A heat dissipation optimization device and heat dissipation method for high-density three-dimensional stacked chips

Abstract

The present invention discloses a heat dissipation optimization device and heat dissipation method for high-density three-dimensional stacked chips, which relates to the field of heat dissipation devices. This solution achieves efficient conduction and rapid dissipation of heat on the chip surface by tightly fitting a heat-conducting seat with multiple first heat pipes and main fins, thereby taking away surface and internal heat at the same time, forming an internal and external coordinated temperature control mechanism. At the same time, during the cooling process, the rotatable flow component slowly presses the coolant through the sealing slide to flow back and forth in the micro-holes, and with the help of the second heat pipe and the auxiliary fin, a secondary heat dissipation coordination based on the heat dissipation of the first heat pipe is formed inside the heat-conducting cover, thereby achieving secondary dissipation of the fluid temperature. Through reciprocating circulation, the coolant not only absorbs the high heat in the stacking area in the middle of the chip to avoid heat accumulation, but also evenly disperses the heat energy along the two ends during the reciprocating motion, avoiding the continuous overheating of the ends caused by traditional unidirectional flow.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation devices, and in particular to a heat dissipation optimization device and a heat dissipation method for high-density three-dimensional stacked chips. Background Art

[0002] In today's era of rapid information technology development, chip computing performance is closely related to power consumption. With the widespread adoption of high-density three-dimensional stacked packaging technology, the area of ​​single chips continues to decrease while the number of computing unit layers continues to increase, leading to increasingly significant heat accumulation. Existing surface cooling solutions primarily rely on heat pipes and fins combined with air cooling, but these only provide limited control over the chip's surface temperature and are unable to effectively remove heat generated deep within the stack.

[0003] Based on this, microfluidic holes are now being used in three-dimensional stacked chips. Microfluidic hole technology processes micron-level or even smaller pore structures on the chip to achieve fluid transmission and heat dissipation. Although traditional liquid cooling systems have higher heat exchange efficiency, they generally use one-way fluid channels. The coolant passes through the radiator along a fixed path and cannot form a reciprocating circulation inside the multi-layer chip, resulting in insufficient heat carrying capacity of the fluid to the high-temperature zone in the middle, causing overheating in the end area and reducing the overall heat dissipation uniformity. In addition, many liquid cooling modules on the market lack precise dynamic flow control and pressure regulation methods for the coordination of air cooling and liquid cooling, and cannot flexibly switch cooling modes according to the real-time power consumption and temperature fluctuations of the chip, resulting in restrictions on heat dissipation performance and system stability.

[0004] The aforementioned chips are essentially temperature-controlled using a single liquid cooling method that uses a water pump to connect the coolant. Due to the interface between the coolant and the chip surface, traditional heat conduction radiators cannot be installed. Furthermore, the coolant flow path is fixed, making it difficult to cover all heat-generating areas within the chip's multi-layer structure. For example, the bottom chip in a chip stack is farther away from the microfluidic holes, extending the heat transfer path and potentially forming local hot spots. This uneven temperature distribution can lead to reduced chip performance, shortened lifespan, and even logical failures. Furthermore, as the coolant flows through a single microfluidic hole, its temperature gradually increases, with the coolant temperature at the outlet significantly higher than at the inlet. This results in large temperature differences between different areas of the chip, and a lack of targeted, small-volume, modular temperature control. Summary of the Invention

[0005] The purpose of the present invention is to solve the traditional problems and to propose a heat dissipation optimization device and heat dissipation method for high-density three-dimensional stacked chips.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a heat dissipation optimization device for high-density three-dimensional stacked chips, comprising a heat conduction component attached to the chip, a fluid cooling component for liquid cooling the chip's microfluidic holes, and two heat dissipation components for cooling the heat conduction component and the fluid cooling component. The heat conduction component includes a heat conducting seat attached to the chip for heat conduction, a plurality of first heat pipes, and main fins mounted on the ends of the plurality of heat pipes.

[0007] The fluid cooling component includes a heat-conducting cover installed between the heat-conducting seat and the main fins to store the coolant and dissipate the heat. The heat-conducting cover includes two second heat pipes that are staggered to contact the coolant. The inner wall of the heat-conducting cover is rotatably provided with a flow direction component that controls the flow and heat exchange of the coolant.

[0008] The heat dissipation assembly includes an air guide cover fixed on the main fin to cool it, one side of the air guide cover is connected to an air induction cover to cool the second heat pipe, and a centrifugal fan is installed in the air guide cover.

