Component carrier structure and method of manufacturing component carrier structure

Abstract

A component carrier structure and a method of manufacturing a component carrier structure are provided. The component carrier structure (100) comprises a stack (102), the stack (102) comprising at least one electrically conductive layer structure (104-108) and at least one electrically insulating layer structure (110-113); the invention relates to a device (100) comprising a stack (102) and at least one identifier structure (114-118), the at least one identifier structure (114-118) being arranged in and / or on the stack (102), the at least one identifier structure (114-118) comprising a central code region (120), the central code region (120) having an electrically conductive material and an electrically insulating material, the electrically conductive material and the electrically insulating material encode optically readable information of the at least one identifier structure (114-118), and the at least one identifier structure (114-118) comprises a frame structure (122) surrounding at least a portion of the central code area (120) and made of an electrically conductive material.

Description

Field of the Invention

[0001] The present invention relates to a component carrier structure and a method of manufacturing a component carrier structure. Background Art

[0002] Against the background of the increasing product functionality of component carriers equipped with one or more electronic components, the ever-increasing miniaturization of such electronic components, and the increasing number of electronic components (such as printed circuit boards) mounted on the component carrier, more and more powerful array-like components or packages with several electronic components are being employed, which have a plurality of contact parts or connection parts, and the pitch between these contact parts is getting smaller and smaller. Removing the heat generated during operation by such electronic components and the component carrier itself has become an increasingly serious problem. At the same time, the component carrier should have mechanical robustness and electrical reliability so that it can be operated even under harsh conditions.

[0003] Effectively controlling the mass manufacturing process of component carriers is challenging. Traceability of the component carrier or its preform is desired, i.e., the ability to track and identify the component carrier structure or the component carrier-related body, for example, during manufacturing and / or use. Tracking the component carrier structure can allow verification of the manufacturing history, location, manufacturing environment (such as temperature, humidity), or application of individual component carrier structures. Summary of the Invention

[0004] It is an object of the present invention to effectively manufacture a component carrier and / or its preform that allows traceability.

[0005] To achieve the above object, a component carrier structure and a method of manufacturing a component carrier structure are provided.

[0006] According to an exemplary embodiment of the present invention, a component carrier structure is provided, the component carrier structure including: a stack including at least one electrically conductive layer structure and at least one electrically insulating layer structure; and at least one identifier structure, at least one of the identifier structures being arranged in the stack and / or on the stack, wherein at least one of the identifier structures includes a central code region having an electrically conductive material and an electrically insulating material, the electrically conductive material and the electrically insulating material encoding optically readable information of at least one identifier structure, and at least one of the identifier structures includes a frame structure surrounding at least a part of the central code region and made of an electrically conductive material.

[0007] According to yet another exemplary embodiment of the present invention, a method of manufacturing a component carrier structure is provided, wherein the method includes: providing a stack, the stack including at least one electrically conductive layer structure and / or at least one electrically insulating layer structure; forming or disposing at least one identifier structure in and / or on the stack; and configuring at least one of the identifier structures to have a central code region and a frame structure, the central code region having an electrically conductive material and an electrically insulating material, the electrically conductive material and the electrically insulating material encoding optically readable information of at least one of the identifier structures, the frame structure surrounding at least a portion of the central code region and being made of an electrically conductive material.

[0008] In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection and / or optical connection and / or thermal connection. In other words, the component carrier may be configured as a mechanical carrier and / or an electronic carrier for components. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different component carriers of the above types of component carriers.

[0009] In the context of the present application, the term "component carrier structure" may particularly denote a physical structure including one or more component carriers or preforms of the component carriers. For example, the component carrier structure may be the component carrier itself. The component carrier structure may also include a plurality of component carriers, such as an array of component carriers or a panel including component carriers. In addition, the component carrier structure may also be a structure obtained during the manufacture of the component carrier, such as a panel or an array including a plurality of component carrier preforms that can still be integrally connected.

[0010] In the context of the present application, the term "stack" may particularly denote a device of a plurality of planar layer structures mounted parallel to each other.

[0011] In the context of the present application, the term "layer structure" may particularly denote a continuous layer, a patterned layer, or a plurality of non-continuous islands in a common plane. The layer structure may be electrically insulating and / or electrically conductive.

[0012] In the context of the present application, the term "identifier structure" may in particular denote a physical structure assigned to or associated with a component carrier, an array of component carriers, or an entire component carrier structure such as a semi-finished product (e.g., a panel). The identifier structure may be an information-bearing structure and may include an identifier capable of identifying the component carrier structure, the panel, the array, or an individual component carrier. Specifically, the identifier structure may include a central code region. Preferably but not necessarily, the identifier structure or a combination of identifier structures may be unique for a particular component carrier, array, or component carrier structure. However, it is also possible for the identifier structure or a combination of identifier structures to be the same for a certain number of component carriers or component carrier bodies, for example, for those component carriers or component carrier structures manufactured within a common lot or batch. For example, such an identifier structure may include a data matrix pattern or a QR code. In the identifier structure, information such as a link to a specific data set in a database may be included. Accessible information, such as information about the defect status of a component carrier of a component carrier structure including the identifier structure, may be stored in the data set. Additionally or alternatively, the identifier structure may include information about the nature of the component carrier structure itself, such as a unique identifier, information about the defect status of the component carrier, the lot number, the panel serial number, the date and time of panel production (e.g., during a photoimaging or laser direct imaging (LDI) process). In particular, the manufacturing history of a semi-finished product or a part thereof (e.g., a layer structure) may be directly encoded in the corresponding identifier structure and / or may be retrieved from a data set in a database that can be linked from the identifier structure. In particular, the identifier structure may be an identification structure. For example, the identifier structure may be produced by one or more of the following procedures: patterning by a lithography process or LDI; applying the identifier structure by pasting, cutting, scribing, casting, embossing, printing (especially three-dimensional printing, inkjet printing, etc.); providing the identifier structure by an electrically conductive material or a dielectric material, wherein the material of the identifier structure should be different in its properties from the surrounding material so that it can be read by an optical reader device.

[0013] In the context of the present application, the term "central code region having a conductive material and an electrically insulating material encoding optically readable information" can in particular denote a part of the identifier structure made of a conductive material and part made of an electrically insulating material to create a central part including an insulating material - conductive material pattern (e.g. in the form of a data matrix or QR code) encoding optical information. In other words, a pattern of an insulating material of a first color and a further conductive material of a second color can be formed, which pattern can encode information that can be read optically. The central code region can be a code structure. For example, points of a lighter insulating material (e.g. resin and / or glass) can encode the logical value "0", while points of a darker conductive material (e.g. copper) can encode the logical value "1". Then, an optical reader device for optically detecting the pattern of the central code region in combination with a pattern recognition algorithm can determine the information of the identifier structure optically encoded in the central code region. For example, the central code region can be a data matrix or QR code formed based on the materials of at least one conductive layer structure and at least one electrically insulating layer structure. Optionally, the central code region can include at least a third material, such as at least a second conductive material and / or at least a second electrically insulating material. The different colors of the different electrically insulating materials and / or the different colors of the different conductive materials can encode additional information of the central code region and can be decoded by the optical reader device. In the latter case, the optical reader may have to distinguish not only between the conductive material and the electrically insulating material (in particular based on color), but also between the different colors of the different conductive materials and / or different electrically insulating materials.

[0014] In the context of the present application, the term "frame structure that surrounds at least part of the central code area and is made of an electrically conductive material" may particularly denote a peripheral physical structure that surrounds a part of the central code area (e.g., two or three of the four edges of a rectangular central code area) or the entire central code area (especially all four edges of a rectangular central code area). For example, a partially surrounding frame structure may surround at least half of the circumference of the central code area (which may correspond to a surrounding of at least 180°) or at least three-quarters (which may correspond to a surrounding of at least 270°). Preferably, the frame structure may be circumferentially closed, e.g., it may be a rectangular frame or a circular frame. Thus, the frame structure may be an annular structure. For example, the frame area may be a circumferentially closed rectangular frame that completely surrounds the central code area, which is embodied as a data matrix or a QR code. Preferably, the electrically conductive material of the frame area and the electrically conductive material of the central code area may be the same, preferably copper. The electrically conductive material of the electrically conductive frame structure and the central code area may be formed based on a common metal layer (e.g., based on a common patterned copper foil). For example, the frame area may be formed based on the material of at least one electrically conductive layer structure. For example, the frame structure may not encode data or information of the identifier structure, but may be used as a defined or predefined boundary or spatial limitation of the identifier structure. Thus, the frame structure may be used as an optical marker to indicate the presence of the identifier structure and the spatial limitation of the identifier structure to an optical reader device, rather than carrying data itself. Alternatively, the frame structure may act as both an optical marker and carry information other than the information carried by the central code area. For example, the frame structure may be defined by an inner rectangle and an outer rectangle having the same center, wherein the frame structure may be defined as the area between the two rectangles, and the central code area may be located inside the inner rectangle.

