Atomic-level tool setting method and system based on in-situ detection of transition layer thickness

Abstract

The application provides an atomic-level tool setting method and system based on in-situ detection of transition layer thickness, and belongs to the technical field of machining. The method uniformly prepares a soft transition layer on the surface of a workpiece to be machined; then a machine tool drives a tool according to a preset cutting feed program to cut a plane on the surface of the transition layer and record the Z-axis coordinate of the machine tool; an atomic-level spectral thickness measuring device is used to in-situ detect the residual thickness of the transition layer after cutting; finally, the distance between the tip of the tool and the surface of the workpiece is calculated according to the residual thickness of the transition layer, and the tool setting coordinate is finally determined. The system comprises a transition layer preparation module, a cutting coordinate recording module, a thickness measuring module and a coordinate calculation module, and each module cooperates to realize the automation of transition layer cutting, thickness measurement and coordinate calculation. The application realizes non-contact tool setting with nanonewton-level contact force control, atomic-level precision and minute-level efficiency, and solves the problems of low tool setting efficiency, low precision and easy damage to tools or workpieces in machining.

Description

Technical Field

[0001] This invention relates to the field of machining technology, and in particular to an atomic-level tool setting method and system based on in-situ detection of transition layer thickness. Background Technology

[0002] In the field of machining, tool setting is a crucial step in determining the relative position coordinates between the tool tip and the workpiece surface. Its accuracy and efficiency directly affect machining quality, especially in precision or ultra-precision machining of micro- and nano-structures. Current technologies mainly employ acoustic / force signal discrimination and visual observation. The former relies on sensors to capture contact signals to determine the tool setting position, while the latter determines the contact state by manually observing chip generation. However, both methods have inherent technical bottlenecks. Acoustic / force signal discrimination requires direct contact between the tool and the workpiece. In micro- and nano-machining scenarios, direct contact between the tool tip and the workpiece is highly susceptible to tool chipping or workpiece surface damage due to rigid contact forces. Visual observation is limited by the micrometer-level resolution of the human eye and relies on operator experience. The tool setting process requires slow, trial-and-error adjustments at extremely low feed rates, with a single setting session taking tens of minutes. Both methods struggle to meet the demands of automated machining and atomic-level precision control.

[0003] Furthermore, the shortcomings of existing technologies stem from the rigid contact tool setting mechanism, where the tool and workpiece are in direct contact. The contact force can damage the microstructure of the tool tip or workpiece surface, causing issues such as tool edge chipping and plastic deformation pits on the workpiece surface. To avoid damage, the feed rate must be reduced and manual probing is required, resulting in low tool setting efficiency and taking tens of minutes. Additionally, the contact signal relies on sensors or human observation, with accuracy limited by the micrometer-level resolution of the sensors or human eye. Moreover, manual operation introduces subjective errors, leading to poor consistency in tool setting.

[0004] Therefore, providing an atomic-level tool setting method and system based on in-situ detection of transition layer thickness has significant practical implications. Summary of the Invention

[0005] To overcome the shortcomings of existing technologies, the purpose of this invention is to provide an atomic-level tool setting method and system based on in-situ detection of transition layer thickness. This method achieves non-contact tool setting with nanonewton-level contact force control, atomic-level precision, and minute-level efficiency, thus solving the problems of low tool setting efficiency, low precision, and easy damage to tools or workpieces in machining.

[0006] To achieve the above objectives, the present invention provides the following solution:

[0007] An atomic-level tool setting method based on in-situ detection of transition layer thickness includes the following steps:

[0008] S1. Prepare a soft, uniform transition layer on the surface of the workpiece to be processed;

[0009] S2. Using a machine tool to drive the cutting tool with a preset cutting feed program, a plane is cut out from the surface of the transition layer, and the machine tool Z-axis coordinate at this time is recorded as a reference.

[0010] S3. Use an atomic-level spectral thickness measurement device to detect the remaining thickness of the transition layer after cutting in situ;

[0011] S4. Based on the remaining thickness of the transition layer, calculate the distance between the tool tip and the workpiece surface, and finally determine the tool setting coordinates to achieve atomic-level precision tool setting.

