Coil packaging module and circuit board structure with coil packaging module

Abstract

The invention provides a coil packaging module and a circuit board structure with the coil packaging module, the coil packaging module comprises a coil and a packaging body, the coil is provided with a winding part, the winding part is provided with at least two wire outlet ends, the packaging body completely covers the coil to form a coil shell, and the coil shell is provided with a plurality of wire outlet ends. And the two wire outlet ends are exposed out of the packaging body to form reserved electrical contacts. By means of the structure, the coil is firstly packaged, the exposed electric contact is reserved, and the coil and the circuit board are welded and assembled in a surface mounting mode of a surface mount technology, so that the efficiency and the yield of product assembly can be greatly improved, and the production cost is effectively reduced.

Description

Technical Field

[0001] The present invention relates to a coil used in a fan motor, and in particular to a coil packaging module and a circuit board structure having the coil packaging module. Background Art

[0002] Currently, fan motor coils are mostly potted with glue, often using polyurethane (PU) or epoxy resin. The glue is completely encapsulated and cured to protect the coil winding assembly, effectively preventing moisture intrusion, reducing wear and the risk of vibration-induced shedding, and extending the product's lifespan. As fans are trending towards smaller and thinner sizes, the trend is shifting from traditional single-phase axial motors to radial motors. However, during production and assembly, the coils of single-phase radial motors are first mounted on the circuit board and then potted. This approach is not only inefficient, difficult, and yield-prone, but also unfavorable for mass production.

[0003] Therefore, it is necessary to propose an innovative coil encapsulation structure and its manufacturing method to effectively solve the problems of low efficiency, high difficulty and disadvantageous for mass production easily caused by the current motor coil encapsulation structure and its manufacturing method. Summary of the Invention

[0004] Therefore, in order to effectively solve the above-mentioned problems, the purpose of the present invention is to provide a coil packaging module and a circuit board structure having a coil packaging module, so as to improve the problems of low efficiency, high difficulty and disadvantages for mass production easily caused by the conventional motor coil encapsulation structure and its manufacturing method.

[0005] To achieve the above-mentioned objectives, the present invention provides a coil packaging module comprising: a coil having a winding portion with at least two wire terminals; and a packaging body that completely covers the coil to form a coil housing, so that the two wire terminals of the coil are exposed outside the packaging body to form reserved electrical contacts for electrical connection with a circuit substrate.

[0006] The package is a colloid.

[0007] The encapsulated body is an insulating material selected from plastic, epoxy resin or other high polymer materials with formability.

[0008] The two outlet terminals are surface-mounted pins, so as to be welded to the circuit substrate via surface-mounted technology.

[0009] The winding portion has a flat spiral structure.

[0010] The coil housing includes a top wall, a bottom wall and a side wall. The top wall and the bottom wall are arranged opposite to each other. The side wall connects the top wall and the bottom wall. The two wire terminals extend and protrude from the bottom wall or the side wall.

[0011] The coil housing includes a top wall, a bottom wall, and a side wall. The top wall and the bottom wall are arranged opposite each other in an upper and lower direction. The side wall connects the top wall and the bottom wall. The side wall includes two side surfaces arranged opposite each other. The two side surfaces are respectively arranged corresponding to the two output terminals. The contour of each side surface is the same as the end contour of each output terminal.

[0012] To achieve the above-mentioned objectives, the present invention provides a circuit board structure with a coil packaging module, comprising: a circuit substrate; and at least one coil packaging module, disposed on the circuit substrate, the coil packaging module including: a coil, having a winding portion, the winding portion having at least two output terminals; and a packaging body, covering the coil to form a coil housing, with the two output terminals exposed outside the packaging body and electrically connected to the circuit substrate.

[0013] The packaging body is a colloid, and the colloid is an insulating material selected from plastic, epoxy resin or other high polymer materials with formability.

