A device carrier suitable for semiconductor processing and methods of using the same

Abstract

The application discloses a device carrying carrier suitable for semiconductor processing and a use method thereof, relates to the technical field of semiconductor processing equipment, and optimizes and improves the structure of a wafer adsorption device in the prior art, adds a contact pad assembly with a main body of a silica gel hose to the wafer adsorption device in the prior art, coats the adsorption pipe directly contacting the wafer by the contact pad assembly, and avoids the occurrence of air leakage by the way of cutting off the air flow channel. The device carrying carrier suitable for semiconductor processing has the technical effects that the device carrying carrier is suitable for different specifications of wafers, has relatively low manufacturing and maintenance costs, and has relatively high reliability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing equipment technology, and in particular to a device carrier suitable for semiconductor processing and its usage method. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Wafer carrier adsorption devices are used when processing wafers.

[0003] Chinese invention patent CN117832150B discloses a wafer adsorption device and a wafer processing machine. Through the cooperation of multiple structures, the wafer adsorption device can be applied to the adsorption of wafers of different models, improving the applicability of the wafer adsorption device. It can also reinforce wafers with sunken edges, making the wafer adsorption device more effective in adsorbing and fixing wafers.

[0004] While the above-disclosed invention increases the applicability of the wafer adsorption device to wafers of different specifications to a certain extent and can improve the wafer bearing capacity through the reinforcement mechanism, it is limited by its own structure. During processing and manufacturing, it is necessary to strictly control the processing accuracy of the limiting gas supply pipe, the first adjustable gas supply pipe, and the second adjustable gas supply pipe, as well as the installation accuracy between the three, and to maintain them frequently to ensure that there is little or no gas leakage between the three (gas leakage will affect the adsorption effect) and thus ensure the stability when adsorbing and bearing wafers. The entire device has high manufacturing and maintenance costs and poor reliability during long-term operation.

[0005] Therefore, there is a need for a device carrier suitable for semiconductor processing that is highly adaptable to wafers of different specifications, has relatively low manufacturing and maintenance costs, and relatively high reliability. Summary of the Invention

[0006] This application provides a device carrier suitable for semiconductor processing, which solves the technical problems of high manufacturing and maintenance costs and poor reliability of the carrier adsorption device in the wafer processing process in the prior art; it achieves the technical effect of strong applicability to wafers of different specifications, relatively low manufacturing and maintenance costs, and relatively high reliability of the device carrier suitable for semiconductor processing.

[0007] This application provides a device carrier suitable for semiconductor processing, including a top connector (which is a rigid plate or block), a base barrel, an internal base tube, an abutment extrusion tube, a tube displacement drive assembly, and a contact pad assembly.

[0008] The base barrel is a rigid cylindrical barrel with its opening facing downwards. Its top is positioned at the bottom of the top connector, and an air extraction component that communicates with the internal space of the built-in base tube is positioned on it.

[0009] The built-in foundation tube is a rigid round tube, with its top fixed to the inner top of the foundation bucket and coaxial with the foundation bucket;

[0010] The contact extrusion tube is a rigid round tube, which is sleeved on the built-in base tube and slides along the axial direction of the built-in base tube under the drive of the tube displacement drive component. The number is 1 to 3, which are sleeved together with each other. The bottom opening diameter of the contact extrusion tube located on the outside is larger.

[0011] The contact pad assembly includes a first carrier ring positioned on the inner wall of the built-in base tube, a second carrier ring positioned on the inner wall of the base barrel, and a contact hose; the contact hose is an elastic silicone hose, with both ends tightly attached to and fixed to the first and second carrier rings respectively, and always in a taut state.

[0012] Furthermore, the length of the built-in base tube is 1.1 to 1.4 times the length of the base barrel, and the diameter is 0.3 to 0.5 times the diameter of the base barrel.

[0013] Furthermore, the tube displacement drive assembly includes a top elastic body, a sliding pin, and a built-in guide rail;

[0014] The top elastic body is an elastic rubber strip or a tension spring, arranged longitudinally, with the top fixed to the inner top of the base bucket and the bottom fixed to the top of the contact extrusion tube;

[0015] The built-in guide rail is a longitudinally arranged straight guide rail, positioned on the inner wall of the base bucket;

[0016] The sliding pin is slidably positioned on the built-in guide rail and slides under the coordinated control of the power component and the control unit;

[0017] The side wall of the abutting extrusion tube is provided with a side hole that matches the sliding pin;

[0018] The sliding pin is an electric pin that inserts into the side hole when extended;

[0019] When it is necessary to control the downward movement of the pressing tube, first control the sliding pin to slide and extend into the side hole of the pressing tube that you want to move, and then use the sliding of the sliding pin to move the pressing tube.

[0020] Preferably, it also includes reinforcement components;

[0021] The reinforcement assembly includes three reinforcement frames; the three reinforcement frames have the same structure and are evenly distributed around the perimeter of the base bucket. The three work together to ensure the stability of the lifted wafer.

[0022] The reinforcement frame includes a sliding support frame, a bottom sliding rod, and an end positioning body;

[0023] The sliding support carrier is a hard U-shaped frame body, which is positioned on the outer sidewall of the base barrel along the axial direction of the base barrel and slides up and down under the cooperative control of the power assembly and the control unit; the bottom sliding rod is a hard straight rod arranged transversely, the length direction of the bottom sliding rod is the same as the radial direction of the base barrel, and the bottom sliding rod is positioned at the bottom of the sliding support carrier along the radial direction of the base barrel under the cooperative control of the power assembly and the control unit; the end positioning body is positioned at the end of the bottom sliding rod close to the base barrel and is used for pressing or supporting the wafer adsorbed.