[0012] Preferably, in S1, the preparation of the transition layer includes, but is not limited to, preparation by spin-coating photoresist and curing, and the transition layer is made of a thin film material with a hardness less than that of the workpiece to be processed.

[0013] Preferably, in S2, the machine tool drives the cutting tool to cut a plane on the surface of the transition layer at a cutting depth of 2μm / cut, which is used to measure the thickness of the transition layer, and the recorded machine tool Z-axis coordinate is Z0.

[0014] Preferably, in S3, the atomic-level spectral thickness measurement device is based on the principle of spectral interference and calculates the remaining thickness t of the transition layer by the optical path difference and phase difference of the reflected light from the upper and lower surfaces of the transition layer.

[0015] Preferably, in S4, the formula for calculating the distance ΔZ between the tool tip and the workpiece surface is:

[0016] ΔZ=Z0-tR(1-cos(arcsin(min(1,(δ P / R)))));

[0017] In the formula, Z0 is the Z-axis coordinate of the machine tool after cutting the transition layer, t is the remaining thickness of the transition layer after cutting, R is the radius of curvature of the tool tip, and δ P This represents the local plastic indentation depth in the current tool-transition layer contact area;

[0018] The formula for calculating the tool setting coordinates is:

[0019]

[0020] Among them, the local plastic indentation depth δ generated when the tool cuts the transition layer is the result of the tool contacting the transition layer. P for:

[0021]

[0022] In the formula, t c The contact time between the tool and the transition layer. For the equivalent plastic strain rate, δ eff (τ) is the Von Mises equivalent stress, εP (τ) represents the cumulative equivalent plastic strain rate from time 0 to τ, θ(τ) represents the real-time temperature of the contact region, and υ n This is the velocity component of the tool in the direction normal to the contact point;

[0023] δ eff (τ)=δ Y (θ)+κ(θ)·[ε P ] n(θ) ;

[0024] In the formula, δ Y (θ) represents the temperature-dependent initial yield stress, κ(θ) represents the temperature-dependent hardening coefficient, and ε P The current cumulative equivalent plastic strain is given by n(θ), which is the temperature-dependent hardening exponent.

[0025] Therefore, the contact force F between the tool and the transition layer is calculated as follows:

[0026]

[0027]

[0028] In the formula, A c δ represents the real-time contact area between the tool and the transition layer. ZZ For the normal stress at the contact point, E eff For the equivalent elastic modulus, For the elastic strain component, η eff The equivalent viscosity coefficient, Let Γ(·) be the total normal strain rate, and Γ(·) be the plastic stress component. For local plastic strain, Where θ is the plastic strain rate and θ is the temperature, the contact force F is controlled to be less than 100 nN by material parameter calibration.

[0029] This invention also provides an atomic-level tool setting system based on in-situ detection of transition layer thickness, comprising:

[0030] The transition layer preparation module is used to prepare a soft and uniform transition layer on the surface of the workpiece to be processed;

[0031] The cutting coordinate recording module is used to cut a plane for measuring the thickness of the transition layer from the surface of the transition layer by driving the tool with a preset cutting feed program, and record the Z-axis coordinate of the machine tool at this time as a reference.

[0032] Thickness measurement module, used to detect the remaining thickness of the transition layer after cutting using an atomic-level spectral thickness measurement device;

[0033] The coordinate calculation module is used to calculate the distance between the tool tip and the workpiece surface based on the remaining thickness of the transition layer, and finally determine the tool setting coordinates to achieve atomic-level precision tool setting.

[0034] Preferably, the cutting coordinate recording module includes a machine tool X-axis, a machine tool Y-axis, a machine tool Z-axis, and a rotary spindle. The machine tool Y-axis is fixed to the machine tool X-axis, the rotary spindle is fixed to the machine tool Y-axis, the workpiece to be processed is detachably mounted on the end of the rotary spindle, a tool post is detachably mounted on the machine tool Z-axis, and a cutting tool is detachably mounted on the tool post.