[0009] As a further description of the above technical solution: the thermal conductive seat includes a seat body, the bottom of the seat body is provided with a fitting groove for staggered attachment of multiple first heat pipes, the upper surface of the seat body is provided with a sealing ridge for sealing and installing with the thermal conductive cover, the four corners of the seat body are provided with an integrally formed mounting portion, the mounting portion is provided with a positioning groove, the seat body is provided with a plurality of liquid flow holes, and the four corners of the bottom of the seat body are provided with connecting grooves connected to the liquid flow holes.

[0010] As a further description of the above technical solution: the heat conductive cover further includes a connecting base through which two second heat pipes are installed, the inner wall of the connecting base is fixed with a cover body, and the four corners of the connecting base are provided with positioning parts that are installed in contact with the inner wall of the positioning groove;

[0011] The bottom of the connecting seat is engaged with the sealing ridge, and a sealing gasket is provided on the opposite surface.

[0012] As a further description of the above technical solution: the cover body is composed of glass covered with a metal shell, and its inner wall is provided with a hemispherical coolant storage space.

[0013] As a further description of the above technical solution: the flow direction component includes a main shaft that is sealed and rotatably installed on both sides of the connecting seat, the surface of the main shaft is fixed with a sealing slide that slides against the inner wall of the cover body, two impellers with blades in opposite directions are fixed at both ends of the main shaft, and the surface of the main shaft is fitted with a partition seat fixed to the inner wall of the seat body.

[0014] As a further description of the above technical solution: the heat dissipation assembly also includes a plurality of air holes opened on the inner wall of the air guide cover and connected to the air induced cover, and the air holes are located in the negative pressure area of ​​the centrifugal fan and connected, the inner wall of the air induced cover is provided with auxiliary fins fixed to the end of the second heat pipe, and the air outlet of the air guide cover is arranged in an inclined shape.

[0015] As a further description of the above technical solution: a connecting piece is fitted in the connecting groove, and the thickness of the connecting piece is 1-1.5 mm greater than the depth of the connecting groove.

[0016] As a further description of the above technical solution: after the positioning portion is engaged and snapped into the positioning groove, a mounting screw that is spring-loaded and slides through the positioning portion, and the mounting screw is threadedly matched with the mounting portion.

[0017] As a further description of the above technical solution: A method for optimizing heat dissipation of high-density three-dimensional stacked chips includes the following methods:

[0018] Real-time acquisition of chip power consumption data, temperature data, and power data of two centrifugal fans;

[0019] Establish a centrifugal fan power control mechanism based on chip temperature and power consumption feedback data.

[0020] As a further description of the above technical solution: the centrifugal fan power control mechanism includes:

[0021] S1. Establish a three-level control mode of low power T-, rated power T0 and overclocking power T+ for the centrifugal fan;

[0022] S2. When the chip power consumption increases:

[0023] When the temperature increases, the centrifugal fan is synchronized to T+ mode;

[0024] When the temperature decreases, the centrifugal fan power is maintained at T0 mode;

[0025] When the chip power consumption stops increasing but the temperature continues to rise, the operating centrifugal fan enters T-mode and another centrifugal fan is started to enter T+ mode;

[0026] S3. When the chip power consumption remains unchanged or decreases:

[0027] If the chip temperature increases, the operating centrifugal fan will enter T-mode and the other centrifugal fan will be started to enter T0 mode;

[0028] If the chip temperature drops, the modes of the two centrifugal fans remain unchanged;

[0029] S4. After step S1, step S2 and step S3 respond, if the temperature continues to rise, the two centrifugal fans are started synchronously and enter T+ mode.

[0030] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0031] When in use, this solution tightly adheres to the thermal base, multiple first heat pipes, and primary fins, achieving efficient heat conduction and rapid heat dissipation from the chip surface. When the thermal shield of the fluid cooling assembly is pressed and coupled to the thermal base via the positioning portion, sealing ridges, and mounting screws, the coolant experiences constant pressure within the enclosed micropores and forms seamless contact with the chip surface, ensuring synchronized operation of the heat pipes and liquid cooling system, simultaneously removing surface and internal heat, creating a coordinated internal and external temperature control mechanism.

[0032] During the cooling process, the rotating flow assembly slowly compresses the coolant through the micro-pores via a sealing slide. A secondary heat dissipation mechanism, based on the heat dissipated by the first heat pipe, is formed within the heat shield via a second heat pipe and auxiliary fins, achieving a secondary dissipation of the fluid temperature. This reciprocating circulation not only absorbs the high heat from the central chip stacking area, preventing heat accumulation, but also evenly disperses the heat energy along both ends during the reciprocating motion, avoiding the persistent overheating at the ends associated with traditional unidirectional flow.

