Etching deviation correction method, device, equipment and storage medium

Abstract

The present invention relates to the field of integrated circuit manufacturing, and in particular to an etching deviation correction method, device, equipment and storage medium, which receives a layout to be processed and a minimum size of an etching process; increases the minimum size of the etching process to obtain a minimum size of a convex corner; increases the minimum size of the etching process to obtain a minimum size of a concave corner; segments the edge of a pattern in the layout to be processed to obtain a segmented layout; the pattern in the segmented layout is a pattern surrounded by multiple edge segments to be adjusted; wherein the length of the edge segment to be adjusted of the concave corner of the pattern in the segmented layout is not less than the minimum size of the concave corner, and the length of the edge segment to be adjusted of the convex corner of the pattern in the segmented layout is not less than the minimum size of the convex corner; the segmented layout is etched to compensate for the deviation and obtain a compensated corrected layout. In the present invention, the size of the edge segment to be adjusted at the corner is prevented from being less than the minimum size of the etching process, thereby improving the accuracy of compensation.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit manufacturing, and in particular to an etching deviation correction method, device, equipment and storage medium. Background Art

[0002] The most critical step in semiconductor chip manufacturing is transferring the chip's design pattern onto the wafer. Among the numerous process steps involved in chip manufacturing, those directly related to pattern transfer are primarily photolithography and etching. Etching is a micromachining method that primarily uses solutions, reactive ions, or other mechanical methods to strip and remove material. During the etching process, semiconductor materials often exhibit unique shapes and morphologies. Therefore, even with the same etching solution concentration, the material can be corroded to varying degrees in both the horizontal and vertical directions. This can easily cause lateral drilling, leading to post-etch wafer dimensions (primarily including line width and spacing) that are inconsistent with the designed dimensions. This phenomenon is known as etching deviation.

[0003] The process of etch deviation compensation is to collect the measurement data of the key dimensions of different pitches, line widths, and lengths on the chip after lithography and etching, and establish an etch deviation rule table based on the measurement data of the key dimensions. Finally, the deviation compensation program is run on the design layout based on the etch deviation rule table.

[0004] However, in practice, simply relying on collecting measurement data of key dimensions of graphics with different pitches, line widths, and lengths on the chip after photolithography and etching, and establishing an etching deviation rule table based on the preset data of the key dimensions, often results in the etching results still not meeting expectations after adjustments are made against the rule table.

[0005] Therefore, how to improve the accuracy of compensation for etching deviation is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0006] The purpose of the present invention is to provide an etching deviation correction method, device, equipment and storage medium to solve the problem of low etching deviation compensation accuracy in the prior art.

[0007] In order to solve the above technical problems, the present invention provides an etching deviation correction method, comprising:

[0008] Receive the layout to be processed and the minimum size of the etching process;

[0009] Increasing the minimum size of the etching process to obtain the minimum size of the convex corner; increasing the minimum size of the etching process to obtain the minimum size of the concave corner;

[0010] Segmenting the edges of the graphics in the to-be-processed layout to obtain a segmented layout; the graphics in the segmented layout are graphics surrounded by a plurality of edge segments to be adjusted; wherein the lengths of the edge segments to be adjusted of the concave corners of the graphics in the segmented layout are not less than the minimum size of the concave corners, and the lengths of the edge segments to be adjusted of the convex corners of the graphics in the segmented layout are not less than the minimum size of the convex corners;

[0011] Etching deviation compensation is performed on the segmented layout to obtain a compensated corrected layout.

[0012] Optionally, in the etching deviation correction method, increasing the minimum size of the etching process to obtain the minimum size of the convex corner; and increasing the minimum size to obtain the minimum size of the concave corner include:

[0013] The sum of the minimum size of the etching process and the preset convex corner increase value is used as the minimum size of the convex corner; the sum of the minimum size of the etching process and the preset concave corner increase value is used to obtain the minimum size of the concave corner.

[0014] Optionally, in the etching deviation correction method, the method for determining the convex angle increase value includes:

[0015] Obtaining etching deviation compensation rules;

[0016] Determining a maximum indentation distance in the etching deviation compensation rule;

[0017] The absolute value of the maximum retraction distance is used as the convex angle increase value.

