Preparation method of ceramic-based circuit board and ceramic-based circuit board

Abstract

The invention is applicable to the technical field of circuit boards, and provides a preparation method of a ceramic-based circuit board, which comprises the following steps: S1, substrate drilling: placing a substrate in a processing device, and performing trepanning and dust removal treatment on the substrate through the processing device; s2, plating copper on the substrate: performing copper plating treatment on the inner wall of the through hole of the substrate in the step S1 by adopting chemical copper plating; s3, manufacturing a film; s4, a pattern is manufactured, wherein the film obtained in the step S3 is developed on the surface of the substrate; s5, substrate installation: the clamping mechanism clamps the circuit boards with different heights through a clamping assembly in the clamping mechanism; the circuit boards with different lengths can be clamped through the two sets of adjusting assemblies, the clamping assemblies clamp the upper ends and the lower ends of the circuit boards through two clamping plates moving up and down in the clamping assemblies, the circuit boards with different specifications can be clamped through the device, the circuit boards with different shapes can also be clamped through the device, and gaps can be avoided in the clamping process.

Description

Technical Field

[0001] The present invention belongs to the technical field of circuit boards, and in particular relates to a method for preparing a ceramic-based circuit board and the ceramic-based circuit board. Background Art

[0002] Ceramic substrates are specially crafted by directly bonding copper foil to the surface (one or both sides) of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperatures. The resulting ultra-thin composite substrate exhibits excellent electrical insulation, high thermal conductivity, superior solderability, and high adhesion strength. Similar to PCBs, it can be etched with various patterns and possesses a high current-carrying capacity.

[0003] Chinese utility model patent publication number CN211803949 U discloses a drilling device for aluminum-based circuit board production. The device comprises a base box with a central partition within the inner chamber. A first motor is fixedly mounted on one side of the base of the partition, and a main shaft is fixedly mounted on the output shaft of the first motor. The aforementioned patent utilizes a meshing transmission between gears to drive a fixed wheel on the slave shaft, thereby driving intermittent and equidistant rotation of the worktable. Combined with a second motor adjusting the horizontal position of the drilling mechanism, the device can achieve equidistant annular drilling at any diameter position on a disc-shaped circuit board on the worktable.

[0004] However, the above patent has the following shortcomings: 1. The above patent uses two fixed clamps and one sliding clamp to fix and clamp the disc-shaped circuit board. This clamping method has a limited clamping range. If a rectangular circuit board needs to be clamped, the edges of the above fixed clamps and the sliding clamp cannot fit with the edges of the rectangular circuit board, which affects the stability of the clamping and further causes errors during the processing.

[0005] 2. After the above patent uses a drilling mechanism to drill holes in the circuit board, it is not possible to vacuum the surface of the circuit board. Instead, the dust is removed by manually wiping the circuit board, which is not only labor-intensive but also inefficient. Summary of the Invention

[0006] The present invention provides a method for preparing a ceramic-based circuit board and the ceramic-based circuit board thereof, aiming to solve the problems that, when a current drilling device clamps a rectangular circuit board, the edges of a fixed clamping plate and a sliding clamping plate cannot fit with the edges of the rectangular circuit board, thereby affecting the stability of the clamping; and that after the circuit board is punched by the drilling mechanism, dust cannot be removed from the surface of the circuit board.

[0007] In order to achieve the above object, the present invention adopts the following technical solution: A method for preparing a ceramic-based circuit board, characterized in that it comprises the following steps: S1. Drilling a hole in a substrate: placing a substrate in a processing device, and performing hole drilling and dust removal on the substrate by the processing device; S2. Copper plating of a substrate: using chemical copper plating to copper-plate the inner wall of the through hole of the substrate in step S1; S3. Making a film: making a film according to a preset material; S4. Making a pattern: developing the film obtained in step S3 on the surface of the substrate; S5. Installing a substrate: installing a circuit layer and an insulating layer in sequence on the substrate in step S4 to obtain a ceramic-based circuit board; in this scheme, the purpose of developing the film on the surface of the substrate is to mark the substrate.