[0035] Preferably, the thickness measurement module includes a fiber optic probe, a collimating lens, and an atomic-level spectral thickness measurement device. The collimating lens is fixed to the front end of the fiber optic probe, and the atomic-level spectral thickness measurement device is connected to the fiber optic probe via an incident signal transmission line and a return signal transmission line. The atomic-level precision thickness measurement device includes one or more of a scanning electron microscope, a laser interferometer, and a spectral interferometer.

[0036] The atomic-level spectral thickness measurement device includes a light source, a light source controller, a spectrometer, a spectrometer controller, a power supply interface, and a data transmission line interface. The light source is connected to the incident signal transmission line through the incident signal transmission line interface, and the spectrometer is connected to the return signal transmission line through the return signal interface. The light source controller and the spectrometer controller are electrically connected to the light source and the spectrometer, respectively. The power supply interface and the data transmission line interface are connected to an external power supply and the data transmission line, respectively.

[0037] Preferably, the coordinate calculation module includes a computer, which communicates with the data transmission line interface of the atomic-level spectral thickness measurement device through a data transmission line and is connected to the power supply interface through a power supply line. It is used to receive thickness data, calculate tool setting coordinates, and control the machine tool movement, with a single tool setting time of <5 minutes.

[0038] Preferably, the transition layer prepared by the transition layer preparation module is a soft material for thickness measurement; the cutting tool and the fiber optic probe are fixed side by side on the tool holder and move synchronously with the Z-axis of the bed; the collimating lens is used to adjust the diameter of the measurement spot to adapt to different measurement needs.

[0039] According to specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0040] This invention constructs a flexible contact system between the tool, transition layer, and workpiece by preparing a soft transition layer with a hardness significantly lower than that of the workpiece substrate on the surface of the workpiece. This system allows the tool to undergo controllable plastic deformation only with the transition layer during tool setting, with the contact force controlled at the nanonewton level (F < 100 nN), thus avoiding damage caused by direct contact between the tool and the workpiece. An atomic-level spectral thickness gauge is used to detect the remaining thickness of the transition layer in situ, and the tool setting coordinates are calculated using machine tool coordinates, improving tool setting accuracy to the atomic level. Through a fully automated design integrating automatic machine tool cutting, real-time thickness measurement, and automatic computer calculation, the single tool setting time is reduced to the minute level (< 5 minutes), eliminating reliance on manual experience and achieving a repeatability error of < 0.1 nm. Simultaneously, the collimating lens allows adjustment of the measurement spot size, and the thickness measurement device supports replacement with equipment such as scanning electron microscopes, enhancing the system's adaptability to different scenarios and expanding the application range of the non-contact tool setting method using a soft transition layer and high-precision thickness measurement. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a flowchart of an atomic-level tool setting method based on in-situ detection of transition layer thickness according to the present invention;

[0043] Figure 2 This is a schematic diagram of the structure of an atomic-level tool setting system based on in-situ detection of transition layer thickness according to the present invention;

[0044] Figure 3 This is a schematic diagram of the principle of the tool setting system based on in-situ detection of transition layer thickness provided by the present invention;

[0045] Figure 4 This is a schematic diagram of the atomic-level spectral thickness measurement device provided by the present invention;

[0046] Explanation of reference numerals in the attached figures:

[0047] 1. Machine tool X-axis; 2. Machine tool Y-axis; 3. Rotary spindle; 4. Workpiece to be processed; 5. Transition layer; 6. Collimating lens; 7. Fiber optic probe; 8. Tool; 9. Tool holder; 10. Machine tool Z-axis; 11. Incident signal transmission line; 12. Return signal transmission line; 13. Atomic-level spectral thickness measurement device; 14. Data transmission line; 15. Computer; 16. Power supply line; 17. Light source controller; 18. Power supply interface; 19. Data transmission line interface; 20. Spectrometer controller; 21. Return signal interface; 22. Spectrometer; 23. Incident signal transmission line interface; 24. Light source. Detailed Implementation

