IML laminating display module, manufacturing method thereof and electronic equipment

Abstract

The invention relates to an IML laminated display module, a manufacturing method thereof and electronic equipment. The IML laminating display module comprises an IML cover plate, a supporting frame, a bonding layer and a display screen, the IML cover plate is provided with a containing groove, the supporting frame is arranged in the containing groove, and the display screen is arranged in the containing groove and connected with the IML cover plate through the bonding layer. The manufacturing method comprises the following steps that a supporting frame is arranged in a containing groove of an IML cover plate, and an assembly part is obtained; arranging a bonding layer on the display screen to obtain a bonding piece; and placing the bonding piece in the accommodating groove, and connecting the bonding piece with the IML cover plate through the bonding layer to obtain the bonding assembly. The supporting frame is arranged in the containing groove of the IML cover plate, then the supporting frame of the assembly part is attached to the display screen, and the supporting frame can flatten the deformation of the IML cover plate, so that the IML cover plate is kept in a flat state, the deformation of the IML cover plate can be stable, and the problem that a finished product is attached to mura and bubbles is solved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an IML lamination display module, a manufacturing method thereof, and an electronic device. Background Art

[0002] The In Molding Label (IML) process first places a pre-printed film into a metal mold. Then, a molding resin is injected into the mold to bond the film, forming a single piece of the printed film and the resin, which then solidifies into the finished product. IML cover panels are manufactured using the IML process.

[0003] When attaching an IML cover to a display screen, an optical water-based adhesive bonding process is typically used. However, the bonded product is prone to mura and air bubbles, which are particularly noticeable during high-temperature processing. Summary of the Invention

[0004] Based on this, it is necessary to provide an IML bonding display module and its manufacturing method, and electronic equipment to solve the problem of mura and bubbles easily appearing in bonded products.

[0005] The first aspect of the present invention is to provide an IML lamination display module, the solution is as follows:

[0006] An IML lamination display module includes an IML cover plate, a support frame, an adhesive layer and a display screen;

[0007] The IML cover plate has a receiving groove, the supporting frame is arranged in the receiving groove, and the display screen is in the receiving groove and connected to the IML cover plate through the adhesive layer.

[0008] In one embodiment, the support frame is a sheet metal part.

[0009] In one embodiment, the display screen is an LCM screen or a FOG screen.

[0010] In one embodiment, the bonding layer is an optical OCA layer.

[0011] The second aspect of the present invention is to provide a method for manufacturing an IML laminated display module, the scheme is as follows:

[0012] A method for manufacturing an IML laminated display module comprises the following steps:

[0013] Arranging a support frame in the receiving groove of the IML cover plate to obtain an assembly;

[0014] providing an adhesive layer on the display screen to obtain an adhesive member;

[0015] Place the bonding member in the receiving groove and connect it to the IML cover plate through the bonding layer to obtain a fitting assembly.

[0016] In one embodiment, the display screen is an LCM screen or an FOG screen.

[0017] In one embodiment, the bonding layer is an optical OCA layer.

[0018] In one embodiment, the support frame is a sheet metal part.

[0019] In one embodiment, before assembling the IML cover plate and the support frame, the manufacturing method of the IML fitting display module further includes the following steps:

[0020] Bake the IML cover plate.

[0021] In one embodiment, the baking process is carried out in an environment with a temperature of 70 °C to 85 °C and a humidity of 2% RH to 4% RH.

[0022] In one embodiment, the manufacturing method of the IML fitting display module further includes the following steps:

[0023] Perform a pressure reduction and degassing treatment on the fitting assembly.

[0024] In one embodiment, the pressure of the pressure reduction and degassing treatment is 0.15 MPa to 0.25 MPa, the temperature is 25 °C to 35 °C, and the time is 15 minutes to 20 minutes.

[0025] The third aspect of the present invention is to provide an electronic device, and the solution is as follows:

[0026] An electronic device includes the IML fitting display module described in any of the above embodiments or the IML fitting display module manufactured by the manufacturing method described in any of the above embodiments.

