Sensing device for collecting motion signal of target object

Abstract

The invention relates to a sensing device for collecting motion signals of a target object. The sensing device comprises a first sensing unit arranged on the first side face, facing the target object, of the flexible substrate. An electric signal generated by a first sensing unit is conducted to a target position through a first conductive channel arranged on a flexible substrate, and the target position is farther away from a target object relative to a first side face, so that the connection position of the sensing device and an external circuit can be away from the first side face; the first side face, facing the target object, of the sensing device can be kept flat, uneven deformation of the first sensing unit on the first side face is avoided, and therefore the working stability of the sensing device is improved. And meanwhile, the first side surface is kept flat, so that foreign body sensation when the sensing device is worn can be reduced, and the wearing comfort of the sensing device is improved.

Description

Technical Field

[0001] The present invention relates to the field of sensing technology, and in particular to a sensing device for collecting motion signals of a target object. Background Art

[0002] With the increasing popularity of wearable devices, wearable flexible and stretchable sensing devices suitable for integration into smart clothing (such as clothes, pants, gloves, shoes, etc.) are gaining more and more applications. In specific scenarios, the connection between the sensing device and the external circuit must be considered, but this connection may affect the reliability and comfort of the sensing device.

[0003] Therefore, it is desired to provide a sensing device that has higher working stability and better wearing comfort. Summary of the Invention

[0004] One embodiment of the present specification provides a sensing device for collecting motion signals of a target object, comprising: a flexible substrate including a first side facing the target object; a first sensitive unit for detecting the target object and generating an electrical signal, the first sensitive unit being disposed on the first side of the flexible substrate; wherein the flexible substrate is provided with a first conductive channel, the first conductive channel being used to conduct the electrical signal generated by the first sensitive unit to a target position, the target position being further away from the target object relative to the first side. The electrical signal generated by the first sensitive unit is conducted to the target position by the first conductive channel disposed on the flexible substrate, wherein the target position is further away from the target object relative to the first side, thereby allowing the connection position between the sensing device and the external circuit to be away from the first side, allowing the first side of the sensing device facing the target object to remain flat, thereby avoiding uneven deformation of the first sensitive unit on the first side, and thus improving the working stability of the sensing device. At the same time, maintaining the first side flat can also reduce the foreign body sensation when the sensing device is worn, thereby improving the wearing comfort of the sensing device.

[0005] In some embodiments, the flexible substrate is provided with a first hole portion, and the first hole portion is filled with a flexible conductive material to form the first conductive channel, so that the first conductive channel can be deformed to adapt to the deformation of the flexible substrate to avoid hindering the deformation of the first sensitive unit.

[0006] In some embodiments, the sensing device further includes a derivation circuit disposed at the target location, wherein the first conductive path forms a first end portion on the first side surface, the first end portion being electrically connected to an electrode of the first sensitive unit; and the first conductive path forms a second end portion at the target location, the second end portion being electrically connected to the derivation circuit. The electrical signal generated by the first sensitive unit is conducted to the derivation circuit via the first conductive path, and the derivation circuit can receive and process or derivate the electrical signal generated by the first sensitive unit.

[0007] In some embodiments, the flexible substrate includes a second side surface opposite the first side surface, and the second side surface is provided with a second sensitive unit, and the electrical signal generated by the second sensitive unit is transmitted to the derivation circuit. By providing the second sensitive unit, the second sensitive unit can also collect information about the target object and generate an electrical signal accordingly. The electrical signal generated by the second sensitive unit can be combined with and compared with the electrical signal generated by the first sensitive unit to improve the measurement accuracy of the sensing device. For example, by performing differential processing on the electrical signals generated by the first sensitive unit and the second sensitive unit, noise signals generated by wrinkles in the flexible substrate can be eliminated.

[0008] In some embodiments, the target position is located between the first side surface and the second side surface, and the flexible substrate is provided with a second conductive channel, the second conductive channel forms a third end portion on the second side surface, and the third end portion is electrically connected to the electrode of the second sensitive unit; the second conductive channel forms a fourth end portion at the target position, and the fourth end portion is electrically connected to the derivation circuit, so that the electrical signal generated by the second sensitive unit is transmitted to the derivation circuit at the target position through the second conductive channel, so that the first side surface can remain flat, avoid uneven deformation of the first sensitive unit, improve the working stability of the sensing device, and at the same time reduce the foreign body sensation when the sensing device is worn, thereby improving the wearing comfort of the sensing device.

[0009] In some embodiments, the target position is located on the second side, and the first conductive path passes through the flexible substrate and extends to the target position, so that the first side can remain flat, avoiding uneven deformation of the first sensitive unit, improving the working stability of the sensing device, and at the same time reducing the foreign body sensation when the sensing device is worn, thereby improving the wearing comfort of the sensing device.

[0010] In some embodiments, the derivation circuit includes a circuit board or wires. The circuit board can receive and process or derivate the electrical signals generated by the sensing unit, enabling the sensor device to directly represent the movement of the target object without being connected to a processor. Alternatively, the sensor device can output a preliminarily processed electrical signal for subsequent processing. The flexible placement and routing of the wires can reduce the complexity of the sensor device's internal structure and simplify the installation design.

[0011] In some embodiments, the circuit board includes a flexible area and a non-flexible area, the flexible area is arranged at the target position, and the non-flexible area is provided with a processing circuit. The flexible area can bend elastically deformed accordingly with the deformation of the sensitive unit and the flexible substrate, so as to avoid obstruction to the deformation of the sensitive unit and the flexible substrate, resulting in inaccurate motion measurement of the target object by the sensing device. The non-flexible area can provide rigid support for the processing circuit, while providing an installation position for the processing circuit and avoiding bending damage to the processing circuit. On the other hand, the setting of the flexible area and the non-flexible area can also make the stress concentration point of the circuit board located in the non-flexible area, so that the projection of the stress concentration point of the circuit board on the target object is located outside the first projection of the first sensitive unit on the target object, so that the circuit board has less influence on the deformation of the first sensitive unit and the flexible substrate, thereby improving the working stability and accuracy of the sensing device.

[0012] In some embodiments, the non-flexible region is provided with a reinforcing plate, which is in contact with the non-flexible region. The reinforcing plate can further support the non-flexible region and reduce the probability of damage to the processing circuit due to bending of the non-flexible region.

[0013] In some embodiments, the projection of the non-flexible area on the target object is outside the projection of the first sensitive unit on the target object, so as to prevent the non-flexible area of the circuit board from hindering the deformation of the flexible substrate.

[0014] In some embodiments, the flexible substrate includes a first sub-substrate and a second sub-substrate, wherein the first sub-substrate is close to the target object and the second sub-substrate is far from the target object. The side of the first sub-substrate close to the target object is the first side surface, and the side of the second sub-substrate far from the target object is the second side surface. The first sub-substrate is provided with the first conductive path. When the derivation circuit includes a circuit board, the circuit board and the second sub-substrate are provided side by side on the side of the first sub-substrate opposite the first side surface. Obviously, the provision of the first and second sub-substrate facilitates the installation of the circuit board.

[0015] In some embodiments, the first sensitive unit is a capacitive structure, the first sensitive unit includes a first electrode layer and a second electrode layer, a dielectric layer is provided between the first electrode layer and the second electrode layer, the first conductive channel includes a first sub-channel and a second sub-channel, the first sub-channel is electrically connected to the first electrode layer, and the second sub-channel is electrically connected to the second electrode layer, thereby realizing the connection between the first sensitive unit of the capacitive structure and the export circuit.

[0016] In some embodiments, the sensing device also includes a derivation circuit arranged at the target position, the first sub-channel forms a first sub-port on the first side, the first sub-channel forms a second sub-port at the target position, the first sub-channel is electrically connected to the electrode of the first electrode layer at the first sub-port, and the first sub-channel is electrically connected to the derivation circuit at the second sub-port; the second sub-channel forms a third sub-port on the first side, the second sub-channel forms a fourth sub-port at the target position, the second sub-channel is electrically connected to the electrode of the second electrode layer at the third sub-port, and the second sub-channel is electrically connected to the derivation circuit at the fourth sub-port, thereby realizing the connection between the first sensitive unit of the capacitive structure and the derivation circuit.

[0017] In some embodiments, the sensing device further includes a derivation circuit provided at the target position, the flexible substrate includes a second side surface opposite to the first side surface, the second side surface is provided with a second sensitive unit, the second sensitive unit is a capacitive structure, the second sensitive unit includes a third electrode layer and a fourth electrode layer, another dielectric layer is provided between the third electrode layer and the fourth electrode layer, the target position is located between the first side surface and the second side surface, the flexible substrate is provided with a second conductive channel, the second conductive channel includes a third sub-channel and a fourth sub-channel, the third sub-channel forms a fifth sub-port on the second side surface, the third sub-channel forms a sixth sub-port at the target position, the third sub-channel is electrically connected to the electrode of the third electrode layer at the fifth sub-port, and the third sub-channel is electrically connected to the derivation circuit at the sixth sub-port; the fourth sub-channel forms a seventh sub-port on the second side surface, the fourth sub-channel forms an eighth sub-port at the target position, the fourth sub-channel is electrically connected to the electrode of the fourth electrode layer at the seventh sub-port, and the fourth sub-channel is electrically connected to the derivation circuit at the eighth sub-port, thereby realizing the connection between the second sensitive unit of the capacitive structure and the derivation circuit.

