Apparatus for processing substrate

Abstract

A substrate processing apparatus includes: an upper container; a lower container including an accommodation space; a filler located in the accommodation space and configured to support the substrate; and a pad body under the filler to prevent the filler from changing position, in which the accommodation space includes a first groove having a first width and a second groove having a second width less than the first width under the first groove, the filler includes a filler body supporting the substrate and a plurality of legs on a lower surface of the filler body, the pad body includes a plurality of fixing holes fixed to the second groove, the plurality of fixing holes fixing the plurality of legs, and a first distance from the pad body to a bottom surface of the first groove is greater than a second distance from the pad body to a bottom surface of the second groove.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefits of Korean Patent Application No. 10-2024-0016964, filed on February 2, 2024, and Korean Patent Application No. 10-2024-0044173, filed on April 1, 2024, in the Korean Intellectual Property Office, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Aspects of the present inventive concept relate to a substrate processing apparatus, and more particularly, to a substrate processing apparatus using a supercritical fluid. Background Art

[0004] Along with semiconductor element becomes more and more highly integrated, single circuit pattern is further miniaturized to realize more semiconductor elements in the same area.Supercritical fluid is used for the various processing (for example, drying, vapor deposition) of miniaturized semiconductor element.This is because supercritical fluid is the material under the temperature and pressure placed above the critical point, and has the diffusivity of gas and the solubility of liquid.As an example of drying process, supercritical fluid easily penetrates the pattern on substrate, and supercritical fluid easily dissolves residual rinsing liquid (for example, organic solvent).Therefore, easily remove the rinsing liquid remaining between the pattern formed on substrate. Summary of the Invention

[0005] Meanwhile, a filler supporting the substrate is provided within the container where supercritical fluid is processed. Because the supercritical fluid is supplied to the container under high pressure, the filler may vibrate. Furthermore, the vibrating filler may scrape the interior of the container, generating metal particles. These particles may cause metal defects on the substrate.

[0006] Aspects of the present inventive concept provide a substrate processing apparatus that can prevent a filler from swinging to minimize metal defects.

[0007] However, aspects of the present invention are not limited to the one set forth herein. The above and other aspects of the present invention will become more apparent to those skilled in the art by referring to the detailed description of the present invention given below.

[0008] According to some example embodiments conceived in the present invention, an apparatus for processing a substrate includes: an upper container; a lower container including a accommodating space; a filler located in the accommodating space and configured to support the substrate; and a pad below the filler, the pad being configured to prevent the filler from changing position, wherein the accommodating space includes a first groove having a first width and a second groove below the first groove having a second width smaller than the first width, wherein the filler includes a filler body configured to support the substrate and a plurality of legs on a lower surface of the filler body, wherein the pad includes a plurality of fixing holes for fixing the plurality of legs, and wherein a first distance from the pad to a bottom surface of the first groove is greater than a second distance from the pad to a bottom surface of the second groove.

[0009] According to some example embodiments of the present invention, an apparatus for processing a substrate includes: a pad body including a first surface and a second surface; a first hole penetrating the pad body body; a second hole spaced apart from the first hole and penetrating the pad body body; a plurality of fixing holes configured to penetrate the pad body body and fix a leg of a filler; a plurality of first bridging grooves connecting each of the plurality of fixing holes to the first hole; and a tunnel disposed along an edge of the first surface, the tunnel being connected to the plurality of fixing holes.

[0010] According to some example embodiments of the present inventive concepts, an apparatus for processing a substrate includes: a container configured to process a substrate with a supercritical fluid, the container including an upper container and a lower container configured to be coupled in an openable and closable manner; a clamp configured to clamp the upper container and the lower container at a closed position of the container; a support member located on a lower surface of the upper container and configured to support the substrate at an open position of the container; a filling member located in the lower container and configured to support the lower surface of the substrate at a closed position of the container; and a cushion body below the filling member, the cushion body configured to prevent the filling member from swinging, wherein the lower container includes a receiving space for receiving the filling member, wherein the receiving space includes a first groove having a first width and a first groove having a first width. a second groove below the groove having a second width smaller than the first width, wherein the filler includes a filler body supporting the substrate and a plurality of legs on a lower surface of the filler body, and wherein the pad includes: a pad body including a first surface and a second surface, the pad body being fixed to the second groove, a plurality of fixing holes penetrating the pad body and configured to fix the plurality of legs of the filler, an exhaust hole penetrating the pad body and aligned with the exhaust port of the lower container, a supply hole penetrating the pad body and aligned with the supply port of the lower container, a plurality of first bridging grooves connecting each of the plurality of fixing holes to the exhaust hole, and a tunnel arranged along an edge of the first surface of the pad body and connected to the plurality of fixing holes.