[0027] Compared with the traditional technology, the above IML fitting display module, its manufacturing method, and the electronic device have the following beneficial effects:

[0028] The fitting products of the traditional water glue fitting process are prone to problems such as mura and bubbles, especially more obvious during high-temperature treatment. The inventors of the present invention studied the above problems and found that the traditional water glue fitting process will generate stress pulling to cause the product to deform, resulting in the generation of mura and bubbles. During high-temperature testing, the product deforms more severely, and the situation of mura and bubbles is more obvious.

[0029] Based on the above research, the IML bonding display module provided by the present invention sets a support frame in the accommodation groove of the IML cover plate, and then bonds the support frame of the assembly to the display screen. The support frame can flatten the deformation of the IML cover plate, so that the IML cover plate remains flat, making the deformation of the IML cover plate stable and improving the problems of bonding mura and bubbles in the finished product.

[0030] The manufacturing method of the above IML bonding display module is to first assemble the IML cover plate and the support frame, and then bond the support frame of the assembly to the display screen. The support frame can flatten the deformation of the IML cover plate, so that the IML cover plate remains flat, making the deformation of the IML cover plate stable and improving the problems of bonding mura and bubbles in the finished product.

[0031] The above electronic device contains the IML bonding display module described in any one of the above embodiments or the IML bonding display module manufactured by the manufacturing method described in any one of the above embodiments, and thus has corresponding technical features and can obtain corresponding beneficial effects. Description of the Drawings

[0032] Figure 1 It is a schematic structural diagram of an IML bonding display module according to an embodiment;

[0033] Figure 2 It is a schematic flow diagram of the manufacturing method of an IML bonding display module according to an embodiment.

[0034] Description of the Reference Numerals:

[0035] 100, IML bonding display module; 110, IML cover plate; 112, accommodation groove; 120, support frame; 130, bonding layer; 140, display screen. Detailed Description of the Embodiments

[0036] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention will be made with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0038] Unless otherwise specified, all steps of this application can be carried out sequentially or randomly. For example, when the method includes steps (a) and (b), it means that the method can include steps (a) and (b) carried out sequentially, or can also include steps (b) and (a) carried out sequentially. For example, when it is mentioned that the method further includes step (c), it means that step (c) can be added to the method in any order. For example, the method can include steps (a), (b), and (c) in sequence, or can also include steps (a), (c), and (b), or can also include steps (c), (a), and (b), etc.

[0039] When a numerical range is disclosed in this application, the above range is regarded as continuous and includes the minimum value and the maximum value of the range, as well as each value between such minimum value and maximum value. Further, when the range refers to integers, it includes each integer between the minimum value and the maximum value of the range. In addition, when multiple ranges are provided to describe features or characteristics, the ranges can be combined. In other words, unless otherwise specified, all ranges disclosed in this application should be understood to include any and all sub-ranges subsumed therein.

[0040] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0041] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0042] In the present invention, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] The present invention provides an IML bonding display module.

[0044] Please refer to Figure 1 As shown, the IML bonding display module 100 of an embodiment of the present invention includes an IML cover plate 110, a support frame 120, an adhesive layer 130, and a display screen 140.

[0045] The IML cover plate 110 has a receiving groove 112, the support frame 120 is disposed in the receiving groove 112, and the display screen 140 is in the receiving groove 112 and is connected to the IML cover plate 110 through the adhesive layer 130.

[0046] In the traditional water glue bonding process, the bonded products are prone to problems such as mura and bubbles, especially more obvious during high-temperature treatment. The inventors of the present invention studied the above problems and found that in the traditional water glue bonding process, stress pulling will cause the product to deform, resulting in the generation of mura and bubbles. During high-temperature testing, the deformation of the product is more serious, and the situation of mura and bubbles is more obvious.