[0018] In some embodiments, the sensing device further includes a derivation circuit disposed at the target location, the flexible substrate includes a second side surface opposite the first side surface, a second sensitive unit is disposed on the second side surface, the second sensitive unit is a capacitive structure, and the second sensitive unit includes a third electrode layer and a fourth electrode layer, with another dielectric layer disposed between the third and fourth electrode layers. The target location is located on the second side surface, and the third and fourth electrode layers are directly electrically connected to the derivation circuit. The third and fourth electrode layers of the second sensitive unit are directly electrically connected to the derivation circuit located on the second side surface, eliminating the need for an additional conductive channel, thereby simplifying the structure of the sensing device.

[0019] In some embodiments, the first sensitive unit is a resistive structure or an inductive structure, the resistive structure or the inductive structure includes a first electrode and a second electrode, the first conductive channel includes a first sub-channel and a second sub-channel, the first sub-channel is electrically connected to the first electrode, and the second sub-channel is electrically connected to the second electrode, thereby realizing the connection between the first sensitive unit of the resistive structure or the inductive structure and the derivation circuit.

[0020] In some embodiments, the sensing device also includes a derivation circuit arranged at the target position, the first sub-channel forms a first sub-port on the first side, the first sub-channel forms a second sub-port at the target position, the first sub-channel is connected to the first electrode at the first sub-port, and the first sub-channel is electrically connected to the derivation circuit at the second sub-port; the second sub-channel forms a third sub-port on the first side, the second sub-channel forms a fourth sub-port at the target position, the second sub-channel is electrically connected to the second electrode at the third sub-port, and the second sub-channel is electrically connected to the derivation circuit at the fourth sub-port, thereby realizing the connection between the first sensitive unit of the resistive structure or the inductive structure and the derivation circuit.

[0021] In some embodiments, the sensing device further includes a derivation circuit provided at the target position, the flexible substrate includes a second side surface opposite to the first side surface, the second side surface is provided with a second sensitive unit, the second sensitive unit is a resistive structure or an inductive structure, the second sensitive unit includes a third electrode and a fourth electrode, the target position is located between the first side surface and the second side surface, the flexible substrate is provided with a second conductive channel, the second conductive channel includes a third sub-channel and a fourth sub-channel, the third sub-channel forms a fifth sub-port on the second side surface, the third sub-channel forms a sixth sub-port at the target position, the third sub-channel is electrically connected to the third electrode at the fifth sub-port, and the third sub-channel is electrically connected to the derivation circuit at the sixth sub-port; the fourth sub-channel forms a seventh sub-port on the second side surface, the fourth sub-channel forms an eighth sub-port at the target position, the fourth sub-channel is electrically connected to the fourth electrode at the seventh sub-port, and the fourth sub-channel is electrically connected to the derivation circuit at the eighth sub-port, thereby realizing the connection between the second sensitive unit with a resistive structure or an inductive structure and the derivation circuit.

[0022] In some embodiments, the sensing device further includes a derivation circuit disposed at the target location. The flexible substrate includes a second side surface opposite the first side surface. A second sensitive unit is disposed on the second side surface. The second sensitive unit has a resistive or inductive structure. The second sensitive unit includes a third electrode and a fourth electrode. The target location is located on the second side surface. The third electrode and the fourth electrode are directly electrically connected to the derivation circuit, respectively. The third and fourth electrode layers of the second sensitive unit are directly electrically connected to the derivation circuit located on the second side surface, eliminating the need for an additional conductive path, thereby simplifying the structure of the sensing device.

[0023] In some embodiments, the sensing device includes a protective layer, the protective layer includes a first protective part and a second protective part, the first protective part covers the first sensitive unit, the sensing device also includes a derivation circuit arranged at the target position, the second protective part covers the derivation circuit, the thickness of the first protective part protruding from the first side surface is the same as the thickness of the second protective part protruding from the first side surface, so that the side of the sensing device facing away from the target object remains flat, avoiding uneven deformation of the second sensitive unit, improving the working stability of the sensing device, and at the same time reducing the foreign body sensation when the sensing device is worn, thereby improving the wearing comfort of the sensing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] This specification will be further described in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, like numbers represent like structures, wherein:

[0025] Figure 1 is a schematic diagram of an exemplary structure of a sensing device according to some embodiments of this specification;

[0026] Figure 2 is another exemplary structural diagram of a sensing device according to some embodiments of this specification;

[0027] Figure 3 is another exemplary structural diagram of a sensing device according to some embodiments of this specification;

[0028] Figure 4 is another exemplary structural diagram of a sensing device according to some embodiments of this specification;

[0029] Figure 5 is another exemplary structural diagram of a sensing device according to some embodiments of this specification;

[0030] Figure 6 is another exemplary structural diagram of a sensing device according to some embodiments of this specification;

[0031] Figure 7 is another exemplary structural diagram of a sensing device according to some embodiments of this specification. DETAILED DESCRIPTION

[0032] In order to more clearly illustrate the technical solutions of the embodiments of this specification, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of this specification. For ordinary technicians in this field, this specification can also be applied to other similar scenarios based on these drawings without paying any creative work. It should be understood that these exemplary embodiments are provided only to enable technicians in the relevant fields to better understand and implement this specification, and do not limit the scope of this specification in any way. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0033] As used in this specification and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not specifically refer to the singular and may also include the plural, unless the context clearly indicates an exception. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been explicitly identified, and these steps and elements do not constitute an exclusive list. The method or apparatus may also include other steps or elements. The term "based on" means "at least in part based on." The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment."

[0034] In the description of this specification, it should be understood that the terms "front", "rear", "ear hook", "rear hook", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this specification and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this specification.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout this specification, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0036] In this specification, unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this specification based on specific circumstances.

[0037] Some embodiments of the present specification provide a sensing device comprising a first sensitive unit disposed on a first side surface of a flexible substrate facing a target object. An electrical signal generated by the first sensitive unit is conducted to a target location via a first conductive path disposed on the flexible substrate, where the target location is further away from the target object than the first side surface. This allows the connection point between the sensing device and an external circuit to be further away from the first side surface, allowing the first side surface of the sensing device facing the target object to remain flat, thereby preventing uneven deformation of the first sensitive unit on the first side surface and improving the operating stability of the sensing device. Furthermore, maintaining a flat first side surface can reduce the foreign body sensation when the sensing device is worn, thereby improving the wearing comfort of the sensing device.

[0038] Some embodiments of this specification also provide a wearable device for collecting motion signals of a target object, which includes the above-mentioned sensing device. The wearable device can have high working stability and wearing comfort.

[0039] Figure 1 is an exemplary structural diagram of a sensing device according to some embodiments of this specification. Figure 1As shown, some embodiments of this specification provide a sensing device 100 , which includes a flexible substrate 110 and a first sensitive unit 120 . The flexible substrate 110 serves as a mounting body of the sensing device 100 , and the first sensitive unit 120 is mounted on the flexible substrate 110 .

[0040] The first sensitive unit 120 can be used to detect a target object and generate an electrical signal. In some embodiments, the target object refers to the subject of the motion signal collected by the sensing device 100. In some embodiments, the target object may include, but is not limited to, a human body, a portion of a human body, a movable object, etc. For example, the target object may be a human finger, a human palm, a motion simulation robot arm, etc.

[0041] In some embodiments, the first sensitive unit 120 can undergo corresponding deformation in response to the movement of the target object, thereby generating a corresponding electrical signal. By processing and analyzing the electrical signal, information such as the movement process and movement posture of the target object can be obtained. In some embodiments, the first sensitive unit 120 can also directly read the relevant signals of the target object. Exemplarily, the first sensitive unit 120 may include a collection electrode. When the target object is a human body, the collection electrode can be attached to the skin of the human body, thereby collecting the myoelectric signal of the human body as an electrical signal output; when the target object is a mechanical structure, the collection electrode can be connected to the control circuit of the mechanical structure, thereby collecting the signal in the control circuit as an electrical signal output.

[0042] In some embodiments, the first sensitive unit 120 can be arranged on the first side 110-a of the flexible substrate 110 facing the target object, so that the movement of the target object can be directly transmitted to the first sensitive unit 120 to cause it to deform, so that the deformation of the first sensitive unit 120 can be more consistent with the movement of the target object, so that the sensing device 100 has higher working accuracy.

[0043] In some embodiments, the first sensitive unit 120 may include but is not limited to a capacitive structure, a resistive structure, an inductive structure, etc. For details, please refer to the following Figure 1-7 Related description.