[0011] Specific details of other embodiments are included in the detailed description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and other aspects and features of the present inventive concept will become more apparent by describing in detail exemplary embodiments of the present inventive concept with reference to the accompanying drawings, in which:

[0013] Figure 1 is a conceptual diagram for explaining a substrate processing apparatus according to some embodiments of the present inventive concept;

[0014] Figure 2 Is used to illustrate Figure 1 A schematic diagram of the reactor shown;

[0015] Figure 3 yes Figure 2 An enlarged view of region A;

[0016] Figure 4 is a perspective view showing a first surface of the pad body;

[0017] Figure 5 is a plan view showing a first surface of the pad body;

[0018] Figure 6 It is along Figure 5 A perspective view taken along line BB;

[0019] Figure 7 It is along Figure 5 A cross-sectional view taken along line CC;

[0020] Figure 8 is a perspective view showing a second surface of the pad body;

[0021] Figure 9 is a plan view showing a second surface of the pad body;

[0022] Figure 10 is a side view for explaining an exhaust path in a substrate processing apparatus according to some embodiments of the present inventive concept;

[0023] Figure 11 is a perspective view for explaining an exhaust path in a substrate processing apparatus according to some embodiments of the present inventive concept;

[0024] Figure 12 and Figure 13 is a schematic diagram for explaining the operation of the reactor;

[0025] Figure 14 is a cross-sectional view for explaining a pad body used in a substrate processing apparatus according to some embodiments of the present inventive concept;

[0026] Figure 15is a cross-sectional view for explaining a pad body used in a substrate processing apparatus according to some embodiments of the present inventive concept;

[0027] Figure 16 is a plan view for explaining a pad body used in a substrate processing apparatus according to some embodiments of the present inventive concept;

[0028] Figure 17 is a plan view for explaining a pad body used in a substrate processing apparatus according to some embodiments of the present inventive concept; and

[0029] Figure 18 is a diagram for explaining a system to which a substrate processing apparatus according to some embodiments of the present inventive concept is applied. DETAILED DESCRIPTION

[0030] Hereinafter, embodiments of the present inventive concept will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same reference numerals will be used for the same components, and repeated description thereof will not be provided.

[0031] Throughout this specification, unless the context indicates otherwise, when a component is described as "comprising" a particular element or group of elements, it will be understood that the component is formed solely of that element or group of elements, or that the element or group of elements may be combined with additional elements to form the component. On the other hand, the term "consisting of" indicates that the component is formed solely of the listed element(s).

[0032] It will be understood that when an element is referred to as being “connected” or “coupled” to another element or being “on another element,” it can be directly connected or coupled to the other element or directly on the other element, or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, or as being “contacting” or “in contact with” another element (or any form of the term “contacting” is used), there are no intervening elements at the point of contact.

[0033] Figure 1 is a conceptual diagram for explaining a substrate processing apparatus according to some embodiments of the inventive concept.

[0034] Reference Figure 1 The substrate processing apparatus includes a reactor 100, a process fluid supply unit 300, a process fluid discharge unit 400, a controller 40, etc. The controller 40 controls operations of the reactor 100, the process fluid supply unit 300, the process fluid discharge unit 400, etc.

[0035] The reactor 100 provides a processing space in which supercritical processing is performed. Figure 2 and Figure 3 The specific structure of the reactor 100 will be described in detail.

[0036] The treatment fluid supply unit 300 includes a fluid storage tank 11 , an upstream supply line 13 , a first supply line 17 , a second supply line 19 , and the like.

[0037] The fluid storage tank 11 can maintain the supercritical fluid in a supercritical state. The supercritical fluid can be, for example, carbon dioxide in a supercritical state. For example, the temperature of the carbon dioxide in the supercritical state can be about 60° C., and the pressure of the carbon dioxide in the supercritical state can be about 80 bar, but is not limited thereto.

[0038] The upstream supply line 13 is connected to the fluid storage tank 11 and may branch into a first supply line 17 and a second supply line 19. Supercritical fluid may be supplied to the upper side of the reactor 100 along the first supply line 17, and supercritical fluid may be supplied to the lower side of the reactor 100 along the second supply line 19.

[0039] At least one upstream supply valve 13a, at least one heater HT1 and HT2, and at least one filter F1 may be provided on the upstream supply line 13. In addition, at least one pressure sensor PS1 and at least one temperature sensor TS1 may be provided on the upstream supply line 13.

[0040] At least one supply valve 17 a , at least one filter F2 and F3 , at least one pressure sensor PS2 , etc. may be provided on the first supply line 17 .

[0041] At least one supply valve 19 a , at least one heater HT3 , at least one filter F4 and F5 , at least one temperature sensor TS2 , etc. may be provided on the second supply line 19 .

[0042] The number and placement points of valves 13a, 17a and 19a, the number and placement points of filters F1, F2, F3, F4 and F5, the number and placement points of heaters HT1, HT2 and HT3, the number and placement points of pressure sensors PS1 and PS2, and the number and placement points of temperature sensors TS1 and TS2 may vary depending on the design.

