Temperature control method, temperature control device, self-driving vehicle-mounted control system and vehicle

Abstract

The invention discloses a temperature control method, a temperature control device, a self-driving vehicle-mounted control system and a vehicle, and relates to the field of electronic device temperature control in an automatic driving vehicle, and a first temperature adjustment surface of a TEC in the temperature control device is used for being attached to a target temperature adjustment surface of a module to be subjected to temperature adjustment in the self-driving vehicle-mounted control system. If yes, the current actual temperature of the module to be subjected to temperature regulation is obtained, switching between the cold end face and the hot end face can be achieved based on the different directions of the current flowing through the TEC by the first temperature regulation face, and the voltage output to the TEC is controlled according to the actual temperature, the target regulation temperature and the preset temperature regulation strategy so that the current flowing through the TEC can be correspondingly changed, and the temperature of the module to be subjected to temperature regulation can be adjusted. The actual temperature is adjusted to a target adjustment temperature through the first temperature adjustment surface. Therefore, according to the scheme, the actual temperature of the to-be-temperature-adjusted module is kept to be obtained, accurate temperature control over the to-be-temperature-adjusted module is achieved timely and rapidly based on the TEC, the computing power of the to-be-temperature-adjusted module can be brought into full play, and the chip failure rate can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature control of electronic devices in autonomous driving vehicles, and in particular to a temperature control method, a temperature control device, an autonomous driving onboard control system, and a vehicle. Background Art

[0002] At present, there are two main heat dissipation methods for ADAS (Advanced Driving Assistance System) domain controllers in autonomous vehicles: natural heat dissipation and water cooling. Among them, natural heat dissipation is mainly used for small computing power chips, that is, thermal conductive glue is covered on the surface of the chip to conduct heat through the thermal conductive glue and dissipate it through the heat sink; for high computing power chips, such as SOC (System on Chip), water cooling is mainly used, that is, thermal conductive glue is covered on the surface of the chip and then contacted with a liquid cooling shell. The interior of the liquid cooling shell is provided with flowing coolant, and then the temperature is reduced by the coolant. However, the above methods only set up a heat dissipation structure, and in actual applications, there are defects such as temperature control lag and inaccuracy, which leads to incomplete utilization of the computing power of the SOC and high chip failure rate.

[0003] Therefore, how to provide a more effective temperature control solution is an urgent problem to be solved. Summary of the Invention

[0004] In view of this, the present invention provides a temperature control method, a temperature control device, a self-driving car control system and a vehicle, which realizes precise temperature control of the module to be temperature-controlled in a timely and rapid manner based on TEC, thereby facilitating full utilization of the computing power of the module to be temperature-controlled.

[0005] To solve the above technical problems, the present application provides a temperature control method, which is applied to a control module in a temperature control device of an onboard control system of a self-driving vehicle. The temperature control device also includes a TEC, wherein a first temperature control surface of the TEC is configured to mate with a target temperature control surface of a module to be temperature-controlled in the onboard control system of the self-driving vehicle. A first input end of the TEC is connected to a first output end of the control module, and a second input end of the TEC is connected to a second output end of the control module. The temperature control method comprises:

[0006] Obtaining the current actual temperature of the module to be temperature adjusted;

[0007] The voltage output to the TEC is controlled according to the actual temperature, the target adjustment temperature, and a preset temperature adjustment strategy to correspondingly change the current flowing through the TEC, thereby adjusting the actual temperature to the target adjustment temperature through the first temperature adjustment surface; wherein the first temperature adjustment surface is used to achieve switching between the cold end surface and the hot end surface when the direction of the current flowing through the TEC is different.

[0008] Furthermore, obtaining the current actual temperature of the module to be temperature-adjusted includes:

[0009] The actual temperature of the module to be temperature-adjusted, collected by a temperature sensor integrated inside the module to be temperature-adjusted, is obtained.

[0010] Furthermore, the temperature control device further includes a temperature acquisition circuit connected to the control module;

[0011] Obtaining the current actual temperature of the module to be temperature-adjusted includes:

[0012] The current actual temperature of the module to be temperature-adjusted is determined according to the temperature acquisition circuit.