[0044] In some embodiments, the flexible substrate 110 includes a second side surface 110 - b opposite to the first side surface 110 - a , and the sensing device may further include a second sensitive unit (eg, Figure 1The second sensitive unit 140 shown). Through the provision of the second sensitive unit, the second sensitive unit can also collect information for the target object and generate an electrical signal accordingly. The electrical signal generated by the second sensitive unit can be combined with the electrical signal generated by the first sensitive unit and compared with each other to improve the measurement accuracy of the sensing device. For example, by performing differential processing on the electrical signals generated by the first sensitive unit and the second sensitive unit, the noise signal generated by the wrinkles of the flexible substrate 110 can be eliminated. In some embodiments, the structure of the second sensitive unit may be the same as or different from that of the first sensitive unit. In some embodiments, in order to reduce the difference between the electrical signal generated by the second sensitive unit and the electrical signal generated by the first sensitive unit, thereby improving the working stability and measurement accuracy of the sensing device, the structure of the second sensitive unit may be the same as that of the first sensitive unit. For more information about the second sensitive unit, please refer to Figures 1-6 The related descriptions will not be repeated here.

[0045] The flexible substrate 110 can provide a mounting platform for other components of the sensor device 100 (e.g., the first sensitive unit 120). In some embodiments, the flexible substrate 110 can be elastic so that it can deform and bend accordingly with the movement of the target object, thereby accurately reflecting the movement of the target object.

[0046] In some embodiments, the flexible substrate 110 may be made of an insulating elastic material, such as PDMS (Polydimethylsiloxane), silicone, or TPU (Thermoplastic polyurethanes). Using an insulating elastic material allows the flexible substrate 110 to have both insulating and elastic properties, thereby reducing the impact of deformation on the first sensitive unit 120 and preventing interference with the electrical signals generated by the first sensitive unit 120.

[0047] In some embodiments, the flexible substrate 110 is provided with a first conductive channel 111, one end of the first conductive channel 111 is electrically connected to the first sensitive unit 120, and the other end of the first conductive channel 111 extends to the target position (eg Figure 1 The first conductive channel 111 can be used to conduct the electrical signal generated by the first sensitive unit 120 to the target location (such as Figure 1 shown).

[0048] Please refer to Figure 1 In some embodiments, the direction from which the sensing device 100 points to the target object is set as the X direction, and the extending direction of the flexible substrate 110 is set as the Y direction. Then, the first conductive channel 111 is extended along the X direction.

[0049] In some embodiments, the target location may be a location for connecting to other circuits (e.g., Figure 1 The processing circuit 152 shown, or an external circuit, etc.) is positioned to conduct the electrical signal generated by the first sensitive unit 120 to the corresponding circuit for processing or output. In some embodiments, the target position is farther away from the target object relative to the first side 110-a, that is, the distance between the target position and the target object in the X direction is greater than the distance between the first side 110-a and the target object, so that the first side 110-a can remain flat, avoid uneven deformation of the first sensitive unit 120, improve the working stability of the sensing device 100, and at the same time reduce the foreign body sensation when the sensing device 100 is worn, thereby improving the wearing comfort of the sensing device 100. For example, the target position can be located on the second side 110-b of the flexible substrate 110 away from the target object, as shown in FIG. Figure 2 、 Figure 4 、 Figure 6 As another example, the target position may be located between the first side surface 110 - a and the second side surface 110 - b , as shown in FIG. Figure 1 、 Figure 3 、 Figure 5 Area A location shown.

[0050] In some embodiments, the flexible substrate 110 may be provided with a first hole (not shown), which may be filled with a flexible conductive material to form a first conductive channel 111. This allows the first conductive channel 111 to deform to match the deformation of the flexible substrate 110, thereby avoiding obstruction of the deformation of the first sensitive unit 120. In some embodiments, the flexible substrate 110 may also be directly provided with a flexible conductor (e.g., a wire), which directly constitutes the corresponding conductive channel.

[0051] In some embodiments, the flexible conductive material refers to a material that has both electrical conductivity and elasticity. In some embodiments, the flexible conductive material may include but is not limited to conductive silicone, graphene, carbon nanotubes, metal nanowires, etc.

[0052] In some embodiments, the first hole portion can be cut on the flexible substrate 110 by laser or mechanical cutting.

[0053] If the first hole is too large, more flexible conductive material will be used, resulting in higher costs. Furthermore, because the flexible conductive material may be made of a different material than the flexible substrate 110, the first conductive channel 111 may interfere with the deformation of the flexible substrate 110 and the first sensitive unit 120. If the first hole is too small, processing becomes more difficult, and the conductive performance of the first conductive channel 111 may be poor, potentially affecting the transmission of the electrical signal generated by the first sensitive unit 120.

[0054] To save costs and reduce the impact of the first conductive channel 111 on the deformation of the flexible substrate 110 and the deformation of the first sensitive unit 120, while ensuring the electrical signal conduction performance of the first conductive channel 111, in some embodiments, the diameter of the first hole portion can be 0.7mm-1.3mm. In some embodiments, to further save material costs, the diameter of the first hole portion can be 0.8mm-1.2mm. In some embodiments, to further reduce processing difficulty, the diameter of the first hole portion can be 0.9mm-1.1mm. For example, the diameter of the first hole portion can be 1mm.

[0055] In some embodiments, the sensing device 100 may further include a derivation circuit 150 disposed at a target location. The derivation circuit 150 may receive and process or derivate the electrical signal generated by the first sensing unit 120. Accordingly, the target location may be the location of the derivation circuit 150 in the X direction or the location of the connection point between the sensing unit and the derivation circuit.

[0056] In some embodiments, the first conductive channel 111 forms a first end (not marked in the figure) on the first side 110-a, and the first end is electrically connected to the electrode of the first sensitive unit 120; the first conductive channel 111 forms a second end (not marked in the figure) at the target position, and the second end is electrically connected to the derivation circuit 150. The electrical signal generated by the first sensitive unit 120 is transmitted to the derivation circuit 150 through the first conductive channel 111. For details, please refer to the subsequent Figures 1-6 Related description.

[0057] In some embodiments, the position of the derivation circuit 150 varies with the target position. For example, when the target position is located in the middle between the first side surface 110 - a and the second side surface 110 - b of the flexible substrate 110 (i.e., region A), the derivation circuit 150 is also correspondingly disposed in the middle of the flexible substrate 110. Figure 1 、 Figure 3 、 Figure 5 For another example, when the target position is located at the second side surface 110 - b of the flexible substrate 110 (ie, the position of region B), the derivation circuit 150 is also correspondingly disposed on the second side surface 110 - b, as shown. Figure 2 、 Figure 4 、 Figure 6 shown.

[0058] In some embodiments, the derivation circuit 150 may include a circuit board (e.g., Figure 1 circuit board 151 etc. shown) or wires (e.g., Figure 4The circuit board can be used to receive and process or export the electrical signal generated by the first sensitive unit 120. By directly processing the electrical signal generated by the first sensitive unit 120 (for example, filtering and denoising, merging with other electrical signals, time domain and frequency domain analysis to predict change trends, etc.), the sensing device 100 can be connected to a processor without being connected to the processor. The signal output by the sensing device 100 can directly represent the movement of the target object, or the sensing device 100 can output a preliminarily processed electrical signal to facilitate subsequent further processing. The wire can directly export the electrical signal generated by the first sensitive unit 120. The layout position and routing direction of the wire are flexible and changeable, which can reduce the complexity of the internal structure of the sensing device 100 and simplify the difficulty of installation design.

[0059] In some embodiments, the circuit board can be used to connect to an external circuit (e.g., via a solder pad) to output the electrical signal generated by the first sensitive unit 120. In some embodiments, other components (e.g., processing circuit 152) can also be provided on the circuit board to process the first sensitive unit 120.

[0060] In some embodiments, when the derivation circuit 150 is disposed in the middle between the first side 110 - a and the second side 110 - b of the flexible substrate 110 , the circuit board (e.g., the circuit board 151 ) extends into the interior of the flexible substrate 110 (e.g., Figure 1 As shown in FIG, in order to prevent the circuit board from hindering the deformation of the flexible substrate 110 and the first sensitive unit 120, the circuit board can be a flexible FPC (Flexible Printed Circuit).

[0061] In other embodiments, when the derivation circuit 150 is disposed on the second side 110 - b of the flexible substrate 110 , the circuit board is disposed outside the flexible substrate 110 (eg, Figure 2 The circuit board 451 shown is located outside the flexible substrate 410. In this manner, the second sensitive unit located on the second side surface can be connected to the derivation circuit without requiring a conductive path on the flexible substrate 110, thereby avoiding the need for excessive conductive paths on the flexible substrate 110. This simplifies the production process and improves the overall flexibility of the flexible substrate 110. When the circuit board 151 of the derivation circuit 150 is located outside the flexible substrate 110, the circuit board can optionally be a rigid PCB (Printed Circuit Board) or a flexible FPC.

