Heat dissipation device and electronic equipment

Abstract

The invention provides a heat dissipation device which is used for heat dissipation of a heating chip of electronic equipment, the heat dissipation device comprises a liquid cooling plate, a radiator and a fan group, the liquid cooling plate is attached to the heating chip, and a first gap between the heating chip and the liquid cooling plate is filled with first heat conduction gel; the radiator is attached to the liquid cooling plate, and a second gap between the radiator and the liquid cooling plate is filled with second heat-conducting gel; the fan group comprises a fan, and the fan is connected to the radiator; heat generated by the heating chip is conducted to the liquid cooling plate through the first heat conduction gel, heat on the liquid cooling plate is conducted to the radiator through the second heat conduction gel, and the fan works to suck external air to exchange heat with the radiator. The invention further provides the electronic equipment provided with the heat dissipation device.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of electronic devices, and particularly to a heat dissipation device and an electronic device provided with the heat dissipation device. Background Art

[0002] The existing internal heat dissipation solutions for electronic devices generally adopt passive heat dissipation using graphite sheets and vapor chamber heat pipes (VC). As the power of power devices such as heating chips increases, the passive heat dissipation effect gradually becomes insufficient. To improve the passive heat dissipation effect, some smartphones add a micro fan and a radiator inside for air-cooled heat dissipation. The heat transfer path of this air-cooled heat dissipation is as follows: The heat generated when the heating chip of the electronic device works is conducted to the vapor gel heat pipe through the first thermal gel, and then conducted to the radiator through the second thermal gel. The fan works to suck in external cold air and exchange heat with the heat dissipation fins of the radiator, so as to drive the external air to take away the heat inside the mobile phone. However, due to the relatively small mechanical strength of the existing vapor gel heat pipe, it is necessary to lap the vapor gel heat pipe on the middle frame of the electronic device, which increases the thickness and weight of the whole electronic device to a certain extent and enlarges the gap between the vapor gel heat pipe and the heating chip and the radiator, making the thickness of the first thermal gel between the vapor gel heat pipe and the heating chip and the thickness of the second thermal gel between the vapor gel heat pipe and the radiator both larger, resulting in relatively low thermal conductivities of the first thermal gel and the second thermal gel, and limited heat conducted from the heating chip to the radiator. Therefore, the heat dissipation efficiency of the fan for the heating chip is not high. Summary of the Invention

[0003] The present application provides a heat dissipation device with better heat dissipation efficiency, and an electronic device provided with the heat dissipation device.

[0004] A heat dissipation device provided by the present application is used to dissipate heat from the heating chip of an electronic device. The heat dissipation device includes a liquid cooling plate, a radiator and a fan group. The liquid cooling plate is attached to the heating chip, and a first thermal gel is filled in the first gap between the heating chip and the liquid cooling plate; the radiator is attached to the liquid cooling plate, and a second thermal gel is filled in the second gap between the radiator and the liquid cooling plate; the fan group includes a fan, and the fan is connected to the radiator; the heat generated by the heating chip is conducted to the liquid cooling plate through the first thermal gel, the heat on the liquid cooling plate is conducted to the radiator through the second thermal gel, and the fan works to suck in external air and exchange heat with the radiator.

[0005] The present application also provides an electronic device, which includes a heat dissipation device and a middle frame. The heat dissipation device is disposed in the inner cavity of the middle frame and is used to dissipate heat from the heating chips of the electronic device. The heat dissipation device includes a liquid cooling plate, a radiator, and a fan group. The liquid cooling plate is attached to the heating chips, and a first thermal gel is filled in the first gap between the heating chips and the liquid cooling plate; the radiator is attached to the liquid cooling plate, and a second thermal gel is filled in the second gap between the radiator and the liquid cooling plate; the fan group includes a fan, and the fan is connected to the radiator; the heat generated by the heating chips is conducted to the liquid cooling plate through the first thermal gel, the heat on the liquid cooling plate is conducted to the radiator through the second thermal gel, and the fan operates to suck in external air for heat exchange with the radiator.

