Wafer separation device for semiconductor processing

Abstract

The present application relates to the field of semiconductor processing and discloses a wafer separation device for semiconductor processing, comprising a sleeve block, a mounting shell and a mounting plate, wherein the mounting shell is fixedly sleeved in the middle of the sleeve block, the mounting plate is fixedly sleeved in the upper part of the inner cavity of the mounting shell, and air-permeable blocks are symmetrically fixedly sleeved on both sides of the left side of the mounting plate, a driving mechanism is arranged on the upper surface of the mounting plate, a rotating shaft is threadedly connected to the middle part of the mounting plate, and a gear sleeve is slidably sleeved on the upper part of the rotating shaft. The hydraulic fluid between the sliding plate in the inner cavity of the mounting shell and the suction sleeve limits the first elastic member from pulling the suction sleeve downward to move upward, so that when the wafer is separated from the substrate, the adsorption mechanism smoothly pulls the wafer upward at the speed of the upward movement of the rotating shaft, thereby solving the problem that when the wafer is separated from the substrate, the adsorption device rigidly pulls the wafer to separate from the sticky substrate and move upward, causing the wafer to vibrate violently and accelerate instantaneously, resulting in stress concentration, cracking and bending of the wafer.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a wafer separation device for semiconductor processing. Background Art

[0002] A wafer separation device is a device that separates wafers from bonded substrates.

[0003] The adsorption devices used in the prior art usually lift the wafer from the adhesive substrate by rigidly pulling it when separating it from the substrate. This method can easily cause severe vibration of the wafer and stress concentration caused by gravitational acceleration, resulting in wafer cracking or bending, seriously affecting the quality and yield of the wafer. In addition, when the existing adsorption device adsorbs the wafer, the sudden increase in adsorption pressure can easily cause the wafer to deform. This deformation is particularly significant for wafers with smaller thicknesses, which not only limits production efficiency but also increases manufacturing costs. In addition, the adsorption device uses valve-controlled constant-pressure adsorption, which means that when adsorbing wafers thicker than the standard thickness, the wafer is easily detached from the adsorption device, and when adsorbing wafers thinner than the standard thickness, the wafer bends and deforms. Summary of the Invention

[0004] The present application proposes a wafer separation device for semiconductor processing, which has the advantages of uniform force and controllable adsorption force, and is used to solve the problem of wafer breakage and bending caused by the adsorption device forcibly pulling the wafer to separate from the sticky substrate when the wafer is separated from the substrate.

[0005] To achieve the above objectives, the present application adopts the following technical solution: a wafer separation device for semiconductor processing, comprising:

[0006] A sleeve block and a mounting shell, wherein the mounting shell is fixedly sleeved on the middle part of the sleeve block;

[0007] A mounting plate, the mounting plate being fixedly sleeved on the upper portion of the inner cavity of the mounting shell, with air-permeable blocks being symmetrically fixedly sleeved on both sides of the left side of the mounting plate;

[0008] A driving mechanism, the driving mechanism being arranged on the upper surface of the mounting plate;

[0009] A rotating shaft, the rotating shaft is threadedly connected to the middle part of the mounting plate, and the upper part of the rotating shaft is slidably sleeved with a gear sleeve;

[0010] A pulling mechanism, the pulling mechanism being arranged at the bottom of the rotating shaft and the middle of the inner cavity of the mounting shell;

[0011] A flow guide mechanism, the flow guide mechanism being arranged in the middle of the mounting plate;

[0012] an adsorption mechanism, the adsorption mechanism being arranged between the bottom of the mounting shell and the bottom of the flow guide mechanism;

[0013] An electromagnetic mechanism, the electromagnetic mechanism being arranged in the middle between the pulling mechanism and the adsorption mechanism;

[0014] Hydraulic fluid is provided between the bottom end of the mounting plate in the inner cavity of the sleeve block and the top end of the adsorption mechanism.