[0013] Furthermore, controlling the voltage output to the TEC according to the actual temperature, the target adjustment temperature, and the preset temperature adjustment strategy to correspondingly change the current flowing through the TEC includes:

[0014] determining a temperature difference between the target regulated temperature and the actual temperature;

[0015] The voltage output to the TEC is determined based on the temperature difference and a preset PID control algorithm to correspondingly change the current flowing through the TEC, so that the first temperature adjustment surface switches between the cold end surface and the hot end surface, thereby adjusting the actual temperature to the target adjustment temperature.

[0016] Furthermore, controlling the voltage output to the TEC according to the actual temperature, the target adjustment temperature, and the preset temperature adjustment strategy to correspondingly change the current flowing through the TEC includes:

[0017] When it is determined that the actual temperature is not less than a preset upper temperature limit, controlling a first voltage output to the TEC so that a first current having a first preset amplitude and a first direction flows through the TEC, and the first temperature-regulating surface is made a cold end surface, so that the actual temperature drops to the target regulation temperature by forming the first temperature-regulating surface as the cold end surface, and then the output is stopped;

[0018] When it is determined that the actual temperature is not greater than the preset lower limit temperature, controlling the second voltage output to the TEC so that a second current having the first preset amplitude and a second direction flows through the TEC, and the first temperature-regulating surface becomes a hot end surface, so that the actual temperature rises to the target regulation temperature by forming the first temperature-regulating surface of the hot end surface, and then the output is stopped;

[0019] When it is determined that the actual temperature exceeds the preset temperature allowable variation range corresponding to the target adjustment temperature, the third voltage output to the TEC is controlled to cause a third current with a second preset amplitude and a third direction to flow through the TEC, so as to adjust the actual temperature to the target adjustment temperature through the first temperature adjustment surface and then stop the output; wherein, the third direction is the first direction when the actual temperature is greater than the upper limit of the preset temperature allowable variation range; wherein, the third direction is the second direction when the actual temperature is less than the lower limit of the preset temperature allowable variation range, and the second preset amplitude is less than the first preset amplitude.

[0020] To solve the above technical problems, the present invention further provides a temperature control device for use in a self-driving vehicle control system, the temperature control device comprising a control module and a TEC; a first temperature control surface of the TEC is adapted to mate with a target temperature control surface of a module to be temperature-controlled in the self-driving vehicle control system; a first input end of the TEC is connected to a first output end of the control module; and a second input end of the TEC is connected to a second output end of the control module.

[0021] The control module is used to implement the steps of the temperature control method as described above when executing a computer program.

[0022] Furthermore, it also includes a heat conducting component and a heat dissipating component;

[0023] The first heat-conducting surface of the heat-conducting component is used to fit with the second temperature-regulating surface of the TEC, and the second heat-conducting surface is used to fit with the heat-conducting surface of the heat-dissipating component;

[0024] The heat dissipation component is used to dissipate the heat transferred by the heat-conducting component through its own heat dissipation portion.

[0025] Furthermore, the area of the first heat-conducting surface of the heat-conducting component is larger than the area of the second temperature-regulating surface of the TEC.

[0026] To solve the above technical problems, the present invention further provides a self-driving car control system, comprising a SOC and a temperature control device as described above; wherein the control module in the temperature control device is an MCU constituting a control unit of the self-driving car control system;

[0027] The first temperature control surface of the TEC in the temperature control device is used to fit the target temperature control surface of the SOC.

[0028] In order to solve the above technical problems, the present invention also provides a vehicle, including the self-driving vehicle control system as described above.