[0024] Further, the end positioning body comprises a V-shaped frame, a winding wheel and a contact belt; the V-shaped frame is a v-shaped hard frame body arranged transversely, fixed at the end of the bottom sliding rod and with an opening facing the axis of the base barrel; the winding wheel is two in number, each of which is internally provided with a micro motor and is used for winding and releasing the contact belt respectively, and each of which is positioned at the end of the V-shaped frame close to the axis of the base barrel; the contact belt is a belt body made of elastic silica gel, the two ends of which are wound and positioned on the two winding wheels respectively and are always in a straightened state; the winding wheel rotates under the control of the control unit and automatically completes the replacement of the contact belt contacting the wafer; after the wafer is adsorbed, the reinforcing assembly operates, adjusts the spatial position thereof and clamps the wafer by using the contact belt.

[0025] Further, the contact pad assembly further comprises an internally provided telescopic body and a vertically arranged elastic body;

[0026] The first carrier ring and the second carrier ring are respectively positioned on the inner wall of the internally provided base pipe and the inner wall of the base barrel and slide along the axial direction of the base barrel;

[0027] The internally provided telescopic body is a telescopic rod controlled to be telescoped under the control of the control unit, is longitudinally arranged inside the internally provided base pipe, is directly or indirectly fixed at the top to the inner wall of the internally provided base pipe and is fixed at the bottom to the first carrier ring;

[0028] The vertically arranged elastic body is a spring or a tension spring, which is longitudinally arranged, one end of which is positioned at the inner top of the base barrel and the other end of which is fixed at the top of the second carrier ring;

[0029] An annular groove is arranged on the outer sidewall of the second carrier ring, and a ring-shaped capsule is sleeved on the annular groove; the ring-shaped capsule is an annular capsule body made of elastic rubber, is in communication with the air pump and is inflated and deflated under the control of the control unit to timely close the gap between the second carrier ring and the base barrel; the air pump is positioned on the base barrel.

[0030] Preferably, the end positioning body comprises a V-shaped frame, a winding wheel and a contact belt;

[0031] The V-shaped frame is a v-shaped hard frame body arranged transversely, fixed at the end of the bottom sliding rod and with an opening facing the axis of the base barrel;

[0032] The number of the winding wheels is two, which are respectively used for winding and releasing the contact belt and are respectively positioned at two ends of the V-shaped frame close to the axis of the base barrel;

[0033] The upper winding wheel is internally provided with a rotation limiting component controlled by the control unit;

[0034] The rotation limiting component is an electric pin; the lower winding wheel is internally provided with a torsion spring;

[0035] The contact belt is an elastic silica gel belt, the two ends of which are respectively wound and positioned on the two winding wheels; the existence of the torsion spring makes the lower winding wheel always have a tendency to wind the contact belt, so that the contact belt is always in a straightened state.

[0036] Preferably, it further comprises a cleaning component;

[0037] The cleaning component comprises a support arm, a rotating carrier, an end plate and a cleaning part;

[0038] The support arm is an L-shaped rod, which plays a role of bearing support, the horizontal rod is located at the top, and the vertical rod is located at the bottom; the horizontal rod and the vertical rod are both telescopic rods controlled by the control unit to be telescopic;

[0039] The rotating carrier is a hard straight rod, one end of which is hinged to the bottom end of the support arm, and rotates relative to the support arm under the cooperative control of the power component and the control unit; the axis of the rotating shaft is perpendicular to the axis of the base barrel; after the rotating carrier rotates, the end thereof away from the support arm will rotate to the bottom of the base barrel;

[0040] The end plate is fixed to the end of the rotating carrier away from the support arm;

[0041] The cleaning part is positioned on the surface of the end plate away from the rotating carrier, and cleans the contact hose by means of brushing, flushing and / or sticking;

[0042] The base barrel is connected to the bottom of the top connecting body by rotating around its own axis, the axis of the rotating shaft coincides with the axis of the base barrel, and rotates under the cooperative control of the power component and the control unit.

[0043] Preferably, the cleaning part comprises a top soft wheel, a first rotating wheel, a second rotating wheel and a cleaning belt;

[0044] The top soft wheel, the first rotating wheel and the second rotating wheel are all cylindrical wheels, the ends of which are positioned on the surface of the end plate away from the rotating carrier, and the axial directions of which are the same as the length direction of the rotating carrier; the top soft wheel is a rubber cylindrical wheel, and when the rotating carrier is horizontally placed at the bottom of the base barrel, the top soft wheel is located above the first rotating wheel and the second rotating wheel; the first rotating wheel and the second rotating wheel are both cylindrical wheels internally provided with micro motors;

[0045] The cleaning belt is a belt with adhesive on one side, with both ends wrapped around and positioned on the first and second rotating wheels respectively, and is always taut and in contact with the top soft wheel;

[0046] When the rotating support rod is placed horizontally at the bottom of the base barrel, the end plate on it is set vertically; when the rotating support rod is placed horizontally at the bottom of the base barrel, the adhesive side of the cleaning belt wound around the first and second rotating wheels faces upward and the whole is in an inverted U shape.