[0015] Preferably, the driving mechanism includes a first driving member, which is fixedly mounted on the upper surface of the mounting plate, and a gear is fixedly mounted on the output end of the first driving member, the gear and the gear sleeve are engaged with each other, and limit blocks are symmetrically fixedly mounted on the upper and lower sides of the gear, and the gear sleeve is located in the middle of the two limit blocks. The above structure can drive the rotating shaft when working, so that the rotating shaft drives the pulling mechanism to move upward, the pulling mechanism drives the adsorption mechanism to move upward, and the adsorption mechanism drives the wafer to separate from the substrate.

[0016] Preferably, the pulling mechanism includes a sliding plate, which is movably sleeved on the bottom of the rotating shaft, and the sliding plate is slidably sleeved on the mounting shell. The left and right sides of the sliding plate are symmetrically fixed with a first one-way valve, and the front and rear sides of the sliding plate are symmetrically fixed with a second one-way valve. The bottom end of the sliding plate is fixedly installed with a first elastic member, and the bottom end of the first elastic member is fixedly connected to the adsorption mechanism. The above structure can control the speed at which the adsorption mechanism drives the wafer to move upward during operation.

[0017] Preferably, the flow guiding mechanism includes a first sleeve, a second sleeve is fixedly installed on the bottom end of the first sleeve, a third sleeve is fixedly installed on the bottom end of the second sleeve, the first sleeve, the second sleeve and the third sleeve are all slidably sleeved on the middle part of the rotating shaft, a second driving member is fixedly installed on the top end of the first sleeve, a connecting rod is fixedly installed on the output end of the second driving member, a threaded block is slidably sleeved on the bottom end of the connecting rod, the threaded block is threadedly connected to the second sleeve, a second elastic member is fixedly installed on the bottom end of the second elastic member, a piston is fixedly installed on the bottom end of the second elastic member, the piston is slidably sleeved on the second sleeve, an annular groove is provided at the bottom of the inner cavity of the second sleeve, and the piston is located above the annular groove. The above structure can control the air pressure in the inner cavity of the adsorption mechanism and the adsorption pressure of the adsorption mechanism on the wafer during operation.

[0018] Preferably, the adsorption mechanism includes an air suction sleeve, the top of the air suction sleeve is fixedly mounted on the bottom end of the first elastic member, the third sleeve is slidably sleeved on the middle part of the air suction sleeve, the upper part of the inner cavity of the air suction sleeve is slidably sleeved with a connecting sleeve, the connecting sleeve is fixedly sleeved on the bottom of the third sleeve, the bottom of the connecting sleeve is circumferentially and fixedly sleeved with multiple groups of plug shafts at equal intervals, a through hole is opened in the middle of the plug shaft, the bottom of the inner cavity of the air suction sleeve is fixedly sleeved with a plug sleeve, the plug shaft and the plug sleeve are slidably sleeved, and a rubber pad is fixedly mounted on the bottom surface of the plug sleeve. The above structure can adsorb wafers to fit on the bottom surface of the rubber pad during operation.

[0019] Preferably, the electromagnetic mechanism includes a limiting ring, which is fixedly mounted on the top of the suction sleeve, a magnetic ring is fixedly mounted on the bottom end of the sliding plate, and an electromagnet is fixedly mounted on the top end of the suction sleeve.

[0020] Preferably, the air-permeable block is made of an air-permeable but water-tight material, and the contact surfaces between the two limit blocks and the gear sleeve are smooth surfaces.

[0021] Preferably, the opening direction of the first one-way valve is downward, the opening direction of the second one-way valve is upward, and the resistance to opening of the second one-way valve is greater than the elastic force of the first elastic member.

[0022] Preferably, ventilation holes are provided on the left and right sides of the upper surface of the threaded block, and the first sleeve, the second sleeve and the third sleeve are all made of heat-insulating material.

[0023] Preferably, the plug sleeve adopts an equilateral hexagonal design, and the rubber pad is made of rubber material.