[0006] In the electronic device of the present invention, the heating chips and the radiator are respectively attached to the liquid cooling plate, so that the first gap between the heating chips and the liquid cooling plate and the second gap between the radiator and the liquid cooling plate are both relatively narrow, thereby making the thicknesses of the first thermal gel and the second thermal gel relatively thin, reducing the conduction thermal resistance between the heating chips and the liquid cooling plate, as well as the conduction thermal resistance between the liquid cooling plate and the radiator, increasing the heat conducted from the heating chips to the radiator, improving the heat dissipation efficiency of the fan for the heating chips, and timely and efficiently taking away more heat generated during the operation of the heating chips, ensuring the high-performance and smooth operation of the electronic device; secondly, the present invention uses a liquid cooling plate with a relatively thin thickness to replace the existing vapor-phase gel heat pipe with a relatively thick thickness, thereby reducing the overall thickness and weight of the heat dissipation device to achieve the thin and light design of the electronic device and improving the user comfort experience. Description of the Drawings

[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the implementation will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0008] Figure 1 It is a three-dimensional structural schematic diagram of the electronic device in the first embodiment of the present application.

[0009] Figure 2 is Figure 1 a cross-sectional view along line II-II in.

[0010] Figure 3 is Figure 2 an exploded schematic diagram of the electronic device in.

[0011] Figure 4 is Figure 3 a three-dimensional structural schematic diagram of the liquid cooling plate in.

[0012] Figure 5 is Figure 4 a schematic exploded three-dimensional structure view of the liquid cooling plate in

[0013] Figure 6 is Figure 4 one of the sectional views of the liquid cooling plate in

[0014] Figure 7 is one of the sectional views of the electronic device in the second embodiment of the present application.

[0015] Figure 8 is Figure 7 a schematic exploded view of the electronic device in

[0016] Figure 9 is Figure 8 a schematic exploded three-dimensional structure view of the support plate in

[0017] Figure 10 is one of the sectional structure views of the electronic device in the third embodiment of the present application.

[0018] Figure 11 is Figure 10 a schematic exploded view of the electronic device in

[0019] Figure 12 is one of the sectional structure views of the electronic device in the fourth embodiment of the present application.

[0020] Main reference numeral description:

[0021] 100, electronic device; 20, heat dissipation device; 22, liquid cooling plate; 220, support piece; 221, flow channel; 222, first heat conducting support piece; 2222, first liquid passing hole; 2224, second liquid passing hole; 224, second heat conducting support piece; 225, heat equalizing liquid; 226, piezoelectric pump; 2262, liquid inlet; 2264, liquid outlet; 24, radiator; 26, fan group; 262, air guiding shell; 264, fan; 2642, air inlet; 27, first heat conducting gel; 28, second heat conducting gel; 40, middle frame; 42, support plate; 423, receiving groove; 44, peripheral plate; 442, air outlet hole; 45, inner cavity; 46, receiving cavity; 50, circuit board; 52, heating chip; 54, chip module; 55, first interval; 56, second interval; 60, back cover; 62, air inlet hole; 70, display screen. Detailed implementation manners

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0023] In addition, the descriptions of the following embodiments refer to the attached drawings for illustrating specific embodiments in which the present application can be implemented. The directional terms mentioned in the present application, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., only refer to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present application, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0024] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected", "disposed on..." should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0025] Please refer to Figures 1 to 3, the electronic device 100 in the first embodiment of the present invention includes a heat dissipation device 20, a middle frame 40, a circuit board 50, a back cover 60 and a display screen 70. The heat dissipation device 20 and the circuit board 50 are both arranged in the inner cavity of the middle frame 40. A heating chip 52 and a chip module 54 are arranged on the circuit board 50, and the heating chip 52 and the chip module 54 are respectively connected to opposite side surfaces of the circuit board 50; the back cover 60 covers the inner cavity of the middle frame 40, the back cover 60 is connected to the middle frame 40, and the display screen 70 is arranged on the front surface of the middle frame 40; the heat dissipation device 20 is used to dissipate heat from the heating chip 52 of the electronic device 100. The heat dissipation device 20 includes a liquid cooling plate 22, a radiator 24, a fan group 26, a first thermal conductive gel 27 and a second thermal conductive gel 28. The liquid cooling plate 22 is attached to the heating chip 52, and the first thermal conductive gel 27 is filled in the first gap 55 between the heating chip 52 and the liquid cooling plate 22; the radiator 24 is attached to the liquid cooling plate 22, and the second thermal conductive gel 28 is filled in the second gap 56 between the radiator 24 and the liquid cooling plate 22; the fan group 26 includes a wind guiding shell 262 and a fan 264 arranged in the inner cavity of the wind guiding shell 262, and the fan 264 is connected to the radiator 24; the heat generated by the heating chip 52 is conducted to the liquid cooling plate 22 through the first thermal conductive gel 27, the heat on the liquid cooling plate 22 is conducted to the radiator 24 through the second thermal conductive gel 28, and the fan 264 works to suck in outside air to exchange heat with the radiator 24, so as to discharge the heat generated by the heating chip 52.

