A multi-channel radio frequency transceiver

Abstract

The present invention provides a multi-channel radio frequency transceiver, comprising: a receiver having multiple receiving paths, a low-noise amplifier module and a first signal processing module, the low-noise amplifier module having multiple first inlet ports respectively connected to the multiple receiving paths and a first outlet port connected to the first signal processing module; a transmitter having multiple transmitting paths, a first switch module and a second signal processing module, the first switch module having multiple second inlet ports respectively connected to the multiple transmitting paths and a second outlet port connected to the second signal processing module; a calibrator having a second switch module and a connected calibration module, the second switch module being connected to the multiple transmitting paths via multiple third inlet ports; and a local oscillator module comprising a first local oscillator component connected to the first signal processing module and the calibration module, and a second local oscillator component connected to the second signal processing module and the calibration module.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of radio frequency transceiver technology, and particularly to multi-channel radio frequency transceivers. Background Technology

[0002] Traditional multi-channel RF transceivers need to be compatible with multiple operating frequency bands, so they may be configured with at least 3-6 independent transmitters (or more) and 3-6 independent receivers (or more), which greatly increases the complexity of the system, and the area and power consumption are also very large. Especially when applied to RF chips, it will lead to an increase in chip area and complex manufacturing process. Summary of the Invention

[0003] To address the aforementioned technical problems, embodiments of the present invention provide a multi-channel radio frequency transceiver, comprising:

[0004] The receiver has multiple receiving paths, a low-noise amplifier module, and a first signal processing module. The low-noise amplifier module has multiple first input terminals and a first output terminal. The multiple receiving paths are respectively connected to the multiple first input terminals, and the first output terminal is connected to the first signal processing module. The multiple receiving paths are turned on or off in response to a received switching signal.

[0005] The transmitter has multiple transmission paths, a first switch module, and a second signal processing module. The first switch module has multiple second input terminals and a second output terminal. The multiple transmission paths are respectively connected to the multiple second input terminals, and the second output terminal is connected to the second signal processing module.

[0006] The calibrator has a second switch module and a calibration module. The second switch module has multiple third inlet terminals and a third outlet terminal. The multiple third inlet terminals are respectively connected to an external signal path and multiple transmission paths. The third outlet terminal is connected to the calibration module.

[0007] The local oscillator module includes a first local oscillator component and a second local oscillator component. The first local oscillator component is connected to the first signal processing module and the calibration module, respectively, and the second local oscillator component is connected to the second signal processing module and the calibration module, respectively.

[0008] In one embodiment, the first signal processing module includes a first balun, a first downconverter mixer, a first transmission impedance amplifier, a first low-pass filter, and a first analog-to-digital converter connected in sequence, and the first output terminal of the low-noise amplifier module is connected to the first balun.

[0009] In one embodiment, the low-noise amplifier module includes a plurality of low-noise amplifiers, the input terminals of the plurality of low-noise amplifiers forming a plurality of first input terminals, and the output terminals of the plurality of low-noise amplifiers converging to form a first output terminal.

[0010] In one embodiment, the second signal processing module includes a second balun, a power drive amplifier, an up-conversion mixer, a second transmission impedance amplifier, a second low-pass filter, and a digital-to-analog converter connected in sequence, and the second output terminal of the first switching module is connected to the second balun.

[0011] In one embodiment, the first switch module includes a plurality of first switches, the first ends of the plurality of first switches in the same direction form a plurality of second inlet ends, and the other ends of the plurality of first switches in the same direction converge to form a second outlet end.

[0012] In one embodiment, the first signal processing module includes a first balun, and the second signal processing module includes a second balun. The first balun and the second balun have at least three interface terminals. The at least three interface terminals are used to form one or more input interfaces and output interfaces. At least one or more of the interface terminals used to form the output interfaces are connected in parallel with a capacitor array for adjusting the operating frequency of the balun. Different capacitor arrays adjust the operating frequency differently.

[0013] In one embodiment, the first balun and the second balun are configured by segmenting the inductor, with each segment of the inductor having an interface terminal, and the inductance characteristics of the inductors in different segments being different.