[0018] Optionally, in the etching deviation correction method, the method for determining the concave angle increase value includes:

[0019] Obtaining etching deviation compensation rules;

[0020] Determining a maximum push-out distance in the etching deviation compensation rule;

[0021] The absolute value of the maximum push-out distance is used as the concave angle increase value.

[0022] Optionally, in the etching deviation correction method, increasing the minimum size of the etching process to obtain the minimum size of the convex corner; and increasing the minimum size to obtain the minimum size of the concave corner include:

[0023] The product of the minimum size of the etching process and the preset convex angle magnification coefficient is used as the minimum size of the convex angle; the product of the minimum size of the etching process and the preset concave angle magnification coefficient is used to obtain the minimum size of the concave angle.

[0024] Optionally, in the etching deviation correction method, the convex angle magnification factor is not equal to the concave angle magnification factor.

[0025] An etching deviation correction device, comprising:

[0026] A receiving module, used to receive the layout to be processed and the minimum size of the etching process;

[0027] A size determination module, configured to increase the minimum size of the etching process to obtain a minimum size of a convex corner; and to increase the minimum size of the etching process to obtain a minimum size of a concave corner;

[0028] a segmentation module configured to segment the edges of the graphics in the to-be-processed layout to obtain a segmented layout; the graphics in the segmented layout are graphics surrounded by a plurality of edge segments to be adjusted; wherein the lengths of the edge segments to be adjusted of the concave corners of the graphics in the segmented layout are not less than the minimum size of the concave corners, and the lengths of the edge segments to be adjusted of the convex corners of the graphics in the segmented layout are not less than the minimum size of the convex corners;

[0029] The deviation compensation module is used to perform etching deviation compensation on the segmented layout to obtain a compensated and corrected layout.

[0030] Optionally, in the etching deviation correction device, the minimum size changing module includes:

[0031] The summing and changing unit is used to take the sum of the minimum size of the etching process and the preset convex corner increase value as the minimum size of the convex corner; and take the sum of the minimum size of the etching process and the preset concave corner increase value to obtain the minimum size of the concave corner.

[0032] An etching deviation correction device, comprising:

[0033] Memory for storing computer programs;

[0034] A processor is configured to implement the steps of any of the above-mentioned etching deviation correction methods when executing the computer program.

[0035] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the etching deviation correction method described above are implemented.

[0036] The etching deviation correction method provided by the present invention receives a layout to be processed and a minimum size of an etching process; increases the minimum size of the etching process to obtain a minimum size of a convex corner; increases the minimum size of the etching process to obtain a minimum size of a concave corner; segments the edges of the graphics in the layout to be processed to obtain a segmented layout; the graphics in the segmented layout are graphics surrounded by multiple edge segments to be adjusted; wherein the length of the edge segments to be adjusted of the concave corners of the graphics in the segmented layout is not less than the minimum size of the concave corners, and the length of the edge segments to be adjusted of the convex corners of the graphics in the segmented layout is not less than the minimum size of the convex corners; etching deviation compensation is performed on the segmented layout to obtain a compensated and corrected layout. The etching deviation rule table used in the prior art only considers the etching deviation of patterns with different spacing and line widths after etching, but does not take into account that at the corner positions of the pattern, the edge segment to be adjusted on one side of the corner will be affected by the edge segment to be adjusted on the other side of the corner, resulting in the length of the edge segment to be adjusted not being consistent with the expected length, or even exceeding the minimum etching process size that the etching machine can operate. This is why, in the prior art, even if the etching deviation is compensated according to the etching deviation rule table, the pattern etched on the wafer after the process is completed may still deviate significantly from the target pattern. In the present invention, the length range of the edge segment to be adjusted is adjusted for different corner positions on the pattern, preventing the size of the edge segment to be adjusted at the corner position from being smaller than the minimum size that the etching machine can achieve (i.e., the minimum etching process size) during the actual etching process, thereby ensuring that each edge segment to be adjusted in the segmented layout meets the process requirements of the machine, thereby ensuring that the etching deviation compensation is consistent with the expected length, thereby improving the accuracy of the etching deviation compensation. The present invention also provides an etching deviation correction device, equipment, and storage medium with the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0038] Figure 1 A schematic flow chart of a specific embodiment of the etching deviation correction method provided by the present invention;

[0039] Figure 2 A schematic diagram of the process structure of a specific embodiment of the etching deviation correction method provided by the present invention;

[0040] Figure 3 A schematic flow chart of another specific embodiment of the etching deviation correction method provided by the present invention;

[0041] Figure 4 、 Figure 5 A schematic diagram of the process structure of another specific embodiment of the etching deviation correction method provided by the present invention;

[0042] Figure 6 A schematic structural diagram of a specific embodiment of the etching deviation correction device provided by the present invention.

