Heat dissipation structure and projection equipment
By setting independent radiator and heat conductor at each exhaust port of the fan, combined with fin assembly and heat homogenization parts, efficient heat dissipation of high-power heat sources is achieved, and the problem of poor heat dissipation among multiple heat sources is solved.
Patent Information
- Application Number
- CN202510687082.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-26
- Publication Date
- 2025-08-05
AI Technical Summary
Among the multiple heat sources that uniformly dissipate heat, the high-power heat source has poor heat dissipation effect.
A fan with multiple exhaust ports is adopted, and an independent radiator is provided at each exhaust port. Combined with a heat conducting member and a fin assembly, multiple radiators are connected through a heat homogenizer to achieve personalized heat dissipation of high-power heat sources.
It improves the heat dissipation effect of high-power heat sources and solves the problem of poor heat dissipation caused by unified heat dissipation.
Smart Images
Figure CN120428501A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of projection equipment, and in particular relates to a heat dissipation structure and a projection equipment. Background Art
[0002] As consumer electronics become increasingly complex, their power consumption continues to rise, leading to a continuous increase in heat generation. Therefore, heat dissipation design has become a key focus for product designers. In related technologies, due to the limited volume of electronic products, multiple adjacent heat sources within the product are typically cooled using a single heat sink, resulting in poor cooling performance for high-power heat sources.
[0003] Therefore, there is a need to improve the existing technology.
[0004] The above information is presented as background information only to assist with an understanding of the present disclosure and is not a determination or admission that any of the above may be applicable as prior art with respect to the present disclosure. Summary of the Invention
[0005] The embodiments of the present application provide a heat dissipation structure and a projection device to solve the problem of poor heat dissipation effect of high-power heat sources among multiple heat sources for unified heat dissipation.
[0006] In a first aspect, an embodiment of the present application provides a heat dissipation structure, including a fan having multiple exhaust ports, each of which is provided with a radiator, and each of which is connected to at least one heat source.
[0007] In a possible implementation, the heat dissipation structure further includes a heat spreader connected to at least two of the heat sinks.
[0008] In a possible embodiment, the heat sink includes a substrate, a heat conductor and a fin assembly, the substrate is connected to a heat source, the fin assembly is arranged at the exhaust port, and the heat conductor is connected to the substrate and the fin assembly.
[0009] In a possible embodiment, the heat dissipation structure further includes a heat spreader, the substrate includes a heat conducting portion and a heat spreader, the heat conducting portion abuts against the heat source, and the heat spreader is fixedly connected to the heat spreader.
[0010] In a possible implementation manner, a mounting groove is provided on the substrate, and the heat conducting member is embedded in the mounting groove.
[0011] In a possible embodiment, the fin assembly includes a plurality of heat dissipation fins arranged in sequence and spaced apart from each other, the plurality of heat dissipation fins are all connected to the heat conducting member, and the plurality of heat dissipation fins are all arranged at the exhaust port.
[0012] In a possible embodiment, the heat conducting member includes a first heat conducting pipe and / or a second heat conducting pipe, the first heat conducting pipe abuts against one side of the fin assembly, and the second heat conducting pipe passes through the fin assembly and is fixedly connected to the fin assembly.
[0013] In one possible embodiment, the fan includes a cover plate, a wind wheel and a volute, the volute is provided with an air guide groove, the wind wheel is rotatably arranged in the air guide groove, the cover plate covers the notch of the air guide groove, and a plurality of the exhaust ports are spaced apart on the volute.
[0014] In a possible implementation, a first air suction port is provided on the cover plate, and a second air suction port is provided at the bottom of the air guide slot.
[0015] In a second aspect, an embodiment of the present application further provides a projection device, which includes the heat dissipation structure as described in any one of the above items.