[0014] The present invention first encapsulates or over-molds the coil and reserves exposed electrical contacts to form a package structure or over-molded structure similar to a patch. Since this package structure or over-molded structure is similar to common electronic packaging components, it can be soldered to a circuit board in a patch-like manner using surface mount technology (SMT). This can significantly improve product assembly efficiency and simplify the production process, thereby effectively reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a three-dimensional schematic diagram of a coil packaging module of the present invention;

[0016] Figure 2 for Figure 1 A three-dimensional schematic diagram of the coil packaging module at another angle;

[0017] Figure 3 for Figure 1 A cross-sectional schematic diagram of a coil packaging module;

[0018] Figure 4 is a three-dimensional schematic diagram of another coil packaging module of the present invention;

[0019] Figure 5 for Figure 4 A cross-sectional schematic diagram of a coil packaging module;

[0020] Figure 6 A schematic side view of a circuit board structure with a coil packaging module according to the present invention;

[0021] Figure 7is a three-dimensional schematic diagram of another coil packaging module of the present invention;

[0022] Figure 8 for Figure 7 A three-dimensional schematic diagram of the coil packaging module at another angle;

[0023] Figure 9 is a three-dimensional schematic diagram of another coil packaging module of the present invention;

[0024] Figure 10 for Figure 9 A three-dimensional schematic diagram of the coil packaging module at another angle;

[0025] Figure 11 The figure is a flow chart of a method for manufacturing a circuit board structure with a coil packaging module according to the present invention.

[0026] Explanation of the accompanying drawings: coil packaging module 1; coil 11; winding portion 111; output terminal 112; packaging body 12; coil housing 121; top wall 1211; bottom wall 1212; side wall 1213; side surface 1214; circuit substrate 2; circuit board structure 3; method for manufacturing circuit board structure 4; coil providing step 41; coil packaging step 42; coil connecting step 43; coil packaging module 5; output terminal 51; packaging body 52; coil housing 521; top wall 5211; bottom wall 5212; side wall 5213; radial surface 5214; fan-shaped bottom surface 5215; top surface 5216; width W. DETAILED DESCRIPTION

[0027] The above-mentioned objectives and structural and functional characteristics of the present invention will be described with reference to the preferred embodiments shown in the accompanying drawings.

[0028] Please also see Figures 1 to 3 As shown, the present invention provides a coil packaging module 1, which includes: a coil 11 having a winding portion 111, the winding portion 111 having at least two output terminals 112; and a packaging body 12 for covering the coil 11 to form a coil housing 121, and the two output terminals 112 are exposed outside the packaging body 12 to form reserved electrical contacts for electrical connection with a circuit substrate (not shown).

[0029] In this embodiment, the package body 12 is a colloid. The colloid is an insulating material selected from plastic, epoxy resin or other high-molecular materials with formability. However, it is not limited to this. The package body 12 can also be made of other insulating materials, such as ceramics. In addition, the two exposed output terminals 112 serve as surface-mounted pins to facilitate soldering to the circuit substrate via surface-mount technology (SMT). Furthermore, the winding portion 111 can be a flat spiral structure, but it is not limited to this. The winding portion 111 can also be a spiral structure of other shapes.

[0030] In this embodiment, the coil housing 121 includes a top wall 1211, a bottom wall 1212, and a side wall 1213. The top wall 1211 and the bottom wall 1212 are disposed vertically opposite each other, and the side wall 1213 connects the top wall 1211 and the bottom wall 1212. The two wire terminals 112 extend from the bottom wall 1212 or the side wall 1213 and are positioned along the diagonal of the bottom wall 1212, thereby achieving a stable structural configuration. It is worth noting that each wire terminal 112 has a generally square or geometric contact point to facilitate soldering to pads on a circuit board (not shown). Furthermore, in addition to being located diagonally along the bottom wall 1212, the two wire terminals 112 can also be positioned in any of four other directions, namely, front, back, left, and right, of the coil housing 121, that is, on all four sides of the side wall 1213 surrounding the coil housing 121. In other words, the present invention does not limit the positions of the two outlet terminals 112 , and the positions of the two outlet terminals 112 can be defined according to actual product needs.

[0031] It will be appreciated that in this embodiment, the coil housing 121 is shaped like a square or other geometric structure. This square structure may include a rectangular or square body to match the square shape formed by the winding portion 111. Cut edges are provided at two opposite corners of the square structure to form two parallel, opposing side surfaces 1214. Each of these side surfaces 1214 may also be referred to as a diagonal cut surface. Therefore, the sidewall 1213 includes two parallel, opposing side surfaces 1214. These two side surfaces 1214 are respectively provided to correspond to the two outlet terminals 112. The width W of each side surface 1214 is slightly greater than or equal to the width of each outlet terminal 112. The profile of each side surface 1214 is identical to the profile of the end of each outlet terminal 112. Therefore, when the outlet terminal 112 is a square contact, the width W of the side surface 1214 will be slightly greater than or equal to the width of the square contact, and the profile of the side surface 1214 will be the same as the end profile of the corresponding square contact. In this way, each outlet terminal 112 can be properly protected by the coil housing 121 without forming an overly large coil housing 121 that would waste space.