[0043] Filters F1, F2, and F4 may be micro filters (MF), and filters F3 and F5 may be ultra filters (UF), but the embodiment is not limited thereto. For example, all filters F1, F2, F3, F4, and F5 may be the same type of filters or different types of filters.

[0044] The process fluid discharge unit 400 may include a discharge line 31 connected to the reactor 100 and a discharge valve 31a installed in the discharge line 31. The process fluid discharge unit 400 discharges air (ie, used process fluid, particles, etc.) within the reactor 100 to the outside.

[0045] The controller 40 may, for example, control the operation of at least one valve 17a, 19a, and 31a. The controller 40 may be configured to send and receive electrical signals to and from at least one valve 17a, 19a, and 31a, and may be configured to control the operation of the at least one valve 17a, 19a, and 31a accordingly.

[0046] The controller 40 may be implemented as hardware, firmware, software, or any combination thereof. For example, the controller 40 may be a computing device such as a workstation computer, a desktop computer, a laptop computer, and a tablet computer. For example, the controller 40 may include a memory device (such as a ROM (read-only memory) or a RAM (random access memory)), and a processor (e.g., a microprocessor, a CPU (central processing unit), a GPU (graphics processing unit)) configured to perform predetermined calculations and algorithms. In addition, the controller 40 may include a receiver and a transmitter for receiving and sending electrical signals.

[0047] Figure 2 Is used to illustrate Figure 1 Schematic diagram of the reactor shown. Figure 3 yes Figure 2 Magnified view of area A.

[0048] First, refer to Figure 2 A process (eg, drying process) using a supercritical fluid is performed in the reactor 100. The reactor 100 includes containers 110 and 130, a baffle 120, a support 119, a filler 150, a holder 200 (eg, a jig), a pad 500, and the like.

[0049] The containers 110 and 130 provide a processing space CS for processing substrates W. The containers 110 and 130 include an upper container 110 and a lower container 130, and are coupled to be openable and closable. Specifically, a first drive unit 190 moves at least one of the upper container 110 and the lower container 130 to determine a relative position. The first drive unit 190 enables the upper container 110 and the lower container 130 to switch between an open position, in which the processing space CS is opened, and a closed position, in which the processing space is closed.

[0050] The upper container 110 includes a first body 111 , a supply port 118 , a first accommodation space 112 , and the like.

[0051] The first body 111 serves as a main body of the upper container 110 and has a supply port 118 and a first receiving space 112 formed therein.

[0052] The supply port 118 may be installed to penetrate the first body 111. The supply port 118 is supplied with the treatment fluid (ie, supercritical fluid) from the treatment fluid supply unit 300 and delivers the treatment fluid to the first receiving space 112.

[0053] The first accommodating space 112 may be formed on the lower surface (or bottom surface) of the first body 111. As shown in the figure, the first accommodating space 112 may have a shape that is recessed inward (e.g., upward) from the lower surface of the first body 111. The depth of the first accommodating space 112 may be, for example, 10 mm or greater. As shown in the figure, when viewed in cross section, the side surface of the first accommodating space 112 may have an inclined shape. That is, the side surface and the upper surface of the first accommodating space 112 may form an angle greater than 90 degrees (e.g., 100 to 160 degrees).

[0054] The baffle 120 is installed in the first receiving space 112. The baffle 120 diffuses the process fluid supplied from the supply port 118 and supplies the process fluid to the process space CS.

[0055] The baffle 120 includes a base 124 and a porous plate 122. The porous plate 122 is fixed by the base 124 and may have a shape in which two or more layers are stacked. The perforation positions of the lower layer of the porous plate 122 may be different from the perforation positions of the upper layer of the porous plate 122. In other words, when viewed from a vertical direction, the perforation positions of the lower layer of the porous plate 122 are not aligned with the perforation positions of the upper layer of the porous plate 122. By not arranging the perforation positions in a line, the process fluid is fully mixed and supplied to the substrate W through the first receiving space 112 and the baffle 120.

[0056] The support 119 is installed on the lower surface of the upper container 110. The support 119 is configured to support the substrate W when the containers 110 and 130 are in an open position (eg, when the upper container 110 and the lower container 130 are in a separated state).

[0057] The lower container 130 includes a second body 131 , a supply port 137 , an exhaust port 138 , a second receiving space 132 , and the like.

[0058] The second body 131 serves as a body of the lower container 130 and has a supply port 137 , an exhaust port 138 , and a second accommodation space 132 formed therein.

[0059] The supply port 137 may be installed to penetrate the second body 131 . The supply port 137 is supplied with the treatment fluid (ie, supercritical fluid) from the treatment fluid supply unit 300 and delivers the treatment fluid to the second receiving space 132 .

[0060] The exhaust port 138 may be installed to penetrate the second body 131. The exhaust port 138 exhausts air (e.g., used process fluid, etc.) of the second receiving space 132 and the process space CS to the outside. The exhaust operation may be controlled by the operation of the process fluid exhaust unit 400 connected to the exhaust port 138.