[0033] To enhance dynamic response, two centrifugal fans operate alternately in a three-stage mode: T+, T0, and T−. Airflow is directed through a shroud and induced draft shield to simultaneously cool the main fins and the secondary heat pipe. The combination of high and low fan power causes the main shaft to deflect the sealing slide, controlling coolant flow while maintaining constant pressure.

[0034] In terms of structure and control strategy, this solution achieves an organic integration of surface heat conduction, internal microfluidic circulation cooling and dynamic air cooling, significantly breaking through the limitations of traditional single air cooling and liquid cooling modes, greatly improving heat dissipation uniformity and system reliability, and enabling high-density three-dimensional stacked chips to maintain stable temperature and extend service life under high power consumption operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a three-dimensional schematic diagram of the present invention;

[0036] Figure 2 A three-dimensional schematic diagram of another viewing angle of the present invention;

[0037] Figure 3 It is a cross-sectional schematic diagram of the present invention;

[0038] Figure 4 It is a cross-sectional schematic diagram of the present invention as viewed from the left;

[0039] Figure 5 It is an explosion diagram of the present invention;

[0040] Figure 6Schematic diagram of the explosion of the heat dissipation assembly of the present invention;

[0041] Figure 7 This is an exploded schematic diagram of the fluid cooling assembly of the present invention;

[0042] Figure 8 is a three-dimensional schematic diagram of the heat conduction component of the present invention;

[0043] Figure 9 Schematic diagrams of the heat conducting seat of the present invention in top and bottom views;

[0044] Figure 10 This is a three-dimensional schematic diagram of the main fin after disassembly of the present invention;

[0045] Figure 11 It is a front view of the present invention;

[0046] Figure 12 is a side view of the present invention;

[0047] Figure 13 It is a top view of the present invention.

[0048] Legend:

[0049] 10. Heat conduction assembly; 11. Heat conduction seat; 111. Sealing body; 112. Sealing ridge; 113. Fitting groove; 114. Liquid flow hole; 115. Connecting groove; 116. Mounting portion; 117. Positioning groove; 12. First heat pipe; 13. Main fin;

[0050] 20. Fluid cooling assembly; 21. Heat conducting cover; 211. Connecting seat; 212. Positioning portion; 213. Cover body; 214. Second heat pipe; 22. Flow direction assembly; 221. Main shaft; 222. Sealing slide; 223. Impeller; 224. Separating seat; 23. Sealing gasket;

[0051] 30. Heat dissipation assembly; 31. Air guide cover; 32. Air induced cover; 33. Air holes; 34. Centrifugal fan; 35. Auxiliary fins;

[0052] 40. Mounting screws; 50. Connecting pieces. DETAILED DESCRIPTION

[0053] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0054] Existing cooling methods for high-density, three-dimensional stacked chips typically rely on air cooling through heat pipes and fins, as well as liquid cooling through one-way fluid channels. This makes it difficult to effectively cool high-heat areas within the stack, resulting in poor heat dissipation uniformity and localized heat accumulation. Current liquid cooling systems lack dynamic flow direction adjustment and pressure control, making them unable to adapt to changes in chip power consumption and temperature, reducing heat dissipation efficiency and chip operational reliability. Therefore, a new cooling solution that combines heat conduction with internal microfluidic circulation cooling, along with fan power grading and flow direction adjustment, is urgently needed to achieve more efficient and stable heat dissipation performance.

[0055] like Figure 1 - Figure 13 As shown, the present invention provides: a heat dissipation optimization device for high-density three-dimensional stacked chips, including a heat conduction component 10 attached to the chip and a fluid cooling component 20 for liquid cooling the chip micropores, and two heat dissipation components 30 for cooling the heat conduction component 10 and the fluid cooling component 20. The heat conduction component 10 includes a heat conduction seat 11 attached to the chip for heat conduction and multiple first heat pipes 12, and main fins 13 installed at the ends of the multiple heat pipes; the sealing ridge 112 of the heat conduction seat 11 is integrated with the positioning part 212 of the heat conduction cover 21, and the spring preload force is relied upon to ensure that the heat conduction seat 11 is gaplessly attached to the chip surface, so that the multiple first heat pipes 12 can simultaneously absorb heat efficiently from the chip surface and internal micropores, thereby achieving seamless convergence of surface and internal heat.