[0047] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0048] By optimizing and improving the structure of existing wafer adsorption devices, a contact pad assembly with a silicone tube as the main body is added to the existing wafer adsorption device. The contact pad assembly covers the adsorption tube that is in direct contact with the wafer, and air leakage is avoided by isolating the airflow channel. This effectively solves the technical problems of high manufacturing and maintenance costs and poor reliability of existing wafer adsorption devices in wafer processing. As a result, a device carrier suitable for semiconductor processing is achieved that is highly applicable to wafers of different specifications, has relatively low manufacturing and maintenance costs, and relatively high reliability. Attached Figure Description

[0049] Figure 1 This is a simplified diagram of the internal structure of the device carrier applicable to semiconductor processing in this application;

[0050] Figure 2 This is a schematic diagram of the external structure of the device carrier applicable to semiconductor processing in this application;

[0051] Figure 3 A schematic diagram of the external structure of the basic rotating cylinder;

[0052] Figure 4 A schematic diagram of the external structure of the contact pad replacement assembly;

[0053] Figure 5 Simplified structural diagram of the contact pad replacement assembly;

[0054] Figure 6 A schematic diagram showing the positional relationship between the extruded tube and the built-in base tube;

[0055] Figure 7 This is a schematic diagram showing the positional relationship between the bottom sliding rod and the end wheel;

[0056] Figure 8 This is a schematic diagram showing the positional relationship between the V-shaped frame and the bottom sliding rod;

[0057] Figure 9 This is a schematic diagram showing the positional relationship between the end locator and the wafer.

[0058] Figure 10 Structure diagram of the end positioning body containing the winding wheel;

[0059] Figure 11 Structure diagram of the cleaning assembly;

[0060] Figure 12 Structure diagram of the cleaning assembly.

[0061] In the figure:

[0062] The top connecting body 100, the air extraction assembly 101, the sliding support carrier 210, the bottom sliding rod 220, the end wheel 221, the V-shaped frame 222, the abutting belt 223, the winding wheel 224, the base barrel 300, the built-in base pipe 400, the bottom ring 401, the abutting extrusion pipe 500, the side hole 501, the top elastic body 510, the sliding pin 520, the built-in guide rail 530, the built-in telescopic body 610, the first carrier ring 620, the second carrier ring 630, the annular capsule 631, the air pump 632, the contact hose 640, the vertically arranged elastic body 650, the support arm 710, the rotating carrier 720, the end plate 730, the top soft wheel 740, the first rotating wheel 750, the second rotating wheel 760, the cleaning belt 770. DETAILED DESCRIPTION

[0063] In order to facilitate the understanding of the present application, the present application will be described in more detail below with reference to the relevant drawings; the preferred embodiments of the present application are shown in the drawings, but the present application can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0064] It should be noted that the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only embodiment.

[0065] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs; the terms used herein in the specification of the present application are only for the purpose of describing the specific embodiments and are not intended to limit the present application; the term "and / or" used herein includes any and all combinations of one or more related listed items.

[0066] Example one

[0067] As Figures 1 to 6 shown, the present application is applicable to a device carrying carrier for semiconductor processing, which includes a top connecting body 100, a base barrel 300, a reinforcing assembly, a built-in base pipe 400, an abutting extrusion pipe 500, a pipe displacement driving assembly, a contact pad assembly, a power assembly and a control unit.

[0068] The top connector 100 is a hard plate or a hard block, which is fixed at the end of the multi-degree-of-freedom mechanical arm and serves as a load-bearing connection; the multi-degree-of-freedom mechanical arm is used to carry and move the device carrier of the application to assist in the wafer suction, movement and placement.

[0069] The base barrel 300 is an open downward hard barrel, which is positioned at the bottom of the top connector 100 and serves as a load-bearing support.

[0070] The base barrel 300 is fixed with an air extraction assembly 101; the main structure of the air extraction assembly 101 is a pump, which is in communication with the space in the built-in base pipe 400 through a pipeline, and creates a negative pressure space in the built-in base pipe 400 by air extraction;

[0071] The reinforcement assembly is positioned on the outer sidewall of the base barrel 300, and the main body is a clip structure, which is used to clamp and / or support the wafer being sucked up to avoid damage caused by falling.

[0072] The built-in base pipe 400 is a hard circular pipe, which is longitudinally arranged, fixed at the inner top of the base barrel 300 and coaxial with the base barrel 300; the length of the built-in base pipe 400 is 1.1 to 1.4 times the length of the base barrel 300, and the diameter of the built-in base pipe 400 is 0.3 to 0.5 times the diameter of the base barrel 300;

[0073] The abutting extrusion pipe 500 is a longitudinally arranged hard circular pipe, which is sleeved on the built-in base pipe 400 and slides along the axial direction of the built-in base pipe 400 under the driving of the pipe displacement driving assembly, and the length of the abutting extrusion pipe 500 is 0.4 to 0.6 times the length of the built-in base pipe 400; the number of the abutting extrusion pipes 500 is 1 to 3, which are sleeved together, and the bottom opening diameter of the abutting extrusion pipe 500 located on the outside is larger than the bottom opening diameter of the abutting extrusion pipe 500 sleeved by it.

[0074] Further, as shown in Figure 5 and Figure 6 The abutting extrusion pipe 500 is composed of a base section, a connecting section and a bottom section; the base section, the connecting section and the bottom section are fixed together, the base section is located at the top, and the bottom section is located at the bottom; the base section and the bottom section are both circular pipes; the connecting section serves as a connection and is a ring-shaped sheet, and the inner ring and the outer ring are fixed at the bottom of the base section and the top of the bottom section, respectively; the inner wall of the base section is tightly attached to the outer wall of the built-in base pipe 400 or the outer wall of the other abutting extrusion pipe 500 located on the inner side.