[0026] It should be noted that the electronic device can be, but is not limited to, a mobile phone, a tablet computer, a smart watch, a VR head-mounted display, a smart wearable device, etc. The "connection" in the description of the embodiments of the present invention includes both direct connection and indirect connection. For example, the connection between A and B includes the direct connection between A and B or the connection through a third element C or more other elements. The connection also includes two cases of integral connection and non-integral connection. The integral connection means that A and B are integrally formed and connected, and the non-integral connection means that A and B are non-integrally formed and connected.

[0027] Compared with the prior art, the gaps between the heating chip and the vapor chamber and between the vapor chamber and the radiator are relatively large, resulting in a relatively large thickness and thermal resistance of the thermal conductive gel filled in the gaps. In the electronic device 100 of the present invention, the heating chip 52 and the radiator 24 are respectively attached to the liquid cooling plate 22, so that the first gap 55 between the heating chip 52 and the liquid cooling plate 22 and the second gap 56 between the radiator 24 and the liquid cooling plate 22 are relatively narrow. As a result, the thicknesses of the first thermal conductive gel 27 and the second thermal conductive gel 28 are reduced, the conduction thermal resistance between the heating chip 52 and the liquid cooling plate 22 and between the liquid cooling plate 22 and the radiator 24 is decreased, the amount of heat conducted from the heating chip 52 to the radiator 24 is increased, the heat dissipation efficiency of the fan 264 for the heating chip 52 is improved, more heat generated during the operation of the heating chip 52 can be removed in a timely and efficient manner, and the high-performance and smooth operation of the electronic device 100 is ensured. Secondly, the present invention uses a relatively thin liquid cooling plate 22 to replace the existing relatively thick vapor chamber, thereby reducing the overall thickness and weight of the heat dissipation device 20, achieving the thinning of the electronic device 100, increasing the heat exchange effect of the electronic device 100, and improving the user comfort experience.

[0028] Optionally, the middle frame 40 of the electronic device 100 includes a support plate 42 and a peripheral plate 44 surrounding the support plate 42. An inner cavity 45 is defined by the peripheral plate 44 and one side of the support plate 42, and a receiving cavity 46 is defined by the peripheral plate 44 and the opposite side of the support plate 42. The heat dissipation device 20 is disposed in the inner cavity 45 of the middle frame 40, the support plate 42 supports the heat dissipation device 20, the liquid cooling plate 22 is received in the inner cavity 45 and attached to the support plate 42; the display screen 70 is disposed in the receiving cavity 46 and connected to the peripheral plate 44. Since the liquid cooling plate 22 is directly attached to the support plate 42, the heating chip 52 and the radiator 24 are both attached to the surface of the liquid cooling plate 22 facing away from the support plate 42, and the first thermal conductive gel 27 is filled between the heating chip 52 and the liquid cooling plate 22, and the second thermal conductive gel 28 is filled between the radiator 24 and the liquid cooling plate 22, the thicknesses of the first thermal conductive gel 27 and the second thermal conductive gel 28 are relatively thin, the conduction thermal resistance between the liquid cooling plate 22 and the heating chip 52 and the radiator 24 is decreased, and the overall thickness and weight of the heat dissipation device 20 are reduced, realizing the thinning development of the electronic device 100.