[0056] The fluid cooling component 20 includes a heat-conducting cover 21 installed between the heat-conducting seat 11 and the main fins 13 to store the coolant and dissipate the heat. The heat-conducting cover 21 includes two second heat pipes 214 that are staggered to contact the coolant. The inner wall of the heat-conducting cover 21 is rotatably provided with a flow direction component 22 that controls the flow and heat exchange of the coolant; the rotatable main shaft 221 cooperates with the sealing slide 222 to form a unique reciprocating micro-pore circulation mechanism: the two impellers 223 generate partial pressure on the main shaft 221 under the alternating drive of high and low power fans, causing the sealing slide 222 to slowly deflect in the micro-pores. The coolant continuously removes the high-temperature area in the center of the stack during the reciprocating flow and evenly distributes the heat to both ends. This reciprocating cycle breaks through the limitation of traditional one-way liquid cooling that can only remove heat near the inlet area.

[0057] The heat sink assembly 30 includes an air scoop 31 fixed to the main fins 13 to cool them. One side of the air scoop 31 is connected to an air induction hood 32, which cools the second heat pipes 214. A centrifugal fan 34 is installed within the air scoop 31. The first heat pipes 12, coupled to the main fins 13, dissipate heat from both the coolant and the chip surface, maintaining temperature uniformity across the four first heat pipes 12 and preventing heat accumulation. The air scoop 31 and air induction hood 32 precisely guide the centrifugal fan 34's air outlet and negative pressure areas, allowing airflow to simultaneously create dynamic pressure and suction in both heat dissipation pathways, enhancing the heat exchange efficiency between the heat pipe surface and the fluid channel. The second heat pipes 214, coupled with the auxiliary fins 35, independently cool the return coolant side based on the cooling effect of the corresponding centrifugal fan 34 when activated. Each time the centrifugal fan 34 switches, the outlet and return sides of the sealing slide 222 are swapped, switching the temperature distribution of the two second heat pipes 214.

[0058] Specifically, such as Figure 9 As shown, the thermal base 11 includes a base body 111, and a fitting groove 113 for staggered attachment of multiple first heat pipes 12 is provided at the bottom of the base body 111. A sealing ridge 112 is provided on the upper surface of the base body 111 for sealing and installing with the thermal cover 21. An integrally formed mounting portion 116 is provided at the four corners of the base body 111, and a positioning groove 117 is provided on the mounting portion 116. A plurality of liquid flow holes 114 are provided on the base body 111, and a connecting groove 115 connected to the liquid flow holes 114 is provided at the four corners of the bottom of the base body 111.

[0059] By setting the bonding groove 113, the bonding groove 113 can flatten the bottom of the base 111 and the first heat pipe 12, so that it can fit the chip for temperature transfer. At the same time, the thickness of the base 111 is reduced at the position of the bonding groove 113, and the temperature of the coolant can also be transmitted through the first heat pipe 12, so that the external heat of the chip and the internal heat carried by the coolant can be uniformly transferred and dissipated.

[0060] Specifically, such as Figure 7 As shown, the heat-conducting cover 21 also includes two second heat pipes 214 passing through a connecting base 211 installed thereon, a cover body 213 is fixed to the inner wall of the connecting base 211, and positioning portions 212 are provided at the four corners of the connecting base 211 to fit the inner wall of the positioning groove 117; the positioning portions 212 and the positioning groove 117 cooperate with each other to assist in the connection between the heat-conducting cover 21 and the heat-conducting base 11.

[0061] The bottom of the connecting seat 211 is engaged with the sealing ridge 112 , and a sealing gasket 23 is provided on the opposite surface.

[0062] The sealing ridge 112 improves the sealing performance when the sealing gasket 23 and the connecting seat 211 are pressed together by the spring.

[0063] Specifically, such as Figure 7 As shown, the cover body 213 is composed of glass covered with a metal shell, and a hemispherical coolant storage space is provided on the inner wall thereof.

[0064] The interior of the cover 213 is made of glass. The integrated melting of the glass is based on mold cooling and forming, which can meet the needs of fitting with the sealing slide 222, so that they have good sealing and sliding performance when cooperating with each other. In addition, the metal shell on the surface can provide protection. The metal shell and the main fin 13 are integrally formed, which can achieve a good fit and heat conduction effect.