[0075] The contact pad assembly comprises a first carrier ring 620, a second carrier ring 630 and a contact hose 640; the first carrier ring 620 and the second carrier ring 630 are both hard ring bodies, which are transversely arranged and closely positioned on the inner walls of the built-in base pipe 400 and the inner walls of the base barrel 300 respectively, and are used for carrying the contact hose 640; the contact hose 640 is a silica gel elastic hose, the two ends of which are closely fixed on the first carrier ring 620 and the second carrier ring 630 respectively, and are always in a straightened state.

[0076] Further, the first carrier ring 620 and the second carrier ring 630 are closely fixed on the inner walls of the built-in base pipe 400 and the inner walls of the base barrel 300 respectively.

[0077] Preferably, in order to reduce the abrasion of the contact hose 640 and ensure the smooth operation of the carrier, the bottom edges of the built-in base pipe 400 that abut against the extrusion pipes 500 are all rounded.

[0078] Further, the bottoms of the built-in base pipe 400 that abut against the extrusion pipes 500 are all fixed with bottom rings 401 with smooth surfaces; the bottom rings 401 are annular, and are made of metal, plastic or rubber.

[0079] The power assembly is used for providing power for the operation of each component of the device carrying carrier suitable for semiconductor processing, and is a motor, an extension rod or the like; the control unit is used for controlling the coordinated operation of each component of the device carrying carrier suitable for semiconductor processing, and is a prior art, which will not be described here.

[0080] Preferably, the control unit is a combination of a programmable logic controller and a control button.

[0081] When the wafer needs to be adsorbed, the pipe displacement driving assembly is controlled to drive the abutment extrusion pipes 500 to move upward or downward, so that the bottom of the built-in base pipe 400 is lower than all the abutment extrusion pipes 500 or the bottom of a certain abutment extrusion pipe 500 is lower than the built-in base pipe 400 and the other abutment extrusion pipes 500; then the device carrying carrier is controlled to move to the top of the wafer and close to the wafer, and then the wafer is adsorbed and positioned; finally, the multi-degree-of-freedom mechanical arm is used to drive the whole carrier to move, so as to realize the transfer of the wafer.

[0082] Preferably, the pipe displacement driving assembly is a combination of multiple extension rods, which is longitudinally arranged, positioned at the inner top of the base barrel 300 at the top and positioned on the abutment extrusion pipes 500 at the bottom, and is a telescopic pneumatic cylinder, a telescopic oil cylinder or an electric telescopic rod, which is controlled by the control unit to drive the abutment extrusion pipes 500 to independently ascend and descend.

[0083] Preferably, as shown in Figures 4 to 6As shown, the pipe displacement driving assembly comprises a top elastic body 510, a sliding pin 520 and an internal guide rail 530; the top elastic body 510 is a rubber strip or a tension spring, longitudinally arranged, fixed at the inner top of the base barrel 300 at the top and fixed at the top of the contact extrusion pipe 500 at the bottom; the internal guide rail 530 is a straight guide rail arranged longitudinally, positioned on the inner wall of the base barrel 300, used for guiding the movement of the sliding pin 520; the sliding pin 520 is slidingly positioned on the internal guide rail 530 and slides under the coordinated control of the power assembly and the control unit; the side wall of the contact extrusion pipe 500 is provided with a side hole 501 matched with the sliding pin 520; the sliding pin 520 is an electric pin, which is inserted into the side hole 501 when elongated; when the contact extrusion pipe 500 needs to be controlled to move downward, the sliding pin 520 is first controlled to slide and elongate to be inserted into the side hole 501 of the contact extrusion pipe 500 to be driven, and then the sliding pin 520 is used to drive the contact extrusion pipe 500 to move.

[0084] Further, as shown in Figure 1 and Figure 2 , the reinforcing assembly comprises three reinforcing frames; the three reinforcing frames are structurally identical and are evenly distributed around the circumference of the base barrel 300, and the three reinforcing frames work together to ensure the stability of the wafer being sucked up; the reinforcing frame comprises a sliding support carrier 210, a bottom sliding rod 220 and an end positioning body; the sliding support carrier 210 is a hard bracket body in the shape of a Chinese character "fang", slidingly positioned on the outer side wall of the base barrel 300 along the axial direction of the base barrel 300, and sliding up and down under the coordinated control of the power assembly and the control unit; the bottom sliding rod 220 is a hard straight rod arranged transversely, with its length direction being the same as the radial direction of the base barrel 300, slidingly positioned at the bottom of the sliding support carrier 210 along the radial direction of the base barrel 300 under the coordinated control of the power assembly and the control unit; the end positioning body is positioned at the end of the bottom sliding rod 220 close to the base barrel 300, used for extruding or supporting the wafer being adsorbed.

[0085] Preferably, as shown in Figure 7 , the end positioning body is an end wheel 221; the end wheel 221 is a wheel body made of rubber, arranged transversely, with its axial direction being the same as the radial direction of the base barrel 300, positioned at the top or end of the bottom sliding rod 220, with its top being higher than the top of the bottom sliding rod 220; after the wafer is adsorbed, the reinforcing assembly operates, and after adjusting its spatial position, the bottom sliding rod 220 is inserted into the bottom of the wafer.

[0086] Preferably, the end positioning body comprises a V-shaped frame 222 and a contact belt 223; the V-shaped frame 222 is a v-shaped hard frame body, horizontally arranged, fixed at the end of the bottom sliding rod 220 and opening towards the axis of the base barrel 300; the contact belt 223 is an elastic silica gel material belt, longitudinally arranged, with two ends positioned at the two ends of the V-shaped frame 222 close to the axis of the base barrel 300 respectively, always in a straightened state; after the wafer is adsorbed, the reinforcing assembly operates, adjusts its spatial position, and then uses the contact belt 223 to stably clamp the wafer.