[0047] Based on the above research, in the IML bonding display module 100 provided by the present invention, a support frame 120 is disposed in the receiving groove 112 of the IML cover plate 110, and then the support frame 120 of the assembled component is bonded to the display screen 140. The support frame 120 can flatten the deformation amount of the IML cover plate 110, so that the IML cover plate 110 maintains a flat state, and the deformation amount of the IML cover plate 110 can be stable, improving the problems of mura and bubbles in the finished product bonding.

[0048] In some examples, the shape of the support frame 120 is the same as or similar to the shape of the IML cover plate 110. In some examples, the shape of the support frame 120 is an annular structure, and the support frame 120 surrounds and is connected to the side wall of the receiving groove 112.

[0049] In some examples, the support frame 120 is a sheet metal part.

[0050] In some examples, the adhesive layer 130 is an optical OCA layer.

[0051] Optionally, the display screen 140 may be, but is not limited to, an LCM (liquid crystal) screen, a FOG (fog screen).

[0052] As Figure 2 As shown, a method for manufacturing an IML bonding display module 100 according to an embodiment of the present invention includes the following steps:

[0053] Step S1, a support frame 120 is disposed in the accommodation groove 112 of the IML cover plate 110 to obtain an assembled component.

[0054] Step S2, an adhesive layer 130 is disposed on the display screen 140 to obtain an adhesive component.

[0055] Step S3, the adhesive component is placed in the accommodation groove 112 and connected to the IML cover plate 110 through the adhesive layer 130 to obtain a bonding assembly.

[0056] Optionally, the display screen 140 may be, but is not limited to, an LCM (liquid crystal) screen, a FOG (fog screen).

[0057] In some examples, the adhesive layer 130 is an optical OCA layer.

[0058] In some examples, the shape of the support frame 120 is the same as or similar to the shape of the IML cover plate 110. In some examples, the shape of the support frame 120 is an annular structure, and the support frame 120 surrounds and is connected to the side wall of the accommodation groove 112.

[0059] In some examples, the support frame 120 is a sheet metal part.

[0060] In some examples, before the step of assembling the IML cover plate 110 and the support frame 120 (step S1), the method for manufacturing the IML bonding display module 100 further includes the following steps:

[0061] Bake the IML cover plate 110.

[0062] Before assembling the IML cover plate 110 and the support frame 120, the above baking treatment is performed on the IML cover plate 110 to remove the moisture in the IML cover plate 110, prevent the release of moisture in the subsequent IML cover plate 110, and better prevent the problem of bubble generation.

[0063] In some of these examples, the temperature of the baking treatment is 70 °C to 85 °C. Further, in some of these examples, the temperature of the baking treatment is 70 °C to 85 °C. In some specific examples, the temperature of the baking treatment is, for example, 70 °C, 75 °C, 80 °C, 60 °C, 65 °C, 70 °C, 75 °C, 80 °C, 85 °C, etc., or the range between any two of the above numerical ranges.

[0064] In some of these examples, the humidity of the baking treatment is 2% RH to 4% RH. Further, in some of these examples, the humidity of the baking treatment is 2% RH to 4% RH. In some specific examples, the humidity of the baking treatment is, for example, 2% RH, 2.2% RH, 2.4% RH, 2.6% RH, 2.8% RH, 3% RH, 3.2% RH, 3.4% RH, 3.6% RH, 3.8% RH, 4% RH, etc., or the range between any two of the above numerical ranges.

[0065] In a specific example, the temperature of the baking treatment is 70 °C and the humidity is 4% RH. In a specific example, the temperature of the baking treatment is 80 °C and the humidity is 2% RH.

[0066] In some of these examples, in step S2, the way to set the bonding layer 130 on the display screen 140 is coating. The coating process can be, for example, but not limited to, spin coating process, printing process, inkjet printing process, scraping coating process, printing process, dip coating process, soaking process, spraying process, roll coating process, casting process, slot die coating process, and bar coating process, etc.

