processor. A computer program is stored in the memory. When the computer program is executed by the processor, the processor is caused to execute the steps of the method for modeling the internal electric field of the power module according to any one of claims 1-6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed, the steps of the method for modeling the internal electric field of the power module according to any one of claims 1-6 are implemented.

10. A computer program product, characterized in that, The computer program product includes a computer program stored on a non-transitory computer-readable storage medium. The computer program includes program instructions. When the program instructions are executed by a computer, the computer is caused to execute the steps of the method for modeling the internal electric field of the power module according to any one of claims 1-6.

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