Chip aging temperature control test system and test method

Abstract

The invention discloses a chip aging temperature control test system and method, and the system comprises a test controller and at least two air valve temperature control modules, and the test controller is electrically connected with each air valve temperature control module through a serial communication interface. The test controller is used for controlling each air valve temperature control module to carry out a temperature aging test on a test chip in the chip aging test cavity structure, and the air valve temperature control modules are used for cooling the environment temperature when the environment temperature in the chip aging test cavity structure is detected to exceed a preset temperature threshold value. The air valve temperature control module is used for detecting the environment temperature, an obtained real-time temperature environment value is compared with a preset temperature threshold value, and then heating or cooling is carried out, so that accurate control over the environment temperature is achieved, the environment temperature in the chip aging test cavity structure can be better controlled, and the service life of the chip aging test cavity structure is prolonged. Therefore, the aging test is carried out on the chip in a stable preset temperature range, and the precision of temperature control is improved.

Description

Technical Field

[0001] The present invention relates to the field of chip aging temperature control testing, and in particular to a chip aging temperature control testing system and testing method. Background Art

[0002] With the continuous advancement of semiconductor technology, the operating frequency and integration density of chips are constantly increasing. Chip aging not only affects their performance and reliability, but also can cause failures and safety risks in the entire application system. Temperature is a significant factor affecting chip aging, and rising temperatures significantly accelerate the aging process. Aging tests, conducted during the chip design phase, are an integral part of the chip design process. Against this backdrop, independent temperature control for chip aging is widely used in chip design.

[0003] However, the temperature control accuracy of the current chip aging independent temperature control system is poor. Summary of the Invention

[0004] The embodiments of the present invention provide a chip aging temperature control test system and a test method to solve the problem of poor control accuracy of the current chip aging independent temperature control system.

[0005] Based on the above purpose, in one embodiment, a chip aging temperature control test system is provided, comprising: a test controller and at least two air valve temperature control modules, wherein the test controller is electrically connected to each of the air valve temperature control modules via a serial communication interface; The test controller is used to control each of the air valve temperature control modules to perform temperature aging test on the test chip in the chip aging test cavity structure. The air valve temperature control module is used to cool the ambient temperature when it detects that the ambient temperature in the chip aging test cavity structure exceeds a preset temperature threshold.

[0006] In one embodiment, the air valve temperature control module includes: an air valve temperature controller, an air valve drive assembly, and a heating control assembly, wherein the air valve temperature controller is electrically connected to the air valve drive assembly, the air valve temperature controller is electrically connected to the heating control assembly, the air valve drive assembly is arranged outside the chip aging test chamber structure, and the air valve temperature controller and the heating control assembly are arranged inside the chip aging test chamber structure; The air valve temperature controller is used to control the heating control component to heat the ambient temperature in the chip aging test cavity structure. The air valve temperature controller is also used to control the air valve drive component to cool the ambient temperature when it detects that the ambient temperature in the chip aging test cavity structure exceeds a preset temperature threshold.

[0007] In one embodiment, it also includes an air valve state detection component, which is electrically connected to the air valve temperature controller. The air valve state detection component is arranged inside the chip aging test cavity structure. The air valve state detection component is used to detect the position state of the rotary switch of the air valve in the air valve drive component and transmit the position state to the air valve temperature controller.

[0008] In one embodiment, a temperature detection component is further included, which is electrically connected to the air valve temperature controller. The temperature detection component is used to detect the ambient temperature in the chip aging test cavity structure. The air valve temperature controller is used to control the heating control component to heat the ambient temperature in the chip aging test cavity structure according to the ambient temperature, or to control the air valve drive component to cool the ambient temperature in the chip aging test cavity structure according to the ambient temperature.

[0009] In one embodiment, the temperature detection component is also electrically connected to the test controller, and the temperature detection component is used to transmit the detected ambient temperature in the chip aging test cavity structure to the test controller, and then the test controller transmits it to the host computer for monitoring.

[0010] In one embodiment, a chip aging temperature control test method is provided, which is applied to the above-mentioned test system, including: The air valve temperature controller of the air valve temperature control module obtains in real time the ambient temperature value in the chip aging test cavity structure detected by the temperature detection component of the chip aging temperature control test system; Comparing the ambient temperature value with a first temperature threshold, if the ambient temperature value is less than the first temperature threshold, the air valve temperature controller outputting a waveform with a first duty cycle to control the heating control component to heat the ambient temperature in the chip aging test cavity structure; If the ambient temperature value is greater than or equal to the first temperature threshold, the ambient temperature value is compared with a second temperature threshold; if the ambient temperature value is less than the second temperature threshold, the air valve temperature controller outputs a waveform with a second duty cycle to control the heating control component to heat the ambient temperature in the chip aging test chamber structure; If the ambient temperature value is greater than or equal to the second temperature threshold, the ambient temperature value is compared with a third temperature threshold and a fourth temperature threshold respectively; if the ambient temperature is greater than the third temperature threshold and less than the fourth temperature threshold, the air valve temperature controller invokes a proportional-integral-differential control mode to control the heating control component to heat the ambient temperature in the chip aging test chamber structure; If the ambient temperature value is greater than or equal to the fourth temperature threshold, the air valve temperature controller controls the air valve driving component to cool the ambient temperature in the chip aging test cavity structure.