[0067] In some of these examples, after the step (step S3) of fitting the support frame 120 of the assembly with the bonding layer 130 of the bonding part, the manufacturing method of the IML fitting display module 100 further includes the following steps:

[0068] Perform a pressure reduction and degassing treatment on the fitting assembly.

[0069] The manufacturing method provided in the above examples performs a pressure reduction and degassing treatment on the fitting assembly, which can better avoid the generation of bubbles.

[0070] In some of these examples, the pressure of the vacuum defoaming treatment is 0.15 MPa to 0.25 MPa. Further, in some of these examples, the pressure of the vacuum defoaming treatment is 0.18 MPa to 0.22 MPa. In some specific examples, the pressure of the vacuum defoaming treatment is, for example, 0.15 MPa, 0.16 MPa, 0.17 MPa, 0.18 MPa, 0.19 MPa, 0.2 MPa, 0.21 MPa, 0.22 MPa, 0.23 MPa, 0.24 MPa, 0.25 MPa, etc., or the range between any two of the above numerical ranges.

[0071] In some of these examples, the temperature of the vacuum defoaming treatment is 25 °C to 35 °C. Further, in some of these examples, the temperature of the vacuum defoaming treatment is 28 °C to 32 °C. In some specific examples, the temperature of the vacuum defoaming treatment is, for example, 25 °C, 26 °C, 27 °C, 28 °C, 29 °C, 30 °C, 31 °C, 32 °C, 33 °C, 34 °C, 35 °C, etc., or the range between any two of the above numerical ranges.

[0072] In some of these examples, the time of the vacuum defoaming treatment is 15 minutes to 20 minutes. Further, in some of these examples, the time of the vacuum defoaming treatment is 17 minutes to 18 minutes. In some specific examples, the time of the vacuum defoaming treatment is, for example, 10 minutes, 15 minutes, 20 minutes, 25 minutes, 30 minutes, 10 minutes, 15 minutes, 20 minutes, 25 minutes, 30 minutes, etc.

[0073] It should be understood that although Figure 2 the steps in the shown flowchart are displayed in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear indication in this article, the execution of these steps has no strict order limit, and they can be executed in other orders or simultaneously, as long as there is no logical contradiction. Moreover, Figure 2 at least a part of the steps in

[0074] can include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same moment, but can be executed at different moments, and their execution order is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or sub-steps or stages of other steps.

[0075] The manufacturing method of the above IML bonding display module 100 first assembles the IML cover plate 110 and the support frame 120, and then bonds the support frame 120 of the assembled part to the display screen 140. The support frame 120 can flatten the deformation amount of the IML cover plate 110, so that the IML cover plate 110 remains flat, making the deformation amount of the IML cover plate 110 stable and improving the problems of bonded mura and bubbles in the finished product.

[0076] Compared with the traditional water glue bonding process, the manufacturing method of the above IML bonding display module 100 has low input cost and high bonding efficiency, and can be applied to the full bonding process of IML cover plates 110 and display screens 140 of large, medium and small sizes, making the deformation amount of the IML cover plate 110 stable and improving the problems of bonded mura and bubbles in the finished product.

[0077] The traditional water glue bonding process has a cumbersome process flow, high labor cost and low production efficiency. When using water glue bonding, the glue overflows, it is difficult to clean, and residual glue and dirt are easily generated. The manufacturing method of the above IML bonding display module 100 breaks through the problems of mura and bubbles in the bonding of the IML cover plate 110 in the industry, simplifies the IML display screen 140 bonding process, reduces production labor and saves man-hour costs.

[0078] Furthermore, the present invention also provides an electronic device.

[0079] An electronic device in an embodiment includes the IML bonding display module 100 described in any of the above examples or the IML bonding display module 100 manufactured by the manufacturing method described in any of the above examples.

[0080] Furthermore, the above electronic device has corresponding technical features and can obtain corresponding beneficial effects.

[0081] The above electronic device can be, but is not limited to, a vehicle-mounted display screen 140, a mobile phone, a notebook computer, a computer monitor, etc.