[0024] The beneficial effects of the present invention are as follows:

[0025] 1. When the rubber pad is in contact with the surface of the wafer, the electromagnetic mechanism is started in the positive direction, and the electromagnetic mechanism pushes the guide mechanism to move upward, and the guide mechanism drives the connecting sleeve to move upward along the inner cavity of the suction sleeve, and the connecting sleeve drives the plug shaft to move upward, so that the space between the bottom end of the plug shaft in the plug sleeve and the contact surface of the wafer is increased, thereby gradually reducing the air pressure between the inner cavity of the connecting sleeve and the bottom of the piston in the inner cavity of the guide mechanism. At the same time, by setting the second elastic member and the piston, the air pressure between the bottom of the piston in the inner cavity of the guide mechanism remains unchanged until the top surface of the connecting sleeve moves upward and contacts the suction sleeve. At this time, the adsorption pressure between the wafer and the rubber pad is approximately equal to that of the second elastic member. The elastic force of the elastic member is stretched, and at the same time, the adsorption pressure between the wafer and the rubber pad gradually increases as the second elastic member is pulled up, thereby overcoming the problem of wafer deformation caused by a sudden increase in adsorption pressure when the existing adsorption device adsorbs the wafer; in addition, by positively starting the second driving member, the distance when the piston top moves to below the top of the ring groove is increased, the pulling length of the second elastic member is increased, and the negative pressure required by the inner cavity of the third sleeve is increased, thereby increasing the adsorption pressure between the wafer and the rubber pad, thereby achieving adsorption of wafers of different weights with different adsorption pressures, avoiding the problem of wafer deformation caused by adsorbing wafers with small thickness.

[0026] When the wafer is adsorbed on the bottom surface of the rubber pad, the rotating shaft is started in the positive direction, and the rotating shaft drives the sliding plate to move upward, the sliding plate pulls the first elastic member to extend, and the hydraulic fluid above the sliding plate flows to the bottom of the sliding plate through the first one-way valve. When the sliding plate moves upward, it pulls the adsorption mechanism upward through the first elastic member, and the adsorption mechanism pulls the wafer to be separated from the substrate, and the elastic force generated by the first elastic member cannot squeeze the hydraulic fluid at the bottom of the sliding plate through the adsorption mechanism alone to squeeze the second one-way valve to open. At this time, the hydraulic fluid between the sliding plate and the suction sleeve in the inner cavity of the mounting shell restricts the first elastic member from pulling the suction sleeve downward to move upward, so that when the wafer is separated from the substrate, the adsorption mechanism smoothly pulls the wafer upward at the speed of the upward movement of the rotating shaft, thereby avoiding that when the wafer is separated from the substrate, the first elastic member suddenly pulls the wafer upward to move instantaneously, causing violent vibration of the wafer and generating huge instantaneous gravitational acceleration, causing stress concentration on the wafer, resulting in wafer cracking and bending. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which constitute a part of the specification, illustrate embodiments disclosed in the present application and, together with the description, serve to explain the principles disclosed in the present application in a clear and understandable manner.

[0028] The present disclosure can be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0029] Figure 1 This is a schematic diagram of the overall appearance of the present invention;

[0030] Figure 2 This is a schematic diagram of the cross-sectional structure of the installation shell of the present invention;

[0031] Figure 3 This is a schematic diagram of the pulling mechanism structure of the present invention;

[0032] Figure 4 Schematic diagram of the adsorption mechanism structure of the present invention;

[0033] Figure 5 It is a schematic structural diagram of the flow guide mechanism of the present invention.