[0087] Preferably, as shown in Figure 8 and Figure 9 In order to ensure the stability of the contact belt 223 clamping the wafer and reduce the replacement frequency of the contact belt 223, the end positioning body comprises a V-shaped frame 222, a winding wheel 224 and a contact belt 223; the V-shaped frame 222 is a v-shaped hard frame body, horizontally arranged, fixed at the end of the bottom sliding rod 220 and opening towards the axis of the base barrel 300; the winding wheel 224 is two in number, both with a built-in micro motor, used for winding and releasing the contact belt 223 respectively, positioned at the two ends of the V-shaped frame 222 close to the axis of the base barrel 300 respectively; the contact belt 223 is an elastic silica gel material belt, with two ends wound and positioned on the two winding wheels 224 respectively, always in a straightened state; the winding wheel 224 rotates under the control of the control unit, thereby automatically completing the replacement of the contact belt 223 contacting the wafer; after the wafer is adsorbed, the reinforcing assembly operates, adjusts its spatial position, and then uses the contact belt 223 to clamp the wafer.

[0088] The technical solutions in the embodiments of the present application have at least the following technical effects or advantages:

[0089] The technical problems of high manufacturing and maintenance cost and poor reliability of the wafer processing process in the prior art are solved; the technical effect of strong applicability, relatively low manufacturing and maintenance cost and relatively high reliability of the device carrying body for semiconductor processing for different specifications of wafers is achieved.

[0090] Embodiment two

[0091] In view of the fact that the contact hose 640 will be locally damaged due to dirt and wear after long-term use, thereby affecting the stability of adsorption (the first elastic adsorption pipe, the second elastic adsorption pipe and the third second elastic adsorption pipe of the wafer adsorption device and the wafer processing machine disclosed in the authorized announcement No. CN117832150B will also encounter the same problem), relatively frequent regular maintenance and replacement are required. In view of the above problems, the structure of the contact pad assembly is optimized and improved on the basis of the above embodiment, the spatial position of the contact hose 640 is changed in a timely manner by moving the contact hose 640, thereby prolonging the service life of the contact hose 640 and effectively reducing the maintenance frequency; specifically:

[0092] As shown in Figures 4 to 6 , the contact pad assembly comprises a first carrier ring 620, a second carrier ring 630 and a contact hose 640, and further comprises an internal telescopic body 610 and a vertical elastic body 650;

[0093] The first carrier ring 620 and the second carrier ring 630 are both hard ring bodies, which are transversely arranged and respectively tightly and slidably positioned on the inner wall of the internal base pipe 400 and the inner wall of the base barrel 300, and slide along the axial direction of the base barrel 300; the contact hose 640 is an elastic hose made of silica gel, the two ends of which are respectively tightly and fixedly arranged on the first carrier ring 620 and the second carrier ring 630, and are always in a straightened state;

[0094] The internal telescopic body 610 is a telescopic rod controlled by a control unit to extend and retract, which is located inside the internal base pipe 400 and is a pneumatic cylinder, an oil cylinder or an electric telescopic rod, and is vertically arranged, with the top directly or indirectly fixed on the inner wall of the internal base pipe 400 and the bottom fixed on the first carrier ring 620;

[0095] The vertical elastic body 650 is a spring cord or a tension spring, which is vertically arranged, with one end positioned at the inner top of the base barrel 300 and the other end fixed on the top of the second carrier ring 630;

[0096] An annular groove is arranged on the outer side wall of the second carrier ring 630, and a ring-shaped capsule 631 is sleeved on the annular groove; the ring-shaped capsule 631 is an annular capsule body made of elastic rubber, which is in communication with a gas pump 632 and is controlled to expand and contract under the control of the control unit, so as to timely close the gap between the second carrier ring 630 and the base barrel 300; the gas pump 632 is positioned on the base barrel 300 and is controlled to operate by the control unit;

[0097] After the device carrier is used for a period of time, the internal telescopic body 610 is controlled to extend or shorten, so as to change the spatial position of the contact hose 640 and the position of the contact hose 640 contacting the bottom of the internal base pipe 400 and the bottom of the contact extrusion pipe 500.

[0098] Preferably, in order to reduce costs and weight, such as Figure 10 As shown, the end positioning body includes a V-shaped frame 222, a winding wheel 224, and an abutment tape 223; the winding wheel 224 does not require a built-in motor; the V-shaped frame 222 is a V-shaped rigid frame, horizontally arranged, fixed to the end of the bottom sliding rod 220, and its opening faces the axis of the base bucket 300; there are two winding wheels 224, used for winding and releasing the abutment tape 223 respectively, and positioned at the two ends of the V-shaped frame 222 near the axis of the base bucket 300; the upper winding wheel 224 has a built-in rotation limiting component controlled by the control unit; the rotation limiting component is an electric pin; the lower winding wheel 224 has a built-in torsion spring; the abutment tape 223 is an elastic silicone tape, with both ends wound around it. Positioned on the two take-up rollers 224, the presence of torsion springs ensures that the lower take-up roller 224 always tends to take up the contact strip 223, thus keeping the contact strip 223 taut. When it is necessary to replace the contact strip 223 that contacts the wafer, firstly, the reinforcement component is controlled to operate, so that the upper take-up roller 224 contacts the contact hose 640; then, the rotation limiting component is controlled to remove the restriction on the rotation of the upper take-up roller 224; then, the built-in telescopic body 610 is controlled to extend or retract, driving the contact hose 640 to move and thus driving the upper take-up roller 224 to rotate, thereby completing the replacement of the contact strip 223 that contacts the wafer; finally, the rotation limiting component is controlled to operate again to restrict the rotation of the upper take-up roller 224.