[0011] In one embodiment, before the air valve temperature controller of the air valve temperature control module obtains the ambient temperature value in the chip aging test cavity structure detected by the temperature detection component in real time, the method further includes: The test controller obtains various preset parameters transmitted by the host computer and transmits the various preset parameters to the air valve temperature controller. The air valve state detection component of the chip aging temperature control test system detects the position state of the rotary switch of the air valve in the air valve drive component of the air valve temperature control module and transmits the position state to the air valve temperature controller. The air valve temperature controller controls the air valve driving assembly according to the position state to initialize the position state of the rotary switch.

[0012] In one embodiment, the air valve temperature controller calls a proportional-integral-differential control mode to control the heating control component to heat the ambient temperature in the chip aging test chamber structure, including: Obtaining the last ambient temperature value detected by the temperature detection component; Subtracting the ambient temperature value from the preset temperature value transmitted by the host computer to obtain a first temperature deviation, and subtracting the previous ambient temperature value from the preset temperature value transmitted by the host computer to obtain a second temperature deviation; performing a difference processing on the first temperature deviation and the second temperature deviation to obtain a deviation change value; It is determined whether the deviation change value satisfies a first preset condition, and when the deviation change value satisfies the first preset condition, a temperature value corrected by a proportional parameter is obtained according to the deviation change value and a preset proportional parameter.

[0013] In one embodiment, determining whether the deviation change value satisfies a first preset condition further includes: When the deviation change value does not meet the first preset condition, or after obtaining the temperature value after the proportional parameter is corrected, determining whether the deviation change value or the temperature value after the proportional parameter is corrected meets the second preset condition; When both the deviation change value and the temperature value after the proportional parameter correction satisfy the second preset condition, a first temperature value after the integral parameter correction is obtained according to the deviation change value and the preset integral parameter, and a second temperature value after the integral parameter correction is obtained according to the temperature value after the proportional parameter correction and the preset integral parameter; When neither the deviation change value nor the temperature value after the proportional parameter is corrected satisfies the second preset condition, it is determined whether the deviation change value or the temperature value after the proportional parameter is corrected satisfies the third preset condition; or after obtaining the first temperature value after the integral parameter is corrected or the second temperature value after the integral parameter is corrected, it is determined whether the first temperature value after the integral parameter is corrected or the second temperature value after the integral parameter is corrected satisfies the third preset condition.

[0014] In one embodiment, it further includes: When the first temperature value after the integral parameter correction, the second temperature value after the integral parameter correction, the deviation change value, or the temperature value after the proportional parameter correction all meet the third preset condition, respectively obtaining a first temperature value for differential parameter correction according to the first temperature value after the integral parameter correction and the preset differential parameter, obtaining a second temperature value for differential parameter correction according to the second temperature value after the integral parameter correction and the preset differential parameter, obtaining a third temperature value for differential parameter correction according to the deviation change value and the preset differential parameter, and obtaining a fourth temperature value for differential parameter correction according to the temperature value after the proportional parameter correction and the preset differential parameter; When the first temperature value after the integral parameter correction, the second temperature value after the integral parameter correction, the deviation change value, or the temperature value after the proportional parameter correction does not meet the third preset condition, or after obtaining the first temperature value after the differential parameter correction, the second temperature value after the differential parameter correction, the third temperature value after the differential parameter correction, or the fourth temperature value after the differential parameter correction, it is determined whether the first temperature value after the integral parameter correction, the second temperature value after the integral parameter correction, the deviation change value, the temperature value after the proportional parameter correction, the first temperature value after the differential parameter correction, the second temperature value after the differential parameter correction, the third temperature value after the differential parameter correction, or the fourth temperature value after the differential parameter correction meet the fourth preset condition; when all of the fourth preset conditions are met, heating the ambient temperature in the chip aging test chamber structure according to the preset temperature value; When the fourth preset condition is not met, the determination is restarted according to the above test method.

[0015] The above-mentioned chip aging temperature control test system and test method are characterized by setting an air valve temperature control module in the test system, controlling the air valve temperature control module through a test controller to detect the ambient temperature in the chip aging test cavity structure, and cooling the ambient temperature when it is detected that the ambient temperature exceeds the temperature threshold. Compared with only heating the ambient temperature, setting the air valve temperature control module to cool the ambient temperature can better control the ambient temperature in the chip aging test cavity structure, so that the chip is in a stable preset temperature range for aging testing, thereby improving the accuracy of temperature control. A test method is set on the air valve temperature controller of the test system, and the real-time temperature environment value obtained is compared with each preset temperature threshold. According to the comparison result, a corresponding control method is adopted to heat or cool the ambient temperature in the chip aging test cavity structure, thereby achieving precise control of the ambient temperature and improving the accuracy of temperature control. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 Schematic diagram of the electrical connection between the test controller and the air valve temperature control module in one embodiment of the present invention; Figure 2 This is a schematic diagram showing the connections between the components in the air valve temperature control module and the air valve temperature controller in one embodiment of the present invention; Figure 3 Schematic diagram of the positions of adjacent air valves and drive motors in one embodiment of the present invention; Figure 4 This is a schematic diagram of the connection between the test controller, the host computer and the temperature detection component in one embodiment of the present invention; Figure 5 1 is a flow chart of a chip aging temperature control test method according to an embodiment of the present invention; Figure 6 This is a schematic diagram of a process before obtaining the ambient temperature value in one embodiment of the present invention; Figure 7 1 is a flow chart of a proportional-integral-derivative control mode in one embodiment of the present invention.