[0048] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0049] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0050] Existing technologies, due to their rigid contact tool setting mechanism, cause contact forces exceeding the material's microscopic strength threshold, leading to damage to both the tool and the workpiece. Furthermore, visual observation relies on manual, low-speed probing and repeated confirmation of chip generation, and the resolution of acoustic / force sensors and human observation is limited, also affected by sensor threshold parameter settings and subjective human judgment. This invention, however, reduces the tool setting contact force from the micrometer level (>10mN) to the nanonewton level (<100nN) by coating a soft transition layer on the workpiece surface. This allows only the transition layer to undergo controllable plastic deformation, avoiding direct contact between the tool and the workpiece substrate and eliminating rigid contact damage. Simultaneously, it utilizes automatic machine tool cutting of the transition layer plane, real-time in-situ measurement with an atomic-level thickness gauge, and automatic coordinate calculation by the control unit, achieving automated and rapid tool setting, reducing the single tool setting time to the minute level (<5 minutes). Employing spectral interferometry thickness measurement technology, combined with the machine tool's 0.1nm-level feed accuracy, the tool setting accuracy is improved from the micrometer level to the atomic level. By implementing fully automated control, pre-setting parameters, automatically collecting data, and performing calculations, subjective errors introduced by manual operation are eliminated. The repeatability error of the tool setting result is <0.1nm. This fundamentally solves the problems of low efficiency, low precision, easy damage to workpieces and tools, and reliance on human experience in existing tool setting methods. It provides an innovative tool setting method for the micro-nano processing field that combines non-destructive, high efficiency, and high precision.

[0051] Specifically, such as Figure 1 As shown, this invention provides an atomic-level tool setting method based on in-situ detection of transition layer thickness, comprising the following steps:

[0052] S1. A soft transition layer is uniformly prepared on the surface of the workpiece to be processed;

[0053] S2. Using a machine tool to drive the cutting tool with a preset cutting feed program, a plane is cut out from the surface of the transition layer, and the machine tool Z-axis coordinate at this time is recorded as a reference.

[0054] S3. Use an atomic-level spectral thickness measurement device to detect the remaining thickness of the transition layer after cutting in situ;

[0055] S4. Based on the remaining thickness of the transition layer, calculate the distance between the tool tip and the workpiece surface, and finally determine the tool setting coordinates to achieve atomic-level precision tool setting.

[0056] Further, in S1, the transition layer is preferably prepared by spin-coating photoresist and then curing it, and the transition layer is made of a thin film material with a hardness lower than that of the workpiece to be processed. For example, if the workpiece to be processed is silicon with a hardness of 20 GPa, the transition layer should be made of a soft material with a hardness lower than this value so that plastic deformation occurs preferentially during cutting, avoiding direct contact between the tool and the workpiece, which could cause damage. In S2, the machine tool drives the tool to cut a plane on the surface of the transition layer at a cutting depth of 2 μm / cut, which is used to measure the thickness of the transition layer. The recorded machine tool Z-axis coordinate is Z0.

[0057] In S3, the atomic-level spectral thickness measurement device is based on the principle of spectral interference and calculates the remaining thickness t of the transition layer by the optical path difference and phase difference of the reflected light from the upper and lower surfaces of the transition layer.

[0058] In S4, the formula for calculating the distance ΔZ between the tool tip and the workpiece surface is:

[0059] ΔZ=Z0-tR(1-cos(arcsin(min(1,(δ P / R)))));

[0060] In the formula, Z0 is the Z-axis coordinate of the machine tool after cutting the transition layer, t is the remaining thickness of the transition layer after cutting, R is the radius of curvature of the tool tip, and δ P This represents the local plastic indentation depth in the current tool-transition layer contact area;

[0061] The formula for calculating the tool setting coordinates is:

[0062]