[0034] Among them: 1. sleeve block; 2. mounting shell; 3. mounting plate; 301. breathable block; 4. driving mechanism; 401. first driving member; 402. gear; 403. limit block; 5. rotating shaft; 501. gear sleeve; 6. pulling mechanism; 601. sliding plate; 602. first one-way valve; 603. second one-way valve; 604. first elastic member; 7. flow guiding mechanism; 701. first sleeve; 702. second sleeve; 703. third sleeve; 704. second driving member; 705. connecting rod; 706. threaded block; 707. second elastic member; 708. piston; 709. ring groove; 8. adsorption mechanism; 801. suction sleeve; 802. connecting sleeve; 803. plug shaft; 804. plug sleeve; 805. rubber pad; 9. electromagnetic mechanism; 901. limit ring; 902. magnetic ring; 903. electromagnet. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0036] See also Figures 1 to 5 As shown, a wafer separation device for semiconductor processing includes:

[0037] The sleeve block 1 and the mounting shell 2, wherein the mounting shell 2 is fixedly sleeved on the middle part of the sleeve block 1;

[0038] The mounting plate 3 is fixedly sleeved on the upper part of the inner cavity of the mounting shell 2. The ventilation blocks 301 are symmetrically fixedly sleeved on both sides of the left side of the mounting plate 3. The ventilation blocks 301 are made of breathable and waterproof materials. The ventilation blocks 301 are made of waterproof cloth, so that the air pressure between the mounting plate 3 and the pulling mechanism 6 is always kept the same as the atmospheric pressure outside the device, so as to maintain stable circulation and exchange of hydraulic fluid on the upper and lower sides of the pulling mechanism 6 in the inner cavity of the mounting shell 2;

[0039] The driving mechanism 4 is arranged on the upper surface of the mounting plate 3;

[0040] The rotating shaft 5 is threadedly connected to the middle part of the mounting plate 3, and the upper part of the rotating shaft 5 is slidably sleeved with a gear sleeve 501;

[0041] The pulling mechanism 6 is arranged at the bottom of the rotating shaft 5 and the middle of the inner cavity of the mounting shell 2;

[0042] The flow guide mechanism 7 is arranged in the middle of the mounting plate 3;

[0043] The adsorption mechanism 8 is arranged between the bottom of the mounting shell 2 and the bottom of the flow guide mechanism 7;

[0044] The electromagnetic mechanism 9 is arranged in the middle between the pulling mechanism 6 and the adsorption mechanism 8;

[0045] Hydraulic liquid is provided between the bottom end of the inner cavity mounting plate 3 of the sleeve block 1 and the top end of the adsorption mechanism 8 .

[0046] See also Figure 1 and Figure 2 As shown, the driving mechanism 4 includes a first driving member 401, which is fixedly mounted on the upper surface of the mounting plate 3. A gear 402 is fixedly mounted on the output end of the first driving member 401. The gear 402 is meshed with a gear sleeve 501. Limit blocks 403 are symmetrically fixedly mounted on the upper and lower sides of the gear 402. The gear sleeve 501 is located in the middle of the two limit blocks 403.

[0047] The contact surfaces between the two limit blocks 403 and the gear sleeve 501 are smooth, thereby reducing the friction resistance between the limit blocks 403 and the gear sleeve 501 and reducing the rotation load of the first driving member 401. At the same time, the two limit blocks 403 limit the upper and lower positions of the gear sleeve 501 to prevent the gear sleeve 501 from moving up and down.

[0048] During use, when the output end of the first driving member 401 rotates in the forward direction, the output end of the first driving member 401 drives the gear 402 to rotate, and the gear 402 drives the rotating shaft 5 to rotate. The rotating shaft 5 moves upward and rotates along the mounting plate 3 threadedly connected to it. At the same time, since the two limit blocks 403 limit the gear sleeve 501, the rotating shaft 5 slides upward along the gear sleeve 501.

[0049] See also Figures 1 to 3 As shown, the pulling mechanism 6 includes a sliding plate 601, which is movably sleeved on the bottom of the rotating shaft 5. The sliding plate 601 is slidably sleeved with the mounting shell 2. The left and right sides of the sliding plate 601 are symmetrically fixed with first one-way valves 602, and the front and rear sides of the sliding plate 601 are symmetrically fixed with second one-way valves 603. The bottom end of the sliding plate 601 is fixedly mounted with a first elastic member 604, and the bottom end of the first elastic member 604 is fixedly connected to the adsorption mechanism 8.