[0029] The present application provides a temperature control method, a temperature control device, an onboard control system for a self-driving vehicle, and a vehicle. The first temperature control surface of a TEC in the temperature control device is adapted to mate with the target temperature control surface of a module to be temperature-controlled in the onboard control system for a self-driving vehicle. The first input end of the TEC is connected to the first output end of the control module, and the second input end of the TEC is connected to the second output end of the control module. The current flowing through the TEC is switched between the cold end and the hot end based on the different directions of the current flowing through the TEC. The voltage output to the TEC is controlled based on the actual temperature, the target temperature, and a preset temperature control strategy to correspondingly change the current flowing through the TEC, thereby adjusting the actual temperature to the target temperature through the first temperature control surface. This solution maintains real-time and continuous acquisition of the actual temperature of the module to be temperature-controlled in the onboard control system for a self-driving vehicle, and promptly and quickly achieves precise temperature control of the module to be temperature-controlled based on the TEC. This facilitates fully utilizing the computing power of the module to be temperature-controlled, reduces chip failure rates, and facilitates practical applications.

[0030] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0032] Figure 1 A flow chart of a temperature control method provided by the present invention;

[0033] Figure 2 This is a schematic structural diagram of a temperature control device in a self-driving vehicle control system provided by the present invention. DETAILED DESCRIPTION

[0034] The core of the present invention is to provide a temperature control method, a temperature control device, a self-driving car control system and a vehicle, which can realize precise temperature control of the module to be temperature-controlled in a timely and rapid manner based on TEC, thereby fully utilizing the computing power of the module to be temperature-controlled.

[0035] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0036] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0037] Please refer to Figure 1 and Figure 2 , Figure 1 A flow chart of a temperature control method provided by the present invention, Figure 2 This is a structural schematic diagram of a temperature control device provided by the present invention.

[0038] The temperature control method is applied to a control module in a temperature control device of a self-driving vehicle control system. The temperature control device further includes a TEC2. A first temperature control surface of the TEC2 is adapted to be aligned with a target temperature control surface of a module 1 to be temperature-controlled in the self-driving vehicle control system. A first input end of the TEC2 is connected to a first output end of the control module, and a second input end of the TEC2 is connected to a second output end of the control module. The temperature control method includes:

[0039] S11: Obtain the current actual temperature of the module 1 to be temperature-adjusted;

[0040] S12: Controlling the voltage output to TEC2 based on the actual temperature, the target adjustment temperature, and a preset temperature adjustment strategy to correspondingly change the current flowing through TEC2, thereby adjusting the actual temperature to the target adjustment temperature through the first temperature adjustment surface; wherein the first temperature adjustment surface is used to achieve switching between the cold end surface and the hot end surface when the direction of the current flowing through TEC2 is different.

[0041] In this embodiment, the TEC2 (Thermoelectric cooler) here includes one or more pairs of N-type semiconductors and P-type semiconductors inside, and two terminals outside. The first input end of TEC2 is connected to the first output end of the control module, and the second input end is connected to the second output end of the control module. By changing the magnitude and direction of the voltage output by the first output end and the second output end of the control module, the magnitude and direction of the current flowing through TEC2 can be changed accordingly; TEC2 includes a first temperature control surface and a second temperature control surface. When the current flows through TEC2 in a first direction, the first temperature control surface is the cold end surface and the corresponding second temperature control surface is the hot end surface; when the current flows through TEC2 in a second direction, the first temperature control surface is the hot end surface and the corresponding second temperature control surface is the cold end surface.

[0042] Specifically, the module 1 to be temperature-adjusted here can be various control chips such as the SOC in the self-driving car control system, or various consumer-grade chips, which are not particularly limited here; step S11 can be real-time and continuous acquisition of the current actual temperature of the module 1 to be temperature-adjusted, or acquisition of the actual temperature of the module 1 to be temperature-adjusted according to a preset sampling period, and the specific value of the preset sampling period is not particularly limited here; and more specifically, what is obtained here can be the actual temperature of the outer shell of the module 1 to be temperature-adjusted and the target temperature adjustment surface.