[0014] In one embodiment, the first signal processing module includes multiple sets of first components formed by different first downconversion mixers and first impedance transfer amplifiers, each first component being connected to an interface terminal forming the output interface, and the different first components operating at different frequencies;

[0015] The second signal processing module includes multiple sets of second components formed by different up-conversion mixers and power drive amplifiers. Each second component is connected to an interface terminal that forms the output interface. The different second components operate at different frequencies.

[0016] In one embodiment, the calibration module includes an attenuator, a transconductance amplifier, a second downconversion mixer, a third transmission impedance amplifier, a third low-pass filter, and a second analog-to-digital converter connected in sequence. The third output terminal of the second switching module is connected to the attenuator, and each of the transmission paths is connected to a second switch in the second switching module via a connection line.

[0017] In one embodiment, both the first local oscillator assembly and the second local oscillator assembly include an interconnected radio frequency phase-locked loop and a local oscillator generator. The local oscillator generator in the first local oscillator assembly is connected to a first down-conversion mixer in the first signal processing module and a second down-conversion mixer in the calibration module via a first switching circuit. The local oscillator generator in the second local oscillator assembly is connected to an up-conversion mixer in the second signal processing module and a second down-conversion mixer in the calibration module via a second switching circuit.

[0018] According to the disclosure of the above embodiments, the beneficial effects of the embodiments of the present invention include combining multiple transmitters into one transmission channel and multiple receivers into one reception channel, so that the modules for processing transmitted and received signals in the transmitter and receiver do not need to be set up in multiple groups, but only one group is needed, thereby significantly reducing the number of components, reducing the design complexity of the RF chip and the chip area. At the same time, by setting up a calibrator, the self-calibration of signals from multiple transmission channels of the transceiver can be achieved, reducing the dependence on external instruments and testing costs.

[0019] Other features and advantages of this application will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures particularly pointed out in the written description, claims, and drawings.

[0020] The technical solution of this application will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of a multi-channel radio frequency transceiver in an embodiment of the present invention.

[0023] Figure 2 This is a traditional balun diagram.

[0024] Figure 3 This is a schematic diagram of the structure of the balun in an embodiment of the present invention.

[0025] Figure 4 This is a schematic diagram of the receiver in an embodiment of the present invention.

[0026] Figure 5 This is a schematic diagram of the transmitter in an embodiment of the present invention.

[0027] Figure 6 This is a schematic diagram of the calibrator in an embodiment of the present invention. Detailed Implementation

[0028] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings, but these are not intended to limit the scope of the invention.

[0029] It should be understood that various modifications can be made to the embodiments disclosed herein. Therefore, the following description should not be considered as limiting, but merely as an example of embodiments. Other modifications within the scope of this disclosure will be apparent to those skilled in the art.

[0030] The accompanying drawings, which are included in and form part of this specification, illustrate embodiments of the present disclosure and, together with the general description of the disclosure given above and the detailed description of the embodiments given below, serve to explain the principles of the disclosure.

[0031] These and other features of the invention will become apparent from the following description of preferred forms of embodiments given as non-limiting examples, with reference to the accompanying drawings.

[0032] It should also be understood that although the invention has been described with reference to some specific examples, those skilled in the art can certainly implement many other equivalent forms of the invention, which have the features described in the claims and are therefore all within the scope of protection defined herein.

[0033] The above and other aspects, features and advantages of this disclosure will become more apparent when taken in conjunction with the accompanying drawings and in view of the following detailed description.

[0034] Specific embodiments of the present disclosure are described thereafter with reference to the accompanying drawings; however, it should be understood that the disclosed embodiments are merely examples of the present disclosure and can be implemented in various ways. Well-known and / or repeated functions and structures are not described in detail to avoid unnecessary or redundant details that could obscure the present disclosure. Therefore, the specific structural and functional details disclosed herein are not intended to be limiting, but merely to serve as the basis and representative basis for the claims to teach those skilled in the art to use the present disclosure in a variety of substantially any suitable detailed structures.

[0035] This specification may use the phrases “in one embodiment,” “in another embodiment,” “in yet another embodiment,” or “in still another embodiment,” all of which may refer to one or more of the same or different embodiments according to this disclosure.