[0043] Reference numerals:

[0044] 100 - receiving module; 200 - size determination module; 300 - segmentation module; 400 - deviation compensation module. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0046] The core of the present invention is to provide an etching deviation correction method, a flow chart of a specific embodiment of the invention is as follows: Figure 1 As shown, it is called specific implementation method one, including:

[0047] S101: Receive the layout to be processed and the minimum size of the etching process.

[0048] The minimum etching process size refers to the minimum etching length that the etching machine can operate. In other words, the etching machine cannot complete a separate etching adjustment for an edge length that is smaller than the minimum etching process size.

[0049] S102: increasing the minimum size of the etching process to obtain the minimum size of the convex corner; increasing the minimum size of the etching process to obtain the minimum size of the concave corner.

[0050] In other words, the minimum size of the concave corner and the minimum size of the convex corner are both larger than the minimum size of the etching process.

[0051] Of course, the specific amount by which the minimum size of the etching process is increased to obtain the minimum size of the concave corner and the minimum size of the convex corner can be determined according to actual conditions. For example, a preset constant value can be added to the minimum size of the etching process to obtain the minimum size of the concave corner and the minimum size of the convex corner, respectively, or the minimum size of the concave corner and the minimum size of the convex corner can be obtained by amplifying them by a preset coefficient. In a preferred embodiment, this step includes:

[0052] The product of the minimum size of the etching process and the preset convex angle magnification coefficient is used as the minimum size of the convex angle; the product of the minimum size of the etching process and the preset concave angle magnification coefficient is used to obtain the minimum size of the concave angle.

[0053] Two preset magnification coefficients (i.e., the convex angle magnification coefficient and the concave angle magnification coefficient) are set, and then the corresponding minimum size is obtained by multiplying them by the minimum size of the etching process. This method uses less computing power and has a high calculation speed. The two magnification coefficients can be coefficients obtained by simulation results or empirical coefficients obtained after a large number of actual operations. For example, the convex angle magnification coefficient can be 1.020, and the concave angle magnification coefficient can be 1.015. Of course, the two magnification coefficients can also be the same, and correspondingly, the minimum size of the convex angle and the minimum size of the concave angle are also the same.

[0054] Furthermore, the convex angle magnification factor is not equal to the concave angle magnification factor.

[0055] Based on historical experience or simulation results, different minimum lengths of the edge segments to be adjusted can be set at convex corners and concave corners to obtain better etching deviation compensation results.

[0056] S103: Segment the edges of the graphics in the to-be-processed layout to obtain a segmented layout; the graphics in the segmented layout are graphics surrounded by multiple edge segments to be adjusted; wherein the lengths of the edge segments to be adjusted of the concave corners of the graphics in the segmented layout are not less than the minimum size of the concave corners, and the lengths of the edge segments to be adjusted of the convex corners of the graphics in the segmented layout are not less than the minimum size of the convex corners.

[0057] Please refer to Figure 2 In the figure, the edge segments A and B to be adjusted form a concave angle, and the edge segments C and D to be adjusted form a convex angle. Accordingly, the lengths of the edge segments A and B to be adjusted cannot be less than the minimum size of the concave angle, and the lengths of the edge segments C and D to be adjusted cannot be less than the minimum size of the concave angle.

[0058] In other words, in the present invention, the lengths of the two edge segments to be adjusted that constitute a convex angle or a concave angle are restricted by the corresponding minimum size of the convex angle or the minimum size of the concave angle, depending on whether they constitute a convex angle or a concave angle. Of course, the edge segment to be adjusted that is not in a corner position only needs to have a length greater than the minimum size of the etching process. In addition, the edge segment to be adjusted that is not in a corner position may also be longer than the edge segment to be adjusted that is in a corner position. The minimum size of the concave angle may be the same as or different from the minimum size of the convex angle, and the present invention does not limit this.