[0008] Preferably, the processing device includes a base, a support member is provided above the base, the base and the support member are connected by a column, a driving mechanism is installed on the side wall of the support member, a punching mechanism and a dust suction mechanism are installed on the driving mechanism, a clamping mechanism is provided below the dust suction mechanism, and the clamping mechanism is connected to the base; in this scheme, by setting a driving mechanism, the setting of the driving mechanism can adjust the lateral position of the punching mechanism and the dust suction mechanism; and the setting of the clamping mechanism can clamp and fix the circuit board.

[0009] Preferably, the driving mechanism includes motor 1, which is located on the side wall of the support and fixedly connected to the support, and a transmission rod is provided on the output shaft of the motor 1, one end of the transmission rod is fixedly connected to the output shaft of the motor 1, and the other end of the transmission rod is rotatably connected to the support; a mounting part 1 and a mounting part 2 are screwed on the side wall of the transmission rod, and the mounting part 1 is located on one side of the mounting part 2, and the mounting part 1 and the mounting part 2 are both slidably connected to the support, the mounting part 1 is connected to the punching mechanism, and the mounting part 2 is connected to the dust suction mechanism; in this scheme, a transmission rod is provided, and when the motor 1 drives the transmission rod to rotate, its mounting part 1 and the mounting part 2 drive the punching mechanism and the dust suction mechanism to move laterally on the support to adjust the lateral position of the punching and dust suction.

[0010] Preferably, the punching mechanism includes an electric cylinder 1, which is located on the mounting member 1 and fixedly connected to the mounting member 1, and a guide plate 1 is installed on the output shaft of the electric cylinder 1, and both ends of the guide plate 1 are slidably connected to the mounting member 1; a support plate 1 is provided below the guide plate 1, and the guide plate 1 and the support plate 1 are connected by a plurality of pillars 1, and a motor 2 is installed at the bottom of the support plate 1, and a drill bit is installed on the output shaft of the motor 2; in this scheme, by setting up an electric cylinder 1, the setting of the electric cylinder 1 can adjust the vertical height of the drill bit; and the setting of the motor 2 can drive the drill bit to rotate, and it cooperates with the electric cylinder 1 to realize the punching operation of the circuit board.

[0011] Preferably, the dust suction mechanism includes an electric cylinder 2, the electric cylinder 2 is located on the mounting member 2 and is fixedly connected to the mounting member 2, a guide plate 2 is installed on the output shaft of the electric cylinder 2, both ends of the guide plate 2 are slidably connected to the mounting member 2, a support plate 2 is provided below the guide plate 2, the guide plate 2 and the support plate 2 are connected by a plurality of pillars 2; a dust collector is installed on the top of the support plate 2, a suction head is provided below the support plate 2, a telescopic tube is provided on the air intake of the dust collector, one end of the telescopic tube is connected to the air intake of the dust collector, and the telescopic tube The other end passes through the support plate 2 and is connected to the suction head; an electric cylinder 3 is installed at the bottom of the support plate 2, and a connecting piece is installed on the side wall of the suction head, and the output shaft of the electric cylinder 3 is fixedly connected to the connecting piece; in this scheme, the electric cylinder 2 is provided, and the setting of the electric cylinder 2 can adjust the height of the vacuum cleaner, and further adjust the distance between the suction head and the clamped circuit board; and the setting of the electric cylinder 3 can further adjust the distance between the suction head and the circuit board, so that the device can fine-tune the height of the suction head when the height of the vacuum cleaner remains unchanged, so that the vacuum cleaner can absorb dust on the circuit board through the suction head.

[0012] Preferably, the clamping mechanism includes a shell, two groups of clamping components symmetrically arranged inside the shell, and adjustment components for respectively adjusting the lateral positions of the two groups of clamping components. The shell is located above the base and is rotatably connected to the base. The two groups of clamping components are respectively located on the two groups of adjustment components. The two groups of adjustment components are located on the shell, and the top of the shell has an opening.