[0036] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0037] First, current multi-channel RF transceivers can be considered as an integration of multiple independent receivers and transmitters, involving numerous components, many of which are repetitive. For example, many components in the receiver and transmitter are repeatedly configured. Therefore, the overall transceiver structure involves numerous components and is complex, leading to complex manufacturing processes and large assembly area requirements. This is especially true when multi-channel RF transceivers are applied to chips, such as RF chips, resulting in a significant increase in the overall chip area, which may not meet the requirements of many application scenarios.

[0038] To solve the above problems, such as Figure 1 As shown, an embodiment of the present invention provides a multi-channel radio frequency transceiver, comprising:

[0039] The receiver has multiple receiving paths, a low-noise amplifier module, and a first signal processing module. The low-noise amplifier module has multiple first input terminals and a first output terminal. The multiple receiving paths are respectively connected to the multiple first input terminals, and the first output terminal is connected to the first signal processing module. The multiple receiving paths are turned on or off in response to a received switching signal.

[0040] The transmitter has multiple transmission paths, a first switch module, and a second signal processing module. The first switch module has multiple second input terminals and a second output terminal. The multiple transmission paths are respectively connected to the multiple second input terminals, and the second output terminal is connected to the second signal processing module.

[0041] The calibrator has a second switch module and a calibration module. The second switch module has multiple third inlet terminals and a third outlet terminal. The multiple third inlet terminals are respectively connected to an external signal path and multiple transmission paths. The third outlet terminal is connected to the calibration module.

[0042] The local oscillator module includes a first local oscillator component and a second local oscillator component. The first local oscillator component is connected to the first signal processing module and the calibration module, respectively, and the second local oscillator component is connected to the second signal processing module and the calibration module, respectively.

[0043] In this embodiment, the receiver's first signal processing module includes only one set of signal processors for processing the received signals. Assuming there are three receiving paths, conventional receivers would typically have three sets of signal processing modules. However, this application reduces this to only one set, using a single module to process signals received from all three paths while maintaining signal processing stability and accuracy. Similarly, for the transmitter, this embodiment also retains only one set of signal processors to process signals transmitted from multiple transmission paths. Specifically, signal processing can employ time-division multiplexing to selectively process signals from multiple paths, or it can choose to process only one path's signal as needed; the specific method is flexible.

[0044] Traditional RF transceivers typically include one or more calibration paths, or calibrators, for calibrating the RF transmitter, such as its performance and transmit power. Usually, each transmitter has its own calibrator, which increases the transceiver's complexity and the number of components involved. Therefore, this embodiment uses only one calibrator, connected to the transmitter, to calibrate the performance of each of the transmitter's transmit paths.

[0045] As can be seen from the above embodiments, this embodiment combines multiple transmitters into one transmitting channel and multiple receivers into one receiving channel. This eliminates the need for multiple sets of modules in the transmitter and receiver for processing transmitted and received signals; only one set is required. This significantly reduces the number of components, the design complexity of the RF chip, and the chip area. Furthermore, by using a single calibrator, self-calibration of the transceiver's multiple transmission channels can be achieved, reducing reliance on external instruments and lowering testing costs.

[0046] Specifically, the first signal processing module includes a first balun, a first down-conversion mixer, a first transmission impedance amplifier, a first low-pass filter, and a first analog-to-digital converter connected in sequence. The first output terminal of the low-noise amplifier module is connected to the first balun. The low-noise amplifier module includes multiple low-noise amplifiers, the input terminals of the multiple low-noise amplifiers form multiple first input terminals, and the output terminals of the multiple low-noise amplifiers converge to form the first output terminal.

[0047] For example, continue to combine Figure 1As shown in the figure, assuming the receiving paths are the three paths shown in the figure, namely RX1, RX2 and RX3, these three receiving paths are sent to the first balun (702) after passing through three independent low noise amplifiers (701), and then to the first down-conversion mixer (703) and then to the first transmission impedance amplifier (704), the first low-pass filter (705) and the first analog-to-digital converter (706) in sequence to complete the signal receiving processing.