[0082] The following provides specific embodiments to further illustrate the present invention. The present invention provides the following specific embodiments for better further understanding of the present invention, which are not limited to the following specific embodiments and do not constitute a limitation to the content and protection scope of the present invention.

[0083] Embodiment 1

[0084] The manufacturing method of the IML bonding display module 100 provided in this embodiment includes the following steps:

[0085] Step 1, provide an IML cover plate 110, and the IML cover plate 110 has a receiving groove 112. Bake the IML cover plate 110. The temperature of the baking process is 85 °C and the humidity is 4% RH.

[0086] Step 2, set the support frame 120 in the accommodation groove 112 of the IML cover plate 110. The support frame 120 is a sheet metal part to obtain an assembled part.

[0087] Step 3, roll-coat optical OCA on the display screen 140 to form an adhesive layer 130 to obtain an adhered part.

[0088] Step 4, place the adhered part in the accommodation groove 112 and connect it to the IML cover plate 110 through the adhesive layer 130 to obtain a fitting assembly.

[0089] Step 5, perform a pressure reduction and degassing treatment on the fitting assembly. The pressure of the pressure reduction and degassing treatment is 0.25 MPa.

[0090] Example 2

[0091] The manufacturing method of the IML fitting display module 100 provided in this example includes the following steps:

[0092] Step 1, provide the IML cover plate 110 which has an accommodation groove 112. Bake the IML cover plate 110. The temperature of the baking treatment is 80 °C and the humidity is 3% RH.

[0093] Step 2, set the support frame 120 in the accommodation groove 112 of the IML cover plate 110. The support frame 120 is a sheet metal part to obtain an assembled part.

[0094] Step 3, roll-coat optical OCA on the display screen 140 to form an adhesive layer 130 to obtain an adhered part.

[0095] Step 4, place the adhered part in the accommodation groove 112 and connect it to the IML cover plate 110 through the adhesive layer 130 to obtain a fitting assembly.

[0096] Step 5, perform a pressure reduction and degassing treatment on the fitting assembly. The pressure of the pressure reduction and degassing treatment is 0.1 MPa.

[0097] Example 3

[0098] The manufacturing method of the IML fitting display module 100 provided in this example includes the following steps:

[0099] Step 1, provide the IML cover plate 110 which has an accommodation groove 112. Bake the IML cover plate 110. The temperature of the baking treatment is 70 °C and the humidity is 2% RH.

[0100] Step 2, set the support frame 120 in the accommodation groove 112 of the IML cover plate 110. The support frame 120 is a sheet metal part to obtain an assembled part.

[0101] Step 3: Roll-coat optical OCA on the display screen 140 to form the bonding layer 130, thereby obtaining the bonded part.

[0102] Step 4: Place the bonded part in the accommodation groove 112 and connect it to the IML cover plate 110 through the bonding layer 130, thereby obtaining the fitting assembly.

[0103] Step 5: Perform a pressure reduction and degassing treatment on the fitting assembly, and the pressure of the pressure reduction and degassing treatment is 0.15 MPa.

[0104] Example 4

[0105] The manufacturing method of the IML fitting display module 100 provided in this example includes the following steps:

[0106] Step 1: Provide the IML cover plate 110, and the IML cover plate 110 has the accommodation groove 112. Bake the IML cover plate 110. The temperature of the baking treatment is 85 °C, and the humidity is 3% RH.

[0107] Step 2: Set the support frame 120 in the accommodation groove 112 of the IML cover plate 110. The support frame 120 is a sheet metal part, thereby obtaining the assembled part.

[0108] Step 3: Roll-coat optical OCA on the display screen 140 to form the bonding layer 130, thereby obtaining the bonded part.

[0109] Step 4: Place the bonded part in the accommodation groove 112 and connect it to the IML cover plate 110 through the bonding layer 130, thereby obtaining the fitting assembly.