[0013] Preferably, the clamping assembly includes a shell, which is located on the adjusting assembly and connected to the adjusting assembly, and a support plate three is installed in the middle position inside the shell, the top of the support plate three is rotatably connected to a screw one, and the bottom of the support plate three is rotatably connected to a screw two, the screw one and the screw two are symmetrically arranged inside the shell along the support plate three, and the screw one and the screw two are connected; nuts are screwed on the side walls of the screw one and the screw two, and the two nuts are slidably connected to the shell, and splints are installed on the side walls of the two nuts, and rubber pads are installed on the opposite sides of the two splints, and a motor three is installed on the top of the shell, the output shaft of the motor three is fixedly connected to the screw one, and an opening two is provided on the side wall of the shell; in this scheme, by providing a motor three, when the motor three is working, it can drive the screw one and the screw two to rotate synchronously, and at this time the two nuts drive the two splints to move in the direction of the material, thereby clamping materials at different heights.

[0014] Preferably, the adjustment component includes a hydraulic cylinder, which is located inside the shell and fixedly connected to the shell. A mounting part three is installed on the output shaft of the hydraulic cylinder, one end of the mounting part three is fixedly connected to the shell, and the other end of the mounting part three is slidably connected to the shell. In this solution, by setting up a hydraulic cylinder, the hydraulic cylinder can adjust the distance between the clamping component and the object through the mounting part three to clamp objects of different lengths.

[0015] Preferably, there is a slide groove on the bottom wall inside the shell, and a slider is provided in the slide groove. The slider is fixedly connected to the mounting part three, and the slider and the slide groove are adapted to each other. The mounting part three is slidingly connected to the shell through the slider and the slide groove. In this scheme, the slider and the slide groove are provided, and the setting of the slider and the slide groove can provide guidance for the lateral movement of the mounting part three.

[0016] A ceramic-based circuit board comprises: a substrate; an insulating layer disposed on the substrate; The circuit layer is arranged on the insulating layer.

[0017] Compared with the prior art, the present invention has the following beneficial effects: By setting up a clamping mechanism, the clamping mechanism can clamp circuit boards of different heights through the clamping components therein; and the setting of the two groups of adjustment components can respectively drive the two groups of clamping components to move horizontally to clamp circuit boards of different lengths. The clamping component is to clamp the upper and lower ends of the circuit board through two clamping plates that move up and down therein, so that the device can not only clamp circuit boards of different specifications, but also clamp rectangular plates of different shapes, and can avoid the generation of gaps during the clamping process.

[0018] By setting up a dust suction mechanism, the dust suction mechanism can absorb the dust on the circuit board through the vacuum cleaner and dust suction nozzle therein; and the driving mechanism cooperates with the dust suction mechanism to adjust the lateral position of the dust suction nozzle to expand the dust removal range. This device avoids manual wiping of the circuit board to remove dust, saves manpower and improves efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 It is a structural schematic diagram of the processing device of the present invention; Figure 2 for Figure 1 A magnified view of the structure at point A on the mounting part; Figure 3 for Figure 1 A magnified view of the structure at point B on the second support plate; Figure 4 is a cross-sectional view of the housing of the present invention; Figure 5 is a cross-sectional view of the clamping assembly of the present invention; Figure 6 A schematic structural diagram of the ceramic-based circuit board of the present invention In the figure: 1. Base; 2. Support member; 3. Column; 4. Driving mechanism; 5. Punching mechanism; 6. Dust collection mechanism; 7. Clamping mechanism; 8. Base plate; 9. Insulation layer; 10. Circuit layer; Motor 1; 42. Transmission rod; 43. Mounting piece 1; 44. Mounting piece 2; 45. Guide rail; Electric cylinder 1; 52. Guide plate 1; 53. Support plate 1; 54. Pillar 1; 55. Motor 2; 56. Drill bit; 57. Guide block; 58. Guide column; 59. Guide sleeve; Electric cylinder 2; 62. Guide plate 2; 63. Support plate 2; 64. Pillar 2; 65. Vacuum cleaner; 66. Suction head; 67. Telescopic tube; 68. Electric cylinder 3; 69. Connector; Housing; 72, clamping assembly; 73, adjustment assembly; 74, opening 1; Housing; 722, support plate three; 723, screw one; 724, screw two; 725, nut; 726, clamping plate; 727, rubber pad; 728, motor three; 729, opening two; 731. Hydraulic cylinder; 732. Mounting part three; 733. Slide; 734. Slider. DETAILED DESCRIPTION