[0016] Compared with the prior art, this application has the following beneficial effects:
[0017] The heat dissipation structure provided in the embodiment of the present application, by providing a fan with multiple exhaust outlets and arranging a radiator at each exhaust outlet, makes it possible to select an independent radiator for heat dissipation for high-power heat sources, thereby improving the heat dissipation effect of the high-power heat sources and solving the problem of poor heat dissipation effect of high-power heat sources among multiple heat sources with unified heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.
[0019] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.
[0020] Figure 1 A schematic diagram of the heat dissipation structure provided in an embodiment of the present application.
[0021] Figure 2 A schematic diagram of the structure of the fan provided in an embodiment of the present application.
[0022] Figure 3 A schematic structural diagram of the radiator provided in an embodiment of the present application.
[0023] Figure 4 A schematic diagram of the structure of the heat sink fins provided in an embodiment of the present application.
[0024] Figure 5 A top view of the heat sink provided in an embodiment of the present application.
[0025] In the figure: 1. Fan; 11. Cover plate; 111. First air suction port; 12. Wind wheel; 13. Volute; 131. Exhaust port; 132. Air guide slot; 133. Second air suction port; 2. Radiator; 21. Base plate; 211. Mounting slot; 212. Mounting hole; 213. Connecting part; 2131. Connecting slot; 22. Heat conducting member; 23. Fin assembly; 231. Heat dissipating fin; 232. Flange; 233. Connecting hole; 234. Connecting ring; 3. Heat spreading member. DETAILED DESCRIPTION
[0026] In order to explain in detail the possible application scenarios, technical principles, specific solutions that can be implemented, and the purpose and effects of this application, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of this application and are therefore only examples and are not intended to limit the scope of protection of this application.
[0027] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more features.
[0028] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.
[0029] The embodiments of the present application provide a heat dissipation structure and a projection device to solve the problem of poor heat dissipation effect of high-power heat sources among multiple heat sources for unified heat dissipation.
[0030] See also Figure 1 and Figure 2 An embodiment of the present application provides a heat dissipation structure, including a fan 1, the fan 1 having a plurality of exhaust ports 131, each exhaust port 131 being provided with a radiator 2, and each radiator 2 being connected to at least one heat source.
[0031] By providing a fan 1 with multiple exhaust ports 131 and providing a radiator 2 at each exhaust port 131, it is possible to select an independent radiator 2 for heat dissipation for a high-power heat source, thereby improving the heat dissipation effect of the high-power heat source and solving the problem of poor heat dissipation effect of the high-power heat source among multiple heat sources with unified heat dissipation.
[0032] See also Figure 1 and Figure 2The fan 1 includes a cover plate 11, a wind wheel 12, a volute 13, and a driving member (not shown in the figure). A wind guide groove 132 is provided on one side of the volute 13. The driving member is fixedly arranged at the bottom of the wind guide groove 132. The wind wheel 12 is fixedly arranged on the driving member. The driving member is used to drive the wind wheel 12 to rotate. In this embodiment, the driving member is a servo motor, and the wind wheel 12 is fixedly connected to the output shaft of the driving member. The cover plate 11 covers the notch of the wind guide groove 132. A first air suction port 111 is provided on the cover plate 11, and a second air suction port 133 is provided at the bottom of the wind guide groove 132. When the driving member drives the wind wheel 12 to rotate, the wind wheel 12 can guide the external air flow from the first air suction port 111 and the second air suction port 133 into the wind guide groove 132.
[0033] See also Figure 2 In this embodiment, the number of the exhaust ports 131 is set to two, and both exhaust ports 131 are opened on the volute 13, one of the exhaust ports 131 is opened on one side of the volute 13, and the other exhaust port 131 is opened on one side of the volute 13, so that when the driving member drives the wind wheel 12 to rotate, the wind wheel 12 can drive the airflow in the air guide groove 132 to be discharged from the two exhaust ports 131.