[0061] As shown in the drawings, the second receiving space 132 may have a shape recessed inward (eg, downward) from the upper surface of the second body 131 .

[0062] The filler 150 is installed in the lower container 130 to face the baffle 120, and specifically, the filler 150 is installed in the second receiving space 132. When the containers 110 and 130 are changed from the open position to the closed position, the substrate W can be transferred from the support 119 to the filler 150 and supported by the filler 150, but the present inventive concept is not limited thereto.

[0063] The gripper 200 grips the containers 110 and 130 in the closed position. The gripper 200 may include, for example, two grippers 210 and 220, but is not limited thereto. The gripper 200 may include one side (i.e., based on, for example, Figure 2 The first clamp 210 is configured to clamp the other side of the containers 110 and 130 (ie, the other side based on the first direction X) at a closed position, and the second clamp 220 is configured to clamp the other side of the containers 110 and 130 (ie, the other side based on the first direction X).

[0064] The gripper 200 can be moved to a locked position and an unlocked position by the second driving unit 290. The locked position refers to a position where the gripper 200 grips the containers 110 and 130, and the unlocked position refers to a position where the gripper 200 does not grip the containers 110 and 130.

[0065] In addition, the upper edge of the upper container 110 may have a curved shape, and the lower edge of the lower container 130 may have a curved shape. The inner surfaces of the first clamp 210 and the second clamp 220 may have complementary shapes to fit the curved shapes of the upper container 110 and the lower container 130.

[0066] Reference Figure 3 The second receiving space 132 of the lower container 130 includes a first groove 1321 and a second groove 1322. The first groove 1321 has a first width W1, and the second groove 1322 has a second width W2 below the first groove 1321 that is smaller than the first width W1.

[0067] Filling (see Figure 2The filler 150 is disposed within the second receiving space 132 and is configured to support the substrate W. The filler 150 includes filler bodies 151 and 152 that support the substrate W, and a plurality of legs 153 disposed on the lower surfaces of the filler bodies 151 and 152. The filler bodies 151 and 152 may include, for example, an upper filler body 151 disposed in the first groove 1321 and a lower filler body 152 disposed in the second groove 1322. The width of the upper filler body 151 may be greater than the width of the lower filler body 152, but the present invention is not limited thereto. The plurality of legs 153 may be disposed in the second groove 1322 so as to contact the bottom surface 1322a of the second groove 1322, but the present invention is not limited thereto. The filler 150 may be a body that fills a portion of the second receiving space 132 and supports the substrate W when the substrate W is loaded into the reactor 100.

[0068] The pad body 500 can be fixed inside the second groove 1322. In addition, the pad body 500 includes a plurality of fixing means (see Figure 5 540) to fix the plurality of legs 153. Since the side walls of the pad body 500 are in contact with the inner walls of the second groove 1322, the pad body 500 can be fixed in place.

[0069] In addition, the pad body 500 may be located at a lower portion (eg, a downward direction based on the third direction Z) inside the second groove 1322 .

[0070] Specifically, if Figure 3 As shown, the first distance H1 from the pad body 500 (i.e., the first surface 500a or upper surface of the pad body 500) to the bottom surface 1321a of the first groove 1321 may be greater than the second distance H2 from the pad body 500 (i.e., the second surface 500b or lower surface of the pad body 500) to the bottom surface 1322a of the second groove 1322.

[0071] In addition, the second distance H2 from the pad body 500 (i.e., the second surface 500b of the pad body 500) to the bottom surface 1322a of the second groove 1322 may be smaller than the third distance H3 from the pad body 500 (i.e., the first surface 500a of the pad body 500) to the lower surface 152a of the filler body 151 and 152.

[0072] Due to the installation position of the pad body 500 , the space between the first surface 500 a of the pad body 500 and the lower surface 152 a of the filler bodies 151 and 152 may be wider than the space between the second surface 500 b of the pad body 500 and the bottom surface 1322 a of the second groove 1322 .

[0073] Will use Figures 4 to 9 The specific structure of the pad body 500 will be described in detail.

[0074] Figure 4 is a perspective view showing the first surface 500a of the pad body. Figure 5 is a plan view showing a first surface of the pad body. Figure 6 It is along Figure 5 A perspective view taken along line BB. Figure 7 It is along Figure 5 A cross-sectional view taken along line CC. Figure 8 is a perspective view showing the second surface 500b of the pad body. Figure 9 5 is a plan view showing the second surface 500b of the pad body.

[0075] Reference Figures 4 to 9 The pad body 500 includes a pad body main body 510, a first hole (or exhaust hole) 520, a second hole (or supply hole) 530, a plurality of fixers 540 (eg, fixing holes), and the like.

