Positioning mechanism of multilayer circuit board pressing equipment

Abstract

The invention discloses a positioning mechanism of multilayer circuit board pressing equipment. The positioning mechanism comprises a positioning groove formed in the upper surface of a pressing table. A positioning groove is formed in the pressing table, a transparent pressure-resistant plate is arranged in the positioning groove, and an optical positioning sensor is arranged below the transparent pressure-resistant plate and in the pressing table in an embedded mode and faces the transparent pressure-resistant plate; and the optical positioning sensor and the transparent pressure-resistant plate are arranged at three wiring holes of the corresponding multilayer circuit board. According to the positioning mechanism of the multilayer circuit board pressing equipment, the optical positioning sensor and the transparent pressure-resistant plate are embedded in the surface of the pressing table, and the positioning mechanism on the pressing table is matched, so that when a circuit board is placed, optical vision positioning is carried out through the optical positioning sensor, and the positioning efficiency and the positioning precision are high.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board production, and particularly to a positioning mechanism for a multi-layer printed circuit board pressing device. Background Art

[0002] During the production of multi-layer printed circuit boards, it is necessary to press multiple layers together. Therefore, the accuracy of the pressing device determines the yield rate of the final product. Traditional pressing devices use mechanical positioning, which is inefficient and difficult to guarantee accuracy. Summary of the Invention

[0003] To solve the deficiencies in the prior art, the present invention provides a positioning mechanism for a multi-layer printed circuit board pressing device. The positioning mechanism of the multi-layer printed circuit board pressing device embeds an optical positioning sensor and a transparent pressure-resistant plate on the surface of the pressing table. Cooperating with the original positioning mechanism on the pressing table, when placing the printed circuit board, optical vision positioning is performed through the optical positioning sensor, with high positioning efficiency and high positioning accuracy.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] The present invention provides a positioning mechanism for a multi-layer printed circuit board pressing device, including a positioning groove opened on the upper surface of the pressing table;

[0006] A transparent pressure-resistant plate is arranged in the positioning groove. Below the transparent pressure-resistant plate, an optical positioning sensor is embedded in the pressing table, and the optical positioning sensor is arranged facing the transparent pressure-resistant plate;

[0007] The optical positioning sensor and the transparent pressure-resistant plate are both arranged at three wiring holes corresponding to the multi-layer printed circuit board.

[0008] The positioning mechanism of the multi-layer printed circuit board pressing device of the present invention embeds an optical positioning sensor and a transparent pressure-resistant plate on the surface of the pressing table. Cooperating with the original positioning mechanism on the pressing table, when placing the printed circuit board, optical vision positioning is performed through the optical positioning sensor, with high positioning efficiency and high positioning accuracy.

[0009] In a further technical solution, a pin hole extending to the transparent pressure-resistant plate is opened inside the pressing table, and a positioning pin is inserted through the pin hole.

[0010] The setting of the positioning pin ensures the positioning accuracy of the transparent pressure-resistant plate and reduces the visual positioning deviation caused by the angle or position deviation of the transparent pressure-resistant plate.

[0011] In a further technical solution, the optical positioning sensor is tightly attached to the transparent pressure-resistant plate.

[0012] The optical positioning sensor is tightly attached to the transparent pressure-resistant plate, effectively reducing the error caused by the refraction of light and further improving the accuracy.

[0013] In a further technical solution, the transparent pressure-resistant plate is made of sapphire.

[0014] Sapphire has a high light transmittance and high hardness, and its surface is not easily scratched, which can effectively improve the service life of the device.

[0015] The beneficial effects are as follows:

[0016] 1. The positioning mechanism of the multi-layer circuit board pressing device of the present invention embeds an optical positioning sensor and a transparent pressure-resistant plate on the surface of the pressing table, and cooperates with the original positioning mechanism on the pressing table. When placing the circuit board, optical vision positioning is performed through the optical positioning sensor, with high positioning efficiency and high positioning accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of the positioning mechanism of the multi-layer circuit board pressing device according to an embodiment of the present invention.

[0018] 10. Pressing table; 20. Positioning groove; 30. Transparent pressure-resistant plate; 40. Optical positioning sensor; 50. Positioning pin. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The present invention will be further described below with reference to the accompanying drawings:

[0020] Embodiment:

[0021] A positioning mechanism of a multi-layer circuit board pressing device, as Figure 1 shown, includes a positioning groove 20 opened on the upper surface of the pressing table 10;

[0022] A transparent pressure-resistant plate 30 is arranged in the positioning groove 20. Below the transparent pressure-resistant plate 30, an optical positioning sensor 40 is embedded in the pressing table 10, and the optical positioning sensor 40 is arranged towards the transparent pressure-resistant plate 30;

[0023] The optical positioning sensor 40 and the transparent pressure-resistant plate 30 are both arranged at three wiring holes corresponding to the multi-layer circuit board.

[0024] The positioning mechanism of the multi-layer circuit board pressing device of the present invention embeds an optical positioning sensor 40 and a transparent pressure-resistant plate 30 on the surface of the pressing table 10, and cooperates with the original positioning mechanism on the pressing table 10. When placing the circuit board, optical vision positioning is performed through the optical positioning sensor 40, with high positioning efficiency and high positioning accuracy.

[0025] In another embodiment, a pin hole extending to the transparent pressure-resistant plate 30 is opened inside the pressing table 10, and a positioning pin 50 is inserted through the pin hole.

[0026] The setting of the positioning pin 50 ensures the positioning accuracy of the transparent pressure-resistant plate 30 and reduces the visual positioning deviation caused by the angle or position deviation of the transparent pressure-resistant plate 30.

[0027] In another embodiment, the optical positioning sensor 40 is disposed closely to the transparent pressure-resistant plate 30.

[0028] The optical positioning sensor 40 being disposed closely to the transparent pressure-resistant plate 30 effectively reduces the error caused by the refraction of light and further improves the accuracy.

[0029] In another embodiment, the transparent pressure-resistant plate 30 is made of sapphire.

[0030] Sapphire has a high light transmittance and high hardness, and its surface is not easily scratched, which can effectively improve the service life of the device.

[0031] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A positioning mechanism for a multi-layer circuit board pressing device, characterized in that, It includes a positioning groove opened on the upper surface of the pressing table; A transparent pressure-resistant plate is arranged in the positioning groove. Below the transparent pressure-resistant plate, an optical positioning sensor is embedded in the pressing table, and the optical positioning sensor is arranged facing the transparent pressure-resistant plate; The optical positioning sensor and the transparent pressure-resistant plate are both arranged at three wiring holes corresponding to the multi-layer circuit board.

2. The positioning mechanism of the multi-layer circuit board laminating device according to claim 1, characterized in that, A pin hole extending to the transparent pressure-resistant plate is opened inside the pressing table, and a positioning pin is inserted through the pin hole.

3. The positioning mechanism of the multi-layer circuit board lamination equipment according to claim 1, characterized in that, The optical positioning sensor is closely arranged with the transparent pressure-resistant plate.

4. The positioning mechanism of the multi-layer circuit board lamination device according to claim 1, characterized in that, The transparent pressure-resistant plate is made of sapphire.

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