[0015] An exemplary embodiment provides a component carrier structure (e.g., a printed circuit board or a panel comprising currently manufactured printed circuit board preforms that are still integrally connected), the component carrier structure having a (preferably laminated) stack of parts, the stack of parts comprising one or more electrically conductive layer structures and one or more electrically insulating layer structures. One or more identifier structures may be located in and / or on the stack of parts, for example, one or more identifier structures may be inlays or may preferably form an integral part of the stack of parts. At least one of the identifier structures may be made of an electrically conductive material (e.g., copper) and an electrically insulating material (e.g., including a resin), the electrically conductive material and the electrically insulating material may, for example, form an optically readable pattern that can be read by an optical reader device for identifying or characterizing the component carrier structure or a portion thereof. Preferably, but not necessarily, the electrically conductive material and the electrically insulating material forming the respective identifier structure may be the same material as the material constituting the layer structure of the stack of parts. Advantageously, the corresponding identifier structure includes not only a central code region (e.g., a data pattern or QR code pattern composed of dots of electrically conductive material and electrically insulating material, preferably laminate material), but also a frame structure partially or completely surrounding the central code region and made of electrically conductive material (preferably laminate material). Although, in a preferred embodiment, the frame structure does not encode data items or information elements of the identifier structure, the frame structure can advantageously serve as a well-defined or even predefined outer boundary or spatial limit for the identifier structure. Surprisingly, it has been discovered that such a frame structure can significantly facilitate an optical reader device's ability to locate and determine the spatial limits of the identifier structure in an image based on recognition of the frame structure having its predefined shape and / or dimensions. In short, an optical reader device (e.g., an optical camera) can optically recognize the frame structure to precisely identify the position of a designated identifier structure in the image. When the frame structure has predefined properties known in advance by the optical reader device, it can be an easy task for pattern recognition algorithms, etc., to accurately and quickly determine the position of the identifier structure for detailed interpretation of the central code region. When the peripheral or surrounding frame structure of the identifier structure has been identified, the information encoded in the central code area designated to at least partially surround the frame structure can be decoded with excellent accuracy. Thus, by adding a frame structure around the central code area, the accuracy and efficiency of optically determining information from at least one identifier structure of a component carrier can be significantly improved. Specifically, the described improvements in optical detection and decoding accuracy can be of greatest advantage in frameworks for component carrier structural identification based on one or more identifier structures, at least a portion of which can be arranged within the interior of a stack. For example, optical detection may have to be performed through a portion of the stack material, which can be challenging for optical readers.Therefore, it may be advantageous to provide a framework structure that simplifies and makes more precise the detection. Descriptively, the identifier structure described with an outer framework structure surrounding an inner code region can be represented as a negative or inverse identifier structure (e.g., a negative or inverse data matrix or QR code). This approach can be considered a paradigm shift in the identification of component carriers based on the integration of the identifier structure in the laminate, which can even be buried in the laminate.

[0016] Below, further exemplary embodiments of the component carrier structure and method will be explained.

[0017] As described above, the method can include: forming or arranging at least one identifier structure in and / or on the laminate. Forming the identifier structure in and / or on the laminate can be patterning one or more electrically conductive layers (e.g., copper foil) and / or one or more electrically insulating layers (e.g., resin sheet, optionally including reinforcing particles) to obtain an overall electrically conductive-insulating pattern that constitutes the identifier structure. In the latter embodiment, the identifier structure can be integrated in the laminate or formed integrally with the laminate. In contrast, the arranging can include the assembly or insertion of a separate identifier structure body placed on or in the laminate. In the latter embodiment, the identifier structure can be an inlay.

[0018] In an embodiment, the central code region and the framework structure are formed integrally with the laminate. In such an embodiment, the electrically conductive layer structure and the electrically insulating layer structure forming (preferably laminating) the laminate can include parts that constitute the integrated identifier structure.

[0019] In an embodiment, the central code region and the framework structure form part of at least one electrically conductive layer structure and / or at least one electrically insulating layer structure of the laminate. Thus, the same layer structure can be used to constitute the laminate and to form at least one identifier structure. The metal code part can have a certain thickness such that it can extend vertically into the corresponding electrically insulating layer structure.

[0020] In an embodiment, the central code region includes a data matrix pattern. Such a data matrix pattern can be a two-dimensional code composed of, for example, darker and lighter units or dots arranged in a square or rectangular pattern to form a matrix. For example, the information to be encoded can be text data and / or numerical data.

[0021] In an embodiment, the central code region is configured as a one-dimensional code, a two-dimensional code, at least a three-dimensional code, a QR code, a bar code, and / or an alphanumeric code. For example, the one-dimensional code can be a bar code. The two-dimensional code can be, for example, PDF417, Data-Matrix-Code, Semacode, QR-Code, BeeTag, VeriCode, Aztec-Code, MaxiCode, VS-Code, or a combination thereof. For example, the three-dimensional code can be any code including different color and / or depth information, such as a holographic code or a high-capacity color bar code and / or a code having different heights. Any such code, especially the three-dimensional code, can be applied by printing or layer patterning. Although many different central code regions are possible, using a data matrix code for the central code region may be a preferred option because such a code remains readable even when part of it is damaged. Using such a fault-robust data matrix code may be advantageous due to the harsh conditions that may exist during the processing of the panel for manufacturing the component carrier. For example, the four-dimensional code can be a code (such as a QR code) including different heights (especially of resin) and colors (especially of resin). For example, the central code region can also be any system for representing other words, letters, graphics, and / or symbols.

[0022] In an embodiment, at least one identifier structure includes a metal pattern of at least one of at least one electrically conductive layer structure. The metal material of one or more electrically conductive layer structures can have a significant contrast with the resin material of one or more electrically insulating layer structures. This can simplify optical detection and can make the detection accurate.

[0023] In an embodiment, at least one identifier structure includes an additional structure that is separated from the frame structure and separated from the central code region. For example, the additional structure can surround the frame structure or can be surrounded by the frame structure. For example, the additional structure can be an additional frame structure. By adding at least one additional structure to the identifier structure, the amount of information encoded in the identifier structure can be further increased. Such at least one additional structure can be an additional electrically conductive layer structure made of an additional metal material (such as aluminum or nickel) different from the metal material of the identifier structure (such as copper). Different metal materials can be optically distinguished by their different colors. Additionally or alternatively, such at least one additional structure can include an additional electrically insulating layer structure made of an additional dielectric material (such as polyimide) different from the dielectric material (such as epoxy resin) of the central code region. Different dielectric materials can be optically distinguished by their different colors.

[0024] In an embodiment, the additional structure has a color different from that of the frame structure and the central code region and / or the additional structure is made of a material different from that of the frame structure and the central code region. For image processing software, based on the optical image detected by the optical reader device, it is easy to distinguish the different colors of the different materials of the additional structure, the frame structure, and / or the central code region. Therefore, the expansion of the number of colors of the various sub-structures of the identifier structure in the detected image can allow an increase in the amount of information encoded in the identifier structure.

[0025] In an embodiment, the additional structure is made of an ink, such as an electrically insulating ink. For example, such an ink may include a colorant that provides the ink with a color different from that of the surrounding material or the material being surrounded by the identifier structure. For example, such an ink may be a solder mask. For example, a solder mask may be formed based on an epoxy resin liquid, which may be screen printed onto the stack via a pattern or mask. A solder mask may also be formed based on a liquid photoimageable solder resist ink, which may be applied, for example, by spraying or screen printing and then patterned. Additionally, a solder mask may be created as a dry film photoimageable solder mask, which may be laminated and then patterned on the stack. In the context of the present application, the term "solder mask structure" may specifically denote a physical structure including a solder mask material. The solder mask material of such a solder mask structure may protect the stack or a part thereof from oxidation or corrosion, and in particular may protect the surface portion containing a metal such as copper. In this embodiment, information may also be encoded.

[0026] In an embodiment, the additional structure is an additional frame structure. For example, the additional structure is an additional frame structure that at least partially surrounds the frame structure. Therefore, two or more different frame structures may be provided. The frame structure and the additional frame structure may be made of different materials, and thus may have different colors and may therefore be distinguishable in the optically detected image. For example, optically distinguishable frame structures may also contribute to the detectable and recognizable information encoded in the identifier structure. In one embodiment, the first frame structure is surrounded by the second frame structure. In another embodiment, the first frame structure surrounds a first part of the central code region, and the optically distinguishable second frame structure surrounds a second part of the same central code region. For example, the first frame structure and the second frame structure may then together completely circumferentially surround the central code region.

[0027] In an embodiment, the frame structure extends around two or three of the four edges of the central code region, or around the entire perimeter of the central code region. More generally, the frame structure may extend around at least two of the four edges of a rectangular structure. For example, the frame structure may be located at the edge of the component carrier structure and may then extend around two edges of the central code region. However, when the frame structure extends around three or four edges of the central code region, the accuracy of determining the position of the central code region can be further refined.

[0028] In an embodiment, the central code region encodes information such that the component carrier structure can be identified and / or tracked by optically reading the information from the central code region. Identifying the component carrier structure or a part thereof based on optically reading the central code region may include determining identity information about the component carrier structure to distinguish it from other or even all other component carrier structures. Tracking the component carrier structure based on the information optically read from the central code region may allow tracing each individual component carrier structure over a particular time interval, such as during the entire manufacturing process of each individual component carrier structure or during its lifetime.