[0029] Such as Figures 3 - 6As shown in the figure, the liquid cooling plate 22 includes a flexible support sheet 220, a flexible first heat-conducting support sheet 222, a flexible second heat-conducting support sheet 224, and a heat-conducting liquid 225. A flow channel 221 is provided on the support sheet 220, and the flow channel 221 penetrates through the opposite two surfaces of the support sheet 220. The first heat-conducting support sheet 222 is hermetically attached to one surface of the support sheet 220, the second heat-conducting support sheet 224 is hermetically attached to the other surface of the support sheet 220, and the heat-conducting liquid 225 can flow in the flow channel 221. The heat-generating chip 52 and the radiator 24 are respectively attached to the first heat-conducting support sheet 222. The heat generated by the operation of the heat-generating chip 52 is conducted to the first heat-conducting support sheet 222 and the heat-conducting liquid 225. The heat-conducting liquid 225 flows along the flow channel 221, so that the heat is quickly and evenly conducted to the entire liquid cooling plate 22 along with the heat-conducting liquid 225, so that the heat can be quickly conducted to the radiator 24.

[0030] The liquid cooling plate 22 further includes a piezoelectric pump 226 electrically connected to the circuit board 50. The piezoelectric pump 226 is connected to the first heat-conducting support sheet 222 or the second heat-conducting support sheet 224. The piezoelectric pump 226 communicates with the flow channel 221. The piezoelectric pump 226 can drive the heat-conducting liquid 225 to flow in the flow channel 221, so that the heat generated by the heat-generating chip 52 is quickly and evenly conducted to the entire liquid cooling plate 22. In this embodiment, the flow channel 221 covers the entire support sheet 220. The flow channel 221 has two parallel and spaced shunt channels, and the ends of the two shunt channels are communicated with each other. The piezoelectric pump 226 has a liquid inlet 2262 and a liquid outlet 2264. The piezoelectric pump 226 is connected to the first heat-conducting support sheet 222. The first heat-conducting support sheet 222 is provided with a first liquid passing hole 2222 and a second liquid passing hole 2224 respectively facing the liquid inlet 2262 and the liquid outlet 2264. The first liquid passing hole 2222 communicates the liquid inlet 2262 with one of the shunt channels, and the second liquid passing hole 2224 communicates the liquid outlet 2264 with the other shunt channel. When the piezoelectric pump 226 operates, the piezoelectric pump 226 extracts the heat-conducting liquid 225 in one of the shunt channels, passes it through the first liquid passing hole 2222 and the liquid inlet 2262 into the piezoelectric pump 226, and the heat-conducting liquid 225 passes through the liquid outlet 2264 and the second liquid passing hole 2224 into the other shunt channel after passing through the piezoelectric pump 226, so as to realize the flow of the heat-conducting liquid 225 in the flow channel 221.

[0031] Optionally, the support sheet 220 may be, but is not limited to, a copper or its alloy sheet, an aluminum or its alloy sheet, a stainless steel sheet, etc.; both the first heat-conducting support sheet 222 and the second heat-conducting support sheet 224 are polymers, and the first heat-conducting support sheet 222 and the second heat-conducting support sheet 224 may be, but are not limited to, polyimide films (i.e., PI films), polyethylene terephthalate films (i.e., PET films), or polyether ether ketone films (i.e., PEEK films), etc. To ensure the heat dissipation effect of the liquid cooling plate 22, it is required that the height (i.e., thickness) of the flow channel 221 of the liquid cooling plate 22 is greater than or equal to 80 μm, the water vapor permeability of the first heat-conducting support sheet 222 and the second heat-conducting support sheet 224 is less than or equal to 1 g / m2 / 24 hr, and the number of piezoelectric pumps 226 is greater than or equal to 1.

[0032] In this embodiment, the heat-conducting liquid 225 in the flow channel 221 of the liquid cooling plate 22 is water, and the thermal conductivity of the liquid cooling plate 22 can reach more than 2000 W / mK, which is much greater than the thermal conductivity of copper foil / copper graphite (about 200 - 400 W / mK). The thickness of the liquid cooling plate 22 is greater than or equal to 0.15 mm. The liquid cooling plate 22 is similar to a flexible plate, and the liquid cooling plate 22 of the liquid cooling type can be directly attached to the outer surface of the support plate 42 of the middle frame 40 close to the heat-generating chip 52 side, which can greatly shorten the gap between the liquid cooling plate 22 and the heat-generating chip 52 and between the liquid cooling plate 22 and the radiator 24, greatly reduce the conduction thermal resistance of the heat dissipation device 20, and more quickly and efficiently conduct the heat of the heat-generating chip 52 to the liquid cooling plate 22, and can conduct the heat conducted on the liquid cooling plate 22 to the radiator 24. Secondly, since the thinnest dimension of the liquid cooling plate 22 is about 0.15 mm, compared with the thickness of the thinnest heat pipe in the prior art being 0.23 mm, the liquid cooling plate 22 has a smaller size and lighter weight, which can reduce the overall thickness of the electronic device 100 to a certain extent, achieve thinness and lightness, increase the heat exchange effect, and improve the user comfort experience.