[0043] The target adjustment temperature is the target temperature value to be controlled. For example, the target adjustment temperature can be 25°, which can be set according to actual needs. Then, according to step S12, the voltage output to TEC2 is controlled (specifically including the magnitude and direction of the adjustment voltage) to correspondingly change the current flowing through TEC2 (also including the magnitude and direction of the adjustment current). For example, when the first output terminal outputs a high level and the second output terminal outputs a low level, the current in the first direction flows through TEC2, making the first temperature adjustment surface a cold end surface, thereby absorbing the heat of the module 1 to be temperature adjusted to achieve the purpose of heat dissipation. The greater the output voltage, the corresponding current flowing through TEC2. When the first output terminal of the TEC2 outputs a low level and the second output terminal of the TEC2 outputs a high level, a current in the second direction flows through the TEC2, making the second temperature control surface a hot end surface, thereby providing heat for the module 1 to be temperature-controlled, thereby achieving the purpose of heating. The larger the output voltage, the larger the corresponding current flowing through the TEC2, and the more obvious the heating effect of the first temperature control surface of the TEC2. That is, the cooling capacity when the first temperature control surface is switched to the cold end surface is positively correlated with the magnitude of the current flowing through the TEC2, and the heating capacity when the first temperature control surface is switched to the hot end surface is positively correlated with the magnitude of the current flowing through the TEC2.

[0044] It should be noted that Figure 2Due to the limited focus of the picture, the connection between TEC2 and the control module is omitted. In addition, when the target temperature control surface of the module 1 to be temperature controlled is large, the hot spots can be marked on the target temperature control surface in advance so that TEC2 can be arranged at each hot spot.

[0045] In summary, the present application provides a temperature control method, which maintains real-time and continuous acquisition of the actual temperature of the module to be temperature-controlled 1 in the self-driving vehicle control system, and realizes precise temperature control of the module to be temperature-controlled 1 in a timely and rapid manner based on TEC2, which is conducive to fully utilizing the computing power of the module to be temperature-controlled 1, improving the performance of the module to be temperature-controlled 1, reducing the chip failure rate, and facilitating practical applications.

[0046] Based on the above embodiment:

[0047] In some embodiments, obtaining the current actual temperature of the module to be temperature-adjusted 1 includes:

[0048] The actual temperature of the module to be temperature-controlled 1 collected by a temperature sensor integrated inside the module to be temperature-controlled 1 is obtained.

[0049] In this embodiment, considering that high computing power chips such as SOC have high-precision temperature sensors integrated therein to collect their temperature, accurate perception of the temperature of the temperature control module 1 can be achieved by directly obtaining the actual temperature collected by the temperature sensor.

[0050] It should be noted that, taking the temperature-adjustable module 1 as SOC as an example, its internal temperature sensor will not work until it is powered on and started. Therefore, in this embodiment, the actual temperature is obtained through the internally integrated temperature sensor after the temperature-adjustable module 1 is powered on and started.

[0051] In some embodiments, the temperature control device further includes a temperature acquisition circuit connected to the control module;

[0052] Obtain the current actual temperature of the module 1 to be temperature-adjusted, including:

[0053] The current actual temperature of the module 1 to be temperature-controlled is determined according to the temperature acquisition circuit.

[0054] In this embodiment, considering that some modules 1 to be temperature-controlled do not have a temperature sensor inside, or when the module 1 to be temperature-controlled has not yet been powered on and started up, a temperature acquisition circuit can be used to determine the current actual temperature of the module 1 to be temperature-controlled. Specifically, the temperature acquisition circuit may include a voltage divider resistor and an NTC thermistor (Negative Temperature Coefficient). The NTC thermistor is arranged close to the housing of the module 1 to be temperature-controlled so as to promptly sense the temperature of the module 1 to be temperature-controlled. One end of the voltage divider resistor is connected to a power supply, and the other end of the voltage divider resistor is connected to a sampling input terminal of the control module and one end of the NTC thermistor, respectively. The other end of the thermistor is grounded. Based on the characteristics of the NTC thermistor that the resistance is high when the temperature is low and low when the temperature is high, combined with a preset temperature-voltage correspondence relationship, the actual temperature of the module 1 to be temperature-controlled can be determined based on the voltage value across the NTC thermistor.