[0062] In some other embodiments, the derivation circuit may also correspond to two different target positions at the same time, and the first sensitive unit and the second sensitive unit may respectively conduct their respective electrical signals to the two different target positions. For example, when the derivation circuit includes a circuit board, one side of the circuit board may correspond to one target position, and the first sensitive unit may conduct the electrical signal to the one target position; the other side of the circuit board may correspond to another target position, and the second sensitive unit may conduct the electrical signal to the other target position. Wherein, the one target position may be located between the first side 110-a and the second side 110-b, and the other target position may be located on the second side 110-b. For details, please refer to Figure 7 Related content.

[0063] Please refer to Figure 1 In some embodiments, the circuit board 151 may include a flexible area and a non-flexible area, the flexible area is set at the target position, and the non-flexible area may be provided with a processing circuit (eg Figure 1 processing circuit 152 in).

[0064] The flexible area refers to an area that can be elastically deformed and bent, and the non-flexible area refers to a rigid area. In some embodiments, in order to prevent the non-flexible area of the circuit board from hindering the deformation of the flexible substrate 110, the projection of the non-flexible area on the target object is located outside the projection of the first sensitive unit 120 on the target object. For the purpose of illustration, in the direction from the sensing device 100 to the target object (i.e., the X direction), the first sensitive unit 120 has a first projection on the target object (e.g., Figure 1 ), the circuit board 151 has a second projection on the target object (e.g. Figure 1 EF segment in the ), the area corresponding to the portion of the second projection that is within the first projection (e.g. Figure 1 The ED segment in the figure) may be the flexible area of the circuit board 151, and the area corresponding to the portion of the second projection outside the first projection (eg Figure 1 The DF section in the circuit board 151 may be a non-flexible area. For example, when the target position is located between the first side surface 110 - a and the second side surface 110 - b (eg Figure 1 The flexible area may be the portion of the circuit board 151 located within the flexible substrate 110, and the non-flexible area may be the portion of the circuit board 151 located outside the flexible substrate 110. In some embodiments, the flexible area of the circuit board may be a flexible FPC, and the non-flexible area may be a rigid PCB.

[0065] The flexible area can bend elastically and deform accordingly with the deformation of the first sensitive unit 120 and the flexible substrate 110, so as to avoid obstructing the deformation of the first sensitive unit 120 and the flexible substrate 110, resulting in inaccurate motion measurement of the target object by the sensing device 100. The non-flexible area can provide rigid support for the processing circuit 152, while providing an installation position for the processing circuit 152 and preventing the processing circuit 152 from being bent and damaged. On the other hand, the setting of the flexible area and the non-flexible area can also make the stress concentration point of the circuit board 151 located in the non-flexible area, so that the projection of the stress concentration point of the circuit board 151 on the target object is located outside the first projection of the first sensitive unit 120 on the target object, so that the circuit board 151 has less influence on the deformation of the first sensitive unit 120 and the flexible substrate 110, thereby improving the working stability and accuracy of the sensing device 100.

[0066] In some embodiments, the non-flexible region of the circuit board 151 may further be provided with a soldering pad 154 , and the circuit board 151 may be electrically connected to an external circuit via the soldering pad 154 .

[0067] In some embodiments, the non-flexible region may be further provided with a reinforcing plate 153, which may be made of a rigid material (e.g., a stainless steel sheet, a ceramic sheet, etc.). The reinforcing plate 153 may further support the non-flexible region and reduce the probability of damage to the processing circuit 152 due to bending of the non-flexible region.

[0068] By setting a processing circuit 152 on the circuit board 151, the sensing device 100 can directly process the electrical signal generated by the first sensitive unit 120 without the need for an additional processor. The signal output by the sensing device 100 can be directly transmitted to the terminal and display the operating information of the target object.

[0069] In other embodiments, the derivation circuit 150 may not include the processing circuit 152, and the processing circuit 152 may be connected to the derivation circuit 150 as an external circuit. In this case, when the derivation circuit 150 includes the circuit board 151, the circuit board 151 may not include a non-flexible area, and there is no need to set the reinforcement plate 153; when the derivation circuit 150 includes a wire (e.g. Figure 4 When the wire 655 is used as shown, the wire is directly connected to the processing circuit as an external circuit, thereby effectively reducing the size and volume of the sensor device 100 and simplifying the structural design of the sensor device 100.

[0070] In some embodiments, the sensing device 100 may further include a protective layer 130, which is disposed on the outermost layer of the sensing device 100 to protect the sensing device 100 and prevent external contact and corrosion of components of the sensing device 100 (such as the first sensitive unit 120, the export circuit 150, etc.).

[0071] In some embodiments, the protection layer 130 may include a first protection portion 131 and a second protection portion 132. The first protection portion 131 covers the first sensitive unit 120 to protect the first sensitive unit 120. The second protection portion 132 covers the derivation circuit 150 to protect the derivation circuit 150.

[0072] In some embodiments, the thickness of the first protective portion 131 protruding from the first side surface 110 - a is the same as the thickness of the second protective portion 132 protruding from the first side surface 110 - a. That is, the side of the first protective portion 131 facing the target object is flush with the side of the second protective portion 132 facing the target object. This ensures that the side of the sensor device 100 facing the target object remains flat, preventing uneven deformation of the first sensitive unit 120, improving the operating stability of the sensor device 100, and reducing the foreign body sensation when the sensor device 100 is worn, thereby improving the wearing comfort of the sensor device 100.

[0073] In some embodiments, the thickness of the first protective portion 131 protruding from the second side surface 110 - b may be the same as or different from the thickness of the second protective portion 132 protruding from the second side surface 110 - b , and this specification does not impose excessive restrictions on this.

[0074] Please refer to Figure 1 ,like Figure 1 As shown, the sensing device 100 only includes a first sensitive unit 120 disposed on the first side 110-a. The first sensitive unit 120 is a capacitive structure. The target position is located between the first side 110-a and the second side 110-b, for example Figure 1 The derivation circuit 150 includes a circuit board 151, a processing circuit 152, and a reinforcement board 153. For more details about the derivation circuit 150, please refer to the above text and will not be repeated here.

[0075] In some embodiments, in the direction from the sensing device 100 toward the target object (i.e., the X direction), the first sensitive unit 120 includes a first electrode layer 121, a first dielectric layer 122, and a second electrode layer 123, which are sequentially arranged. The first dielectric layer 122 is located between the first electrode layer 121 and the second electrode layer 123. The first electrode layer 121 is connected to the first side surface 110-a of the flexible substrate 110, and the second electrode layer 123 is connected to the first protective portion 131.

[0076] The first conductive channel 111 can include a first sub-channel 111-1 and a second sub-channel 111-2, the first electrode layer 121 is electrically connected to the first sub-channel 111-1, and the second electrode layer 123 is electrically connected to the second sub-channel 111-2, so that the first electrode layer 121 is electrically connected to the derivation circuit 150 of the target position through the first sub-channel 111-1, and the second electrode layer 123 is electrically connected to the derivation circuit 150 of the target position through the second sub-channel 111-2, thereby realizing the connection between the capacitive structure and the derivation circuit 150. It should be noted that in some embodiments, when the first electrode layer 121 or the second electrode layer 123 of the first sensitive unit 120 has multiple electrodes, the number of the first sub-channel 111-1 or the second sub-channel 111-2 is also set to multiple according to the corresponding number of electrodes. In some embodiments, when the sensing device 100 is provided with multiple sensitive units, the number of electrodes of the electrode layer of each sensitive unit can be one or more, and the number of sub-channels of the corresponding conductive channel can also be one or more accordingly, so as to conduct the electrical signal generated by the sensitive unit to the derivation circuit 150.

[0077] Specifically, the first subchannel 111-1 forms a first subport (not marked in the figure) on the first side 110-a, and the first subchannel 111-1 forms a second subport (not marked in the figure) at the target position (for example, the position of area A), the first subchannel 111-1 is electrically connected to the electrode of the first electrode layer 121 at the first subport, and the first subchannel 111-1 is electrically connected to the export circuit 150 at the second subport; the second subchannel 111-2 forms a third subport (not marked in the figure) on the first side 110-a, and the second subchannel 111-2 forms a fourth subport (not marked in the figure) at the target position (for example, the position of area A), the second subchannel 111-2 is electrically connected to the electrode of the second electrode layer 123 at the third subport, and the second subchannel 111-2 is electrically connected to the export circuit 150 at the fourth subport.

[0078] like Figure 1 As shown, the thickness of the first protective portion 131 protruding from the second side surface 110-b can be different from the thickness of the second protective portion 132 protruding from the second side surface 110-b. That is, the side of the first protective portion 131 facing away from the target object is not flush with the side of the second protective portion 132 facing away from the target object, thereby making the side of the sensor device 100 facing away from the target object uneven. This allows for greater differentiation between the side of the sensor device 100 provided with the first sensitive unit 120 and the other side without the sensitive unit, facilitating proper wearing of the sensor device 100.