[0033] As Figure 2 and Figure 3 shown, an air outlet hole 442 is provided at the air outlet groove of the peripheral plate 44 facing the radiator 24, and an air inlet hole 62 is provided at the air inlet 2642 of the back cover 60 facing the fan 264; since the air outlet hole 442 is located on the peripheral plate 44 and the air inlet hole 62 is located on the back cover 60, the distance between the air inlet hole 62 and the air outlet hole 442 is relatively far, avoiding the hot air flowing out of the air outlet hole 442 from flowing back to the air inlet hole 62, so that the overall heat exchange efficiency of the electronic device 100 is relatively high.

[0034] In other embodiments, the back cover 60 is provided with spaced air inlet holes and air outlet holes, the air outlet groove of the radiator 24 communicates with the air outlet holes, and the air inlet of the fan 264 communicates with the air inlet holes.

[0035] In other embodiments, the peripheral plate 44 is provided with air inlet holes and air outlet holes spaced apart from each other, the air outlet slot of the radiator 24 is connected to the air outlet holes, and the air inlet of the fan 264 is connected to the air inlet holes.

[0036] In other embodiments, the camera decorative piece of the back cover 60 is provided with an air inlet, and the peripheral plate 44 is provided with an air outlet. The air inlet of the fan 264 is connected to the air inlet, and the air outlet slot of the heat sink 24 is connected to the air outlet. Preferably, the camera decorative piece is provided with air inlet holes around the light inlet.

[0037] Optionally, the radiator 24 and the fan assembly 26 are an integrated connection component, and the heat is taken away by blowing the heat dissipation fins of the radiator 24 through the fan 264.

[0038] like Figure 2 and Figure 3 As shown, when assembling the electronic device 100, the liquid cooling plate 22 is placed in the inner cavity 45 of the middle frame 40 so that the liquid cooling plate 22 is attached to the support plate 42, the first thermal conductive gel 27 is applied to the surface of the heat generating chip 52 facing away from the circuit board 50, and the circuit board 50 is accommodated in the inner cavity 45 of the middle frame 40 so that the first thermal conductive gel 27 is connected to the liquid cooling plate 22; the second thermal conductive gel 28 is applied to one surface of the radiator 24, and the radiator 24 and the fan assembly 26 are placed in the inner cavity together so that the second thermal conductive gel 28 is connected to the liquid cooling plate 22, and the air outlet slot of the radiator 24 is opposite to the air outlet hole 442; the back cover 60 is covered in the inner cavity 45 of the middle frame 40 so that the back cover 60 is connected to the peripheral plate 44; the display screen 70 is accommodated in the receiving cavity 46 of the middle frame 40 and connected to the peripheral plate 44.

[0039] like Figures 1 - 6 As shown, when electronic device 100 is operating, a large amount of heat generated by heat-generating chip 52 is transferred to liquid cooling plate 22 via first thermally conductive gel 27. Piezoelectric pump 226 operates to drive heat-scaling liquid 225 within liquid cooling plate 22 to flow in flow channel 221. Heat is rapidly transferred throughout liquid cooling plate 22 along with heat-scaling liquid 225. Heat from liquid cooling plate 22 is then transferred to the cooling fins of radiator 24 via second thermally conductive gel 28. Simultaneously, external air drawn in by fan 264 enters air inlet 62 and air inlet 2642, passes through air guide housing 262, and enters the gaps between the cooling fins of radiator 24 before being discharged through air outlet 442. As the external air passes through the gaps between the cooling fins, it exchanges heat with the heat from the cooling fins of radiator 24 before being discharged from middle frame 40. Some of the heat from liquid cooling plate 22 is transferred to peripheral plate 44 via support plate 42, where the heat from peripheral plate 44 is directly exchanged with the external air.