[0018] Figure numerals: 1. test controller, 3. air valve temperature control module, 301. air valve temperature controller, 303. air valve drive component, 305. heating control component, 307. air valve status detection component, 309. temperature detection component, 5. host computer. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0020] It should be understood that the present invention can be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make the disclosure thorough and complete and to fully convey the scope of the invention to those skilled in the art. In the drawings, the dimensions and relative dimensions of layers and regions may be exaggerated for clarity. Like reference numerals denote like elements throughout.

[0021] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Thus, a first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part without departing from the teachings of the present invention.

[0022] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," etc., may be used herein for convenience of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the drawings is flipped, then the elements or features described as "under" or "beneath" or "beneath" the other elements will be oriented as "over" the other elements or features. Thus, the exemplary terms "under" and "under" may include both the upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0023] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present invention. When used herein, the singular forms "a", "an", and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0024] In order to fully understand the present invention, detailed structures and steps will be provided in the following description to illustrate the technical solutions proposed by the present invention. Preferred embodiments of the present invention are described in detail below. However, in addition to these detailed descriptions, the present invention may also have other implementations.

[0025] In one embodiment, if Figure 1 As shown, a chip aging temperature control test system is provided, comprising: a test controller 1 and at least two air valve temperature control modules, wherein the test controller 1 is electrically connected to each of the air valve temperature control modules 3 through a serial communication interface; The test controller 1 is used to control each of the air valve temperature control modules 3 to perform temperature aging test on the test chip in the chip aging test cavity structure. The air valve temperature control module 3 is used to cool the ambient temperature when it detects that the ambient temperature in the chip aging test cavity structure exceeds a preset temperature threshold.

[0026] Among them, the test controller 1 adopts FPGA logic chip and interface controller IP core, and is electrically connected to each air valve temperature control module 3 through a serial communication interface. The serial communication interface is one of the SPI interface, I2C interface or UART interface, which can be set as needed.

[0027] FPGAs (Field Programmable Gate Arrays) are a further development of programmable devices such as PALs (Programmable Array Logic) and GALs (General Array Logic). They emerged as a semi-custom circuit within the field of application-specific integrated circuits (ASICs), addressing both the shortcomings of custom circuits and the limited number of gates inherent in existing programmable devices.

[0028] Interface controller IP core (Intellectual Property core) is a pre-designed circuit function module used in FPGA logic chips.

[0029] The UART interface (Universal Asynchronous Receiver / Transmitter) is a universal asynchronous receiver / transmitter used to implement serial communication between semiconductor devices. It is a full-duplex communication interface that supports bidirectional data transmission without the need for clock signal synchronization and is suitable for asynchronous communication between different devices.

[0030] SPI interface (Serial Peripheral Interface) is a serial peripheral interface, a synchronous serial communication interface, widely used in embedded control systems for high-speed data communication between chips.

[0031] The I2C interface (Inter-Integrated Circuit) is a serial communication interface mainly used for short-distance communication between microcontrollers, sensors or other peripheral devices, allowing multiple devices to share the same bus.

[0032] In this embodiment, the test controller and the air valve temperature control module are electrically connected through a serial communication interface, thereby achieving the scalability and versatility of the chip aging temperature control test system, which can simultaneously meet the independent temperature control aging test requirements of different types of chips (including but not limited to high-end chips such as CPU, GPU, SOC, FPGA, ASIC, ARM, etc.), greatly improving the versatility and scalability of the chip aging temperature control test system, and the number of air valve temperature control modules can be set according to production capacity requirements, reducing the cost of modification. An air valve temperature control module is set in the test system, and the air valve temperature control module is controlled by the test controller to detect the ambient temperature in the chip aging test cavity structure, and the ambient temperature is cooled when it is detected that the ambient temperature exceeds the temperature threshold. Compared with only heating the ambient temperature, setting the air valve temperature control module to cool the ambient temperature can better control the ambient temperature in the chip aging test cavity structure, so that the chip is in a stable preset temperature range for aging test, thereby improving the accuracy of temperature control.

[0033] In one embodiment, if Figure 2 As shown, the air valve temperature control module 3 includes: an air valve temperature controller 301, an air valve drive component 303 and a heating control component 305, wherein the air valve temperature controller 301 is electrically connected to the air valve drive component 303, and the air valve temperature controller 301 is electrically connected to the heating control component 305. The air valve drive component 303 is arranged outside the chip aging test chamber structure, and the air valve temperature controller 301 and the heating control component 305 are arranged inside the chip aging test chamber structure; The air valve temperature controller 301 is used to control the heating control component 305 to heat the ambient temperature in the chip aging test cavity structure. The air valve temperature controller 301 is also used to control the air valve drive component 303 to cool the ambient temperature when it detects that the ambient temperature in the chip aging test cavity structure exceeds a preset temperature threshold.