[0079] In some embodiments, when the target position is set between the first side surface 110-a and the second side surface 110-b (eg Figure 1In some embodiments, the flexible substrate 110 may be symmetrically arranged around the circuit board 151 of the derivation circuit 150 located at the target location (i.e., the area where the first conductive channel 111 is located on the first sub-substrate 110-1 (i.e., the area where the first sub-channel 111-1 and the second sub-channel 111-2 are located) and the circuit board 251 using conductive glue to ensure electrical connection between the first conductive channel 111 and the circuit board 151. The first sub-substrate 110-1 and the second sub-substrate 110-2 are bonded using non-conductive glue, and the area of the first sub-substrate 110-1 other than the first conductive channel 111 is bonded to the circuit board 251 using non-conductive glue to avoid interference with the conduction of electrical signals.

[0080] In some embodiments, the first sensitive unit 120 can be prepared first, wherein the preparation method of the first sensitive unit 120 can include but is not limited to spraying, sputtering, printing, etc. For example, two electrode layers can be printed on two films respectively, and the two films can be bonded to form the first sensitive unit 120 of the capacitive structure, wherein the two electrode layers correspond to the first electrode layer 121 and the second electrode layer 123 respectively, and the two bonded films correspond to the first dielectric layer 122. For another example, the second electrode layer 123, the first dielectric layer 122, and the first electrode layer 121 can be prepared in sequence on the first protective layer 131 of the protective layer 130 that abuts the first side surface 110-a. Compared to the first electrode layer 121 and the first dielectric layer 122, the second electrode layer 123 is relatively farther away from the flexible substrate 110. To prevent the first electrode layer 121 and the first dielectric layer 122 from obstructing the electrical connection between the second electrode layer 123 and the second sub-channel 111-2, in some embodiments, the second electrode layer 123 is larger than the first electrode layer 121 and the first dielectric layer 122. This allows the second electrode layer 123 to form a protrusion toward the flexible substrate 110, and the protrusion can abut against the second sub-channel 111-2 on the flexible substrate 110 to achieve electrical connection between the second electrode layer 123 and the second sub-channel 111-2. In some embodiments, the first electrode layer 121 and the second electrode layer 123 can be made of a flexible conductive material such as conductive ink or liquid metal.

[0081] The first sensitive unit 120 is attached to the first side surface 110-a of the first sub-base 110-1. A first hole is then machined in the first sub-base 110-1 and filled with a flexible conductive material to form a first conductive path 111. Heat and pressure are applied to ensure that the flexible conductive material in the first hole is in full contact with the electrode layer of the first sensitive unit 120 and is cured, thereby completing the preparation and installation of the first sensitive unit 120 and the first sub-base 110-1.

[0082] In some embodiments, the sensing device 100 further includes a second sensitive unit 140 disposed on the second side surface 110 - b . The second sensitive unit 140 can deform in response to the movement of the target object and generate an electrical signal accordingly. The electrical signal generated by the second sensitive unit 140 can be combined with and compared with the electrical signal generated by the first sensitive unit 120 to improve the measurement accuracy of the sensing device 100 .

[0083] In some embodiments, the second sensitive unit 140 can be a capacitive structure. In the direction from the first side 110-a to the second side 110-b (i.e., the opposite direction of the X direction), the second sensitive unit 140 includes a third electrode layer 141, a second dielectric layer 142, and a fourth electrode layer 143, which are arranged in sequence. The second dielectric layer 142 is located between the third electrode layer 141 and the fourth electrode layer 143. The third electrode layer 141 is connected to the second side 110-b of the flexible substrate 110, and the fourth electrode layer 143 is connected to the first protective portion 231.

[0084] In some embodiments, the flexible substrate 110 is provided with a second conductive channel 112, the second conductive channel 112 forms a third end on the second side 110-b, the third end is electrically connected to the electrode of the second sensitive unit 140, the second conductive channel 112 forms a fourth end at the target position, the fourth end is electrically connected to the export circuit 150 at the target position, thereby transmitting the electrical signal generated by the second sensitive unit 140 to the export circuit 150 at the target position through the second conductive channel 112.

[0085] Specifically, the second conductive channel 112 includes a third sub-channel 112-1 and a fourth sub-channel 112-2. The third sub-channel 112-1 forms a fifth sub-port (not shown) on the second side 110-b. Figure 1 The third subchannel 112-1 is electrically connected to the electrode of the third electrode layer 141 at the fifth subport, and the third subchannel 112-1 is electrically connected to the derivation circuit 150 at the sixth subport. The fourth subchannel 112-2 forms a seventh subport (not marked in the figure) on the second side 110-b, and the fourth subchannel 112-2 is electrically connected to the target position (e.g. Figure 1 The fourth subchannel 112-2 is electrically connected to the electrode of the fourth electrode layer 143 at the seventh subport, and the fourth subchannel 112-2 is electrically connected to the derivation circuit 150 at the eighth subport.

[0086] In some embodiments, the thickness of the first protective portion 131 protruding from the second side surface 110 - b and the thickness of the second protective portion 132 protruding from the second side surface 110 - b of the protective layer 130 can be the same. That is, the side of the first protective portion 131 facing away from the target object is flush with the side of the second protective portion 132 facing away from the target object. This ensures that the side of the sensor device 100 facing away from the target object remains flat, preventing uneven deformation of the second sensitive unit 140, improving the operating stability of the sensor device 100, and reducing the foreign body sensation when the sensor device 100 is worn, thereby improving the wearing comfort of the sensor device 100.

[0087] In some embodiments, the thickness of the first protective portion 131 of the protective layer 130 protruding from the second side 110 - b can be different from the thickness of the second protective portion 132 protruding from the second side 110 - b. That is, the side of the first protective portion 131 facing away from the target object is not flush with the side of the second protective portion 132 facing away from the target object. This allows for greater distinction between the sides of the sensor device 100 facing toward and away from the target object, facilitating proper fitting of the sensor device 100. Furthermore, since the second protective portion 132 needs to cover and protect the derivation circuit 150, and the circuit board 151 and processing circuit 152 of the derivation circuit 150 have a certain thickness, the second protective portion 132 needs to be thick enough to cover the derivation circuit 150. The thickness of the first protective portion 131 is not particularly restricted. In some embodiments, the second protective portion 132 protruding from the second side 110 - b can be thicker than the first protective portion 131 to cover and protect the derivation circuit 150.

[0088] In some embodiments, when the target position is set between the first side surface 110-a and the second side surface 110-b (eg Figure 1 When the flexible substrate 110 is positioned at the target location (e.g., in the area A shown in the figure), the flexible substrate 110 can be symmetrically structured with the circuit board 151 of the derivation circuit 150 positioned at the target location as the center. In this case, the flexible substrate 110 can include a first sub-substrate 110-1 and a second sub-substrate 110-2 located on either side of the circuit board 151. The connection between the first sub-substrate 110-1 and the first sensitive unit 120, and the connection between the second sub-substrate 110-2 and the second sensitive unit 140 can refer to the connection between the first sub-substrate 110-1 and the first sensitive unit 120 described above, and will not be repeated here.

[0089] In some embodiments, the preparation and installation of the first sub-substrate 110-1 and the first sensing unit 120, and the preparation and installation of the second sub-substrate 110-2 and the second sensing unit 140 can be the same as the preparation and installation of the first sub-substrate 110-1 and the first sensing unit 120 described above, and will not be repeated here. The circuit board 151 of the derivation circuit 150 is placed between the first sub-substrate 110-1 and the second sub-substrate 110-2 and bonded together, and finally covered with a protective layer 130, thereby completing the preparation of the sensor device 100.

[0090] Figure 2 FIG. 1 is another exemplary structural diagram of a sensing device according to some embodiments of this specification. Figure 2 As shown, the sensing device 400 includes a flexible substrate 410, a first sensitive unit 420, a protective layer 430, a second sensitive unit 440, and a derivation circuit 450. The target position is located at the second side surface 410-b, for example Figure 2 The flexible substrate 410 (e.g., the first side 410-a, the second side 410-b, etc.), the first sensitive unit 420 (e.g., the first electrode layer 421, the first dielectric layer 422, the second electrode layer 423, etc.), the protective layer 430 (e.g., the first protective portion 431, the second protective portion 432, etc.), the derivation circuit 450 (e.g., the circuit board 451, the processing circuit 452, the pad 454, etc.) can be connected to the flexible substrate 410 (e.g., the first side 410-a, the second side 410-b, etc.), the first sensitive unit 420 (e.g., the first electrode layer 421, the first dielectric layer 422, the second electrode layer 423, etc.), the protective layer 430 (e.g., the first protective Figure 1 The flexible substrate 110, the first sensitive unit 120, the protective layer 130, and the derivation circuit 150 are identical or similar and are not described in detail here. The difference between the sensing device 400 and the sensing device 100 is that the target position of the sensing device 400 is located on the second side surface 410-b, and the derivation circuit 450 is also correspondingly disposed on the second side surface 410-b. Figure 2 Region B location shown.

[0091] like Figure 2 As shown, in some embodiments, the circuit board 451 is arranged on the second side 410-b, and the circuit board 451 has little effect on the deformation of the flexible substrate 410 and the first sensitive unit 420. The circuit board 451 does not need to deform accordingly with the deformation of the flexible substrate 410 and the first sensitive unit 420. The circuit board 451 can adopt a flexible FPC or a rigid PCB, and the setting of the circuit board 451 can be more flexible.