[0040] The first interval between the heating chip 52 of the present application and the liquid cooling plate 22 and the second interval between the radiator 24 and the liquid cooling plate 22 are both relatively narrow, such that the thicknesses of the first thermal conductive gel 27 and the second thermal conductive gel 28 are both relatively thin, reducing the conduction thermal resistance between the heating chip 52 and the liquid cooling plate 22, as well as the conduction thermal resistance between the liquid cooling plate 22 and the radiator 24, increasing the amount of heat conducted from the heating chip 52 to the radiator 24, and enhancing the heat dissipation efficiency of the fan 264 for the heating chip 52; secondly, part of the heat of the liquid cooling plate 22 is conducted to the peripheral plate 44 of the middle frame 40, further enhancing the heat dissipation efficiency for the heating chip 52; in addition, the liquid cooling plate 22 has a relatively thin thickness and a relatively light weight, thereby realizing the thinning and lightening of the electronic device 100.

[0041] Such as Figures 7 - 9As shown, the structure of the electronic device 100a in the second embodiment of the present application is similar to the structure of the electronic device 100 in the first embodiment. The difference is that in the second embodiment, the support plate of the middle frame 40 is replaced by a liquid cooling plate 22a. Specifically, the periphery of the liquid cooling plate 22a is connected to the inner peripheral surface of the peripheral plate 44. The liquid cooling plate 22a includes a support sheet 220a, a first heat-conducting support sheet 222a, a second heat-conducting support sheet 224a, and a heat-conducting liquid 225. A flow channel 221 is provided on the support sheet 220a, and the flow channel 221 penetrates through the opposite two surfaces of the support sheet 220a respectively. The first heat-conducting support sheet 222a is hermetically attached to one surface of the support sheet 220a, and the second heat-conducting support sheet 224a is hermetically attached to the opposite surface of the support sheet 220a. The heat-conducting liquid 225 is accommodated in the flow channel 221. The heating chip 52 and the radiator 24 are both connected to the first heat-conducting support sheet 222a. Specifically, the four peripheries of the liquid cooling plate 22a are fixedly connected to the inner peripheral surface of the peripheral plate 44. Optionally, the four peripheries of the liquid cooling plate 22a are fixedly connected to the inner peripheral surface of the peripheral plate 44 by welding. The first heat-conducting support sheet 222a and the inner peripheral surface of the peripheral plate 44 enclose an inner cavity 45. The circuit board 50, the radiator 24, and the fan group 26 are accommodated in the inner cavity 45. The heating chip 52 is connected to the first heat-conducting support sheet 222a through a first heat-conducting gel 27, and the radiator 24 is connected to the first heat-conducting support sheet 222a through a second heat-conducting gel 28. The second heat-conducting support sheet 224a and the inner peripheral surface of the peripheral plate 44 enclose a receiving cavity 46. In this embodiment, by replacing the support plate of the middle frame 40 with the liquid cooling plate 22a, the overall thickness of the electronic device 100 can be further reduced to achieve the development of the electronic device 100 towards thin and light. Secondly, the heating chip 52 and the radiator 24 are directly attached to the first heat-conducting support sheet 222a respectively, so that the first gap between the heating chip 52 and the first heat-conducting support sheet 222a and the second gap between the radiator 24 and the first heat-conducting support sheet 222a are both relatively narrow. Thereby, the thickness of the first heat-conducting gel 27 filled in the first gap and the second heat-conducting gel 28 filled in the second gap is reduced, and the conduction thermal resistance between the heating chip 52 and the liquid cooling plate 22a, as well as the conduction thermal resistance between the liquid cooling plate 22a and the radiator 24, are reduced. The heat-conducting liquid 225 in the liquid cooling plate 22a can quickly and evenly conduct the heat generated by the heating chip 52 to the entire liquid cooling plate 22a, increasing the heat conducted from the heating chip 52 to the radiator 24, improving the heat dissipation efficiency of the fan 264 for the heating chip 52, and timely and efficiently taking away more heat generated during the operation of the heating chip 52 to ensure the high-performance and smooth operation of the electronic device 100a.