[0050] The opening direction of the first one-way valve 602 is downward, and the opening direction of the second one-way valve 603 is upward. The resistance to opening the second one-way valve 603 is greater than the elastic force of the first elastic member 604, so that when the adsorption mechanism 8 is adsorbed on the upper surface of the wafer and the wafer adheres to the adhesive substrate, when the positively rotating shaft 5 drives the sliding plate 601 to move upward, the sliding plate 601 pulls the first elastic member 604 to extend, and the hydraulic fluid above the sliding plate 601 flows to the bottom of the sliding plate 601 through the first one-way valve 602. When the wafer is separated from the substrate, the elastic force generated by the first elastic member 604 cannot squeeze the hydraulic fluid at the bottom of the sliding plate 601 through the adsorption mechanism 8 to squeeze the second one-way valve 603 to open, thereby avoiding the first elastic member 604 suddenly pulling the wafer upward instantaneously when the wafer is separated from the substrate, causing violent vibration of the wafer and generating huge gravitational acceleration, causing stress concentration on the wafer, and resulting in wafer cracking and bending.

[0051] See also Figures 1 to 5 As shown, the flow guiding mechanism 7 includes a first sleeve 701, a second sleeve 702 is fixedly installed on the bottom end of the first sleeve 701, and a third sleeve 703 is fixedly installed on the bottom end of the second sleeve 702. The first sleeve 701, the second sleeve 702 and the third sleeve 703 are all slidably sleeved on the middle part of the rotating shaft 5. The top of the first sleeve 701 is fixedly installed with a second driving member 704, and the output end of the second driving member 704 is fixedly installed with a connecting rod 705. The bottom end of the connecting rod 705 is slidably sleeved with a threaded block 706, which is threadedly connected to the second sleeve 702. The bottom end of the threaded block 706 is fixedly installed with a second elastic member 707, and the bottom end of the second elastic member 707 is fixedly installed with a piston 708. The piston 708 is slidably sleeved with the second sleeve 702. An annular groove 709 is provided at the bottom of the inner cavity of the second sleeve 702, and the piston 708 is located above the annular groove 709.

[0052] Ventilation holes are provided on the left and right sides of the upper surface of the threaded block 706, so that the hot air entering the first sleeve 701 flows to the bottom of the threaded block 706 through the ventilation holes. The first sleeve 701, the second sleeve 702 and the third sleeve 703 are all made of heat-insulating materials. The first sleeve 701, the second sleeve 702 and the third sleeve 703 are all made of high-carbon steel, thereby reducing the heat loss of the hot air flowing through the middle of the first sleeve 701, the second sleeve 702 and the third sleeve 703;

[0053] When in use, the second driving member 704 is started in the positive direction, and the output end of the second driving member 704 drives the connecting rod 705 to rotate, and the connecting rod 705 drives the threaded block 706 to rotate. The threaded block 706 rotates along the threaded surface of the second sleeve 702 and moves upward. The threaded block 706 drives the piston 708 to move upward through the second elastic member 707, so that the distance between the top end of the piston 708 and the top end of the annular groove 709 increases, thereby increasing the distance when the piston 708 moves downward until the top end of the piston 708 moves below the top end of the annular groove 709, increasing the pulling length of the second elastic member 707, and increasing the negative pressure required in the inner cavity of the third sleeve 703;

[0054] In addition, before the adsorption mechanism 8 adsorbs the wafer, high-temperature gas is introduced into the inner cavity of the first sleeve 701. The high-temperature gas is sprayed onto the surface of the wafer through the guide mechanism 7, the inner cavity of the connecting sleeve 802 and the plug shaft 803 in turn, heating the wafer and reducing the viscosity of the colloid between the wafer and the substrate, thereby facilitating the subsequent separation of the wafer and the substrate.