[0034] Among them, the air valve temperature controller 301 is an ARM controller, which is set inside a chip aging test cavity structure. The ARM controller is a microcontroller (Microcontroller Unit) based on the ARM architecture (Advanced RISC Machines) and is widely used in embedded systems, industrial field control, Internet of Things devices and other fields.

[0035] The air valve drive assembly 303 is used to drive the rotation angle of the air valve to achieve precise control of the external cooling air volume entering the chip aging test cavity structure, so as to achieve the purpose of cooling control degree. Figure 3 As shown, the air valve drive assembly 303 includes an air valve and a drive motor. In adjacent air valve drive assemblies, the air valve and the drive motor are staggered. The drive motor receives the signal of the air valve temperature controller 301, drives the rotary switch of the control air valve, and allows external cooling air to enter therein to cool the ambient temperature. The drive motor is a servo motor, a stepper motor or other types of drive motors, which drives the left and right rotation angle of the rotary switch of the air valve to adjust the amount of cooling air entering the chip aging test cavity structure to achieve cooling treatment of the ambient temperature.

[0036] The heating control component 305 includes a heating drive unit and a heating unit. The heating drive unit receives the signal from the air valve temperature controller 301 and drives the heating unit to heat the ambient temperature of the chip aging test cavity structure. The heating drive unit is a high-power MOS tube, and the model can be one of WSD40L48DN33, GT3401 or SVG083R4NS. The heating unit uses a heating wire, and the model can be 0Cr21Al6Nb, Cr30Ni70 or KANTHAL series. The models of the MOS tube and the heating wire can be adjusted as needed.

[0037] In this embodiment, the heating drive unit and the heating wire in the heating control component are controlled by the air valve temperature controller to heat the ambient temperature in the chip aging test cavity structure. When the air valve temperature controller detects that the ambient temperature in the chip aging test cavity structure exceeds the preset temperature threshold, it controls the driving motor in the air valve driving component to open the air valve, thereby cooling the ambient temperature. The air valve driving component and the heating component are set to adjust the ambient temperature in the chip aging test cavity structure to stably maintain it at the preset temperature value, thereby improving the temperature control accuracy of the test system.

[0038] In one embodiment, if Figure 2 As shown, it also includes an air valve state detection component 307, which is electrically connected to the air valve temperature controller 301. The air valve state detection component 307 is arranged inside the chip aging test cavity structure. The air valve state detection component 307 is used to detect the position state of the rotary switch of the air valve in the air valve drive component 303 and transmit the position state to the air valve temperature controller 301.

[0039] The damper state detection component 307 is provided with a state signal detection unit for detecting the position state of the rotary switch of the damper in the damper drive component 303 .

[0040] In this embodiment, an air valve state detection component is provided to perform real-time detection on the position state of the rotary switch of the air valve in the air valve drive component, and the detection result is transmitted to the air valve temperature controller. The air valve in the air valve drive component is controlled according to the position state, thereby realizing precise control of the ambient temperature in the chip aging test cavity structure and improving the accuracy of the temperature control of the test system.

[0041] In one embodiment, if Figure 2 As shown, it also includes a temperature detection component 309, which is electrically connected to the air valve temperature controller 301. The temperature detection component 309 is used to detect the ambient temperature in the chip aging test cavity structure. The air valve temperature controller 301 is used to control the heating control component 305 to heat the ambient temperature in the chip aging test cavity structure according to the ambient temperature, or to control the air valve drive component 303 to cool the ambient temperature in the chip aging test cavity structure according to the ambient temperature.

[0042] Among them, the temperature detection component 309 includes a temperature sensor and a temperature change weak signal conditioning unit. The temperature sensor is used to detect the temperature change value in the chip aging test cavity structure in real time. The temperature change weak signal conditioning unit is used to amplify, filter and isolate the weak temperature signal output by the temperature sensor. The temperature sensor uses a PT100 platinum resistance temperature sensor.

[0043] In this embodiment, a temperature detection component is provided to perform real-time detection of the temperature change value within the chip aging test cavity structure, and the weak temperature signal detected by the temperature sensor is processed and then transmitted to the air valve temperature controller, thereby improving the accuracy of temperature detection. The air valve temperature processor takes corresponding processing according to the received real-time ambient temperature, thereby realizing precise control of the ambient temperature in the chip aging test cavity structure and improving the accuracy of temperature control of the test system.

[0044] In one embodiment, if Figure 4 As shown, the temperature detection component 309 is also electrically connected to the test controller 1. The temperature detection component 309 is used to transmit the detected ambient temperature in the chip aging test cavity structure to the test controller 1, and then the test controller 1 transmits it to the host computer 5 for monitoring.

[0045] The host computer 5 also sends various parameter settings to the test controller 1. The parameter settings include preset temperature values, PWM duty cycle, and preset proportional parameters, preset integral parameters, and preset differential parameters in the PID algorithm, which can be set according to the needs of the chip.

[0046] In this embodiment, the temperature detection component is also electrically connected to the test controller, and the detected ambient temperature in the chip aging test cavity structure is transmitted to the host computer through the test controller, so that the ambient temperature in the chip aging test cavity structure can be known at any time. If a fault occurs, timely measures can be taken, thereby improving the reliability and safety of the chip aging temperature control test system.