[0034] See also Figure 1 and Figure 3 In this embodiment, the number of heat sinks 2 is set to two, and the heat sinks 2 are arranged in a one-to-one correspondence with the exhaust port 131. Both heat sinks 2 include a substrate 21, a heat conductor 22 and a fin assembly 23. The substrate 21 is in contact with the external heat source, and the fin assembly 23 is arranged at the corresponding exhaust port 131. One end of the heat conductor 22 is fixedly connected to the substrate 21, and the other end is fixedly connected to the fin assembly 23. Specifically, a mounting groove 211 is provided on one side of the substrate 21. One end of the heat conductor 22 is embedded in the mounting groove 211 and is fixed to the groove wall of the mounting groove 211. This not only realizes the fixed connection between the heat conductor 22 and the substrate 21, but also increases the contact area between the heat conductor 22 and the substrate 21, which is beneficial to improving the heat transfer effect between the substrate 21 and the heat conductor 22. In addition, a mounting hole 212 is provided on the heat sink 2. By allowing the external connecting part to pass through the mounting hole 212 and be fixedly connected to the heat source, the fixed connection between the substrate 21 and the external heat source can be achieved.
[0035] See also Figure 3In this embodiment, the number of heat conducting members 22 is set to two, one of which is located at one end away from the substrate 21 and abuts against the top of the corresponding fin assembly 23, while the other end of the heat conducting member 22 is located away from the substrate 21 and passes through the corresponding fin assembly 23. Both heat conducting members 22 are heat pipes, which include a tube body, a wick, and a heat exchange medium. The wick and the heat exchange medium are both disposed within the tube body. The heat exchange medium can vaporize after absorbing heat and liquefy after releasing heat. The wick can absorb the liquefied heat exchange medium and guide the liquefied heat exchange medium from the heat release end of the heat pipe to the heat absorption end of the heat pipe. The liquefied heat exchange medium can absorb heat and vaporize at the heat absorption end of the heat pipe and flow to the heat release end of the heat pipe under the guidance of the tube body to release heat. By configuring the heat conducting members 22 as heat pipes, heat from the substrate 21 can be transferred to the fin assembly 23, thereby achieving heat dissipation from the heat source.
[0036] See also Figure 3 and Figure 4 The fin assembly 23 includes a plurality of heat dissipation fins 231 arranged in sequence and spaced apart. In this embodiment, flanges 232 are integrally formed at both ends of the heat dissipation fins 231 in the length direction. The setting of the flanges 232 not only increases the surface area of the heat dissipation fins 231 and improves the heat dissipation capacity of the heat dissipation fins 231, but also increases the contact area between the heat conductive member 22 and the heat dissipation fins 231, which is conducive to increasing the heat exchange capacity between the heat conductive member 22 and the heat dissipation fins 231. In addition, a connecting ring 234 is integrally formed on one side of the heat dissipation fin 231, and a connecting hole 233 is provided on the heat dissipation fin 231 for the heat conductive part 22 to pass through. The connecting hole 233 is located inside the connecting ring 234 and the inner ring surface of the connecting ring 234 is flush with the hole wall of the connecting hole 233. When the heat conductive part 22 is passed through the heat dissipation fin 231, the hole wall of the connecting hole 233 and the inner wall of the connecting ring 234 are tightly abutted against the side wall of the heat conductive part 22, so as to facilitate the heat on the heat conductive part 22 to be transferred to the heat dissipation fin 231.
[0037] See also Figure 5 It should be noted that one heat dissipation fin 231 is directly opposite to one exhaust port 131, and the other heat dissipation fin 231 is directly opposite to the other exhaust port 131. The angle between the two heat dissipation fins 231 is α, 80°≤α≤100°. In this embodiment, the value of α is 90°. In some embodiments of the present application, the value of α is any one of 80°, 82°, 84°, 86°, 88°, 92°, 94°, 96°, 98°, and 100°. By setting 80°≤α≤100°, not only can the installation requirements of the heat dissipation structure in a small space be met, but also the heat dissipation requirements of the heat dissipation fins 231 by the air flow blown out of the exhaust port 131 can be met.