[0055] See also Figures 1 to 4 As shown, the adsorption mechanism 8 includes an air suction sleeve 801, the top of the air suction sleeve 801 is fixedly mounted on the bottom end of the first elastic member 604, the third sleeve 703 is slidably sleeved on the middle part of the air suction sleeve 801, the upper part of the inner cavity of the air suction sleeve 801 is slidably sleeved with a connecting sleeve 802, the connecting sleeve 802 is fixedly sleeved on the bottom of the third sleeve 703, a plurality of groups of plug shafts 803 are fixedly sleeved at equal intervals on the bottom circumference of the connecting sleeve 802, a through hole is opened in the middle of the plug shaft 803, a plug sleeve 804 is fixedly sleeved on the bottom of the inner cavity of the air suction sleeve 801, the plug shaft 803 and the plug sleeve 804 are slidably sleeved, and a rubber pad 805 is fixedly mounted on the bottom surface of the plug sleeve 804;

[0056] The rubber pad 805 is made of rubber material to prevent the hard plug sleeve 804 from directly contacting the wafer and scratching the wafer surface. The plug sleeve 804 adopts an equilateral hexagonal design to ensure that the rubber pad 805 at the bottom of the plug sleeve is in uniform contact with the wafer to avoid uneven force.

[0057] During use, when the rubber pad 805 is attached to the surface of the wafer, the electromagnetic mechanism 9 drives the guide mechanism 7 to move upward, and the guide mechanism 7 drives the connecting sleeve 802 to move upward along the inner cavity of the suction sleeve 801, and the connecting sleeve 802 drives the plug shaft 803 to move upward. The space between the bottom end of the plug shaft 803 in the inner cavity of the plug sleeve 804 and the contact surface of the wafer increases, thereby reducing the air pressure between the inner cavity of the connecting sleeve 802 and the bottom of the piston 708 in the inner cavity of the guide mechanism 7, and the suction piston 708 pulls the second elastic member 707 to extend and move downward.

[0058] See also Figure 3As shown, the electromagnetic mechanism 9 includes a limiting ring 901, which is fixedly mounted on the top of the suction sleeve 801, a magnetic ring 902 is fixedly mounted on the bottom end of the sliding plate 601, and an electromagnet 903 is fixedly mounted on the top end of the suction sleeve 801;

[0059] Among them, the limit ring 901 is used to limit the upward movement distance of the suction sleeve 801, to prevent the connecting sleeve 802 from driving the suction sleeve 801 to move upward when the connecting sleeve 802 moves upward along the inner cavity of the suction sleeve 801. When in use, the magnetic ring 902 is energized, and the magnetic ring 902 pushes the electromagnet 903 to move upward, and the electromagnet 903 drives the guide mechanism 7 to move.

[0060] Working principle:

[0061] In the present invention, after the rubber pad 805 is in contact with the surface of the wafer, the electromagnetic mechanism 9 is then started in the positive direction. The electromagnetic mechanism 9 pushes the guide mechanism 7 to move upward, and the guide mechanism 7 drives the connecting sleeve 802 to move upward along the inner cavity of the suction sleeve 801. The connecting sleeve 802 drives the plug shaft 803 to move upward, and the space between the bottom end of the plug shaft 803 in the inner cavity of the plug sleeve 804 and the contact surface of the wafer increases, thereby causing the air pressure between the inner cavity of the connecting sleeve 802 and the bottom of the piston 708 in the inner cavity of the guide mechanism 7 to gradually decrease, and the suction piston 708 pulls the second elastic member 707 to extend and move downward. When the piston 708 moves downward, the top end of the piston 708 moves to below the top end of the annular groove 709. At this time, the air above the piston 708 flows to the bottom of the piston 708, and the air pressure between the inner cavity of the connecting sleeve 802 and the bottom end of the piston 708 in the inner cavity of the guide mechanism 7 recovers upward. At this time, the second elastic member 707 recovers upward, pulling the piston 708 to move upward, and the cycle continues.