[0065] Specifically, such as Figure 7 As shown, the flow direction component 22 includes a main shaft 221 that is sealed and rotatably installed on both sides of the connecting seat 211. The surface of the main shaft 221 is fixed with a sealing slide 222 that slides against the inner wall of the cover body 213. Two impellers 223 with blades in opposite directions are fixed at both ends of the main shaft 221. The surface of the main shaft 221 is fitted with a partition seat 224 fixed to the inner wall of the seat body 111.

[0066] By setting the main shaft 221, the main shaft 221 is sealed and rotated on the connecting seat 211, which can prevent the internal coolant from leaking during rotation. At the same time, the blades of the impeller 223 at both ends are in opposite directions, so that it can be affected by the two heat dissipation components 30 and rotate in two directions respectively.

[0067] Specifically, such as Figure 6 As shown, the heat dissipation assembly 30 also includes a plurality of air holes 33 opened on the inner wall of the air guide cover 31 and connected to the air induced cover 32, and the air holes 33 are located in the negative pressure area of ​​the centrifugal fan 34 and connected. The inner wall of the air induced cover 32 is provided with auxiliary fins 35 fixed to the end of the second heat pipe 214, and the air outlet of the air guide cover 31 is arranged in an inclined shape.

[0068] By setting up the air hole 33, the air hole 33 can allow a part of the air flow to enter through this side when the centrifugal fan 34 is in use. The centrifugal fan 34 throws the air flow from the inside to the outside based on the centrifugal force, so that the center of the impeller 223 presents a negative pressure air inlet, which can have a higher wind pressure and can meet the driving needs of the impeller 223 and the traction needs of the heat dissipation airflow.

[0069] Specifically, such as Figure 8 As shown, a connecting piece 50 is fitted in the connecting groove 115 , and the thickness of the connecting piece 50 is 1-1.5 mm greater than the depth of the connecting groove 115 .

[0070] The connecting piece 50 includes an annular and a sheet-shaped one, and the positions of the connecting groove 115 and the liquid flow hole 114 are opened at corresponding positions of the base body 111 according to the actual position of the chip. When multiple chip models are adapted, the sheet-shaped connecting piece 50 can optionally completely block the connecting groove 115 to prevent internal coolant leakage. At the same time, an annular connecting piece 50 is selected, and its thickness is greater than the connecting groove 115. During the installation process, it can be deformed with extrusion and fit tightly to the inner wall of the connecting groove 115, maintaining liquid connectivity and avoiding leakage.

[0071] Specifically, such as Figure 1 As shown, after the positioning portion 212 is engaged and snapped into the positioning groove 117 , a mounting screw 40 that is spring-loaded and slides through the positioning portion 212 is inserted, and the mounting screw 40 is threadedly engaged with the mounting portion 116 .

[0072] By setting the mounting screw 40, the mounting screw 40 can be fixed to the mainboard on which the chip is installed. At the same time, the mounting screw 40 can be threadedly engaged with the mounting portion 116. By being fixed to the mounting portion 116, the spring thereon can be supported so that the spring can press the positioning portion 212 through elastic force, keeping the positioning portion 212 tightly fitted in the positioning groove 117. This structural design can realize the disassembly of the fluid cooling component 20 when needed.

[0073] A heat dissipation optimization method for high-density three-dimensional stacked chips:

[0074] Real-time acquisition of power consumption data, temperature data of the chip and power data of the two centrifugal fans 34;

[0075] A centrifugal fan 34 power control mechanism based on chip temperature and power consumption feedback data is established.

[0076] The centrifugal fan 34 power control mechanism includes:

[0077] S1. Establish a three-level control mode of low power T-, rated power T0 and overclocking power T+ for the centrifugal fan 34;

[0078] S2. When the chip power consumption increases:

[0079] When the temperature increases, the synchronous centrifugal fan 34 is switched to T+ mode;

[0080] When the temperature decreases, the power of the centrifugal fan 34 is maintained at the T0 mode;

[0081] When the chip power consumption stops increasing but the temperature continues to increase, the centrifugal fan 34 in operation enters the T-mode and the other centrifugal fan 34 is started to enter the T+ mode;

[0082] From this step, it can be seen that as the power consumption of the chip increases, its temperature increases, and the started centrifugal fan 34 enters the T+ mode, the centrifugal fan 34 in the standby state maintains the T- state, and when the temperature drops, it enters the T0 mode. This method can respond to the heat dissipation rate in real time according to the temperature change when the power increases, and can control the heat dissipation rate according to the temperature change. It can judge whether liquid cooling is in progress based on the temperature change, and then feedback the operating status control of the two centrifugal fans 34.