[0059] S104: performing etching deviation compensation on the segmented layout to obtain a compensated corrected layout.

[0060] The etching deviation compensation is to adjust the position of the edge segments to be adjusted perpendicular to their extension direction one by one, so as to compensate for the lateral etching error.

[0061] The etching deviation correction method provided by the present invention receives a layout to be processed and a minimum size of an etching process; increases the minimum size of the etching process to obtain a minimum size of a convex corner; increases the minimum size of the etching process to obtain a minimum size of a concave corner; segments the edges of the graphics in the layout to be processed to obtain a segmented layout; the graphics in the segmented layout are graphics surrounded by multiple edge segments to be adjusted; wherein the length of the edge segments to be adjusted of the concave corners of the graphics in the segmented layout is not less than the minimum size of the concave corners, and the length of the edge segments to be adjusted of the convex corners of the graphics in the segmented layout is not less than the minimum size of the convex corners; etching deviation compensation is performed on the segmented layout to obtain a compensated and corrected layout. The etching deviation rule table used in the prior art only considers the etching deviation of patterns with different spacing and line widths after etching, but does not take into account that at the corner positions of the pattern, the edge segment to be adjusted on one side of the corner will be affected by the edge segment to be adjusted on the other side of the corner, resulting in the length of the edge segment to be adjusted not being consistent with expectations, and even exceeding the minimum etching process size that the etching machine can operate. This is why, in the prior art, even if the etching deviation is compensated according to the etching deviation rule table, the pattern etched on the wafer after the process is completed may still significantly deviate from the target pattern. In the present invention, the length range of the edge segment to be adjusted is adjusted for different corner positions on the pattern, avoiding the size of the edge segment to be adjusted at the corner position being smaller than the minimum size that the etching machine can achieve (i.e., the minimum etching process size) during the actual etching process, so as to ensure that each edge segment to be adjusted in the segmented layout meets the process requirements of the machine, thereby ensuring that the compensation correction of the etching deviation is in line with expectations, thereby improving the accuracy of the compensation of the etching deviation.

[0062] On the basis of the specific implementation mode 1, the method for obtaining the minimum size of the convex angle and the minimum size of the concave angle is further limited to obtain the specific implementation mode 2, and the corresponding flow chart is as follows: Figure 3 Shown, including:

[0063] S201: Receive the layout to be processed and the minimum size of the etching process.

[0064] S202: taking the sum of the minimum size of the etching process and the preset convex corner increase value as the minimum size of the convex corner; and taking the sum of the minimum size of the etching process and the preset concave corner increase value as the minimum size of the concave corner.

[0065] The convex angle increase value and the concave angle increase value may be preset fixed values, and the two may be the same or different, and the present invention will not be described in detail here.

[0066] As a preferred embodiment, the method for determining the convex angle increase value includes:

[0067] A1: Obtain etching deviation compensation rules.

[0068] The etching deviation compensation rule is a preset relationship for etching deviation compensation. Current etching deviation compensation rules typically determine the corresponding etching deviation compensation based on the line width and spacing of the pattern, i.e., the indentation or extension distance of the edge segment to be adjusted. Table 1 below shows a common compensation rule table for determining etching deviation compensation based on the line width and spacing of the pattern.

[0069] Table 1

[0070] Line Width / Spacing 100-200 nm 200-300 nm 300-400 nm >400 nm 100-200 nm 0 nm 2 nm 4 nm 6 nm 200-300 nm -1 nm 0 nm 2 nm 4 nm 300-400 nm -3 nm -1 nm 0 nm 2 nm >400 nm -9 nm -3 nm -1 nm 0 nm

[0071] In the table, the positive or negative value of the compensation value indicates whether the corresponding edge segment to be adjusted is pushed out or retracted, for example, a negative value indicates retraction, and a positive value indicates push-out.

[0072] A2: Determine the maximum value of the indentation distance in the etching deviation compensation rule.