[0048] Taking a multi-channel RF transceiver applied to an RF chip as an example (the same applies below), unlike traditional transceivers, this embodiment combines multiple receivers to the maximum extent, thereby optimizing chip area and greatly reducing chip design complexity. The difficulty in combining multiple receivers in traditional methods is mainly due to impedance matching issues with multiple ports and the small operating frequency range of a single balun. However, this embodiment does not combine multiple ports; instead, it combines the outputs of multiple low-noise amplifiers (701) onto the same first signal processing module. In this way, independent low-noise amplifiers (701) are connected to independent RF ports, i.e., receiving paths (RX1 / RX2 / RX3), ensuring different RF matching for different ports. This effectively preserves the advantages of traditional multi-channel receivers, ensuring stable and accurate received signals.

[0049] The second signal processing module includes a second balun, a power drive amplifier, an up-conversion mixer, a second transmission impedance amplifier, a second low-pass filter, and a digital-to-analog converter connected in sequence. The second output terminal of the first switching module is connected to the second balun. The first switching module includes a plurality of first switches, the first ends of the plurality of first switches in the same direction forming a plurality of second input terminals, and the other ends of the plurality of first switches in the same direction converging to form a second output terminal.

[0050] Continue to combine Figure 1 As shown in the figure, assuming the transmission paths are the three shown in the figure, namely TX1, TX2 and TX3, the three transmission paths pass through an independent first switch module (801) and are then connected in sequence to the second balun (802), power drive amplifier (803), upconverter mixer (804), second low-pass filter (805), second transmission impedance amplifier (806) and digital-to-analog converter (807). When processing the transmitted signal, the above-mentioned multiple devices are executed in reverse order to complete the signal transmission processing.

[0051] Unlike traditional transceivers, this embodiment optimizes chip area and significantly reduces chip design complexity by merging multiple transmitters to the maximum extent possible. The difficulty in merging multiple transmitters stems primarily from considerations of power matching between RF transmitters at different frequencies and the limited operating frequency range of a single balun. However, this embodiment employs an independent first switching module (such as...). Figure 1 The switch array (801) in the middle leads out different transmit ports, namely transmit paths (TX1 / TX2 / TX3), so that different radio frequency matching can be performed for different frequency bands. This can solve the problem of impedance matching for multiple paths corresponding to a single transmit port.

[0052] Furthermore, regarding the aforementioned balun problem, as described above, the first signal processing module includes a first balun, and the second signal processing module includes a second balun. The first and second baluns each have at least three interface ports, such as four or more. At least three of these interface ports are used to form one or more input and output interfaces. At least one or more of the interface ports used to form the output interface are connected in parallel with a capacitor array for adjusting the balun's operating frequency. Different capacitor arrays adjust the operating frequency differently.

[0053] Specifically, in this embodiment, the first and second baluns are segmented by inductors, with each segment having an interface terminal. The inductor characteristics of different segments are different, allowing each segment to correspond to a different operating frequency band, thus enabling the baluns with different inductor segments to operate in different frequency bands. Furthermore, to further expand the operating frequency range of each balun, this embodiment also incorporates a capacitor array connected in parallel at the output interface of each balun, allowing for adjustment of the operating frequency of different segments of the balun based on different capacitor arrays.

[0054] Unlike traditional baluns, this embodiment proposes a novel configurable balun scheme that can further broaden the operating frequency range of the balun. For example... Figure 2 As shown, Figure 2 The diagram illustrates a traditional balun. A traditional on-chip single-ended to differential balun has one differential RF port (RF1+ and RF1-), one single-ended RF port (RF2+ and RF2-, where RF2- is grounded, thus becoming single-ended), and one DC port. This type of balun has a relatively narrow operating frequency range. While the operating frequency range can be adjusted in practical applications using a parallel capacitor array, the quality factors of the on-chip capacitors and inductors limit the size of the parallel capacitors; otherwise, it will affect the system's conversion efficiency and consequently, its transmit / receive performance. To address this issue, methods such as... Figure 3As shown, this embodiment proposes a novel balun that segments the balun, dividing its inherent inductive characteristics into multiple segments, such as two or three segments. For example, using... Figure 3 Taking the two segments shown as examples, one segment of the balun can operate within a larger inductance range (RF1+ and RF1-), corresponding to a lower operating frequency; the other segment can operate within a smaller inductance range (RF3+ and RF3-), corresponding to a higher operating frequency. That is, inductor segments with different inductance characteristics allow the corresponding parts of the balun to operate in different frequency ranges. To increase the balun's operating range, a capacitor array can be incorporated; by connecting the capacitor array in parallel with the inductor, the balun's operating frequency range can be expanded by at least 100%.