[0021] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0022] The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention.

[0023] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0026] See also Figure 1-5 A method for preparing a ceramic-based circuit board includes the following steps: S1, substrate drilling: placing the substrate in a processing device, and performing hole drilling and dust removal on the substrate by the processing device; S2, substrate copper plating: using chemical copper plating to copper-plate the inner wall of the through hole of the substrate in step S1; S3, film production: producing a film according to a preset material; S4, pattern production: developing the film obtained in step S3 on the surface of the substrate; S5, substrate installation: installing a circuit layer and an insulating layer in sequence on the substrate in step S4 to obtain a ceramic-based circuit board.

[0027] Furthermore, the processing device includes a base 1, a support member 2 is provided above the base 1, the base 1 and the support member 2 are connected by a column 3, a driving mechanism 4 is installed on the side wall of the support member 2, a punching mechanism 5 and a dust collection mechanism 6 are installed on the driving mechanism 4, a clamping mechanism 7 is provided below the dust collection mechanism 6, and the clamping mechanism 7 is connected to the base 1.

[0028] Specifically, the present invention can clamp circuit boards of conventional shapes, such as rectangular, circular, and trapezoidal circuit boards. Since the device clamps the upper and lower ends of the circuit board, the clamping range of the device is wider than that of only clamping the side edges.

[0029] Furthermore, the driving mechanism 4 includes a motor 41, which is located on the side wall of the support member 2 and fixedly connected to the support member 2. A transmission rod 42 is provided on the output shaft of the motor 41, one end of the transmission rod 42 is fixedly connected to the output shaft of the motor 41, and the other end of the transmission rod 42 is rotatably connected to the support member 2; a mounting member 43 and a mounting member 2 44 are screwed on the side wall of the transmission rod 42, the mounting member 43 is located on one side of the mounting member 2 44, and both the mounting member 43 and the mounting member 2 44 are slidably connected to the support member 2, the mounting member 43 is connected to the punching mechanism 5, and the mounting member 2 44 is connected to the dust collection mechanism 6.

[0030] Specifically, the outer wall of the transmission rod 42 has external threads, while the connection between the first and second mounting members 43, 44 and the transmission rod 42 has internal threaded holes. The transmission rod 42 is screwed to the first and second mounting members 43, 44 via the external threads and internal threaded holes, respectively. Guide rails 45 are also mounted on the side walls of the support member 2, and guide blocks 57 are also mounted on the rear side walls of the first and second mounting members 43, 44. The first and second mounting members 43, 44 are slidably connected to the support member 2 via the guide blocks 57 and the guide rails 45.

[0031] Furthermore, the punching mechanism 5 includes an electric cylinder 51, which is located on the mounting member 43 and fixedly connected to the mounting member 43. A guide plate 52 is installed on the output shaft of the electric cylinder 51, and both ends of the guide plate 52 are slidably connected to the mounting member 43; a support plate 53 is provided below the guide plate 52, and the guide plate 52 and the support plate 53 are connected by multiple pillars 54. A motor 55 is installed at the bottom of the support plate 53, and a drill bit 56 is installed on the output shaft of the motor 55.