[0073] The maximum indentation distance is the value with the largest absolute value among the negative values, that is, the value with the longest indentation distance. Taking Table 1 as an example, the maximum indentation distance is -9 nm.

[0074] A3: The absolute value of the maximum retraction distance is used as the convex angle increase value.

[0075] The maximum value of the indentation distance is taken, and then the corresponding absolute value is obtained. If we continue to use Table 1 as an example, the corresponding convex angle increase value is 9 nm.

[0076] As another preferred embodiment, the method for determining the concave angle increase value includes:

[0077] B1: Obtain etching deviation compensation rules.

[0078] For details, please refer to step A1 in the previous text. Of course, in actual operation, this step B1 can be combined with A1 in the previous text, that is, it is only necessary to obtain the etching deviation compensation rule once, and then perform steps A2, A3 and steps B2, B3 respectively.

[0079] B2: Determine the maximum value of the push-out distance in the etching deviation compensation rule.

[0080] Taking Table 1 as an example, the maximum exit distance in Table 1 is 6 nm.

[0081] B3: The absolute value of the maximum value of the push-out distance is used as the concave angle increase value.

[0082] Take the maximum value of the push-out distance and then obtain the corresponding absolute value. Of course, if we continue to take Table 1 as an example, the maximum value of the push-out distance itself is a positive value, and the corresponding concave angle increase value is 6nm.

[0083] S203: Segment the edges of the graphics in the to-be-processed layout to obtain a segmented layout; the graphics in the segmented layout are graphics surrounded by multiple edge segments to be adjusted; wherein the lengths of the edge segments to be adjusted of the concave corners of the graphics in the segmented layout are not less than the minimum size of the concave corners, and the lengths of the edge segments to be adjusted of the convex corners of the graphics in the segmented layout are not less than the minimum size of the convex corners.

[0084] S204: performing etching deviation compensation on the segmented layout to obtain a compensated corrected layout.

[0085] The difference between this specific embodiment and the above specific embodiment is that, in this specific embodiment, a method for obtaining the minimum size of the convex angle and the minimum size of the concave angle by adding with a preset value is further provided, and the remaining steps are the same as the above specific embodiment and will not be elaborated here.

[0086] In this specific embodiment, the concave angle increase value and the convex angle increase value are determined according to the existing etching deviation compensation rule. For ease of understanding, further reference can be made to Figure 4 , Figure 4 is a schematic diagram of the local structure of the concave corner of the graphic in the segmented layout, such as Figure 4 As shown, the edge segments A and B to be adjusted that constitute the concave angle, if edge segment A is retracted inward during the etching deviation compensation, it will not affect the adjustment of edge segment B, but if edge segment A is pushed outward (to position A' in the figure), it will occupy the position originally designed for edge segment B, resulting in the actual shortening of edge segment B to be adjusted. If the length of edge segment B to be adjusted is too short, it may be smaller than the minimum etching process size of the etching machine, thereby making the etching deviation compensation not meet expectations. Therefore, for the edge segments to be adjusted that constitute the concave angle, it is necessary to make their length greater than the sum of the minimum etching process size and the maximum push-out distance of the adjacent edge segments to be adjusted, to ensure that even if edge segment A to be adjusted is pushed outward by the maximum distance, the length left for edge segment B to be adjusted is still greater than the minimum etching process size of the etching machine, thereby achieving precise control of etching deviation compensation.

[0087] Similarly, you can refer to Figure 5 , Figure 5 is a schematic diagram of the local structure at the convex corner of the graphic in the segmented layout, such as Figure 5As shown, if edge segment C is pushed outward, it will not affect the adjustment of edge segment D. However, if edge segment C is retracted inward (to position C' in the figure), edge segment D will be shortened. Therefore, the length of edge segment D must be greater than the sum of the minimum etching process size of the etching machine and the maximum retraction distance.

[0088] This specific implementation further combines specific circumstances to provide an etching deviation correction method with higher adjustment accuracy and better working stability.

[0089] The following is an introduction to an etching deviation correction device provided by an embodiment of the present invention. The etching deviation correction device described below and the etching deviation correction method described above can be referred to in correspondence with each other.