[0055] It can be understood that for the module 1 to be temperature-controlled that is integrated with a temperature sensor, the actual temperature can be determined solely by the temperature sensor. Of course, the actual temperature of the module 1 to be temperature-controlled can also be determined based on the first temperature determined by the temperature acquisition circuit and the second temperature determined by the temperature sensor, such as determining the average of the first temperature and the second temperature as the actual temperature of the module 1 to be temperature-controlled.

[0056] In some embodiments, controlling the voltage output to TEC2 according to the actual temperature, the target temperature, and a preset temperature regulation strategy to correspondingly change the current flowing through TEC2 includes:

[0057] determining a temperature difference between a target regulated temperature and an actual temperature;

[0058] The voltage output to TEC2 is determined according to the temperature difference and a preset PID control algorithm to correspondingly change the current flowing through TEC2, so that the first temperature adjustment surface switches between the cold end surface and the hot end surface, thereby adjusting the actual temperature to the target adjustment temperature.

[0059] Specifically, the above method can accurately and reliably realize the temperature control of the module 1 to be temperature-controlled. It should be noted that there is no special limitation on the setting of proportional parameters, integral parameters and differential parameters in the preset PID control algorithm, and they can be selected according to actual needs.

[0060] In some embodiments, controlling the voltage output to TEC2 according to the actual temperature, the target temperature, and a preset temperature regulation strategy to correspondingly change the current flowing through TEC2 includes:

[0061] When it is determined that the actual temperature is not less than the preset upper temperature limit, the first voltage output to TEC2 is controlled so that a first current having a first preset amplitude and a first direction flows through TEC2, and the first temperature-regulating surface is made a cold end surface, so that the actual temperature drops to the target regulation temperature through the first temperature-regulating surface forming the cold end surface, and then the output is stopped;

[0062] When it is determined that the actual temperature is not greater than the preset lower limit temperature, controlling the second voltage output to TEC2 so that a second current having a first preset amplitude and a second direction flows through TEC2, and the first temperature-regulating surface becomes a hot end surface, so that the actual temperature rises to a target regulating temperature through the first temperature-regulating surface forming the hot end surface, and then the output is stopped;

[0063] When it is determined that the actual temperature exceeds the preset temperature allowable variation range corresponding to the target adjustment temperature, the third voltage output to TEC2 is controlled to cause a third current with a second preset amplitude and a third direction to flow through TEC2, so as to adjust the actual temperature to the target adjustment temperature through the first temperature adjustment surface and then stop the output; wherein, the third direction is the first direction when the actual temperature is greater than the upper limit of the preset temperature allowable variation range; wherein, the third direction is the second direction when the actual temperature is less than the lower limit of the preset temperature allowable variation range, and the second preset amplitude is less than the first preset amplitude.

[0064] In this embodiment, specifically, the upper limit of the preset temperature can be 35°, and the lower limit of the preset temperature can be 0°, which can be set according to actual needs; in addition, the setting mechanism for making the second preset amplitude smaller than the first preset amplitude is that: the cooling capacity when the first temperature control surface is switched to the cold end surface is positively correlated with the magnitude of the current flowing through TEC2, and the heating capacity when the first temperature control surface is switched to the hot end surface is positively correlated with the magnitude of the current flowing through TEC2; temperature control near the preset temperature allowable variation range is essentially fine-tuning to ensure that the actual temperature fluctuates within the preset temperature allowable variation range corresponding to the target adjustment temperature, and when the actual temperature is not less than the preset temperature upper limit or the actual temperature is not greater than the preset temperature lower limit, it indicates that an obvious temperature fault has occurred, and therefore the temperature needs to be adjusted as soon as possible, so the second preset amplitude is set to be smaller than the first preset amplitude to speed up the temperature adjustment rate.

[0065] It should also be noted that, in actual applications, the magnitude of the second current can also be set to a third preset amplitude that is different from the first preset amplitude, which is not particularly limited here; preferably, the third preset amplitude is still greater than the second preset amplitude.

[0066] Please refer to Figure 2 , Figure 2 This is a schematic structural diagram of a temperature control device in a self-driving vehicle control system provided by the present invention.