[0032] Specifically, guide columns 58 are vertically provided inside both ends of the guide plate 52, and both ends of the two guide columns 58 are fixedly connected to the mounting member 43. A guide sleeve 59 is sleeved on the outer wall of each guide column 58. The guide plate 52 is slidably connected to the mounting member 43 through the guide columns 58 and the guide sleeve 59. The setting of the guide columns 58 and the guide sleeve 59 can provide guidance for the vertical movement of the guide plate 52 to avoid its horizontal displacement.

[0033] Furthermore, the dust suction mechanism 6 includes an electric cylinder 2 61, which is located on the mounting part 2 44 and fixedly connected to the mounting part 2 44. A guide plate 2 62 is installed on the output shaft of the electric cylinder 2 61, and both ends of the guide plate 2 62 are slidably connected to the mounting part 2 44. A support plate 2 63 is provided below the guide plate 2 62, and the guide plate 2 62 and the support plate 2 63 are connected by multiple pillars 2 64; a dust collector 65 is installed on the top of the support plate 2 63, and a suction head 66 is provided below the support plate 2 63. A telescopic tube 67 is provided on the air intake of the dust collector 65, one end of the telescopic tube 67 is connected to the air intake of the dust collector 65, and the other end of the telescopic tube 67 passes through the support plate 2 63 and is connected to the suction head 66; an electric cylinder 3 68 is installed at the bottom of the support plate 2 63, and a connecting piece 69 is installed on the side wall of the suction head 66, and the output shaft of the electric cylinder 3 68 is fixedly connected to the connecting piece 69.

[0034] Furthermore, the clamping mechanism 7 includes a shell 71, two groups of clamping assemblies 72 symmetrically arranged inside the shell 71, and an adjustment assembly 73 for respectively adjusting the lateral positions of the two groups of clamping assemblies 72. The shell 71 is located above the base 1 and is rotatably connected to the base 1. The two groups of clamping assemblies 72 are respectively located on the two groups of adjustment assemblies 73. The two groups of adjustment assemblies 73 are located on the shell 71. The top of the shell 71 has an opening 74.

[0035] Specifically, motor 4 is mounted within base 1. Its output shaft is fixedly connected to housing 71. When motor 4 is operating, the output shaft drives housing 71 to rotate, thereby adjusting the rotation angle of the clamped circuit board. When punching mechanism 5 punches a hole in the left end of the circuit board, due to the limited range of movement of dust collection mechanism 6, motor 4 is used to move the left end of the circuit board to the right end, thereby facilitating dust collection by dust collection mechanism 6.

[0036] Furthermore, the clamping assembly 72 includes a shell 721, which is located on the adjustment assembly 73 and connected to the adjustment assembly 73. A support plate 3 722 is installed at the middle position inside the shell 721. The top of the support plate 3 722 is rotatably connected to a screw 1 723, and the bottom of the support plate 3 722 is rotatably connected to a screw 2 724. The screw 1 723 and the screw 2 724 are symmetrically arranged inside the shell 721 along the support plate 3 722. The screw 1 723 and the screw 2 Rod two 724 is connected; nuts 725 are screwed on the side walls of screw one 723 and screw two 724, and the two nuts 725 are slidably connected to the shell 721. Clamps 726 are installed on the side walls of the two nuts 725, and rubber pads 727 are installed on the opposite sides of the two clamps 726. Motor three 728 is installed on the top of the shell 721, and the output shaft of motor three 728 is fixedly connected to screw one 723. There is an opening two 729 on the side wall of the shell 721.

[0037] Furthermore, the adjustment assembly 73 includes a hydraulic cylinder 731, which is located inside the shell 71 and fixedly connected to the shell 71. A mounting member 732 is installed on the output shaft of the hydraulic cylinder 731. One end of the mounting member 732 is fixedly connected to the outer shell 721, and the other end of the mounting member 732 is slidably connected to the shell 71.

[0038] Furthermore, a slide groove 733 is provided on the bottom wall inside the shell 71, and a slider 734 is provided in the slide groove 733. The slider 734 is fixedly connected to the mounting member 3 732. The slider 734 and the slide groove 733 are adapted to each other, and the mounting member 3 732 is slidably connected to the shell 71 through the slider 734 and the slide groove 733.