[0090] Figure 6 The structural block diagram of the etching deviation correction device provided by the embodiment of the present invention is shown in FIG. Figure 6 The etching deviation correction device may include:

[0091] Receiving module 100, used to receive the layout to be processed and the minimum size of the etching process;

[0092] The size determination module 200 is configured to increase the minimum size of the etching process to obtain the minimum size of the convex corner; and increase the minimum size of the etching process to obtain the minimum size of the concave corner;

[0093] A segmentation module 300 is configured to segment the edges of the graphics in the to-be-processed layout to obtain a segmented layout; the graphics in the segmented layout are graphics surrounded by a plurality of to-be-adjusted edge segments; wherein the lengths of the to-be-adjusted edge segments of the concave corners of the graphics in the segmented layout are not less than the minimum size of the concave corners, and the lengths of the to-be-adjusted edge segments of the convex corners of the graphics in the segmented layout are not less than the minimum size of the convex corners;

[0094] The deviation compensation module 400 is used to perform etching deviation compensation on the segmented layout to obtain a compensated corrected layout.

[0095] As a preferred embodiment, the size determination module 200 includes:

[0096] The summing and changing unit is used to take the sum of the minimum size of the etching process and the preset convex corner increase value as the minimum size of the convex corner; and take the sum of the minimum size of the etching process and the preset concave corner increase value to obtain the minimum size of the concave corner.

[0097] As a preferred embodiment, the size determination module 200 includes:

[0098] A first rule acquisition unit, configured to acquire an etching deviation compensation rule;

[0099] A maximum indentation unit, used to determine the maximum indentation distance in the etching deviation compensation rule;

[0100] The convex angle summing unit is used to take the absolute value of the maximum value of the retraction distance as the convex angle increase value.

[0101] As a preferred embodiment, the size determination module 200 includes:

[0102] A second rule acquisition unit, configured to acquire an etching deviation compensation rule;

[0103] A maximum push-out unit is configured to determine a maximum push-out distance in the etching deviation compensation rule;

[0104] The concave angle adding unit is used to take the absolute value of the maximum value of the push-out distance as the concave angle addition value.

[0105] As a preferred embodiment, the size determination module 200 includes:

[0106] The size multiplication unit is used to take the product of the minimum size of the etching process and the preset convex angle magnification coefficient as the minimum size of the convex angle; and take the product of the minimum size of the etching process and the preset concave angle magnification coefficient to obtain the minimum size of the concave angle.

[0107] The etching deviation correction device provided by the present invention is used to receive the layout to be processed and the minimum size of the etching process through the receiving module 100; the size determination module 200 is used to increase the minimum size of the etching process to obtain the minimum size of the convex corner; the minimum size of the etching process is increased to obtain the minimum size of the concave corner; the segmentation module 300 is used to segment the edge of the figure in the layout to be processed to obtain a segmented layout; the figure in the segmented layout is a figure surrounded by multiple edge segments to be adjusted; wherein the length of the edge segment to be adjusted of the concave corner of the figure in the segmented layout is not less than the minimum size of the concave corner, and the length of the edge segment to be adjusted of the convex corner of the figure in the segmented layout is not less than the minimum size of the convex corner; the deviation compensation module 400 is used to perform etching deviation compensation on the segmented layout to obtain a compensated and corrected layout. The etching deviation rule table used in the prior art only considers the etching deviation of patterns with different spacing and line widths after etching, but does not take into account that at the corner positions of the pattern, the edge segment to be adjusted on one side of the corner will be affected by the edge segment to be adjusted on the other side of the corner, resulting in the length of the edge segment to be adjusted not being consistent with expectations, and even exceeding the minimum etching process size that the etching machine can operate. This is why, in the prior art, even if the etching deviation is compensated according to the etching deviation rule table, the pattern etched on the wafer after the process is completed may still significantly deviate from the target pattern. In the present invention, the length range of the edge segment to be adjusted is adjusted for different corner positions on the pattern, avoiding the size of the edge segment to be adjusted at the corner position being smaller than the minimum size that the etching machine can achieve (i.e., the minimum etching process size) during the actual etching process, so as to ensure that each edge segment to be adjusted in the segmented layout meets the process requirements of the machine, thereby ensuring that the compensation correction of the etching deviation is in line with expectations, thereby improving the accuracy of the compensation of the etching deviation.