[0067] The temperature control device is applied to a self-driving car control system and includes a control module and a TEC2. The first temperature control surface of the TEC2 is adapted to mate with the target temperature control surface of the temperature-controlled module 1 in the self-driving car control system. The first input terminal of the TEC2 is connected to the first output terminal of the control module, and the second input terminal of the TEC2 is connected to the second output terminal of the control module.

[0068] The control module is used to implement the steps of the temperature control method as described above when executing the computer program.

[0069] For an introduction to the temperature control device provided in this application, please refer to the embodiment of the above-mentioned temperature control method, which will not be repeated here.

[0070] In some embodiments, a heat conducting component 3 and a heat dissipating component 4 are further included;

[0071] The first heat-conducting surface of the heat-conducting component 3 is used to fit with the second temperature-regulating surface of the TEC 2, and the second heat-conducting surface is used to fit with the heat-conducting surface of the heat-dissipating component 4;

[0072] The heat dissipation component 4 is used to dissipate the heat transferred by the heat-conducting component 3 through its own heat dissipation part.

[0073] Specifically, the material of the heat conducting component 3 can be copper to better achieve heat transfer; please refer to Figure 2 The heat conducting surface of the heat dissipation component 4 can be concave so as to better fit with the heat conducting component 3, and the heat dissipation portion of the heat dissipation component 4 can be configured as follows Figure 2 The serrated heat sink fins shown.

[0074] It should be noted that Figure 2 Due to the limitation of the focus of the picture, the connection between TEC2 and the control module is omitted, and only the setting diagram between the temperature-controlled module 1, TEC2, the heat-conducting component 3 and the heat-dissipating component 4 is shown.

[0075] In some embodiments, the area of the first heat-conducting surface of the heat-conducting component 3 is larger than the area of the second temperature-regulating surface of the TEC 2 .

[0076] Specifically, considering that the heat dissipation area is proportional to the heat dissipation effect, it can be as follows Figure 2 As shown, the area of the first heat-conducting surface of the heat-conducting component 3 is set to be larger than the area of the second temperature-regulating surface of the TEC2 to ensure better heat release.

[0077] The present invention also provides a self-driving car control system, comprising a SOC and a temperature control device as described above; wherein the control module in the temperature control device is an MCU constituting a control unit of the self-driving car control system;

[0078] The first temperature control surface of the TEC in the temperature control device is used to fit the target temperature control surface of the SOC.

[0079] For an introduction to the self-driving car control system provided in this application, please refer to the above-mentioned embodiment of the temperature control method, which will not be repeated here.

[0080] It should also be noted that the self-driving car control system may include multiple control units, such as MCU and SOC. Reusing the MCU as the control module in the temperature control device here is beneficial to save costs and achieve reliable control of the temperature of the SOC.

[0081] The present invention also provides a vehicle, comprising the self-driving vehicle control system as described above.

[0082] For the introduction of the vehicle provided in this application, please refer to the embodiment of the temperature control method above, which will not be repeated here. In addition, the vehicle here is a vehicle that can realize automatic driving by relying on a self-driving car onboard control system.

[0083] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. Relational terms such as first and second are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements limited by the sentence "comprising a" do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0084] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is to be construed in the widest manner consistent with the principles and novel features disclosed herein.

Claims

1. A temperature control method, characterized in that: A control module used in a temperature control device of a self-driving vehicle control system, the temperature control device further comprising a TEC, wherein a first temperature control surface of the TEC is adapted to mate with a target temperature control surface of a module to be temperature-controlled in the self-driving vehicle control system, a first input end of the TEC being connected to a first output end of the control module, and a second input end of the TEC being connected to a second output end of the control module; and a temperature control method comprising: Obtaining the current actual temperature of the module to be temperature adjusted; The voltage output to the TEC is controlled according to the actual temperature, the target adjustment temperature, and a preset temperature adjustment strategy to correspondingly change the current flowing through the TEC, thereby adjusting the actual temperature to the target adjustment temperature through the first temperature adjustment surface; wherein the first temperature adjustment surface is used to achieve switching between the cold end surface and the hot end surface when the direction of the current flowing through the TEC is different.