[0076] The pad body 510 may have a substantially disc-like shape. The pad body 510 may include or be made of a material having wear resistance, chemical resistance, and heat resistance. For example, the pad body 510 may be PTFE (polytetrafluoroethylene), PFA (perfluoroalkoxyalkane), PI (polyimide), PE (polyethylene), or PCTFE (polychlorotrifluoroethylene).

[0077] The first hole 520 and the lower container ( Figure 3 Exhaust port (130) Figure 3 138) and the second hole 530 can be aligned with the supply port ( Figure 3 137) alignment.

[0078] The first hole 520 can be located at the center of the pad body 510, and the second hole 530 can be offset from the center toward the edge of the pad body 510. For example, the second hole 530 can be located away from the center of the pad body 510 (or off-center).

[0079] The plurality of holders 540 may correspond to the plurality of legs ( Figure 3 153). The shape of the retainer 540 can correspond to the shape of the leg 153. For example, if the leg 153 is a cylindrical post, the retainer 540 can be a semi-cylindrical hole (or semi-cylindrical groove) having an inner wall with which the outer wall of the cylindrical post can contact. For example, each retainer 540 can be a notch in the edge of the pad body 510 that conforms to the shape of its corresponding leg 153.

[0080] When the filling member 150 includes three legs 153 disposed at intervals of 120 degrees, the pad body 500 may further include three fasteners 540 disposed at intervals of 120 degrees.

[0081] Because the legs 153 of the filler 150 are fixed in place by the holders 540 of the pad body 500, the filler 150 does not swing or change position even when the treatment fluid is supplied at high pressure through the supply port 137 of the lower container 130. In addition, since the filler 150 does not swing, the legs 153 of the filler 150 do not scrape the bottom surface of the lower container 130 (i.e., the second groove ( Figure 3 The bottom surface 1322a of 1322) is not affected. Therefore, particles that may appear due to scratching are no longer generated.

[0082] In addition, the pad body 500 may further include a plurality of bridging grooves 550 connecting the first hole 520 to each of the plurality of holders 540. The plurality of bridging grooves 550 may be formed in the first surface 500a of the pad body 510. The depth of the bridging grooves 550 may be the same as or shallower than the depth of the holders 540 to which they are connected.

[0083] Although each of the holders 540 is shown as being connected to the first hole 520 through one bridging groove 550 , the embodiment is not limited thereto. That is, each of the holders 540 may be connected to the first hole 520 through two or more bridging grooves 550 .

[0084] In addition, the pad body 500 may further include a first surface ( Figure 3 The first surface 500a of the cushion body 510 is the surface facing the filler 150. The tunnel 560 is connected to at least one fixture 540. The depth of the tunnel 560 can be the same as or shallower than the depth of the fixture 540 to which it is connected. The depth of the tunnel 560 can be achieved in a variety of ways. For example, the tunnel 560 can be a recess extending circumferentially around the edge of the first surface 500a of the cushion body 510. The recess can extend entirely or partially around the circumference of the cushion body 510. The recess can intersect each of the fixtures 540.

[0085] In another embodiment, the tunnel can also be formed along the second surface ( Figure 3 500b) is formed on the edge.

[0086] As will be described below, various particles may pass through the tunnel 560 and the bridge groove 550 and be discharged to the first hole (i.e., the exhaust hole) 520. That is, materials remaining on the outermost portion of the pad body 500 or flowing into the outermost portion of the pad body 500 may pass through the tunnel 560 and the bridge groove 550 and be discharged to the first hole 520.

[0087] like Figure 7As shown, the side surface 580 of the pad body 500 may have an outwardly convex shape. By having such a configuration, the pad body 500 can be smoothly fitted into the second groove ( Figure 3 1322) and fixed to the second groove 1322.

[0088] like Figure 9 As shown, alignment points 590 (eg, alignment marks) may be formed on the pad body 500. A worker may install the pad body 500 in place by using the alignment points 590.

[0089] Figure 10 is a side view for explaining an exhaust path in a substrate processing apparatus according to some embodiments of the inventive concept. Figure 11 is a perspective view for explaining an exhaust path in a substrate processing apparatus according to some embodiments of the inventive concept.

[0090] Reference Figure 10 After a process (eg, a drying process) using the process fluid is performed in the reactor 100, an exhaust operation for removing air (eg, used process fluid and various particles) in the process space CS is performed.

[0091] When the exhaust operation is being performed, the air in the processing space CS moves between the upper filler body 151 and the first groove 1321, and between the lower filler body 152 and the second groove 1322 (see reference numeral F1). The air then passes through the first hole 520 of the cushion body 500 and the exhaust port 138 and is exhausted to the outside of the apparatus (see reference numeral F11).

[0092] When the exhaust operation is being performed, as Figure 11 As shown, the substance remaining on the outermost portion of the pad body 500 or flowing into the outermost portion of the pad body 500 moves along the tunnel 560 of the pad body 500 and is transported to the first hole 520 through the bridge groove 550. In addition, the substance remaining in the holder 540 can also be transported to the first hole 520 through the bridge groove 550.