[0032] Furthermore, in order to reduce the space occupied by the coil packaging module 1, the two wire terminals 112 extending from the bottom wall 1212 or the side wall 1213 can be designed to be directly located on the bottom wall 1212. Figures 4 and 5 As shown, the present invention provides another coil packaging module, whose coil housing 121 also includes a top wall 1211, a bottom wall 1212 and a side wall 1213. The top wall 1211 and the bottom wall 1212 are arranged opposite each other in an upper and lower direction, and the side wall 1213 connects the top wall 1211 and the bottom wall 1212. The difference between this coil packaging module and the above-mentioned coil packaging module 1 is that the two output terminals 112 are arranged on the bottom wall 1212 and located on the diagonal line of the bottom wall 1212. Since the two output terminals 112 are located on the bottom wall 1212, the space waste caused by the space occupied by the output terminals 112 can be effectively reduced.

[0033] Similarly, the side wall 1213 also includes two parallel side surfaces 1214 arranged opposite to each other. The two side surfaces 1214 can also be called two diagonal sections. The two side surfaces 1214 are respectively arranged corresponding to the two outlet terminals 112. The width W of each side surface 1214 is slightly greater than or equal to the width of each outlet terminal 112. The profile of each side surface 1214 is identical to the end profile of each outlet terminal 112. In this way, each outlet terminal 112 can be properly protected by the outer profile of the coil housing 121.

[0034] It is worth mentioning that the side surface 1214 not only protects the outlet terminal 112, but also has the function of marking the position of the outlet terminal 112. Figure 4 As shown, from this angle only the side 1214 can be seen but the outlet end 112 cannot be seen. Figure 5 As shown, the side surface 1214 and the outlet terminal 112 can be seen from another angle at the same time. As is known from the above embodiments, the outlet terminal 112 is arranged close to the side surface 1214. Figure 4 Only the side surface 1214 can be seen in the figure, but it actually indicates the position of the terminal 112 , which is at the junction of the side surface 1214 and the bottom wall 1212 . In other words, the side surface 1214 has the function of indicating the position of the terminal 112 .

[0035] See also Figure 6As shown, the present invention also provides a circuit board structure 3 with a coil packaging module, including: a circuit substrate 2; and at least one coil packaging module 1, which is arranged on the circuit substrate 2, and the coil packaging module 1 includes: a coil (not shown), having a winding portion (not shown), the winding portion having at least two output terminals 112; and a packaging body 12 covering the coil to form a coil housing 121, and the two output terminals 112 are exposed outside the packaging body 12 and electrically connected to the circuit substrate 2.

[0036] In this embodiment, the encapsulation body 12 is a colloid, which is an insulating material selected from plastic, epoxy resin, or other moldable polymer materials. Furthermore, the coil housing 121 of the coil packaging module 1 includes a top wall 1211, a bottom wall 1212, and a side wall 1213. The top wall 1211 and the bottom wall 1212 are disposed in an upper and lower relationship. A product number marking can be formed on the top wall 1211, and the flat surface of the top wall 1211 can be used for suction. Therefore, the flat top wall 1211 can be used as a suction surface or a product number marking surface.

[0037] Please also see Figures 7 and 8 As shown, the present invention further provides a coil packaging module 5, which includes: a coil (not shown) having a winding portion (not shown), the winding portion being provided with at least two output terminals 51; and a packaging body 52, covering the coil to form a coil housing 521, and the two output terminals 51 are exposed outside the packaging body 52 to form reserved electrical contacts. The coil housing 521 of this coil packaging module 5 is similar to a fan-shaped structure to match the fan-shaped appearance formed by the winding portion. The coil housing 521 includes a top wall 5211, a bottom wall 5212 and a side wall 5213, wherein the side wall 5213 includes two radial surfaces 5214 arranged opposite to each other, a fan-shaped bottom surface 5215 and a top surface 5216, and the two output terminals 51 protrude from the fan-shaped bottom surface 5215 and are respectively located on both sides of the fan-shaped bottom surface 5215. However, it is not limited to this, please also refer to Figures 9 and 10 As shown, the present invention can also set the two outlet terminals 51 to protrude from the top surface 5216 and be respectively located on both sides of the top surface 5216. In other words, the present invention does not limit the shape of the coil housing 521 to be square like the above-mentioned coil housing 121. It can also be other geometric shapes, and the positions of the two outlet terminals 51 can be protruding from the fan-shaped bottom surface 5215, or protruding from the top surface 5216, or protruding from the two radial surfaces 5214 respectively. Therefore, the present invention does not limit the position of the outlet terminals 51, which can be in any direction without being defined. However, it is not limited to this. Another option is that the coil housing 521 of the package body 12 can also be circular. In other words, the package body 12 of the present invention should be of any shape and is not limited here.