2. The temperature control method according to claim 1, wherein: Obtaining the current actual temperature of the module to be temperature-adjusted includes: The actual temperature of the module to be temperature-adjusted, collected by a temperature sensor integrated inside the module to be temperature-adjusted, is obtained.

3. The temperature control method according to claim 1, wherein: The temperature control device further includes a temperature acquisition circuit connected to the control module; Obtaining the current actual temperature of the module to be temperature-adjusted includes: The current actual temperature of the module to be temperature-adjusted is determined according to the temperature acquisition circuit.

4. The temperature control method according to any one of claims 1 to 3, characterized in that: Controlling the voltage output to the TEC according to the actual temperature, the target adjustment temperature, and a preset temperature adjustment strategy to correspondingly change the current flowing through the TEC includes: determining a temperature difference between the target regulated temperature and the actual temperature; The voltage output to the TEC is determined based on the temperature difference and a preset PID control algorithm to correspondingly change the current flowing through the TEC, so that the first temperature adjustment surface switches between the cold end surface and the hot end surface, thereby adjusting the actual temperature to the target adjustment temperature.

5. The temperature control method according to any one of claims 1 to 3, characterized in that: Controlling the voltage output to the TEC according to the actual temperature, the target adjustment temperature, and a preset temperature adjustment strategy to correspondingly change the current flowing through the TEC includes: When it is determined that the actual temperature is not less than a preset upper temperature limit, controlling a first voltage output to the TEC so that a first current having a first preset amplitude and a first direction flows through the TEC, and the first temperature-regulating surface is made a cold end surface, so that the actual temperature drops to the target regulation temperature by forming the first temperature-regulating surface as the cold end surface, and then the output is stopped; When it is determined that the actual temperature is not greater than the preset lower limit temperature, controlling the second voltage output to the TEC so that a second current having the first preset amplitude and a second direction flows through the TEC, and the first temperature-regulating surface becomes a hot end surface, so that the actual temperature rises to the target regulation temperature by forming the first temperature-regulating surface of the hot end surface, and then the output is stopped; When it is determined that the actual temperature exceeds the preset temperature allowable variation range corresponding to the target adjustment temperature, the third voltage output to the TEC is controlled to cause a third current with a second preset amplitude and a third direction to flow through the TEC, so as to adjust the actual temperature to the target adjustment temperature through the first temperature adjustment surface and then stop the output; wherein, the third direction is the first direction when the actual temperature is greater than the upper limit of the preset temperature allowable variation range; wherein, the third direction is the second direction when the actual temperature is less than the lower limit of the preset temperature allowable variation range, and the second preset amplitude is less than the first preset amplitude.

6. A temperature control device, characterized in that: Applied to a self-driving car control system, the temperature control device includes a control module and a TEC; a first temperature control surface of the TEC is used to fit with a target temperature control surface of a module to be temperature-controlled in the self-driving car control system; a first input end of the TEC is connected to a first output end of the control module, and a second input end of the TEC is connected to a second output end of the control module; The control module is configured to implement the steps of the temperature control method according to any one of claims 1 to 5 when executing a computer program.

7. The temperature control device according to claim 6, characterized in that: Also includes heat conducting components and heat dissipating components; The first heat-conducting surface of the heat-conducting component is used to fit with the second temperature-regulating surface of the TEC, and the second heat-conducting surface is used to fit with the heat-conducting surface of the heat-dissipating component; The heat dissipation component is used to dissipate the heat transferred by the heat-conducting component through its own heat dissipation portion.

8. The temperature control device according to claim 7, characterized in that: The area of the first heat-conducting surface of the heat-conducting component is larger than the area of the second temperature-regulating surface of the TEC.

9. A self-driving car control system, characterized in that: The system comprises an SOC and a temperature control device according to any one of claims 6 to 8; wherein the control module in the temperature control device is an MCU constituting a control unit of the self-driving vehicle control system; The first temperature control surface of the TEC in the temperature control device is used to fit the target temperature control surface of the SOC.

10. A vehicle, characterized in that: It includes the self-driving car control system as claimed in claim 9.

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