[0108] The etching deviation correction device of this embodiment is used to implement the aforementioned etching deviation correction method. Therefore, the specific implementation method of the etching deviation correction device can be seen in the embodiment part of the etching deviation correction method in the previous text. For example, the receiving module 100, the size determination module 200, the segmentation module 300, and the deviation compensation module 400 are respectively used to implement steps S101, S102, S103 and S104 in the above-mentioned etching deviation correction method. Therefore, its specific implementation method can refer to the description of the corresponding embodiments of each part, and will not be repeated here.

[0109] The present invention also provides an etching deviation correction device, comprising:

[0110] Memory for storing computer programs;

[0111] A processor is configured to implement the steps of any of the above-mentioned etching deviation correction methods when executing the computer program. The etching deviation correction method provided by the present invention receives a layout to be processed and a minimum size of an etching process; increases the minimum size of the etching process to obtain a minimum size of a convex corner; increases the minimum size of the etching process to obtain a minimum size of a concave corner; segments the edges of the graphics in the layout to be processed to obtain a segmented layout; the graphics in the segmented layout are graphics surrounded by multiple edge segments to be adjusted; wherein the length of the edge segments to be adjusted of the concave corners of the graphics in the segmented layout is not less than the minimum size of the concave corners, and the length of the edge segments to be adjusted of the convex corners of the graphics in the segmented layout is not less than the minimum size of the convex corners; and performs etching deviation compensation on the segmented layout to obtain a compensated and corrected layout. The etching deviation rule table used in the prior art only considers the etching deviation of patterns with different spacing and line widths after etching, but does not take into account that at the corner positions of the pattern, the edge segment to be adjusted on one side of the corner will be affected by the edge segment to be adjusted on the other side of the corner, resulting in the length of the edge segment to be adjusted not being consistent with expectations, and even exceeding the minimum etching process size that the etching machine can operate. This is why, in the prior art, even if the etching deviation is compensated according to the etching deviation rule table, the pattern etched on the wafer after the process is completed may still significantly deviate from the target pattern. In the present invention, the length range of the edge segment to be adjusted is adjusted for different corner positions on the pattern, avoiding the size of the edge segment to be adjusted at the corner position being smaller than the minimum size that the etching machine can achieve (i.e., the minimum etching process size) during the actual etching process, so as to ensure that each edge segment to be adjusted in the segmented layout meets the process requirements of the machine, thereby ensuring that the compensation correction of the etching deviation is in line with expectations, thereby improving the accuracy of the compensation of the etching deviation.

[0112] The present invention also provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the etching deviation correction method described above are implemented. The etching deviation correction method provided by the present invention receives a layout to be processed and a minimum size of an etching process; increases the minimum size of the etching process to obtain a minimum size of a convex corner; increases the minimum size of the etching process to obtain a minimum size of a concave corner; segments the edge of the figure in the layout to be processed to obtain a segmented layout; the figure in the segmented layout is a figure surrounded by multiple edge segments to be adjusted; wherein the length of the edge segment to be adjusted of the concave corner of the figure in the segmented layout is not less than the minimum size of the concave corner, and the length of the edge segment to be adjusted of the convex corner of the figure in the segmented layout is not less than the minimum size of the convex corner; and performs etching deviation compensation on the segmented layout to obtain a compensated and corrected layout. The etching deviation rule table used in the prior art only considers the etching deviation of patterns with different spacing and line widths after etching, but does not take into account that at the corner positions of the pattern, the edge segment to be adjusted on one side of the corner will be affected by the edge segment to be adjusted on the other side of the corner, resulting in the length of the edge segment to be adjusted not being consistent with expectations, and even exceeding the minimum etching process size that the etching machine can operate. This is why, in the prior art, even if the etching deviation is compensated according to the etching deviation rule table, the pattern etched on the wafer after the process is completed may still significantly deviate from the target pattern. In the present invention, the length range of the edge segment to be adjusted is adjusted for different corner positions on the pattern, avoiding the size of the edge segment to be adjusted at the corner position being smaller than the minimum size that the etching machine can achieve (i.e., the minimum etching process size) during the actual etching process, so as to ensure that each edge segment to be adjusted in the segmented layout meets the process requirements of the machine, thereby ensuring that the compensation correction of the etching deviation is in line with expectations, thereby improving the accuracy of the compensation of the etching deviation.