[0063] When the tool contacts the transition layer, due to the low hardness of the transition layer, only plastic compression occurs. The local plastic indentation depth δ generated by the contact between the tool and the transition layer is... P for:

[0064]

[0065] In the formula, t c The contact time between the tool and the transition layer. For the equivalent plastic strain rate, δ eff (τ) is the Von Mises equivalent stress, ε P (τ) represents the cumulative equivalent plastic strain rate from time 0 to τ, θ(τ) represents the real-time temperature of the contact region, and υ n This is the velocity component of the tool in the direction normal to the contact point;

[0066] δ eff (τ)=δ Y (θ)+κ(θ)·[ε P ] n(θ) ;

[0067] In the formula, δ Y (θ) represents the temperature-dependent initial yield stress, κ(θ) represents the temperature-dependent hardening coefficient, and ε P The current cumulative equivalent plastic strain is given by n(θ), which is the temperature-dependent hardening exponent.

[0068] Therefore, the contact force F between the tool and the transition layer is calculated as follows:

[0069]

[0070] In the formula, A c δ represents the real-time contact area between the tool and the transition layer. ZZ For the normal stress at the contact point, E eff For the equivalent elastic modulus, For the elastic strain component, η eff The equivalent viscosity coefficient, Let Γ(·) be the total normal strain rate, and Γ(·) be the plastic stress component. For local plastic strain, Where θ is the plastic strain rate and θ is the temperature, the contact force F is controlled to be less than 100 nN by material parameter calibration.

[0071] Reference Figure 2 and Figure 3 As shown, the present invention also provides an atomic-level tool setting system based on in-situ detection of transition layer thickness, comprising:

[0072] The transition layer preparation module is used to uniformly prepare a soft transition layer on the surface of the workpiece to be processed;

[0073] The cutting coordinate recording module is used to cut a plane for measuring the thickness of the transition layer by driving the tool with the machine tool to a preset cutting depth, and record the Z-axis coordinate of the machine tool at this time as a reference.

[0074] Thickness measurement module, used to detect the remaining thickness of the transition layer after cutting using an atomic-level spectral thickness measurement device;

[0075] The coordinate calculation module is used to calculate the distance between the tool tip and the workpiece surface based on the remaining thickness of the transition layer, and finally determine the tool setting coordinates to achieve atomic-level precision tool setting.

[0076] The cutting coordinate recording module includes a machine tool X-axis 1, a machine tool Y-axis 2, a machine tool Z-axis 10, and a rotary spindle 3. The machine tool Y-axis 2 is fixed to the machine tool X-axis 1, and the rotary spindle 3 is fixed to the machine tool Y-axis 2. The workpiece 4 to be processed is detachably mounted on the end of the rotary spindle 3. A tool holder 9 is detachably mounted on the machine tool Z-axis 10, and a cutting tool 8 is detachably mounted on the tool holder 9.

[0077] The thickness measurement module includes an optical fiber probe 7, a collimating lens 6, and an atomic-level spectral thickness measurement device 13. The collimating lens 6 is fixed to the front end of the optical fiber probe 7, and the atomic-level spectral thickness measurement device 13 is connected to the optical fiber probe 7 through an incident signal transmission line 11 and a return signal transmission line 12. The atomic-level precision thickness measurement device includes one or more of a scanning electron microscope, a laser interferometer, and a spectral interferometer.

[0078] Reference Figure 4 The atomic-level spectral thickness measurement device 13 includes a light source 24, a light source controller 17, a spectrometer 22, a spectrometer controller 20, a power supply interface 18, and a data transmission line interface 19. The light source 24 is connected to the incident signal transmission line 11 through the incident signal transmission line interface 23, and the spectrometer 22 is connected to the return signal transmission line 12 through the return signal interface 21. The light source controller 17 and the spectrometer controller 20 are electrically connected to the light source 24 and the spectrometer 22, respectively. The power supply interface 18 and the data transmission line interface 19 are connected to an external power supply and a data transmission line 14, respectively.