[0038] See also Figure 11 As shown, the present invention also provides a manufacturing method 4 of a circuit board structure with a coil packaging module, which includes: a coil providing step 41, providing a coil, and making the coil have a winding portion and forming at least two output terminals on the winding portion; a coil packaging step 42, covering the coil with a packaging body to form a coil shell, and exposing the two output terminals outside the packaging body to form a coil packaging module; and a coil connecting step 43, soldering the two output terminals of the coil packaging module to a circuit substrate through surface mounting technology to form a circuit board structure with a coil packaging module.

[0039] Specifically, the encapsulation in coil encapsulation step 42 is a gelatinized body, which is an insulating material selected from plastic, epoxy resin, or other moldable polymer materials. In this embodiment, a single coil is encapsulated and then bonded to the PCB. Bonding can be performed using surface mount technology (SMT), which allows for automated processing and significantly improves product assembly efficiency.

[0040] In summary, the present invention forms a package structure or encapsulated structure similar to a patch by first encapsulating or encapsulating the coil and reserving exposed pins. The motor coil can be assembled using surface mount technology (SMT) patch technology, which can greatly improve the efficiency of product assembly. This process is comparable to PCB motors and increases inductance. The production process is also simple, thus effectively reducing production costs. In addition, the position of electronic components is not restricted, and there is no single-phase starting dead angle problem. Therefore, the three-phase radial coil motor developed by the present invention and the process of improving the coil have the above advantages.

[0041] The above description has provided a detailed description of the present invention. However, the above description is merely a preferred embodiment of the present invention and should not limit the scope of the present invention. In other words, all equivalent variations and modifications based on the present invention are still within the scope of the present invention.

Claims

1. A coil packaging module, characterized in that: Include: A coil having a winding portion with at least two wire outlets; and A packaging body covers the coil to form a coil shell. The at least two output terminals are exposed outside the packaging body to form reserved electrical contacts for electrical connection with a circuit substrate.

2. The coil packaging module according to claim 1, wherein: The package is a colloid.

3. The coil packaging module according to claim 2, wherein: The encapsulated body is an insulating material selected from plastic, epoxy resin or other high polymer materials with formability.

4. The coil packaging module according to claim 1, wherein: The at least two output terminals are surface-mounted pins, so as to be welded to the circuit substrate through surface-mounted technology.

5. The coil packaging module according to claim 1, wherein: The winding portion has a flat spiral structure.

6. The coil packaging module according to claim 1, wherein: The coil housing includes a top wall, a bottom wall and a side wall. The top wall and the bottom wall are arranged opposite to each other. The side wall connects the top wall and the bottom wall. The at least two wire ends extend out of the bottom wall or the side wall.

7. The coil packaging module according to claim 1, wherein: The coil housing includes a top wall, a bottom wall and a side wall. The top wall and the bottom wall are arranged opposite to each other in an up-and-down manner. The side wall connects the top wall and the bottom wall. The at least two wire terminals are arranged on the bottom wall.

8. The coil packaging module according to claim 1, wherein: The coil housing includes a top wall, a bottom wall, and a side wall. The top wall and the bottom wall are arranged opposite each other in an upper and lower direction. The side wall connects the top wall and the bottom wall. The side wall includes two side surfaces arranged opposite each other. The two side surfaces are respectively arranged corresponding to the at least two output terminals. The contour of each side surface is the same as the contour of the end of each output terminal.

9. A circuit board structure with a coil packaging module, characterized in that: Include: a circuit substrate; and At least one coil packaging module is disposed on the circuit substrate, and the coil packaging module further comprises: A coil having a winding portion with at least two wire outlets; and A packaging body covers the coil to form a coil shell, and the at least two output terminals are exposed outside the packaging body and are electrically connected to the circuit substrate.

10. The circuit board structure according to claim 9, wherein: The packaging body is a colloid, and the colloid is an insulating material selected from plastic, epoxy resin or other high polymer materials with formability.

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