[0092] In some embodiments, when the circuit board 451 is a rigid PCB, no additional reinforcement plate may be provided.

[0093] In some embodiments, the circuit board 451 can be flush with the side of the first protective portion 431 away from the target object, and the circuit board 451 is covered by the second protective portion 432 to reduce the impact of the circuit board 451 on the first sensitive unit 420, while protecting the circuit board 451 from external contact and corrosion. At this time, the first sub-channel 411-1 and the second sub-channel 411-2 of the first conductive channel 411 pass through the flexible substrate 410 and extend to the target position. Specifically, the first sub-channel 411-1 and the second sub-channel 411-2 can respectively pass through the protective layer 430 between the circuit board 451 and the flexible substrate 410 and extend to the circuit board 451 at the target position to conduct the electrical signal generated by the first sensitive unit 420 to the derivation circuit 450 at the target position.

[0094] In some embodiments, the third electrode layer 441 and the fourth electrode layer 443 of the second sensitive unit 440 can be directly electrically connected to the export circuit 450 (for example, a circuit board 451) located on the second side 410-b without the need for additional conductive channels, thereby simplifying the structure of the sensing device 400.

[0095] In some embodiments, the preparation and installation of the flexible substrate 410 and the first sensitive unit 420 can be the same as the preparation and installation process of the first sub-substrate 110-1 and the first sensitive unit 120, which will not be repeated here. Figure 2 Since the third electrode layer 441 and the fourth electrode layer 443 of the second sensitive unit 440 penetrate the first protective part 431 of the protective layer 430 and are connected to the circuit board 451 of the export circuit 450, it is difficult and complicated to prepare the second sensitive unit 440 directly on the side where the first protective part 431 of the protective layer 450 contacts the second side 410-b. In some embodiments, the second sensitive unit 440 can be prepared by screen printing the third electrode layer 441, the second dielectric layer 442, and the third electrode layer 443 in sequence on the second side 410-b of the flexible substrate 410. Compared with the fourth electrode layer 443 and the second dielectric layer 442, the third electrode layer 441 is relatively farther away from the export circuit 450 (for example, the circuit board 451). In order to avoid the fourth electrode layer 443 and the second dielectric layer 442 hindering the electrical connection between the third electrode layer 441 and the export circuit 450, in some embodiments, the size of the third electrode layer 441 is larger than the size of the fourth electrode layer 443 and the second dielectric layer 442, so that the third electrode layer 441 can form a protrusion toward the export circuit 450 (for example, the circuit board 451), and the protrusion can abut the export circuit 450 (for example, the circuit board 451) to achieve electrical connection between the second electrode layer 123 and the second sub-channel 111-2.

[0096] Figure 3FIG. 1 is another exemplary structural diagram of a sensing device according to some embodiments of this specification. Figure 3 As shown, the sensing device 500 includes a flexible substrate 510, a first sensitive unit 520, a protective layer 530, a second sensitive unit 540, and a derivation circuit 550. The target position is located between the first side surface 2510-a and the second side surface 510-b, for example Figure 3 The flexible substrate 510 (e.g., the first sub-substrate 510-1, the second sub-substrate 510-2, the first sub-channel 511-1 and the second sub-channel 511-2 of the first conductive channel 511, the third sub-channel 512-1 and the fourth sub-channel 512-2 of the second conductive channel 512, the first side 510-a, the second side 510-b, etc.), the first sensitive unit 520 (e.g., the first electrode layer 521, the first dielectric layer 522, the second electrode layer 523, etc.), the protective layer 530 (e.g., the first protective portion 531, the second protective portion 532, etc.), the second sensitive unit 540 (e.g., the third electrode layer 541, the second dielectric layer 542, the fourth electrode layer 543, etc.) can be connected to the flexible substrate 510 (e.g., the first sub-substrate 510-1, the second sub-channel 511-2, the first conductive channel 511, the third sub-channel 512-1 and the fourth sub-channel 512-2, the first side 510-a, the second side 510-b, etc.), the first sensitive unit 520 (e.g., the first electrode layer 521, the first dielectric layer 522, the second electrode layer 523, etc.), the protective layer 530 (e.g., the first protective portion 531, the second protective portion 532, etc.), the second sensitive unit 540 (e.g., the third electrode layer 541, the second dielectric layer 542, the fourth electrode layer 543, etc.) Figure 1 The flexible substrate 110, first sensitive unit 120, protective layer 130, and second sensitive unit 140 shown are identical or similar and are not described in detail here. The difference between the sensor device 500 and the sensor device 100 is that the derivation circuit 550 of the sensor device 500 lacks a processing circuit and a reinforcement plate. That is, the derivation circuit 550 does not process the electrical signals generated by the first sensitive unit 520 or the second sensitive unit 540. Instead, the derivation circuit 550 transmits the electrical signals directly to an external circuit connected to the pad 554 via the circuit board 551, which then processes and analyzes the electrical signals.

[0097] In some embodiments, the thickness of the first protective portion 531 protruding from the second side surface 510-b and the thickness of the second protective portion 532 protruding from the second side surface 510-b of the protective layer 530 of the sensing device 500 can be different. That is, the side of the first protective portion 531 facing away from the target object and the side of the second protective portion 532 facing away from the target object are not flush. This allows for greater distinction between the two sides of the sensing device 500 facing toward and away from the target object, facilitating proper wearing of the sensing device 500.

[0098] Figure 4 FIG. 1 is another exemplary structural diagram of a sensing device according to some embodiments of this specification. Figure 4 As shown, the sensing device 600 includes a flexible substrate 610, a first sensitive unit 620, a protective layer 630, a second sensitive unit 640, and a derivation circuit 650. The target position is located at the second side 610-b, for example Figure 4The flexible substrate 610 (e.g., the first side 610-a, the second side 610-b, the first sub-channel 611-1 and the second sub-channel 611-2 of the first conductive channel 611), the first sensitive unit 620 (e.g., the first electrode layer 621, the first dielectric layer 622, the second electrode layer 623), the protective layer 630 (e.g., the first protective portion 631, the second protective portion 632), the second sensitive unit 640 (e.g., the third electrode layer 641, the second dielectric layer 642, the fourth electrode layer 643), etc.) can be connected to the flexible substrate 610 (e.g., the first side 610-a, the second side 610-b, the first sub-channel 611-1 and the second sub-channel 611-2 of the first conductive channel 611), the first sensitive unit 620 (e.g., the first electrode layer 621, the first dielectric layer 622, the second electrode layer 623), the protective layer 630 (e.g., the first protective portion 631, the second protective portion 632), the second sensitive unit 640 (e.g., the third electrode layer 641, the second dielectric layer 642, the fourth electrode layer 643), etc.) Figure 2 The flexible substrate 410, first sensitive unit 420, protective layer 430, and second sensitive unit 440 shown are identical or similar and are not described in detail here. The difference between the sensing device 600 and the sensing device 400 is that the derivation circuit 650 of the sensing device 600 is a wire 655. That is, the derivation circuit 650 does not process the electrical signals generated by the first sensitive unit 620 and the second sensitive unit 640. Instead, the derivation circuit 650 transmits the electrical signals directly via the wire 655 to an external circuit connected to the wire 655, which then processes and analyzes the electrical signals.

[0099] Specifically, the first electrode layer 621 of the first sensitive unit 620 can be electrically connected to the first wire through the first sub-channel 611-1, the second electrode layer 623 of the first sensitive unit 620 can be electrically connected to the second wire through the second sub-channel 611-2, the third electrode layer 641 of the second sensitive unit 640 can be electrically connected to the third wire, and the fourth electrode layer 643 of the second sensitive unit 640 can be electrically connected to the fourth wire. The above four wires are electrically connected to the external circuit together.

[0100] Figure 5 FIG. 1 is another exemplary structural diagram of a sensing device according to some embodiments of this specification. Figure 5 As shown, the sensing device 800 includes a flexible substrate 810, a first sensitive unit 820, a protective layer 830, a second sensitive unit 840, and a derivation circuit 850. The target position is located between the first side surface 810-a and the second side surface 810-b, for example Figure 5The flexible substrate 810 (e.g., the first sub-substrate 810-1, the second sub-substrate 810-2, the first sub-channel 811-1 and the second sub-channel 811-2 of the first conductive channel 811, the third sub-channel 812-1 and the fourth sub-channel 812-2 of the second conductive channel 812, the first side surface 810-a, the second side surface 810-b, etc.), the protective layer 830 (e.g., the first protective portion 831, the second protective portion 832, etc.), and the derivation circuit 850 (e.g., the circuit board 851, the processing circuit 852, the reinforcement plate 853, the pad 854, etc.) can be the same as or similar to the flexible substrate 110, the protective layer 130, and the derivation circuit 150, and are not described in detail here. The difference between the sensor device 800 and the sensor device 100 is that the first sensitive unit 820 and the second sensitive unit 840 can be a resistive structure or an inductive structure.