[0042] Optionally, the first heat-conducting support sheet 222a is connected to a piezoelectric pump 226. The piezoelectric pump 226 communicates with a flow channel 221, and a heat-conducting liquid 225 is filled in the flow channel 221. The piezoelectric pump 226 can drive the heat-conducting liquid 225 to flow in the flow channel 221, so that the heat generated by the heating chip 52 is conducted to the entire liquid cooling plate 22a. The piezoelectric pump 226 has a liquid inlet 2262 and a liquid outlet 2264. The piezoelectric pump 226 is connected to the first heat-conducting support sheet 222a. The first heat-conducting support sheet 222a is provided with a first liquid passing hole 2222 and a second liquid passing hole 2224 respectively facing the liquid inlet 2262 and the liquid outlet 2264. The first liquid passing hole 2222 communicates the liquid inlet 2262 with one of the flow channels, and the second liquid passing hole 2224 communicates the liquid outlet 2264 with the other flow channel. When the piezoelectric pump 226 operates, the piezoelectric pump 226 extracts the heat-conducting liquid 225 in one of the flow channels, passes it through the first liquid passing hole 2222 and the liquid inlet 2262 into the piezoelectric pump 226. After passing through the piezoelectric pump 226, the heat-conducting liquid 225 passes through the liquid outlet 2264 and the second liquid passing hole 2224 into the other flow channel, so as to realize the flow of the heat-conducting liquid 225 in the flow channel 221.

[0043] Optionally, the support sheet 220a can be, but is not limited to, a copper and its alloy sheet, an aluminum and its alloy sheet, a stainless steel sheet, etc.; the first heat-conducting support sheet 222a and the second heat-conducting support sheet 224a can be metal sheets respectively. The first heat-conducting support sheet 222a and the second heat-conducting support sheet 224a can be, but are not limited to, a copper and its alloy sheet, an aluminum and its alloy sheet, a stainless steel sheet, etc. To ensure the heat dissipation effect of the liquid cooling plate 22a, it is required that the height (i.e., thickness) of the flow channel 221 of the liquid cooling plate 22a is greater than or equal to 80 μm, the water and gas permeability of the first heat-conducting support sheet 222a and the second heat-conducting support sheet 224a is less than or equal to 1 g / m2 / 24hr, and the number of the piezoelectric pumps 226 is greater than or equal to 1.

[0044] As Figures 10 - 11 shown, the structure of the electronic device 100b in the third embodiment of the present application is similar to the structure of the electronic device 100 in the first embodiment. The difference is that in the third embodiment, the liquid cooling plate 22 is accommodated on the support plate 42. Specifically, a receiving groove 423 is provided on the surface of the support plate 42 facing the heat dissipation device 20, and the liquid cooling plate 22 is accommodated in the receiving groove 423. Since the receiving groove 423 is provided on the surface of the support plate 42 facing the inner cavity 45, the liquid cooling plate 22 can save the thickness of the electronic device 100b occupied by the liquid cooling plate 22 when being accommodated in the receiving groove 423, so as to further reduce the thickness of the electronic device 100b, realize the thin and light of the electronic device 100b, and increase the heat exchange effect of the electronic device 100b, improving the user comfort experience.

[0045] Optionally, the thickness of the receiving groove 423 on the support plate 42 may be the same as or different from the thickness of the liquid cooling plate 22. In this embodiment, the thickness of the receiving groove 423 is equal to the thickness of the liquid cooling plate 22. When the liquid cooling plate 22 is received in the receiving groove 423, the surface of the liquid cooling plate 22 facing the inner cavity 45 is coplanar with the surface of the support plate 42 facing the inner cavity 45.

[0046] In other embodiments, the thickness of the receiving groove 423 on the support plate 42 is less than the thickness of the liquid cooling plate 22. When the liquid cooling plate 22 is received in the receiving groove 423, the surface of the liquid cooling plate 22 facing the inner cavity 45 protrudes from the surface of the support plate 42 facing the inner cavity 45.

[0047] As Figure 12 shown, the structure of the electronic device 100c in the fourth embodiment of the present application is similar to the structure of the electronic device 100 in the first embodiment. The difference is that in the fourth embodiment, the liquid cooling plate 22 is received in the support plate 42. Specifically, a receiving groove 423a is provided on the surface of the support plate 42 facing the heat dissipation device 20, and the liquid cooling plate 22 is received in the receiving groove 423a. The surface of the liquid cooling plate 22 facing the inner cavity 45 is located in the receiving groove 423a. Since the receiving groove 423a is provided on the surface of the support plate 42 facing the inner cavity 45, receiving the liquid cooling plate 22 in the receiving groove 423a can save the thickness of the liquid cooling plate 22 occupying the electronic device 100c, so as to further reduce the thickness of the electronic device 100c, realize the thinning of the electronic device 100c, and increase the heat exchange effect of the electronic device 100c, improving the user comfort experience.