[0099] Example 3

[0100] To further extend the service life of the contact hose 640, reduce its maintenance frequency, and maintain the adsorption effect (adsorption stability, etc.) of the device carrier on the wafer for a long time, this embodiment adds a cleaning component based on the above embodiment; the cleaning component is used to frequently clean the contact hose 640; specifically:

[0101] like Figure 2 and Figure 12 As shown, the cleaning assembly includes a support arm 710, a rotating rod 720, an end plate 730, and cleaning components;

[0102] The support arm 710 is an L-shaped rod that serves as a load-bearing support. Its horizontal bar is located at the top and its vertical bar is located at the bottom. Both the horizontal bar and the vertical bar are telescopic rods that are controlled by the control unit to extend and retract. The length direction of the vertical bar is the same as the axial direction of the base bucket 300. The end of the horizontal bar of the support arm 710 away from the vertical bar is fixed to the side wall of the top connector 100.

[0103] The rotating load rod 720 is a hard straight rod, one end of which is hinged to the bottom end of the support arm 710, and rotates relative to the support arm 710 under the cooperative control of the power assembly and the control unit, the axis of the rotating shaft is perpendicular to the axis of the base barrel 300; after the rotating load rod 720 rotates, the end thereof away from the support arm 710 will rotate to the bottom of the base barrel 300;

[0104] The end plate 730 is fixed to the end of the rotating load rod 720 away from the support arm 710, is a hard plate body, and plays a role of bearing support;

[0105] The cleaning component is positioned on the surface of the end plate 730 away from the rotating load rod 720, and includes a fine brush, a gas nozzle and / or a water nozzle; the gas nozzle and the water nozzle are respectively in communication with a gas pump and a water pump;

[0106] The base barrel 300 is rotatably connected to the bottom of the top connecting body 100 around the axis thereof, the axis of the rotating shaft coincides with the axis thereof, and rotates under the cooperative control of the power assembly and the control unit;

[0107] When cleaning is needed, first, the end plate 730 is controlled to approach and contact the contact hose 640, and then the built-in telescopic body 610 is controlled to be telescoped while the base barrel 300 is controlled to rotate, so that the contact hose 640 is cleaned by the fine brush, the gas nozzle and / or the water nozzle.

[0108] Embodiment Four

[0109] In order to further prolong the service life of the contact hose 640, reduce the maintenance frequency, and long-term maintain the adsorption effect (stability of adsorption, etc.) of the device carrier on the wafer, the cleaning assembly is additionally provided in the embodiment based on the above-mentioned embodiments; the contact hose 640 is frequently cleaned by the cleaning assembly; specifically:

[0110] As shown in Figure 11 The cleaning assembly includes the support arm 710, the rotating load rod 720, the end plate 730 and the cleaning component; the cleaning component includes the top soft wheel 740, the first rotating wheel 750, the second rotating wheel 760 and the cleaning belt 770;

[0111] The support arm 710 is an L-shaped rod body, plays a role of bearing support, the horizontal rod thereof is located at the top, and the vertical rod thereof is located at the bottom; the horizontal rod and the vertical rod are both telescopic rods controlled to be telescoped by the control unit; the length direction of the vertical rod is the same as the axis of the base barrel 300; the end of the horizontal rod of the support arm 710 away from the vertical rod is fixed to the side wall of the top connecting body 100;

[0112] The rotating load rod 720 is a hard straight rod, one end of which is hinged to the bottom end of the support arm 710, and rotates relative to the support arm 710 under the coordinated control of the power assembly and the control unit, the axis of the rotating shaft being perpendicular to the axis of the base barrel 300; after the rotating load rod 720 rotates, the end thereof away from the support arm 710 rotates to the bottom of the base barrel 300;

[0113] The end plate 730 is fixed to the end of the rotating load rod 720 away from the support arm 710, is a hard plate body, and plays a role of bearing support;

[0114] The base barrel 300 is connected to the bottom of the top connecting body 100 and rotates around its own axis, the axis of the rotating shaft coinciding with the axis of the base barrel 300, and rotates under the coordinated control of the power assembly and the control unit;

[0115] When the rotating load rod 720 is transversely placed at the bottom of the base barrel 300, the end plate 730 thereon is vertically arranged;

[0116] The top soft wheel 740, the first rotating wheel 750 and the second rotating wheel 760 are all cylindrical wheel bodies, the ends of which are positioned on the surface of the end plate 730 away from the rotating load rod 720, and the axial directions of which are the same as the length direction of the rotating load rod 720; the top soft wheel 740 is a cylindrical wheel of rubber material, and is located above the first rotating wheel 750 and the second rotating wheel 760 when the rotating load rod 720 is transversely placed at the bottom of the base barrel 300; the top soft wheel 740 plays a role of guiding the moving direction of the cleaning belt 770; the first rotating wheel 750 and the second rotating wheel 760 are both cylindrical wheel bodies with built-in micro motors, and rotate under the control of the control unit;

[0117] The cleaning belt 770 is a belt body with a layer of adhesive on one surface, and is wound and positioned on the first rotating wheel 750 and the second rotating wheel 760 at two ends, and is always in a straightened state and in contact with the top soft wheel 740;

[0118] When the rotating load rod 720 is transversely placed at the bottom of the base barrel 300, the adhesive surface of the cleaning belt 770 wound on the first rotating wheel 750 and the second rotating wheel 760 faces upward and the entire cleaning belt 770 is in an inverted U shape;

[0119] When cleaning is needed, first, the top soft wheel 740 is controlled to contact the part of the contact hose 640 protruding downward through the cleaning belt 770, and then the base barrel 300 is controlled to rotate, and the first rotating wheel 750 and the second rotating wheel 760 are controlled to rotate synchronously, so as to remove the dirt on the contact hose 640 (after one cleaning, the built-in telescopic body 610 can be controlled to retract, so as to clean other parts of the contact hose 640).