[0101] In some embodiments, the first sensitive unit 820 may include a first electrode 821 and a second electrode 823, the first sub-channel 811-1 is electrically connected to the first electrode 821 at the first sub-port of the first side 810-a, and the first sub-channel 811-1 is at the target position (for example Figure 5 The second sub-port of the second sub-channel 811-2 at the first side 810-a is electrically connected to the second electrode 823, and the second sub-channel 811-2 is electrically connected to the target position (for example Figure 5 The fourth sub-port of the second sensitive unit 840 (the position of area A shown) is electrically connected to the derivation circuit 850. The second sensitive unit 840 may include a third electrode 841 and a fourth electrode 843. The flexible substrate 810 may be provided with a second conductive channel 812, and the third electrode 841 and the fourth electrode 843 of the second sensitive unit 840 are electrically connected to the derivation circuit 850 through the second conductive channel 812. Exemplarily, the second conductive channel 812 may include a third sub-channel 812-1 and a fourth sub-channel 812-2. The third sub-channel 812-1 forms a fifth sub-port on the second side 810-b, and the third sub-channel is at the target position (for example Figure 5 The third subchannel 812-1 is electrically connected to the third electrode 841 at the fifth subport, and the third subchannel 812-1 is electrically connected to the derivation circuit 850 at the sixth subport. The fourth subchannel 812-2 forms a seventh subport on the second side 810-b, and the fourth subchannel 812-2 is electrically connected to the target position (e.g., Figure 5 The eighth sub-port is formed in the area A shown in FIG. 8 , the fourth sub-channel 812 - 2 is electrically connected to the fourth electrode 843 at the seventh sub-port, and the fourth sub-channel 812 - 2 is electrically connected to the derivation circuit 850 at the eighth sub-port.

[0102] Figure 6FIG. 1 is another exemplary structural diagram of a sensing device according to some embodiments of this specification. Figure 6 As shown, the sensing device 900 includes a flexible substrate 910, a first sensitive unit 920, a protective layer 930, a second sensitive unit 940, and a derivation circuit 950. Among them, the flexible substrate 910 (such as the first sub-substrate 810-1, the second sub-substrate 810-2, the first side 810-a, the second side 810-b, etc.), the first sensitive unit 920, the protective layer 930 (such as the first protective portion 931, the second protective portion 932, etc.), the second sensitive unit 940, and the derivation circuit 950 (such as the circuit board 951, the processing circuit 952, the pad 954, etc.) can be the same as or similar to the flexible substrate 810, the first sensitive unit 820, the protective layer 830, the second sensitive unit 840, and the derivation circuit 850, and are not described in detail here. The difference between the sensing device 900 and the sensing device 800 is that the target position of the sensing device 900 is located on the second side 910-b, for example Figure 6 As shown in the area B, the corresponding derivation circuit 950 is also arranged on the second side 910-b.

[0103] In some embodiments, when the circuit board 951 of the derivation circuit 950 is disposed on the second side surface 910 - b , the circuit board 951 has a minimal effect on the deformation of the flexible substrate 910 and the first and second sensitive units 920 and 940 . The circuit board 951 does not need to deform accordingly with the deformation of the flexible substrate 910 and the first and second sensitive units 920 and 940 . The circuit board 951 can be a flexible FPC or a rigid PCB, allowing for greater flexibility in its configuration. In some embodiments, when the circuit board 951 is a rigid PCB, no additional reinforcement plate is required.

[0104] In some embodiments, the third electrode 941 and the fourth electrode 943 of the second sensitive unit 940 can be directly electrically connected to the export circuit 950 (for example, a circuit board 951) located on the second side 910-b without the need for an additional conductive channel, thereby simplifying the structure of the sensing device 900.

[0105] Figure 7 FIG. 1 is another exemplary structural diagram of a sensing device according to some embodiments of this specification. Figure 7As shown, the sensing device 1000 includes a flexible substrate 1010, a first sensitive unit 1020, a protective layer 1030, a second sensitive unit 1040, and a derivation circuit 1050. The first sensitive unit 1020 (e.g., a first electrode layer 1021, a first dielectric layer 1022, a second electrode layer 1023, etc.), the protective layer 1030 (e.g., a first protective portion 1031, a second protective portion 1032, etc.), and the second sensitive unit 1040 (e.g., a third electrode layer 1041, a second dielectric layer 1042, a fourth electrode layer 1043, etc.) can be connected to the flexible substrate 1010. Figure 1 The first sensitive unit 120, the protective layer 130, the second sensitive unit 140 or the Figure 2 The first sensitive unit 420, protective layer 430, and second sensitive unit 440 of the sensor device 400 are the same or similar and are not described in detail here. The difference between the sensor device 1000 and the sensor device 100 and the sensor device 400 is that the target position of the first sensitive unit 1020 of the sensor device 1000 is located between the first side surface 1010-a and the second side surface 1010-b, for example Figure 7 The target position of the second sensitive unit 1040 is located at the second side 1010-b, for example Figure 7 The derivation circuit 1050 can be electrically connected to the corresponding sensitive units at the two target locations at the same time.

[0106] In some embodiments, the flexible substrate 1010 can be divided into a first sub-substrate 1010-1, which is relatively close to the target object, and a second sub-substrate 1010-2, which is relatively far away from the target object, by a plane passing through region A and parallel to the first side surface 1010-a or the second side surface 1010-b. The side of the first sub-substrate 1010-1 close to the target object is the first side surface 1010-a, and the side of the second sub-substrate 1010-2 far away from the target object is the second side surface 1010-b. In the direction from the sensing device 1000 pointing toward the target object (i.e., the X direction), the thickness of the first sub-substrate 1010-1 and the second sub-substrate 1010-2 can be the same or different. In the extension direction of the flexible substrate 1010 (i.e., the Y direction), the length of the first sub-substrate 1010-1 can be less than the length of the second sub-substrate 1010-2. In some embodiments, the first sub-substrate 1010-1 and the second sub-substrate 1010-2 can be integrally formed or separately prepared and then bonded.

[0107] In some embodiments, the circuit board 1051 of the derivation circuit 1050 and the second sub-substrate 1010-2 are arranged side by side in the Y direction on a side of the first sub-substrate 1010-1 opposite the first side surface 1010-a. This ensures that one side of the derivation circuit 1050 is electrically connected to the first sensitive unit 1020 in region A via the first conductive path 1011, while the other side of the derivation circuit 1050 is directly electrically connected to the second sensitive unit 1040 in region B. The processing circuit 1052 and the pads 1054 are both arranged on the other side of the circuit board 1051.

[0108] In some embodiments, the thickness of the circuit board 1051 of the derivation circuit 1050 can be the same as or approximately the same as the thickness of the second sub-substrate 1010-2. That is, the side of the second sub-substrate 1010-2 facing away from the target object is flush or approximately flush with the side of the circuit board 1051 facing away from the target object, together forming the second side surface 1010-b. This configuration can increase the thickness of the derivation circuit 1050 in the X direction, thereby improving the support strength of the derivation circuit 1050 for the processing circuit 1052 and enhancing the operating stability of the sensor device 1000.

[0109] Exemplarily, when the first sensitive unit 1020 and the second sensitive unit 1040 are capacitive structures, a first conductive channel 1011 is provided on the first sub-substrate 1010-1, and the first conductive channel 1011 includes a first sub-channel 1011-1 and a second sub-channel 1011-2. The first electrode layer 1021 of the first sensitive unit 1020 is electrically connected to the first sub-port of the first sub-channel 1011-1 at the first side 1010-a, and the second sub-port of the first sub-channel 1011-1 at the position of area A is electrically connected to the said one side of the circuit board 1051; the second electrode layer 1023 of the first sensitive unit 1020 is electrically connected to the third sub-port of the second sub-channel 1011-2 at the first side 1010-a, and the fourth sub-port of the second sub-channel 1011-2 at the position of area A is electrically connected to the said one side of the circuit board 1051. The third electrode layer 1041 and the fourth electrode layer 1043 of the second sensitive unit 1040 are directly electrically connected to the other side of the circuit board 1051 .

[0110] Figure 7 The sensor device 1000 shown in the figure can not only simplify the installation steps, but also the preparation process of the first sensitive unit 1020 and the second sensitive unit 1040 can be the same as that of the conventional sensor device 1000. Figure 1 The manufacturing process of the first sensitive unit 120 and the second sensitive unit 140 is the same, and the yield of the first sensitive unit 1020 and the second sensitive unit 1040 is high. The sensing device 1000 is not only suitable for application scenarios such as laboratories, but also for industrial mass production application scenarios.

[0111] In some embodiments, when the first sensitive unit 1020 and the second sensitive unit 1040 are of resistive or inductive structures, the connection method between the two and the circuit board 1051 can refer to the connection method between the above-mentioned capacitive structure and the circuit board 1051, which will not be repeated here.

[0112] In some embodiments, when the derivation circuit 1050 includes wires, two of the wires can be electrically connected to the first sensitive unit 1020 through the first sub-channel 1011-1 and the second sub-channel 1011-2 at the position of area A, and the other two wires can be directly electrically connected to the second sensitive unit 1040 at the position of area B.