[0055] In practical use, taking the first and second baluns, both of which have two output interfaces, as an example, in order to adapt to the balun proposed in this embodiment, the two sets of differential RF ports of the balun need to be input into the receiving mixer or the transmitting mixer respectively, instead of simply using a switch to select, because switching will cause the quality factor of the inductor to decrease; while the mixer can directly act as a switch, which not only reduces the layout of components such as switches and reduces the process complexity, but also effectively realizes the connection with the corresponding balun by multiplexing the mixers in the receiver and transmitter, saving costs.

[0056] As mentioned above, this embodiment significantly reduces the chip area by merging multiple baluns into a single balun. Furthermore, to address the issue of the limited operating frequency range of a single balun, this embodiment improves the balun's structure, thereby expanding its operating range and consequently the operating range of the receiver and transmitter, making the proposed receiver-transmitter merging scheme possible.

[0057] Specifically, such as Figure 4 As shown, the first signal processing module includes multiple first components formed by different first down-conversion mixers and first impedance transmission amplifiers. Each first component is connected to an interface terminal that forms the output interface. The different first components have different operating frequencies.

[0058] like Figure 5 As shown, the second signal processing module includes multiple sets of second components formed by different up-conversion mixers and power drive amplifiers. Each second component is connected to an interface terminal that forms the output interface, and the different second components operate at different frequencies.

[0059] For example, continue to combine Figure 4As shown, during normal operation, assuming RX1 is a receiving path, the receiving paths RX2 and RX3 are relatively close and can share a receiving path; the three receiving paths converge at the input port of the first balun (702), and then lead to the first down-conversion mixer (7031) in the first group of components of the first balun and the first down-conversion mixer (7032) in the second group of components, respectively, and then pass through the first impedance transmission amplifier (7041) and the second impedance transmission amplifier (7042), respectively. After that, the signals output by the two components are selected according to actual needs and then sent to the first low-pass filter (705) and the first analog-to-digital converter (706) in sequence to complete the filtering of the received signal.

[0060] Continue to combine Figure 5 As shown, during normal operation, assuming TX1 is a transmission path, TX2 and TX3 can share a transmission path because they are close to each other. After passing through the first switch module (801), the three transmission paths enter the second balun (802) and converge at the input port of the second balun (802). Then, they are respectively connected to the power drive amplifier (8031) and up-conversion mixer (8041) of the first group of components in the second balun, as well as the power drive amplifier (8032) and up-conversion mixer (8042) of the second group of components. After that, the signals output by the two components are selected according to actual needs and then sent to the second low-pass filter (805), the second impedance transmission amplifier (806) and the digital-to-analog converter (807) in sequence.

[0061] Because baluns occupy a very large area in RF chips, while active devices occupy a relatively small area, the RF transceiver architecture of this embodiment can save 15%-30% of the RF chip area compared to traditional architectures. The larger the original circuit size, the greater the area saved.

[0062] Continue to combine Figure 1 As shown, the calibration module includes an attenuator, a transconductance amplifier, a second downconversion mixer, a third transmission impedance amplifier, a third low-pass filter, and a second analog-to-digital converter connected in sequence. The third output terminal of the second switching module is connected to the attenuator. Each of the transmission paths is connected to a second switch in the second switching module through a connection line.

[0063] Both the first local oscillator assembly and the second local oscillator assembly include an interconnected radio frequency phase-locked loop and a local oscillator generator. The local oscillator generator in the first local oscillator assembly is connected to the first down-conversion mixer in the first signal processing module and the second down-conversion mixer in the calibration module through a first switching circuit. The local oscillator generator in the second local oscillator assembly is connected to the up-conversion mixer in the second signal processing module and the second down-conversion mixer in the calibration module through a second switching circuit.