[0093] Next, we will use Figure 2 、 Figure 12 and Figure 13 Describe the operation of the reactor. Figure 12 and Figure 13 It is a diagram for explaining the operation of the reactor.

[0094] like Figure 2, the containers 110 and 130 for performing supercritical processing are in a closed position, and the clamp 200 is in a locked position. That is, the upper container 110 and the lower container 130 are in contact and engaged with each other to seal the processing space CS, the first clamp 210 clamps the upper container 110 and the lower container 130 on one side, and the second clamp 220 clamps the upper container 110 and the lower container 130 on the other side.

[0095] With the substrate W supported by the filler 150, the process fluid supply unit 300 supplies a process fluid (i.e., a supercritical fluid) into the process space CS. The process fluid (e.g., a rinse liquid) remaining on the substrate W may be removed by the process fluid within the process space CS. The process fluid and / or particles within the process space CS are then discharged from the containers 110 and 130.

[0096] When supercritical treatment is completed, Figure 12 As shown, the clamp 200 is moved from the locked position to the unlocked position (see reference numeral 230) by the second driving unit 290. That is, the first clamp 210 is separated from one side of the container 110 and 130, and the second clamp 220 is separated from the other side of the container 110 and 130.

[0097] like Figure 13 As shown, the containers 110 and 130 are moved from the closed position to the open position by the first drive unit 190 (see reference numeral 193 ). Figure 13 The upper container 110 is exemplarily shown as being fixed and the lower container 130 moving along the third direction Z. When the lower container 130 moves along the third direction Z, the processing space CS is opened. As a result, a separated space (i.e., an open space) is formed between the upper container 110 and the lower container 130.

[0098] When the lower container 130 moves in the third direction Z, the substrate W is moved from the filling member 150 to the supporting member 119. Thereafter, the substrate W is taken out of the containers 110 and 130 by, for example, a transfer robot.

[0099] Afterwards, a new substrate W is placed in the containers 110 and 130. Figure 13 As shown, containers 110 and 130 are in the open position, and gripper 200 is also in the unlocked position. The transfer robot moves substrate W to support 119. Thereafter, containers 110 and 130 are moved from the open position to the closed position. Gripper 200 is moved from the unlocked position to the locked position. While containers 110 and 130 are moving to the closed position, substrate W is moved from support 119 to filler 150.

[0100] Figure 14is a cross-sectional view of a pad used in a substrate processing apparatus according to some embodiments of the present invention. Figures 2 to 13 The points described are different.

[0101] although Figure 7 The tunnel 560 of the pad 500 is shown to have a stepped shape with one level or step, but Figure 14 The tunnel 560 of the illustrated cushion body 501 may have a stepped shape with two layers or steps. The two-layer stepped shape may be a stepped shape that descends to the outermost edge of the cushion body 501. That is, the tunnel 560 includes a first step 561 connected to the first surface 500a and a second step 562 connected to the first step 561. Unlike the illustrated example, the tunnel 560 may have a stepped shape with three or more layers or steps.

[0102] Figure 15 is a cross-sectional view of a pad used in a substrate processing apparatus according to some embodiments of the present invention. Figures 2 to 13 The points described are different.

[0103] Figure 3 The illustrated cushion body 500 is mounted within the second groove 1322 of the second receiving space 132. The cushion body 500 may be disposed spaced apart from the bottom surface 1322a of the second groove 1322. A second distance H2 from the cushion body 500 to the bottom surface 1322a of the second groove 1322 is smaller than a first distance H1 from the cushion body 500 to the bottom surface 1321a of the first groove 1321 and a third distance H3 from the cushion body 500 to the lower surface 152a of the filler 150.

[0104] on the other hand, Figure 15 The pad body 502 is shown to be arranged to contact the bottom surface 1322a of the second groove 1322. In this way, since there is no space between the bottom surface 1322a of the second groove 1322 and the pad body 502, the generation of particles in the space between the bottom surface 1322a of the second groove 1322 and the pad body 502 can be minimized.

[0105] Figure 16 is a plan view of a pad used in a substrate processing device according to some embodiments of the present invention. Figures 2 to 13 The points described are different.

[0106] Figure 16The pad body 503 shown includes not only a plurality of bridging grooves 550 but also a plurality of bridging grooves 551. Each of the plurality of bridging grooves 551 connects the tunnel 560 to the first hole 520. The depth of the bridging grooves 551 may be substantially the same as the depth of the bridging grooves 550, but the present invention is not limited thereto. The depth of the bridging grooves 551 may be substantially the same as the depth of the tunnel 560, but the present invention is not limited thereto.

[0107] By adding not only the bridging groove 550 but also the bridging groove 551, substances remaining on or flowing into the outermost portion of the pad body 503 can be discharged to the first hole 520 through the bridging groove 551. That is, by adding the bridging groove 551, exhaust performance can be improved.