[0048] In this embodiment, the thickness of the receiving groove 423a is greater than the thickness of the liquid cooling plate 22. When the liquid cooling plate 22 is received in the receiving groove 423a, the surface of the liquid cooling plate 22 facing the inner cavity 45 is located in the inner cavity 45.

[0049] The above are the implementation manners of the embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the embodiments of the present invention, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present invention.

Claims

1. A heat dissipation device for dissipating heat from a heating chip of an electronic device, characterized in that, The heat dissipation device includes: A liquid cooling plate, which is attached to the heating chip, and a first heat-conducting gel is filled in the first gap between the heating chip and the liquid cooling plate; A radiator, which is attached to the liquid cooling plate, and a second heat-conducting gel is filled in the second gap between the radiator and the liquid cooling plate; and A fan group, the fan group includes a fan, and the fan is connected to the radiator; the heat generated by the heating chip is conducted to the liquid cooling plate through the first heat-conducting gel, the heat on the liquid cooling plate is conducted to the radiator through the second heat-conducting gel, and the fan operates to suck in outside air for heat exchange with the radiator.

2. The heat dissipation device according to claim 1, characterized in that The electronic device includes a middle frame having a support plate, the heat dissipation device is disposed in the inner cavity of the middle frame, the support plate supports the heat dissipation device, and the liquid cooling plate is attached to the support plate.

3. The heat dissipation device according to claim 1, wherein, The liquid cooling plate includes a flexible support sheet, a flexible first heat-conducting support sheet, a flexible second heat-conducting support sheet and a heat-conducting liquid. The support sheet is provided with a flow channel, the flow channel respectively penetrates through the opposite two surfaces of the support sheet, the first heat-conducting support sheet is hermetically attached to one surface of the support sheet, the second heat-conducting support sheet is hermetically attached to the other surface of the support sheet, and the heat-conducting liquid can flow in the flow channel.

4. The heat dissipation device according to claim 2, wherein The surface of the support plate facing the heat dissipation device is provided with a receiving groove, and the liquid cooling plate is received in the receiving groove.

5. The heat dissipation device according to claim 4, characterized in that, The surface of the liquid cooling plate facing the heat dissipation device is located in the receiving groove, or the surface of the liquid cooling plate facing the heat dissipation device is coplanar with the surface of the support plate facing the heat dissipation device.

6. The heat dissipation device according to claim 1, wherein, The middle frame of the electronic device includes a peripheral plate, the periphery of the liquid cooling plate is connected to the inner peripheral surface of the peripheral plate, the liquid cooling plate includes a support sheet, a first heat-conducting support sheet and a second heat-conducting support sheet, the support sheet is provided with a flow channel, the flow channel respectively penetrates through the opposite two surfaces of the support sheet, the first heat-conducting support sheet is hermetically attached to one surface of the support sheet, the second heat-conducting support sheet is hermetically attached to the other surface of the support sheet, and the heating chip and the radiator are both connected to the first heat-conducting support sheet.

7. The heat dissipation device according to claim 6, wherein The first heat-conducting support sheet is connected with a piezoelectric pump, the piezoelectric pump communicates with the flow channel, the flow channel is filled with a heat-conducting liquid, and the piezoelectric pump can drive the heat-conducting liquid to flow in the flow channel so as to conduct the heat generated by the heating chip to the entire liquid cooling plate.

8. The heat dissipation device according to claim 2 or 6, characterized in that, The middle frame includes a peripheral plate surrounding the support plate, and an air outlet hole is provided at the position of the air outlet groove of the peripheral plate facing the radiator.

9. The heat dissipation device according to claim 1, wherein, The electronic device includes a back cover, and an air inlet hole is provided at the position of the back cover facing the air inlet of the fan.

10. An electronic device, characterized in that, The electronic device includes the heat dissipation device and the middle frame according to any one of claims 1-9, and the heat dissipation device is disposed in the inner cavity of the middle frame.

Images