[0047] In one embodiment, if Figure 5 As shown, a chip aging temperature control test method is provided, which is applied to the above-mentioned test system, including: S601, the air valve temperature controller of the air valve temperature control module obtains in real time the ambient temperature value in the chip aging test cavity structure detected by the temperature detection component of the chip aging temperature control test system; Among them, the temperature sensor in the temperature detection component detects the ambient temperature value in the chip aging test cavity structure in real time, transmits the detection result to the temperature change weak signal conditioning unit, processes the ambient temperature value and then transmits it to the air valve temperature controller.

[0048] S602, comparing the ambient temperature value with a first temperature threshold; if the ambient temperature value is less than the first temperature threshold, the air valve temperature controller outputting a waveform with a first duty cycle to control the heating control component to heat the ambient temperature in the chip burn-in test chamber structure; Among them, such as Figure 5 As shown, after receiving the ambient temperature value, the damper temperature controller compares it with a first temperature threshold and takes corresponding actions based on the comparison result. The first temperature threshold is a digital signal indicating that the temperature is a certain degree Celsius below a preset temperature value. If the comparison result shows that the ambient temperature value is less than the first temperature threshold, the damper temperature controller outputs a waveform with a first duty cycle to control the heating component to heat the ambient temperature. The first duty cycle refers to a 100% PWM high-level duty cycle. If the comparison result is greater than or equal to the first temperature threshold, step S603 is performed.

[0049] S603: If the ambient temperature value is greater than or equal to the first temperature threshold, the ambient temperature value is compared with a second temperature threshold; if the ambient temperature value is less than the second temperature threshold, the air valve temperature controller outputs a waveform with a second duty cycle to control the heating control component to heat the ambient temperature in the chip burn-in test chamber structure; Among them, such as Figure 5 As shown, when the comparison result is greater than or equal to the first temperature threshold, the ambient temperature value is compared with the second temperature threshold, and corresponding actions are again performed based on the comparison result, where the second temperature threshold is a digital signal indicating that the ambient temperature value is a certain degree Celsius lower than the preset temperature value, and the second temperature threshold is greater than the first temperature threshold. When the comparison result shows that the ambient temperature value is less than the second temperature threshold, the damper temperature controller outputs a waveform with a second duty cycle to control the heating component to heat the ambient temperature. The second duty cycle refers to a 60% PWM high-level duty cycle. When the comparison result is greater than or equal to the second temperature threshold, step S604 is performed.

[0050] S604: If the ambient temperature value is greater than or equal to the second temperature threshold, the ambient temperature value is compared with a third temperature threshold and a fourth temperature threshold respectively; if the ambient temperature is greater than the third temperature threshold and less than the fourth temperature threshold, the air valve temperature controller invokes a proportional-integral-differential control mode to control the heating control component to heat the ambient temperature in the chip burn-in test chamber structure; Among them, such as Figure 5 As shown, when the comparison result is greater than or equal to the second temperature threshold, the ambient temperature value is compared with the third temperature threshold and the fourth temperature threshold, respectively, and corresponding actions are again performed based on the comparison results. The third temperature threshold is a digital signal indicating that the temperature is a certain degree Celsius lower than the preset temperature value, and the fourth temperature threshold is also a digital signal indicating that the temperature is a certain degree Celsius lower than the preset temperature value. The third temperature threshold is greater than the second temperature threshold, and the fourth temperature threshold is greater than the third temperature threshold. If the comparison result shows that the ambient temperature value is greater than the third temperature threshold and less than the fourth temperature threshold, the damper temperature controller calls the proportional-integral-differential control module to control the heating component to heat the ambient temperature; otherwise, step S605 is performed.

[0051] S605: If the ambient temperature value is greater than or equal to the fourth temperature threshold, the damper temperature controller controls the damper driving assembly to cool down the ambient temperature in the chip aging test chamber structure.

[0052] Among them, when the ambient temperature value is greater than or equal to the fourth temperature threshold, it means that the current temperature has exceeded the preset temperature value and heat dissipation is required. The air valve temperature controller controls the drive motor in the air valve drive assembly to drive the rotary switch of the air valve to allow external cooling air to enter the chip aging test cavity structure to cool the ambient temperature.

[0053] In this embodiment, the damper temperature controller receives the ambient temperature value detected by the temperature detection component, compares it with various temperature thresholds according to a preset program, and performs heating or cooling based on the comparison results. By comparing the ambient temperature value with the four temperature thresholds and outputting waveforms with different duty cycles based on the comparison results, the damper temperature controller achieves precise control of the ambient temperature within the chip burn-in test chamber structure, improving temperature control accuracy.

[0054] In one embodiment, if Figure 6 As shown, before the air valve temperature controller of the air valve temperature control module obtains the ambient temperature value in the chip aging test cavity structure detected by the temperature detection component in real time, it also includes: S701: The test controller obtains various preset parameters transmitted by the host computer and transmits the preset parameters to the air valve temperature controller. The air valve state detection component of the chip aging temperature control test system detects the position state of the rotary switch of the air valve in the air valve drive component of the air valve temperature control module and transmits the position state to the air valve temperature controller. Among them, the test controller receives various preset parameters transmitted by the host computer through the high-speed communication interface. The preset parameters include: preset temperature value, preset proportional parameter, preset integral parameter and preset differential parameter, and then transmits each preset parameter to the air valve temperature control through the serial communication interface.