[0083] S3. When the chip power consumption remains unchanged or decreases:

[0084] If the chip temperature increases, the centrifugal fan 34 in operation enters the T-mode, and the other centrifugal fan 34 is started to enter the T0 mode;

[0085] If the chip temperature decreases, the modes of the two centrifugal fans 34 are maintained unchanged;

[0086] When the chip power consumption decreases, if the temperature increases, it is determined that the sealing slide 222 has moved to the end position, causing the coolant to stop entering the liquid flow hole 114, causing heat to accumulate in the chip micro-holes. By switching the state of the centrifugal fan 34, the originally operating fan enters the T- state, and the originally standby motor enters the T0 state. This method can determine whether the liquid cooling is proceeding normally.

[0087] S4. After step S1, step S2 and step S3 respond, if the temperature continues to rise, the two centrifugal fans 34 are started synchronously and enter the T+ mode.

[0088] Both S2 and S3 can adjust the operation mode of the two centrifugal fans according to temperature changes, and can also determine whether liquid cooling is in progress. If the temperature continues to rise, there may be a liquid cooling failure. At this time, the two centrifugal fans 34 operate synchronously, and the maximum power is used for heat conduction and heat dissipation, which plays a safety role and avoids thermal runaway.

[0089] This solution, based on a three-stage fan control mode with real-time power consumption and temperature feedback, achieves intelligent regulation of fan power linked to the flow direction component 22: When the local temperature rises, the high-power fan quickly activates and simultaneously accelerates the microfluidic circulation. When the temperature drops, it switches to low-power mode to maintain pressure, achieving adaptive switching of the heat dissipation path. This solution achieves multiple breakthroughs in compact structure, coordinated fluid and airflow dynamics, and intelligent control, effectively avoiding local heat accumulation and significantly improving the heat dissipation uniformity and system reliability of high-density three-dimensional stacked chips.

[0090] During installation, the heat shield 21 of the fluid cooling assembly 20 is inserted into the positioning groove 117, and the connecting piece 50 is interference-fitted into the four connecting grooves 115 below the base 111. The mounting screw 40 is then rotated, threaded into the mounting portion 116 and secured to the chip's mainboard. The spring on the mounting screw 40 presses the heat shield 21 of the fluid cooling assembly 20 against the heat base 11 of the heat conduction assembly 10, and under pressure, the heat base 11 is tightly attached to the chip surface.

[0091] During use, the four first heat pipes 12 are pressed against the chip on one side and in the bonding groove 113 on the other side under the pressure of the base 111. This allows the temperature of the coolant in the bonding groove 113 to be transferred to the first heat pipe 12 through the base 111. At the same time, the temperature of the chip can also be transferred to the first heat pipe 12. The coolant carrying heat through the micro-pores and the temperature dissipated by the chip surface itself can be uniformly dissipated through the first heat pipe 12. The surface of the first heat pipe 12 is cooled by multiple installed main fins 13. Combined with the heat dissipation components 30 on both sides of the main fins 13, airflow is driven to maintain rapid heat dissipation.

[0092] At the same time, when this solution is in use, the centrifugal fans 34 of the two heat dissipation components 30 are started separately, one is in high-power T+ mode, and the other is in low-power T- mode. At this time, the impellers 223 fixed at both ends of the main shaft 221 are synchronously subjected to forces in two directions. Based on the low air volume in the low-power mode, the influence of the force on the impeller 223 on the corresponding side is negligible. The high wind pressure generated by the centrifugal fan 34 on the other side acts on the corresponding impeller 223, so that the impeller 223 rotates with the main shaft 221 under the action of the wind pressure. At the same time, the main shaft 221 rotates During the heat dissipation process, the sealing slide 222 on the surface deflects. At this time, the sealing slide 222 presses the lubricating liquid into the liquid flow hole 114 at a constant pressure and enters the micropores of the chip. After heat exchange, the lubricating liquid enters the other side of the sealing slide 222 from the liquid flow hole 114 on the other side, so that the heat dissipation of the micropores is combined with the heat dissipation of the heat conduction to achieve stable temperature control. The direct surface high heat transfer and dissipation of the heat conduction component 10, combined with the internal heat carried by the micropores, effectively avoids the local heat accumulation of the high-density three-dimensional stacked chips.