[0029] In an embodiment, at least one of the identifier structures includes a first identifier structure and a second identifier structure, and each of the first and second identifier structures has the features as described above. Thus, a single component carrier structure may include multiple identifier structures, each having the central code region and the frame structure that at least partially surrounds it. To identify or characterize the component carrier structure, it may be sufficient to read one of its multiple identifier structures. In another embodiment, it may be necessary to read multiple (e.g., two) identifier structures of the component carrier structure, for example to obtain sufficient information for the traceability of the component carrier structure.

[0030] In an embodiment, the first identifier structure and the second identifier structure are vertically and horizontally spaced apart from each other (see, for example Figure 1 or Figure 2) In the plan view of the component carrier structure, the first identifier structure and the second identifier structure can be simultaneously observed or detected by an optical reader device because there is a mutual lateral spacing between the first identifier and the second identifier that can be arranged not to overlap in the mentioned observation or detection direction. At the same time, the first identifier structure and the second identifier structure can be arranged at two different vertical height levels in the cross-sectional view. The latter design may be the result of forming different identifier structures at different layer structures of the stack of the component carrier structure. By taking this measure, layer structure-specific identifier structures can be created such that the process of manufacturing the individual layer structures of the component carrier structure can be reflected in the respectively specified identifier structures of the layer structures. Thus, traceability of the characteristics of the component carrier structure with respect to each individual layer structure of the stack or the build is possible during the manufacturing process.

[0031] In an embodiment, the first identifier structure and the second identifier structure are configured such that each of them can be optically read from the outside of the component carrier structure. In particular, the first identifier structure and the second identifier structure are configured such that each of them can be optically read simultaneously from the outside of the component carrier structure. For example, the first identifier structure and the second identifier structure can be configured to be optically exposed to the outside of the component carrier structure. For example, both the first identifier structure and the second identifier structure can be read from the outside of the component carrier structure through openings provided in one or more outer layers of the component carrier structure, such that even identifier structures located deeper inside the stack can be optically read by an optical reader device. Very advantageously, identifier structures separated from the outer surface of the stack by an electrically insulating layer structure (such as a resin layer or a prepreg layer) can also be read. This may be due to the excellent contrast of the central code region in view of its electrically conductive material part and in view of the simplified detection due to the frame structure. With the described configuration, two (or more) identifier structures can be read simultaneously. This can make a favorable contribution to the successive formation of layer structure-specific identifier structures that can be correlated with another previously formed layer structure-specific identifier structure.

[0032] In an embodiment, the component carrier structure includes a third identifier structure which is arranged deeper in the stack in the stack thickness direction than the first identifier structure and the second identifier structure, such that the third identifier structure cannot be optically read from the outside of the component carrier, in particular not simultaneously with the first identifier structure and / or the second identifier structure. Herein, the term "deeper" can represent the fact that, compared to the first identifier structure and the second identifier, the third identifier structure has a greater vertical distance from the main surface of the stack from which the identifier structures are optically read. For example, the first identifier structure can be arranged at the outer main surface of the stack, and the second identifier structure can be arranged within the stack, but at a shallower position within the stack than the third identifier structure which is located deeper within the stack. Due to the greater vertical depth of the third identifier structure within the stack and / or due to the greater lateral displacement of the third identifier structure relative to the first identifier structure and the second identifier structure (which may cause other stack structures to shield the third identifier structure), the third identifier structure may not be optically readable from the outside of the component carrier structure (see, for example Figure 1 or Figure 2 ). This may be, for example, due to the fact that the depth of the third identifier structure is so large that sufficient contrast of the deeply buried third identifier structure cannot be optically detected from the outside of the stack. This may also be due to the fact that an electrically conductive layer structure can be located between the outer main surface of the stack and the embedded third identifier structure. Optical detection cannot be performed through an optically opaque electrically conductive layer structure such as a copper foil.

[0033] In an embodiment, at least one electrically conductive layer structure includes a first electrically conductive layer structure and a second electrically conductive layer structure, and an electrically insulating layer structure of at least one electrically insulating layer structure is arranged between the first electrically conductive layer structure and the second electrically conductive layer structure. For example, the stack can include electrically conductive layer structures and electrically insulating layer structures in an alternating order (see, for example Figure 1 or Figure 2)。Each identifier structure in the identifier structure can be located inside the specified conductive layer structure or can form part of the specified conductive layer structure, in particular, it can be located in its recess (such as a via). More particularly, the corresponding identifier structure can be a patterned part of the specified conductive layer structure, and an opening can be provided beside the patterned part to allow the second identifier structure placed below to be read through the opening. In other words, the recess formed in the conductive layer structure can have a first segment in which the corresponding identifier structure is arranged, and can include a second empty segment that forms the opening in addition to the identifier structure. The opening allows an additional identifier structure located deeper inside the stack and laterally aligned with the second segment to be optically read. A code including information or encoded information (in particular, the central code region of the corresponding identifier structure) can be directly formed on or in the conductive layer structure, so that it can have a negative design (in particular, a central code region surrounded by a frame structure). The code or identifier structure can be formed in the same plane as the conductive layer structure, for example, not embedded in the conductive layer structure. The opening can be formed together with the current code or identifier structure and can be used to identify or read the internal code or identifier structure. In addition, the opening can be larger than the internal code or identifier structure, so that there can be a lateral space between the current code or identifier structure and the internal code or identifier structure (see, for example Figure 4 )。

[0034] In an embodiment, an opening is provided at the first conductive layer structure, in particular, an opening is provided beside the first identifier structure in at least one identifier structure. More particularly, the recess of the first conductive layer structure can have a first segment filled with the first identifier structure and a second segment in which the aforementioned opening is formed. The opening can also be referred to as an optical detection opening because it can allow the optical detection of a second identifier structure that is laterally aligned with the opening and arranged deeper in the stack.

[0035] In an embodiment, an opening (such as an additional opening) is provided at the second conductive layer structure, in particular, an opening is provided beside the second identifier structure in at least one identifier structure. Therefore, the configuration of the second conductive layer structure including the opening and the second identifier structure can correspond to the configuration of the first conductive layer structure including the opening and the first identifier structure.

[0036] In an embodiment, the first identifier structure and the second identifier structure are laterally displaced relative to each other such that (in particular simultaneously) the first identifier structure can be optically read (in particular directly) from the outside of the component carrier structure and the second identifier structure can be optically read from the outside of the component carrier structure through an opening provided in the first conduction layer structure. Specifically, the reading of the second identifier structure can be performed by one of the at least one electrically insulating layer structures arranged between the first conduction layer structure and the second conduction layer structure. Thus, compared to the openings and identifier structures in the first conduction layer structure, the openings and identifier structures in the second conduction layer structure can be laterally displaced. This can enable the optical reading of two identifier structures at different vertical levels simultaneously by an optical reader device arranged outside the stack.

[0037] In an embodiment, the opening in the first conduction layer structure corresponds in size and / or position to the second identifier structure. In particular, the opening in the first conduction layer structure has the same size and the same lateral position as the second identifier structure (see Figure 2 ). More particularly, the geometric parameters (such as length and width) of the opening can be selected such that in a top view from outside the stack (and thus in the viewing direction of the optical reader device) the shape of the opening corresponds to the shape of the second identifier structure, which is vertically displaced relative to the opening and laterally aligned.

[0038] In another embodiment, the opening in the first conduction layer structure is larger than the second identifier structure (see Figure 1 ). In another embodiment, in a cross-sectional view as shown in Figure 1 , the opening can be separated by a deeper identifier structure.

[0039] In an embodiment, the at least one conduction layer structure includes a third conduction layer structure, wherein another of the at least one electrically insulating layer structures is arranged between the second conduction layer structure and the third conduction layer structure. Preferably, the at least one identifier structure can include a third identifier structure, which is arranged in and / or on the third conduction layer structure. In particular, the third identifier structure can be formed based on the third conduction layer structure, for example, it can be formed as an integrated part of the third conduction layer structure and additional electrically insulating material (such as from an adjacent electrically insulating layer structure).

[0040] In an embodiment, an opening is provided at the third conduction layer structure, in particular an opening is provided next to the third identifier structure. Preferably, the opening in the second conduction layer structure may correspond to the size and / or position of the third identifier structure. In particular, the opening in the second conduction layer structure has the same size and the same lateral position as the third identifier structure (see Figure 2 ). In an embodiment, the opening may have a size larger than the third identifier structure (see Figure 1 ), or may have the same size (see Figure 2 ).

[0041] In an embodiment, at least one conduction layer structure includes a fourth conduction layer structure, wherein at least one identifier structure includes a fourth identifier structure, the fourth identifier structure is arranged in and / or on the fourth conduction layer structure, and wherein the fourth identifier structure is arranged in a recess of the fourth conduction layer structure, in particular no opening is left next to the fourth identifier structure in the fourth conduction layer structure. In particular, the fourth identifier structure may be formed based on the fourth conduction layer structure, for example, may be formed as an integrated part of the fourth conduction layer structure and an additional electrical insulating material (such as from an adjacent electrical insulating layer structure). If the fourth conduction layer structure is the innermost conduction layer structure including the identifier structure (such as Figure 2 ), then no opening needs to be provided in the fourth conduction layer structure for the purpose of optical reading. Such omission of the opening in the innermost conduction layer structure having the identifier structure can keep the amount of unfilled volume inside the stack small, which can result in appropriate mechanical integrity.