[0055] S702: The damper temperature controller controls the damper drive assembly according to the position state to initialize the position state of the rotary switch.

[0056] When the damper state detection component detects that the position state of the rotary switch of the damper is already in the initialization state, the initial step is skipped to step S601 to start acquiring the ambient temperature.

[0057] In this embodiment, the test controller transmits the obtained preset parameters to the air valve temperature controller, detects and initializes the position of the air valve rotary switch, so that the external cold air will not enter the chip aging test cavity structure during heating, thereby ensuring high efficiency when heating the ambient temperature.

[0058] In one embodiment, if Figure 7As shown, the air valve temperature controller calls the proportional integral differential control mode to control the heating control component to heat the ambient temperature in the chip aging test cavity structure, including: S801, obtaining the last ambient temperature value detected by the temperature detection component; The last ambient temperature value refers to the last ambient temperature value detected by the temperature detection component.

[0059] S802, performing a subtraction process on the ambient temperature value and the preset temperature value transmitted by the host computer to obtain a first temperature deviation, and performing a subtraction process on the previous ambient temperature value and the preset temperature value transmitted by the host computer to obtain a second temperature deviation; S803, performing a difference processing on the first temperature deviation and the second temperature deviation to obtain a deviation change value; S804 , determining whether the deviation change value satisfies a first preset condition; when the deviation change value satisfies the first preset condition, obtaining a temperature value corrected by a proportional parameter according to the deviation change value and a preset proportional parameter.

[0060] Among them, the deviation change value is compared with the preset temperature value, and the first comparison result obtained has two situations: positive and negative values. When the first comparison result is greater than the first preset value or less than the negative first preset value, the first preset condition is met. The first preset value is a digital signal. At this time, a preset proportional parameter is introduced to obtain a temperature value corrected by the proportional parameter.

[0061] In this embodiment, a deviation change value is obtained based on the first temperature deviation and the second temperature deviation, and a determination is made as to whether the deviation change value satisfies a first preset condition. If the first preset condition is satisfied, a preset proportional parameter is introduced to correct the ambient temperature value to obtain a temperature value corrected by the proportional parameter. This makes the temperature value corrected by the proportional parameter closer to the preset temperature value, thereby improving the accuracy of temperature control.

[0062] In one embodiment, determining whether the deviation change value satisfies a first preset condition further includes: S901, when the deviation change value does not satisfy the first preset condition, or after obtaining the temperature value after the proportional parameter is corrected, determining whether the deviation change value or the temperature value after the proportional parameter is corrected meets a second preset condition; S902, when both the deviation change value or the temperature value after the proportional parameter correction satisfies the second preset condition, obtaining a first temperature value after the integral parameter correction based on the deviation change value and the preset integral parameter, and obtaining a second temperature value after the integral parameter correction based on the temperature value after the proportional parameter correction and the preset integral parameter; Among them, the deviation change value is compared with the preset temperature value to obtain a second comparison result. When the second comparison result is greater than the second preset value or less than the negative second preset value, the second preset condition is met. At this time, the preset integral parameter is introduced to obtain the first temperature value after the integral parameter is corrected; the temperature value after the proportional parameter is corrected is compared with the preset temperature value to obtain a third comparison result. When the third comparison result is greater than the second preset value or less than the negative second preset value, the second preset condition is met. The second preset value is a digital signal. At this time, the preset integral parameter is introduced to obtain the second temperature value after the integral parameter is corrected.

[0063] S903, when neither the deviation change value nor the temperature value after the proportional parameter is corrected satisfies the second preset condition, respectively determine whether the deviation change value or the temperature value after the proportional parameter is corrected satisfies the third preset condition; or after obtaining the first temperature value after the integral parameter is corrected or the second temperature value after the integral parameter is corrected, respectively determine whether the first temperature value after the integral parameter is corrected or the second temperature value after the integral parameter is corrected satisfies the third preset condition.

[0064] In this embodiment, a determination is made as to whether the deviation change value or the temperature value after the proportional parameter correction satisfies a second preset condition. When the second preset condition is satisfied, a preset integral parameter is introduced to correct the deviation change value to obtain a first temperature value after the integral parameter correction, and to correct the temperature value after the proportional parameter correction to obtain a second temperature value after the integral parameter correction. This allows the first or second temperature value after the integral parameter correction to be closer to the preset temperature value, thereby improving the accuracy of temperature control.