[0079] The coordinate calculation module includes a computer 15, which communicates with the data transmission line interface 19 of the atomic-level spectral thickness measurement device 13 via a data transmission line 14 and is connected to the power supply interface 18 via a power supply line 16. It is used to receive thickness data, calculate tool setting coordinates, and control the machine tool movement. The single tool setting time is <5 minutes.

[0080] In addition, the transition layer 5 prepared by the transition layer 5 preparation module is a soft material used for thickness measurement; the cutting tool 8 and the fiber optic probe 7 are fixed side by side on the tool holder 9 and move synchronously with the Z-axis 10 of the bed; the collimating lens 6 is used to adjust the size of the measurement spot to adapt to different measurement requirements.

[0081] Working principle: The atomic-level spectral thickness measurement device 13 calculates the thickness t of the transition layer 5 by measuring the optical path difference and phase difference between the two reflected beams from the upper and lower surfaces of the transition layer 5. After being superimposed with the machine tool feed accuracy, the tool setting accuracy reaches ±0.5nm, achieving atomic-level tool setting precision. The atomic-level spectral thickness measurement device 13 collects the thickness data of the transition layer 5 in real time and transmits it to the computer 15. The computer 15 calculates the tool setting coordinates based on the thickness data and controls the machine tool to perform tool setting feed. This solution, through flexible contact and high-precision measurement, overcomes the technical bottleneck of traditional rigid contact tool setting, providing a non-destructive, fast, and high-precision automated tool setting solution for atomic-level micro-nano machining.

[0082] Therefore, by adopting the above-mentioned atomic-level tool setting method and system based on in-situ detection of transition layer thickness, non-contact tool setting with nanonewton-level contact force control, atomic-level accuracy, and minute-level efficiency is achieved, solving the problems of low tool setting efficiency, low accuracy, and easy damage to tools or workpieces in machining.

[0083] This document uses specific examples and individual data to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. An atomic-level tool setting method based on in-situ detection of transition layer thickness, characterized in that, Includes the following steps: S1. Prepare a soft, uniform transition layer on the surface of the workpiece to be processed; S2. Using a machine tool to drive the cutting tool with a preset cutting feed program, a plane is cut out from the surface of the transition layer, and the machine tool Z-axis coordinate at this time is recorded as a reference. S3. Use an atomic-level spectral thickness measurement device to detect the remaining thickness of the transition layer after cutting in situ; S4. Based on the remaining thickness of the transition layer, calculate the distance between the tool tip and the workpiece surface, and finally determine the tool setting coordinates to achieve atomic-level precision tool setting; In S4, the distance between the tool tip and the workpiece surface The calculation formula is: ； In the formula, Z0 is the machine tool Z-axis coordinate after the transition layer is cut, and t is the remaining thickness of the transition layer after cutting. R The radius of curvature of the tool tip. This represents the local plastic indentation depth in the current tool-transition layer contact area; The formula for calculating the tool setting coordinates is: ； Among them, the local plastic indentation depth generated when the tool cuts the transition layer is the result of the tool contacting the transition layer. for: ； In the formula, The contact time between the tool and the transition layer. For equivalent plastic strain rate, For Von Mises equivalent stress, From 0 to Accumulated equivalent plastic strain rate over time Real-time temperature of the contact area. This is the velocity component of the tool in the direction normal to the contact point; ； In the formula, The initial yield stress is temperature-dependent. This is the temperature-dependent hardening coefficient. For the current accumulated equivalent plastic strain, This refers to the temperature-dependent hardening index. Therefore, the contact force F between the tool and the transition layer is calculated as follows: ； ； In the formula, This represents the real-time contact area between the cutting tool and the transition layer. The normal stress at the contact point, For the equivalent elastic modulus, For elastic strain components, The equivalent viscosity coefficient, The total normal strain rate, For plastic stress components, For local plastic strain, For plastic strain rate, The contact force F < 100 nN is controlled by temperature and material parameter calibration.