[0108] Figure 17 is a plan view of a pad used in a substrate processing device according to some embodiments of the present invention. Figures 2 to 13 The graph illustrates the different points.

[0109] Figure 5 The pad body 500 shown includes a first hole 520 for exhaust and a second hole 530 for process fluid supply. In addition, the retainer 540 has a shape of a hole passing through the pad body 510.

[0110] on the other hand, Figure 17 The pad body 504 shown includes a hole 521 configured to perform both exhaust and process fluid supply. The hole 521 is mounted offset from the center of the pad body 510 toward the edge. For example, the hole 521 is positioned away from the center (or off-center) of the pad body 510. The hole 521 corresponds to the supply port ( Figure 3 137) and the discharge port ( Figure 3 138).

[0111] Furthermore, the retainer 541 has a groove shape that does not penetrate the entire pad body 510. Therefore, the legs 153 fixed by the pad body 504 do not contact the bottom surface of the lower container 130, but rather contact the bottom surface of the groove. This prevents particles that may be generated when the legs 153 of the filler 150 scrape the bottom surface of the lower container 130.

[0112] Figure 18 is a diagram for explaining a system to which a substrate processing apparatus according to some embodiments of the present inventive concept is applied.

[0113] Reference Figure 18 The system includes a loading port 1100 , an indexing module 1200 and a processing module 1300 .

[0114] The load port 1100 includes a mounting table on which a container (see LP1 to LP4) for accommodating a plurality of substrates is placed. The container may be, for example (but not limited to), a front opening unified container (FOUP).

[0115] The indexing module (IDR) 1200 is disposed between the load port 1100 and the processing module 1300. For example, the indexing module 1200 includes a track installed in an indexing chamber and an indexing robot that moves along the track. The indexing robot includes an arm and a hand, and picks up a substrate located at the load port 1100 and transfers it to the buffer chamber (WCP) 1305.

[0116] The processing module 1300 includes a buffer chamber 1305, a transfer chamber, a first processing chamber (PU1) 1310, a second processing chamber (PU2) 1320, a third processing chamber (PU3) 1330, a fourth processing chamber (PU4) 1340, a valve box 1350, an electronic box (T-box) 1360, etc.

[0117] The buffer chamber 1305 temporarily stores substrates transferred by the index robot of the index module 1200. In addition, the buffer chamber 1305 may temporarily store substrates that have undergone a predetermined process in at least one of the process chambers 1310, 1320, 1330, and 1340.

[0118] A guide rail and a transport robot that moves along the guide rail are installed inside the transport chamber MTR.

[0119] The first process chamber 1310, the valve box 1350, and the second process chamber 1320 may be sequentially arranged on one side of the transport chamber MTR. Furthermore, the electronics box 1360, the fourth process chamber 1340, and the third process chamber 1330 may be sequentially arranged on the other side of the transport chamber MTR. In other words, the transport chamber MTR is arranged to intersect between the first process chamber 1310 and the fourth process chamber 1340, and between the second process chamber 1320 and the third process chamber 1330.

[0120] At least one of the first to fourth process chambers 1310 to 1340 may correspond to the reactor 100 of the substrate processing apparatus according to some embodiments of the present inventive concept. For example, a rinsing process may be performed in the first process chamber 1310, and a supercritical drying process for drying the rinsing liquid may be performed in the second process chamber 1320.

[0121] The valve box 1350 is a space in which pipes and valves for supplying chemical liquids (e.g., at least one of a precursor, a reducing fluid, a developing fluid, a cleaning fluid, and a rinsing fluid) and / or a supercritical fluid (e.g., carbon dioxide) to at least one of the processing chambers 1310, 1320, 1330, and 1340 are installed.

[0122] The electronic box 1360 may be a space in which a plurality of electrical devices are installed. For example, the electronic box 1360 may be installed with electrical equipment associated with the fourth process chamber 1340 adjacent to the electronic box 1360, but the embodiment is not limited thereto.

[0123] Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments and can be manufactured in various forms. Those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical spirit or basic features of the present invention. Therefore, the above embodiments should be understood in all aspects as illustrative rather than restrictive.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: Upper container; a lower container comprising a receiving space; a filling member in the receiving space and configured to support the substrate; as well as a cushion body located below the filling piece, the cushion body being configured to prevent the filling piece from changing position, The accommodating space includes a first groove having a first width and a second groove located below the first groove and having a second width smaller than the first width. The filler comprises a filler body configured to support the substrate, and a plurality of legs located on a lower surface of the filler body. Wherein, the pad body includes a plurality of fixing holes for fixing the plurality of legs, and Wherein, a first distance from the pad body to the bottom surface of the first groove is greater than a second distance from the pad body to the bottom surface of the second groove.