[0064] like Figure 4 As shown, local oscillators LO_1 and LO_23 are provided with local oscillator signals through the RF frequency synthesizer (707) and the local oscillator generator (708). Through the above connections and operations, multi-channel reception can be configured on a single receiver. Figure 5 As shown, local oscillators LO_1 and LO_23 are provided with local oscillator signals through the radio frequency synthesizer (808) and the local oscillator generator (809). Through the above connections and operations, multi-channel transmission can be configured on a single transmitter.

[0065] Furthermore, in combination Figure 6 As shown, this embodiment can further reduce the area of ​​the chip containing the multi-channel transceiver by matching and setting the calibrator and local oscillator module. The structure of the calibrator in this embodiment includes: a switch array (901) that connects the external radio frequency signal (ORX_Ext) and the three transmit signals (TX1 / TX2 / TX3) to the calibration channel based on a time-division mechanism, or controls a certain transmit signal to be connected to the calibration channel through a switch control signal. The calibration channel includes, in the direction of signal transmission, a first-stage attenuator (902), a transconductance amplifier (903), a second down-conversion mixer (904), a third impedance transmission amplifier (905), a third low-pass filter (906), and a second analog-to-digital converter (907). The obtained radio frequency signal is processed by the above-mentioned devices in sequence to complete the calibration of the radio frequency signal.

[0066] In this embodiment, the calibration condition is to calibrate the transmitter's local oscillator leakage and quadrature mismatch. That is, the calibrator / calibration channel can perform different calibrations by configuring different switch channels, mainly including transmitter local oscillator leakage and quadrature mismatch calibration, as well as transmitter power control and predistortion calibration. When it is necessary to calibrate the transmitter's local oscillator leakage and quadrature mismatch, the receiver's local oscillator switch (908) is turned on, and the receiver's local oscillator signal is connected. In this way, the transmitter and receiver can be set to different frequencies. By detecting this frequency difference as the intermediate frequency signal, the transmitter's local oscillator leakage and quadrature mismatch can be calibrated. When it is necessary to perform closed-loop power control or predistortion processing on the transmitter, the transmitter's local oscillator switch (909) is turned on, and the transmitter's local oscillator signal is connected. In this way, the transmitter and calibration receiver use the same local oscillator signal to synchronously receive the transmitted baseband signal. After data calculation and processing, the predistortion analysis of the transmitted signal is completed.

[0067] Specifically, the different calibration processes of the transmitter are described below: (1) Local oscillator leakage and quadrature mismatch calibration of the transmitter: The transmitter TX1 normally transmits a single-tone signal. The calibration channel is connected to TX1 using a switch array (901), which connects to the local oscillator switch (908) of the receiver and connects to the local oscillator signal of the receiver SXR (707). At this time, the transmission channel and the calibration channel can be set to different frequencies. By detecting this frequency difference as the intermediate frequency signal, and using a suitable calibration algorithm, the local oscillator leakage and quadrature mismatch of the transmitter can be calibrated. (2) Power control and predistortion calibration of the transmitter: The transmitter TX1 normally transmits a single-tone signal or a modulated signal. The calibration channel is connected to TX1 using a switch array (901), which connects to the local oscillator switch (909) of the transmitter and connects to the local oscillator signal of the transmitter SXR (808). At this time, the transmitter and the calibration receiver use the same local oscillator signal to synchronously receive the transmitted baseband signal. After data calculation and processing using a suitable calibration algorithm, the power control and predistortion analysis of the transmitted signal are completed.

[0068] Another embodiment of the present invention provides a radio frequency chip, including a multi-channel radio frequency transceiver as described in any of the embodiments above.

[0069] Another embodiment of the present invention provides an electronic device including the radio frequency chip as described above.

[0070] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of protection of this application is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of one or more embodiments of this application as described above, which are not provided in detail for the sake of brevity.