[0042] In an embodiment, at least one conduction layer structure (in particular a plurality of conduction layer structures) arranged under each of the at least one identifier structure is configured as a continuous metal layer (see specifically Figure 2 ). This can increase the metal content of the stack and can reduce the empty or void volume inside the stack. This can have a positive impact on the mechanical stability and integrity of the component carrier structure, in particular can suppress undesirable phenomena such as warping and / or delamination.

[0043] In an embodiment, the component carrier structure includes a panel, an array or a component carrier, such as a printed circuit board or an integrated circuit substrate. Thus, the component carrier structure (which may be a semi-finished product) can be selected from: a panel for manufacturing a plurality of component carriers and an array forming a part of the panel for manufacturing a plurality of component carriers. Such a component carrier structure can be a planar body (such as a panel or an array) of a plurality of component carriers or pre-forms thereof (such as semi-finished products obtained during the manufacture of component carriers individually or in a batch process).

[0044] In one embodiment, a component is embedded in a stack. In the context of the present application, the term "embedded component" may specifically denote a component that is partially or fully disposed inside the stack. This can be achieved by circumferentially surrounding the component entirely with stack material. However, this can also be accomplished by inserting the component into a recess or cavity of the stack while the upper main surface and / or sidewall portion of the component may extend partially or fully out of the stack. In another embodiment, the component is surface-mounted on the stack.

[0045] In an embodiment, at least one identifier structure is a patterned portion of at least one electrically conductive layer structure of the stack. This can have the advantage that the identifier structure can be constructed in a stack-type component carrier that further includes an electrically conductive layer structure in an easier and more reliable manner. Advantageously, at least one identifier structure can be formed during the process of manufacturing a component carrier based on the stack, in particular by correspondingly processing one or more electrically conductive layer structures of the stack such that the patterned at least one electrically conductive layer structure includes information or a link to the information (e.g., a link to a data set in a database, where the link and the data set are assigned to the component carrier structure or a part thereof). For example, the copper foil of the stack can be patterned in the surface area of the panel to form a data matrix or a QR code. Then, such a data matrix or QR code can be optically read during the manufacturing process so that, for example, defective and non-defective preforms can be identified by the manufacturing device. Then, the manufacturing device can use the detected information to correspondingly adjust the further manufacturing process, in particular to continue the manufacturing process only for the preforms classified as non-defective, while the manufacturing process may not be continued for the defective preforms.

[0046] In an embodiment, at least two identifier structures are arranged at different vertical levels of the stack and preferably laterally displaced such that they do not overlap in the plan view on the stack. When different identifier structures are formed at different height levels of the stack (i.e., in different layer structures), each layer portion of the identifier structure can include information about the corresponding manufacturing process performed at the level of the specified layer structure. For example, defect information can also be stored in a layer-dependent manner in such a multi-layer identifier structure system to further refine the information about the nature of the defects of the individual preforms and their manufacturing history. When the vertically adjacent identifier structures are laterally displaced relative to each other, the two identifier structures can be read simultaneously, one identifier structure being exposed and related to the layer of the stack currently being processed, while the resin-covered identifier structure is related to the previously processed hidden layer. This allows linking the subsequently formed identifier structure and the layer of the stack subsequently processed.

[0047] In an embodiment, at least one identifier structure is disposed more externally along the stack-up thickness relative to a stack-up main surface than another identifier structure, and the external identifier structure carries information of the other identifier structure. In particular, the other identifier structure may be at least partially overlapped by a conductive layer. If information cannot be read from a hidden identifier structure, the information carried thereby can be obtained through another more external or more accessible identifier structure. The external identifier structure is not overlapped by an electrically conductive layer and can thus be read by a reader device.

[0048] In an embodiment, the method includes reading information from and / or writing information to at least one identifier structure during at least one process in the group consisting of an automated optical inspection (AOI) process, an automated optical shaping (AOS) process, and a verification and repair (VRS) process. For example, when a defect monitoring process has been performed and a preform of a component carrier of a component carrier structure has been classified as defective or non-defective, and if "yes" has been optionally assigned to one of a plurality of different defect types, the defect information can be written to an identifier structure of the component carrier structure itself, and / or the defect information can be written to a specified data set. This allows obtaining a physical connection between the defect information structure and the preform of the component carrier while allowing the defect information to be processed simultaneously based on electronic data rather than by physically marking the individual preforms as defective.

[0049] In an embodiment, the method includes: tracking a component carrier structure and / or an individual component carrier being manufactured based on information related to at least one identifier structure. In the context of the present application, the term "tracking or tracing a component carrier or a component carrier structure" may particularly denote an opportunity for a tracking system that is capable of analyzing a component carrier or a component carrier structure with respect to an assigned identifier structure, thereby allowing the identification of the component carrier or the component carrier structure, and / or allowing the association of the component carrier or the component carrier structure with a specific manufacturing batch or lot (e.g., for determining a lot number) and / or a manufacturing location, a manufacturing process (e.g., a specific customer order), a time (e.g., a date), or an issue (e.g., a quality issue determined during product testing). By associating the identity of an individual preform or a component carrier structure with a preform of a component carrier having an identifier structure physically connected thereto, the identity can be assigned to a corresponding data set stored in a remote database. As the manufacturing process of the component carrier by processing the preform of the component carrier structure further progresses, the data set in the database can be continuously updated. Thus, the manufacturing history of each individual component carrier or its preform can be derived from the specified data set stored in the database, and is accessible by the identifier structure and forms part of the specified data set in the database. Then, each individual component carrier can be traced back during its entire manufacturing process.

[0050] In an embodiment, the method further includes a reading step, in which at least one optical reader device obtains information of one of the preforms of the component carrier from at least one identifier structure of the component carrier structure. For example, the optical reader device may include an optical camera that can detect an image in a specified wavelength range (e.g., a wavelength range including visible light, a wavelength range including ultraviolet light, and / or a wavelength range including infrared light). The reading step may include: providing at least one optical reader device associated with a main surface of a stack, the optical reader device being configured to obtain information of at least one closest identifier structure, preferably at least two identifier structures. When a plurality of identifier structures are formed in the stack, the reader arranged beside a main surface of the stack can read information from the identifier structure positioned closest to the main surface.

[0051] In an embodiment, the component carrier structure comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier can be a laminate of the mentioned electrically insulating layer structure and electrically conductive layer structure, in particular a laminate formed by applying mechanical pressure and / or thermal energy. The mentioned stack can provide a plate-shaped component carrier which can provide a large mounting surface for further components and yet is very thin and compact overall. The term "layer structure" can in particular denote a continuous layer, a patterned layer or a plurality of non-continuous islands in a common plane.

[0052] In an embodiment, the component carrier structure is shaped as a plate. This contributes to a compact design, in which the component carrier still provides a large basis for mounting components thereon. Furthermore, in particular, bare chips, as an example of embedded electronic components, can be conveniently embedded in thin sheet-like components such as printed circuit boards due to their small thickness.

[0053] In an embodiment, the component carrier or its preform is configured as one of a printed circuit board, a substrate (in particular an IC substrate), and an interposer.

[0054] In the context of the present application, the term "printed circuit board" (PCB) can in particular denote a plate-shaped component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example by applying pressure and / or providing thermal energy. As a preferred material for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures can comprise a resin and / or glass fibres, i.e. so-called prepregs or FR4 materials. The various electrically conductive layer structures can be connected to one another in a desired manner by: forming holes through the laminate, for example by laser drilling or mechanical drilling, and partially or completely filling the holes with an electrically conductive material (in particular copper), thereby forming via connections such as vias. In addition to one or more components that can be embedded in the printed circuit board, the printed circuit board is generally configured to accommodate one or more components on one or both opposite surfaces of the plate-shaped printed circuit board. They can be connected to the respective main surfaces by soldering. The dielectric part of the PCB can consist of a resin with reinforcing fibres (such as glass fibres).

[0055] In the context of the present application, the term "substrate" may specifically denote a component carrier. The substrate may be a relatively small component carrier associated with a PCB, on which one or more components may be mounted and which may act as a connection medium between one or more chips and another PCB. For example, the substrate may have substantially the same size as the component (in particular an electronic component) to be mounted thereon (e.g. in the case of a chip scale package (CSP)). More particularly, the substrate may be understood as a carrier for electrical connections or electrical networks and a component carrier comparable to a printed circuit board (PCB), but having a considerably high density of laterally and / or vertically arranged connection elements. The lateral connection elements are, for example, electrically conductive paths, while the vertical connection elements may be, for example, drilled holes. These lateral and / or vertical connection elements are arranged within the substrate and may be used to provide electrical, thermal and / or mechanical connections for components with a housing or without a housing (such as bare dies), in particular IC chips, to the printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrates". The dielectric part of the substrate may consist of a resin with reinforcing particles (such as reinforcing spheres, in particular glass spheres).

[0056] The substrate or the interposer may include or consist of layers of at least the following materials: glass, silicon (Si), or photoimageable or dry-etchable organic materials, such as epoxy-based laminate materials (such as epoxy-based laminate films) or polymer compounds such as polyimide, polybenzoxazole or benzocyclobutene-functionalized polymers.