[0093] When the main shaft 221 deflects with the sealing slide 222, the coolant on one side is pressurized and the coolant on the other side is kept sucked. At this time, the centrifugal fan 34 on the corresponding side blows toward the corresponding impeller 223 through the inclined air outlet of the air guide hood 31 to provide a pressure. At this time, the centrifugal fan 34 on this side sucks the heat of the main fins 13 through the air guide hood 31. At this time, the negative pressure area of ​​the centrifugal fan 34 is connected to the induced draft cover 32 through multiple air holes 33, and continues to draw part of the air through the induced draft cover 32. The cooling area on the return liquid side of the sealing slide 222 is The liquid heat is transferred to the auxiliary fins 35 through the second heat pipe 214 it contacts, thereby dissipating the heat. This achieves cooling of the main fins 13 of the first heat pipe 12. At the same time, the airflow acts on the impeller 223, providing continuous pressure from the main shaft 221 to the sealing slide 222. At the same time, the centrifugal fan 34 on this side creates a negative pressure on the induced draft hood 32, and this airflow cools the second heat pipe 214. As a whole, a coordinated cooling mechanism is formed for the first heat pipe 12 and the second heat pipe 214, and the pressurized hot air can provide a driving force for the impeller 223.

[0094] During use, the operating power and temperature data of the chip are used to feedback and control the mode changes of the two heat dissipation components 30, so that the two heat dissipation components 30 are alternately started, so that the impellers 223 on both sides drive the main shaft 221 to deflect back and forth. The main shaft 221, through the slow movement of the sealing slide 222, carries the coolant into the liquid flow hole 114 from the right side, and then the coolant flows back from the liquid flow hole 114 on the left side. After the sealing slide 222 reaches the rightmost side, it moves in the opposite direction, so that the coolant on the left side enters the liquid flow hole 114 to dissipate heat for the chip, and flows back from the right side, and the cycle repeats. This process combines the first heat pipe 12 and the second heat pipe 214 to control the temperature of the coolant and the chip surface, and the coolant's carrying effect on the heat accumulation area inside the chip to achieve good temperature control.

[0095] At the same time, the reciprocating control method allows the coolant to flow from one end to the other end of the chip, and carry the temperature of the heat accumulation in the middle. The closer to the tail end, the higher the temperature. The reciprocating flow can balance the temperature at both ends, avoiding the end being continuously heated when the temperature of the heat accumulation in the middle is carried out. Compared with traditional liquid cooling methods, it has better temperature control stability.

[0096] In summary, this solution forms a close collaborative temperature control mechanism between the heat conduction component 10, the micro-pore liquid cooling component, and the dual heat dissipation component 30. An efficient surface heat transfer channel is formed through the heat conduction seat 11, the first heat pipe 12, and the main fins 13. At the same time, a rotatable flow direction component 22 and a sealing slide 222 are arranged in the heat conduction cover 21, so that the coolant flows back and forth in the micro-pores and dissipates heat collaboratively with the second heat pipe 214 and the auxiliary fins 35. Then, two centrifugal fans 34 alternately drive the impeller 223 in high and low power modes to drive the main shaft 221 to deflect, thereby achieving continuous pressure on the sealing slide 222, thereby ensuring that the heat conduction component 10 is closely attached to the chip under pressure and maintaining a constant pressure of the coolant. This mechanism ensures that the coolant not only carries the heat from the chip, but also evenly distributes the temperature of the heat accumulation area to both ends through reciprocating flow and then flows back, effectively avoiding the end-overheating problem of traditional liquid cooling. At the same time, the airflow guided by the main fins 13 and the air guide 31 simultaneously cools the first heat pipe 12 and the second heat pipe 214, forming a dual synergy of surface heat transfer and micro-pore circulation cooling. This achieves two-way control of the local and overall temperature of high-density three-dimensional stacked chips, significantly improving heat dissipation efficiency and temperature uniformity, allowing high-density stacked chips to maintain a stable temperature even in high-power operation, avoiding internal heat accumulation and improving reliability and service life.