[0065] In one embodiment, it further includes: S1001: When the first temperature value after the integral parameter correction, the second temperature value after the integral parameter correction, the deviation change value, or the temperature value after the proportional parameter correction all meet the third preset condition, respectively obtaining a first temperature value for differential parameter correction based on the first temperature value after the integral parameter correction and a preset differential parameter, obtaining a second temperature value for differential parameter correction based on the second temperature value after the integral parameter correction and the preset differential parameter, obtaining a third temperature value for differential parameter correction based on the deviation change value and the preset differential parameter, and obtaining a fourth temperature value for differential parameter correction based on the temperature value after the proportional parameter correction and the preset differential parameter; Among them, the first temperature value after the integral parameter is corrected is compared with the preset temperature value to obtain a fourth comparison result. When the fourth comparison result is greater than the third preset value or less than the negative third preset value, the third preset condition is met. At this time, the preset differential parameter is introduced to obtain the first temperature value corrected by the preset WeChat parameter; the second temperature value after the integral parameter is corrected is compared with the preset temperature value to obtain a fifth comparison result. When the fifth comparison result is greater than the third preset value or less than the negative third preset value, the third preset condition is met. At this time, the preset differential parameter is introduced to obtain the second temperature value after the differential parameter is corrected; the deviation change value is compared with the preset temperature value to obtain a sixth comparison result. When the sixth comparison result is greater than the third preset value or less than the negative third preset value, the third preset condition is met. At this time, the preset differential parameter is introduced to obtain the third temperature value after the differential parameter is corrected; the temperature value after the proportional parameter is corrected is compared with the preset temperature value to obtain a seventh comparison result. When the seventh comparison result is greater than the third preset value or less than the negative third preset value, the third preset condition is met. At this time, the preset differential parameter is introduced to obtain the fourth temperature value after the differential parameter is corrected. The third preset value is a digital signal.

[0066] S1002: When the first temperature value after the integral parameter correction, the second temperature value after the integral parameter correction, the deviation change value, or the temperature value after the proportional parameter correction does not meet the third preset condition, or after obtaining the first temperature value after the differential parameter correction, the second temperature value after the differential parameter correction, the third temperature value after the differential parameter correction, or the fourth temperature value after the differential parameter correction, determine whether the first temperature value after the integral parameter correction, the second temperature value after the integral parameter correction, the deviation change value, the temperature value after the proportional parameter correction, the first temperature value after the differential parameter correction, the second temperature value after the differential parameter correction, the third temperature value after the differential parameter correction, or the fourth temperature value after the differential parameter correction meet the fourth preset condition; when all of the fourth preset conditions are met, heat the ambient temperature in the chip burn-in test chamber structure according to the preset temperature value; Among them, the fourth preset parameter refers to comparing the first temperature value after integral parameter correction, the second temperature value after integral parameter correction, the deviation change value, the temperature value after proportional parameter correction, the first temperature value after differential parameter correction, the second temperature value after differential parameter correction, the third temperature value after differential parameter correction or the fourth temperature value after differential parameter correction with the preset temperature value. If it is greater than or equal to the preset temperature value, the ambient temperature is heated according to the preset temperature value.

[0067] When the fourth preset condition is not met, the determination is restarted according to the above test method.

[0068] In this embodiment, it is judged whether the first temperature value after integral parameter correction, the second temperature value after integral parameter correction, the deviation change value, the temperature value after proportional parameter correction, the first temperature value after differential parameter correction, the second temperature value after differential parameter correction, the third temperature value after differential parameter correction or the fourth temperature value after differential parameter correction meets the fourth preset condition. If the fourth preset condition is met, it means that the ambient temperature in the chip aging test cavity structure can be heated according to the preset temperature value to realize the aging test of the chip. After the above judgment and correction, the ambient temperature can be stably maintained at the preset temperature value, thereby improving the accuracy of temperature control.

[0069] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A chip aging temperature control test system, characterized in that: include: A test controller and at least two air valve temperature control modules, wherein the test controller is electrically connected to each of the air valve temperature control modules via a serial communication interface; The test controller is used to control each of the air valve temperature control modules to perform temperature aging test on the test chip in the chip aging test cavity structure. The air valve temperature control module is used to cool the ambient temperature when it detects that the ambient temperature in the chip aging test cavity structure exceeds a preset temperature threshold.

2. The test system according to claim 1, wherein: The air valve temperature control module includes: an air valve temperature controller, an air valve drive assembly and a heating control assembly, wherein the air valve temperature controller is electrically connected to the air valve drive assembly, the air valve temperature controller is electrically connected to the heating control assembly, the air valve drive assembly is arranged outside the chip aging test cavity structure, and the air valve temperature controller and the heating control assembly are arranged inside the chip aging test cavity structure; The air valve temperature controller is used to control the heating control component to heat the ambient temperature in the chip aging test cavity structure. The air valve temperature controller is also used to control the air valve drive component to cool the ambient temperature when it detects that the ambient temperature in the chip aging test cavity structure exceeds a preset temperature threshold.

3. The test system according to claim 2, wherein: It also includes an air valve status detection component, which is electrically connected to the air valve temperature controller. The air valve status detection component is arranged inside the chip aging test cavity structure. The air valve status detection component is used to detect the position status of the rotary switch of the air valve in the air valve drive component and transmit the position status to the air valve temperature controller.

4. The test system according to claim 3, characterized in that It also includes a temperature detection component, which is electrically connected to the air valve temperature controller. The temperature detection component is used to detect the ambient temperature in the chip aging test cavity structure. The air valve temperature controller is used to control the heating control component to heat the ambient temperature in the chip aging test cavity structure according to the ambient temperature, or to control the air valve drive component to cool the ambient temperature in the chip aging test cavity structure according to the ambient temperature.

5. The test system according to claim 4, characterized in that: The temperature detection component is also electrically connected to the test controller. The temperature detection component is used to transmit the detected ambient temperature in the chip aging test cavity structure to the test controller, and then the test controller transmits it to the host computer for monitoring.