[0062] The suction cup 805 is pressed against the top of the second sleeve 802 and the suction cup 806 is pulled upward to prevent the suction cup 801 from contacting the suction cup 801. At this time, the suction pressure between the wafer and the rubber pad 805 is approximately equal to the elastic force of the second elastic member 707. At the same time, the suction pressure between the wafer and the rubber pad 805 gradually increases as the second elastic member 707 is pulled up, thereby overcoming the problem of the wafer deformation caused by the sudden increase in suction pressure when the existing suction device adsorbs the wafer. In addition, by positively starting the second driving member 704, the distance when the top of the piston 708 moves below the top of the annular groove 709 is increased, and the pulling length of the second elastic member 707 is increased, thereby increasing the negative pressure required in the inner cavity of the third sleeve 703, thereby increasing the suction pressure between the wafer and the rubber pad 805, thereby achieving suction of wafers of different weights with different suction pressures, and avoiding wafer deformation due to adsorption;

[0063] In addition, when the wafer is adsorbed on the bottom surface of the rubber pad 805, the rotating shaft 5 is started in the positive direction. When the rotating shaft 5 drives the sliding plate 601 to move upward, the sliding plate 601 pulls the first elastic member 604 to extend, and the hydraulic fluid above the sliding plate 601 flows to the bottom of the sliding plate 601 through the first one-way valve 602. When the sliding plate 601 moving upward pulls the adsorption mechanism 8 upward through the first elastic member 604, and the adsorption mechanism 8 pulls the wafer and the substrate apart, the elastic force generated by the first elastic member 604 cannot squeeze the bottom of the sliding plate 601 through the adsorption mechanism 8 alone. The hydraulic liquid squeezes the second one-way valve 603 to open. At this time, the hydraulic liquid between the inner sliding plate 601 of the mounting shell 2 and the suction sleeve 801 limits the first elastic member 604 from pulling the suction sleeve 801 downward to move upward, so that when the wafer is separated from the substrate, the adsorption mechanism 8 pulls the wafer upward steadily at the speed of the upward movement of the rotating shaft 5, thereby avoiding that when the wafer is separated from the substrate, the first elastic member 604 suddenly pulls the wafer upward to move instantaneously, causing the wafer to vibrate violently and generate huge gravitational acceleration, causing stress concentration on the wafer, resulting in wafer breakage and bending.

[0064] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A wafer separation device for semiconductor processing, characterized in that: include: A sleeve block (1) and a mounting shell (2), wherein the mounting shell (2) is fixedly sleeved on the middle portion of the sleeve block (1); A mounting plate (3), the mounting plate (3) being fixedly sleeved on the upper portion of the inner cavity of the mounting shell (2), and air permeable blocks (301) being symmetrically fixedly sleeved on both sides of the left side of the mounting plate (3); A driving mechanism (4), the driving mechanism (4) being arranged on the upper surface of the mounting plate (3); A rotating shaft (5), the rotating shaft (5) is threadedly connected to the middle portion of the mounting plate (3), and the upper portion of the rotating shaft (5) is slidably sleeved with a gear sleeve (501); A pulling mechanism (6), the pulling mechanism (6) being arranged at the bottom of the rotating shaft (5) and the middle of the inner cavity of the mounting shell (2); A flow guiding mechanism (7), wherein the flow guiding mechanism (7) is arranged in the middle of the mounting plate (3); An adsorption mechanism (8), the adsorption mechanism (8) being arranged between the bottom of the mounting shell (2) and the bottom of the flow guide mechanism (7); An electromagnetic mechanism (9), the electromagnetic mechanism (9) being arranged in the middle between the pulling mechanism (6) and the adsorption mechanism (8); Hydraulic fluid, the hydraulic fluid being arranged between the bottom end of the inner cavity mounting plate (3) of the sleeve block (1) and the top end of the adsorption mechanism (8); The driving mechanism (4) comprises a first driving member (401), the first driving member (401) being fixedly mounted on the upper surface of the mounting plate (3), a gear (402) being fixedly mounted on the output end of the first driving member (401), the gear (402) being meshed with a gear sleeve (501), and limit blocks (403) being symmetrically fixedly mounted on the upper and lower sides of the gear (402), the gear sleeve (501) being located in the middle of the two limit blocks (403); The pulling mechanism (6) includes a sliding plate (601), the sliding plate (601) is movably sleeved on the bottom of the rotating shaft (5), the sliding plate (601) is slidably sleeved with the mounting shell (2), the left and right sides of the sliding plate (601) are symmetrically and fixedly sleeved with a first one-way valve (602), the front and rear sides of the sliding plate (601) are symmetrically and fixedly sleeved with a second one-way valve (603), the bottom end of the sliding plate (601) is fixedly mounted with a first elastic member (604), and the bottom end of the first elastic member (604) is fixedly connected to the adsorption mechanism (8); The flow guiding mechanism (7) comprises a first sleeve (701), a second sleeve (702) is fixedly mounted on the bottom end of the first sleeve (701), a third sleeve (703) is fixedly mounted on the bottom end of the second sleeve (702), the first sleeve (701), the second sleeve (702) and the third sleeve (703) are all slidably sleeved on the middle part of the rotating shaft (5), a second driving member (704) is fixedly mounted on the top end of the first sleeve (701), and a connecting rod (705) is fixedly mounted on the output end of the second driving member (704). ), the bottom end of the connecting rod (705) is slidably sleeved with a threaded block (706), the threaded block (706) is threadedly connected to the second sleeve (702), the bottom end of the threaded block (706) is fixedly installed with a second elastic member (707), the bottom end of the second elastic member (707) is fixedly installed with a piston (708), the piston (708) is slidably sleeved with the second sleeve (702), and an annular groove (709) is provided at the bottom of the inner cavity of the second sleeve (702), and the piston (708) is located above the annular groove (709).