[0057] In an embodiment, at least one electrically insulating layer structure includes at least one of the following: resin (such as reinforced or non-reinforced resin, such as epoxy resin or bismaleimide-triazine resin), cyanate resin, polyphenylene derivatives, glass (in particular glass fibers, multi-layer glass, glass-like materials), prepreg materials (such as FR-4 or FR-5), polyimide, polyamide, liquid crystal polymer (LCP), epoxy-based laminate film, polytetrafluoroethylene (PTFE, Teflon), ceramics and metal oxides. Reinforcing structures, such as meshes, fibers or spheres, made of glass (multi-layer glass) may also be used, for example. Although prepregs, in particular FR4, are usually preferred for rigid PCBs, other materials, in particular epoxy-based laminate films or photoimageable dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymer and / or cyanate resin, low-temperature co-fired ceramics (LTCC) or other low, very low or ultra-low DK materials may be applied in the component carrier as the electrically insulating layer structure.

[0058] In an embodiment, at least one electrically conductive layer structure comprises at least one of the following substances: copper, aluminum, nickel, silver, gold, palladium, and tungsten. Although copper is generally preferred, other materials or their coated versions are also possible, especially when coated with a superconducting material such as graphene.

[0059] At least one component that can be embedded in the stack can be selected from the following: a non-electrically conductive inlay (such as a ceramic inlay, preferably including aluminum nitride (AlN)), an electrically conductive inlay (such as a metal inlay, preferably including copper or aluminum), a heat transfer unit (such as a heat pipe), an optical waveguide element (such as an optical waveguide or an optical conductor connection), an optical element (such as a lens), an electronic component, or a combination thereof. For example, the component can be an active electronic component, a passive electronic component, an electronic chip, a storage device (such as a DRAM or other data memory), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light-emitting diode, an optocoupler, a voltage converter (such as a DC / DC converter or an AC / DC converter), a cryptographic component, a transmitter and / or receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components can be embedded in the component carrier. For example, a magnetic element can be used as the component. Such a magnetic element can be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element, a multiferroic element, or a ferrimagnetic element, such as a ferrite core) or can be a paramagnetic element. However, the component can also be a substrate, an interposer, or another component carrier, for example, in a board-in-board configuration. The component can be surface-mounted on the component carrier and / or can be embedded inside the component carrier. In addition, other components can also be used as the component.

[0060] In an embodiment, the component carrier is a laminated component carrier. In such an embodiment, the component carrier is a composite of a multilayer structure that is stacked and connected together by applying a pressing force and / or heat.

[0061] After processing the internal layer structure of the component carrier, one or more additional electrically insulating layer structures and / or electrically conductive layer structures can be used to symmetrically or asymmetrically cover (especially by lamination) one or both opposite main surfaces of the processed layer structure. In other words, the lamination can continue until the desired number of layers is obtained.

[0062] After completing the formation of the stack of the electrically insulating layer structure and the electrically conductive layer structure, the obtained layer structure or the component carrier can be surface-treated.

[0063] Specifically, with respect to surface treatment, an electrically insulating solder resist can be applied to one or both opposing major surfaces of a laminate or component carrier. For example, such a solder resist can be formed over the entire major surface, and the solder resist layer can then be patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to the electronic peripheral. This effectively protects the surface portions of the component carrier still covered with solder resist, particularly those containing copper, from oxidation or corrosion.

[0064] As far as surface treatment is concerned, the exposed electrically conductive surface portions of the component carrier can also be selectively surface modified. Such surface modification can be an electrically conductive covering material on the exposed electrically conductive layer structures (such as solder pads, conductive traces, etc., in particular solder pads, conductive traces, etc. comprising or consisting of copper) on the surface of the component carrier. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material (in particular copper) may be oxidized, making the component carrier less reliable. The surface modification can then be formed, for example as an interface between a surface-mounted component and the component carrier. The surface modification has the function of protecting the exposed electrically conductive layer structure (in particular copper circuitry) and enabling a connection process with one or more components (for example by soldering). Examples of suitable materials for surface modification are organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), gold (in particular hard gold), chemical tin, nickel gold, nickel palladium, electroless nickel immersion palladium immersion gold (ENIPIG), etc.

[0065] The aspects defined above and further aspects of the present invention are apparent from the examples of embodiment described hereinafter and are explained with reference to these examples of embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 A cross-section and a layer-by-layer plan view of a component carrier structure with an identifier structure according to an exemplary embodiment of the present invention are shown.

[0067] Figure 2 A cross section of a component carrier structure with an identifier structure according to an exemplary embodiment of the present invention and a plan view of the identifier structure are shown.

[0068] Figure 3 A section of a component carrier structure with an identifier structure according to an exemplary embodiment of the present invention is shown.

[0069] Figure 4 A section of a component carrier structure with an identifier structure according to an exemplary embodiment of the present invention is shown. DETAILED DESCRIPTION

[0070] The illustrations in the drawings are schematic. In different drawings, similar or identical elements are provided with the same reference signs.

[0071] Before referring to the drawings, the exemplary embodiments will be described in more detail, and some basic considerations will be summarized based on the exemplary embodiments in which the present invention has been developed.

[0072] According to an exemplary embodiment of the present invention, a component carrier structure (e.g., a panel of a printed circuit board preform) can be formed by a stack-up, with which at least one identifier structure can be provided. An optically readable pattern of electrically conductive material and electrically insulating material (preferably a stack-up material per se) can constitute one or more identifier structures. The one or more identifier structures can be optically read by an optical reader (e.g., a camera) to determine information characterizing, describing, and / or identifying at least a part of the component carrier structure. When the patterns of electrically conductive and electrically insulating materials constituting the identifier structure are stack-up materials, the manufacturing process can be particularly simple. The identifier structure can include an internal code region (e.g., a pattern of electrically conductive material and electrically insulating material encoding actual identifier information) and an outer frame structure arranged around the internal code region or a part thereof. Advantageously, the frame structure can simplify the optical detection of the identifier by the optical reader, since this can make it easier and more precise to determine the position and extent of the identifier structure to be detected and decoded. The surrounding frame structure, especially when the nature of the optical reader device is known in advance, can allow the optical reader device to precisely locate the frame structure. On this basis, the reader device can easily and accurately determine the position of the information-carrying central code region inside the identified frame structure. Then, the information encoded in the central code region can be accurately obtained. Therefore, the accuracy of decoding the encoded information from the identifier structure can be increased. This can bring significant advantages especially for technical applications of the identification or characterization of the component carrier structure or a part thereof. For example, the optical detection performed by the optical reader device may have to be carried out through a surface part of the stack-up, which may cause limited profile or contrast. Therefore, the frame structure with increased accuracy can provide a significant improvement in the identification of the component carrier structure based on (e.g., embedded) identifier structures. Therefore, the identifier structure can be provided with an outer frame structure formed around the outer periphery of the internal code region and thus can be provided with a negative identifier structure (such as a negative data matrix or a negative QR code).

[0073] According to an exemplary embodiment, an identifier structure for a component carrier structure (e.g., a two-dimensional identifier structure such as a QR code) is provided, which can be applied to different materials and processes. The exemplary embodiment can advantageously avoid uneven thickness at the panel edges and in the center of the panel due to insufficient resin filling of the component carrier structure. This can be achieved by reducing the voids inside the component carrier structure. Thus, exemplary embodiments of the present invention can improve processing capabilities. In addition, the problem of air bubbles on the cover can be suppressed or even avoided. In addition, the identifier structure concept of the exemplary embodiment of the present invention can reduce waste and can increase the yield of component carrier manufacturing. The manufacturing concept is applicable to different materials without the problem of compression losses.

[0074] For example, exemplary embodiments of the present invention can form a full copper layer or nearly full copper layer with a negative two-dimensional identifier structure (specifically embodied as a data matrix or QR code), which can be arranged in a layer stack so that bubble problems caused by low resin content of prepreg materials, etc. can be avoided.

[0075] Advantageously, exemplary embodiments of the present invention are compatible with various materials and component carrier designs. Furthermore, when the panels are electroplated, compression loss and current balance issues may not be a concern. Furthermore, there are no noticeable uneven panel shapes at the panel edges. Furthermore, the manufacturing method is simple and does not require a high level of labor.

[0076] Furthermore, it has been found that identifier structures formed based on a data matrix design can be more stable than other codes, can contain more symbols than other codes, and can also have better error correction capabilities than other types of codes.

[0077] Furthermore, the manufacturing architecture according to exemplary embodiments of the present invention may also be compatible with mSAP (modified semi-additive processing) or HDI (high density integration) processes.

[0078] In order to achieve the traceability function of the component carrier structure, one or more identifier structures may preferably be formed on the edge of the panel.The center of the panel may be used to manufacture a component carrier, such as a printed circuit board.

[0079] For example, exemplary embodiments of the present invention can change the laminate design in a laminate stack from a hollow core design to a fully copper-clad design. This can avoid air bubbles caused by insufficient glue potting. The identifier structure design of the component carrier structure of exemplary embodiments of the present invention is compatible with conventional optical reader devices.

[0080] Figure 1Shows a cross-section and a layer-by-layer plan view of a component carrier structure 100 having identifier structures 114 to 118 according to an exemplary embodiment of the present invention. More specifically, Figure 1 The upper part of shows a plan view of different electrically conductive layer structures 104 to 108 having one or more designated identifier structures 114 to 118. For each individual electrically conductive layer structure 104 to 108, an identifier structure 160 of the shown electrically conductive layer structures 104 to 108 and additional identifier structures 162 of the electrically conductive layer structures 104 to 108 below the current identifier structure are shown. In Figure 1 On the right side of, a plan view showing the detailed construction of one of the identifier structures 114 to 118 is shown. In Figure 1 On the bottom side of, a cross-sectional view of the component carrier structure 100 is shown.