2. The apparatus for processing a substrate according to claim 1, in, The second distance from the pad body to the bottom surface of the second groove is smaller than a third distance from the pad body to the lower surface of the filler body.

3. The apparatus for processing a substrate according to claim 1, in, The pad body comprises: The main body of the pad, a first hole extending through the pad body, and A plurality of first bridging grooves, each of the plurality of bridging grooves connecting a corresponding fixing hole of the plurality of fixing holes to the first hole.

4. The apparatus for processing a substrate according to claim 3, wherein The pad body also includes: a second hole spaced apart from said first hole, wherein the first hole is positioned to exhaust air in the accommodation space, and The second hole is configured to supply a treatment fluid into the accommodation space.

5. The apparatus for processing a substrate according to claim 3, in, The pad body includes a first surface facing the filler body and a second surface facing the bottom surface of the second groove, and The cushion body further includes a tunnel provided along an edge of the first surface of the cushion body main body, wherein the tunnel is connected to the plurality of fixing holes.

6. The apparatus for processing a substrate according to claim 5, wherein The pad body also includes: At least one second bridging groove connects the tunnel to the first hole.

7. The apparatus for processing a substrate according to claim 5, in, The second surface of the pad body contacts the bottom surface of the second groove.

8. The apparatus for processing a substrate according to claim 3, in, The center of the first hole is located away from the center of the pad body.

9. The apparatus for processing a substrate according to claim 1, in, Each of the plurality of fixing holes includes a hole penetrating through an entire thickness of the pad body or a groove not penetrating through an entire thickness of the pad body.

10. The apparatus for processing a substrate according to claim 1, in, The side surface of the pad body has an outwardly convex shape.

11. The apparatus for processing a substrate according to claim 1, in, The pad body also includes an alignment mark.

12. The apparatus for processing a substrate according to claim 1, in, The filling piece body includes a lower filling piece body in the second groove and an upper filling piece body in the first groove, Wherein, the upper filling piece body is connected to the lower filling piece body, and Wherein, the width of the upper filling piece body is wider than the width of the lower filling piece body.

13. The apparatus for processing a substrate according to claim 1, in, The upper container includes a first supply port configured to supply a process fluid, and The lower container includes a second supply port configured to supply the treatment fluid and an exhaust port configured to exhaust the used treatment fluid to the outside of the device.

14. An apparatus for processing a substrate, the apparatus comprising: a pad body comprising a first surface and a second surface; a first hole penetrating the pad body; a second hole spaced apart from the first hole and penetrating the pad body; a plurality of fixing holes configured to penetrate the cushion body and fix the legs of the filling member; a plurality of first bridging grooves connecting each of the plurality of fixing holes to the first hole; as well as A tunnel is provided along an edge of the first surface, the tunnel being connected to the plurality of fixing holes.

15. The apparatus for processing a substrate according to claim 14, further comprising: At least one second bridging groove connects the tunnel to the first hole.

16. The apparatus for processing a substrate according to claim 14, in, The cross section of the tunnel has a stepped shape.

17. An apparatus for processing a substrate, comprising: a container configured to process a substrate with a supercritical fluid, the container comprising an upper container and a lower container configured to be coupled in an openable and closable manner; a clamp configured to clamp the upper container and the lower container in a closed position of the containers; a support member located on a lower surface of the upper container and configured to support the substrate in an open position of the container; a filler positioned within the lower container and configured to support a lower surface of the substrate in the closed position of the container; as well as a cushion body located below the filling piece, the cushion body being configured to prevent the filling piece from swinging, Wherein, the lower container includes a receiving space for receiving the filling member, The accommodating space includes a first groove having a first width and a second groove below the first groove having a second width smaller than the first width. wherein the filler comprises a filler body supporting the substrate and a plurality of legs on a lower surface of the filler body, and Wherein, the pad body comprises: a pad body having a first surface and a second surface, wherein the pad body is fixed in the second groove, a plurality of fixing holes penetrating the cushion body and configured to fix the plurality of legs of the filling member, an exhaust hole penetrating the cushion body and aligned with the exhaust port of the lower container, a supply hole penetrating the pad body and aligned with the supply port of the lower container, a plurality of first bridging grooves connecting each of the plurality of fixing holes to the exhaust hole, and A tunnel is provided along an edge of the first surface of the pad body and connected to the plurality of fixing holes.

18. The apparatus for processing a substrate according to claim 17, in, A first distance from the pad body to the bottom surface of the first groove is greater than a second distance from the pad body to the bottom surface of the second groove, and The second distance from the pad body to the bottom surface of the second groove is smaller than the third distance from the pad body to the lower surface of the filling member body.

19. The apparatus for processing a substrate according to claim 17, wherein: The pad body also includes: At least one second bridging groove connects the tunnel to the exhaust hole.

20. The apparatus for processing a substrate according to claim 17, in, The second surface of the pad body contacts the bottom surface of the second groove.

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