[0038] See also Figure 1 and Figure 3In addition, the heat dissipation structure also includes a heat spreader 3, one end of which is fixedly connected to the substrate 21 of one radiator 2, and the other end is fixedly connected to the substrate 21 of the other radiator 2. Specifically in this embodiment, a connecting portion 213 is provided at the bottom end of the substrate 21 of one radiator 2, and a connecting groove 2131 is provided on the connecting portion 213. One end of the heat spreader 3 is accommodated in the connecting groove 2131 and is fixedly fitted with the groove wall of the connecting groove 2131, and the other end is fixedly connected to the side of the substrate 21 of the other radiator 2 that is fitted with the heat source. In this embodiment, the heat spreader 3 is also a heat pipe. By connecting the heat spreader 3 between the substrates 21 of the two radiators 2, the substrate 21 with a relatively high temperature can transfer heat to the substrate 21 with a relatively low temperature, which is beneficial to improving the heat dissipation capacity of the heat dissipation structure for heat sources with relatively high temperatures.
[0039] The present application also provides a projection device including the heat dissipation structure described above. Since the projection device includes the heat dissipation structure described above, it has at least some or all of the beneficial effects of the heat dissipation structure described above, which will not be described in detail here.
[0040] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0041] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concepts of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.
Claims
1. A heat dissipation structure, characterized in that: The invention comprises a fan (1), wherein the fan (1) has a plurality of air outlets (131), each of the air outlets (131) is provided with a radiator (2), and each of the radiators (2) is connected to at least one heat source.
2. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further comprises a heat spreader (3), and the heat spreader (3) is connected to at least two of the heat sinks (2).
3. The heat dissipation structure according to claim 1, characterized in that: The heat sink (2) comprises a base plate (21), a heat conducting member (22) and a fin assembly (23); the base plate (21) is connected to a heat source; the fin assembly (23) is arranged at the air outlet (131); and the heat conducting member (22) is connected to the base plate (21) and the fin assembly (23).
4. The heat dissipation structure according to claim 3, characterized in that: The heat dissipation structure further comprises a heat equalizing member (3), the substrate (21) comprises a heat conducting portion and a heat equalizing portion, the heat conducting portion abuts against the heat source, and the heat equalizing portion is fixedly connected to the heat equalizing member (3).
5. The heat dissipation structure according to claim 3, characterized in that: The base plate (21) is provided with a mounting groove (211), and the heat conducting member (22) is embedded in the mounting groove (211).
6. The heat dissipation structure according to claim 3, characterized in that: The fin assembly (23) comprises a plurality of heat dissipation fins (231) arranged in sequence and at intervals, the plurality of heat dissipation fins (231) are all connected to the heat conducting member (22), and the plurality of heat dissipation fins (231) are all arranged at the air outlet (131).
7. The heat dissipation structure according to claim 3, characterized in that: The heat conducting member (22) includes a first heat conducting pipe and / or a second heat conducting pipe, wherein the first heat conducting pipe abuts against one side of the fin assembly (23), and the second heat conducting pipe passes through the fin assembly (23) and is fixedly connected to the fin assembly (23).
8. The heat dissipation structure according to claim 1, characterized in that: The fan (1) comprises a cover plate (11), a wind wheel (12) and a volute (13); an air guide groove (132) is provided on the volute (13); the wind wheel (12) is rotatably arranged in the air guide groove (132); the cover plate (11) covers the notch of the air guide groove (132); and a plurality of air outlets (131) are spaced apart and provided on the volute (13).
9. The heat dissipation structure according to claim 8, characterized in that: A first air suction port (111) is provided on the cover plate (11), and a second air suction port (133) is provided at the bottom of the air guide slot (132).
10. A projection device, characterized in that: The projection device includes the heat dissipation structure according to any one of claims 1 to 9.