Claims

1. A multi-channel radio frequency transceiver, characterized in that, include: The receiver has multiple receiving paths, a low-noise amplifier module, and a first signal processing module. The low-noise amplifier module has multiple first input terminals and a first output terminal. The multiple receiving paths are respectively connected to the multiple first input terminals, and the first output terminal is connected to the first signal processing module. The multiple receiving paths are turned on or off in response to a received switching signal. The transmitter has multiple transmission paths, a first switch module, and a second signal processing module. The first switch module has multiple second input terminals and a second output terminal. The multiple transmission paths are respectively connected to the multiple second input terminals, and the second output terminal is connected to the second signal processing module. The calibrator has a second switch module and a calibration module. The second switch module has multiple third inlet terminals and a third outlet terminal. The multiple third inlet terminals are respectively connected to an external signal path and multiple transmission paths. The third outlet terminal is connected to the calibration module. The local oscillator module includes a first local oscillator component and a second local oscillator component. The first local oscillator component is connected to the first signal processing module and the calibration module, respectively, and the second local oscillator component is connected to the second signal processing module and the calibration module, respectively.

2. The multi-channel radio frequency transceiver according to claim 1, characterized in that, The first signal processing module includes a first balun, a first downconverter mixer, a first transmission impedance amplifier, a first low-pass filter, and a first analog-to-digital converter connected in sequence. The first output terminal of the low-noise amplifier module is connected to the first balun.

3. The multi-channel radio frequency transceiver according to claim 1, characterized in that, The low-noise amplifier module includes multiple low-noise amplifiers, the input terminals of the multiple low-noise amplifiers form multiple first input terminals, and the output terminals of the multiple low-noise amplifiers converge to form the first output terminal.

4. The multi-channel radio frequency transceiver according to claim 1, characterized in that, The second signal processing module includes a second balun, a power drive amplifier, an up-conversion mixer, a second transmission impedance amplifier, a second low-pass filter, and a digital-to-analog converter connected in sequence. The second output terminal of the first switching module is connected to the second balun.

5. The multi-channel radio frequency transceiver according to claim 1, characterized in that, The first switch module includes a plurality of first switches, the first ends of the plurality of first switches in the same direction form a plurality of second inlet ends, and the other ends of the plurality of first switches in the same direction converge to form a second outlet end.

6. The multi-channel radio frequency transceiver according to claim 1, characterized in that, The first signal processing module includes a first balun, and the second signal processing module includes a second balun. The first balun and the second balun have at least three interface terminals. The at least three interface terminals are used to form one or more input interfaces and output interfaces. At least one or more of the interface terminals used to form the output interfaces are connected in parallel with a capacitor array for adjusting the operating frequency of the balun. Different capacitor arrays adjust the operating frequency differently.

7. The multi-channel radio frequency transceiver according to claim 6, characterized in that, The first balun and the second balun are formed by segmenting the inductor, with each segment of the inductor being equipped with an interface terminal, and the inductance characteristics of the inductors in different segments are different.

8. The multi-channel radio frequency transceiver according to claim 7, characterized in that, The first signal processing module includes multiple first components formed by different first down-conversion mixers and first impedance transfer amplifiers. Each first component is connected to an interface terminal that forms the output interface. The different first components have different operating frequencies. The second signal processing module includes multiple sets of second components formed by different up-conversion mixers and power drive amplifiers. Each second component is connected to an interface terminal that forms the output interface. The different second components operate at different frequencies.

9. The multi-channel radio frequency transceiver according to claim 1, characterized in that, The calibration module includes an attenuator, a transconductance amplifier, a second downconversion mixer, a third transmission impedance amplifier, a third low-pass filter, and a second analog-to-digital converter connected in sequence. The third output terminal of the second switching module is connected to the attenuator. Each of the transmission paths is connected to a second switch in the second switching module through a connection line.

10. The multi-channel radio frequency transceiver according to claim 1, characterized in that, Both the first local oscillator assembly and the second local oscillator assembly include an interconnected radio frequency phase-locked loop and a local oscillator generator. The local oscillator generator in the first local oscillator assembly is connected to the first down-conversion mixer in the first signal processing module and the second down-conversion mixer in the calibration module through a first switching circuit. The local oscillator generator in the second local oscillator assembly is connected to the up-conversion mixer in the second signal processing module and the second down-conversion mixer in the calibration module through a second switching circuit.

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