[0120] The above merely describes the preferred embodiments of the present application and is not used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A device carrying carrier suitable for use in semiconductor processing, characterized by: It comprises a top connecting body (100) of a hard plate or block, a base barrel (300), an embedded base pipe (400), a resistance extrusion pipe (500), a pipe displacement driving assembly, and a contact pad assembly. The base barrel (300) is a hard downwardly open barrel, and the top thereof is positioned at the bottom of the top connecting body (100), and an air extraction assembly (101) is positioned on the top and communicates with the space in the embedded base pipe (400). The embedded base pipe (400) is a hard pipe, and the top thereof is fixed to the inner top of the base barrel (300) and coaxial with the base barrel (300). The resistance extrusion pipe (500) is a hard pipe, and is sleeved on the embedded base pipe (400) and slides along the axis of the embedded base pipe (400) under the driving of the pipe displacement driving assembly. The number of the resistance extrusion pipes (500) is 1-3, and they are sleeved together. The bottom of the outer resistance extrusion pipe (500) has a larger opening diameter. The contact pad assembly comprises a first load ring (620) positioned on the inner wall of the embedded base pipe (400), a second load ring (630) positioned on the inner wall of the base barrel (300), and a contact hose (640). The contact hose (640) is a flexible hose made of silica gel, and the two ends thereof are tightly fixed on the first load ring (620) and the second load ring (630) respectively, and is always in a straightened state.

2. A device-bearing carrier suitable for use in semiconductor processing as recited in claim 1, wherein: The length of the embedded base pipe (400) is 1.1-1.4 times the length of the base barrel (300), and the diameter thereof is 0.3-0.5 times the diameter of the base barrel (300).

3. A device-bearing carrier suitable for use in semiconductor processing as recited in claim 1, wherein: The pipe displacement driving assembly comprises a top elastic body (510), a sliding pin (520), and an embedded guide rail (530). The top elastic body (510) is a longitudinal elastic rubber strip or a tension spring, and the top and bottom thereof are fixed to the inner top of the base barrel (300) and the top of the resistance extrusion pipe (500) respectively. The embedded guide rail (530) is a longitudinal straight guide rail, and is positioned on the inner wall of the base barrel (300). The sliding pin (520) is slidingly positioned on the embedded guide rail (530) and slides under the cooperative control of a power assembly and a control unit. The side wall of the resistance extrusion pipe (500) is provided with a side hole (501) matched with the sliding pin (520). The sliding pin (520) is an electric pin, and is inserted into the side hole (501) when elongated. When the resistance extrusion pipe (500) needs to be controlled to move downward, the sliding pin (520) is first controlled to slide and elongate and is inserted into the side hole (501) of the resistance extrusion pipe (500) to be driven, and then the sliding pin (520) is used to drive the resistance extrusion pipe (500) to move.

4. The device-bearing carrier adapted for use in semiconductor processing of claim 1, wherein: It further comprises a reinforcing assembly. The reinforcing assembly comprises three reinforcing frames which are uniformly distributed around the base barrel (300) and cooperatively work to ensure the stability of the wafer being sucked. The reinforcing frame comprises a sliding support carrier (210), a bottom sliding rod (220), and an end positioning body. The sliding support carrier (210) is a hard U-shaped frame body, which is positioned on the outer sidewall of the base barrel (300) along the axial direction of the base barrel (300) and slides up and down under the cooperative control of the power assembly and the control unit; the bottom sliding rod (220) is a hard straight rod arranged transversely, the length direction of the bottom sliding rod (220) is the same as the radial direction of the base barrel (300), and the bottom sliding rod (220) is positioned on the bottom of the sliding support carrier (210) along the radial direction of the base barrel (300) under the cooperative control of the power assembly and the control unit; the end positioning body is positioned at the end of the bottom sliding rod (220) close to the base barrel (300) and is used for pressing or supporting the wafer adsorbed.

5. A device-bearing carrier suitable for use in semiconductor processing as recited in claim 4, wherein: The end positioning body comprises a V-shaped frame (222), a winding wheel (224) and a contact belt (223); the V-shaped frame (222) is a hard v-shaped frame body arranged transversely, is fixed at the end of the bottom sliding rod (220) and has an opening facing the axis of the base barrel (300); the winding wheel (224) is provided with two built-in micro motors and is used for winding and releasing the contact belt (223) respectively, and is positioned at the two ends of the V-shaped frame (222) close to the axis of the base barrel (300); the contact belt (223) is an elastic silica gel belt body, the two ends of the contact belt (223) are wound and positioned on the two winding wheels (224) respectively, and the contact belt (223) is always in a straight state; the winding wheel (224) rotates under the control of the control unit, thereby automatically replacing the contact belt (223) contacting the wafer; after the wafer is adsorbed, the reinforcing assembly operates, adjusts the spatial position and clamps the wafer by using the contact belt (223).