[0081] In the shown embodiment, the component carrier structure 100 can be embodied as a panel for manufacturing a plurality of component carriers, such as a printed circuit board (PCB). However, the component carrier can also be an integrated circuit (IC) substrate, etc. In addition, Figure 1 The cross-sectional view of can show a part of the component carrier structure 100 or the entire component carrier structure 100. For example, Figure 1 can be an embodiment that only shows the edge part of the panel-type component carrier structure 100, i.e., without an actual component carrier. Such a panel edge region can include identifier structures 114 to 118, and the identifier structures 114 to 118 can be used to identify the component carrier structure 100 as a whole or its individual component carriers, wherein the identifier structures 114 to 118 can be arranged in the central part of the panel and are Figure 1 not shown in.

[0082] Figure 1 The shown section of the component carrier structure 100 and / or its individual component carriers can include a laminated stack 102, and the laminated stack 102 includes a plurality of electrically conductive layer structures 104 to 108 and a plurality of electrically insulating layer structures 110 to 113. Figure 1 The stack 102 of can include layers and vias in a stacked structure. In particular, it is possible to provide a stack 102 that is implemented as having a core in the stack.

[0083] The conductive layer structures 104 to 108 may include complete and / or patterned copper layers, which may form horizontal pads and / or horizontal wiring structures as well as reinforcement regions. Additionally, the conductive layer structures 104 to 108 may include vertical through-connections, such as copper pillars and / or copper-filled laser vias. Additionally or alternatively, mechanically plated through-holes (PTHs) may also be used as vertical through-connections. Furthermore, the stack 102 may include one or more electrical insulation layer structures 110 to 113 (such as one or more prepreg sheets, resin sheets, or cores made of FR4). Ajinomoto (ABF) materials may also be used for at least a portion of the electrical insulation layer structures 110 to 113, particularly when manufacturing a component carrier implemented as an IC substrate. Additionally, a surface treatment (such as ENIG or ENEPIG, etc.) may optionally be applied on the top side and / or bottom side of the stack 102 (not shown).

[0084] In addition to the component carrier structure 100, Figure 1 a plan view of the corresponding identifier structures 114 to 118 is also shown. Furthermore, Figure 1 a plan view of the various conductive layer structures 104 to 108 of the stack 102 corresponding to the identifier structures 114 to 118 is shown. Furthermore, Figure 1 an optical reader device 150 is shown, the optical reader device 150 including an optical detector for detecting optical data (such as a camera, such as a CMOS camera or a CCD camera) and a control unit 154 for controlling the operation of the optical reader device 150 and for processing the detected optical signals (which may include a processor). For example, the optical signals may be processed by the control unit 154 to decode the information encoded in the detected identifier structures 114 to 118. The optical reader device 150 may be movable, as Figure 1 indicated by the double arrow in

[0085] As shown, Figure 1 the stack 102 of the component carrier structure 100 has conductive layer structures 104 to 108 and electrical insulation layer structures 110 to 113 in an alternating order between the lower main surface 156 and the upper main surface 158. Also as shown, a plurality of identifier structures 114 to 118 are arranged in and on the stack 102.

[0086] Now referring to as Figure 1An enlarged detail of one of the identifier structures 114 to 118 shown on the right, each of the identifier structures 114 to 118 including a central code region 120 having an electrically conductive material (such as copper) and an electrically insulating material (such as resin and / or glass), the electrically conductive material and the electrically insulating material encoding optically readable information for the corresponding identifier structures 114 to 118. Such optically readable information can be read and processed by an optical reader device 150. As shown, each of the identifier structures 114 to 118 also includes a metallic rectangular annular frame structure 122 that completely surrounds the central code region 120. Thus, Figure 1 the frame structure 122 of Figure 1 extends around the entire perimeter of the central code region 120. Alternatively, the frame structure 122 only extends around three of the four edges of the central code region 120. In the illustrated embodiment, the central code region 120 is a data matrix pattern formed of a component carrier material. Alternatively, the central code region 120 can be a QR code. It has been found that the optical reader device 150 can more easily read the central code region 120 when the central code region 120 is surrounded by the metallic annular frame structure 122. This is especially true when reading, for example, the identifier structure 115 that is separated from the optical reader device 150 by the electrically insulating layer structure 110. In addition to the central code region 120, the frame structure 122 can also be used to achieve better contrast, and automatic image processing can be performed in a more reliable manner in the presence of the frame structure 122.

[0087] As Figure 1Only schematically indicated by dashed lines, any one of the identifier structures 114 to 118 may optionally include an additional structure 124, which is separated from the frame structure 122 and from the central code region 120, and which has an additional color different from the frame structure 122 and / or the central code region 120 and / or is made of an additional material different from the frame structure 122 and / or the central code region 120. For example, the additional structure 124 is made of ink or of an additional metal (such as aluminum or nickel) different from the metal (such as copper) of the frame structure 122. As shown, the additional structure 124 may be an additional frame structure completely surrounding the frame structure 122. By such an additional structure 124 of the respective identifier structures 114 to 118, additional information can be encoded in the identifier structures 114 to 118, especially when the additional structure 124 has an additional color different from the frame structure 122 and / or the central code region 120 and / or is made of an additional material different from the frame structure 122 and / or the central code region 120. Such a color pattern can be detected by the optical reader device 150 and can be processed to decode the information encoded in the respective identifier structures 114 to 118. When optically detected and processed by the optical reader device 150, the information encoded by the central code region 120 can be decoded so that the optical reader device 150 or the user can identify and / or track the component carrier structure 100 by optically reading the information from the central code region 120. When also carrying encoded information, the additional structure 124 can also contribute to this purpose.

[0088] Now referring again to Figure 1 the cross-sectional view of, the central code regions 120 and the frame structures 122 of the respective identifier structures 114 to 118 may preferably be formed integrally with the stack 102. In other words, the central code region 120 and the designated frame structure 122 may form part of the conductive layer structures 104 to 108 and the electrically insulating layer structures 110 to 113. Thus, the metallic material of the frame structure 122 and the conductive material of the central code region 120 may be the metallic material of the conductive layer structures 104 to 108, while the electrically insulating material of the central code region 120 may be a resin or prepreg material of the electrically insulating layer structures 110 to 113. More precisely, each of the identifier structures 114 to 117 may include a metal pattern of one of the designated ones of the conductive layer structures 104 to 108.

[0089] Still referring particularly to Figure 1Cross-sectional view in which a first identifier structure 114 is arranged in a first electrically conductive layer structure 104, a second identifier structure 115 is arranged in a second electrically conductive layer structure 105, a third identifier structure 116 is arranged in a third electrically conductive layer structure 106, a fourth identifier structure 117 is arranged in a fourth electrically conductive layer structure 107, and a fifth identifier structure 118 is arranged in a fifth electrically conductive layer structure 108. Any other number of identifier structures 114 to 118 is possible. Each of the identifier structures 114 to 118 is arranged in a respective recess of the designated electrically conductive layer structures 104 to 108. At the bottom side of the stack 102, a patterned electrically conductive layer structure 108 is formed that has recesses but no identifier structures 114 to 118. As shown, the identifier structures 114 to 118 are arranged in a staggered manner in the respective recesses. Between each pair of adjacent electrically conductive layer structures 104 to 108, a respective prepreg layer or resin layer is sandwiched, thereby forming respective electrically insulating layer structures 110 to 113.

[0090] As shown, the first identifier structure 114 and the second identifier structure 115 are vertically and laterally spaced apart from each other. Correspondingly, the second identifier structure 115 and the third identifier structure 116 are vertically and laterally spaced apart from each other, and so on. In view of this arrangement, the first identifier structure 114 and the second identifier structure 115 - i.e., the two closest to the upper main surface 158 of the stack 102 among the identifier structures 114 to 118 - are configured such that each of them can be optically read simultaneously, for example, from the outside of the component carrier structure 100. This is due to the fact that the first identifier structure 114 is located at the upper main surface 158 of the stack 102 and can thus be directly optically detected by the optical reader device 150. In addition, with respect to the optical reader device 150, the second identifier structure 115 is neither shielded by the electrically conductive layer structure 104 at a higher position (due to the corresponding aligned opening in the electrically conductive layer structure 104) nor shielded by the optically higher identifier 114 (due to the mutual lateral displacement between the identifier structures 114, 115). Therefore, the second identifier structure 115 can be read by the optical reader device 150 together with the first identifier structure 114 because only a resin or prepreg layer in the form of the electrically insulating layer structure 110 is arranged between the optical reader device 150 and the second identifier structure 115. The electrically insulating layer structure 110 is optically transparent enough to allow optical detection of the second identifier structure 115 through the electrically insulating layer structure 110.