[0097] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A heat dissipation optimization device for high-density three-dimensional stacked chips, comprising a heat conduction component (10) attached to the chip, a fluid cooling component (20) for liquid cooling the microfluidic holes of the chip, and two heat dissipation components (30) for cooling the heat conduction component (10) and the fluid cooling component (20), characterized in that: The heat conduction component (10) comprises a heat conduction seat (11) attached to the chip for heat conduction, a plurality of first heat pipes (12), and main fins (13) installed at the ends of the plurality of heat pipes; The fluid cooling component (20) includes a heat-conducting cover (21) installed between the heat-conducting seat (11) and the main fins (13) to store the coolant and dissipate the heat, and the heat-conducting cover (21) includes two second heat pipes (214) that are staggered to contact the coolant, and the inner wall of the heat-conducting cover (21) is rotatably provided with a flow direction component (22) for controlling the flow and heat exchange of the coolant; The heat dissipation assembly (30) includes an air guide cover (31) fixed on the main fin (13) to cool it, one side of the air guide cover (31) is connected to an air induction cover (32) to cool the second heat pipe (214), and a centrifugal fan (34) is installed in the air guide cover (31); The heat-conducting seat (11) comprises a seat body (111), the bottom of the seat body (111) is provided with a fitting groove (113) for staggered attachment of a plurality of first heat pipes (12), the upper surface of the seat body (111) is provided with a sealing ridge (112) for sealingly mounting with the heat-conducting cover (21), the four corners of the seat body (111) are provided with an integrally formed mounting portion (116), the mounting portion (116) is provided with a positioning groove (117), the seat body (111) is provided with a plurality of liquid flow holes (114), and the four corners of the bottom of the seat body (111) are provided with a connecting groove (115) connected to the liquid flow holes (114); The heat-conducting cover (21) further includes a connecting seat (211) on which two second heat pipes (214) are installed, a cover body (213) is fixed to the inner wall of the connecting seat (211), and positioning portions (212) are provided at the four corners of the connecting seat (211) and are installed in contact with the inner wall of the positioning groove (117); The bottom of the connecting seat (211) is engaged with the sealing ridge (112), and a sealing gasket (23) is provided on the opposite surface; The flow direction component (22) includes a main shaft (221) that is sealingly rotatably mounted on both sides of the connecting seat (211); a sealing slide (222) that slides against the inner wall of the cover body (213) is fixed on the surface of the main shaft (221); two impellers (223) with blades in opposite directions are fixed at both ends of the main shaft (221); and a partition seat (224) that is fixed to the inner wall of the seat body (111) is provided on the surface of the main shaft (221); The heat dissipation assembly (30) further includes a plurality of air holes (33) provided on the inner wall of the air guide cover (31) and communicating with the air induced cover (32), and the air holes (33) are located in a negative pressure area of ​​the centrifugal fan (34) and communicate with the air induced cover (34). The inner wall of the air induced cover (32) is provided with auxiliary fins (35) fixed to the end of the second heat pipe (214), and the air outlet of the air guide cover (31) is arranged in an inclined shape.

2. The heat dissipation optimization device for high-density three-dimensional stacked chips according to claim 1, characterized in that: The cover body (213) is composed of glass covered with a metal shell, and a hemispherical cooling liquid storage space is provided on its inner wall.

3. The heat dissipation optimization device for high-density three-dimensional stacked chips according to claim 1, characterized in that: A connecting piece (50) is fitted in the connecting groove (115), and the thickness of the connecting piece (50) is 1-1.5 mm greater than the depth of the connecting groove (115).

4. The heat dissipation optimization device for high-density three-dimensional stacked chips according to claim 1, characterized in that: After the positioning portion (212) is engaged and snapped into the positioning groove (117), a mounting screw (40) is slid through the positioning portion (212) and is pressed by a spring. The mounting screw (40) is threadedly engaged with the mounting portion (116).

5. A method for optimizing heat dissipation of high-density three-dimensional stacked chips, using the heat dissipation optimization device for high-density three-dimensional stacked chips according to claim 1, characterized in that: Includes the following methods: Real-time acquisition of power consumption data, temperature data of the chip and power data of two centrifugal fans (34); A power control mechanism for the centrifugal fan (34) is established based on chip temperature and power consumption feedback data.

6. The heat dissipation optimization method for high-density three-dimensional stacked chips according to claim 5, characterized in that: The centrifugal fan (34) power control mechanism includes: S1, establishing a three-level control mode of low power T-, rated power T0 and overclocking power T+ of the centrifugal fan (34); S2. When the chip power consumption increases: When the temperature increases, the centrifugal fan (34) is synchronized to the T+ mode; When the temperature decreases, the power T0 mode of the centrifugal fan (34) is maintained; When the chip power consumption stops increasing but the temperature continues to increase, the centrifugal fan (34) in operation is put into T-mode, and another centrifugal fan (34) is started to enter T+ mode; S3. When the chip power consumption remains unchanged or decreases: If the chip temperature increases, the centrifugal fan (34) in operation is put into T-mode, and another centrifugal fan (34) is started to enter T0 mode; If the chip temperature decreases, the modes of the two centrifugal fans (34) are maintained unchanged; S4. After step S1, step S2 and step S3 respond, if the temperature continues to rise, the two centrifugal fans (34) are started synchronously and enter the T+ mode.

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