6. A device-bearing carrier suitable for use in semiconductor processing as recited in claim 4, wherein: The contact pad assembly further comprises an inner telescopic body (610) and a vertical elastic body (650); The first carrier ring (620) and the second carrier ring (630) are respectively positioned on the inner wall of the inner built-in base pipe (400) and the inner wall of the base barrel (300) and slide along the axial direction of the base barrel (300); The inner telescopic body (610) is a telescopic rod controlled to be telescoped under the control of the control unit, is arranged longitudinally in the inner built-in base pipe (400), is directly or indirectly fixed at the top of the inner wall of the inner built-in base pipe (400) and is fixed at the bottom of the first carrier ring (620); The vertical elastic body (650) is a spring or a tension spring arranged longitudinally, one end of the vertical elastic body (650) is positioned at the inner top of the base barrel (300) and the other end is fixed at the top of the second carrier ring (630); An annular groove is arranged on the outer sidewall of the second carrier ring (630), and a ring-shaped capsule (631) is sleeved on the annular groove; the ring-shaped capsule (631) is an annular capsule body made of elastic rubber, is communicated with the air pump (632) and is inflated and deflated under the control of the control unit, thereby timely closing the gap between the second carrier ring (630) and the base barrel (300); the air pump (632) is positioned on the base barrel (300).

7. A device-bearing carrier suitable for use in semiconductor processing as recited in claim 6, wherein: The end positioning body comprises a V-shaped frame (222), a winding wheel (224) and a contact belt (223); The V-shaped frame (222) is a v-shaped hard frame body, which is transversely arranged, fixed at the end of the bottom sliding rod (220) and has an opening facing the axis of the base barrel (300); The number of the winding wheels (224) is two, which are respectively used for winding and releasing the contact belt (223) and are respectively positioned at the two ends of the V-shaped frame (222) close to the axis of the base barrel (300); The upper winding wheel (224) is internally provided with a rotation limiting component controlled by the control unit; The rotation limiting component is an electric pin; the lower winding wheel (224) is internally provided with a torsion spring; The contact belt (223) is an elastic silica gel material belt, the two ends of which are respectively wound and positioned on the two winding wheels (224); the existence of the torsion spring makes the lower winding wheel (224) always have a tendency to wind the contact belt (223), so that the contact belt (223) is always in a straightened state.

8. A device-bearing carrier suitable for use in semiconductor processing according to claim 6 or 7, characterized in that: Further comprising a cleaning component; The cleaning component comprises a support arm (710), a rotating carrier rod (720), an end plate (730) and a cleaning part; The support arm (710) is an L-shaped rod body, which plays a role of bearing support, the horizontal rod is located at the top, and the vertical rod is located at the bottom; the horizontal rod and the vertical rod are both telescopic rods controlled by the control unit to be telescoped; The rotating carrier rod (720) is a hard straight rod, one end of which is hingedly connected to the bottom end of the support arm (710) and rotates relative to the support arm (710) under the cooperative control of the power assembly and the control unit; the axis of the rotating shaft is perpendicular to the axis of the base barrel (300); after the rotating carrier rod (720) rotates, the end thereof away from the support arm (710) rotates to the bottom of the base barrel (300); The end plate (730) is fixed to the end of the rotating carrier rod (720) away from the support arm (710); The cleaning part is positioned on the surface of the end plate (730) away from the rotating carrier rod (720) and cleans the contact hose (640) by means of brushing, flushing and / or sticking; The base barrel (300) is rotatably connected to the bottom of the top connecting body (100) around the axis thereof, the axis of the rotating shaft coincides with the axis thereof and rotates under the cooperative control of the power assembly and the control unit.

9. A device-bearing carrier suitable for use in semiconductor processing as recited in claim 8, wherein: The cleaning part comprises a top soft wheel (740), a first rotating wheel (750), a second rotating wheel (760) and a cleaning belt (770); The top soft wheel (740), the first rotating wheel (750) and the second rotating wheel (760) are all columnar wheel bodies, the ends of which are positioned on the surface of the end plate (730) away from the rotating carrier rod (720) and the axial directions of which are the same as the length direction of the rotating carrier rod (720); the top soft wheel (740) is a rubber material columnar wheel, which is located above the first rotating wheel (750) and the second rotating wheel (760) when the rotating carrier rod (720) is transversely arranged at the bottom of the base barrel (300); the first rotating wheel (750) and the second rotating wheel (760) are both columnar wheel bodies internally provided with micro motors; The cleaning belt (770) is a belt body coated with adhesive on one side, and the two ends are wound and positioned on the first rotating wheel (750) and the second rotating wheel (760) respectively, always in a straightened state and in contact with the top soft wheel (740); When the rotating carrier (720) is horizontally placed on the bottom of the base barrel (300), the end plate (730) on it is vertically arranged; when the rotating carrier (720) is horizontally placed on the bottom of the base barrel (300), the cleaning belt (770) wound on the first rotating wheel (750) and the second rotating wheel (760) has the adhesive side upward and the whole presents an inverted U shape.

10. A method of using a device-bearing carrier suitable for semiconductor processing, characterized by: The device carrying carrier suitable for semiconductor processing is matched with the device carrying carrier of claim 7; the steps are as follows: when the wafer needs to be adsorbed, the displacement driving assembly is controlled according to the wafer specification to drive the contact extrusion pipe (500) to move upward or downward, so that the bottom of the built-in base pipe (400) is lower than all the contact extrusion pipes (500) or the bottom of a certain contact extrusion pipe (500) is lower than the built-in base pipe (400) and other contact extrusion pipes (500); then the device carrying carrier is controlled to move to the top of the wafer and close to the wafer, and then the wafer is adsorbed and positioned; After a period of use, the built-in telescopic body (610) is controlled to be elongated or shortened, the spatial position of the contact hose (640) is changed, and then the position of the contact hose (640) in contact with the bottom of the built-in base pipe (400) and the bottom of the contact extrusion pipe (500) is changed.

Images