[0113] Some embodiments of this specification also provide a wearable device for collecting motion signals of a target object, which includes the sensing device as described above (for example, sensing device 100, sensing device 400, sensing device 500, sensing device 1000, etc.), so that the wearable device can have higher working stability and wearing comfort.

[0114] The basic concepts have been described above. It will be apparent to those skilled in the art that the detailed disclosure above is merely illustrative and does not limit the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and amendments to the present application. Such modifications, improvements, and amendments are suggested in the present application and remain within the spirit and scope of the exemplary embodiments of the present application.

[0115] At the same time, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or multiple times in different locations in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

[0116] Similarly, it should be noted that, in order to simplify the presentation of this application and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this application sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not mean that the subject matter of this application requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single embodiment disclosed above.

[0117] In some embodiments, numbers are used to describe the quantity of components and attributes. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise stated, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the description and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the settings of such numerical values are as accurate as possible within the feasible range.

[0118] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other variations may also fall within the scope of this application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this application may be considered consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly introduced and described in this application.

Claims

1. A sensor device for collecting motion signals of a target object, characterized in that: include: a flexible substrate comprising a first side facing the target object; The first sensitive unit is used to detect the target object and generate an electrical signal, and the first sensitive unit is arranged on the first side of the flexible substrate; wherein, The flexible substrate is provided with a first conductive channel, and the first conductive channel is used to conduct the electrical signal generated by the first sensitive unit to a target position, and the target position is farther away from the target object than the first side surface.

2. The sensing device according to claim 1, wherein: The flexible substrate is provided with a first hole portion, and the first hole portion is filled with a flexible conductive material to form the first conductive channel.

3. The sensing device according to claim 1 or 2, characterized in that: The sensing device further includes a derivation circuit disposed at the target position, wherein the first conductive path forms a first end portion on the first side surface, and the first end portion is electrically connected to an electrode of the first sensitive unit; The first conductive path forms a second end portion at the target position, and the second end portion is electrically connected to the derivation circuit.

4. The sensing device according to claim 3, characterized in that The flexible substrate includes a second side surface opposite to the first side surface. A second sensitive unit is provided on the second side surface. Another electrical signal generated by the second sensitive unit is conducted to the derivation circuit.

5. The sensing device according to claim 4, characterized in that The target position is located between the first side surface and the second side surface, and the flexible substrate is provided with a second conductive path. The second conductive channel forms a third end portion on the second side surface, and the third end portion is electrically connected to the electrode of the second sensitive unit; The second conductive path forms a fourth end portion at the target position, and the fourth end portion is electrically connected to the derivation circuit.

6. The sensing device according to claim 4, characterized in that The target location is located on the second side surface, and the first conductive path penetrates the flexible substrate and extends to the target location.

7. The sensing device according to any one of claims 3 to 6, characterized in that: The derivation circuit includes a circuit board or a wire.

8. The sensing device according to claim 7, characterized in that The circuit board includes a flexible area and a non-flexible area. The flexible area is arranged at the target position, and a processing circuit is arranged on the non-flexible area.

9. The sensing device according to claim 8, characterized in that The non-flexible area is provided with a reinforcing plate, and the reinforcing plate is in contact with the non-flexible area.

10. The sensing device according to claim 8, characterized in that The projection of the non-flexible area on the target object is outside the projection of the first sensitive unit on the target object.

11. The sensing device according to claim 7, characterized in that The flexible substrate includes a first sub-substrate and a second sub-substrate, wherein the first sub-substrate is close to the target object and the second sub-substrate is far away from the target object, the side of the first sub-substrate close to the target object is the first side surface, and the side of the second sub-substrate far away from the target object is the second side surface, and the first sub-substrate is provided with the first conductive path; When the derivation circuit includes a circuit board, the circuit board and the second sub-base are arranged side by side on a side of the first sub-base opposite to the first side surface.

12. The sensing device according to claim 1, wherein: The first sensitive unit is a capacitive structure, and the first sensitive unit includes a first electrode layer and a second electrode layer. A dielectric layer is provided between the first electrode layer and the second electrode layer. The first conductive channel includes a first sub-channel and a second sub-channel. The first sub-channel is electrically connected to the first electrode layer, and the second sub-channel is electrically connected to the second electrode layer.

13. The sensing device according to claim 12, characterized in that The sensing device further includes a derivation circuit provided at the target location, the first subchannel forming a first subport at the first side surface, the first subchannel forming a second subport at the target location, the first subchannel being electrically connected to an electrode of the first electrode layer at the first subport, and the first subchannel being electrically connected to the derivation circuit at the second subport; The second subchannel forms a third subport on the first side, the second subchannel forms a fourth subport at the target position, the second subchannel is electrically connected to the electrode of the second electrode layer at the third subport, and the second subchannel is electrically connected to the export circuit at the fourth subport.

14. The sensing device according to claim 12, wherein: The sensing device further includes a derivation circuit disposed at the target position, the flexible substrate includes a second side surface opposite to the first side surface, the second side surface is provided with a second sensitive unit, the second sensitive unit is a capacitive structure, the second sensitive unit includes a third electrode layer and a fourth electrode layer, another dielectric layer is provided between the third electrode layer and the fourth electrode layer, the target position is located between the first side surface and the second side surface, the flexible substrate is provided with a second conductive channel, the second conductive channel includes a third sub-channel and a fourth sub-channel, The third subchannel forms a fifth subport at the second side surface, the third subchannel forms a sixth subport at the target position, the third subchannel is electrically connected to the electrode of the third electrode layer at the fifth subport, and the third subchannel is electrically connected to the derivation circuit at the sixth subport; The fourth subchannel forms a seventh subport on the second side, the fourth subchannel forms an eighth subport at the target position, the fourth subchannel is electrically connected to the electrode of the fourth electrode layer at the seventh subport, and the fourth subchannel is electrically connected to the export circuit at the eighth subport.

15. The sensing device according to claim 12, wherein: The sensing device also includes a derivation circuit arranged at the target position, the flexible substrate includes a second side surface opposite to the first side surface, the second side surface is provided with a second sensitive unit, the second sensitive unit is a capacitive structure, the second sensitive unit includes a third electrode layer and a fourth electrode layer, another dielectric layer is provided between the third electrode layer and the fourth electrode layer, the target position is located on the second side surface, and the third electrode layer and the fourth electrode layer are respectively directly electrically connected to the derivation circuit.

16. The sensing device according to claim 1, wherein The first sensitive unit is a resistive structure or an inductive structure, the resistive structure or the inductive structure includes a first electrode and a second electrode, the first conductive channel includes a first sub-channel and a second sub-channel, the first sub-channel is electrically connected to the first electrode, and the second sub-channel is electrically connected to the second electrode.

17. The sensing device according to claim 16, characterized in that The sensing device further includes a derivation circuit provided at the target location, wherein the first subchannel forms a first subport on the first side surface, and the first subchannel forms a second subport at the target location, the first subchannel is connected to the first electrode at the first subport, and the first subchannel is electrically connected to the derivation circuit at the second subport; The second subchannel forms a third subport on the first side, the second subchannel forms a fourth subport at the target position, the second subchannel is electrically connected to the second electrode at the third subport, and the second subchannel is electrically connected to the derivation circuit at the fourth subport.

18. The sensing device according to claim 16, wherein: The sensing device further includes a derivation circuit disposed at the target position, the flexible substrate includes a second side surface opposite to the first side surface, the second side surface is provided with a second sensitive unit, the second sensitive unit is a resistive structure or an inductive structure, the second sensitive unit includes a third electrode and a fourth electrode, the target position is located between the first side surface and the second side surface, the flexible substrate is provided with a second conductive channel, the second conductive channel includes a third sub-channel and a fourth sub-channel, The third subchannel forms a fifth subport at the second side surface, the third subchannel forms a sixth subport at the target position, the third subchannel is electrically connected to the third electrode at the fifth subport, and the third subchannel is electrically connected to the derivation circuit at the sixth subport; The fourth subchannel forms a seventh subport on the second side, the fourth subchannel forms an eighth subport at the target position, the fourth subchannel is electrically connected to the fourth electrode at the seventh subport, and the fourth subchannel is electrically connected to the derivation circuit at the eighth subport.

19. The sensing device according to claim 16, wherein: The sensing device also includes a derivation circuit arranged at the target position, the flexible substrate includes a second side surface opposite to the first side surface, the second side surface is provided with a second sensitive unit, the second sensitive unit is a resistive structure or an inductive structure, the second sensitive unit includes a third electrode and a fourth electrode, the target position is located at the second side surface, and the third electrode and the fourth electrode are respectively directly electrically connected to the derivation circuit.

20. The sensing device according to claim 1, wherein The sensing device includes a protective layer, which includes a first protective part and a second protective part. The first protective part covers the first sensitive unit. The sensing device also includes a derivation circuit arranged at the target position, and the second protective part covers the derivation circuit. The thickness of the first protective part protruding from the first side surface is the same as the thickness of the second protective part protruding from the first side surface.

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