2. The atomic-level tool setting method based on in-situ detection of transition layer thickness according to claim 1, characterized in that, In S1, the transition layer is prepared by spin-coating photoresist and curing it, and the transition layer is made of a thin film material with a hardness lower than that of the workpiece to be processed.

3. The atomic-level tool setting method based on in-situ detection of transition layer thickness according to claim 1, characterized in that, In S2, the machine tool drives the cutting tool to cut a plane on the surface of the transition layer with a cutting depth of 2μm / cut, which is used to measure the thickness of the transition layer. The recorded machine tool Z-axis coordinate is Z0.

4. The atomic-level tool setting method based on in-situ detection of transition layer thickness according to claim 3, characterized in that, In S3, the atomic-level spectral thickness measurement device is based on the principle of spectral interference and calculates the remaining thickness t of the transition layer by the optical path difference and phase difference of the reflected light from the upper and lower surfaces of the transition layer.

5. A system for implementing the atomic-level tool setting method based on in-situ detection of transition layer thickness as described in any one of claims 1 to 4, characterized in that, include: The transition layer preparation module is used to prepare a soft and uniform transition layer on the surface of the workpiece to be processed; The cutting coordinate recording module is used to cut a plane for measuring the thickness of the transition layer from the surface of the transition layer by driving the tool with a preset cutting feed program, and record the Z-axis coordinate of the machine tool at this time as a reference. Thickness measurement module, used to detect the remaining thickness of the transition layer after cutting using an atomic-level spectral thickness measurement device; The coordinate calculation module is used to calculate the distance between the tool tip and the workpiece surface based on the remaining thickness of the transition layer, and finally determine the tool setting coordinates to achieve atomic-level precision tool setting.

6. The atomic-level tool setting system based on in-situ detection of transition layer thickness according to claim 5, characterized in that, The cutting coordinate recording module includes a machine tool X-axis, a machine tool Y-axis, a machine tool Z-axis, and a rotary spindle. The machine tool Y-axis is fixed to the machine tool X-axis, and the rotary spindle is fixed to the machine tool Y-axis. The workpiece to be processed is detachably mounted on the end of the rotary spindle. A tool post is detachably mounted on the machine tool Z-axis, and a cutting tool is detachably mounted on the tool post.

7. An atomic-level tool setting system based on in-situ detection of transition layer thickness according to claim 6, characterized in that, The thickness measurement module includes a fiber optic probe, a collimating lens, and an atomic-level spectral thickness measurement device. The collimating lens is fixed to the front end of the fiber optic probe, and the atomic-level spectral thickness measurement device is connected to the fiber optic probe through an incident signal transmission line and a return signal transmission line. The atomic-level precision thickness measurement device includes one or more of a scanning electron microscope, a laser interferometer, and a spectral interferometer. The atomic-level spectral thickness measurement device includes a light source, a light source controller, a spectrometer, a spectrometer controller, a power supply interface, and a data transmission line interface. The light source is connected to the incident signal transmission line through the incident signal transmission line interface, and the spectrometer is connected to the return signal transmission line through the return signal interface. The light source controller and the spectrometer controller are electrically connected to the light source and the spectrometer, respectively. The power supply interface and the data transmission line interface are connected to an external power supply and the data transmission line, respectively.

8. An atomic-level tool setting system based on in-situ detection of transition layer thickness according to claim 7, characterized in that, The coordinate calculation module includes a computer, which communicates with the data transmission line interface of the atomic-level spectral thickness measurement device through a data transmission line and is connected to the power supply interface through a power supply line. It is used to receive thickness data, calculate tool setting coordinates, and control the machine tool movement. The single tool setting time is less than 5 minutes.

9. An atomic-level tool setting system based on in-situ detection of transition layer thickness according to claim 7, characterized in that, The transition layer prepared by the transition layer preparation module is a soft material used for thickness measurement; the cutting tool and the fiber optic probe are fixed side by side on the tool holder and move synchronously with the Z-axis of the bed; the collimating lens is used to adjust the diameter of the measurement spot to adapt to different measurement needs.

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