2. The semiconductor processing wafer separation device according to claim 1, wherein: The adsorption mechanism (8) includes an air suction sleeve (801), the top end of the air suction sleeve (801) is fixedly mounted on the bottom end of the first elastic member (604), the third sleeve (703) is slidably sleeved on the middle part of the air suction sleeve (801), the upper part of the inner cavity of the air suction sleeve (801) is slidably sleeved with a connecting sleeve (802), the connecting sleeve (802) is fixedly sleeved on the bottom of the third sleeve (703), the bottom of the connecting sleeve (802) is equidistantly and fixedly sleeved with multiple groups of plug shafts (803), the middle part of the plug shaft (803) is provided with a through hole, the bottom of the inner cavity of the air suction sleeve (801) is fixedly sleeved with a plug sleeve (804), the plug shaft (803) and the plug sleeve (804) are slidably sleeved, and the bottom surface of the plug sleeve (804) is fixedly mounted with a rubber pad (805).

3. The semiconductor processing wafer separation device according to claim 2, wherein: The electromagnetic mechanism (9) comprises a limiting ring (901), the limiting ring (901) is fixedly mounted on the top end of the suction sleeve (801), a magnetic ring (902) is fixedly mounted on the bottom end of the sliding plate (601), and an electromagnet (903) is fixedly mounted on the top end of the suction sleeve (801).

4. The semiconductor processing wafer separation device according to claim 3, wherein: The air permeable block (301) is made of an air permeable but water-tight material, and the contact surfaces between the two limit blocks (403) and the gear sleeve (501) are smooth surfaces.

5. The semiconductor processing wafer separation device according to claim 4, characterized in that: The opening direction of the first one-way valve (602) is downward, the opening direction of the second one-way valve (603) is upward, and the resistance to opening the second one-way valve (603) is greater than the elastic force of the first elastic member (604).

6. The semiconductor processing wafer separation device according to claim 5, characterized in that: Ventilation holes are provided on the left and right sides of the upper surface of the threaded block (706), and the first sleeve (701), the second sleeve (702) and the third sleeve (703) are all made of heat-insulating material.

7. The semiconductor processing wafer separation device according to claim 6, characterized in that: The plug sleeve (804) is designed in an equilateral hexagonal shape, and the rubber pad (805) is made of rubber material.

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