[0113] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from the other embodiments. Reference can be made to the descriptions of the identical or similar parts between the various embodiments. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the methods.

[0114] It should be noted that, in this specification, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0115] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

[0116] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0117] The etching deviation correction method, device, equipment and storage medium provided by the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, the present invention can also be improved and modified in a number of ways, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A method for correcting etching deviation, characterized in that: include: Receive the layout to be processed and the minimum size of the etching process; Increasing the minimum size of the etching process to obtain the minimum size of the convex corner; Increasing the minimum size of the etching process to obtain the minimum size of the concave corner; Segmenting the edges of the graphics in the to-be-processed layout to obtain a segmented layout; the graphics in the segmented layout are graphics surrounded by a plurality of edge segments to be adjusted; wherein the lengths of the edge segments to be adjusted of the concave corners of the graphics in the segmented layout are not less than the minimum size of the concave corners, and the lengths of the edge segments to be adjusted of the convex corners of the graphics in the segmented layout are not less than the minimum size of the convex corners; Etching deviation compensation is performed on the segmented layout to obtain a compensated corrected layout.

2. The etching deviation correction method according to claim 1, wherein: Increasing the minimum size of the etching process to obtain the minimum size of the convex corner; Increasing the minimum dimensions to obtain the minimum dimensions of the concave corners includes: The sum of the minimum size of the etching process and the preset convex angle increase value is used as the minimum size of the convex angle; The minimum size of the concave angle is obtained by adding the minimum size of the etching process and the preset concave angle increase value.

3. The etching deviation correction method according to claim 2, wherein: The method for determining the convex angle increase value includes: Obtaining etching deviation compensation rules; Determining a maximum indentation distance in the etching deviation compensation rule; The absolute value of the maximum retraction distance is used as the convex angle increase value.

4. The etching deviation correction method according to claim 2, wherein: The method for determining the concave angle increase value includes: Obtaining etching deviation compensation rules; Determining a maximum push-out distance in the etching deviation compensation rule; The absolute value of the maximum push-out distance is used as the concave angle increase value.

5. The etching deviation correction method according to claim 1, wherein: Increasing the minimum size of the etching process to obtain the minimum size of the convex corner; Increasing the minimum dimensions to obtain the minimum dimensions of the concave corners includes: The product of the minimum size of the etching process and the preset convex angle magnification factor is used as the minimum size of the convex angle; The minimum size of the concave angle is obtained by multiplying the minimum size of the etching process by a preset concave angle magnification factor.

6. The etching deviation correction method according to claim 5, wherein: The convex angle magnification factor is not equal to the concave angle magnification factor.

7. An etching deviation correction device, characterized in that: include: A receiving module, used to receive the layout to be processed and the minimum size of the etching process; A size determination module, configured to increase the minimum size of the etching process to obtain a minimum size of the convex corner; Increasing the minimum size of the etching process to obtain the minimum size of the concave corner; a segmentation module configured to segment the edges of the graphics in the to-be-processed layout to obtain a segmented layout; the graphics in the segmented layout are graphics surrounded by a plurality of edge segments to be adjusted; wherein the lengths of the edge segments to be adjusted of the concave corners of the graphics in the segmented layout are not less than the minimum size of the concave corners, and the lengths of the edge segments to be adjusted of the convex corners of the graphics in the segmented layout are not less than the minimum size of the convex corners; The deviation compensation module is used to perform etching deviation compensation on the segmented layout to obtain a compensated and corrected layout.

8. The etching deviation correction device according to claim 7, wherein: The size determination module includes: The summing and changing unit is used to take the sum of the minimum size of the etching process and the preset convex corner increase value as the minimum size of the convex corner; and take the sum of the minimum size of the etching process and the preset concave corner increase value to obtain the minimum size of the concave corner.

9. An etching deviation correction device, characterized in that: include: Memory for storing computer programs; A processor, configured to implement the steps of the etching deviation correction method according to any one of claims 1 to 6 when executing the computer program.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the etching deviation correction method according to any one of claims 1 to 6 are implemented.

Images