[0039] See also Figure 6 , a ceramic-based circuit board, comprising: a substrate 8; an insulating layer 9 disposed on the substrate 8; The circuit layer 10 is provided on the insulating layer 9 .

[0040] The working principle of the present invention is: See also Figure 1-5 The staff first places the circuit board on the top of the shell 71, and then starts the two groups of hydraulic cylinders 731, so that the output shafts of the two groups of hydraulic cylinders 731 drive the shell 721 to move horizontally to adapt to circuit boards of different lengths. Subsequently, the motor three 728 is turned on again, so that the output shaft of the motor three 728 drives the screw one 723 and the screw two 724 to rotate. At this time, the two nuts 725 drive the two clamping plates 726 to move toward the upper and lower ends of the circuit board until the rubber pad 727 contacts the circuit board, thereby clamping and fixing the rectangular or round circuit board. Then, the motor 1 41 is turned on again, so that the output shaft of the motor 1 41 drives the transmission rod 42 to rotate, and further drives the mounting part 1 43 to move horizontally to adjust the horizontal position of the punching mechanism 5. When the position of the punching mechanism 5 is adjusted, the electric cylinder 1 51 and the motor 2 55 cooperate to realize the punching of the circuit board. After punching, the circuit board is cleaned by the dust suction mechanism 6, and the processing of the circuit board is completed.

[0041] The above description is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for preparing a ceramic-based circuit board, characterized in that: The following steps are involved: S1. Substrate drilling: placing a substrate in a processing device, and performing hole drilling and dust removal on the substrate by the processing device; S2, copper plating of substrate: copper plating the inner wall of the through hole of the substrate in step S1 by using chemical copper plating; S3, making film: making film according to the preset materials; S4, making a pattern: developing the film obtained in step S3 on the surface of the substrate; S5. Substrate installation: The circuit layer and the insulating layer are sequentially installed on the substrate of step S4 to obtain a ceramic-based circuit board.

2. The method for preparing a ceramic-based circuit board according to claim 1, wherein: The processing device comprises a base (1), a support member (2) is provided above the base (1), the base (1) and the support member (2) are connected via a column (3), a driving mechanism (4) is installed on the side wall of the support member (2), a punching mechanism (5) and a dust collection mechanism (6) are installed on the driving mechanism (4), a clamping mechanism (7) is provided below the dust collection mechanism (6), and the clamping mechanism (7) is connected to the base (1).

3. The method for preparing a ceramic-based circuit board according to claim 2, wherein: The driving mechanism (4) includes a motor 1 (41), the motor 1 (41) is located on the side wall of the support member (2) and is fixedly connected to the support member (2), a transmission rod (42) is provided on the output shaft of the motor 1 (41), one end of the transmission rod (42) is fixedly connected to the output shaft of the motor 1 (41), and the other end of the transmission rod (42) is rotatably connected to the support member (2); A mounting member 1 (43) and a mounting member 2 (44) are screwed onto the side wall of the transmission rod (42), the mounting member 1 (43) is located on one side of the mounting member 2 (44), the mounting member 1 (43) and the mounting member 2 (44) are both slidably connected to the support member (2), the mounting member 1 (43) is connected to the punching mechanism (5), and the mounting member 2 (44) is connected to the dust collection mechanism (6).

4. The method for preparing a ceramic-based circuit board according to claim 3, wherein: The punching mechanism (5) includes an electric cylinder (51), the electric cylinder (51) is located on the mounting member (43) and is fixedly connected to the mounting member (43), a guide plate (52) is installed on the output shaft of the electric cylinder (51), and both ends of the guide plate (52) are slidably connected to the mounting member (43); A support plate 1 (53) is provided below the guide plate 1 (52). The guide plate 1 (52) and the support plate 1 (53) are connected via a plurality of pillars 1 (54). A motor 2 (55) is installed at the bottom of the support plate 1 (53). A drill bit (56) is installed on the output shaft of the motor 2 (55).