[0091] However, the third identifier structure 116 is arranged deeper in the stack 102 than the first identifier structure 114 and the second identifier structure 115 and is shielded from the optical reader device 150 by the electrically conductive layer structure 104 and the second identifier structure 115 (seeFigure 1 )。Therefore, the third identifier structure 116 cannot be optically read simultaneously with the first identifier structure 114 and the second identifier structure 115 from the outside of the component carrier structure 100. However, before the formation of the first identifier structure 114, the electrically conductive layer structure 104, and the uppermost electrically insulating layer structure 110, the second identifier structure 115 and the third identifier structure 116 can already be read simultaneously by the optical reader device 150. Therefore, during the layer-by-layer formation of the laminated stack 102, it is always possible to simultaneously read the two uppermost identifier structures, i.e., the two identifier structures closest to the upper main surface 158 of the stack 102.

[0092] Advantageously, providing negative codes of the identifier structures 114 to 118, i.e., the respective central code regions 120 surrounded by the full-circumference frame structures 122, can enable the identifier structures 114 to 118 of the data matrix pattern type or QR code type to be easily read by the optical reader device 150. First, the metal frame structure 122 having a characteristic shape that can also be predefined can simplify the recognition of the identifier structures 114 to 118 on the optically detected image. In addition, providing the metal frame structure 122 (which can be formed as a mixture of metal points and insulating points) surrounding the central code region 120 can significantly improve the optical readability by enhancing the obtained contrast. Such a negative or reverse identifier structure 115 is particularly advantageous when the identifier structure (see, for example, reference numeral 115) inside the stack 102 is optically read by the optical reader device 150 arranged at the upper main surface 158 of the component carrier structure 100 through the resin or prepreg layer in the form of the first electrically insulating layer structure 110. Therefore, especially when two identifier structures 114, 115 arranged at different vertical levels of the stack 102 should be optically read simultaneously, such negative codes or reverse codes can have the greatest advantage.

[0093] Figure 2 A cross-section of a component carrier structure 100 having identifier structures 114 to 117 according to another exemplary embodiment of the present invention is shown, as well as a plan view of an exemplary one of the identifier structures 114 to 117. In Figure 2 On the right side, a plan view showing the detailed construction of one of the multiple identifier structures 114 to 117 of the component carrier structure 100 is shown. Figure 2 The identifier structures 114 to 117 of Figure 1 can be implemented as shown and described, where the optional additional structure 124 is omitted in Figure 2 . At the bottom side of Figure 2 , a cross-sectional view of the component carrier structure 100 is shown. Next, the embodiment of Figure 2 will be mainly described in connection withFigure 1 Differences between embodiments.

[0094] Similarly, Figure 2 The stack 102 of the component carrier structure 100 has electrically conductive layer structures 104 to 108 and electrically insulating layer structures 110 to 113 in an alternating order. Four identifier structures 114 to 117 are formed in some of the electrically conductive layer structures 104 to 108, where any other number of identifier structures is possible.

[0095] The first identifier structure 114 is arranged in the first electrically conductive layer structure 104, the second identifier structure 115 is arranged in the second electrically conductive layer structure 105, the third identifier structure 116 is arranged in the third electrically conductive layer structure 106, and the fourth identifier structure 117 is arranged in the fourth electrically conductive layer structure 107. At the bottom side of the stack 102, a continuous or complete electrically conductive layer structure 108 is formed without openings and without the identifier structures 114 to 117. The identifier structures 114 to 117 are arranged in a staggered manner in the recesses of the electrically conductive layer structures 104 to 107. Between adjacent electrically conductive layer structures 104 to 108, a prepreg layer or a resin-only layer is sandwiched, thereby forming the corresponding electrically insulating layer structures 110 to 113.

[0096] As shown, the first identifier structure 114 and the second identifier structure 115 are vertically and laterally spaced apart from each other, the second identifier structure 115 and the third identifier structure 116 are vertically and laterally spaced apart from each other, and the third identifier structure 116 and the fourth identifier structure 117 are vertically and laterally spaced apart from each other.

[0097] Given the geometry shown, the first identifier structure 114 and the second identifier structure 115 are configured such that each of them can be optically read simultaneously by an optical reader device 150 from the outside of the component carrier structure 100. However, the third identifier structure 116 is shielded by the electrically conductive layer structure 104 and the second identifier structure 115 relative to the optical reader device 150 and thus cannot be optically read from the outside of the component carrier structure 100. For corresponding reasons, the fourth identifier structure 117 also cannot be optically read by the optical reader device 150 facing the upper main surface 158 of the stack 102.

[0098] As Figure 2As shown, an opening 128 is provided at or in the first conduction layer structure 104 next to the first identifier structure 114. The opening 128 may be integrally formed in the first conduction layer structure 104. The first identifier structure 114 is arranged in the first conduction layer structure 104 adjacent to the opening 128 of the first conduction layer structure 104. More specifically, one sidewall of the first identifier structure 114 faces the opening 128, while the opposite sidewall of the first identifier structure 114 is in direct contact or connection with the first conduction layer structure 104. Correspondingly, an opening 130 is provided at or in the second conduction layer structure 105 next to the second identifier structure 115. The opening 130 may be integrally formed in the second conduction layer structure 105. The second identifier structure 115 is arranged in the second conduction layer structure 105 adjacent to the opening 130 of the second conduction layer structure 105. More specifically, one sidewall of the second identifier structure 115 faces the opening 130, while the opposite sidewall of the second identifier structure 115 is in direct contact or connection with the second conduction layer structure 105. As shown, the first identifier structure 114 and the second identifier structure 115 are laterally displaced relative to each other such that both the first identifier structure 114 and the second identifier structure 115 can be optically read from the outside of the component carrier structure 100 through the opening 128. The opening 128 in the first conduction layer structure 104 has the same size as the second identifier structure 115 and has the same horizontal position. Thus, the opening 128 in the first conduction layer structure 104 not filled by the first identifier structure 114 corresponds to the size and position of the second identifier structure 115.

[0099] An electrically insulating layer structure 111 is arranged between the second conduction layer structure 105 and the third conduction layer structure 106. A third identifier structure 116 is arranged in the third conduction layer structure 106 and is preferably integrally formed with the third conduction layer structure 106. An opening 132 is provided in the third conduction layer structure 106 next to the third identifier structure 116. The third identifier structure 116 is arranged in the third conduction layer structure 106 adjacent to the opening 132 of the third conduction layer structure 106. More specifically, one sidewall of the third identifier structure 116 faces the opening 132, while the opposite sidewall of the third identifier structure 116 is in direct contact or connection with the third conduction layer structure 106. The opening 130 in the second conduction layer structure 105 has the same size as the third identifier structure 116 and has the same horizontal position. The opening 130 in the second conduction layer structure 105 not filled by the second identifier structure 115 corresponds to the size and position of the third identifier structure 116.

[0100] The fourth identifier structure 117 is arranged in the fourth electrically conductive layer structure 107. The lowermost fourth identifier structure 117 is arranged in the recess 134 of the fourth electrically conductive layer structure 107 without leaving an opening beside the fourth identifier structure 117. The fourth identifier structure 117 fills the entire recess 134 of the fourth electrically conductive layer structure 107.

[0101] As Figure 2 shown, the openings 128, 130, 132 are staggered in the same manner as the identifier structures 114 to 117. Preferably, the width W of each of the openings 128, 130, 132 substantially corresponds to the width D of the respective underlying identifier structures 115 to 117. For example, the respective width W can be no more than 1 mm, preferably no more than 0.5 mm, greater than the respective width D. For example, the width W and / or the width D can be in the range of 2 mm to 10 mm, preferably in the range of 3 mm to 6 mm.

[0102] A plurality of electrically conductive layer structures 108 arranged below each of the identifier structures 114 to 117 are configured as continuous metal layers.

[0103] Figure 2 The embodiments of Figure 1 provide a further improvement over the embodiments of Figure 2 The embodiments of Figure 2 are suitably compatible with different materials. Since Figure 2 the copper window openings in Figure 2 are very small, no bubble problems occur even when using very thin prepreg sheets with a low resin material content. Since Figure 2 there are no large hollow areas in the component carrier structure 100 of Figure 2 less resin is required to completely fill the copper windows. Thus, a uniform level of panel thickness can be achieved at the panel edges and in the panel center. Furthermore, since no notable hollow volume is left in the component carrier structure 100 according to

[0104] no problem of pressure loss on the panel surface occurs during pressing. This can result in a relatively uniform panel thickness and avoid any bubble problems. Thus, Figure 2 no scratching problems occur in the embodiments of Figure 2The laminate structure can be suitably compatible with prepregs of different thicknesses and different types of resin material contents. In addition, Figure 2 the implementation can ensure a uniform horizontal thickness between the panel edge and the panel center. According to Figure 2 , there will be no compression loss problem. This implementation can also induce a balanced current during the electroplating process. Due to the all-copper layer concept, resin filling may not be required. The all-copper design on the bottom side can avoid the problem of air bubbles when the resin content of the prepreg material is low.

[0105] In addition, Figure 2 the implementation also shows identifier structures 114 to 117 with a 2DID design, which has negative features due to the provision of a metal frame structure 122 around the central code area 120. This can lead to better readability of the identifier structures 114 to 117 by the optical reader device 150, especially when the resin-covered identifier structures are read by the optical reader device 150 oriented to face the upper main surface 158 of the laminate 102 during optical detection. Therefore, it may not be necessary to change the type of code reader.

[0106] Figure 3 shows an image of a part of a component carrier structure 100 having an identifier structure 114 according to an exemplary implementation of the present invention.