[0110] Step 5: Perform a pressure reduction and degassing treatment on the fitting assembly, and the pressure of the pressure reduction and degassing treatment is 0.2 MPa.

[0111] Comparative Example 1

[0112] The manufacturing method of the IML fitting display module in this comparative example includes the following steps:

[0113] Step 1: First, seal the position of the iron frame of the display module with a sealant.

[0114] Step 2: Dot RTV structural adhesive on the iron frame of the display module.

[0115] Step 3: Complete the fitting between the IML cover plate and the display module through the alignment jig.

[0116] Step 4: Stand still and cure at room temperature.

[0117] Step 5: Inject liquid glue into the gap between the IML cover plate and the display module.

[0118] Step 6, complete the curing of the glue by heating.

[0119] Step 7, clean the overflowed glue.

[0120] Perform high-temperature tests on the IML laminated display modules obtained from the above-mentioned examples and comparative examples. The test conditions are to place the samples in an environment of 95 °C for 1000 h. Then take them out, conduct appearance inspections, and record the mura and bubble conditions. The test results are shown in Table 1.

[0121] Table 1 Appearance inspection results of IML laminated display modules obtained from each example and comparative example

[0122]

[0123] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0124] The above-described embodiments only represent several implementation manners of the present invention. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims, and the description can be used to explain the content of the claims.

Claims

1. An IML bonding display module (100), characterized in that, It includes an IML cover plate (110), a support frame (120), an adhesive layer (130), and a display screen (140). The IML cover plate (110) has a receiving groove (112), the support frame (120) is disposed in the receiving groove (112), and the display screen (140) is in the receiving groove (112) and is connected to the IML cover plate (110) through the adhesive layer (130).

2. The IML bonding display module (100) according to claim 1, characterized in that, The support frame (120) is a sheet metal part.

3. The IML lamination display module (100) according to claim 1, wherein, The display screen (140) is an LCM screen or a FOG screen.

4. The IML bonding display module (100) according to any one of claims 1 to 3, characterized in that, The adhesive layer (130) is an optical OCA layer.

5. A manufacturing method of an IML bonding display module (100), characterized in that, It includes the following steps: Dispose the support frame (120) in the receiving groove (112) of the IML cover plate (110) to obtain an assembled part. Dispose the adhesive layer (130) on the display screen (140) to obtain an adhered part. Place the adhered part in the receiving groove (112) and connect it to the IML cover plate (110) through the adhesive layer (130) to obtain a fitting assembly.

6. The manufacturing method of the IML bonding display module (100) according to claim 5, characterized in that, The manufacturing method of the IML fitting display module (100) conforms to one or more of the following features (1) to (3): (1) The display screen (140) is an LCM screen or a FOG screen; (2) The adhesive layer (130) is an optical OCA layer; (3) The support frame (120) is a sheet metal part.

7. The manufacturing method of the IML lamination display module (100) according to claim 5 or 6, characterized in that, The manufacturing method of the IML fitting display module (100) conforms to one or more of the following features (1) to (2): (1) Before assembling the IML cover plate (110) and the support frame (120), the manufacturing method of the IML fitting display module (100) further includes the following steps: Bake the IML cover plate (110). (2) The manufacturing method of the IML fitting display module (100) further includes the following steps: Perform a pressure reduction and degassing treatment on the fitting assembly.

8. The manufacturing method of the IML laminated display module (100) according to claim 7, characterized in that, The baking treatment is carried out in an environment with a temperature of 70 °C to 85 °C and a humidity of 2% RH to 4% RH.

9. The manufacturing method of the IML bonding display module (100) according to claim 7, characterized in that, The pressure of the pressure reduction and degassing treatment is 0.15 MPa to 0.25 MPa, the temperature is 25 °C to 35 °C, and the time is 15 minutes to 20 minutes.

10. An electronic device, characterized in that, It contains the IML fitting display module (100) described in any one of claims 1 to 4 or the IML fitting display module (100) manufactured by the manufacturing method described in any one of claims 5 to 9.

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