6. A chip aging temperature control test method, applied to the test system according to any one of claims 2 to 5, characterized in that: include: The air valve temperature controller of the air valve temperature control module obtains in real time the ambient temperature value in the chip aging test cavity structure detected by the temperature detection component of the chip aging temperature control test system; Comparing the ambient temperature value with a first temperature threshold, if the ambient temperature value is less than the first temperature threshold, the air valve temperature controller outputting a waveform with a first duty cycle to control the heating control component to heat the ambient temperature in the chip aging test cavity structure; If the ambient temperature value is greater than or equal to the first temperature threshold, the ambient temperature value is compared with a second temperature threshold; if the ambient temperature value is less than the second temperature threshold, the air valve temperature controller outputs a waveform with a second duty cycle to control the heating control component to heat the ambient temperature in the chip aging test chamber structure; If the ambient temperature value is greater than or equal to the second temperature threshold, the ambient temperature value is compared with a third temperature threshold and a fourth temperature threshold respectively; if the ambient temperature is greater than the third temperature threshold and less than the fourth temperature threshold, the air valve temperature controller invokes a proportional-integral-differential control mode to control the heating control component to heat the ambient temperature in the chip aging test chamber structure; If the ambient temperature value is greater than or equal to the fourth temperature threshold, the air valve temperature controller controls the air valve driving component to cool the ambient temperature in the chip aging test cavity structure.

7. The testing method according to claim 6, characterized in that: Before the air valve temperature controller of the air valve temperature control module obtains the ambient temperature value in the chip aging test cavity structure detected by the temperature detection component in real time, the method further includes: The test controller obtains various preset parameters transmitted by the host computer and transmits the various preset parameters to the air valve temperature controller. The air valve state detection component of the chip aging temperature control test system detects the position state of the rotary switch of the air valve in the air valve drive component of the air valve temperature control module and transmits the position state to the air valve temperature controller. The air valve temperature controller controls the air valve driving assembly according to the position state to initialize the position state of the rotary switch.

8. The testing method according to claim 7, characterized in that: The air valve temperature controller calls the proportional integral differential control mode to control the heating control component to heat the ambient temperature in the chip aging test cavity structure, including: Obtaining the last ambient temperature value detected by the temperature detection component; Subtracting the ambient temperature value from the preset temperature value transmitted by the host computer to obtain a first temperature deviation, and subtracting the previous ambient temperature value from the preset temperature value transmitted by the host computer to obtain a second temperature deviation; performing a difference processing on the first temperature deviation and the second temperature deviation to obtain a deviation change value; It is determined whether the deviation change value satisfies a first preset condition, and when the deviation change value satisfies the first preset condition, a temperature value corrected by a proportional parameter is obtained according to the deviation change value and a preset proportional parameter.

9. The testing method according to claim 8, characterized in that: Determining whether the deviation change value satisfies a first preset condition further includes: When the deviation change value does not meet the first preset condition, or after obtaining the temperature value after the proportional parameter is corrected, determining whether the deviation change value or the temperature value after the proportional parameter is corrected meets the second preset condition; When both the deviation change value and the temperature value after the proportional parameter correction satisfy the second preset condition, a first temperature value after the integral parameter correction is obtained according to the deviation change value and the preset integral parameter, and a second temperature value after the integral parameter correction is obtained according to the temperature value after the proportional parameter correction and the preset integral parameter; When neither the deviation change value nor the temperature value after the proportional parameter is corrected satisfies the second preset condition, it is determined whether the deviation change value or the temperature value after the proportional parameter is corrected satisfies the third preset condition; or after obtaining the first temperature value after the integral parameter is corrected or the second temperature value after the integral parameter is corrected, it is determined whether the first temperature value after the integral parameter is corrected or the second temperature value after the integral parameter is corrected satisfies the third preset condition.

10. The testing method according to claim 9, characterized in that: Also includes: When the first temperature value after the integral parameter correction, the second temperature value after the integral parameter correction, the deviation change value, or the temperature value after the proportional parameter correction all meet the third preset condition, respectively obtaining a first temperature value for differential parameter correction according to the first temperature value after the integral parameter correction and the preset differential parameter, obtaining a second temperature value for differential parameter correction according to the second temperature value after the integral parameter correction and the preset differential parameter, obtaining a third temperature value for differential parameter correction according to the deviation change value and the preset differential parameter, and obtaining a fourth temperature value for differential parameter correction according to the temperature value after the proportional parameter correction and the preset differential parameter; When the first temperature value after the integral parameter correction, the second temperature value after the integral parameter correction, the deviation change value, or the temperature value after the proportional parameter correction does not meet the third preset condition, or after obtaining the first temperature value after the differential parameter correction, the second temperature value after the differential parameter correction, the third temperature value after the differential parameter correction, or the fourth temperature value after the differential parameter correction, it is determined whether the first temperature value after the integral parameter correction, the second temperature value after the integral parameter correction, the deviation change value, the temperature value after the proportional parameter correction, the first temperature value after the differential parameter correction, the second temperature value after the differential parameter correction, the third temperature value after the differential parameter correction, or the fourth temperature value after the differential parameter correction meet the fourth preset condition; when all of the fourth preset conditions are met, heating the ambient temperature in the chip aging test chamber structure according to the preset temperature value; When the fourth preset condition is not met, the determination is restarted according to the test method.

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