[0107] Figure 4 shows an image of a part of a component carrier structure 100 having identifier structures 114, 115 according to an exemplary implementation of the present invention.

[0108] It should be noted that the term "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. Elements described in connection with different implementations can also be combined.

[0109] It should also be noted that the reference signs in the claims should not be construed as limiting the scope of the claims.

[0110] The implementation of the present invention is not limited to the preferred implementations shown in the figures and described above. Alternatively, even in the case of fundamentally different implementations, it is possible to use the shown solutions and various variants based on the principles of the present invention.

Claims

1. A component carrier structure (100), wherein, The component carrier structure (100) comprises: a stack (102), the stack (102) comprising at least one electrically conductive layer structure (104 - 108) and at least one electrically insulating layer structure (110 - 113); and at least one identifier structure (114 - 118), at least one of the at least one identifier structure (114 - 118) being arranged in and / or on the stack (102); wherein at least one of the at least one identifier structure (114 - 118) comprises a central code region (120), the central code region (120) having electrically conductive material and electrically insulating material, the electrically conductive material and the electrically insulating material encoding optically readable information for at least one of the at least one identifier structure (114 - 118), and at least one of the at least one identifier structure (114 - 118) comprises a frame structure (122), the frame structure (122) surrounding at least part of the central code region (120) and the frame structure (122) being made of electrically conductive material.

2. The component carrier structure (100) according to claim 1, wherein, The central code region (120) and the frame structure (122) are formed integrally with the stack (102).

3. The component carrier structure (100) according to claim 1 or 2, wherein, The central code region (120) and the frame structure (122) form part of at least one of the at least one electrically conductive layer structure (104 - 108) and / or at least one of the at least one electrically insulating layer structure (110 - 113).

4. The component carrier structure (100) according to any one of claims 1 to 3, wherein, The central code region (120) comprises a data matrix pattern.

5. The component carrier structure (100) according to any one of claims 1 to 4, wherein, The central code region (120) is configured as a one - dimensional code, two - dimensional code, at least three - dimensional code, QR code, bar code, and / or alphanumeric code.

6. The component carrier structure (100) according to any one of claims 1 to 5, wherein, At least one of the at least one identifier structure (114 - 118) comprises a metal pattern of at least one of the at least one electrically conductive layer structure (104 - 108).

7. The component carrier structure (100) according to any one of claims 1 to 6, wherein, At least one of the at least one identifier structure (114 - 118) comprises an additional structure (124), the additional structure (124) being separated from the frame structure (122) and separated from the central code region (120).

8. The component carrier structure (100) according to claim 7, wherein, The additional structure (124) has a different color from the frame structure (122) and the central code region (120) and / or the additional structure (124) is made of a different material from the frame structure (122) and the central code region (120).

9. The component carrier structure (100) according to claim 7 or 8, wherein, The additional structure (124) is made of ink.

10. The component carrier structure (100) according to any one of claims 7 to 9, wherein, The additional structure (124) is an additional frame structure, for example, the additional structure (124) is an additional frame structure that at least partially surrounds the frame structure (122).

11. The component carrier structure (100) according to any one of claims 1 to 10, wherein, The frame structure (122) extends around two or three of the four edges of the central code region (120), or the frame structure (122) extends around the entire perimeter of the central code region (120).

12. The component carrier structure (100) according to any one of claims 1 to 11, wherein, The central code region (120) encodes information such that the component carrier structure (100) can be identified and / or tracked by optically reading the information from the central code region (120).

13. The component carrier structure (100) according to any one of claims 1 to 12, wherein, At least one of the identifier structures (114 - 118) includes a first identifier structure (114) and a second identifier structure (115), and each of the first identifier structure (114) and the second identifier structure (115) has the features according to any one of claims 1 to 12.

14. The component carrier structure (100) according to claim 13, wherein, The first identifier structure (114) and the second identifier structure (115) are vertically and horizontally spaced apart from each other.

15. The component carrier structure (100) according to claim 13 or 14, wherein, The first identifier structure (114) and the second identifier structure (115) are configured such that each of the first identifier structure (114) and the second identifier structure (115) can be optically read from the outside of the component carrier structure (100), in particular, the first identifier structure (114) and the second identifier structure (115) are configured such that each of the first identifier structure (114) and the second identifier structure (115) can be optically read simultaneously from the outside of the component carrier structure (100).

16. The component carrier structure (100) according to any one of claims 13 to 15, the component carrier structure (100) includes a third identifier structure (116), and the third identifier structure (116) is arranged deeper in the stack (102) than the first identifier structure (114) and the second identifier structure (115), such that the third identifier structure (116) cannot be optically read from the outside of the component carrier structure (100), in particular, the component carrier structure (100) includes a third identifier structure (116), and the third identifier structure (116) is arranged deeper in the stack (102) than the first identifier structure (114) and the second identifier structure (115), such that the third identifier structure (116) cannot be optically read simultaneously with the first identifier structure (114) and / or the second identifier structure (115) from the outside of the component carrier structure (100).

17. The component carrier structure (100) according to any one of claims 1 to 16, Among them, At least one of the conduction layer structures (104 - 108) includes a first conduction layer structure (104) and a second conduction layer structure (105), and one of the at least one electrical insulation layer structure, an electrical insulation layer structure (110), is arranged between the first conduction layer structure (104) and the second conduction layer structure (105); wherein, an opening (128) is provided at the first conduction layer structure (104), in particular, an opening (128) is provided at the first conduction layer structure (104) beside the first identifier structure (114) among at least one of the identifier structures (114 - 118); and / or Wherein, an opening (130) is provided at the second conduction layer structure (105), in particular, an opening (130) is provided at the second conduction layer structure (105) beside the second identifier structure (115) among at least one of the identifier structures (114 - 118).

18. The component carrier structure (100) according to claim 17, wherein, The first identifier structure (114) and the second identifier structure (115) are laterally displaced relative to each other such that the first identifier structure (114) can be optically read from the outside of the component carrier structure (100) and the second identifier structure (115) can be optically read from the outside of the component carrier structure (100) through the opening (128) provided at the first conduction layer structure (104). In particular, the first identifier structure (114) and the second identifier structure (115) are laterally displaced relative to each other such that the following readings are carried out simultaneously: the first identifier structure (114) can be optically read from the outside of the component carrier structure (100) and the second identifier structure (115) can be optically read from the outside of the component carrier structure (100) through the opening (128) provided at the first conduction layer structure (104), and in particular, the second identifier structure (115) can be optically read from the outside of the component carrier structure (100) through at least one of the electrical insulation layer structures (110) through the opening (128) provided at the first conduction layer structure (104).

19. The component carrier structure (100) according to claim 17 or 18, wherein, The opening (128) in the first conduction layer structure (104) corresponds to the size and / or position of the second identifier structure (115).

20. The component carrier structure (100) according to any one of claims 17 to 19, Among them, At least one of the conduction layer structures (104 - 108) includes a third conduction layer structure (106), wherein another electrical insulation layer structure (111) among at least one of the electrical insulation layer structures is arranged between the second conduction layer structure (105) and the third conduction layer structure (106); Wherein, at least one of the identifier structures (114 - 118) includes a third identifier structure (116), and the third identifier structure (116) is arranged in and / or on the third conduction layer structure (106); Wherein, an opening (132) is provided at the third conduction layer structure (106), in particular, an opening (132) is provided at the third conduction layer structure (106) beside the third identifier structure (116); Wherein, the opening (130) in the second conduction layer structure (105) corresponds to the size and / or position of the third identifier structure (116).

21. The component carrier structure (100) according to claim 20, Among them, At least one of the electroconductive layer structures (104 - 108) includes a fourth electroconductive layer structure (107); wherein at least one of the identifier structures (114 - 118) includes a fourth identifier structure (117), the fourth identifier structure (117) being arranged in and / or on the fourth electroconductive layer structure (107), wherein the fourth identifier structure (117) is arranged in a recess (134) of the fourth electroconductive layer structure (107), in particular, the fourth identifier structure (117) is arranged in the recess (134) of the fourth electroconductive layer structure (107) without leaving an opening beside the fourth identifier structure (117).

22. The component carrier structure (100) according to any one of claims 1 to 21, wherein, At least one electroconductive layer structure (108) arranged below each of at least one of the identifier structures (114 - 118) is configured as a continuous metal layer, in particular, a plurality of electroconductive layer structures (108) arranged below each of at least one of the identifier structures (114 - 118) are configured as a continuous metal layer.

23. The component carrier structure (100) according to any one of claims 1 to 22, wherein, The component carrier structure (100) includes a panel, an array or a component carrier, for example, a printed circuit board or an integrated circuit substrate.

24. A method of manufacturing a component carrier structure (100), wherein, The method includes: providing a stack (102) including at least one electroconductive layer structure (104 - 108) and at least one electrically insulating layer structure (110 - 113); forming or arranging at least one identifier structure (114 - 118) in and / or on the stack (102); and configuring at least one of the identifier structures (114 - 118) to have a central code region (120) and a frame structure (122), the central code region (120) having an electroconductive material and an electrically insulating material, the electroconductive material and the electrically insulating material encoding optically readable information of at least one of the identifier structures (114 - 118), the frame structure (122) surrounding at least a part of the central code region (120) and the frame structure (122) being made of an electroconductive material.

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