5. The method for preparing a ceramic-based circuit board according to claim 3, wherein: The dust collecting mechanism (6) includes an electric cylinder (61) 2, the electric cylinder (61) 2 being located on the mounting member (44) 2 and fixedly connected to the mounting member (44), a guide plate (62) 2 being installed on the output shaft of the electric cylinder (61), both ends of the guide plate (62) 2 being slidably connected to the mounting member (44), a support plate (63) 2 being provided below the guide plate (62), the guide plate (62) 2 and the support plate (63) 2 being connected via a plurality of support pillars (64); A vacuum cleaner (65) is installed on the top of the second support plate (63), a suction head (66) is provided below the second support plate (63), a telescopic tube (67) is provided on the air inlet of the vacuum cleaner (65), one end of the telescopic tube (67) is connected to the air inlet of the vacuum cleaner (65), and the other end of the telescopic tube (67) passes through the second support plate (63) and is connected to the suction head (66); An electric cylinder three (68) is installed at the bottom of the support plate two (63), a connecting piece (69) is sleeved and installed on the side wall of the suction head (66), and the output shaft of the electric cylinder three (68) is fixedly connected to the connecting piece (69).

6. The method for preparing a ceramic-based circuit board according to claim 2, wherein: The clamping mechanism (7) comprises a shell (71), two groups of clamping assemblies (72) symmetrically arranged inside the shell (71), and an adjusting assembly (73) for adjusting the lateral positions of the two groups of clamping assemblies (72) respectively. The shell (71) is located above the base (1) and is rotatably connected to the base (1). The two groups of clamping assemblies (72) are respectively located on the two groups of adjusting assemblies (73). The two groups of adjusting assemblies (73) are located on the shell (71). The top of the shell (71) has an opening (74).

7. The method for preparing a ceramic-based circuit board according to claim 6, wherein: The clamping assembly (72) includes a shell (721), the shell (721) is located on the adjusting assembly (73) and is connected to the adjusting assembly (73), a support plate three (722) is installed at a middle position inside the shell (721), the top of the support plate three (722) is rotatably connected to the screw rod one (723), the bottom of the support plate three (722) is rotatably connected to the screw rod two (724), the screw rod one (723) and the screw rod two (724) are symmetrically arranged along the support plate three (722) inside the shell (721), and the screw rod one (723) and the screw rod two (724) are connected; The side walls of the screw rod 1 (723) and the screw rod 2 (724) are both screwed with nuts (725), and the two nuts (725) are both slidably connected to the housing (721). The side walls of the two nuts (725) are both installed with clamps (726), and the opposite sides of the two clamps (726) are both installed with rubber pads (727). The top of the housing (721) is installed with a motor 3 (728), and the output shaft of the motor 3 (728) is fixedly connected to the screw rod 1 (723). The side wall of the housing (721) has an opening 2 (729).

8. The method for preparing a ceramic-based circuit board according to claim 7, wherein: The adjustment assembly (73) includes a hydraulic cylinder (731), the hydraulic cylinder (731) is located inside the housing (71) and fixedly connected to the housing (71), and a mounting member 3 (732) is installed on the output shaft of the hydraulic cylinder (731), one end of the mounting member 3 (732) is fixedly connected to the housing (721), and the other end of the mounting member 3 (732) is slidably connected to the housing (71).

9. The method for preparing a ceramic-based circuit board according to claim 8, wherein: A sliding groove (733) is provided on the bottom wall inside the shell (71), and a slider (734) is provided in the sliding groove (733). The slider (734) is fixedly connected to the third mounting member (732), and the slider (734) and the sliding groove (733) are adapted to each other. The third mounting member (732) is slidingly connected to the shell (71) through the slider (734) and the sliding groove (733).

10. A ceramic-based circuit board obtained by the preparation method according to any one of claims 1 to 9, characterized in that: Include: substrate; an insulating layer disposed on the substrate; The circuit layer is arranged on the insulating layer.

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